Optical chip automatic coupling sealing test method and system

Abstract

The invention discloses an optical chip automatic coupling sealing test method and system, and relates to the technical field of optical communication, and the method comprises the steps: moving a to-be-tested optical chip to a sealing test position, and determining the coupling position of the optical chip through an industrial camera; acquiring a coupling part coupled with the optical chip, performing coarse alignment on the optical chip and the coupling part, and recording an initial coupling position of the coupling part; an optical output signal of the optical chip is collected, the coupling position of the optical chip and the coupling component is fed back and analyzed according to the power of the optical output signal, and a first coupling position is obtained; and the coupling part performs fine alignment coupling with the optical chip at the initial coupling position according to the first coupling position, and executes the performance sealing test of the optical chip. According to the invention, the technical problems of low precision and low efficiency of the optical chip in the coupling and sealing test process are solved, and the technical effects of precise coupling of the optical chip and the coupling component and improvement of the precision and efficiency of the coupling and sealing test of the optical chip are achieved.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technologies, and particularly to an automatic coupling, packaging and testing method and system for optical chips. Background Art

[0002] The automatic coupling, packaging and testing of optical chips are key links to ensure their performance and quality. Currently, the coupling, packaging and testing of optical chips mainly rely on traditional methods. When determining the coupling position between an optical chip and a coupling component, these traditional methods often use simple manual positioning or mechanical positioning with limited accuracy. In the performance testing and packaging link, only some basic indicators are detected.

[0003] With the development of optical chip technologies, higher requirements are imposed on the coupling accuracy and the comprehensiveness and accuracy of performance testing and packaging for optical chips. Many problems have emerged when applying traditional methods. For example, the low positioning accuracy of the coupling position results in poor optical signal transmission efficiency; the performance testing and packaging indicators are not comprehensive, and the comprehensive performance of optical chips cannot be accurately evaluated. These problems make it difficult for the produced optical chips to meet the requirements of high-end optical communication, data centers and other fields. Summary of the Invention

[0004] This application solves the technical problems of low accuracy and low efficiency in the coupling, packaging and testing process of optical chips. This application moves the optical chip to be tested to the packaging and testing position, uses an industrial camera to determine the coupling position, obtains the coupling component and performs rough alignment to record the initial position; collects the optical output signal of the optical chip, and obtains the first coupling position through analysis based on optical power feedback; then performs fine alignment and coupling based on this position and the initial position, and finally performs performance testing and packaging on the optical chip. Through this series of steps, the coupling position between the optical chip and the coupling component is accurately determined, and performance indicators such as the insertion loss, return loss, stability of different temperature responses, central wavelength and bandwidth of the optical chip are comprehensively detected, thereby realizing efficient and accurate automatic coupling, packaging and testing of optical chips, and improving the production quality and testing efficiency of optical chips.

[0005] In view of the above technical problems, this application proposes technical solutions for an automatic coupling, packaging and testing method and system for optical chips.

[0006] In a first aspect, the present application provides an automatic coupling and packaging testing method for an optical chip. The method includes: moving the optical chip to be tested to a packaging testing position, and determining the coupling position of the optical chip through an industrial camera; obtaining a coupling component coupled to the optical chip, performing rough alignment of the optical chip and the coupling component according to the coupling position, and recording the initial coupling position of the coupling component; collecting the optical output signal of the optical chip, and feedback analyzing the coupling position of the optical chip and the coupling component according to the power magnitude of the optical output signal to obtain a first coupling position, where the first coupling position is a position where the optical power value is greater than a preset optical power value; and performing fine alignment coupling of the coupling component and the optical chip according to the first coupling position at the initial coupling position, and performing performance packaging testing of the optical chip.

[0007] In a second aspect, the present application provides an automatic coupling and packaging testing system for an optical chip. The system includes: a coupling position determination module, configured to move the optical chip to be tested to a packaging testing position, and determine the coupling position of the optical chip through an industrial camera; a coupling position recording module, configured to obtain a coupling component coupled to the optical chip, perform rough alignment of the optical chip and the coupling component according to the coupling position, and record the initial coupling position of the coupling component; a coupling position obtaining module, configured to collect the optical output signal of the optical chip, and feedback analyze the coupling position of the optical chip and the coupling component according to the power magnitude of the optical output signal to obtain a first coupling position, where the first coupling position is a position where the optical power value is greater than a preset optical power value; and a performance packaging testing execution module, configured to perform fine alignment coupling of the coupling component and the optical chip according to the first coupling position at the initial coupling position, and perform performance packaging testing of the optical chip.

[0008] The present application proposes one or more technical solutions, having at least the following technical effects:

[0009] In the present application, the optical chip is moved to the packaging testing position, and the coupling position is determined by using an industrial camera. The coupling component is obtained for rough alignment and the initial position is recorded. The optical output signal of the optical chip is collected, and the first coupling position is determined based on the optical power feedback. Fine alignment coupling is performed according to this position. Then, multiple performance packaging tests such as insertion loss and return loss of the optical chip are performed and a report is generated. During this process, the coupling position determination is optimized by filtering the optical output signal, and the movement trajectory is planned according to the coupling position relationship for precise coupling, achieving precise coupling between the optical chip and the coupling component, and improving the accuracy and efficiency of the coupling and packaging testing of the optical chip.

[0010] The above content outlines the present application for solving the automatic coupling and packaging testing method and system of an optical chip. The technical solution steps of the present application will be described in detail in the following specific embodiments, so as to facilitate those skilled in the art to understand the present application clearly and completely. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0012] Figure 1 It is a schematic flowchart of the optical chip automatic coupling and packaging and testing method provided by the embodiment of the present application.

[0013] Figure 2 It is a schematic structural diagram of the optical chip automatic coupling and packaging and testing system provided by the embodiment of the present application.

[0014] Description of reference numerals: coupling position determination module 1, coupling position recording module 2, coupling position acquisition module 3, performance packaging and testing execution module 4. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] In the present application, the optical chip is moved to the packaging and testing position, and an industrial camera is used to determine the coupling position of the optical chip. After obtaining the coupling component, it is roughly aligned with the optical chip and the initial coupling position is recorded. The optical output signal of the optical chip is collected, and the first coupling position is obtained through feedback analysis based on the optical power. Based on the initial coupling position, fine alignment coupling is performed with the optical chip according to the first coupling position. Subsequently, performance packaging and testing such as insertion loss and return loss of the optical chip are carried out to generate a packaging and testing report. The whole process realizes automatic coupling of the optical chip and precise performance detection, achieving precise coupling between the optical chip and the coupling component, and improving the precision and efficiency of the optical chip coupling and packaging and testing.

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0017] It should be noted that any variations of the terms "including" and "having" are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or server that includes a series of steps or units does not necessarily have to be limited to those clearly listed steps or units, but may include other steps or modules that are not clearly listed or are inherent to these processes, methods, products, or devices.

[0018] Embodiment 1, as Figure 1 shown, an optical chip automatic coupling and packaging and testing method, wherein the method includes:

[0019] Step A100: Move the optical chip to be tested to the packaging and testing position, and determine the coupling position of the optical chip through an industrial camera.

[0020] In the embodiment of the present application, the packaging and testing position is the starting positioning point of the automatic coupling packaging and testing process of the optical chip. The coupling position is the position coordinate of the optical output end of the optical chip.

[0021] Specifically, first, a high-precision robotic arm is used to move the optical chip. The robotic arm usually has extremely high positioning accuracy. For example, the repeat positioning accuracy of a common high-precision robotic arm can reach ±2μm, and it can accurately grasp and transfer the optical chip to the pre-set packaging and testing position. The packaging and testing position is determined by those skilled in the art through a large number of experiments and data verification and is within the optimal operation area of the packaging and testing equipment.

[0022] After the optical chip reaches the packaging and testing position, an industrial camera is used to determine its coupling position. The industrial camera has the characteristic of high resolution. The resolution of a common 5-megapixel industrial camera can reach 2448×2048. The industrial camera captures images of the optical chip quickly at a set frame rate, such as 60 frames per second.

[0023] After the industrial camera obtains the image of the optical chip, it enters the image preprocessing stage. First, gray-scale transformation is performed. Through functional relationships such as logarithmic transformation and power-law transformation, the gray-scale values of the image are remapped, and the pixel values originally concentrated in a certain gray-scale interval are extended to a wider range, making the bright areas of the image brighter and the dark areas darker, thereby enhancing the contrast of the image. Immediately afterwards, filtering operations are used to remove noise interference. Common filtering methods include mean filtering, median filtering, etc. Mean filtering replaces the current pixel value by calculating the average value within the pixel neighborhood, smoothing the image while reducing noise; median filtering selects the median value of the pixel values within the neighborhood as the current pixel value and can effectively remove impulse interference such as salt-and-pepper noise. After gray-scale transformation and filtering operations, the contrast and clarity of the image are significantly enhanced, the noise interference is greatly reduced, and the image quality is improved.

[0024] Next, the Canny edge detection algorithm is used to identify the edge contour of the optical chip. The Canny edge detection algorithm first applies a Gaussian filter to the image to further smooth the image and reduce false edges caused by factors such as noise. Then, it calculates the gradient magnitude and direction of each pixel point in the image. By comparing the gray value differences of adjacent pixel points, it calculates the gradient components in the horizontal and vertical directions using the first-order partial derivatives, and then obtains the gradient magnitude and direction. To accurately determine the edges, the algorithm uses non-maximum suppression technology. At each pixel point, it determines whether the gradient magnitude at that point is a local maximum along the gradient direction. If not, it sets the magnitude of that point to 0, which can refine the edges and remove unnecessary edge responses. Finally, through operations such as double-threshold detection and connecting edges, it retains the real edge information and filters out weak edges that may be caused by noise. After the above processing, the Canny edge detection algorithm can accurately identify the edge contour of the optical chip, and its edge positioning accuracy can reach the 0.1 pixel level.

[0025] After determining the edge contour, further extract the feature points of the optical chip, such as specific identification points at the optical output end. Based on the coordinate information of these feature points, the coupling position of the optical chip can be accurately determined, providing an accurate data basis for the subsequent rough alignment of the optical chip and the coupling component.

[0026] The optical chip is moved to the packaging and testing position by an automated device, and the coupling position is determined by using an industrial camera combined with image processing technology, achieving the technical effect of accurately positioning the coupling position of the optical chip.

[0027] Step A200: Obtain the coupling component coupled to the optical chip, perform rough alignment of the optical chip and the coupling component according to the coupling position, and record the initial coupling position of the coupling component.

[0028] In the embodiment of the present application, the coupling component refers to the component that is coupled to the optical chip, mainly including a fiber array or a waveguide module.

[0029] Optionally, first, select a suitable coupling component from a pre-reserved coupling component library (providing corresponding coupling components such as fiber arrays, waveguide modules, etc. according to the type, application scenario, and design requirements of the optical chip). For example, for an optical chip in the field of high-speed optical communication, a high-precision fiber array is often selected as the coupling component. The key dimensional parameters of the coupling component at the time of leaving the factory, such as the aperture and position accuracy of the optical input end, have strict standards. Generally, the aperture accuracy of the optical input end of the fiber array can reach ±1μm.

[0030] After obtaining the coupling component, then obtain the optical input end of the coupling component including the fiber optic array or waveguide module, roughly align its position coordinates with the position coordinates of the optical output end of the optical chip (i.e., the coupling position), and record the current position of the coupling component as the initial coupling position after completion. The specific steps are described in detail in A210 - A230.

[0031] Step A300: Collect the optical output signal of the optical chip, analyze the coupling position between the optical chip and the coupling component based on the feedback of the power magnitude of the optical output signal, and obtain the first coupling position, where the first coupling position is the position where the optical power value is greater than the preset optical power value.

[0032] In an embodiment of the present application, during the collection process, an optical power meter is usually integrated on the coupling component to obtain the optical power values of the optical output signal of the optical chip at multiple positions. The optical power values of the optical output signal of the optical chip at multiple positions are obtained through the optical power meter, and the mapping relationship between the position and the optical power value is established. Based on this, the first coupling position where the optical power value is greater than the preset value is determined. The specific steps are described in detail in A310 - A320.

[0033] Step A400: On the initial coupling position of the coupling component, perform fine alignment coupling with the optical chip according to the first coupling position, and perform performance sealing and testing of the optical chip.

[0034] Specifically, on the initial coupling position of the coupling component, first determine the coupling movement coordinates with the first coupling position, then decompose the coordinates according to the preset adjustment step size to generate a coupling movement trajectory, and perform fine alignment coupling accordingly. The specific steps are described in detail in A430 - A440. When performing performance sealing and testing of the optical chip, detect indicators such as insertion loss, return loss, response stability at different temperatures, central wavelength, and bandwidth, and generate a sealing and testing report based on these indicators to return a qualified test result. The specific steps are described in detail in A410 - A420.

[0035] By performing fine alignment coupling and performance sealing and testing, the technical effect of accurately coupling the optical chip and the coupling component and comprehensively detecting the performance of the optical chip to ensure the quality of the optical chip is achieved.

[0036] Furthermore, step A200 in the method provided by the embodiment of the present application includes:

[0037] A210: Wherein, the coupling position is the position coordinates of the optical output end of the optical chip.

[0038] A220: Obtain the optical input end of the coupling component, where the coupling component includes a fiber optic array or a waveguide module.

[0039] A230: Coarsely align the position coordinates of the optical input end of the coupling component with the position coordinates of the optical output end of the optical chip, and record the current position of the coupling component as the initial coupling position.

[0040] In the embodiments of the present application, the optical output end is the port where the optical chip emits optical signals, and its position coordinates are used as the coupling position. The optical input end is the port where the coupling component receives the optical signals emitted by the optical chip.

[0041] Specifically, first, it is clear that the coupling position is the position coordinates of the optical output end of the optical chip, and this coordinate information is obtained in step A100.

[0042] Then, obtain the coupling component. Common coupling components include fiber optic arrays or waveguide modules. Taking a fiber optic array as an example, during its production and manufacturing process, there are strict standards for the position accuracy of the optical input end. Generally, the position accuracy of the optical fiber is controlled within ±1μm. After obtaining the optical input end of the coupling component, the coarse alignment operation begins.

[0043] The coarse alignment is achieved by relying on a high-precision three-axis displacement stage. This displacement stage has the ability of multi-axis movement, and the positioning accuracy in the X, Y, and Z axis directions can reach ±0.5μm. Through computer programming to control the movement of the displacement stage, the position coordinates of the optical input end of the coupling component are matched with the position coordinates of the optical output end of the optical chip. During the adjustment process, those skilled in the art use a visual feedback system to continuously monitor the position deviation between the two. For example, an industrial camera continuously captures images to analyze the relative position relationship between the optical output end of the optical chip and the optical input end of the coupling component. When the position deviation is reduced to within the preset coarse alignment accuracy range (the planar position deviation is less than ±5μm, and the axial deviation is less than ±3μm), it is considered that the coarse alignment is completed. At this time, record the current position of the coupling component, and this position is the initial coupling position.

[0044] By determining the initial coupling position, it provides an important starting benchmark for the subsequent fine alignment and coupling operations, helps to improve the final coupling accuracy between the optical chip and the coupling component, and ensures the stable transmission of optical signals.

[0045] Furthermore, step A400 in the method provided by the embodiments of the present application includes:

[0046] A410: Execute the performance sealing and testing indicators of the optical chip, including the insertion loss and return loss of the optical chip, the response stability of the optical chip under different temperature conditions, and the central wavelength and bandwidth of the optical chip.

[0047] A420: Generate a sealing and testing report of the optical chip based on the performance sealing and testing indicators and return a qualified test result.

[0048] In the embodiments of the present application, the insertion loss is the degree of optical power loss after the optical signal is transmitted through the optical chip. The return loss is used to measure the internal reflection of the optical chip. The response stability refers to the ability of the optical chip to maintain stable parameters such as output optical power and wavelength under different temperature conditions. The central wavelength refers to the wavelength corresponding to the maximum optical signal intensity in the optical signal spectrum output by the optical chip. The bandwidth refers to the wavelength range when the optical signal intensity drops to half of the peak intensity.

[0049] Optionally, in the performance sealing and testing process of the optical chip, the detection of insertion loss is carried out first. Usually, an optical power meter is used to measure the optical power at the input and output ends of the optical chip. For example, first inject an optical signal with a specific power (assumed to be P 1 = 1 mW) at the input end of the optical chip. After being transmitted through the optical chip, use an optical power meter to measure the power value (assumed to be P 2 = 0.8 mW) at the output end. According to the insertion loss the insertion loss of this optical chip can be calculated to be approximately 0.97 dB.

[0050] For the detection of return loss, an optical time domain reflectometer (OTDR) is generally used. The OTDR emits optical pulses to the optical chip. When the optical signal encounters a reflection interface inside the optical chip, part of the light will be reflected back. The OTDR calculates the return loss based on the intensity and time delay of the reflected light. For example, if the reflected optical power is Pr and the incident optical power is Pi, the return loss In actual detection, if the return loss of an optical chip is lower than the industry-specified standard value (the standard value is -40 dB), it means that the optical chip has poor performance in reducing optical signal reflection, which will affect the stability of the entire optical communication system.

[0051] When detecting the response stability of the optical chip under different temperature conditions, the optical chip will be placed in a temperature-controlled environmental test chamber. Taking a common optical chip as an example, according to industry standards, the test will be carried out in the temperature range of -40°C to 85°C. At each temperature point (such as -40°C, 0°C, 25°C, 50°C, 85°C), keep a certain time (assumed to be 30 minutes) for the optical chip to reach thermal equilibrium, and then monitor the changes in its output optical power, wavelength and other parameters. If during the temperature change process, the fluctuation range of the output optical power of the optical chip exceeds the specified value (±0.05 dB), or the central wavelength drift exceeds a certain range (±0.5 nm), it indicates that its response stability under different temperature conditions is poor.

[0052] When measuring the central wavelength and bandwidth of an optical chip, a spectrum analyzer is often used. A spectrum analyzer can accurately measure the spectral distribution of the optical signal output by the optical chip. For example, by measuring an optical chip with a spectrum analyzer, a curve of its optical signal intensity versus wavelength is obtained, and the wavelength corresponding to the peak of the curve is the central wavelength. The bandwidth is determined by measuring the wavelength range corresponding to when the optical signal intensity drops to half of the peak intensity.

[0053] After completing the testing of the above performance indicators, all test data are summarized and the packaging and testing report of the optical chip is generated according to the pre-set qualified standards (such as insertion loss must be between 0.5-1.5dB, return loss must be less than -40dB, optical power fluctuations at different temperatures are within ±0.05dB, central wavelength is between 1549-1551nm, bandwidth is between 8-12nm, etc.). If all performance indicators of the optical chip meet the standards, a qualified test result is returned; if any indicator does not meet the standards, the optical chip is judged to be unqualified, and the unqualified items and specific data are detailed in the report to provide a basis for subsequent improvements and screening.

[0054] By detecting the performance packaging and testing indicators of optical chips and generating packaging and testing reports, the technical effect of comprehensively evaluating the performance of optical chips, determining whether they are qualified, and providing a basis for optical chip quality control and subsequent applications is achieved.

[0055] Further, step A300 in the method provided in the embodiment of the present application includes:

[0056] A310: Obtain optical power values ​​of the optical output signal of the optical chip at multiple positions through the optical power meter.

[0057] A320: Establish a mapping relationship between the multiple positions and corresponding optical power values, and determine a first coupling position whose optical power value is greater than a preset optical power value based on the mapping relationship.

[0058] Specifically, first, in the process of collecting the optical output signal of the optical chip, a high-precision photodetector is used to convert the optical signal into an electrical signal for subsequent processing. Its sensitivity and response speed directly affect the detection accuracy.

[0059] Next, use an optical power meter to obtain the optical power values ​​of the optical chip at multiple positions. An optical power meter is an instrument used to measure the optical power, and its measurement accuracy can usually reach ±0.1dBm or even higher. In actual operation, the position where the optical chip and the coupling component are initially aligned is used as the reference point, and multiple measurement positions are selected within a certain range.

[0060] After obtaining these data, a mapping relationship between multiple positions and corresponding optical power values ​​is established by constructing a lookup table:

[0061] Step a: Obtain the optical power values of the optical output signal of the optical chip at multiple positions through an optical power meter. Taking the position where the optical chip is initially aligned with the coupling component as the center, within a square area with a side length of 100 μm, select a measurement point every 5 μm, record the position information of each measurement point, represented by two-dimensional coordinates (x, y), and the corresponding optical power value, so that a large number of optical power values at different positions can be obtained.

[0062] Step b: Select a suitable storage structure to construct a lookup table. If the position information of the measurement points is regular, an array can be used as the storage structure. For example, if the measurement points are evenly distributed at uniform intervals within a rectangular area, a two-dimensional array can be created, where the row index of the array corresponds to the abscissa and the column index corresponds to the ordinate, and the array elements store the optical power values at the corresponding positions. If the position information is relatively complex or irregular, a database table can be considered for storage, and fields are set in the table to record the position information (such as x coordinate, y coordinate) and the optical power value respectively.

[0063] Step c: Fill the collected and sorted data into the lookup table according to the determined storage structure. Taking the two-dimensional array as an example, if the optical power value at a certain position (x 1 , y 1 ) is P 1 , then store P 1 at the position of the x 1 -th row and y 1 -th column of the array. For the database table, insert the position and optical power value data into the corresponding fields through database operation statements (such as the INSERT INTO statement, which is an SQL statement used to insert new data rows into a specified database table).

[0064] Step d: After completing the data filling, the lookup table establishes the mapping relationship between the position and the optical power value. When it is necessary to determine the optical power value at a certain position, it can be searched in the lookup table according to the position information. For example, in the two-dimensional array, according to the given coordinates (x, y), directly obtain the element value at the position (x, y) in the array, and this value is the optical power value at the corresponding position; in the database table, by writing a query statement (such as the SELECT statement), query the corresponding optical power value according to the value of the position field.

[0065] Finally, determine the first coupling position based on the established mapping relationship. During the design and production process of the optical chip, a preset optical power value is set according to its application scenario and performance requirements. Suppose an optical chip is used in a specific optical communication system, and according to the requirements of the system for the optical signal intensity, the preset optical power value is -15 dBm. By comparing the optical power values in the mapping relationship with the preset optical power value, find the positions where the optical power value is greater than the preset optical power value. If there are multiple such positions, these positions are the potential first coupling positions.

[0066] Through the above series of steps, the first coupling position where the optical power transmission performance meets the requirements can be accurately determined, providing a key basis for the precise coupling of the subsequent optical chip and the coupling component, thereby improving the accuracy and reliability of the optical chip packaging and testing, and ensuring the performance of the optical chip in practical applications.

[0067] Further, step A330 in the method provided by the embodiments of the present application includes:

[0068] A331: If the optical power values at multiple coupling positions are all greater than the preset optical power value, generate candidate coupling positions based on the multiple coupling positions.

[0069] A332: Obtain the high-density regions in the candidate coupling positions where the power intensity density is greater than the preset density, and select the central position of the high-density region as the first coupling position.

[0070] In the embodiments of the present application, the candidate coupling positions are a set of positions generated by the coupling positions where the optical power values are all greater than the preset optical power value. The power intensity density is an index used to evaluate the optical signal intensity distribution of the candidate coupling positions, which is obtained by calculating the optical power value per unit area in the small region where the candidate coupling position is located. The high-density region is the region in the candidate coupling positions where the power intensity density is greater than the preset density.

[0071] Specifically, in the automatic coupling and packaging technology of optical chips, when determining the first coupling position using the mapping relationship, if there are multiple coupling positions where the optical power values are all greater than the preset optical power value, it is necessary to further screen out the optimal first coupling position.

[0072] Suppose in actual testing, the optical power values of the optical chip at different positions are obtained through an optical power meter, and a mapping relationship between the positions and the optical power values is established. The preset optical power value is -15 dBm. After comparison, it is found that the optical power values of 10 coupling positions are all greater than this preset value, such as -8 dBm, -9 dBm, etc. At this time, these 10 coupling positions are determined as candidate coupling positions.

[0073] Next, in order to find the best first coupling position from these candidate coupling positions, it is necessary to analyze the power intensity density. The power intensity density can be measured by the optical power value per unit area. For example, taking each candidate coupling position as the center, divide a very small square region (assuming the side length is 10 μm), and calculate the average optical power value in this region as the power intensity density. The preset density is 0.5 W / mm 2 , calculate the power intensity density of each small region where the candidate coupling position is located, and screen out the regions where the power intensity density is greater than the preset density.

[0074] Suppose after calculation, among these 10 candidate coupling positions, the power intensity densities in the regions where 3 positions are located are greater than the preset density, which are 0.6 W / mm 2 , 0.7 W / mm 2 , 0.8 W / mm 2 . Finally, select the central positions of these 3 high-density regions, and comprehensively consider the actual process error and optical signal transmission characteristics, and select the most stable central position that can optimize the performance of the optical chip as the first coupling position.

[0075] Through the above steps, among multiple coupling positions that meet the basic optical power requirements, the first coupling position that is most conducive to the performance of the optical chip can be determined, thereby improving the coupling quality between the optical chip and the coupling component and ensuring the efficient and stable transmission of optical signals.

[0076] Furthermore, step A400 in the method provided in the embodiments of the present application includes:

[0077] A430: Determine the coupling movement coordinates between the initial coupling position and the first coupling position.

[0078] A440: Decompose the coupling movement coordinates according to a preset adjustment step size to generate a coupling movement trajectory, and align and couple the coupling component with the optical chip based on the coupling movement trajectory.

[0079] In the embodiments of the present application, the coupling movement coordinates are the displacement change amounts in each dimension determined when the coupling component moves from the initial coupling position to the first coupling position. The preset adjustment step size is a fixed interval value based on which the coupling movement coordinates are decomposed. The coupling movement trajectory is a series of continuous displacement paths obtained by decomposing the coupling movement coordinates according to the preset adjustment step size.

[0080] Specifically, first, determine the coupling movement coordinates between the initial coupling position and the first coupling position. Use a high-precision displacement measurement device, such as a laser interferometer, which can accurately measure the displacement changes in each dimension between two positions. Suppose through preliminary measurement and analysis, the initial coupling position is determined to be (x 1 , y 1 , z 1 ), and the first coupling position is (x 2 , y 2 , z 2 ), then the coupling movement coordinates in the three coordinate axis directions are respectively Δx = x 2 - x 1 , Δy = y 2 - y 1 , Δz = z 2 - z 1 .

[0081] Next, decompose the coupled moving coordinates according to a preset adjustment step size to generate a coupled moving trajectory. The selection of the preset adjustment step size depends on the characteristics of the optical chip and the coupling component as well as the required alignment accuracy. In the high-precision optical chip coupling scenario, the preset adjustment step size is set between dozens of nanometers and several micrometers, for example, set to 0.1 μm. Taking the movement in the X-axis direction as an example, decompose Δx in steps of 0.1 μm. If Δx = 10 μm, then this 10-μm displacement needs to be decomposed into 100 small steps of 0.1 μm. By controlling the displacement stage to move precisely at each small step, a continuous coupled moving trajectory can be generated. The displacement stage usually adopts piezoelectric ceramic drive or high-precision motor drive, and these drive methods can achieve precise displacement control at the nanometer level, ensuring that the displacement stage moves stably according to the preset step size.

[0082] Finally, align and couple the coupling component with the optical chip based on the generated coupled moving trajectory. During this process, the coupling state between the coupling component and the optical chip is monitored in real time, and the coupling effect can be judged by monitoring the optical power value fed back by the optical power meter. As the coupling component gradually approaches the optical chip along the coupled moving trajectory, the optical power meter measures the optical signal power output by the optical chip in real time. When the optical power reaches the optimal state (that is, the optical power value meets the expected high-efficiency coupling standard, for example, greater than a certain specific threshold, and this threshold is set by those skilled in the art according to the design requirements of the optical chip, application scenarios, and relevant industry standards. Assume this threshold is -8 dBm), it is considered that the coupling component and the optical chip have completed precise alignment and coupling.

[0083] Through the above steps, it is possible to precisely achieve the fine alignment and coupling of the coupling component and the optical chip by using the existing technology, improve the coupling quality of the optical chip, ensure the efficient and stable transmission of optical signals, and thus meet the strict requirements for the performance of optical chips in fields such as optical communication.

[0084] Furthermore, step A340 in the method provided by the embodiments of the present application includes:

[0085] A341: Set a signal filter, input the optical output signal into the signal filter, and perform signal filtering with a moving average filtering algorithm to obtain an optical output filtered signal.

[0086] A342: Update and feedback-analyze the coupling position between the optical chip and the coupling component according to the optical output filtered signal, and update the first coupling position.

[0087] In the embodiments of the present application, the signal filter is a device for processing the optical output signal of the optical chip. The optical output filtered signal is the signal obtained after the optical output signal of the optical chip passes through the signal filter and is processed by the moving average filtering algorithm.

[0088] In one embodiment, first, a signal filter is set up. There are various types of common signal filters, such as low-pass filters and high-pass filters based on electronic circuits. Here, a filter suitable for optical signal processing is selected. For example, in a scenario where the optical signal frequency range is 10 GHz - 20 GHz, a low-pass filter with a cut-off frequency of 30 GHz is selected, which can effectively filter out noise signals above this frequency.

[0089] Next, the optical output signal is input into the signal filter, and the sliding average filtering algorithm is used for signal filtering to obtain the optical output filtered signal. In practical applications of the sliding average filtering algorithm, a suitable window size is set. Assume the window size is 5, that is, each time 5 consecutive optical output signal samples are taken for average calculation. If the collected optical output signal sequence is P 1 、P 2 、P 3 、P 4 、P 5 , the first filtered optical power value P ‘ 1 =(P 1 +P 2 +P 3 +P 4 +P 5 ) / 5; when the new signal P 6 arrives, calculate P ‘ 2 =(P 2 +P 3 +P 4 +P 5 +P 6 ) / 5, and so on. In this way, the original optical output signal is smoothed to remove random noise in the signal and obtain the optical output filtered signal.

[0090] Then, based on the optical output filtered signal, the coupling position between the optical chip and the coupling component is updated by feedback analysis, and then the first coupling position is updated. In this process, using a feedback control system (a system for adjusting the coupling position between the optical chip and the coupling component according to the optical output filtered signal), the power value of the optical output filtered signal is compared with a preset ideal power value. Assume the preset ideal optical power value is -15 dBm. If the power value of the optical output filtered signal is lower than this ideal value, the feedback control system will calculate the adjustment direction and distance of the coupling component according to a pre-set algorithm (such as the PID algorithm, i.e., the proportional-integral-derivative algorithm).

[0091] First, calculate the deviation value between the optical output filter signal power value and the preset ideal optical power value (-15 dBm). The proportional link multiplies this deviation value by the proportional coefficient to obtain an adjustment amount proportional to the deviation magnitude. The larger the deviation, the stronger the adjustment effect. The integral link integrates the deviation, accumulates past deviations, and as time increases, its adjustment effect gradually strengthens to eliminate the steady-state error. The derivative link adjusts according to the change rate of the deviation, predicts the deviation change trend, and quickly responds when the deviation just shows signs of change to suppress the rapid change of the deviation. Add the adjustment amounts of these three links, namely proportional, integral, and derivative, to obtain the final adjustment amount, thereby calculating the direction and distance that the coupling component needs to be adjusted. For example, it is calculated that the coupling component needs to move 10 μm in a certain direction to update the coupling position and the first coupling position.

[0092] By continuously repeating the process of the above algorithm, the coupling position between the optical chip and the coupling component is gradually optimized to achieve more precise coupling, improving the performance and packaging and testing quality of the optical chip.

[0093] In summary, the optical chip automatic coupling packaging and testing method provided by the embodiments of the present application has the following technical effects:

[0094] In this application, the optical chip to be tested is moved to the packaging and testing position. With the help of an industrial camera, the coupling position is determined, the coupling component is obtained and roughly aligned to record the initial position, and the optical output signal is collected and feedback analyzed to obtain the first coupling position. After measurement by an optical power meter and screening by establishing a mapping relationship, the precise first coupling position is determined using a preset algorithm. The coupling component is finely aligned and coupled accordingly, and performance packaging and testing are performed to detect indicators such as insertion loss and generate a report. After collecting the signal, it is filtered and the coupling position is feedback adjusted, achieving the precise coupling between the optical chip and the coupling component, and improving the precision and efficiency of the optical chip coupling packaging and testing.

[0095] Embodiment 2, as Figure 2 shown, based on the same inventive concept as the foregoing Embodiment 1, the embodiment of the present application provides an optical chip automatic coupling packaging and testing system, and the system includes:

[0096] A coupling position determination module 1, which is used to move the optical chip to be tested to the packaging and testing position and determine the coupling position of the optical chip through an industrial camera.

[0097] A coupling position recording module 2, which is used to obtain the coupling component coupled to the optical chip, roughly align the optical chip and the coupling component according to the coupling position, and record the initial coupling position of the coupling component.

[0098] Coupling position acquisition module 3, which is used to collect the optical output signal of the optical chip, analyze the coupling position between the optical chip and the coupling component according to the power of the optical output signal, and obtain the first coupling position, where the first coupling position is the position where the optical power value is greater than the preset optical power value.

[0099] Performance sealing and testing execution module 4, which is used to perform fine alignment coupling between the coupling component and the optical chip at the initial coupling position according to the first coupling position, and execute the performance sealing and testing of the optical chip.

[0100] Furthermore, the coupling position recording module 2 is used to execute the following steps:

[0101] Wherein, the coupling position is the position coordinate of the optical output end of the optical chip; obtain the optical input end of the coupling component, where the coupling component includes an optical fiber array or a waveguide module; perform rough alignment between the position coordinate of the optical input end of the coupling component and the position coordinate of the optical output end of the optical chip, and record the current position of the coupling component as the initial coupling position.

[0102] Furthermore, the performance sealing and testing execution module 4 is used to execute the following steps:

[0103] The performance sealing and testing indicators for the optical chip include the insertion loss and return loss of the optical chip, the response stability of the optical chip under different temperature conditions, as well as the central wavelength and bandwidth of the optical chip; according to the performance sealing and testing indicators, generate a sealing and testing report for the optical chip and return a qualified detection result.

[0104] Furthermore, the coupling position acquisition module 3 is used to execute the following steps:

[0105] Obtain the optical power values of the optical output signal of the optical chip at multiple positions through the optical power meter; establish a mapping relationship between the multiple positions and the corresponding optical power values, and determine the first coupling position where the optical power value is greater than the preset optical power value based on the mapping relationship.

[0106] Furthermore, the coupling position acquisition module 3 is used to execute the following steps:

[0107] If the optical power values of multiple coupling positions are all greater than the preset optical power value, generate candidate coupling positions with the multiple coupling positions; obtain the high-density area where the power intensity density in the candidate coupling positions is greater than the preset density, and select the central position of the high-density area as the first coupling position.

[0108] Furthermore, the performance sealing and testing execution module 4 is used to execute the following steps:

[0109] Determine the coupling movement coordinates of the initial coupling position and the first coupling position; decompose the coupling movement coordinates according to a preset adjustment step size to generate a coupling movement trajectory, and align and couple the coupling component with the optical chip based on the coupling movement trajectory.

[0110] Further, the coupling position acquisition module 3 is configured to perform the following steps:

[0111] Set a signal filter, input the optical output signal into the signal filter, perform signal filtering with a sliding average filtering algorithm to obtain an optical output filtered signal; update and analyze the coupling position of the optical chip and the coupling component according to the optical output filtered signal, and update the first coupling position.

[0112] The optical chip automatic coupling and packaging and testing system provided by the embodiments of the present invention can execute the optical chip automatic coupling and packaging and testing method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0113] Although the present application makes various references to certain modules in the system according to the embodiments of the present application, however, any number of different modules can be used and run on the user terminal and / or server. The various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of mutual distinction and do not limit the protection scope of the present invention.

[0114] The above specific implementation manners do not constitute a limitation to the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present application shall be included within the protection scope of the present application. In some cases, the actions or steps recorded in the present application can be executed in a different order from that in the embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

Claims

1. An automatic coupling packaging and testing method for an optical chip, characterized in that: The method comprises: Move the optical chip to be tested to the sealing and testing position, and determine the coupling position of the optical chip by an industrial camera; Acquire a coupling component coupled with the optical chip, roughly align the optical chip with the coupling component according to the coupling position, and record an initial coupling position of the coupling component; Collecting an optical output signal of the optical chip, analyzing the coupling position of the optical chip and the coupling component according to the power feedback of the optical output signal, and acquiring a first coupling position, wherein the first coupling position is a position where the optical power value is greater than a preset optical power value; The coupling component is at the initial coupling position, and performs fine alignment coupling with the optical chip according to the first coupling position, to perform performance packaging and testing of the optical chip.

2. The method according to claim 1, characterized in that The optical chip is roughly aligned with the coupling component according to the coupling position, and the method include: Wherein, the coupling position is the position coordinate of the light output end of the optical chip; Acquire the optical input end of the coupling component, wherein the coupling component comprises an optical fiber array or a waveguide module; The position coordinates of the optical input end of the coupling component are roughly aligned with the position coordinates of the optical output end of the optical chip, and the current position of the coupling component is recorded as the initial coupling position.

3. The method according to claim 1, characterized in that The method for performing performance packaging and testing of the optical chip includes: The performance testing indicators of the optical chip include the insertion loss and return loss of the optical chip, the response stability of the optical chip under different temperature conditions, and the central wavelength and bandwidth of the optical chip; Based on the performance packaging and testing indicators, a packaging and testing report of the optical chip is generated and a qualified test result is returned.

4. The method according to claim 1, characterized in that The coupling component is provided with an optical power meter, and the method comprises: Acquiring optical power values ​​of the optical output signal of the optical chip at multiple positions by means of the optical power meter; A mapping relationship between the multiple positions and corresponding optical power values ​​is established, and a first coupling position having an optical power value greater than a preset optical power value is determined based on the mapping relationship.

5. The method according to claim 4, characterized in that Determining a first coupling position where the optical power value is greater than a preset optical power value based on the mapping relationship, the method further includes: If the optical power values ​​of the multiple coupling positions are all greater than the preset optical power value, generating candidate coupling positions with the multiple coupling positions; A high-density area in the candidate coupling positions, where the power intensity density is greater than a preset density, is obtained, and a central position of the high-density area is selected as the first coupling position.

6. The method according to claim 1, characterized in that The coupling component is at the initial coupling position, and performs fine alignment coupling with the optical chip according to the first coupling position, and the method includes: determining coupling movement coordinates of the initial coupling position and the first coupling position; The coupling movement coordinates are decomposed according to a preset adjustment step length to generate a coupling movement trajectory, and the coupling component is aligned and coupled with the optical chip based on the coupling movement trajectory.

7. The method according to claim 1, characterized in that After collecting the optical output signal of the optical chip, the method further includes: Setting a signal filter, inputting the optical output signal into the signal filter, filtering the signal using a sliding average filtering algorithm, and obtaining an optical output filtered signal; The coupling position between the optical chip and the coupling component is analyzed based on the updated feedback of the optical output filter signal, and the first coupling position is updated.

8. The optical chip automatic coupling packaging and testing system is characterized by: The system is used to implement the optical chip automatic coupling packaging and testing method according to any one of claims 1 to 7, comprising: A coupling position determination module, used to move the optical chip to be tested to the sealing and testing position, and determine the coupling position of the optical chip through an industrial camera; A coupling position recording module, used for acquiring a coupling component coupled to the optical chip, roughly aligning the optical chip with the coupling component according to the coupling position, and recording an initial coupling position of the coupling component; A coupling position acquisition module, used for collecting the optical output signal of the optical chip, analyzing the coupling position of the optical chip and the coupling component according to the power feedback of the optical output signal, and acquiring a first coupling position, wherein the first coupling position is a position where the optical power value is greater than a preset optical power value; A performance packaging and testing execution module is used for the coupling component to be at the initial coupling position, to perform fine alignment coupling with the optical chip according to the first coupling position, and to perform performance packaging and testing of the optical chip.

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