High-precision temperature control cooling system and temperature control equipment

Abstract

The invention relates to a high-precision temperature control cooling system and temperature control equipment, and the cooling system comprises a heat exchange part which is used for cooling a cooling medium supplied to equipment to be subjected to constant temperature; the temperature control part comprises a first temperature measurement circuit board, and the temperature control part can adjust the working power of the heat exchange part according to the obtained temperature; and the constant temperature part is used for acquiring the board body temperature of the first temperature measurement circuit board and adjusting the board body temperature of the first temperature measurement circuit board according to the acquired temperature. The constant temperature part obtains the board body temperature of the first temperature measurement circuit board and adjusts the board body temperature of the first temperature measurement circuit board, so that the first temperature measurement circuit board can be kept in a preset temperature range meeting requirements, and the accuracy and stability of the temperature, measured by the first temperature measurement circuit board, of the cooling medium subjected to constant temperature treatment are effectively improved. And the temperature control part can accurately and timely control the working power of the heat exchange part according to the measured temperature of the cooling medium subjected to constant temperature treatment, so that the stability and the accuracy of the temperature of the cooling medium provided for the equipment to be subjected to constant temperature treatment are ensured.

Description

Technical Field

[0001] The present application relates to the technical field of high-precision temperature measurement and temperature control, and in particular, to a high-precision temperature control cooling system and temperature control equipment. Background Art

[0002] With the continuous improvement of the performance requirements for industrial equipment, especially in high-precision fields such as semiconductors, precision instruments, and laser processing, higher requirements are placed on the accuracy and stability of temperature control. Existing high-precision water chillers are mainly used to provide a stable cooling water source for precision equipment to ensure that the temperature of the equipment remains within a specific range during operation. The water chiller can output the temperature of the cooling medium provided by its own temperature measuring circuit board, and adjust the refrigeration power in real time according to the temperature so that the temperature of the output cooling medium remains within a specific range. In the related art, the temperature measuring circuit board is usually directly integrated on or in the water chiller body. Since the water chiller body itself and the ambient temperature in which it is located are unstable, temperature changes will affect the performance of electronic components on the circuit board (such as drift effects, changes in resistance, inductance, etc.), thereby reducing the temperature accuracy of the temperature measuring circuit board output, and the circuit thermal noise is large, which leads to problems such as over-response (inaccuracy) of the temperature control system, temperature control lag, temperature oscillation, reduced cooling efficiency, increased risk of equipment failure, reduced energy efficiency, and reduced system stability. Summary of the invention

[0003] The purpose of the present disclosure is to provide a high-precision temperature-controlled cooling system and a temperature-controlled device to at least partially solve the problems existing in the related art.

[0004] According to a first aspect of the present disclosure, a high-precision temperature control cooling system is provided for providing a cooling medium to a device to be kept at a constant temperature. The high-precision temperature control cooling system comprises: A heat exchange part, used for cooling the cooling medium supplied to the equipment to be kept at a constant temperature; A temperature control unit, comprising a first temperature measuring circuit board, wherein the temperature control unit can adjust the working power of the heat exchange unit according to the temperature of the cooling medium after cooling obtained by the first temperature measuring circuit board; and The thermostat is used to obtain the board temperature of the first temperature measuring circuit board and adjust the board temperature of the first temperature measuring circuit board according to the obtained temperature.

[0005] Optionally, the constant temperature section includes at least one constant temperature module, which are arranged in sequence and respectively include a second temperature measuring circuit board. The temperature control section is arranged at the most downstream of the at least one constant temperature module. The temperature control section and the at least one constant temperature module, the upstream one of the two adjacent ones located upstream, are used to obtain the board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board of the downstream one, and adjust the board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board of the downstream one according to the obtained board temperature.

[0006] Optionally, the temperature control unit further includes: A first temperature sensor connected to the first temperature measuring circuit board, the first temperature sensor and the first temperature measuring circuit board are used to obtain the temperature of the cooling medium after the temperature is reduced; and A first controller is used to adjust the working power of the heat exchange part according to the obtained temperature of the cooling medium after the temperature is reduced.

[0007] Optionally, the constant temperature module further includes: a temperature controller installed on the first temperature measuring circuit board or the second temperature measuring circuit board adjacent to the constant temperature module and located downstream of the constant temperature module; a second temperature sensor, mounted on the first temperature measuring circuit board or the second temperature measuring circuit board adjacent to the constant temperature module and located downstream of the constant temperature module, the second temperature sensor being connected to the second temperature measuring circuit board of the constant temperature module to obtain a board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board adjacent to the constant temperature module and located downstream of the constant temperature module; and A second controller, the second controller is used to adjust the working power of the temperature controller according to the obtained board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board. Preferably, the first controller is integrated in the first temperature measuring circuit board, and the second controller is integrated in the second temperature measuring circuit board.

[0008] Optionally, a first heat-conducting medium is provided between the temperature controller and the corresponding first temperature-measuring circuit board or the corresponding second temperature-measuring circuit board, or the temperature controller and the corresponding first temperature-measuring circuit board or the corresponding second temperature-measuring circuit board are bonded to each other.

[0009] Optionally, it also includes: A first pipeline is used to connect between the heat exchange part and the device to be thermostatically controlled, so that the heat exchange part can receive the cooling medium after absorbing heat from the device to be thermostatically controlled; and The second pipeline is used to connect between the heat exchange part and the device to be thermostatically controlled, so that the heat exchange part can provide the cooling medium after the temperature is reduced to the device to be thermostatically controlled. Wherein, the first temperature sensor is installed in the second pipeline, and preferably, it also includes a water pump and a water tank arranged in the second pipeline.

[0010] Optionally, the heat exchange unit includes: A first heat exchange plate, used to cool the cooling medium flowing through the first heat exchange plate; A compressor assembly, used to cool the first heat exchange plate; and a heater installed downstream of the first heat exchange plate to heat the cooling medium from the first heat exchange plate, The temperature control unit is used to adjust the working power of the heater according to the temperature of the cooling medium after cooling.

[0011] Optionally, the heat exchange unit includes: A second heat exchange plate, used to cool the cooling medium flowing through the second heat exchange plate; and A semiconductor refrigeration sheet, wherein the cold end of the semiconductor refrigeration sheet faces the second heat exchange plate, The temperature control unit is used to adjust the working power of the semiconductor refrigeration sheet according to the temperature of the cooling medium after cooling. Preferably, the number of the semiconductor refrigeration fins is two, and they are symmetrically arranged on both sides of the second heat exchange plate. Preferably, a heat dissipation module is also included which is arranged at the hot end of the semiconductor refrigeration fins.

[0012] Optionally, a second heat-conducting medium is provided between the cold end of the semiconductor refrigeration plate and the second heat exchange plate. Preferably, the second heat-conducting medium is thermally conductive silicone grease, or an indium sheet, or a tin sheet, or a copper sheet. Alternatively, the cold end of the semiconductor refrigeration plate and the second heat exchange plate are in contact with each other.

[0013] According to a second aspect of the present disclosure, a temperature control device is provided, comprising the above-mentioned high-precision temperature control cooling system.

[0014] By using the above technical solution, the constant temperature unit can obtain the board temperature of the first temperature measuring circuit board and adjust the board temperature of the first temperature measuring circuit board according to the temperature, so that the first temperature measuring circuit board can be maintained within a preset temperature range that meets the requirements, thereby ensuring the stability of the performance of the electronic components on the first temperature measuring circuit board, so as to effectively improve the accuracy and stability of the temperature of the cooling medium after constant temperature treatment measured by the first temperature measuring circuit board, and then the temperature control unit can accurately and timely control the working power of the heat exchange unit according to the measured temperature of the cooling medium after constant temperature treatment, thereby ensuring the stability and accuracy of the temperature of the cooling medium provided to the device to be thermostatted, and avoiding the system's over-response due to changes in ambient temperature (temperature changes in the first temperature measuring circuit board), temperature control lag, temperature oscillation, decreased cooling efficiency, increased failure rate due to frequent temperature adjustments, energy waste, decreased stability and other problems.

[0015] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 is a schematic diagram of a high-precision temperature control cooling system exemplarily shown according to the present disclosure; Figure 2 It is a schematic diagram of another high-precision temperature control cooling system exemplarily shown according to the present disclosure.

[0017] Description of Reference Numerals 1-equipment to be thermostatically controlled; 2-heat exchange unit; 21-first heat exchange plate; 22-compressor assembly; 23-heater; 24-second heat exchange plate; 25-semiconductor refrigeration plate; 26-heat dissipation module; 31-first temperature measuring circuit board; 32-first temperature sensor; 33-first controller; 41-second temperature measuring circuit board; 42-thermostat; 43-second temperature sensor; 44-second controller; 50-second heat transfer medium; 61-first pipeline; 62-second pipeline; 63-water pump; 64-water tank. DETAILED DESCRIPTION

[0018] The specific embodiments of the present disclosure are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure.

[0019] In the present disclosure, unless otherwise stated, the directional words used, such as "upper" and "lower", may be based on the orientation of related components when used in combination, for example: the temperature control part and the at least one constant temperature module, the one located "upstream" is used to obtain the board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board of the one located "downstream", and the "upper" and "lower" here are defined based on the functional coordination relationship between the temperature control part and the at least one constant temperature module, that is, the at least one constant temperature module and the temperature control part are connected in sequence, the direction toward the temperature control part is the downstream, and the direction away from the temperature control part is the upstream.

[0020] In the present disclosure, the terms "first", "second", etc. are used to distinguish one element from another element, and do not have order and importance. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0021] Reference Figure 1 and Figure 2 The present disclosure provides a high-precision temperature control cooling system for providing a cooling medium to a device 1 to be thermostatically controlled. The cooling medium here can be cooling water, cooling oil, cooling gas, etc. The high-precision temperature control cooling system includes: a heat exchange unit 2 for cooling the cooling medium supplied to the device 1 to be thermostatically controlled, a temperature control unit, and a constant temperature unit. The temperature control unit includes a first temperature measuring circuit board 31. The temperature control unit can adjust the working power of the heat exchange unit 2 according to the temperature of the cooling medium after cooling obtained by the first temperature measuring circuit board 31, thereby achieving the adjustment of the temperature of the cooling medium. The constant temperature unit is used to obtain the board temperature of the first temperature measuring circuit board 31, and adjust the board temperature of the first temperature measuring circuit board 31 according to the obtained temperature. Here, the aforementioned board temperature is affected by the ambient temperature and the like.

[0022] It should be noted that the first temperature measuring circuit board 31 here and the second temperature measuring circuit board 41 mentioned below may include resistors, capacitors, semiconductor elements, reference voltages, etc., which can cooperate with a temperature measuring probe (such as the temperature sensor mentioned below) to calculate and output the measured temperature, and their own temperature and the ambient temperature in which they are located can affect the temperature measurement results they output. It is well known to those skilled in the art that the temperature measuring probe cooperates with the temperature measuring circuit board to calculate and output the temperature to be measured. The principle and structure are not introduced in detail here. The improvement points of the present disclosure do not involve improvements in the structure and principle of the temperature measuring circuit board. The present disclosure aims to provide a high-precision temperature control cooling system with stable temperature of the temperature measuring circuit board itself.

[0023] The present disclosure does not limit the heat exchange part 2, as long as it can absorb the heat of the cooling medium and cool it down to a temperature that meets the conditions so as to be able to cool the constant temperature equipment. It can include the compressor assembly or semiconductor refrigeration plate mentioned below, and the specific structure will be introduced below.

[0024] By using the above technical scheme, the constant temperature unit can obtain the board temperature of the first temperature measuring circuit board 31 and adjust the board temperature of the first temperature measuring circuit board 31 according to the temperature, so that the first temperature measuring circuit board 31 can be maintained within a preset temperature range that meets the requirements, thereby ensuring the stability of the performance of the electronic components on the first temperature measuring circuit board 31, so as to effectively improve the accuracy and stability of the temperature of the cooling medium after the constant temperature treatment measured by the first temperature measuring circuit board 31, and then the temperature control unit can accurately and timely control the working power of the heat exchange unit 2 according to the measured temperature of the cooling medium after the constant temperature treatment, thereby ensuring the stability and accuracy of the temperature of the cooling medium provided to the device to be thermostatted 1, and avoiding the system's over-response due to changes in ambient temperature (temperature changes in the first temperature measuring circuit board 31), temperature control lag, temperature oscillation, reduced cooling efficiency, increased failure rate due to frequent temperature adjustments, energy waste, reduced stability and other problems.

[0025] In an embodiment of the present disclosure, the thermostatic part may include at least one thermostatic module, and at least one thermostatic module is arranged in sequence and includes a second temperature measuring circuit board 41 respectively. The temperature control part is arranged at the most downstream of the at least one thermostatic module. If the number of the thermostatic modules is one, the thermostatic module and the temperature control part are arranged in sequence. Among them, the temperature control part and the at least one thermostatic module are located upstream of the two adjacent ones, and the temperature control part is used to obtain the plate body temperature of the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 of the one located downstream, and adjust the plate body temperature of the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 of the one located downstream according to the obtained plate body temperature. In this way, when there are multiple thermostatic modules, the most upstream thermostatic module can perform temperature control on the second temperature measuring circuit board 41 of a thermostatic module located downstream thereof, thereby improving the accuracy and stability of the temperature measurement and temperature control of the one located downstream. When multiple thermostatic modules are connected in sequence, the aforementioned temperature measurement and temperature control effects are superimposed in sequence, thereby further improving the accuracy and stability of the temperature measurement and temperature control of the temperature control part located at the most downstream, thereby meeting the high-precision temperature control requirements.

[0026] In the embodiments of the present disclosure, the number of the constant temperature modules may be one, two, three, four, five, etc.

[0027] In order to measure the temperature of the cooling medium after cooling, and adjust the working power of the heat exchange part 2 according to the temperature, refer to Figure 1 and Figure 2In the embodiment of the present disclosure, the temperature control unit may further include a first temperature sensor 32 and a first controller 33. The first temperature sensor 32 may be connected to the first temperature measuring circuit board 31. The first temperature sensor 32 and the first temperature measuring circuit board 31 are used to obtain the temperature of the cooling medium after cooling. Specifically, the first temperature sensor 32 may be used as a probe to directly contact the cooling medium, and the first temperature measuring circuit board 31 may calculate and output the temperature of the cooling medium according to the change in the performance parameters of the first temperature sensor 32 (which changes with the temperature of the cooling medium). The first controller 33 is used to adjust the working power of the heat exchange unit 2 according to the obtained temperature of the cooling medium after cooling. The first controller 33 may be connected to the first temperature measuring circuit board 31 and control the working power of the heat exchange unit 2 according to the temperature data output by the first temperature measuring circuit board 31, thereby adjusting the temperature of the cooling medium.

[0028] The present disclosure does not limit the types of the first temperature sensor 32 and the second temperature sensor mentioned below, which may be a thermistor, a thermocouple, a semiconductor sensor, etc.

[0029] The present disclosure does not limit the constant temperature module. Figure 1 and Figure 2 In the embodiment of the present disclosure, the constant temperature module may further include a thermostat 42, a second temperature sensor 43 and a second controller 44. The thermostat 42 may be installed on the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 adjacent to the constant temperature module and located downstream of the constant temperature module. The thermostat 42 may be used to adjust the temperature. Specifically, in order to facilitate the arrangement and simplify the structure, the thermostat 42 may be a heating device (without a cooling function), for example, a compressor refrigerant waste heat heater, or a hot end of a semiconductor refrigeration plate, a PCT heater, a silicone heating plate, and an aluminum fin, etc. In this case, the preset temperature of the first temperature measuring circuit board 31 and the second temperature measuring circuit board 41 may be higher than the ambient temperature, so that it is only necessary to heat the corresponding temperature measuring circuit board. The second temperature sensor 43 may be installed on the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 adjacent to the thermostatic module and located downstream of the thermostatic module, and the second temperature sensor 43 may be connected to the second temperature measuring circuit board 41 of the thermostatic module to obtain the board temperature of the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 adjacent to the thermostatic module and located downstream of the thermostatic module. The second controller 44 may be used to adjust the working power of the thermostat 42 according to the obtained board temperature of the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41, thereby controlling the temperature of the first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 to be within the required temperature range, thereby ensuring the accuracy of the temperature measurement and the stability of the temperature control.

[0030] Reference Figure 1 and Figure 2 In the embodiment of the present disclosure, in order to simplify the structure of the high-precision temperature control cooling system and improve space utilization, the first controller 33 can be integrated into the first temperature measuring circuit board 31, and the second controller 44 can be integrated into the second temperature measuring circuit board 41. Of course, in some other embodiments, the controller and the temperature measuring circuit board can also be separately provided and establish a signal connection (such as an electrical connection).

[0031] In order to improve the heat conduction efficiency between the thermostat 42 and the corresponding first temperature measuring circuit board 31 or the second temperature measuring circuit board 41, in the embodiment of the present disclosure, a first heat conducting medium (not shown in the figure) may be provided between the thermostat 42 and the corresponding first temperature measuring circuit board 31 or the second temperature measuring circuit board 41, which may specifically be thermal conductive silicone grease, indium sheet, tin sheet, copper sheet, etc. In addition, in some other embodiments, the thermostat 42 may also be bonded to (directly contacted with) the corresponding first temperature measuring circuit board 31 or the second temperature measuring circuit board 41 to improve the thermal conductivity.

[0032] Reference Figure 1 and Figure 2 In the embodiment of the present disclosure, the high-precision temperature control cooling system may further include a first pipeline 61 and a second pipeline 62. The first pipeline 61 may be used to connect between the heat exchange unit 2 and the device to be thermostatically controlled 1, so that the heat exchange unit 2 can receive the cooling medium after absorbing heat from the device to be thermostatically controlled 1. The second pipeline 62 may be used to connect between the heat exchange unit 2 and the device to be thermostatically controlled 1, so that the heat exchange unit 2 can provide the cooling medium after cooling to the device to be thermostatically controlled 1. Among them, the first temperature sensor 32 may be installed in the second pipeline 62 to be able to measure the temperature of the cooling medium after cooling. With such a design, a circulation flow path may be formed between the heat exchange unit 2 and the device to be thermostatically controlled 1, that is, the heat exchange unit 2 cools the cooling medium and supplies it to the device to be thermostatically controlled 1 through the second pipeline 62 to cool the device to be thermostatically controlled 1, and the cooling medium after absorbing heat in the device to be thermostatically controlled 1 may flow to the heat exchange unit 2 through the first pipeline 61 for cooling, and the cooling medium after cooling may be supplied to the device to be thermostatically controlled 1 through the second pipeline 62 again, and the cycle repeats.

[0033] Reference Figure 1 and Figure 2 In the embodiment of the present disclosure, the high-precision temperature control cooling system may further include a water pump 63 and a water tank 64 disposed in the second pipeline 62. The water pump 63 may provide power for the circulation of the cooling medium, and the water tank 64 may ensure that there is enough cooling medium to participate in the circulation to meet the cooling demand.

[0034] The present disclosure does not limit the specific structure of the heat exchange part 2. Two embodiments will be introduced below. Of course, the present disclosure is not limited to these two embodiments. Specifically: First embodiment Reference Figure 1 In this embodiment, the heat exchange unit 2 may include: a first heat exchange plate 21, which is used to cool the cooling medium flowing through the first heat exchange plate 21; a compressor assembly 22, which is used to cool the first heat exchange plate 21; and a heater 23, which is installed downstream of the first heat exchange plate 21, and is used to heat the cooling medium from the first heat exchange plate 21, and perform thermal compensation, so as to keep the temperature of the cooling medium constant. Among them, the temperature control unit is used to adjust the working power of the heater 23 according to the temperature of the cooling medium after cooling. With such a design, the compressor assembly 22 can reduce the temperature of the first heat exchange plate 21, so that the cooling medium flowing through the first heat exchange plate 21 can be cooled, and the cooling medium after cooling flows through the heater 23 to be heated to obtain a cooling medium that meets the temperature requirements and is supplied to the device 1 to be thermostatically controlled. Specifically, the first controller 33 of the temperature control unit can control the working power of the heater 23, so as to control the temperature of the cooling medium, and the adjustment is flexible and convenient.

[0035] Second embodiment Reference Figure 2 In this embodiment, the heat exchange unit 2 may include: a second heat exchange plate 24, which is used to cool the cooling medium flowing through the second heat exchange plate 24; and a semiconductor refrigeration plate 25, the cold end of which faces the second heat exchange plate 24. The temperature control unit is used to adjust the working power of the semiconductor refrigeration plate 25 according to the temperature of the cooling medium after cooling. With such a design, when the semiconductor refrigeration plate 25 is powered on, the temperature of its cold end is reduced, thereby reducing the temperature of the second heat exchange plate 24, and further reducing the temperature of the cooling medium flowing through the second heat exchange plate 24. The first controller 33 can adjust the working power of the semiconductor refrigeration plate 25 to adjust the temperature of the cold end, and then indirectly adjust the temperature of the second heat exchange plate 24, and finally realize the temperature regulation of the cooling medium flowing through the second heat exchange plate 24, and the regulation is convenient and flexible.

[0036] Here, the semiconductor cooling sheet refers to a sheet material that generates a hot end and a cold end after being powered on. The hot end and the cold end can be connected to the ceramic sheet respectively so that the temperature control effect of the hot end and the cold end acts on the ceramic sheet, and the temperature of the cooling plate can be adjusted by turning the ceramic sheet toward the corresponding cooling plate. Of course, the aforementioned ceramic sheet can also be replaced by other materials, as long as it can act on the corresponding cooling plate with the heat of the hot end and the cold end. In some embodiments, the hot end and the cold end can be directly attached to the corresponding cooling plate to change its temperature. Since its working principle is well known to those skilled in the art, it will not be introduced too much here. It should be noted that in the embodiment of the present disclosure, the number of semiconductor cooling sheets 25 can be multiple, and the first hot end and the first cold end of the multiple semiconductor cooling sheets 25 are oriented in the same direction to improve the cooling effect.

[0037] Reference Figure 2In the embodiment of the present disclosure, the number of semiconductor refrigeration plates 25 can be two, and they are symmetrically arranged on both sides of the second heat exchange plate 24. By arranging two semiconductor refrigeration plates 25, the cooling capacity of the second heat exchange plate 24 can be improved so that it can meet the cooling requirements.

[0038] Further, refer to Figure 2 In the embodiment of the present disclosure, the high-precision temperature control cooling system may further include a heat dissipation module 26 disposed at the hot end of the semiconductor cooling plate 25. The heat dissipation module 26 can dissipate heat from the hot end of the semiconductor cooling plate 25, thereby ensuring the cooling efficiency of the cold end of the semiconductor cooling plate 25. The present disclosure does not limit the specific type of the heat dissipation module 26, which may be a fan, a water cooling plate, etc.

[0039] In order to improve the thermal conductivity between the cold end of the semiconductor refrigeration plate 25 and the second heat exchange plate 24, refer to Figure 2 In the embodiment of the present disclosure, a second heat conducting medium 50 may be provided between the cold end of the semiconductor refrigeration plate 25 and the second heat exchange plate 24 .

[0040] The present disclosure does not limit the type of the second heat-conducting medium 50, which may be, for example, thermal grease, or an indium sheet, or a tin sheet, or a copper sheet. Compared with thermal grease, the above three have better thermal conductivity.

[0041] In addition, in some other embodiments, the cold end of the semiconductor refrigeration plate 25 can be in contact with (directly in contact with) the second heat exchange plate 24 to improve thermal conductivity, which is not limited in the present disclosure.

[0042] According to a second aspect of the present disclosure, a temperature control device is provided, including the above-mentioned high-precision temperature control cooling system. Since the temperature control device has all the beneficial effects of the above-mentioned cooling system, no further description is given here. The temperature control device can be, for example, a water chiller, a constant temperature chamber, etc.

[0043] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0044] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0045] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A high-precision temperature control cooling system for providing cooling medium to a device to be kept at a constant temperature, characterized in that: The cooling system comprises: A heat exchange part, used for cooling the cooling medium supplied to the equipment to be kept at a constant temperature; A temperature control unit, comprising a first temperature measuring circuit board, wherein the temperature control unit can adjust the working power of the heat exchange unit according to the temperature of the cooling medium after cooling obtained by the first temperature measuring circuit board; and The thermostat is used to obtain the board temperature of the first temperature measuring circuit board and adjust the board temperature of the first temperature measuring circuit board according to the obtained temperature.

2. The high-precision temperature control cooling system according to claim 1, characterized in that: The constant temperature section includes at least one constant temperature module, and the at least one constant temperature module is arranged in sequence and respectively includes a second temperature measuring circuit board. The temperature control section is arranged at the most downstream of the at least one constant temperature module. The temperature control section and the at least one constant temperature module, the one located upstream of the two adjacent ones are used to obtain the board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board of the one located downstream, and adjust the board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board of the one located downstream according to the obtained board temperature.

3. The high-precision temperature control cooling system according to claim 2, characterized in that: The temperature control unit also includes: A first temperature sensor connected to the first temperature measuring circuit board, the first temperature sensor and the first temperature measuring circuit board are used to obtain the temperature of the cooling medium after the temperature is reduced; and A first controller is used to adjust the working power of the heat exchange part according to the obtained temperature of the cooling medium after the temperature is reduced.

4. The high-precision temperature control cooling system according to claim 3, characterized in that: The constant temperature module also includes: a temperature controller installed on the first temperature measuring circuit board or the second temperature measuring circuit board adjacent to the constant temperature module and located downstream of the constant temperature module; a second temperature sensor, mounted on the first temperature measuring circuit board or the second temperature measuring circuit board adjacent to the constant temperature module and located downstream of the constant temperature module, the second temperature sensor being connected to the second temperature measuring circuit board of the constant temperature module to obtain a board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board adjacent to the constant temperature module and located downstream of the constant temperature module; and A second controller, the second controller is used to adjust the working power of the temperature controller according to the obtained board temperature of the first temperature measuring circuit board or the second temperature measuring circuit board. Preferably, the first controller is integrated in the first temperature measuring circuit board, and the second controller is integrated in the second temperature measuring circuit board.

5. The high-precision temperature control cooling system according to claim 4, characterized in that: A first heat-conducting medium is arranged between the temperature controller and the corresponding first temperature-measuring circuit board or the corresponding second temperature-measuring circuit board, or the temperature controller and the corresponding first temperature-measuring circuit board or the corresponding second temperature-measuring circuit board are attached to each other.

6. The high-precision temperature control cooling system according to claim 3, characterized in that: Also includes: A first pipeline is used to connect between the heat exchange part and the device to be thermostatically controlled, so that the heat exchange part can receive the cooling medium after absorbing heat from the device to be thermostatically controlled; as well as The second pipeline is used to connect between the heat exchange part and the device to be thermostatically controlled, so that the heat exchange part can provide the cooling medium after the temperature is reduced to the device to be thermostatically controlled. Wherein, the first temperature sensor is installed in the second pipeline, and preferably, it also includes a water pump and a water tank arranged in the second pipeline.

7. The high-precision temperature control cooling system according to any one of claims 1 to 6, characterized in that: The heat exchange part comprises: A first heat exchange plate, used to cool the cooling medium flowing through the first heat exchange plate; A compressor assembly, used to cool the first heat exchange plate; and a heater installed downstream of the first heat exchange plate to heat the cooling medium from the first heat exchange plate, The temperature control unit is used to adjust the working power of the heater according to the temperature of the cooling medium after cooling.

8. The high-precision temperature control cooling system according to any one of claims 1 to 6, characterized in that: The heat exchange part comprises: A second heat exchange plate, used to cool the cooling medium flowing through the second heat exchange plate; and A semiconductor refrigeration sheet, wherein the cold end of the semiconductor refrigeration sheet faces the second heat exchange plate, The temperature control unit is used to adjust the working power of the semiconductor refrigeration sheet according to the temperature of the cooling medium after cooling. Preferably, the number of the semiconductor refrigeration fins is two, and they are symmetrically arranged on both sides of the second heat exchange plate. Preferably, a heat dissipation module is also included which is arranged at the hot end of the semiconductor refrigeration fins.

9. The high-precision temperature control cooling system according to claim 8, characterized in that: A second heat-conducting medium is arranged between the cold end of the semiconductor refrigeration plate and the second heat exchange plate. Preferably, the second heat-conducting medium is heat-conducting silicone grease, or an indium sheet, or a tin sheet, or a copper sheet. Alternatively, the cold end of the semiconductor refrigeration plate and the second heat exchange plate are in contact with each other.

10. A temperature control device, characterized in that: A high-precision temperature-controlled cooling system comprising any one of claims 1-9.

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