Production process for installing insulator on lead of electronic component
During the sintering process of electronic components, the casing is assembled on metal pins and constrained by metal flanges to form an insulator embryo, and the problems of deformation and low yield of metal components in the prior art are solved, and an efficient and low-cost production process is achieved.
Patent Information
- Application Number
- CN202510340272.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2025-06-10
AI Technical Summary
The prior art easily leads to deformation of metal components during the sintering process of electronic components, and the sintering and electroplating processes of stainless steel materials are complex, the yield is low, the time cost is high, and the small batch of multiple varieties of products increases the mold and time cost.
By assembling the sleeve on the metal pins and constrained by the metal flange, it is assembled into an insulator embryo and fed into a sintering furnace for sintering to form a separate insulator part, which is subsequently plating and laser packaging installation.
The risks of sintering deformation and high-temperature degeneration are avoided, the product pass rate is improved, the production time is shortened, the time and mold manufacturing cost is reduced, and the work efficiency and applicability is improved.
Smart Images
Figure CN120126871A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic components, and specifically to a production process for an insulator for installing wires of electronic components. Background Art
[0002] In the processing of components such as integrated circuits and chips, a metal component housing is first fabricated. A number of holes are reserved on the housing for installing metal pins. The function of the metal pins is to install and fix other electronic components, but insulation treatment is required between the metal pins and the component itself. In the prior art, a common processing method is to install a number of metal pins and a glass / ceramic blank on the electronic component housing, and then sinter them together in a high-temperature furnace so that the metal pins are fixed at fixed positions in the holes. However, if the prior art is adopted, the following problems exist: 1) Some metal components are prone to deformation during sintering, or their physical properties are changed, resulting in product scrapping. 2) Especially for products made of stainless steel, the sintering and electroplating processes are relatively complex. The hole diameters on the housings of different batches may vary. Glass beads or ceramic beads need to be rematched for each batch of housings to ensure the matching degree, and the error tolerance is low. If there is a problem with one pin or the glass, the entire set of products will be scrapped, and the yield is relatively low. 3) The number of pins to be installed on the metal component is uncertain. Therefore, different fixing molds need to be fabricated for sintering each product to fix the positions of the metal pins. When the product is a small-batch and multi-variety product, a large amount of cost is increased. 4) From customizing the mold, glass / ceramic blank, to sintering the finished product, the time is at least 15 - 20 days, and the time cost is relatively large. Summary of the Invention
[0003] (I) Technical Problems to be Solved In view of the deficiencies of the prior art, the present invention provides a production process for an insulator for installing wires of electronic components, which solves the problems existing in the prior art.
[0004] (II) Technical Solutions To achieve the above objectives, the present invention is realized through the following technical solutions: A production process for an insulator for installing wires of electronic components, the specific operations are as follows: S1. Assemble a sleeve on a metal pin and constrain it with a metal flange to form an insulator blank. S2. Then send the insulator blank into a sintering furnace and perform sintering operations using a sintering mold, so that the metal pin, metal flange, and sleeve form a single insulator part. S3. Electroplate the pins of the insulator part according to the plating requirements. S4. Install and fix the corresponding insulator parts onto the corresponding electronic components in a laser encapsulation manner. During operation, place the metal housing of the electronic component on the corresponding jig, and then install the insulator parts corresponding to the housing into multiple holes on the housing, and fix them in place through laser welding. The laser power and time are set according to different product conditions.
[0005] Preferably, in step S1, the material of the metal flange is stainless steel.
[0006] Preferably, in step S1, the bushing is one of a glass blank or a ceramic bead.
[0007] Preferably, in step S2, the sintering temperature is 960°C - 980°C, and the processing time is 15 - 20 minutes. The specific parameters are determined according to the size of the insulator.
[0008] Preferably, the shape of the metal flange is a cylinder or a combination of two cylinders with different radii stacked together, and the front view of the combination is in the shape of a "convex".
[0009] Preferably, the bushing used in step S1 is obtained by outsourcing or self - manufacturing. If it is self - manufactured and the bushing material is a glass blank, the specific operation is as follows: According to the aperture size on the housing of different electronic components, the granulated glass powder containing an adhesive that is hermetically sealed and matched is pressed into the shape required for the product by a machine tool, called a glass bead blank, which has a through - hole in the center for passing through the pins. Place it in a stainless - steel tray and enter the dewaxing furnace one by one through a conveyor belt. Exclude the adhesive in the glass powder by degumming within the temperature range of 300° - 680°, and then cure it. After curing, it is called a glass bead.
[0010] Preferably, before using the metal flange and metal pins, they need to be aligned and cleaned. At the same time, according to the sealing requirements of different products, it is judged whether to perform pre - oxidation operations on the housing and pins.
[0011] Preferably, in step S2, the sintering die is made of graphite, which has several counter - bores and through - holes. The through - holes are located at the center of the counter - bores. The counter - bores are for positioning the metal flange, and the through - holes are for pin positioning, thus preventing pin offset.
[0012] Preferably, a positioning groove is provided on the metal flange, and a sealing ring is provided in the positioning groove. The sealing ring is sleeved on the surface of the bushing, and the upper surface of the sealing ring is in the same plane as the upper surface of the metal flange.
[0013] (III) Beneficial effects The present invention provides a production process for an insulator for installing wires of electronic components. It has the following beneficial effects: In the production process of the insulator for installing wires of electronic components, during processing, the metal component part does not enter the sintering furnace, avoiding the risks of sintering deformation and high-temperature denaturation, and improving the product qualification rate. At the same time, through the form of pre-sintering the metal pins and the glass embryo, a modular insulator installation module is formed, eliminating the need for additional customized positioning molds. From insulator sintering to product installation and laser welding encapsulation, the time can be shortened to 1 week, compared with 15 - 20 days in the prior art, greatly improving work efficiency and reducing time costs. Meanwhile, this product has strong applicability. For the outer shells of similar integrated circuit electronic components, the diameters of most pins and the heights of inner pins are basically similar. By setting several finished products of modular insulator parts with general specifications according to different diameters, a large amount of goods can be stocked, greatly reducing the manufacturing cost of the molds. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic structural diagram of the present invention (when the metal flange is a cylinder); Figure 2 It is a schematic structural diagram of the present invention (when the metal flange is a combined body).
[0015] In the figure: 1, sleeve; 2, metal pin; 3, metal flange; 4, narrower part; 5, wider part. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0017] Please refer to Figure 1-2 , the present invention provides a technical solution: a production process for an insulator for installing wires of electronic components, and the specific operations are as follows: S1. Assemble the sleeve on the metal pin and be restricted by the metal flange to form an insulator embryo. Among them, the material of the metal flange is stainless steel, the sleeve is one of a glass embryo or a ceramic bead, the shape of the metal flange is a cylinder or a combined body formed by stacking two cylinders with different radii, the front view of the combined body is in the shape of a "convex", a positioning groove is provided on the metal flange, a sealing ring is provided in the positioning groove, the sealing ring is sleeved on the surface of the sleeve, and the upper surface of the sealing ring is in the same plane as the upper surface of the metal flange; Meanwhile, the casing is obtained by purchasing or self-making. If the self-making method is adopted and the casing material is glass blank, the specific operation is as follows: According to the aperture size on the housings of different electronic components, the granulated glass powder containing adhesive that is hermetically sealed and matched is pressed into the shape required for the product by a machine tool, which is called the glass bead blank. There is a through hole in the center that can pass through the pins. It is placed in a stainless steel tray and enters the dewaxing furnace one by one through a conveyor belt. The adhesive in the glass powder is removed by degumming in the temperature range of 300°-680°, and after being cured after the adhesive is completely removed, it is called a glass bead; Before using the metal flange and metal pins, they need to be aligned for cleaning operations. At the same time, according to the different product sealing requirements, it is judged whether to perform pre-oxidation operations on the housing and pins; S2. Then, the insulator blank is sent into a sintering furnace and sintered using a sintering mold, so that the metal pins, metal flange, and casing form a single insulator part. Among them, the sintering temperature is 960°C - 980°C, and the processing time is 15 - 20 minutes. The specific parameters are determined according to the size of the insulator. Among them, the sintering mold is made of graphite, with several counterbores and through holes. The through holes are located at the center of the counterbores. The counterbores are for positioning the metal flange, and the through holes are for pin positioning, so as to prevent pin offset; S3. Electroplate the pins of the insulator part according to the plating requirements; S4. Install and fix the corresponding insulator parts onto the corresponding electronic components through laser encapsulation. During the operation, place the metal housing of the electronic component on the corresponding fixture, and then install the insulator parts corresponding to the housing into multiple holes on the housing, and fix and install them through the laser welding encapsulation form. The laser power and time are set according to different product conditions.
[0018] In summary, for the production process of the insulator for installing the wire of this electronic component, during processing, the metal component part does not enter the sintering furnace, avoiding the risks of sintering deformation and high-temperature deformation, and improving the product qualification rate. At the same time, the metal pins and glass blank form a modular insulator installation module through pre-sintering, eliminating the need for additional customized positioning molds. From insulator sintering to product installation and laser welding encapsulation, the time can be shortened to 1 week, compared with 15 - 20 days in the prior art, greatly improving the work efficiency and reducing the time cost; At the same time, this product has strong applicability. For the housings of similar integrated circuit electronic components, the diameters of most pins and the heights of inner pins are basically similar. According to different diameters, several types of module insulator part finished products with general specifications are set, which can be stocked in large quantities, greatly reducing the manufacturing cost of the molds.
[0019] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.
[0020] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A production process for mounting insulators for electronic components, characterized in that: The specific operations are as follows: S1. Assemble the bushing onto the metal pin and constrain it through the metal flange to assemble it into an insulator blank; S2, then the insulator blank is sent into a sintering furnace, and a sintering operation is performed using a sintering mold, so that the metal pin, the metal flange, and the sleeve form a separate insulator part; S3. Electroplating the pins of the insulator parts according to the plating requirements; S4. Install and fix the corresponding insulator parts onto the corresponding electronic components, and fix them by laser packaging. During operation, place the metal shell of the electronic components on the corresponding fixture, and then install the insulator parts corresponding to the shell in multiple holes on the shell, and fix them by laser welding packaging. Laser welding sets the laser power and time according to different product conditions.
2. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: In step S1 , the material of the metal flange is stainless steel.
3. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: In step S1 , the sleeve is one of a glass embryo or a ceramic bead.
4. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: In step S2, the sintering temperature is 960°C-980°C, and the processing time is 15-20 minutes. The specific parameters are determined according to the size of the insulator.
5. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: The metal flange is in the shape of a cylinder or a combination of two cylinders of different radii stacked together, and the front view of the combination is a "convex" shape.
6. The production process of an electronic component wire mounting insulator according to claim 3, characterized in that: The sleeve used in step S1 is obtained by purchasing or making it yourself. If it is made by yourself and the sleeve material is glass embryo, the specific operation is as follows: According to the different aperture sizes on the shells of electronic components, the granulated glass powder containing adhesive that matches the sealing is pressed into the required shape of the product by a machine tool. It is called a glass bead blank with a through hole in the center for the pin to pass through. It is placed in a stainless steel plate and enters the wax removal furnace one by one through a conveyor belt. The adhesive in the glass powder is removed and solidified within the temperature range of 300°-680°. After solidification, it is called a glass bead.
7. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: The metal flange and the metal pin need to be aligned and cleaned before use. At the same time, it is determined whether to perform pre-oxidation on the shell and the pin according to different product sealing requirements.
8. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: In step S2, the sintering mold is made of graphite and has a plurality of countersunk holes and through holes. The through holes are located at the center of the countersunk holes. The countersunk holes are used to position the metal flanges, and the through holes are used to position the pins, thereby preventing the pins from being offset.
9. The production process of an electronic component wire mounting insulator according to claim 1, characterized in that: The metal flange is provided with a positioning groove, a sealing ring is provided in the positioning groove, the sealing ring is sleeved on the surface of the sleeve, and the upper surface of the sealing ring and the upper surface of the metal flange are located in the same plane.