GaN power device with thermal management protection and phase change cooling
By installing special heat dissipation components on both the upper and lower ends of the GaN power device, the problem of thermal management challenges of GaN power devices in high-power applications is solved, efficient heat dissipation is achieved, and the long-term and stable operation of the device is ensured.
Patent Information
- Application Number
- CN202510283856.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2025-06-10
AI Technical Summary
GaN power devices face significant thermal management challenges in high power applications, resulting in increased device temperatures that affect performance and may cause permanent damage.
By installing the first heat dissipation assembly and the second heat dissipation assembly on both upper and lower ends of the GaN power device, heat is transferred to the outside world, and the heat dissipation efficiency is improved. The first heat dissipation assembly includes a contact plate, a first fan, a first heat sink and a support plate, and the second heat dissipation assembly includes a phase change heat storage block, a second heat conduction tube, a sealing ring, a second heat sink and a second fan.
Effectively bring the heat generated by electronic power devices to the outside world, improve heat dissipation efficiency, and ensure the long-term and stable operation of GaN power devices.
Smart Images
Figure CN120127072A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of power devices, and particularly to a GaN power device with thermal management protection and phase change cooling. Background Art
[0002] Gallium nitride is a wide-bandgap semiconductor material that has been widely used in high-frequency and high-power electronic devices due to its excellent electrical properties. Compared with traditional silicon-based materials, GaN has higher electron mobility, larger breakdown voltage, and lower on-resistance, which enables GaN devices to operate at higher frequencies and generate less heat under the same power output conditions. Although GaN devices are superior to traditional silicon devices in terms of efficiency and performance, they still face significant thermal management challenges in high-power applications. Since heat is inevitably generated during the power conversion process, if heat cannot be dissipated effectively, it may cause the device temperature to rise, which in turn affects its performance and even causes permanent damage. Therefore, an efficient thermal management system is crucial to ensure the long-term stable operation of GaN devices.
[0003] GaN power devices are usually installed in a closed environment, which makes it difficult for heat to transfer to the external heat dissipation structure. Even with the use of highly efficient thermal conductive materials such as copper or aluminum, there may still be a relatively high thermal resistance, resulting in low heat dissipation efficiency. Summary of the Invention
[0004] The purpose of the present invention is to provide a GaN power device with thermal management protection and phase change cooling. By installing a first heat dissipation component and a second heat dissipation component for heat dissipation at the upper and lower ends of the electronic power device, heat is transferred to the outside world, improving the heat dissipation efficiency.
[0005] The above technical purpose of the present invention is achieved through the following technical solutions:
[0006] A GaN power device with thermal management protection and phase change cooling includes a base. An installation cavity is provided at the upper end of the base. A heat dissipation groove is opened at the bottom of the installation cavity. A circuit board is provided at the open end of the installation cavity. A first heat dissipation component for cooperating with the circuit board is provided in the heat dissipation groove. A heat conducting sheet is provided at the upper end of the circuit board. The heat conducting sheet cooperates with the heat dissipation component. An electronic power device is provided on the heat conducting sheet. The electronic power device is electrically connected to the circuit board through the heat conducting sheet. A support frame is provided at the upper end of the circuit board. A second heat dissipation component is provided on the support frame. The second heat dissipation component cooperates with the electronic power device. A protective cover for cooperating with the base is provided above the support frame.
[0007] By adopting the above technical solution, the first heat dissipation component is used to dissipate heat from the lower end of the electronic power device. Arranging the heat conducting sheet at the lower end of the electronic power device is conducive to transferring the heat between the electronic power device and the circuit board. And the second heat dissipation component is used to dissipate heat from the upper end of the electronic power device, improving the heat dissipation efficiency.
[0008] The further setting of the present invention is that: the heat conducting sheet is provided with contacts for connecting the electronic power device and the circuit board. The circuit board is provided with a plurality of through holes, and each through hole is communicated with a first heat conducting pipe. One end of the first heat conducting pipe is connected to the heat conducting sheet, and the other end of the first heat conducting pipe is connected to the first heat dissipation component.
[0009] By adopting the above technical solution, the heat conducting sheet electrically connects the electronic power device and the circuit board through the contacts to ensure the normal operation of the electronic power device, and the first heat conducting pipe can transfer the heat from the heat conducting sheet to the first heat dissipation component.
[0010] The further setting of the present invention is that: the bottom of the heat dissipation groove penetrates through the base. The first heat dissipation component includes a contact plate, a first fan, a first heat sink and a support plate. The contact plate is arranged at the upper opening end of the heat dissipation groove. The upper end of the contact plate is in contact with the circuit board. The first heat conducting pipe is connected to the contact plate. A plurality of first heat sinks are arranged at equal intervals from front to back at the lower end of the contact plate. A first air duct is arranged between the first heat sinks. The support plate is arranged at the lower end of the first heat sink. The support plate is arranged at the lower opening end of the heat dissipation groove. An air inlet communicating with the first air duct is arranged in the middle of the support plate. The first fan is installed in the air inlet. Air outlets communicating with the first air duct are arranged on the left and right sides of the support plate.
[0011] By adopting the above technical solution, the contact plate further absorbs the heat on the circuit board. The first heat dissipation component allows air to flow into the first air duct through the first fan and then flow to the left and right sides to take away the heat on the first heat sink.
[0012] The further setting of the present invention is that: the support frame includes a fixing plate, a support pipe and a connecting sleeve. The fixing plate is arranged above the circuit board. The lower end of the fixing plate is connected to the circuit board and the base through the support pipe. The upper end of the support pipe communicates with the fixing plate. A material discharging port is arranged on the circumferential side of the support pipe. The connecting sleeve is arranged at the lower end of the fixing plate. The upper end of the connecting sleeve is connected to the fixing plate and corresponds to the position of the electronic power device.
[0013] By adopting the above technical solution, the support frame can support the second heat dissipation component, facilitating installation.
[0014] A further setting of the present invention is that: a placement hole corresponding to the connection sleeve is formed on the protective cover. The second heat dissipation component includes a phase change heat storage block, a second heat conduction tube, a sealing ring, second heat dissipation fins and a second fan. The phase change heat storage block is installed in the connection sleeve. One end of the phase change heat storage block is attached to the upper surface of the electronic power device. The lower end of the second heat conduction tube is inserted into the phase change heat storage block. The other end of the second heat conduction tube passes through the fixing plate and extends into the placement hole. There are multiple second heat dissipation fins vertically arranged in the placement hole. The second heat dissipation fins are equally spaced left and right. The second heat dissipation fins and the placement hole form a U-shaped second air duct. The second fan is installed at one end of the second air duct. The sealing ring is arranged at the upper end of the fixing plate and corresponds to the placement hole.
[0015] By adopting the above technical solution, the phase change heat storage block is attached to the electronic power device to absorb the heat generated by the electronic power device. Then the heat is transferred to the second heat conduction tube, and the heat is transferred to the outside through the second heat conduction tube, and the heat in the second air duct is taken away by the second fan for heat dissipation.
[0016] A further setting of the present invention is that: the second heat conduction tube is a copper tube, and the second heat conduction tube is approximately in an "O" shape.
[0017] By adopting the above technical solution, the heat dissipation efficiency is improved.
[0018] A further setting of the present invention is that: the connection sleeve is made of a heat-insulating material.
[0019] By adopting the above technical solution, the heat remaining in the closed cavity is reduced.
[0020] To sum up, the present invention has the following beneficial effects:
[0021] First, the first heat dissipation component and the second heat dissipation component in the present invention bring the heat generated by the electronic power device to the outside, improving the heat dissipation efficiency.
[0022] Second, through the heat conduction sheet installed between the electronic power device and the circuit board, the heat between the electronic power device and the circuit board is transmitted to the contact board through the heat conduction sheet and the first heat conduction tube, and the heat is brought to the outside by the first fan and the first heat dissipation fins, ensuring the heat dissipation efficiency.
[0023] Third, the second heat dissipation component in the present invention absorbs the heat generated when the electronic power device works through the phase change heat storage block, and then brings the heat to the outside through the second heat conduction tube, the second heat dissipation fins and the second fan, ensuring the heat dissipation efficiency. Description of the Drawings
[0024] Figure 1It is the overall sectional view in the present invention;
[0025] Figure 2 It is the present invention Figure 1 The enlarged view of part A in the invention;
[0026] Figure 3 It is the structural schematic diagram of the heat conducting fin in the present invention;
[0027] Figure 4 It is the bottom view of the base in the present invention;
[0028] Figure 5 It is the structural schematic diagram of the placement hole in the present invention.
[0029] In the figure: 1. Base; 11. Installation cavity; 12. Heat dissipation groove; 2. Circuit board; 21. Through hole; 22. First heat conducting tube; 3. First heat dissipation component; 31. Contact plate; 32. First fan; 33. First heat sink; 34. Support plate; 35. First air duct; 36. Air inlet; 37. Air outlet; 4. Heat conducting fin; 41. Contact point; 5. Electronic power device; 6. Support frame; 61. Fixed plate; 62. Support tube; 63. Connecting sleeve; 64. Feeding port; 7. Second heat dissipation component; 71. Phase change heat storage block; 72. Second heat conducting tube; 73. Sealing ring; 74. Second heat sink; 75. Second blower; 76. Second air duct; 8. Protective cover; 81. Placement hole. Specific embodiments
[0030] The present invention will be further described in detail below with reference to the accompanying drawings.
[0031] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.
[0032] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0033] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and defined, the terms "arranged", "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0034] Embodiment, a GaN power device with thermal management protection and phase change cooling, as Figures 1 to 5 shown, includes a base 1. An installation cavity 11 is provided at the upper end of the base 1. A heat dissipation groove 12 is opened at the bottom of the installation cavity 11. A circuit board 2 is provided at the open end of the installation cavity 11. A first heat dissipation component 3 for cooperating with the circuit board 2 is provided in the heat dissipation groove 12. A heat conducting sheet 4 is provided at the upper end of the circuit board 2. The heat conducting sheet 4 cooperates with the heat dissipation component. An electronic power device 5 is provided on the heat conducting sheet 4. The electronic power device 5 is electrically connected to the circuit board 2 through the heat conducting sheet 4. A support frame 6 is provided at the upper end of the circuit board 2. A second heat dissipation component 7 is provided on the support frame 6. The second heat dissipation component 7 cooperates with the electronic power device 5. A protective cover 8 for cooperating with the base 1 is provided above the support frame 6. The first heat dissipation component 3 transfers the heat between the circuit board 2 and the electronic power device 5 to the outside, while the second heat dissipation component 7 transfers the heat on the electronic power device 5 to the outside. Heat dissipation is carried out from the upper and lower directions to improve the heat dissipation efficiency.
[0035] A contact 41 for connecting the electronic power device 5 and the circuit board 2 is provided on the heat conducting sheet 4. It is convenient to electrically connect the electronic power device 5 and the circuit board 2 through the contact 41. Of course, the three can be welded together or pressed together. A plurality of through holes 21 are opened on the circuit board 2. A first heat conducting tube 22 is connected to each through hole 21. One end of the first heat conducting tube 22 is connected to the heat conducting sheet 4, and the other end of the first heat conducting tube 22 is connected to the first heat dissipation component 3. The first heat conducting tube 22 transfers the heat on the heat conducting sheet 4 to the first heat dissipation component 3, and then transfers the heat to the outside through the first heat dissipation component 3. Of course, the design of the through holes 21 cannot affect the operation of the electrical connection board. The first heat conducting tube 22 can select materials that conduct heat but not electricity, such as alumina, aluminum nitride and other materials, or materials that conduct heat and electricity, but insulation protection is required.
[0036] The bottom of the heat dissipation groove 12 penetrates through the base 1. The first heat dissipation component 3 includes a contact plate 31, a first fan 32, a first heat sink 33, and a support plate 34. The contact plate 31 is arranged at the upper opening end of the heat dissipation groove 12. The upper end of the contact plate 31 is in contact with the circuit board 2. The first heat conduction tube 22 is connected to the contact plate 31. A plurality of first heat sinks 33 are arranged at equal intervals from front to back at the lower end of the contact plate 31. A first air duct 35 is provided between the first heat sinks 33. The support plate 34 is arranged at the lower end of the first heat sink 33. The support plate 34 is arranged at the lower opening end of the heat dissipation groove 12. An air inlet 36 communicating with the first air duct 35 is formed in the middle of the support plate 34. The first fan 32 is installed in the air inlet 36. Air outlets 37 communicating with the first air duct 35 are formed on the left and right sides of the support plate 34. The contact plate 31 can, firstly, receive the heat of the first heat conduction tube 22, and secondly, be in contact with the contact plate 31 to absorb the heat on the electrical connection plate, and transfer the heat to the outside through the first fan 32 and the first heat sink 33.
[0037] Among them, the support frame 6 includes a fixing plate 61, a support tube 62, and a connecting sleeve 63. The fixing plate 61 is arranged above the circuit board 2. The lower end of the fixing plate 61 is connected to the circuit board 2 and the base 1 through the support tube 62. The upper end of the support tube 62 communicates with the fixing plate 61. A material discharging port 64 is formed on the peripheral side of the support tube 62. The connecting sleeve 63 is arranged at the lower end of the fixing plate 61. The upper end of the connecting sleeve 63 is connected to the fixing plate 61, and the electronic power device 5 corresponds to the position of the electronic power device 5. The support frame 6 facilitates the installation of the second heat dissipation component 7, and the connecting sleeve 63 facilitates the subsequent installation of the phase change heat storage block 71. The connecting sleeve 63 is made of a heat insulating material to avoid heat transfer to the sealed cavity.
[0038] A placing hole 81 corresponding to the connecting sleeve 63 is formed on the protective cover 8. The second heat dissipation component 7 includes a phase change heat storage block 71, a second heat conduction tube 72, a sealing ring 73, a second heat sink 74, and a second fan 75. The phase change heat storage block 71 is installed in the connecting sleeve 63. One end of the phase change heat storage block 71 is attached to the upper surface of the electronic power device 5. The lower end of the second heat conduction tube 72 is inserted into the phase change heat storage block 71. The other end of the second heat conduction tube 72 passes through the fixing plate 61 and extends into the placing hole 81. A plurality of second heat sinks 74 are arranged vertically in the placing hole 81. The second heat sinks 74 are arranged at equal intervals left and right. The second heat sinks 74 and the placing hole 81 form a U-shaped second air duct 76. The second fan 75 is installed at one end of the second air duct 76. The sealing ring 73 is arranged at the upper end of the fixing plate 61 and corresponds to the placing hole 81. The phase change heat storage block 71 is attached to the upper end of the electronic power device 5. The phase change heat storage block 71 absorbs heat and undergoes a phase change, and then transfers the heat to the outside through the second heat conduction tube 72, the second heat sink 74, and the second fan 75. The second heat conduction tube 72 is a copper tube, and the second heat conduction tube 72 is approximately in an "O" shape, which can improve the heat dissipation efficiency.
[0039] This specific embodiment is only an interpretation of the present invention and does not limit the present invention. After reading this specification, those skilled in the art can make modifications to this embodiment that do not contribute creatively as needed, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.
Claims
1. A GaN power device with thermal management protection and phase change cooling, comprising a base (1), characterized in that: The upper end of the base (1) is provided with a mounting cavity (11), the bottom of the mounting cavity (11) is provided with a heat dissipation groove (12), the open end of the mounting cavity (11) is provided with a circuit board (2), the heat dissipation groove (12) is provided with a first heat dissipation component (3) used in conjunction with the circuit board (2), the upper end of the circuit board (2) is provided with a heat conductive sheet (4), the heat conductive sheet (4) is used in conjunction with the heat dissipation component, an electronic power device (5) is provided on the heat conductive sheet (4), the electronic power device (5) is electrically connected to the circuit board (2) through the heat conductive sheet (4), the upper end of the circuit board (2) is provided with a support frame (6), the support frame (6) is provided with a second heat dissipation component (7), the second heat dissipation component (7) is used in conjunction with the electronic power device (5), and a protective cover (8) used in conjunction with the base (1) is provided above the support frame (6).
2. A GaN power device with thermal management protection and phase change cooling according to claim 1, characterized in that: The heat conducting sheet (4) is provided with a contact (41) for connecting the electronic power device (5) and the circuit board (2); the circuit board (2) is provided with a plurality of through holes (21); each through hole (21) is connected to a first heat conducting pipe (22); one end of the first heat conducting pipe (22) is connected to the heat conducting sheet (4); and the other end of the first heat conducting pipe (22) is connected to the first heat dissipation component (3).
3. A GaN power device with thermal management protection and phase change cooling according to claim 2, characterized in that: The bottom of the heat dissipation slot (12) passes through the base (1); the first heat dissipation assembly (3) comprises a contact plate (31), a first fan (32), a first heat sink (33) and a support plate (34); the contact plate (31) is arranged at the upper open end of the heat dissipation slot (12); the upper end of the contact plate (31) contacts the circuit board (2); the first heat conducting pipe (22) is connected to the contact plate (31); a plurality of first heat sinks (33) are provided and are arranged on the contact plate (31) at equal intervals from front to back. The first heat sink (33) is provided at the lower end of the first heat sink (33), a first air duct (35) is provided between the first heat sink (33), the support plate (34) is provided at the lower end of the first heat sink (33), the support plate (34) is provided at the lower open end of the heat dissipation slot (12), an air inlet (36) connected to the first air duct (35) is provided in the middle of the support plate (34), the first fan (32) is installed in the air inlet (36), and air outlets (37) connected to the first air duct (35) are provided on the left and right sides of the support plate (34).
4. A GaN power device with thermal management protection and phase change cooling according to claim 3, characterized in that: The support frame (6) comprises a fixing plate (61), a supporting tube (62) and a connecting sleeve (63); the fixing plate (61) is arranged above the circuit board (2); the lower end of the fixing plate (61) is connected to the circuit board (2) and the base (1) through the supporting tube (62); the upper end of the supporting tube (62) is connected to the fixing plate (61); a discharge port (64) is provided on the peripheral side of the supporting tube (62); the connecting sleeve (63) is arranged at the lower end of the fixing plate (61); the upper end of the connecting sleeve (63) is connected to the fixing plate (61); the electronic power device (5) corresponds to the position of the electronic power device (5).
5. A GaN power device with thermal management protection and phase change cooling according to claim 4, characterized in that: The protective cover (8) is provided with a placement hole (81) corresponding to the connecting sleeve (63); the second heat dissipation assembly (7) comprises a phase change heat storage block (71), a second heat conducting pipe (72), a sealing ring (73), a second heat sink (74) and a second fan (75); the phase change heat storage block (71) is installed in the connecting sleeve (63); one end of the phase change heat storage block (71) is attached to the upper surface of the electronic power device (5); the lower end of the second heat conducting pipe (72) is inserted into the phase change heat storage block (71); the other end of the second heat conducting pipe (72) passes through the fixed sleeve (63); The fixed plate (61) extends into the placement hole (81); a plurality of second heat sinks (74) are provided and vertically arranged in the placement hole (81); the second heat sinks (74) are arranged at equal intervals on the left and right; the second heat sinks (74) and the placement hole (81) form a U-shaped second air duct (76); the second fan (75) is installed at one end of the second air duct (76); the sealing ring (73) is arranged at the upper end of the fixed plate (61); the sealing ring (73) is arranged at the upper end of the fixed plate (61); and the sealing ring (73) corresponds to the placement hole (81).
6. A GaN power device with thermal management protection and phase change cooling according to claim 5, characterized in that: The second heat conducting pipe (72) is a copper pipe, which drives the second heat conducting pipe (72) to be approximately in an "O" shape.
7. A GaN power device with thermal management protection and phase change cooling according to claim 6, characterized in that: The connecting sleeve (63) is made of heat insulating material.