High-power active array plane light and thin integrated architecture

Abstract

The invention relates to the technical field of active phased-array antennas, and particularly discloses a high-power active array plane light and thin integrated architecture, which comprises a radiation unit, a top bearing structural member, an amplification module, a middle bearing structural member, an amplitude-phase control / frequency conversion module and a bottom bearing structural member which are sequentially arranged from top to bottom, the middle bearing structural member is provided with a first heat dissipation liquid cooling flow channel for heat dissipation of the amplification module. The bottom bearing structural member is provided with a bottom heat dissipation liquid cooling flow channel for heat dissipation of the amplitude-phase control / frequency conversion module. According to the invention, because the amplification module and the radiation unit are tightly connected in structure, the loss path is small, the loss is low, the transmitting efficiency is high, the receiving noise is low, the amplification device has the shortest direct heat dissipation path, liquid cooling liquid exchange is realized through connection of a bottom heat dissipation liquid cooling flow channel, and the heat dissipation efficiency is improved. And a good heat dissipation effect is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of active phased array antennas, and more specifically, to a high-power active array surface thin and light integrated architecture. Background Art

[0002] Active phased array antennas, with their characteristics such as beam scanning without inertia and rapid change, excellent radio frequency performance, and good channel redundancy, have been widely used in military fields such as radar, electronic warfare, communication, reconnaissance, and early warning.

[0003] An active phased array antenna usually includes N radiating elements, N amplification modules, N amplitude-phase control modules, N frequency conversion modules, a signal processing module, a power supply module, and supporting carrier and heat dissipation structures, etc. Among them, the radiating element is a passive circuit, which functions to convert circuit energy into free space wave energy and radiate it outward; the amplification module is a high-power active circuit, which functions to amplify weak electrical signals and suppress noise, etc., and is the part with the highest heat in the active phased array antenna; the amplitude-phase control module is a low-power active circuit, which functions to control the amplitude and phase of the electrical signals of the N radiating elements; the frequency conversion module is a low-power active circuit, which functions to convert high-frequency signals and digital signals with each other; the signal processing module is a medium-power active circuit, which functions to process signals; the power supply module and supporting carrier and heat dissipation structures provide functions such as power energy, protection support, and heat dissipation for the entire active phased array antenna.

[0004] Since the radiating element, amplification module, amplitude-phase control module, and frequency conversion module all belong to high-frequency circuits, are closely related and usually one-to-one correspondence, that is, one radiating element corresponds to one path of amplification, amplitude-phase control, and frequency conversion modules, therefore, they are usually collectively referred to as the active array surface.

[0005] Currently, active array surface technology is developing towards the directions of broadband, high-power, multi-functional, thin and light integration, etc. The power level of a single-channel amplification module is increasing from the milliwatt level to the watt level or even the tens of watt level, and at the same time, the integration method is developing from the traditional large-size modular integration method to the small-size thin and light integration method. The two together lead to a sharp increase in the heat density of the active array surface. Therefore, it is urgent to solve the heat dissipation problem of high-power active array surface thin and light integration. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a high-power active array surface thin and light integrated architecture;

[0007] The solution adopted by the present invention to solve the technical problem is:

[0008] A high-power active phased array thin and light integrated architecture, comprising a radiation unit, a top bearing structure member, an amplification module, a middle bearing structure member, a phase-amplitude control / frequency conversion module, and a bottom bearing structure member arranged in sequence from top to bottom;

[0009] A first liquid-cooling flow channel for dissipating heat from the amplification module is arranged on the middle bearing structure member; a bottom liquid-cooling flow channel for dissipating heat from the phase-amplitude control / frequency conversion module is arranged on the bottom bearing structure member.

[0010] In some possible implementation manners, the middle bearing structure member includes a middle bearing metal member provided with the first liquid-cooling flow channel, and middle high-low frequency connectors mounted on the middle bearing metal member and respectively connected to the amplification module and the phase-amplitude control / frequency conversion module.

[0011] In some possible implementation manners, the middle bearing structure member further includes a liquid-cooling joint arranged at the bottom of the middle bearing metal member and communicated with the first liquid-cooling flow channel; the bottom liquid-cooling flow channel is communicated with the first liquid-cooling flow channel through the liquid-cooling joint.

[0012] In some possible implementation manners, the liquid-cooling joint and the middle bearing metal member cooperate to form an installation cavity for installing the phase-amplitude control / frequency conversion module.

[0013] In some possible implementation manners, the amplification module includes a grid-shaped transfer printed circuit board having multiple groups of grids, and amplification devices arranged in the grids; the amplification devices are mounted on the middle bearing structure member; the amplification devices are multiple groups and are arranged horizontally.

[0014] In some possible implementation manners, the amplification module further includes interconnecting gold wires for connecting the grid-shaped transfer printed circuit board and the amplification devices.

[0015] In some possible implementation manners, the phase-amplitude control / frequency conversion module includes a transfer printed circuit board arranged in the installation cavity, multiple groups of phase-amplitude control / frequency conversion devices mounted on one side of the transfer printed circuit board close to the bottom bearing structure member, and bottom high-low frequency connectors mounted on one side of the transfer printed circuit board close to the bottom bearing structure member; the multiple groups of bottom high-low frequency connectors are arranged horizontally.

[0016] In some possible implementation manners, the phase-amplitude control / frequency conversion module further includes an elastic heat dissipation material mounted on one side of the phase-amplitude control / frequency conversion device away from the transfer printed circuit board.

[0017] In some possible implementation manners, the top bearing structure member includes a top bearing metal member, and top high-frequency connectors arranged on the top bearing metal member and respectively connected to the radiation unit and the amplification module.

[0018] In some possible embodiments, the bottom heat dissipation liquid cooling channel is connected to a liquid cooling source.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] In the present invention, since the amplification module and the radiation unit are tightly connected in structure, the loss path is small and the loss is low. The present invention has the beneficial effects of high emission efficiency and low received noise;

[0021] In the present invention, a first heat dissipation liquid cooling channel is arranged on the middle bearing metal part, so that the amplification device has the shortest direct heat dissipation path, and the liquid cooling liquid exchange is realized through the connection of the bottom heat dissipation liquid cooling channel; the amplitude-phase control / frequency conversion device is installed on the surface of the adapter printed board and exchanges heat with the bottom bearing structure part through the elastic heat dissipation material located on its non-installed surface, so as to have a good heat dissipation effect;

[0022] In the present invention, the devices in the amplification module and the amplitude-phase control / frequency conversion module are arranged in a thin and light tile-like integrated manner, that is, horizontally arranged along a two-dimensional plane. At the same time, other modules are longitudinally stacked to complete electrical signal interconnection and heat dissipation, having the beneficial effects of thin and light integration and high integration degree. Description of the Drawings

[0023] Figure 1 is a sectional exploded view of the present invention;

[0024] Figure 2 is a top view of the amplification module of the present invention;

[0025] Wherein:

[0026] 1. Radiation unit;

[0027] 2. Top bearing structure part; 201. Top bearing metal part; 202. Top high-frequency connector;

[0028] 3. Amplification module; 301. Grid-like adapter printed board; 302. Amplification device; 303. Interconnecting gold wires;

[0029] 4. Middle bearing structure part; 401. Middle bearing metal part; 402. Middle high and low-frequency connector; 403. Liquid cooling joint; 404. First heat dissipation liquid cooling channel;

[0030] 5. Amplitude-phase control / frequency conversion module; 501. Adapter printed board; 502. Amplitude-phase control / frequency converter; 503. Elastic heat dissipation material; 504. Bottom high and low-frequency connector;

[0031] 6. Bottom bearing structure part; 601. Bottom bearing metal part; 602. Bottom heat dissipation liquid cooling channel. Detailed Embodiments

[0032] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two components or the interaction relationship between two components. The "first", "second" and similar terms mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, terms such as "one" or "a" do not indicate a quantity limit, but indicate that there is at least one. In the implementation of this application, "and / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In the description of the embodiments of this application, unless otherwise stated, the meaning of "a plurality" refers to two or more. For example, a plurality of positioning posts means two or more positioning posts. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] The present invention will be described in detail below.

[0034] As Figure 1 、 Figure 2 shown:

[0035] A high-power active phased array thin and light integrated architecture includes a radiation unit 1, a top bearing structure member 2, an amplification module 3, a middle bearing structure member 4, a phase amplitude control / frequency conversion module 5, and a bottom bearing structure member 6 arranged in sequence from top to bottom; the radiation unit 1, the top bearing structure member 2, the amplification module 3, the middle bearing structure member 4, the phase amplitude control / frequency conversion module 5, and the bottom bearing structure member 6 are connected by means such as welding and screwing;

[0036] A first heat dissipation liquid cooling channel 404 for dissipating heat from the amplification module 3 is arranged on the middle bearing structure member 4; a bottom heat dissipation liquid cooling channel 602 for dissipating heat from the phase amplitude control / frequency conversion module 5 is arranged on the bottom bearing structure member; the first heat dissipation liquid cooling channel 404 is connected to the bottom heat dissipation liquid cooling channel 602, and the liquid cooling liquid exchange of the first heat dissipation liquid cooling channel 404 can be realized through the bottom heat dissipation liquid cooling channel 602; the bottom heat dissipation liquid cooling channel 602 is connected to a liquid cooling source;

[0037] Specifically, the middle bearing structure member 4 is arranged below the amplification module 3. Due to the arrangement of the first heat dissipation liquid cooling channel 404, the middle bearing structure member 4 has good heat dissipation performance, can directly dissipate heat from the amplification module 3, has a short heat dissipation path, high heat dissipation efficiency and good performance;

[0038] In the present invention, the amplification module 3 is connected to the radiation unit 1 through the top bearing structure member 2, with a smaller loss path and lower loss, and has the beneficial effects of high emission efficiency and low receiving noise.

[0039] In some possible implementation manners, in order to effectively connect the amplification module 3 and the amplitude-phase control / frequency conversion module 5 through the middle bearing structure member 4, and at the same time be able to effectively dissipate heat from the amplification module 3; the middle bearing structure member 4 includes a middle bearing metal member 401 provided with a first liquid cooling flow channel 404 for heat dissipation, and middle high-low frequency connectors 402 mounted on the middle bearing metal member 401 and respectively connected to the amplification module 3 and the amplitude-phase control / frequency conversion module 5; the middle high-low frequency connectors 402 play a role in high-frequency interconnection between the amplification module 3 and the amplitude-phase control / frequency conversion module 5.

[0040] Furthermore, the middle high-low frequency connectors 402 penetrate through the middle bearing metal member 401 and are connected to the amplification module 3 at one end and to the amplitude-phase control / frequency conversion module 5 at the other end.

[0041] In some possible implementation manners, in order to effectively connect the first liquid cooling flow channel 404 with the bottom liquid cooling flow channel 602; the middle bearing structure member 4 further includes a liquid cooling joint 403 provided at the bottom of the middle bearing metal member 401 and communicating with the first liquid cooling flow channel 404; the bottom liquid cooling flow channel 602 is connected to the first liquid cooling flow channel 404 through the liquid cooling joint 403.

[0042] In some possible implementation manners, in order to make the integration degree of the present invention higher; the liquid cooling joint 403 and the middle bearing metal member 401 cooperate to form an installation cavity for installing the amplitude-phase control / frequency conversion module 5; the liquid cooling joint 403 is located outside the amplitude-phase control / frequency conversion module 5.

[0043] In some possible implementation manners, the amplification module 3 includes a grid-shaped transfer printed circuit board 301 having multiple groups of grids, and amplification devices 302 provided in the grids; the amplification devices 302 are mounted on the middle bearing structure member 4; there are multiple groups of the amplification devices 302 and they are arranged horizontally.

[0044] Specifically, the grid-shaped transfer printed circuit board 301 is connected to the amplitude-phase control / frequency conversion module 5 through the middle high-low frequency connectors 402.

[0045] The amplification module 3 further includes interconnection gold wires 303 for connecting the grid-shaped transfer printed circuit board 301 and the amplification devices 302; high-low frequency interconnection between the amplification devices 302 and the grid-shaped transfer printed circuit board 301 is achieved through the interconnection gold wires 303.

[0046] In some possible embodiments, the amplitude-phase control / frequency conversion module 5 includes an adapter printed circuit board 501 disposed in the installation cavity, multiple groups of amplitude-phase control / frequency conversion devices 502 mounted on one side of the adapter printed circuit board 501 close to the bottom bearing structure member 6, and a bottom high-low frequency connector 504 mounted on one side of the adapter printed circuit board 501 close to the bottom bearing structure member; multiple groups of the bottom high-low frequency connectors 504 are arranged horizontally; the bottom high-low frequency connector 504 serves to interconnect the high and low frequencies between the adapter printed circuit board 501 and the external system.

[0047] In some possible embodiments, the amplitude-phase control / frequency conversion module 5 further includes an elastic heat dissipation material 503 mounted on the side of the amplitude-phase control / frequency conversion device 502 away from the adapter printed circuit board 501;

[0048] The amplitude-phase control / frequency conversion device 502 with less heat generated during use is mounted on the surface of the adapter printed circuit board 501 and exchanges heat with the bottom bearing structure member 6 through the elastic heat dissipation material 503 located on its non-mounting surface.

[0049] The bottom bearing structure member 6 includes a bottom bearing metal member 601, and a bottom heat dissipation liquid cooling channel 602 is located inside the bottom bearing metal member 601 and is connected to the liquid cooling joint 403.

[0050] In some possible embodiments, the top bearing structure member 2 includes a top bearing metal member 201, and top high-frequency connectors 202 disposed on the top bearing metal member 201 and respectively connected to the radiation unit 1 and the amplification module 3. The top high-frequency connectors 202 serve to interconnect the high frequencies between the radiation unit 1 and the grid-shaped adapter printed circuit board 301.

[0051] In the present invention, the function of the adapter printed circuit board 501 is to integrate and distribute the signals from the external system or the amplification module 3 to the amplitude-phase control / frequency conversion devices 502 according to the transmission or reception state, and after being processed by the amplitude-phase control / frequency conversion devices 502, transfer them to the middle high-low frequency connector 402 or the bottom high-low frequency connector 504;

[0052] The function of the grid-shaped adapter printed circuit board 301 is to integrate and distribute the high and low frequency signals from the amplitude-phase control / frequency conversion module 5 or the radiation unit 1 entering the amplification module 3 to the amplification devices 302 according to the transmission or reception state, and after being processed by the amplification devices 302, transfer them to the top high-frequency connector 202 or the middle high-low frequency connector 402.

[0053] In the present invention, the installation methods of the high and low frequency connectors (top high-frequency connector 202, middle high-low frequency connector 402, bottom high-low frequency connector 504) can be welding, screwing, pressing or other possible methods, and the interconnection with each functional module can be elastic contact or welding.

[0054] The present invention is not limited to the foregoing specific embodiments. The present invention extends to any new feature or any new combination disclosed in this specification, as well as to any new combination of steps of any new method or process disclosed.

Claims

1. A high-power active array thin and light integrated architecture, characterized in that: It includes a radiation unit, a top bearing structure, an amplification module, a middle bearing structure, an amplitude and phase control / frequency conversion module, and a bottom bearing structure which are arranged in sequence from top to bottom; The middle bearing structure is provided with a heat dissipation liquid cooling channel 1 for dissipating heat from the amplification module; the bottom bearing structure is provided with a bottom heat dissipation liquid cooling channel for dissipating heat from the amplitude and phase control / frequency conversion module.

2. The high-power active array thin and light integrated architecture according to claim 1, characterized in that: The middle bearing structure comprises a middle bearing metal part provided with a heat dissipation liquid cooling channel, and middle high and low frequency connectors installed on the middle bearing metal part and respectively connected to the amplification module and the amplitude and phase control / frequency conversion module.

3. The high-power active array thin and light integrated architecture according to claim 2, characterized in that: The middle bearing structure also includes a liquid cooling joint which is arranged at the bottom of the middle bearing metal part and is connected to the heat dissipation liquid cooling channel; the bottom heat dissipation liquid cooling channel is connected to the heat dissipation liquid cooling channel through the liquid cooling joint.

4. The high-power active array thin and light integrated architecture according to claim 3, characterized in that: The liquid cooling joint cooperates with the middle bearing metal piece to form an installation cavity for installing the amplitude and phase control / frequency conversion module.

5. The high-power active array thin and light integrated architecture according to claim 1, characterized in that: The amplification module comprises a grid-shaped transfer printed circuit board with multiple groups of grids and an amplification device arranged in the grid; the amplification device is installed on a middle bearing structure; the amplification device is in multiple groups and arranged horizontally.

6. The high-power active array thin and light integrated architecture according to claim 5, characterized in that: The amplification module also includes interconnecting gold wires for connecting the grid-shaped transfer printed circuit board and the amplification device.

7. The high-power active array thin and light integrated architecture according to claim 6, characterized in that: The amplitude-phase control / frequency conversion module includes a transfer printed circuit board arranged in the installation cavity, a plurality of groups of amplitude-phase control / frequency conversion components installed on the side of the transfer printed circuit board close to the bottom load-bearing structure, and a bottom high- and low-frequency connector installed on the side of the transfer printed circuit board close to the bottom load-bearing structure; A plurality of groups of bottom high and low frequency connectors are arranged horizontally.

8. The high-power active array thin and light integrated architecture according to claim 7, characterized in that: The amplitude-phase control / frequency conversion module further comprises an elastic heat dissipation material installed on a side of the amplitude-phase control / frequency conversion device away from the transfer printed circuit board.

9. The high-power active array thin and light integrated architecture according to claim 1, characterized in that: The top bearing structure comprises a top bearing metal member and a top high-frequency connector which is arranged on the top bearing metal member and is respectively connected to the radiation unit and the amplification module.

10. A high-power active array thin and light integrated architecture according to any one of claims 1 to 9, characterized in that: The bottom heat dissipation liquid cooling channel is connected to a liquid cooling source.

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