Socket for chip testing

Abstract

A chip testing socket disclosed by the present invention comprises a socket body 10, a support frame 20 and a heat dissipation assembly 30, the heat dissipation assembly is fixed on the support frame, the support frame is connected with one end of the socket body through a first rotating shaft, the socket is further provided with an operating rod 50 and a pair of first cams 61 located at two tail ends of the operating rod, the support frame is provided with two accommodating grooves, and the accommodating grooves are connected with the first cams 61. The first cam 61 is contained in the containing groove, and the tail end of the first cam 61 and the tail end of the operating rod are fixed to the supporting frame 20 through a second rotating shaft 42. When the heat dissipation assembly rotates to the socket body, the supporting frame is located on the socket body, and the long edge 631 of the first cam is located in the vertical direction, so that the heat dissipation assembly and the supporting frame are spaced by a certain distance. The operating rod 50 is rotated, so that the short edge 6321 of the first cam is located in the vertical direction, and at the moment, the heat dissipation assembly is pressed downwards to abut against the chip. The operating rod is matched with the first cam, so that the heat dissipation assembly is separated from the supporting frame by a certain distance, then the heat dissipation assembly is pressed downwards, and the heat dissipation assembly is prevented from scratching a chip.

Description

[Technical field]

[0001] The invention relates to a socket for chip testing, which has a heat dissipation component. [Background technology]

[0002] CN213484050U discloses a heat dissipation combination of a chip connector, including a chip connector, a rotating member and a heat dissipation assembly, wherein the rotating member pivots on the chip connector and the heat dissipation assembly is mounted on the rotating member; the heat dissipation assembly includes a heat dissipation module and an elastic force increasing member, wherein the heat dissipation module has a copper block, and the copper block is used to press against the chip contained in the chip connector; the elastic force increasing member includes a first frame, a second frame and a plurality of springs, wherein the plurality of springs are clamped between the first and second frames to generate elastic force, the first frame is placed on the rotating member, and the second frame is fixed around the copper block by bolts, and the copper block passes through the first and second frames to press against the chip. In this invention patent, the elastic force increasing member covered with springs transmits force to the copper block, so that the copper block can transmit a large downward force and provide downward force to the chip. Then in actual use, during the process of covering the rotating member, due to the rotational movement, the copper block of the radiator may slide against the surface of the chip, and there is a risk of scratching the chip.

[0003] Therefore, it is necessary to design a new socket for chip testing to overcome the defects of the above-mentioned heat dissipation assembly. [Summary of the invention]

[0004] The problem to be solved by the present invention is to provide a socket for chip testing, which can prevent the heat dissipation contact from scratching the chip.

[0005] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a socket for chip testing, comprising a socket body, a support frame and a heat dissipation assembly, the socket body is provided with a chip testing area, the heat dissipation assembly is fixed to the support frame, and one end of the support frame is connected to one end of the socket body by a first rotating shaft, the socket is further provided with an operating rod, a pair of first cams located at two ends of the operating rod, the support frame is provided with two receiving grooves, the first cam is accommodated in the corresponding receiving grooves, and the ends of the first cam and the operating rod are fixed to the support frame by a second rotating shaft, the first cam has a long side and a short side; when the heat dissipation assembly is rotated to the socket body, the support frame is seated on the socket body, and the long side of the first cam is located in the vertical direction, so that the heat dissipation assembly is separated from the support frame by a certain distance; the operating rod is rotated so that the short side of the first cam is located in the vertical direction, and the heat dissipation assembly is pressed down and abuts against the chip.

[0006] Compared with the prior art, the operating rod of the present invention cooperates with the first cam, so that the heat dissipation component is first spaced apart from the support frame by a certain distance, and then the heat dissipation component is pressed down to prevent the heat dissipation component from scratching the chip.

Description of the Drawings

[0007] Figure 1 is a perspective view of the socket for chip testing of the present invention, wherein the heat dissipation component is in an open state.

[0008] Figure 2 is Figure 1 a perspective view of the socket in another angle in

[0009] Figure 3 is Figure 2 a cross-sectional view of the heat dissipation component and the support frame in along the dashed line A-A.

[0010] Figure 4 is Figure 2 a perspective view of the lifting mechanism and the support frame in

[0011] Figure 5 is Figure 4 a perspective view of the support frame in

[0012] Figure 6 is Figure 4 a perspective exploded view of a part of the lifting mechanism in

[0013] Figure 7 is Figure 1 a perspective view of the socket, wherein the heat dissipation component is in a pressed state.

[0014] Figure 8 is Figure 7 a cross-sectional view along the dashed line B-B.

[0015] Figure 9 is Figure 7 a perspective view of the lifting mechanism in

[0016]

Description of the Reference Numerals

[0017]

[0018]

[0019] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Specific Embodiments

[0020] The present invention is a socket 100 for chip testing, which can test chips such as CPUs and DDRs. Refer Figure 1-2As shown, the socket includes a socket body 10, a support frame 20, and a heat dissipation component 30. The socket body 10 is provided with a chip test area 11, and the chips to be pre-tested are placed in the chip test area 11. Conductive terminals are generally provided in the chip test area. The heat dissipation component 30 is fixed to the support frame 20. One end of the support frame 20 is connected to one end of the socket body 10 through a first rotating shaft 41. The heat dissipation component 30 is provided with a locking member 31 at the other end relative to the first rotating shaft 41. As shown in Figure 7-8 As shown, when the heat dissipation component 30 rotates to the socket body 10, the locking member 31 is latched on the socket body 10.

[0021] Figure 3 It is a schematic cross-sectional view of the heat dissipation component in the open state, and it is also a schematic view of the support frame 20 located on the socket body 10, that is, a schematic view before the heat dissipation component 30 is further pressed down. Figure 8 Then it is a schematic view after the heat dissipation component 30 is further pressed down. As can be seen in Figure 3 , the lower bottom surface 301 of the heat dissipation component is supported by the long sides 631 of the first and second cams 61 and 62, and there is a certain distance between the lower bottom surface 301 and the upper surface 201 of the support frame 20. At this time, there is a certain distance between the heat dissipation contacts of the heat dissipation component and the chips. In Figure 8 , the lower bottom surface 301 is supported by the short sides 632 of the first and second cams. The lower bottom surface 301 of the heat dissipation component has moved down and abuts against the upper surface of the support member 20. At this time, the heat dissipation contacts of the heat dissipation component abut against the chips, thereby achieving the heat dissipation effect. When the heat dissipation component 30 of the present invention rotates from the open state to the sitting state, during the rotation process, the heat dissipation contacts will not touch the chips. In the sitting state, then operate through the operating rod 50. The operating rod rotates along the Figure 6 arrow direction in, so that the heat dissipation component 30 continues to be pressed down, and it moves in the up and down direction, avoiding the risk of scratching the chips caused by the sliding movement between the heat dissipation contacts and the chip surface in the prior art.

[0022] The following specifically introduces the specific structure for driving the heat dissipation component 30 to move down.

[0023] Refer to Figure 4-6 As shown, the socket 10 is further provided with an operating rod 50 and a pair of first cams 61 located at both ends of the operating rod. The support frame 20 is provided with two receiving grooves 21. A central through area 22 for the heat dissipation contacts to pass through is provided in the middle of the support frame 20. Receiving portions 23 extending downward are provided on both sides. The receiving grooves 21 penetrate through the receiving portions 23. A pair of first cams 61 are respectively received in the corresponding receiving grooves 21. The first cams 61 and the ends of the operating rod 50 are fixed to the support frame 20 through a second rotating shaft 42. As shown in Figure 3, when the heat dissipation component 30 rotates to the socket body, the support frame 20 is seated on the socket body 10. One end of the positioning post 34 in the heat dissipation component is fixed to the support frame 20, and the other end is fixed to the heat dissipation component. The elastic member 35 is sleeved on the positioning post 34 and presses downward on the heat dissipation contact 32. When the long side 631 of the cam is in the vertical direction, the elastic member 35 is compressed and moves upward, so that there is a certain distance between the heat dissipation component 30 and the support frame 20, and the heat dissipation contact 32 does not contact the chip. It can be understood that at this time, the heat dissipation contact 32 stores energy and has a tendency to move downward. Combined with Figure 8 , rotate the operating rod 50 so that the short side 632 of the first cam is in the vertical direction. At this time, the energy of the elastic member 35 is released, prompting the heat dissipation contact 32 to move downward, so as to abut against the chip. When the chip is not installed, if the operating rod 50 is rotated to a position where Figure 8 is located, and the short side 632 of the first cam is in the vertical direction, it can be understood that the heat dissipation contact 32 can protrude downward into the chip test area 11 by a certain distance.

[0024] Further, the socket 10 is provided with a pair of second cams 62. The structure of the second cam 62 is the same as that of the first cam. The second cam 62 is located in the corresponding receiving groove 21 and is fixed to the support frame 20 by a third rotating shaft 43. The first and second cams are provided with meshing gears 64. The first cam 61 and the second cam 62 are arranged side by side with each other. The first cam 61 is located on the side close to the locking member 31, and the second cam 62 is located on the side close to the first rotating shaft 41. The first and second cams are symmetrical to each other, forming a symmetrical rotating mechanism, which can ensure that the heat dissipation contacts can simultaneously press against the chip and can also reduce the force on the operating rod. The operating rod 50 and the two sets of cams and rotating shafts together constitute a lifting mechanism for promoting the heat dissipation component 30 to rise and fall.

[0025] The operating rod 50 includes two side portions 51 and a cross bar 52 connecting the side portions. Each side portion 51 includes a flipping portion 521 formed by connecting four rod portions into a quadrilateral structure and a round hole 53 located outside the flipping portion 521. The round hole 53 is connected to the second rotating shaft 42. The cross bar 51 and the round hole 53 are located at the diagonals of the quadrilateral structure. In this embodiment, the quadrilateral structure of the flipping portion 521 is a square structure with the same length of rod portions. A rotation prevention hole 54 is integrally communicated beside the round hole 53. An anti-rotation protrusion 614 protrudes from the inner side surface of the first cam 61, and the anti-rotation protrusion 614 is received in the rotation prevention hole 54. In this way, the operating rod 50 drives the first cam 61 to rotate through the cooperation of the anti-rotation protrusion 614 and the rotation prevention hole 54. In other embodiments, the round hole and the rotation prevention hole can be integrally formed into other non-circular holes, and one end of the corresponding second rotating shaft 42 needs to be set into a shape matching the non-circular hole. In this way, there is no need to set an anti-rotation protrusion at the first cam. In this way, the round hole 53 and the rotation prevention hole 54 together constitute a fixing hole.

[0026] The outer shape of the first cam 61 is composed of a circular portion 611 and a trimmed portion 612. The trimmed portion 612 is formed by cutting off one side of the circle. A rotating hole 613 that mates with the first cam is provided at the center of the circular portion 611. The gear 64 is disposed on the circular portion 611. Thus, the diameter length of the circular portion 611 constitutes the long side 631 of the first cam 61, and the length perpendicular to the trimmed portion 612 constitutes the short side 632 of the first cam. The cross bar 52 is connected to the two side portions 51 by the fourth rotating shaft 44.

[0027] As Figure 2 shown, the heat dissipation assembly 30 is provided with a channel 33 for accommodating the flipping portion 521, and the cross bar 52 is exposed on the upper surface of the heat dissipation assembly. As Figure 3 shown, in the sitting state, the cross bar 52 is located on the side of the heat dissipation assembly adjacent to the locking member 31. The user pulls the cross bar 52, causing the flipping portion 521 to flip and move to the other end of the heat dissipation assembly. As Figure 8 shown, when the flipping portion 521 drives the trimmed portion 612 to face upward, the heat dissipation assembly presses down and abuts against the chip. The second cam has the same structure and will not be described in detail.

[0028] It should be noted that the above description is only the best implementation mode of the present invention, not all implementation modes. Any equivalent changes made by those of ordinary skill in the art to the technical solution of the present invention by reading the specification of the present invention are covered by the claims of the present invention.

Claims

1. A socket for chip testing, comprising a socket body, a support frame and a heat dissipation component. The socket body is provided with a chip testing area. The heat dissipation component is fixed on the support frame, and one end of the support frame is connected to one end of the socket body through a first rotating shaft. Characterized in that: The socket further comprises an operating rod and a pair of first cams located at two ends of the operating rod. The support frame is provided with two receiving grooves. The first cams are received in the corresponding receiving grooves, and the first cams and the ends of the operating rod are fixed on the support frame through a second rotating shaft. The first cam has a long side and a short side. When the heat dissipation component rotates to the socket body, the support frame is located on the socket body, and the long side of the first cam is in the vertical direction, so that there is a certain distance between the heat dissipation component and the support frame. Rotate the operating rod so that the short side of the first cam is in the vertical direction, and the heat dissipation component is pressed down to abut against the chip.

2. The socket for chip testing according to claim 1, Characterized in that: The socket is provided with a pair of second cams. The second cams are located in the corresponding receiving grooves and are fixed on the support frame by a third rotating shaft. The first and second cams are provided with gears that engage with each other.

3. The socket for chip testing according to claim 2, Characterized in that: The heat dissipation component is provided with a locking part at the other end relative to the first rotating shaft. When the heat dissipation component rotates to the socket body, the locking part is latched on the socket body.

4. The socket for chip testing according to claim 3, Characterized in that: The first cam and the second cam are arranged side by side with each other. The first cam is located on the side close to the locking part, and the second cam is located on the side close to the first rotating shaft.

5. The socket for chip testing according to claim 4, Characterized in that: The operating rod includes two side parts and a cross bar connecting the side parts. Each side part includes a flipping part and a fixing hole located outside the flipping part. One end of the first rotating shaft is fixed in the fixing hole, and the cross bar and the fixing hole are located diagonally on the flipping part.

6. The socket for chip testing according to claim 4, Characterized in that: The operating rod includes two side parts and a cross bar connecting the side parts. Each side part includes a flipping part, a round hole located outside the flipping part and an anti-rotation hole integrally connected to the round hole. The cross bar and the round hole are located diagonally on the flipping part. One end of the first rotating shaft is fixed in the round hole. An anti-rotation protrusion protrudes from the inner side surface of the first cam, and the anti-rotation protrusion is received in the anti-rotation hole. The operating rod drives the first cam to rotate through the cooperation of the anti-rotation protrusion and the anti-rotation hole.

7. The socket for chip testing according to claim 5 or 6, Characterized in that: The cross bar is connected to the two side parts by a fourth rotating shaft.

8. The socket for chip testing according to claim 1, Characterized in that: The outer shape of the first cam is composed of a circular part and a trimmed part. A rotating hole for cooperating with the second rotating shaft is provided at the center of the circular part, and the gear is arranged on the circular part. Thus, the diameter length of the circular part constitutes the long side of the first cam, and the length perpendicular to the trimmed part constitutes the short side of the first cam.

9. The socket for chip testing according to claim 1, characterized in that: The outer shapes of the first and second cams are both composed of a circular part and a trimmed part. A rotating hole for cooperating with the first cam is provided at the center of the circular part, and the gear is arranged on the circular part; when the operating rod drives the trimmed part to face upward, the heat dissipation component presses downward and abuts against the chip.

10. The socket for chip testing according to claim 1, characterized in that: The heat dissipation component includes a positioning post and an elastic member. One end of the positioning post is fixed to the heat dissipation component, and the other end is fixed to a heat dissipation contact provided on the heat dissipation component. The elastic member is sleeved on the positioning post and presses downward on the heat dissipation contact.

Images