Metal elastic sheet splicing needle manufacturing method

Abstract

The invention relates to a method for manufacturing a metal elastic sheet splicing needle, which comprises the following steps of: selecting a metal raw material with a preset size, and carrying out chemical etching or laser etching treatment on the metal raw material to obtain a primarily-formed metal elastic sheet connecting piece splicing needle which is of a structure that two ends are connected through a plurality of connecting piece needle heads; and electroplating treatment is conducted on the primarily-formed metal elastic sheet connecting piece splicing needle, one end of the primarily-formed metal elastic sheet connecting piece splicing needle is punched and cut through a hardware jig to remove waste, the splicing needle head of the metal elastic sheet is bent by a preset angle value to be formed while punching is conducted, and the jig is used for positioning, passing through a furnace and conducting welding treatment. By using the manufacturing method of the scheme, the function of circuit intercommunication and switching is achieved, signals are not distorted, and notches are flat and smooth. The product service life is long. And the physical performance of the switching splicing pin connection circuit is stable. The circuit actual performance is stable. The transmission rate of finished products is effectively improved and can reach 8GB / s to the maximum, and the stability of communication signals is high.

Description

Technical Field

[0001] The present invention relates to the technical field of metal shrapnel processing, and particularly relates to a method for manufacturing a metal shrapnel pin. Background Art

[0002] Currently, in the market, when producing metal shrapnel, it is necessary to first manufacture a mold, and then use the mold to die-cast the metal shrapnel into shape. In production, the cost is relatively high, the process is complex, and it is difficult to achieve a rapid mass production effect through die-casting with a mold. As a result, the market price of this type of connector is high, and the defective rate of the metal shrapnel produced using the mold is relatively high. Moreover, due to the thin thickness of the metal shrapnel, the small distance between each pin, and the easy occurrence of burrs during later cutting and assembly, it has a certain impact on the stability of network transmission signals. Summary of the Invention

[0003] A first object of the present invention is to provide a method for manufacturing a metal shrapnel pin, which does not require using a mold to die-cast the metal shrapnel into shape, effectively reducing the cost. Moreover, a stamping device is used to punch and cut the needle head of the metal shrapnel, making the cut of the needle head neater, smoother, with fewer burrs, and the transmitted signal is not distorted.

[0004] The above first object of the present invention is achieved through the following technical solutions:

[0005] A method for manufacturing a metal shrapnel pin includes:

[0006] Select a metal raw material of a preset size, and perform chemical etching or laser etching treatment on the metal raw material to obtain a preliminarily formed metal shrapnel continuous pin; the preliminarily formed metal shrapnel continuous pin has a structure in which two ends are connected by a plurality of continuous needles;

[0007] Perform electroplating treatment on the preliminarily formed metal shrapnel continuous pin;

[0008] Use a hardware fixture to punch and cut the waste material from one end of the preliminarily formed metal shrapnel continuous pin, and at the same time bend the continuous needles of the metal shrapnel into a preset angle value to form;

[0009] Correspond the bent needles one by one with the gold fingers on the PCB board or with the pins of the PCBA integrated circuit module, and use a fixture for positioning and through-hole soldering treatment.

[0010] In one embodiment, the chemical etching treatment of the metal raw material includes:

[0011] Pretreatment, cleaning the surface of the metal raw material;

[0012] Apply a dry film, apply a dry film to the cleaned metal raw material;

[0013] Exposure, exposing the photosensitive glue layer on the dry film;

[0014] Development, removing the unnecessary photosensitive glue layer;

[0015] Etching, etching away the part of the metal raw material not covered by the dry film;

[0016] Removing the dry film, removing the dry film covering the metal raw material.

[0017] In one embodiment, the dry film needs to be dried before exposure to thoroughly dry the photosensitive glue layer on the dry film.

[0018] In one embodiment, the method for laser etching of the metal raw material includes:

[0019] Coating glue, coating photoresist on the metal raw material;

[0020] Pre-baking, baking the photoresist;

[0021] Exposure, exposing the photoresist coated on the metal raw material;

[0022] Development, removing the photoresist at the positions where circuit production is not required;

[0023] Corrosion, etching away the part of the metal raw material not covered by the photoresist;

[0024] Removing the glue, removing the photoresist covering the circuit pattern on the metal raw material.

[0025] In one embodiment, after development, hardening the film is carried out to remove the remaining photoresist at the positions where circuit production is not required.

[0026] In one embodiment, the method of electroplating treatment is one of chemical electroplating, vacuum electroplating or vapor electroplating.

[0027] In one embodiment, the method of vacuum electroplating includes:

[0028] Performing repair welding and polishing treatment on the preliminarily formed metal shrapnel connecting piece and pin;

[0029] Degreasing treatment;

[0030] Sandblasting treatment;

[0031] Performing vacuum electroplating treatment on the preliminarily formed metal shrapnel connecting piece and pin;

[0032] Polishing the preliminarily formed metal shrapnel connecting piece and pin after vacuum electroplating;

[0033] The preliminary formed metal spring pieces and stitching needles after vacuum plating are tested.

[0034] In one of the embodiments, the equipment for stamping and preliminarily forming the metal spring pieces and stitching needles is an open tiltable punch press, a steel frame punch press, or a guide rail punch press.

[0035] In summary, the present invention includes at least one of the following beneficial technical effects: the product produced by the method and process of the scheme of the present invention is suitable for the production of connector circuit plug-in spring pins or pin welding of PCBA integrated circuit boards. The welding conditions of board to board or board to line can be realized, and the function of circuit intercommunication transfer can be realized. It is customized as a solderable, plug-in, and pluggable application function circuit product. The signal is not distorted, and the incision is flat and smooth. The product has a long service life. The physical performance of the transfer pin connection circuit is stable. The actual performance of the circuit is stable. In actual measurements, the positive and negative tolerances of the differential impedance circuit of the pin transfer can be controlled at ±5 microns. Effectively guarantee the stable performance of high-frequency and high-speed circuit signals and transmission data. Thereby reducing the signal distortion of the signal circuit and the rate reduction of the transmission data circuit. It has the effect of signal data correction for the plug-in gold finger transfer of the PCB differential impedance circuit or the pin transfer of the PCBA integrated circuit module board. The transmission rate of the completed product is effectively improved, up to 8GB / s, and the communication signal is highly stable. It does not require cumbersome processes such as mold opening and production of multiple sets of related molds, so it has lower costs, higher economy and product development timeliness. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a flow chart of steps S1-S4 in a method for making a metal spring needle according to one embodiment of the present invention;

[0037] Figure 2 yes Figure 1 A schematic diagram of a specific process of the chemical etching method in step S1;

[0038] Figure 3 yes Figure 1 A schematic diagram of a specific process of the laser etching method in step S1;

[0039] Figure 4 yes Figure 1 Specific flow chart of the vacuum plating method in step S2. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The following further elaborates on the present invention in conjunction with the attached Figures 1-4 drawings.

[0042] Example 1

[0043] Referring to Figure 1 , a method for manufacturing a metal shrapnel pin includes:

[0044] S1. Select metal raw materials of a preset size and perform chemical etching or laser etching on the metal raw materials to obtain a preliminarily formed metal shrapnel continuous-piece pin; the preliminarily formed metal shrapnel continuous-piece pin has a structure in which two ends are connected by a plurality of continuous-piece needle tips;

[0045] Referring to Figure 2 , performing chemical etching on the metal raw materials includes:

[0046] S11. Pretreatment, cleaning the surface of the metal raw materials;

[0047] Cleaning the surface of the metal raw materials mainly serves to remove dirt, dust, oil stains, etc. on the material surface. The cleaning process is the key to ensuring good adhesion of the subsequent thin film or screen printing ink to the metal surface. Therefore, it is necessary to thoroughly remove the oil stain and oxide film on the metal etching surface. The degreasing should be determined according to the oil stain situation of the workpiece. It is best to perform electro-degreasing before screen printing ink to ensure the degreasing effect. In addition to removing the oxide film, the best etching solution should also be selected according to the metal type and film thickness to ensure surface cleanliness.

[0048] S12. Applying a dry film, applying a dry film to the cleaned metal raw materials;

[0049] Determine the size of the dry film used according to the actual thickness of the metal raw materials and the precise width of the pattern. For metal raw materials of different thicknesses, when applying the photosensitive layer, factors such as the etching processing time required for the product pattern should be considered. A thicker or thinner photosensitive glue layer can be made, with good covering performance and high pattern clarity generated by metal etching.

[0050] S13. Drying, thoroughly drying the photosensitive glue layer on the dry film;

[0051] The photosensitive glue layer of the dry film needs to be thoroughly dried to prepare for the exposure process. At the same time, it is necessary to ensure surface cleanliness, without adhesion, impurities, etc.

[0052] S14. Exposure, exposing the photosensitive glue layer on the dry film;

[0053] This process is an important process for metal etching. The exposure energy will be considered according to the thickness and precision of the product material. The exposure process determines whether the etching can meet requirements such as better dimensional control precision.

[0054] S15. Develop and remove the unnecessary photosensitive resin layer.

[0055] After exposing the photosensitive resin layer on the surface of the metal etching plate and curing the exposed pattern resin layer, the parts that are not needed in the pattern, i.e., the parts to be etched, are exposed. This process will completely remove the unnecessary photosensitive resin layer on the product.

[0056] S16. Etch the parts of the metal raw material not covered by the dry film.

[0057] After the prefabrication process of the product, the parts of the metal raw material not covered by the dry film are etched. This process determines whether the final product is qualified. Select an etching solution with a preset concentration, temperature, pressure, and speed to etch the metal material on the metal raw material not covered by the dry film.

[0058] S17. Remove the dry film covering the metal raw material.

[0059] The required parts on the etched metal raw material are still covered with a dry film, and the photosensitive resin layer on the dry film on the surface of the etched product needs to be removed. Since the photosensitive resin layer is an acidic substance, the swelling is mostly carried out by the acid-base neutralization method. After overflow cleaning and ultrasonic cleaning, the photosensitive resin layer on the surface is removed to prevent the residue of the photosensitive resin.

[0060] S2. Electroplate the preliminarily formed metal shrapnel connecting piece and pin; the electroplating method is one of chemical electroplating, vacuum electroplating, or vapor electroplating.

[0061] Refer to Figure 4 , the method of vacuum electroplating includes:

[0062] S21. Perform repair welding and polishing on the preliminarily formed metal shrapnel connecting piece and pin; stress relief heat treatment must be carried out after repair welding. The Ra of the stamping die is <0.5μm, and the forming surface requires Ra <0.2μm to facilitate improving the effect after vacuum electroplating treatment.

[0063] S22. Degreasing treatment; it includes 4 steps: ① Oil removal; it is divided into three ultrasonic cleaning tanks, and the content of the cleaning agent in each tank gradually decreases. The cleaning time for each tank is 5 min - 10 min. ② Cleaning with clean water to remove dirt; it is divided into three clean water cleaning tanks. The first tank is for clean water spraying, with a time of 3 min, and the second and third tanks are for ultrasonic cleaning, with a time of 3 min each. ③ Cleaning with deionized water; it is divided into three tanks. The first and second tanks are deionized water ultrasonic tanks, with a time of 3 min, and the third tank is for deionized water immersion cleaning, with a time of 3 min. ④ Dehydration; use hot air to blow for 8 min - 10 min to ensure that the preliminarily formed metal shrapnel is dry.

[0064] S23. Sandblasting treatment; the selected abrasive is one of copper ore sand, quartz sand, emery, iron sand or Hainan sand. The sandblasting step can change the surface or shape of the preliminarily formed metal shrapnel. Due to the impact and cutting action of the abrasive on the workpiece surface, the surface of the preliminarily formed metal shrapnel obtains a certain cleanliness and different roughness, improving the mechanical properties of the surface of the preliminarily formed metal shrapnel. Therefore, the fatigue resistance of the preliminarily formed metal shrapnel is improved, the adhesion between it and the coating is increased, the durability of the coating film is extended, and it is also beneficial to the leveling and decoration of the coating.

[0065] S24. Vacuum electroplating treatment is carried out on the preliminarily formed metal shrapnel connecting piece and pin; ① Nitriding treatment; the vacuum electroplating furnace is evacuated, liquid ammonia is introduced, and heated to evaporate ammonia gas to treat the surface of the preliminarily formed metal shrapnel. ② Coating deposition; specifically select one of TiN, CrN, TiCN, TiAlN or CrAlN.

[0066] S25. Polish the preliminarily formed metal shrapnel connecting piece and pin after vacuum electroplating; the Ra of the stamping die is <0.5μm, and the forming surface requires Ra <0.2μm.

[0067] S26. Inspect the preliminarily formed metal shrapnel connecting piece and pin after vacuum electroplating.

[0068] S3. Use a hardware fixture to punch and cut off the waste at one end of the preliminarily formed metal shrapnel connecting piece and pin, and bend the connecting piece and pin head of the metal shrapnel into a preset angle value during stamping; the equipment for stamping the preliminarily formed metal shrapnel is one of an open-type tilting punch press, a steel frame punch press or a guide rail punch press. Punch and cut one end of the preliminarily formed metal shrapnel, and bend the pin head of the metal shrapnel during stamping to correspond to the gold fingers on the PCB for welding one by one later.

[0069] S4. Align the bent pins with the gold fingers on the PCB board or the pins of the PCBA integrated circuit module one by one, and use a fixture for positioning and in-furnace welding treatment.

[0070] The implementation principle of this embodiment is as follows: Select a metal raw material of a preset size. The metal raw material is a copper sheet or other conductive material, and the metal raw material is subjected to etching or lithography to obtain a preliminarily formed metal spring piece. The preliminarily formed metal spring piece has a structure in which two ends are connected by a number of needles, and the number of needles is basically equidistant. The preliminarily formed metal spring piece is subjected to electroplating treatment. A stamping device is used to stamp and cut one end of the preliminarily formed metal spring piece. While stamping, the needles of the metal spring piece are bent into shape so as to be welded to the gold fingers on the PCB one by one. The bent needles are welded to the gold fingers on the PCB one by one. For the product using this manufacturing method and process, in actual measurement, its transmission rate can reach up to 8 GB / second at most, and the communication signal stability is high; moreover, there is no need to open a mold and make related molds, the cost is lower, and it has higher economy.

[0071] Referring to Figure 3 , the difference between this embodiment and Embodiment 1 lies in the method of laser etching the metal raw material, which includes:

[0072] S181, Coating: Coating photoresist on the metal raw material;

[0073] S182, Pre-baking: Drying the photoresist; Baking can remove the organic substances and moisture generated during the lithography process, making the chip surface cleaner and flatter. This is very important for subsequent processes such as electroplating and etching, because any impurities or contaminants may cause the chip to fail or reduce its performance.

[0074] S183, Exposure: Exposing the photoresist coated on the metal raw material;

[0075] S184, Development: Removing the photoresist at the positions where circuit production is not required;

[0076] S185, Hardening the film: Removing the remaining photoresist at the positions where circuit production is not required; It helps to further perform etching. Otherwise, the remaining photoresist is likely to affect the etching and the required circuit pattern cannot be obtained.

[0077] S186, Corrosion: Etching away the part of the metal raw material not covered by the photoresist; Etching away the metal material not covered by the photoresist;

[0078] S187, Removing the glue: Removing the photoresist covering the circuit pattern on the metal raw material. Removing the photoresist covering the metal pattern.

[0079] It should be noted that when the device provided in the above embodiments realizes its functions, only the division of the above functional modules is used for illustration. In actual applications, the above functions can be allocated to different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiments belong to the same concept. For the specific implementation process, please refer to the method embodiments and will not be elaborated here.

[0080] It should be noted that for the foregoing method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that this application is not limited by the described action sequence, because according to this application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0081] This specific embodiment is only an explanation of the present invention and does not limit the present invention. Those skilled in the art can make modifications to this embodiment without creative contributions according to needs after reading this specification, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A manufacturing method for metal shrapnel pins, characterized in that, it includes: Select metal raw materials of a preset size, and perform chemical etching or laser etching on the metal raw materials to obtain a preliminarily formed metal shrapnel continuous-pin; The preliminarily formed metal shrapnel continuous-pin has a structure where two ends are connected by a number of continuous-pin heads; Perform electroplating on the preliminarily formed metal shrapnel continuous-pin; Use a hardware fixture to punch and cut off the waste at one end of the preliminarily formed metal shrapnel continuous-pin, and at the same time bend the continuous-pin heads of the metal shrapnel into a preset angle value for forming; Correspond the bent heads of the pins one by one with the gold fingers on the PCB board or with the pins of the PCBA integrated circuit module, and use a fixture for positioning and through-hole soldering treatment.

2. The manufacturing method for metal shrapnel pins according to claim 1, characterized in that, The chemical etching treatment of the metal raw materials includes: Pretreatment, cleaning the surface of the metal raw materials; Applying a dry film, applying a dry film to the cleaned metal raw materials; Exposure, exposing the photosensitive resin layer on the dry film; Development, removing the unnecessary photosensitive resin layer; Etching, etching away the parts of the metal raw materials not covered by the dry film; Removing the dry film, removing the dry film covering the metal raw materials.

3. The manufacturing method for metal shrapnel pins according to claim 2, characterized in that, Before exposure, the dry film needs to be dried to thoroughly dry the photosensitive resin layer on the dry film.

4. The manufacturing method for metal shrapnel pins according to claim 1, characterized in that, The method for laser etching of the metal raw materials includes: Coating the glue, coating a photoresist on the metal raw materials; Pre-baking, baking the photoresist; Exposure, exposing the photoresist coated on the metal raw materials; Development, removing the photoresist at the positions where circuit production is not required; Corrosion, etching away the parts of the metal raw materials not covered by the photoresist; Removing the glue, removing the photoresist covering the circuit pattern on the metal raw materials.

5. The manufacturing method for metal shrapnel pins according to claim 4, characterized in that, After development, hardening the film is carried out to remove the remaining photoresist at the positions where circuit production is not required.

6. The manufacturing method for metal shrapnel pins according to claim 1, characterized in that, The method for electroplating treatment is one of chemical electroplating, vacuum electroplating or vapor electroplating.

7. The manufacturing method for metal shrapnel pins according to claim 6, characterized in that, The method for vacuum electroplating includes: Performing repair welding and polishing treatment on the preliminarily formed metal shrapnel continuous-pin; Degreasing treatment; Sandblasting treatment; Performing vacuum electroplating treatment on the preliminarily formed metal shrapnel continuous-pin; Polishing the preliminarily formed metal shrapnel continuous-pin after vacuum electroplating; Inspecting the preliminarily formed metal shrapnel continuous-pin after vacuum electroplating.

8. The manufacturing method for metal shrapnel pins according to claim 1, characterized in that, The equipment for punching the preliminarily formed metal shrapnel continuous-pin is one of an open-type tilting punching press, a steel-frame punching press or a guide-rail punching press.

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