Efficient phase change radiator for communication equipment

By using heat dissipation blocks filled with paraffin-based or fatty acid-based phase change materials in communication equipment, combined with the design of thermal capsules and argon, and combined with the automated control system, the problem of low heat dissipation efficiency of the equipment is solved, achieving efficient heat dissipation and dynamic adjustment effects.

CN120129211APending Publication Date: 2025-06-10QILIHANG INTELLIGENT EQUIP (SUQIAN) CO LTD
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Patent Information

Application Number
CN202510300190.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-14
Publication Date
2025-06-10

AI Technical Summary

Technical Problem

The existing communication equipment heat dissipation methods cannot effectively dissipate heat under high heat density and long-term operation, making it difficult to control the equipment temperature within the safe range.

Method used

The paraffin-based or fatty acid-based phase change material is used to fill the heat dissipation block, combined with the low thermal conductivity design of the thermal capsule and argon, and the automatic control of the electric cooling fan and temperature sensor is used to achieve dynamic adjustment of the heat dissipation effect.

Benefits of technology

When the equipment temperature is too high, it can prevent heat from entering the heat-absorbing particles when not in use, improve the utilization rate and heat dissipation efficiency of phase change materials, and ensure that the equipment operates stably under various operating conditions.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a high-efficiency phase-change radiator for communication equipment, and provides the high-efficiency phase-change radiator for the communication equipment, which is characterized in that a radiating block is filled with a paraffin-based or fatty acid-based phase-change material, and the low-thermal-conductivity design of a heat-conducting bag and argon is combined, so that high-efficiency heat dissipation is realized when the temperature of the equipment is too high; when the heat dissipation assembly is not used, heat is prevented from entering the heat absorption particles unintentionally, when the temperature sensor detects that the temperature exceeds a set threshold value, the heat is transferred to the heat absorption particles, the heat absorption particles are made to change from the solid state to the liquid state, and after the heat dissipation assembly finishes working, the first heat conduction oil is compressed into the heat dissipation bag. Under the starting of a conventional heat dissipation mode of the electric heat dissipation fan, the heat dissipation bag stretches out and swings, heat in the heat absorption particles is guided out, heat dissipation is further conducted through the wind action, the heat absorption particles are changed from the liquid state to the solid state, and through the design, the radiator can efficiently transmit heat and prevent ineffective heat from entering; and the heat-absorbing particles are always in an optimal state.
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Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and more specifically, to an efficient phase change radiator for communication devices. Background Art

[0002] In modern communication devices, with the enhancement of functions and the improvement of operating speed, the heat generated by internal chips and circuit boards of the devices has increased significantly. If heat is not dissipated in a timely and effective manner, excessive temperature may lead to a decline in device performance, frequent failures, and even permanent damage. Currently, traditional heat dissipation methods mainly rely on fans and heat sinks, but these methods often cannot meet the heat dissipation requirements under high heat density and long-term operation, resulting in the device temperature being difficult to control within a safe range.

[0003] To solve this problem, more and more research has begun to focus on the application of phase change materials in heat dissipation. Phase change materials can absorb and release a large amount of heat through the phase change process, thereby effectively dissipating heat at high temperatures. However, how to efficiently combine phase change materials with traditional heat dissipation structures to improve the overall heat dissipation efficiency, and prevent ambient heat from inadvertently entering the phase change materials when the device is not in use or at a low temperature, causing premature phase change, is a key challenge that the existing technology needs to overcome. In addition, how to achieve automatic control of the heat dissipation system so that it can dynamically adjust the heat dissipation effect according to the actual temperature situation, thereby ensuring that the device can remain stable under various operating conditions, is also an important issue.

[0004] Therefore, in view of the above technical problems, it is necessary to provide an efficient phase change radiator for communication devices. Summary of the Invention

[0005] The purpose of the present invention is to provide an efficient phase change radiator for communication devices to solve the above problems.

[0006] To achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0007] An efficient phase change radiator for communication devices, comprising: a bottom plate, a heat dissipation component, a guiding component, and a connecting component. A first heat dissipation plate and a second heat dissipation plate are fixedly connected to the top end of the bottom plate, and a heat dissipation aluminum plate is installed at the middle position between the first heat dissipation plate and the second heat dissipation plate at the top end of the bottom plate; the heat dissipation component is arranged on one side of the heat dissipation aluminum plate, and the heat dissipation component includes a moving plate and a plurality of heat dissipation blocks, and the plurality of heat dissipation blocks are installed on the moving plate, and the moving plate is slidably connected to the bottom plate; the guiding component includes a guiding plate, and the guiding plate is fixedly connected to one end of the second heat dissipation plate; the connecting component includes a plurality of first transmission rods and a plurality of second transmission rods, the bottom end of the first transmission rod is fixedly connected to the top end of the heat dissipation block, the top end of the first transmission rod is fixedly connected to the second transmission rod, and a heat insulation and heat conduction ball is installed in the second transmission rod.

[0008] As a further improvement of the present invention, a plurality of evenly distributed electric cooling fans and temperature sensors are installed on the first heat dissipation plate. One end of the second heat dissipation plate is fixedly connected to an electric push rod, and the output end of the electric push rod is fixedly connected to a moving plate. The temperature sensor is electrically connected to the electric push rod.

[0009] As a further improvement of the present invention, the heat dissipation block is filled with heat absorption particles, and a heat conduction capsule is installed around the outside of the heat dissipation block. An argon gas is filled in the cavity formed between the heat dissipation block and the heat conduction capsule.

[0010] As a further improvement of the present invention, a heat conduction net is installed in the heat absorption particles. The heat conduction net is connected to the first transfer rod through a heat conduction rod. Heat insulation sleeves are installed around the outside of the first transfer rod and the second transfer rod.

[0011] As a further improvement of the present invention, the material of the heat absorption particles is any one of paraffin-based phase change materials and fatty acid-based phase change materials.

[0012] As a further improvement of the present invention, an abutting groove is formed in the guide plate. A sealed heat conduction block is slidably connected in the abutting groove. A heat dissipation capsule is installed in the guide plate. A first heat conduction oil is filled in the cavity formed at one end of the abutting groove where the sealed heat conduction block and the heat dissipation capsule are close to each other.

[0013] As a further improvement of the present invention, a limiting frame is installed on the inner wall of the abutting groove on the side where the sealed heat conduction block and the heat dissipation capsule are close to each other.

[0014] As a further improvement of the present invention, the heat insulation and heat conduction ball includes a heat conduction hemispherical body. The heat conduction hemispherical body is embedded in the second transfer rod. One end of the heat conduction hemispherical body is fixedly connected to a first heat conduction film. A second heat conduction oil is filled in the cavity formed by the heat conduction hemispherical body and the first heat conduction film.

[0015] As a further improvement of the present invention, a plurality of evenly distributed heat conduction columns are fixedly connected to one end of the heat conduction hemispherical body and located inside the first heat conduction film. A plurality of evenly distributed heat conduction fibers are installed around the outside of the heat conduction columns.

[0016] As a further improvement of the present invention, a second heat conduction film is installed around the outside of one end of the heat conduction hemispherical body and located outside the first heat conduction film. An argon gas is filled in the cavity formed by the second heat conduction film and the first heat conduction film.

[0017] Compared with the prior art, the advantages of the present invention are as follows:

[0018] (1) This solution ensures efficient heat dissipation when the device temperature is too high and prevents heat from inadvertently entering the heat-absorbing particles when not in use by filling a paraffin-based or fatty acid-based phase change material in the heat sink and combining the low thermal conductivity design of the heat conduction capsule and argon gas, thereby improving the utilization rate of the phase change material and the heat dissipation efficiency and better dissipating heat from the device.

[0019] (2) After the heat dissipation component finishes working, the first heat-conducting oil is compressed into the heat conduction capsule. Under the start of the conventional heat dissipation mode of the electric heat dissipation fan, the heat conduction capsule extends and swings to export the heat in the heat-absorbing particles, and further dissipates heat through the action of wind, so that the heat-absorbing particles change from liquid to solid, ensuring the reuse rate of the heat-absorbing particles and enabling them to dynamically adjust the heat dissipation effect according to the actual temperature situation. Brief Description of the Drawings

[0020] Figure 1 is a three-dimensional structural schematic diagram of the high-efficiency phase change radiator of the present invention;

[0021] Figure 2 is a three-dimensional structural schematic diagram of the heat dissipation component of the present invention;

[0022] Figure 3 is a front sectional structural schematic diagram of the heat sink of the present invention;

[0023] Figure 4 is a front sectional structural schematic diagram of the guiding component of the present invention;

[0024] Figure 5 is a front sectional structural schematic diagram of the heat insulation and heat conduction ball of the present invention.

[0025] Explanation of the Reference Numerals in the Drawings:

[0026] 1, bottom plate; 2, heat dissipation component; 3, guiding component; 4, connecting component; 5, heat insulation and heat conduction ball; 11, first heat dissipation plate; 12, second heat dissipation plate; 13, heat dissipation aluminum plate; 21, moving plate; 22, heat sink; 23, heat-absorbing particles; 24, heat conduction capsule; 31, guiding plate; 32, abutting groove; 33, sealed heat conduction block; 34, first heat-conducting oil; 35, limiting frame; 36, heat conduction capsule; 41, first transmission rod; 42, second transmission rod; 51, heat conduction hemisphere; 52, heat conduction column; 53, first heat conduction film; 54, second heat conduction film; 55, second heat-conducting oil. Detailed Embodiment

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] Embodiment:

[0029] Please refer to Figures 1-5 , a highly efficient phase change radiator for a communication device, comprising: a bottom plate 1, a heat dissipation component 2, a guiding component 3 and a connecting component 4. A first heat dissipation plate 11 and a second heat dissipation plate 12 are fixedly connected to the top end of the bottom plate 1, and a heat dissipation aluminum plate 13 is installed at the middle position between the first heat dissipation plate 11 and the second heat dissipation plate 12 on the top end of the bottom plate 1; the heat dissipation component 2 is arranged on one side of the heat dissipation aluminum plate 13, and the heat dissipation component 2 includes a moving plate 21 and a plurality of heat dissipation blocks 22, the plurality of heat dissipation blocks 22 are installed on the moving plate 21, and the moving plate 21 is slidably connected to the bottom plate 1; the guiding component 3 includes a guiding plate 31, and the guiding plate 31 is fixedly connected to one end of the second heat dissipation plate 12; the connecting component 4 includes a plurality of first transmission rods 41 and a plurality of second transmission rods 42, the bottom end of the first transmission rod 41 is fixedly connected to the top end of the heat dissipation block 22, the top end of the first transmission rod 41 is fixedly connected to the second transmission rod 42, and a heat insulation and heat conduction ball 5 is installed in the second transmission rod 42.

[0030] Among them, the present invention provides a highly efficient phase change radiator for a communication device. By filling the heat dissipation block 22 with a paraffin-based phase change material or a fatty acid-based phase change material and combining the low thermal conductivity design of the heat conduction capsule 24 and argon, it is ensured that efficient heat dissipation is achieved when the device temperature is too high, and heat is prevented from inadvertently entering the heat absorption particles 23 when not in use. This radiator utilizes the automatic control of an electric cooling fan and a temperature sensor to achieve dynamic adjustment of the heat dissipation effect.

[0031] When the temperature sensor detects that the temperature exceeds the set threshold range, the electric push rod is activated to push the moving plate 21 and the heat dissipation block 22 into the heat dissipation aluminum plate 13. The inner wall of the heat dissipation aluminum plate 13 squeezes the heat conduction capsule 24 to make it closely adhere to the outer wall of the heat dissipation block 22, and transfers the heat to the heat absorption particles 23 through the heat conduction capsule 24 and the heat dissipation block 22. The heat absorption particles 23 absorb heat and undergo a phase change when the device is overheated, changing from a solid state to a liquid state, playing an effective heat dissipation role.

[0032] After the heat dissipation component finishes working, the electric push rod drives multiple heat dissipation blocks 22 to move towards the side close to the guide plate 31. During the movement, the second heat conduction film 54 in the heat insulation and heat conduction ball 5 on the second transmission rod 42 squeezes against the sealed heat conduction block 33 in the abutting groove 32. After the second heat conduction film 54 squeezes the sealed heat conduction block 33, the first heat conduction oil 34 in the abutting groove 32 is compressed and enters the heat dissipation bladder 36, causing the heat dissipation bladder 36 to extend and form a thin strip. The second heat conduction film 54 fits with the first heat conduction film 53 to better conduct the heat in the heat absorption particles 23. Under the activation of the conventional heat dissipation mode of the electric heat dissipation fan, the thin strip part where the heat dissipation bladder 36 extends swings under the action of wind force, so as to achieve a better heat dissipation effect, ensure that the heat absorption particles 23 change from liquid state to solid state, and enable them to continue to play a role.

[0033] Through the above design and working principle, the high-efficiency phase change radiator can efficiently transfer the heat of the device to the heat absorption particles 23 when needed, and prevent a large amount of heat from entering when not needed, ensuring that the heat absorption particles 23 are always in the best state. The thin strip formed by the extrusion and extension of the heat dissipation bladder 36 swings under the action of wind force, causing the phase change of the heat absorption particles 23 after heat absorption, and then changing from liquid state to solid state for repeated use. In this way, the heat dissipation system can dynamically adjust the heat dissipation effect according to the actual temperature situation, ensure that the communication device can work stably under various operating conditions, and thus effectively improve the reliability and service life of the device.

[0034] A plurality of evenly distributed electric heat dissipation fans and temperature sensors are installed on the first heat dissipation plate 11. One end of the second heat dissipation plate 12 is fixedly connected with an electric push rod, the output end of the electric push rod is fixedly connected with the moving plate 21, and the temperature sensor is electrically connected with the electric push rod.

[0035] Among them, a plurality of evenly distributed electric heat dissipation fans and temperature sensors are installed on the first heat dissipation plate 11. The function of the electric heat dissipation fan is to dissipate heat through forced convection to ensure that the temperature of the heat dissipation aluminum plate 13 and the surrounding area is kept within a safe range, and the temperature sensor is used to monitor the temperature of the heat dissipation plate in real time.

[0036] When the temperature sensor detects that the temperature exceeds the set threshold range, it will send a signal to activate the electric push rod connected to one end of the second heat dissipation plate 12. The output end of the electric push rod is fixedly connected with the moving plate 21. After activation, it will push the moving plate 21 and the multiple heat dissipation blocks 22 installed thereon into the heat dissipation aluminum plate 13.

[0037] Through automatic control, it is ensured that when the temperature of the device is too high, the heat dissipation blocks 22 can enter the heat dissipation aluminum plate 13 in time for effective heat dissipation, thereby preventing the communication device from being damaged due to overheating. In this way, the heat dissipation system can dynamically adjust the heat dissipation effect according to the actual temperature situation to ensure the stable operation of the device.

[0038] The heat sink 22 is filled with heat-absorbing particles 23, and a heat-conducting capsule 24 is installed around the outside of the heat sink 22. An argon gas is filled in the cavity formed between the heat sink 22 and the heat-conducting capsule 24. A heat-conducting mesh is installed inside the heat-absorbing particles 23, and the heat-conducting mesh is connected to the first transfer rod 41 through a heat-conducting rod. Heat-insulating sleeves are installed around the outside of the first transfer rod 41 and the second transfer rod 42. The material of the heat-absorbing particles 23 is any one of paraffin-based phase change materials and fatty acid-based phase change materials.

[0039] Among them, the heat sink 22 is filled with heat-absorbing particles 23, and the heat-absorbing particles 23 adopt paraffin-based phase change materials or fatty acid-based phase change materials. These phase change materials can undergo phase changes when absorbing heat, so as to store a large amount of thermal energy at higher temperatures and play an effective heat dissipation role.

[0040] Paraffin-based phase change materials are a type of commonly used phase change material PCM, and the main component is paraffin. Paraffin is a mixture composed of alkanes. During the phase change process, paraffin can absorb or release a large amount of heat, and can be repeatedly converted between solid and liquid states. And this phase change process is reversible, with good chemical stability, not easy to undergo chemical reactions, suitable for long-term use. Paraffin is non-toxic and non-corrosive, and is safe to use.

[0041] Fatty acid-based phase change materials are a type of phase change materials composed of fatty acids or their derivatives. Fatty acid-based phase change materials can also absorb or release a large amount of heat during the phase change process. Similar to paraffin, fatty acid-based materials can be repeatedly converted between solid and liquid states, and the phase change process is stable. Fatty acid-based phase change materials show good thermal stability during the phase change process. At the same time, fatty acid-based materials are usually biodegradable and environmentally friendly.

[0042] Paraffin-based phase change materials and fatty acid-based phase change materials each have their own advantages. The former is famous for its high latent heat value, stability and low cost, while the latter is widely popular for its environmental friendliness, low supercooling and good thermal stability. Both materials can effectively absorb and release a large amount of heat during the heat dissipation process, thereby improving the heat dissipation performance of the device and ensuring the stable operation of the device in a high-temperature environment.

[0043] A heat-conducting capsule 24 is installed around the outside of the heat sink 22, and an argon gas is filled in the cavity formed between the heat-conducting capsule 24 and the heat sink 22. The low thermal conductivity of the argon gas is used to prevent a large amount of heat from entering the heat-absorbing particles 23 when not in use, thereby reducing the utilization rate of the heat-absorbing particles 23.

[0044] Specifically, the low thermal conductivity of argon can effectively isolate the heat transfer, preventing a large amount of ambient heat from inadvertently entering the heat-absorbing particles 23 when the heat dissipation component is not activated. This can ensure that the heat-absorbing particles 23 absorb heat for phase change only when needed, that is, when the device temperature is too high, maintaining their efficient heat dissipation performance. A heat conduction mesh is installed inside the heat-absorbing particles 23, and the heat conduction mesh is connected to the first transfer rod 41 through a heat conduction rod. The role of the heat conduction mesh is to strengthen the distribution and transfer of heat inside the heat-absorbing particles 23, thereby improving the overall heat dissipation efficiency.

[0045] When the heat dissipation component 2 is in use, the inner wall of the heat dissipation aluminum plate 13 will squeeze the heat conduction capsule 24, making it closely adhere to the outer wall of the heat dissipation block 22, and transfer the heat to the heat-absorbing particles 23 through the heat conduction capsule 24 and the heat dissipation block 22.

[0046] Heat insulation sleeves are installed outside both the first transfer rod 41 and the second transfer rod 42. The heat insulation sleeves can effectively isolate the heat transfer path, prevent heat from dissipating in unnecessary directions, and thus improve the overall efficiency of the heat dissipation system.

[0047] Through the combination of multi-layer structures and materials, the heat dissipation capacity and efficiency of the heat dissipation block 22 are improved, thereby ensuring that the device can be quickly cooled down during high-temperature operation of the device and guaranteeing the stable operation of the device.

[0048] A butting groove 32 is formed in the guide plate 31. A sealed heat conduction block 33 is slidably connected in the butting groove 32. A heat dissipation capsule 36 is installed in the guide plate 31. A first heat conduction oil 34 is filled in the cavity formed at one end where the sealed heat conduction block 33 and the heat dissipation capsule 36 are close to each other in the butting groove 32.

[0049] A limiting frame 35 is installed on the inner wall of the butting groove 32 on the side where the sealed heat conduction block 33 and the heat dissipation capsule 36 are close to each other. The heat insulation and heat conduction ball 5 includes a heat conduction hemispherical body 51. The heat conduction hemispherical body 51 is embedded in the second transfer rod 42. One end of the heat conduction hemispherical body 51 is fixedly connected with a first heat conduction film 53. A second heat conduction oil 55 is filled in the cavity formed by the heat conduction hemispherical body 51 and the first heat conduction film 53.

[0050] A plurality of uniformly distributed heat conduction columns 52 are fixedly connected to one end of the heat conduction hemispherical body 51 and located inside the first heat conduction film 53. A plurality of uniformly distributed heat conduction fibers are installed outside the heat conduction columns 52. A second heat conduction film 54 is installed outside one end of the heat conduction hemispherical body 51 and located outside the first heat conduction film 53. An argon gas is filled in the cavity formed by the second heat conduction film 54 and the first heat conduction film 53.

[0051] Among them, the heat-absorbing particles 23 absorb heat and undergo a phase change when the device overheats, changing from a solid state to a liquid state. In order to ensure that these heat-absorbing particles 23 can return to the solid state after heat dissipation is completed, heat dissipation treatment is required, which can be carried out at night or when the device temperature has dropped to a safe range.

[0052] The electric push rod drives a plurality of heat dissipation blocks 22 to move towards the side close to the guide plate 31. During the movement, the second heat conduction film 5 in the heat insulation and heat conduction ball 5 on the second transmission rod 42 presses against the sealed heat conduction block 33 in the abutting groove 32.

[0053] After the second heat conduction film 54 presses against the sealed heat conduction block 33, the first heat conduction oil 34 in the abutting groove 32 is compressed and enters the heat dissipation capsule 36, causing the heat dissipation capsule 36 to extend and be in a thin strip shape. At the same time, the second heat conduction film 54 fits with the first heat conduction film 53, so as to better conduct the heat in the heat absorption particles 23.

[0054] Start the electric cooling fan. Through the action of the wind, the thin strip-shaped part where the heat dissipation capsule 36 extends swings, so as to achieve a better heat dissipation effect, ensuring that the heat absorption particles 23 change from liquid to solid state, so that they can continue to play a role.

[0055] The designs of the heat dissipation block 22 and the heat conduction capsule 24, as well as the designs of the first heat conduction film 53 and the second heat conduction film 54, are all to prevent heat from inadvertently entering the heat absorption particles 23 when the heat dissipation component 2 is not in use, thereby reducing their utilization rate.

[0056] Through the above components, the heat of the device can be efficiently transferred to the heat absorption particles 23 when needed, and a large amount of heat can be prevented from entering when not needed, ensuring that the heat absorption particles 23 are always in the best state. At the same time, through the swinging of the thin strip extruded by the heat dissipation capsule 36 under the action of the wind, the heat absorption particles 23 undergo a phase change after absorbing heat and then change from liquid to solid state for repeated use, ensuring that the communication device can work stably under various operating conditions.

[0057] Working principle:

[0058] When the temperature sensor detects that the temperature exceeds the set threshold range, the electric push rod starts, pushing the moving plate 21 and the heat dissipation block 22 into the heat dissipation aluminum plate 13. The inner wall of the heat dissipation aluminum plate 13 presses against the heat conduction capsule 24, making it closely adhere to the outer wall of the heat dissipation block 22, and transferring the heat through the heat conduction capsule 24 and the heat dissipation block 22 to the heat absorption particles 23. The heat absorption particles 23 absorb heat and undergo a phase change when the device is overheated, changing from solid state to liquid state, playing an effective heat dissipation role;

[0059] When the heat dissipation is completed or night comes, the electric push rod drives multiple heat dissipation blocks 22 to move towards the side close to the guide plate 31. During the movement, the second heat conduction film 54 in the heat insulation and heat conduction ball 5 on the second transmission rod 42 squeezes and abuts against the sealed heat conduction block 33 in the abutting groove 32. After the second heat conduction film 54 squeezes the sealed heat conduction block 33, the first heat conduction oil 34 in the abutting groove 32 is compressed and enters the heat dissipation capsule 36, causing the heat dissipation capsule 36 to extend and form a thin strip. The second heat conduction film 54 fits with the first heat conduction film 53 to better conduct the heat in the heat absorption particles 23. Start the electric cooling fan, and through the action of the wind, make the thin strip part of the extended heat dissipation capsule 36 swing, so as to achieve a better heat dissipation effect, ensure that the heat absorption particles 23 change from liquid to solid state, and enable them to continue to play a role;

[0060] The designs of the heat dissipation block 22 and the heat conduction capsule 24, as well as the first heat conduction film 53 and the second heat conduction film 54, are all to prevent heat from inadvertently entering the heat absorption particles 23 when the heat dissipation component 2 is not in use, thereby reducing their utilization rate. Through the above designs and working principles, this high-efficiency phase change radiator can efficiently transfer the heat of the device to the heat absorption particles 23 when needed, and prevent a large amount of heat from entering when not needed, ensuring that the heat absorption particles 23 are always in the best state. The thin strip formed by the extrusion and extension of the heat dissipation capsule 36 swings under the action of the wind, causing the phase change of the heat absorption particles 23 after heat absorption, and then changing from liquid to solid state for repeated use. In this way, the heat dissipation system can dynamically adjust the heat dissipation effect according to the actual temperature situation, ensuring that the communication device can work stably under various operating conditions.

[0061] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0062] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-efficiency phase-change radiator for communication equipment, characterized in that: include: A bottom plate (1), wherein a first heat sink (11) and a second heat sink (12) are fixedly connected to the top of the bottom plate (1), and a heat sink aluminum plate (13) is installed at the top of the bottom plate (1) and between the first heat sink (11) and the second heat sink (12); A heat dissipation component (2), the heat dissipation component (2) being arranged on one side of the heat dissipation aluminum plate (13), and the heat dissipation component (2) comprising a movable plate (21) and a plurality of heat dissipation blocks (22), the plurality of heat dissipation blocks (22) being mounted on the movable plate (21), and the movable plate (21) being slidably connected to the bottom plate (1); A guide assembly (3), the guide assembly (3) comprising a guide plate (31), the guide plate (31) being fixedly connected to one end of the second heat dissipation plate (12); A connection assembly (4), the connection assembly (4) comprising a plurality of first transmission rods (41) and a plurality of second transmission rods (42), the bottom ends of the first transmission rods (41) being fixedly connected to the top ends of the heat sink (22), the top ends of the first transmission rods (41) being fixedly connected to the second transmission rods (42), and the second transmission rods (42) having heat insulating and heat conducting balls (5) installed therein.

2. The high-efficiency phase-change heat sink for communication equipment according to claim 1, characterized in that: A plurality of evenly distributed electric cooling fans and temperature sensors are installed on the first heat dissipation plate (11); an electric push rod is fixedly connected to one end of the second heat dissipation plate (12); an output end of the electric push rod is fixedly connected to the movable plate (21); and the temperature sensor is electrically connected to the electric push rod.

3. The high-efficiency phase-change heat sink for communication equipment according to claim 1, characterized in that: The heat dissipation block (22) is filled with heat absorbing particles (23), and a heat conducting capsule (24) is installed around the heat dissipation block (22), and the cavity formed between the heat dissipation block (22) and the heat conducting capsule (24) is filled with argon gas.

4. The high-efficiency phase-change heat sink for communication equipment according to claim 3, characterized in that: A heat-conducting net is installed inside the heat-absorbing particles (23), and the heat-conducting net is connected to the first transfer rod (41) via a heat-conducting rod. The first transfer rod (41) and the second transfer rod (42) are both surrounded by heat-insulating sleeves.

5. The high-efficiency phase-change heat sink for communication equipment according to claim 3, characterized in that: The material of the heat absorbing particles (23) is any one of a paraffin-based phase change material and a fatty acid-based phase change material.

6. The high-efficiency phase-change heat sink for communication equipment according to claim 1, characterized in that: The guide plate (31) is provided with an abutment groove (32), a sealed heat-conducting block (33) is slidably connected in the abutment groove (32), a heat dissipation bag (36) is installed in the guide plate (31), and a first heat-conducting oil (34) is filled in the abutment groove (32) and in a cavity formed by the sealed heat-conducting block (33) and the heat dissipation bag (36) at one end close to each other.

7. The high-efficiency phase-change heat sink for communication equipment according to claim 6, characterized in that: A limiting frame (35) is installed on the inner wall of the abutment groove (32) and the only sealed heat-conducting block (33) and the heat-dissipating bag (36) close to each other.

8. The high-efficiency phase-change heat sink for communication equipment according to claim 1, characterized in that: The heat-insulating heat-conducting ball (5) comprises a heat-conducting hemisphere (51), the heat-conducting hemisphere (51) is embedded in the second transfer rod (42), one end of the heat-conducting hemisphere (51) is fixedly connected to a first heat-conducting film (53), and the cavity formed by the heat-conducting hemisphere (51) and the first heat-conducting film (53) is filled with a second heat-conducting oil (55).

9. The high-efficiency phase-change heat sink for communication equipment according to claim 8, characterized in that: A plurality of evenly distributed heat-conducting columns (52) are fixedly connected to one end of the heat-conducting hemisphere (51) and located inside the first heat-conducting film (53), and a plurality of evenly distributed heat-conducting fibers are installed around the heat-conducting columns (52).

10. The high-efficiency phase-change heat sink for communication equipment according to claim 8, characterized in that: A second heat-conducting film (54) is installed at one end of the heat-conducting hemisphere (51) and is located outside the first heat-conducting film (53), and the cavity formed by the second heat-conducting film (54) and the first heat-conducting film (53) is filled with argon gas.

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