Novel RGB lamp bead packaging process

Abstract

The invention discloses a novel RGB (Red, Green and Blue) lamp bead packaging process, which comprises the following steps of: S1, manufacturing a flat plate bracket, obtaining an RLED (Red Light Emitting Diode) wafer, a GLED (Glue Light Emitting Diode) wafer and a BLED (Blue Light Emitting Diode) wafer, and fixing the wafers on the flat plate bracket and electrically connecting the wafers with the flat plate bracket to form an RGB assembly; s2, mold closing, vacuumizing, glue injection and heating mold pressing are conducted on the RGB assembly through a mold pressing machine, a light-transmitting cover plate is manufactured on the RGB assembly through mold pressing, and the light-transmitting cover plate is made to be in a specific shape through mold pressing; s3, putting the product obtained in the step S2 into an oven for constant-temperature heating, and thoroughly curing the light-transmitting cover plate; and S4, slitting the product obtained in the step S3, carrying out batch detection to obtain an RGB lamp bead product, regulating the voltage and current, and regulating the light intensity of each wafer, so that the product is adaptive to different color gamut requirements and color temperature requirements, better degree of freedom can be obtained, and the color gamut matching degree is higher.

Description

Technical Field

[0001] The present invention relates to the field of LEDs, and specifically to a new RGB lamp bead packaging process. Background Art

[0002] LEDs are widely used, and different types of LED products are applied in different industries, including signal indication, display, backlight, and lighting, etc.

[0003] Basically, existing backlight LED high-color gamut products use blue chips to excite red and green phosphors to emit white light, which is a common packaging method in the current industry. The limitations of this solution are relatively large, and it is impossible to provide diversified solutions for customers through powder blending.

[0004] The patent with the publication number CN114520220A discloses a packaging structure and a packaging method of a three-color LED chip. The packaging structure includes an LED bracket, a driving integrated circuit, and a three-color LED chip.

[0005] Existing common technologies all obtain white light by exciting phosphors of multiple colors with a single color light, and cannot flexibly adjust various parameters of the emitted light well. At the same time, the improved technologies still require a containing type or cutting type bracket, and the colloid is encapsulated inside the bracket bowl cup, and its light source cannot be fully displayed, with a certain degree of occlusion. Summary of the Invention

[0006] The purpose of the present invention is to provide a new RGB lamp bead packaging process to improve the overall working efficiency in view of the above existing problems and deficiencies.

[0007] The present invention solves at least one of the following technical problems:

[0008] (1) In the prior art, various parameters of the emitted light cannot be flexibly adjusted well;

[0009] (2) The light source of the improved technology cannot be fully displayed, with a certain degree of occlusion.

[0010] The purpose of the present invention can be achieved through the following technical solutions: A new RGB lamp bead packaging process includes the following steps:

[0011] Step S1: Manufacture a flat bracket, obtain RLED wafers, GLED wafers, and BLED wafers, fix each wafer on the flat bracket and electrically connect it to the flat bracket to form an RGB component;

[0012] Step S2: Use a molding press to close the mold, evacuate, inject glue, and heat-mold the RGB component, mold and manufacture a light-transmitting cover plate on the RGB component, and make the light-transmitting cover plate form a specific shape through molding;

[0013] Step S3: Put the product obtained in step S2 into an oven for constant-temperature heating to completely cure the light-transmitting cover plate;

[0014] Step S4: Cut the product obtained in step S3 and conduct batch inspections to obtain RGB LED products.

[0015] As a further solution of the invention, step S1 includes the following steps:

[0016] Step S11: Obtain a COB printed circuit board and make a flat bracket;

[0017] Step S12: Assemble the RLED chip, GLED chip, and BLED chip to the corresponding metal negative electrodes respectively;

[0018] Step S13: Place the product obtained in step S12 in an oven for step-by-step baking to complete the curing of the die-bonding glue and the welding of the negative electrodes of the RLED chip, GLED chip, and BLED chip to their respective corresponding metal negative electrodes;

[0019] Step S14: Use a wire bonder to electrically connect the positive electrodes of the RLED chip, GLED chip, and BLED chip to their respective corresponding metal positive electrodes.

[0020] As a further solution of the invention, step S11 includes the following steps:

[0021] Step S111, Print circuit: Make power supply circuits for the RLED chip, GLED chip, and BLED chip respectively on the COB printed circuit board, so as to generate several pairs of metal positive electrodes and metal negative electrodes on the upper surface of the COB printed circuit board;

[0022] Step S112, Mark and locate: Generate die-bonding position marks and COB package welding points correspondingly on each metal negative electrode.

[0023] As a further solution of the invention, in step S111, die-bonding position marks and COB package welding points independently corresponding to the RLED chip, GLED chip, and BLED chip are respectively provided on the metal negative electrodes, and the COB package welding points are located within the die-bonding position marks.

[0024] As a further solution of the invention, step S12 includes the following steps:

[0025] Step S121, Apply glue: Apply die-bonding glue to the die-bonding connection surfaces of the RLED chip, GLED chip, and BLED chip;

[0026] Step S122, positioning and placing: The coated RLED chips, GLED chips, and BLED chips are respectively placed on their corresponding metal negative electrodes by a die bonder, and the negative electrodes of the RLED chips, GLED chips, and BLED chips are bonded to the COB packaging welding points on the corresponding metal negative electrodes.

[0027] As a further aspect of the invention, in step S2, the used molding press is provided with an upper mold and a lower mold. During molding, after the upper mold and the lower mold are closed, air is evacuated inside the mold to form a vacuum environment, and then the cover plate glue is injected into the upper mold, so that the cover plate glue covers the upper surface of the RGB component, and the shape of the cover plate glue is restricted by the inner side wall of the upper mold. Subsequently, the upper mold is heated to preliminarily cure the cover plate glue inside the mold.

[0028] As a further aspect of the invention, the cover plate glue in step S2 is a colorless and transparent glue, and the shape of the cover plate glue includes one or several superpositions of convex lens shape, concave lens shape, and flat plate shape.

[0029] As a further aspect of the invention, the RGB lamp bead includes an RGB component and a light-transmitting cover plate. The RGB component includes a flat plate bracket and chips. The flat plate bracket includes a COB printed circuit board. A plurality of pairs of metal positive electrodes and metal negative electrodes are provided on the COB printed circuit board. The chips include RLED chips, GLED chips, and BLED chips, and the RLED chips, GLED chips, and BLED chips respectively correspond to one of the pairs of metal positive electrodes and metal negative electrodes.

[0030] As a further aspect of the invention, the die bonding ends of the metal negative electrodes are all gathered in the middle of the COB printed circuit board and are evenly distributed in a circular array.

[0031] As a further aspect of the invention, in step S1, each chip selects a vertical structure LED chip, and the lower part of each chip is the chip negative electrode and the upper part is the positive electrode.

[0032] The beneficial effects of the present invention:

[0033] (1) During operation, the current is adjusted to emit white light. First, the color gamut is greatly improved. Secondly, by adjusting the voltage and current, the light intensity of each chip can be adjusted to make the product adapt to different color gamut requirements and color temperature requirements, and better freedom can be obtained, and the color gamut matching degree is higher, so that the product solution is more diversified and applicable to a wider color gamut range and color temperature range;

[0034] (2) During operation, the compression dispensing process is selected. By setting the light-transmitting cover plate, it can not only wrap and protect each component on the RGB component, but also form a stable structure in combination with the COB printed circuit board for support. Moreover, it will not cause any obstruction to the illuminated wafers, effectively increasing the light-emitting area and gamut value of the lamp beads, ensuring the best light-emitting angle and the lowest absorption loss, and achieving the best light-emitting effect.

[0035] (3) During operation, it can be flexibly adjusted during the working process, with better spectral continuity, and can more evenly cover the visible spectrum. By precisely controlling the light intensity ratio of different color LEDs, the spectrum after mixing light can be made closer to natural light, thereby improving the color rendering index, and the color saturation and overall brightness after mixing light can be flexibly changed by adjusting the light intensity.

[0036] (4) During operation, full-wafer encapsulation is adopted without phosphor powder, and the gamut scheme is not limited. The subsequent lighting and light mixing effect is more natural and uniform compared with the traditional fluorescence excitation mode, and the visual effect is better.

[0037] (5) During operation, the compression glue curing process is adopted, which can achieve five-sided light emission, with a larger light-emitting angle and more uniform light output, and can reduce the number of lamp beads, reducing costs and increasing efficiency.

[0038] (6) During operation, by setting the light-transmitting cover plate and molding its surface shape, the light-emitting effect can be further adjusted, increasing more possibilities, avoiding the problem of being unable to adapt due to the interference of its own contents, and improving its scope of application. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] For the convenience of those skilled in the art to understand, the present invention will be further described below in conjunction with the accompanying drawings.

[0040] Figure 1 It is the process flow chart of the present invention;

[0041] Figure 2 It is the process flow chart of step S1 of the present invention;

[0042] Figure 3 It is the process flow chart of step S11 of the present invention;

[0043] Figure 4 It is the process flow chart of step S12 of the present invention;

[0044] Figure 5 It is the top view of the overall structure of the RGB component of the present invention;

[0045] Figure 6 It is the top view of the overall structure of the flat bracket of the present invention;

[0046] Figure 7Side view of the overall structure of the present invention;

[0047] In the figure: 100, RGB component; 110, flat bracket; 111, COB printed circuit board; 112, metal positive electrode sheet; 113, metal negative electrode sheet; 200, light-transmitting cover plate; 201, RLED chip; 202, GLED chip; 203, BLED chip. Detailed implementation manners

[0048] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following, in combination with the accompanying drawings and preferred embodiments, details the specific implementation manners, structures, features and their effects of the present invention as follows.

[0049] Please refer to Figure 1-7 As shown: A new RGB lamp bead encapsulation process includes the following steps:

[0050] Step S1, board making, die bonding and electrical connection: Make the flat bracket 110, obtain the RLED chip 201, GLED chip 202, and BLED chip 203, die bond each chip on the flat bracket 110 and electrically connect it to the flat bracket 110 to form the RGB component 100;

[0051] Step S2, molding and sizing: Through a molding press, perform mold closing, vacuum pumping, glue injection and heating molding on the RGB component 100, mold and make the light-transmitting cover plate 200 on the RGB component 100, and make the light-transmitting cover plate 200 form a specific shape through molding;

[0052] Step S3, curing: Put the product obtained in step S2 into an oven for constant temperature heating to thoroughly cure the light-transmitting cover plate 200;

[0053] Step S4, cutting: Cut the product obtained in step S3 and perform batch inspection to obtain RGB lamp bead products.

[0054] When this embodiment works, the upper surface of the light-transmitting cover plate 200 is a horizontal surface, and the four sides of the light-transmitting cover plate 200 are flush with the four sides of the RGB component 100.

[0055] In step S1, each chip selects a vertical structure LED chip, and the lower part of each chip is the chip negative electrode and the upper part is the positive electrode.

[0056] The RGB light-emitting diode includes an RGB component 100 and a light-transmitting cover plate 200. The RGB component 100 includes a flat support 110 and wafers. The flat support 110 includes a COB printed circuit board 111. A plurality of pairs of metal positive electrodes 112 and metal negative electrodes 113 are provided on the COB printed circuit board 111. The wafers include an RLED wafer 201, a GLED wafer 202, and a BLED wafer 203. The RLED wafer 201, the GLED wafer 202, and the BLED wafer 203 respectively correspond to one pair of the metal positive electrodes 112 and the metal negative electrodes 113.

[0057] Step S1 includes the following steps:

[0058] Step S11, board manufacturing: Obtain the COB printed circuit board 111 and manufacture the flat support 110;

[0059] Step S12, assembly: Assemble the RLED wafer 201, the GLED wafer 202, and the BLED wafer 203 onto the corresponding metal negative electrodes 113 respectively;

[0060] Step S13, die bonding: Place the product obtained in step S12 in an oven and bake it step by step to complete the curing of the die bonding glue and the welding of the negative electrodes of the RLED wafer 201, the GLED wafer 202, and the BLED wafer 203 to their respective corresponding metal negative electrodes 113;

[0061] Step S14, wire connection: Use a wire bonding machine to electrically connect the positive electrodes of the RLED wafer 201, the GLED wafer 202, and the BLED wafer 203 to their respective corresponding metal positive electrodes 112.

[0062] Step S11 includes the following steps:

[0063] Step S111, printed circuit: Manufacture power supply circuits for the RLED wafer 201, the GLED wafer 202, and the BLED wafer 203 respectively on the COB printed circuit board 111, so as to generate a plurality of pairs of metal positive electrodes 112 and metal negative electrodes 113 on the upper surface of the COB printed circuit board 111;

[0064] Step S112, marking and positioning: Generate die bonding position marks and COB package welding points correspondingly on each of the metal negative electrodes 113.

[0065] In step S111, die bonding position marks and COB package welding points independently corresponding to the RLED wafer 201, the GLED wafer 202, and the BLED wafer 203 are respectively provided on the metal negative electrodes 113, and the COB package welding points are located within the die bonding position marks. The end where the die bonding position marks are located is the die bonding end of the metal negative electrode 113, and the other end of the metal negative electrode 113 is the power connection end;

[0066] The die bonding ends of the metal negative electrode sheets 113 in this embodiment are all gathered in the middle of the COB printed circuit board 111 and are evenly distributed in a circular array;

[0067] All the metal positive electrode sheets 112 are located on one side of the flat bracket 110, and the power connection ends of all the metal negative electrode sheets 113 are located on the other side of the flat bracket 110.

[0068] Step S12 includes the following steps:

[0069] Step S121, Glue application: Apply die bonding glue on the die bonding connection surfaces of the RLED chip 201, GLED chip 202, and BLED chip 203;

[0070] Step S122, Positioning and placing: Through a die bonder, place the RLED chip 201, GLED chip 202, and BLED chip 203 coated with die bonding glue on their respective metal negative electrode sheets 113, and bond the negative electrodes of the RLED chip 201, GLED chip 202, and BLED chip 203 to the COB packaging welding points on the corresponding metal negative electrode sheets 113.

[0071] In step S2, the used molding press is provided with an upper mold and a lower mold. During molding, after the upper mold and the lower mold are closed, air is evacuated inside the mold to form a vacuum environment, and then the cover plate glue is injected into the upper mold, so that the cover plate glue covers the upper surface of the RGB component 100, and the shape of the cover plate glue is restricted by the inner side wall of the upper mold. Subsequently, the upper mold is heated to preliminarily cure the cover plate glue inside the mold;

[0072] During the operation of this embodiment, the shape of the cover plate glue includes one or several superpositions of a convex lens shape, a concave lens shape, and a flat shape.

[0073] The RLED chip 201, GLED chip 202, and BLED chip 203 are each provided with at least one, and are designed in terms of quantity and arrangement according to the lighting requirements. In this embodiment, the RLED chip 201, GLED chip 202, and BLED chip 203 are each set to one and are distributed in a triangular array.

[0074] The cover plate glue in step S2 is a colorless and transparent glue.

[0075] The light-transmitting cover plate 200 wraps and protects each component on the RGB component 100 to prevent external erosion. The colorless and transparency of the light-transmitting cover plate 200 enables the emitted light of each chip to have no obstruction, thereby forming the largest emission angle and facilitating subsequent further processing, thus having a wide range of applications;

[0076] During the operation of this embodiment, after step S4, glue liquid is sprayed on the top and around each of the cut RGB lamp beads. The sprayed glue liquid can be one or several superpositions of light mixing glue liquid, anti-glare glue liquid or light halo glue liquid. And the glue liquid is fully and evenly coated on the outer surface of the light-transmitting cover plate 200, so as to further improve the consistency of the emitted light at various angles and obtain a better color temperature range and color gamut range.

[0077] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A new RGB lamp bead packaging process, characterized in that: The steps include: Step S1: manufacturing a flat plate support (110), obtaining an RLED chip (201), a GLED chip (202), and a BLED chip (203), bonding each chip on the flat plate support (110) and electrically connecting the flat plate support (110) to form an RGB component (100); Step S2: using a molding machine to mold, evacuate, inject glue, and heat the RGB component (100), and molding the transparent cover plate (200) on the RGB component (100), and forming the transparent cover plate (200) into a specific shape through molding; Step S3: placing the product obtained in step S2 into an oven and heating it at a constant temperature to completely solidify the light-transmitting cover plate (200); Step S4: Cut the product obtained in step S3 into pieces and perform batch testing to obtain RGB lamp bead products.

2. According to the novel RGB lamp bead packaging process of claim 1, it is characterized in that: Step S1 includes the following steps: Step S11: Obtain a COB printed circuit board (111) and manufacture a flat panel bracket (110); Step S12: Assembling the RLED chip (201), the GLED chip (202) and the BLED chip (203) onto the corresponding metal cathode sheet (113) respectively; Step S13: placing the product obtained in step S12 in an oven and baking it in steps to complete the curing of the die-bonding adhesive and the welding of the cathodes of the RLED chip (201), the GLED chip (202) and the BLED chip (203) and their corresponding metal cathode sheets (113); Step S14: Use a wire bonding machine to electrically connect the positive electrodes of the RLED chip (201), the GLED chip (202) and the BLED chip (203) to their corresponding metal positive electrode sheets (112).

3. According to the new RGB lamp bead packaging process of claim 2, it is characterized in that: Step S11 includes the following steps: Step S111, printed circuit: power supply circuits are respectively made for the RLED chip (201), the GLED chip (202) and the BLED chip (203) on the COB printed board (111), thereby generating a plurality of pairs of metal positive electrode sheets (112) and metal negative electrode sheets (113) on the upper surface of the COB printed board (111); Step S112, marking and positioning: generating corresponding die-bonding position marks and COB packaging welding points on each metal negative electrode sheet (113).

4. According to the novel RGB lamp bead packaging process of claim 3, it is characterized in that: In step S111, the metal negative electrode sheet (113) is provided with die-bonding position marks and COB packaging welding points independently corresponding to the RLED chip (201), the GLED chip (202) and the BLED chip (203), and the COB packaging welding points are located within the die-bonding position marks.

5. According to the novel RGB lamp bead packaging process of claim 2, it is characterized in that: Step S12 includes the following steps: Step S121, coating: coating the bonding adhesive on the bonding connection surfaces of the RLED chip (201), the GLED chip (202) and the BLED chip (203); Step S122, positioning and placement: the RLED chip (201), GLED chip (202) and BLED chip (203) coated with the bonding glue are placed on their respective metal cathode sheets (113) by a bonding machine, and the cathodes of the RLED chip (201), GLED chip (202) and BLED chip (203) are bonded to the COB packaging welding points on the corresponding metal cathode sheets (113).

6. According to the novel RGB lamp bead packaging process of claim 1, it is characterized in that: In step S2, the molding machine used is provided with an upper mold and a lower mold. During molding, after the upper mold and the lower mold are closed, the mold is evacuated to form a vacuum environment, and then the cover glue is injected into the upper mold so that the cover glue covers the upper surface of the RGB component (100), and the shape of the cover glue is restricted by the inner side wall of the upper mold. Subsequently, the upper mold is heated to allow the cover glue to be initially cured in the mold.

7. A novel RGB lamp bead packaging process according to claim 6, characterized in that: The cover glue in step S2 is colorless and transparent glue, and the shape of the cover glue includes one or a combination of convex lens, concave lens and flat plate.

8. According to the novel RGB lamp bead packaging process of claim 1, it is characterized in that: The RGB lamp bead comprises an RGB component (100) and a light-transmitting cover plate (200); the RGB component (100) comprises a flat panel support (110) and a chip; the flat panel support (110) comprises a COB printed board (111); a plurality of pairs of metal positive electrode sheets (112) and metal negative electrode sheets (113) are arranged on the COB printed board (111); the chip comprises an RLED chip (201), a GLED chip (202) and a BLED chip (203); the RLED chip (201), the GLED chip (202) and the BLED chip (203) respectively correspond to one pair of metal positive electrode sheets (112) and metal negative electrode sheets (113).

9. According to the novel RGB lamp bead packaging process of claim 4, it is characterized in that: The crystal-bonding ends of the metal negative electrode sheets (113) are gathered in the middle of the COB printed board (111) and are evenly distributed in a circular array.

10. The novel RGB lamp bead packaging process according to claim 1, characterized in that: In step S1 , each chip is a vertical structure LED chip, and the bottom of each chip is the chip cathode and the top is the chip anode.

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