Device and process for cleaning tin ash and impurities on surface of tinned copper conductor

Abstract

The invention discloses a device and a process for cleaning tin ash and impurities on the surface of a tinned copper conductor, and relates to the technical field of tinned copper conductor processing, the cleaning device comprises an output module used for outputting a tinned copper conductor to be processed and an input module used for inputting the processed tinned copper conductor; an ultrasonic cleaning module is arranged between the output module and the input module, the ultrasonic cleaning module comprises a first cleaning box and a second cleaning box which are symmetrically arranged between the output module and the input module, and two sets of first fixed pulleys used for penetrating through tinned copper conductors are symmetrically and rotationally arranged at a box opening of the first cleaning box; two groups of first movable pulleys are symmetrically and rotationally arranged in the first cleaning box; two groups of second fixed pulleys for penetrating through the tinned copper conductor are symmetrically and rotationally arranged at the box opening of the second cleaning box, and two groups of second movable pulleys are symmetrically and rotationally arranged in the second cleaning box; and when any group of cleaning boxes are cleaned, the normal treatment process of the tinned copper conductor does not need to be stopped, so that the processing efficiency is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of tin-plated copper conductor processing, and specifically relates to a device and process for cleaning tin ash and impurities on the surface of a tin-plated copper conductor. Background Art

[0002] The reasons for the existence of tin ash and impurities on the surface of tinned copper wire may involve multiple aspects. For example: Flux quality: If the flux used has poor quality or is too acidic, it may react with the tin solution during the tin-plating process, generating tin ash and other impurities; Oil stains on the surface of the copper wire: If there are oil stains on the surface of the copper wire before tin-plating, these oil stains may burn due to high temperature during the tin-plating process, producing ashes and impurities that adhere to the surface of the copper wire; Tin-plating temperature: Too high tin-plating temperature may cause impurities in the tin solution to precipitate more easily, forming tin ash. At the same time, high temperature may also accelerate the reaction between the flux and the tin solution, generating more impurities.

[0003] The attachment of tin ash and impurities to the surface of the tin-plated copper conductor will affect its appearance quality and electrical conductivity. Through cleaning, these harmful substances can be removed to ensure that the appearance and performance of the product meet the standards. At the same time, the tin ash and impurities may contain components harmful to the copper conductor, and long-term existence will cause corrosion of the copper conductor, thereby affecting its service life and performance.

[0004] Currently, when cleaning tin ash and impurities on the surface of a tin-plated copper conductor, the tin-plated copper conductor is usually placed in an ultrasonic cleaning machine, and an appropriate amount of cleaning agent and water are added. The ultrasonic cleaning machine is turned on, and the tin ash and impurities on the surface are removed by the vibration of ultrasonic waves. This method has high cleaning efficiency and is suitable for cleaning a large number of tin-plated copper conductors;

[0005] In the actual application process, when the ultrasonic cleaning machine is used for a period of time, a lot of impurities washed down will be suspended in the cleaning liquid. If the cleaning liquid is not cleaned or replaced in time, it will affect the normal cleaning of tin ash and impurities on the surface of the subsequent tin-plated copper conductor, resulting in incomplete cleaning. When cleaning, it is necessary to pre-stop the ultrasonic cleaning machine for treatment, but the stop treatment will affect the processing progress. Summary of the Invention

[0006] The purpose of the present invention is to provide a device for cleaning tin ash and impurities on the surface of a tin-plated copper conductor, and solve the following technical problems:

[0007] When using an ultrasonic cleaning machine to clean tin ash and impurities on the surface of a tin-plated copper conductor, a lot of impurities washed down will be suspended in the cleaning liquid. If not processed or replaced in time, it will affect the normal cleaning of tin ash and impurities on the surface of the subsequent tin-plated copper conductor, but stopping the machine will also affect the normal processing progress.

[0008] The purpose of the present invention can be achieved through the following technical solutions:

[0009] A device for cleaning tin ash and impurities on the surface of a tinned copper conductor, comprising an output module for outputting the tinned copper conductor to be processed and an input module for inputting the processed tinned copper conductor;

[0010] An ultrasonic cleaning module is arranged between the output module and the input module. The ultrasonic cleaning module includes a first cleaning tank and a second cleaning tank symmetrically arranged between the output module and the input module. At the opening of the first cleaning tank, two groups of first fixed pulleys for passing through the tinned copper conductor are symmetrically and rotatably arranged. Two groups of first movable pulleys are symmetrically and rotatably arranged in the first cleaning tank;

[0011] At the opening of the second cleaning tank, two groups of second fixed pulleys for passing through the tinned copper conductor are symmetrically and rotatably arranged. Two groups of second movable pulleys are symmetrically and rotatably arranged in the second cleaning tank.

[0012] Preferably, cleaning modules are respectively arranged in the first cleaning tank and the second cleaning tank for treating impurities in the cleaning liquid.

[0013] Preferably, the two groups of first movable pulleys are rotatably arranged on one side of the first lifting frame, and the two groups of second movable pulleys are rotatably arranged on one side of the second lifting frame. The ultrasonic cleaning module further includes a lifting mechanism for driving the first lifting frame and the second lifting frame to lift;

[0014] Among them, the first lifting frame and the second lifting frame move in opposite directions.

[0015] Preferably, the lifting mechanism includes a driving motor fixed between the first cleaning tank and the second cleaning tank. The output end of the driving motor is fixed to a gear. The first lifting frame is fixed to a first rack arranged outside the first cleaning tank, and the second lifting frame is fixed to a second rack arranged outside the second cleaning tank. Both the first rack and the second rack are engaged with the gear, and the first rack and the second rack are arranged in a parallel and offset manner.

[0016] Preferably, guide rods are fixedly arranged on the outer sides of the first cleaning tank and the second cleaning tank, and the first lifting frame and the second lifting frame are both slidably sleeved on the guide rods.

[0017] Preferably, the cleaning module includes through grooves opened at the bottom of the first cleaning tank and the second cleaning tank. The bottom plate is slidably embedded at the bottom of the through groove, and side plates are symmetrically and fixedly arranged on the bottom plate and slidably attached to the inner wall of the through groove;

[0018] Among them, a first baffle that is slidably attached to the inner wall of the through groove is also slidably arranged on one side of the bottom plate, and second baffles are symmetrically arranged on the other side. The first baffle, the second baffles, the bottom plate and the side plates enclose a sedimentation chamber.

[0019] Preferably, a first partition plate is vertically and fixedly arranged on one side of the first baffle plate facing the second baffle plate, and a second partition plate is vertically and fixedly arranged on one side of the second baffle plate facing the first baffle plate. The first partition plate and the second partition plate are respectively in sliding fit with the groove walls of the through groove. A first sealing plate is fixedly arranged on the box wall outside one side of the through groove, and the lower surface of the first sealing plate is flush with the upper groove wall of the through groove. A second sealing plate is fixedly arranged on the side of the second baffle plate away from the first baffle plate, and a clamping groove for embedding the side plate is formed at the connection end of the second sealing plate and the second baffle plate;

[0020] Wherein, a top rod is fixedly arranged at the bottom of the first sealing plate, the end of the top rod is fixed to the first baffle plate, a support is fixedly arranged at the bottom of the second sealing plate, the support is slidably sleeved on the driving rod, the other end of the driving rod is fixed to the push rod, a telescopic spring is further arranged on the driving rod, and a driving mechanism is fixedly arranged outside the cleaning box, and the driving end of the driving mechanism is fixed to the driving rod.

[0021] Preferably, the output module includes an unwinding roller for unwinding the tinned copper conductor, and the unwinding roller is rotatably arranged on one side of the unwinding frame.

[0022] Preferably, the input module includes a winding roller for winding the tinned copper conductor, and the winding roller is rotatably arranged on one side of the winding frame;

[0023] Wherein, the winding roller is fixed to the output end of a winding motor fixed on one side of the winding frame for driving the winding roller to rotate.

[0024] A process for cleaning tin ash and impurities on the surface of a tinned copper conductor, which is applied to the above-mentioned device for cleaning tin ash and impurities on the surface of a tinned copper conductor, includes the following steps:

[0025] Wind the tinned copper conductor around the unwinding roller and output it from the unwinding roller;

[0026] After the tinned copper conductor is output by the output module, it sequentially passes through the first cleaning box and the second cleaning box for ultrasonic cleaning;

[0027] By setting two groups of ultrasonic cleaning boxes, after cleaning for a period of time, close any one of the ultrasonic cleaning boxes, and the other ultrasonic cleaning box is in normal operation to treat the impurities in the cleaning liquid in the closed ultrasonic cleaning box, while the other ultrasonic cleaning box is in normal operation, and so on;

[0028] The treated tinned copper conductor is wound around the winding roller.

[0029] Advantages of the present invention:

[0030] (1) After the tin-plated copper conductor to be processed is output by the output module, it can pass through the first fixed pulley, the first movable pulley, the second fixed pulley, and the second movable pulley in sequence and then be conveyed towards the input module. The first cleaning tank and the second cleaning tank in this embodiment are both ultrasonic cleaning tanks, and there is a certain height of cleaning liquid stored inside. The conveying route of the tin-plated copper conductor in the first cleaning tank and the second cleaning tank is in a 'U' shape, so that the tin-plated copper conductor can be immersed in the cleaning liquid, and thus the effect of ultrasonic cleaning can be achieved;

[0031] (2) By setting two groups of ultrasonic cleaning tanks, after ultrasonic cleaning for a period of time, the lifting mechanism drives the first lifting frame to descend a certain height in the first cleaning tank. At the same time, the lifting mechanism drives the second lifting frame to ascend a certain height in the second cleaning tank. The height by which the first lifting frame descends is the same as the height by which the second lifting frame ascends, and after the second lifting frame ascends, it is separated from the ultrasonic cleaning liquid in the second cleaning tank. At this time, the second cleaning tank can be shut down, and the impurities contained in the ultrasonic cleaning liquid can be cleaned by the cleaning module. Correspondingly, after the second cleaning tank is cleaned, the lifting mechanism can drive the first lifting frame to ascend to be separated from the ultrasonic cleaning liquid, while the second lifting frame descends into the ultrasonic cleaning liquid to realize the interchange of their position heights, and then the impurities contained in the ultrasonic cleaning liquid in the first cleaning tank can be cleaned. After the cleaning is completed, finally, the lifting mechanism drives the first lifting frame and the second lifting frame to move to the initial position again to process the impurities on the surface of the tin-plated copper conductor. In this way, when cleaning any one of the cleaning tanks, the normal processing process of the tin-plated copper conductor does not need to be stopped, ensuring the stability of the processing efficiency. Description of the Drawings

[0032] The present invention will be further described below with reference to the accompanying drawings.

[0033] Figure 1 is a schematic structural diagram of a device for cleaning tin ash and impurities on the surface of a tin-plated copper conductor according to the present invention;

[0034] Figure 2 is a front view structural diagram of a device for cleaning tin ash and impurities on the surface of a tin-plated copper conductor according to the present invention;

[0035] Figure 3 is a schematic structural diagram of the cleaning tank in a device for cleaning tin ash and impurities on the surface of a tin-plated copper conductor according to the present invention Figure 1 ;

[0036] Figure 4 is a schematic structural diagram of the cleaning tank in a device for cleaning tin ash and impurities on the surface of a tin-plated copper conductor according to the present invention Figure 2 ;

[0037] Figure 5It is a schematic structural diagram inside the cleaning tank in a device for cleaning tin ash and impurities on the surface of a tinned copper conductor according to the present invention;

[0038] Figure 6 It is a schematic structural diagram of the sealing plate in a device for cleaning tin ash and impurities on the surface of a tinned copper conductor according to the present invention;

[0039] Figure 7 It is a schematic sectional view of the cleaning tank in a device for cleaning tin ash and impurities on the surface of a tinned copper conductor according to the present invention;

[0040] Figure 8 It is a schematic structural diagram of the bottom plate in a device for cleaning tin ash and impurities on the surface of a tinned copper conductor according to the present invention;

[0041] Figure 9 It is a schematic structural diagram of the movement process of the bottom plate in a device for cleaning tin ash and impurities on the surface of a tinned copper conductor according to the present invention.

[0042] In the figure: 1. Output module; 2. Ultrasonic cleaning module; 3. Input module; 4. Tinned copper conductor; 5. Driving mechanism; 6. Driving motor; 7. Through groove; 101. Unwinding roller; 102. Unwinding frame; 201. First cleaning tank; 202. Second cleaning tank; 203. First fixed pulley; 204. First movable pulley; 205. Second fixed pulley; 206. Second movable pulley; 207. First lifting frame; 208. Second lifting frame; 301. Winding roller; 302. Winding frame; 303. Winding motor; 304. Guide wheel; 501. Second sealing plate; 502. First sealing plate; 503. Jacking rod; 504. Driving rod; 505. Telescopic spring; 506. Support; 507. Push rod; 601. Gear; 602. Second rack; 603. First rack; 604. Guide rod; 701. Storage cavity; 702. Bottom plate; 703. First baffle; 704. First partition; 705. Card slot; 706. Second partition; 707. Side plate; 708. Second baffle. Detailed implementation manners

[0043] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0044] Embodiment 1

[0045] Please refer to Figure 1 - Figure 2 As shown, the present invention is a device for cleaning tin ash and impurities on the surface of a tinned copper conductor, including an output module 1 for outputting the tinned copper conductor 4 to be processed and an input module 3 for inputting the processed tinned copper conductor 4;

[0046] Specifically, in this embodiment, the output module 1 includes an unwinding roller 101 for unwinding the tinned copper conductor 4. The unwinding roller 101 is rotatably disposed on one side of the unwinding frame 102 and can wind the tinned copper conductor around the unwinding roller 101. When cleaning the tin ash and impurities on the surface of the tinned copper conductor 4, the tinned copper conductor 4 is output from the unwinding roller 101.

[0047] The input module 3 includes a winding roller 301 for winding the tinned copper conductor 4. The winding roller 301 is rotatably disposed on one side of the winding frame 302 and can wind the processed tinned copper conductor 4 around the winding roller 301. Among them, the winding roller 301 is fixed to the output end of a winding motor 303 fixed on one side of the winding frame 302 to drive the winding roller 301 to rotate and achieve the winding effect.

[0048] In addition, a guide wheel 304 is rotatably disposed on one side of the winding roller 301, and the guide wheel 304 is connected to a servo drive device that drives it to reciprocate axially along the winding roller 301. Specifically, when winding the processed tinned copper conductor 4 in this embodiment, the tinned copper conductor 4 can be passed through the guide wheel 304 and then wound around the winding roller 301. During the winding process, the servo drive device drives the guide wheel 304 to reciprocate axially along the winding roller 301 to wind the tinned copper conductor 4 evenly on the winding roller 301.

[0049] It should be noted that the servo drive device in this embodiment can adopt servo drive components such as electric cylinders or air cylinders, and this embodiment does not limit this. Correspondingly, the output module 1 and the input module 3 in this embodiment are both prior arts, and their specific working principles and structures are not limited.

[0050] As a further solution of this embodiment, reference can be made to Figure 2 - Figure 4, there is an ultrasonic cleaning module 2 between the output module 1 and the input module 3. The ultrasonic cleaning module 2 includes a first cleaning tank 201 and a second cleaning tank 202 symmetrically arranged between the output module 1 and the input module 3. At the opening of the first cleaning tank 201, two groups of first fixed pulleys 203 for passing through the tinned copper conductor 4 are symmetrically and rotatably arranged. Two groups of first movable pulleys 204 are symmetrically and rotatably arranged in the first cleaning tank 201. At the opening of the second cleaning tank 202, two groups of second fixed pulleys 205 for passing through the tinned copper conductor 4 are symmetrically and rotatably arranged. Two groups of second movable pulleys 206 are symmetrically and rotatably arranged in the second cleaning tank 202; specifically, after the to-be-processed tinned copper conductor 4 is output from the output module 1, it can pass through the first fixed pulley 203, the first movable pulley 204, the second fixed pulley 205 and the second movable pulley 206 in sequence and then be conveyed towards the input module 3. In this embodiment, both the first cleaning tank 201 and the second cleaning tank 202 are ultrasonic cleaning tanks, and there is a cleaning liquid with a certain height stored inside. The conveying route of the tinned copper conductor 4 in the first cleaning tank 201 and the second cleaning tank 202 is 'U'-shaped (which can be referred to Figure 5 ), so that the tinned copper conductor 4 can be immersed in the cleaning liquid, and thus the effect of ultrasonic cleaning can be achieved;

[0051] Correspondingly, in this embodiment, by setting two groups of ultrasonic cleaning tanks, after cleaning for a period of time, this embodiment can close any one of the ultrasonic cleaning tanks, and the other ultrasonic cleaning tank is in normal operation. Therefore, the impurities in the cleaning liquid in the closed ultrasonic cleaning tank can be processed, and the other ultrasonic cleaning tank is in normal operation, which will not affect the normal processing of the impurities on the surface of the tinned copper conductor 4;

[0052] In addition, the ultrasonic cleaning principle of the two groups of ultrasonic cleaning tanks in this embodiment is the prior art, and the specific structure and principle thereof will not be elaborated in this embodiment.

[0053] As a further solution of this embodiment, cleaning modules are respectively arranged in the first cleaning tank 201 and the second cleaning tank 202 for processing the impurities in the cleaning liquid;

[0054] It can be explained that when any one of the ultrasonic cleaning tanks stops operating, in this embodiment, the cleaning modules arranged in the cleaning tank are used to clean the impurities in the cleaning liquid. In this embodiment, it is not necessary for manual labor to clean the impurities in the cleaning liquid, which effectively improves the cleaning efficiency and reduces the labor cost.

[0055] It should also be noted that the number of ultrasonic cleaning tanks in this embodiment is not limited to the two groups set in this embodiment, and the specific number set is not limited, as long as the actual processing requirements are met.

[0056] Embodiment 2

[0057] Based on Embodiment 1, please refer to Figure 3 - Figure 5 , two groups of first movable pulleys 204 are rotatably arranged on one side of the first lifting frame 207, two groups of second movable pulleys 206 are rotatably arranged on one side of the second lifting frame 208, and the ultrasonic cleaning module 2 further includes a lifting mechanism for driving the first lifting frame 207 and the second lifting frame 208 to lift. Among them, the moving directions of the first lifting frame 207 and the second lifting frame 208 are opposite; it can be stated that reference can be made to Figure 5 , in the initial state, the lifting mechanism drives the first lifting frame 207 and the second lifting frame 208 to be at the same horizontal height. At this time, the tinned copper conductors 4 passing through the first movable pulley 204 and the second movable pulley 206 can all be immersed in the ultrasonic cleaning liquid. After ultrasonic cleaning for a period of time, the lifting mechanism drives the first lifting frame 207 to descend a certain height in the first cleaning tank 201. At the same time, the lifting mechanism drives the second lifting frame 208 to ascend a certain height in the second cleaning tank 202. The height that the first lifting frame 207 descends is the same as the height that the second lifting frame 208 ascends, and after the second lifting frame 208 ascends, it is separated from the ultrasonic cleaning liquid in the second cleaning tank 202. At this time, the second cleaning tank 202 can be shut down, and the impurities contained in the ultrasonic cleaning liquid can be cleaned by the cleaning module. Correspondingly, after the second cleaning tank 202 is cleaned, the lifting mechanism can be used to drive the first lifting frame 207 to rise until it is separated from the ultrasonic cleaning liquid, while the second lifting frame 208 descends into the ultrasonic cleaning liquid, realizing the interchange of their position heights. Furthermore, the impurities contained in the ultrasonic cleaning liquid in the first cleaning tank 201 can be cleaned. After the cleaning is completed, finally, the lifting mechanism drives the first lifting frame 207 and the second lifting frame 208 to move to the initial position again to process the impurities on the surface of the tinned copper conductor 4. In this way, in this embodiment, when cleaning any one of the cleaning tanks, the normal processing process of the tinned copper conductor 4 does not need to be stopped, ensuring the stability of the processing efficiency;

[0058] It should also be noted that the lifting mechanism of this embodiment drives the first lifting frame 207 and the second lifting frame 208 to move the same distance. Even when any one of the lifting frames is separated from the cleaning liquid, the other lifting frame can descend the same height, thereby keeping the conveying tension of the tinned copper conductor 4 always equal and having higher conveying stability. At the same time, since the lifting frame descends to a deeper position in the cleaning tank, even if the other lifting frame is separated from the cleaning liquid, the conveying time of the tinned copper conductor 4 in the cleaning liquid will not be reduced, and its ultrasonic cleaning time remains unchanged, thereby ensuring the stability of the cleaning effect.

[0059] In this embodiment, reference can be made to Figure 3 - Figure 4, the lifting mechanism includes a driving motor 6 fixed between the first cleaning tank 201 and the second cleaning tank 202. The output end of the driving motor 6 is fixed to a gear 601. The first lifting frame 207 is fixed to a first rack 603 disposed outside the first cleaning tank 201, and the second lifting frame 208 is fixed to a second rack 602 disposed outside the second cleaning tank 202. Both the first rack 603 and the second rack 602 are engaged with the gear 601, and the first rack 603 and the second rack 602 are arranged in a parallel and offset manner. It can be explained that when driving the first lifting frame 207 and the second lifting frame 208 to lift, in this embodiment, the driving motor 6 can be used to drive the gear 601 to rotate, and during the rotation of the gear 601, the first rack 603 and the second rack 602 can be synchronously driven to move in opposite directions;

[0060] Specifically, please refer to Figure 7 , in order to improve the stability of the movement of the first lifting frame 207 and the second lifting frame 208, in this embodiment, guide rods 604 are fixedly arranged on the outsides of the first cleaning tank 201 and the second cleaning tank 202. The first lifting frame 207 and the second lifting frame 208 are both slidably sleeved on the guide rods 604. It can be explained that the first lifting frame 207 and the second lifting frame 208 can slide synchronously on the guide rods 604 during the lifting process. On the one hand, it can improve the stability during their movement, and on the other hand, it can guide their movement.

[0061] In this embodiment, reference can be made to Figure 3 - Figure 4 and Figure 6 - Figure 9 , the cleaning module includes a through groove 7 opened at the bottom of the first cleaning tank 201 and the second cleaning tank 202. A bottom plate 702 is slidably embedded at the bottom of the through groove 7. Side plates 707 that are symmetrically and fixedly arranged on the bottom plate 702 are slidably fitted to the groove walls of the through groove 7. Among them, a first baffle 703 that is slidably arranged on one side of the bottom plate 702 is also slidably fitted to the groove wall of the through groove 7, and second baffles 708 are symmetrically arranged on the other side. The first baffle 703, the second baffles 708, the bottom plate 702, and the side plates 707 enclose a deposition cavity. It can be explained that when the ultrasonic cleaning tank stops operating, the suspended impurities in its cleaning liquid can be deposited in the deposition cavity for easy treatment.

[0062] As a further solution of this embodiment, a first partition plate 704 is vertically and fixedly arranged on one side of the first baffle 703 facing the second baffle 708, and a second partition plate 706 is vertically and fixedly arranged on one side of the second baffle 708 facing the first baffle 703. The first partition plate 704 and the second partition plate 706 are respectively in sliding fit with the groove walls of the through groove 7. A first sealing plate 502 is fixedly arranged on the box wall outside one side of the through groove 7, and the lower surface of the first sealing plate 502 is flush with the upper groove wall of the through groove 7. A second sealing plate 501 is fixedly arranged on the side of the second partition plate 706 away from the first baffle 703. A clamping groove 705 for embedding the side plate 707 is formed at the connection end of the second sealing plate 501 and the second partition plate 706. Among them, a top rod 503 is fixedly arranged at the bottom of the first sealing plate 502, and the end of the top rod 503 is fixed to the first baffle 703. A support 506 is fixedly arranged at the bottom of the second sealing plate 501, and the support 506 is slidably sleeved on the driving rod 504. The other end of the driving rod 504 is fixed to the push rod 507. A telescopic spring 505 is also arranged on the driving rod 504. One end of the telescopic spring 505 is fixed to the support 506, and the other end is fixed to the end of the driving rod 504. A driving mechanism 5 is fixedly arranged outside the cleaning box, and the driving end of the driving mechanism 5 is fixed to the driving rod 504. It can be explained that when cleaning the impurities in the cleaning liquid in the ultrasonic cleaning box in this embodiment, the ultrasonic cleaning box can be stopped first, so that the impurities in the cleaning liquid can be deposited in the deposition cavity. After a certain deposition time, the driving mechanism 5 drives the bottom plate 702 to slide towards the first sealing plate 502 through the push rod 507. In this embodiment, since the driving force for pushing the second baffle 708 towards the first baffle 703 is less than the elastic force of the telescopic spring 505 deforming, the push rod 507 can synchronously push the second sealing plate 501 and the second baffle 708 to move through the telescopic spring 505 and the support 506 during the movement. During this process, since the position of the first baffle 703 remains unchanged, a relative displacement is generated between the first baffle 703 and the bottom plate 702, and the first baffle 703 can scrape off the impurities deposited on the bottom plate 702. It can be referred to Figure 9, when the first partition plate 704 contacts the second partition plate 706, the first baffle plate 703, the second baffle plate 708, the first partition plate 704 and the second partition plate 706 enclose a storage cavity 701 for storing impurities. Correspondingly, the driving mechanism 5 continues to drive the bottom plate 702 to move. Based on the abutment of the first partition plate 704, the second baffle plate 708 and the second sealing plate 501 also stop moving, and a relative sliding occurs between the second baffle plate 708 and the bottom plate 702. The telescopic spring 505 can be compressed by the support 506 to generate an elastic force. During this process, the first baffle plate 703 and the second baffle plate 708 are misaligned with the bottom plate 702, so that the impurities in the storage cavity 701 can be discharged. In this embodiment, a collection box can be arranged at the bottom of the ultrasonic cleaning tank to collect the discharged impurities. Correspondingly, after the impurities are discharged, as the driving end of the driving mechanism 5 resets, each component can also reset accordingly, and a cleaning can be completed. In this embodiment, there is no need for manual cleaning of the impurities deposited in the cleaning tank, the cleaning efficiency is higher, and the operation is more convenient.

[0063] In addition, the driving mechanism 5 of this embodiment can adopt a synchronous belt mechanism or a screw-nut transmission mechanism, which is not limited in this embodiment, as long as it can satisfy the linear reciprocating motion of the driving push rod 507.

[0064] A cleaning process of a tin-ash and impurity cleaning device for the surface of a tinned copper conductor includes the following steps:

[0065] Please refer to Figure 1 - Figure 5 , S1. Wind the tinned copper conductor around the unwinding roller 101 and output it from the unwinding roller 101.

[0066] S2. After the tinned copper conductor 4 is output from the output module 1, it passes through the first cleaning tank 201 and the second cleaning tank 202 in sequence for ultrasonic cleaning.

[0067] S3. By setting two groups of ultrasonic cleaning tanks, after cleaning for a period of time, close any one of the ultrasonic cleaning tanks, and the other ultrasonic cleaning tank is in normal operation to process the cleaning liquid impurities in the closed ultrasonic cleaning tank, while the other ultrasonic cleaning tank is in normal operation, and so on.

[0068] S4. The processed tinned copper conductor 4 is wound around the winding roller 301.

[0069] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, as well as a specific orientation structure and operation. Therefore, it should not be construed as a limitation of the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0070] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] The above has described in detail one embodiment of the present invention, but the content described is only the preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A device for cleaning tin ash and impurities on the surface of a tinned copper conductor, comprising an output module (1) for outputting a tinned copper conductor (4) to be processed and an input module (3) for inputting a processed tinned copper conductor (4); It is characterized in that An ultrasonic cleaning module (2) is provided between the output module (1) and the input module (3), the ultrasonic cleaning module (2) comprising a first cleaning box (201) and a second cleaning box (202) symmetrically arranged between the output module (1) and the input module (3), two groups of first fixed pulleys (203) for passing the tinned copper conductor (4) are symmetrically arranged at the box opening of the first cleaning box (201), and two groups of first movable pulleys (204) are symmetrically arranged in rotation in the first cleaning box (201); Two groups of second fixed pulleys (205) for passing the tinned copper conductor (4) are symmetrically arranged at the box opening of the second cleaning box (202), and two groups of second movable pulleys (206) are symmetrically arranged in the second cleaning box (202).

2. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 1, characterized in that: The first cleaning box (201) and the second cleaning box (202) are respectively provided with cleaning modules for processing impurities in the cleaning liquid.

3. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 1, characterized in that: Two groups of the first movable pulleys (204) are rotatably arranged on one side of the first lifting frame (207), and two groups of the second movable pulleys (206) are rotatably arranged on one side of the second lifting frame (208). The ultrasonic cleaning module (2) also includes a lifting mechanism, which is used to drive the first lifting frame (207) and the second lifting frame (208) to rise and fall; Wherein, the movement directions of the first lifting frame (207) and the second lifting frame (208) are opposite.

4. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 3, characterized in that: The lifting mechanism comprises a driving motor (6) fixed between a first cleaning box (201) and a second cleaning box (202); the output end of the driving motor (6) is fixed to a gear (601); a first lifting frame (207) is fixed to a first rack (603) arranged outside the first cleaning box (201); a second lifting frame (208) is fixed to a second rack (602) arranged outside the second cleaning box (202); the first rack (603) and the second rack (602) are both meshed with the gear (601); and the first rack (603) and the second rack (602) are arranged in parallel and staggered manner.

5. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 4, characterized in that: Guide rods (604) are fixedly arranged on the outsides of the first cleaning box (201) and the second cleaning box (202), and the first lifting frame (207) and the second lifting frame (208) are slidably sleeved on the guide rods (604).

6. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 2, characterized in that: The cleaning module comprises a through groove (7) provided at the bottom of the first cleaning box (201) and the second cleaning box (202); a bottom plate (702) is slidably embedded in the bottom of the through groove (7); and side plates (707) are symmetrically fixedly arranged on the bottom plate (702) and are slidably fitted with the groove wall of the through groove (7); A first baffle (703) is slidably arranged on one side of the bottom plate (702) and is slidably fitted with the groove wall of the through groove (7), and a second baffle (708) is symmetrically arranged on the other side. The first baffle (703), the second baffle (708), the bottom plate (702) and the side plate (707) together form a deposition chamber.

7. A device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 6, characterized in that: A first partition plate (704) is vertically fixedly arranged on the side of the first baffle plate (703) close to the second baffle plate (708), and a second partition plate (706) is vertically fixedly arranged on the side of the second baffle plate (708) close to the first baffle plate (703). The first partition plate (704) and the second partition plate (706) are respectively slidably fitted with the groove wall of the through groove (7). A first sealing plate (502) is fixedly arranged on the box wall outside the through groove (7) on one side, and the lower surface of the first sealing plate (502) is flush with the upper groove wall of the through groove (7). A second sealing plate (501) is fixedly arranged on the side of the second baffle plate (706) away from the first baffle plate (703), and the connecting end of the second sealing plate (501) and the second partition plate (706) forms a slot (705) for embedding the side plate (707); A push rod (503) is fixedly arranged at the bottom of the first sealing plate (502), and the end of the push rod (503) is fixed to the first baffle (703). A support (506) is fixedly arranged at the bottom of the second sealing plate (501), and the support (506) is slidably sleeved on the driving rod (504). The other end of the driving rod (504) is fixed to the push rod (507). The driving rod (504) is also provided with a telescopic spring (505). A driving mechanism (5) is fixedly arranged on the outside of the cleaning box, and the driving end of the driving mechanism (5) is fixed to the driving rod (504).

8. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 1, characterized in that: The output module (1) comprises an unwinding roller (101) for unwinding the tinned copper conductor (4), and the unwinding roller (101) is rotatably arranged on one side of the unwinding frame (102).

9. The device for cleaning tin ash and impurities on the surface of tinned copper conductor according to claim 1, characterized in that: The input module (3) comprises a winding roller (301) for winding up the tinned copper conductor (4), and the winding roller (301) is rotatably arranged on one side of the winding frame (302); The winding roller (301) is fixed to the output end of a winding motor (303) fixed to one side of the winding frame (302) so as to drive the winding roller (301) to rotate.

10. A process for cleaning tin ash and impurities on the surface of a tin-plated copper conductor, applied to a device for cleaning tin ash and impurities on the surface of a tin-plated copper conductor as claimed in any one of claims 1 to 9, characterized in that: The steps include: The tinned copper conductor is wound onto a reel (101) and discharged from the reel (101); After being output from the output module (1), the tinned copper conductor (4) passes through a first cleaning box (201) and a second cleaning box (202) in sequence to be ultrasonically cleaned; By setting up two groups of ultrasonic cleaning boxes, after cleaning for a period of time, any one group of ultrasonic cleaning boxes is closed, and the other group of ultrasonic cleaning boxes is in a normal operating state, and the cleaning liquid impurities in the closed ultrasonic cleaning box are processed, while the other group of ultrasonic cleaning boxes is in a normal operating state, and this is repeated; The treated tinned copper conductor (4) is wound on a winding roller (301).

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