Transport scheduling method, cleaning method and cleaning equipment for semiconductor workpiece storage device to be cleaned

Abstract

The present invention provides a transportation scheduling method, a cleaning method, and cleaning equipment for a semiconductor workpiece storage device to be cleaned. The transportation scheduling method includes: S1, loading the semiconductor workpiece storage device to be cleaned into a loading station of a loading unit of the cleaning equipment; S2, utilizing a first transfer mechanism to transfer the semiconductor workpiece storage device to be cleaned from the loading station to an inspection station of the loading unit; S3, utilizing an inspection unit to inspect the semiconductor workpiece storage device to be cleaned; S4, if the inspection result is unqualified, utilizing the first transfer mechanism to transfer the semiconductor workpiece storage device to be cleaned from the loading station to a cache station of the loading unit; S5, utilizing a second transfer mechanism located outside the cleaning equipment to transport another semiconductor workpiece storage device to be cleaned to the loading station. This transportation scheduling method can not only optimize the transportation scheduling route, but also provide sufficient flexible scheduling space.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a transportation scheduling method, a cleaning method and cleaning equipment for a semiconductor workpiece storage device to be cleaned. Background Art

[0002] In the field of electronics and semiconductors, wafers are the fundamental material for integrated circuit manufacturing. All integrated circuits are designed and manufactured using wafers, so-called wafers due to their round shape. Wafers are generally thin, lightweight, brittle, and require high surface cleanliness. Wafers are typically placed in semiconductor workpiece storage devices for handling and transportation.

[0003] At present, in the design and manufacturing process of integrated circuits, semiconductor workpiece storage devices are transported to the loading station of the equipment by overhead cranes. The semiconductor workpiece storage devices need to be inspected before cleaning. When the inspection result of the semiconductor workpiece storage device is unqualified, it is necessary to use the overhead crane to dispatch and transfer it, and then transport another semiconductor workpiece storage device to be cleaned to the loading station. This process will take up a lot of overhead crane transportation time, reducing the cleaning efficiency of the equipment. Summary of the Invention

[0004] The embodiments of the present application provide a transportation scheduling method, a cleaning method, and a cleaning device for a semiconductor workpiece storage device to be cleaned.

[0005] In a first aspect, an embodiment of the present application provides a method for transporting and scheduling a semiconductor workpiece storage device to be cleaned, wherein a cleaning device is used to clean the semiconductor workpiece storage device to be cleaned. The method comprises:

[0006] S1. Loading a semiconductor workpiece storage device to be cleaned into a loading station of a loading unit of the cleaning equipment, wherein the loading station is located outside the cleaning equipment;

[0007] S2, using a first transfer mechanism to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the inspection station of the loading unit;

[0008] S3, using a detection unit to detect the semiconductor workpiece storage device to be cleaned;

[0009] S4. If the inspection result is unqualified, the semiconductor workpiece storage device to be cleaned is transported from the loading station to the buffer station of the loading unit by using the first transport mechanism, wherein the buffer station and the loading station are located on the same side;

[0010] S5. Transport another semiconductor workpiece storage device to be cleaned to the loading station using a second transfer mechanism located outside the cleaning equipment.

[0011] In conjunction with the first aspect of the present application, in an optional implementation manner, after step S5, the following steps are further included:

[0012] S6. The second transfer mechanism places another semiconductor workpiece storage device to be cleaned at the loading station and then moves it directly to the buffer station, and transfers the semiconductor workpiece storage device at the buffer station that has an unqualified inspection result.

[0013] In conjunction with the first aspect of the present application, in an optional embodiment, step S6 includes:

[0014] Performing a secondary confirmation on the semiconductor workpiece storage device located at the cache station whose inspection result is unqualified;

[0015] If the confirmation result is qualified, the second transfer mechanism is used to move the semiconductor workpiece storage device to be cleaned located at the buffer station and having the confirmation result qualified to the unloading station of the loading unit via the loading station, and the unloading station is located inside the cleaning equipment;

[0016] If the confirmation result is unqualified, the semiconductor workpiece storage device to be cleaned with the confirmation result of unqualified is transferred by the second transfer mechanism.

[0017] In conjunction with the first aspect of the present application, in an optional implementation manner, step S3 includes:

[0018] The semiconductor workpiece storage device to be cleaned is weighed; and / or the appearance and / or the internal space of the semiconductor workpiece storage device to be cleaned is scanned.

[0019] In conjunction with the first aspect of the present application, in an optional implementation manner, step S1 includes:

[0020] When the semiconductor workpiece storage device to be cleaned is loaded into the loading station of the loading unit of the cleaning equipment, the cover of the semiconductor workpiece storage device to be cleaned located on the loading station is located on the side of the box body of the semiconductor workpiece storage device to be cleaned, and the cover is detachably connected to the box body;

[0021] Before step S3, the method further includes:

[0022] The cover and the box of the semiconductor workpiece storage device to be cleaned are unlocked by using an unlocking mechanism so that the box and the cover of the semiconductor workpiece storage device are separated, wherein during the unlocking process, the cover is located at the side of the box.

[0023] In conjunction with the first aspect of the present application, in an optional implementation manner, step S4 further includes:

[0024] If the inspection result is qualified, the semiconductor workpiece storage device to be cleaned is transported from the inspection station to the unloading station located inside the cleaning equipment by using the first transport mechanism.

[0025] In combination with the first aspect of the present application, in an optional embodiment, the slide rail assembly of the first transfer mechanism is used to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the inspection station and the cache station of the loading unit; and the second transfer mechanism located outside the cleaning equipment is used to transport another semiconductor workpiece storage device to be cleaned to the loading station.

[0026] In combination with the first aspect of the present application, in an optional embodiment, the transportation scheduling method further includes: using an identification component to identify the category of the semiconductor workpiece storage device to be cleaned located at the loading station and / or the inspection station.

[0027] In a second aspect, an embodiment of the present application provides a method for cleaning a semiconductor workpiece storage device, including the transportation scheduling method for the semiconductor workpiece storage device to be cleaned according to any one of the first aspects, the cleaning method comprising:

[0028] The semiconductor workpiece storage device located at the unloading station inside the cleaning equipment is sent into the cleaning unit of the cleaning equipment for cleaning.

[0029] In a third aspect, an embodiment of the present application further provides a cleaning device for a semiconductor workpiece storage device to be cleaned, the cleaning device comprising:

[0030] frame;

[0031] A detection unit, used to detect the semiconductor workpiece storage device to be cleaned and obtain a detection result, wherein the detection unit is provided with a detection station;

[0032] A loading unit, used for loading the semiconductor workpiece storage device to be cleaned, wherein the loading unit is provided with a loading station and a buffer station, and the loading station and the buffer station are both located outside the frame;

[0033] The transfer mechanism is used to transfer the semiconductor workpiece storage device to be cleaned so as to transfer it between the loading station, the inspection station and the buffer station, and to transport the semiconductor workpiece storage device to be cleaned located outside the cleaning equipment to the loading station.

[0034] The transportation scheduling method, cleaning method, and cleaning equipment for a storage device for semiconductor workpieces to be cleaned provided in the embodiments of the present application have at least the following beneficial effects:

[0035] The semiconductor workpiece storage device with an unqualified inspection result is transferred to the cache station for temporary storage by the first transfer mechanism, so that the second transfer mechanism located outside the cleaning equipment can transfer the semiconductor workpiece storage device with an unqualified inspection result located at the cache station to the next processing station after transporting another semiconductor workpiece storage device to be cleaned to the loading station. Compared with using the second transfer mechanism to transfer the semiconductor workpiece storage device with an unqualified inspection result located at the loading station and then transporting another semiconductor workpiece storage device to be cleaned to the loading station, it can not only optimize the transportation scheduling route, but also provide sufficient flexible scheduling space, thereby improving the transportation scheduling efficiency of the semiconductor workpiece storage device, and thus improving the cleaning efficiency of the semiconductor workpiece storage device. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a plan view of the internal structure of the cleaning device provided in an embodiment of the present application;

[0037] Figure 2 This is a schematic diagram of the three-dimensional structure of the cleaning device provided in an embodiment of the present application;

[0038] Figure 3 is a top view of the cleaning device provided in an embodiment of the present application;

[0039] Figure 4 This is a schematic diagram of the three-dimensional structure of a cleaning device provided by another embodiment of the present application;

[0040] Figure 5 This is a top view of the positional relationship between the cover and the box body, the detection assembly, and the unlocking mechanism of the semiconductor workpiece storage device provided by an embodiment of the present application;

[0041] Figure 6a Schematic diagram of the positional relationship between the semiconductor workpiece storage device, the detection component, and the unlocking mechanism before detection provided by an embodiment of the present application;

[0042] Figure 6b A schematic diagram of the positional relationship between the semiconductor workpiece storage device, the detection assembly, and the unlocking mechanism during detection provided by an embodiment of the present application;

[0043] Figure 7 A schematic flow chart of a method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned provided in an embodiment of the present application.

[0044] Reference numerals:

[0045] 100- Cleaning equipment;

[0046] 1-loading unit; 11-loading station; 13-unloading station; 14-first slide rail assembly; 16-caching station; 17-second slide rail assembly;

[0047] 2- Unlocking mechanism;

[0048] 3-Detection unit; 31-Detection component; 32-Detection station;

[0049] 4-cleaning unit; 5-semiconductor workpiece storage device; 51-box; 511-grabbing part; 52-cover;

[0050] 6-frame; 61-opening and closing door; 7-unloading unit. DETAILED DESCRIPTION

[0051] To make the technical solutions and beneficial effects of the present invention more clearly understood, the following detailed description is given by way of specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly illustrate the details of the local features. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0052] In the description of the present invention, the terms "inside," "outside," and the like indicate positions or locations based on those shown in the accompanying drawings. These terms are intended solely to simplify the description of the present invention and are not intended to indicate that the devices or components referred to must have, be constructed, or operate in a specific orientation. In other words, they should not be construed as limiting the present invention. In the present invention, unless otherwise expressly specified, a first feature being "on," "above," "above," "above," "below," "below," or "below" a second feature may mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediary. Furthermore, "on," "above," and "above" a first feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. "under," "below," and "below" a first feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0053] In the present invention, the terms "first" and "second" are only used for the purpose of clear description and cannot be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly include at least one of the features. In the description of the present invention, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise clearly defined. In the present invention, unless otherwise clearly defined, the terms "installed", "connected", "connected", "fixed", "set", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0054] The semiconductor workpiece storage device 5 in the embodiments of the present application is used to accommodate or place substrates, illustratively, semiconductor workpiece products such as wafers. In some embodiments, the semiconductor workpiece storage device 5 can be a FOUP (front-opening wafer transport box), a FOSB (front-opening shipping box), a reticle box for storing photomasks, etc., and can also be a storage box for other purposes. The embodiments of the present application do not specifically limit the specific structure or type of the semiconductor workpiece storage device 5 to be cleaned.

[0055] Please refer to Figures 1 to 3 The cleaning device 100 for the semiconductor workpiece storage device 5 to be cleaned provided in an embodiment of the present application includes a frame 6, a loading unit 1, a cleaning unit 4, a detection unit 3 and a discharge unit 7.

[0056] Among them, the frame 6 makes the cleaning device 100 have a closed processing space, and the cleanliness of the space inside the frame 6 is much greater than the cleanliness of the space outside the frame 6. The cleaning unit 4 is located inside the frame 6 and is used to clean the semiconductor workpiece storage device 5. The unloading unit 7 is used to unload the semiconductor workpiece storage device 5 that has been cleaned. The loading unit 1 and the unloading unit 7 are arranged adjacent to each other. The number of the loading unit 1 and the unloading unit 7 is set according to specific needs, and the embodiment of the present application does not make specific restrictions. For example, Figure 3 Two loading units 1 and one unloading unit 7 are shown.

[0057] Multiple loading units 1 are arranged side by side in the EFEM (Equipment Front End Module), and each loading unit 1 is provided with a loading station 11 and an unloading station 13. The loading station 11 is used to load the semiconductor workpiece storage device 5 to be cleaned (exemplarily, it can be transported by an external mechanism such as an overhead crane), and the unloading station 13 is a station area for receiving the semiconductor workpiece storage device 5 that has passed the foreign matter detection, so that it can be subsequently sent to the cleaning unit 4 for cleaning.

[0058] The inspection unit 3 includes an inspection station 32 , which is a station area for inspecting the semiconductor workpiece storage device 5 for foreign matter.

[0059] In an alternative embodiment, the loading station 11 and the inspection station 32 are located outside the frame 6, and the unloading station 13 is located inside the frame 6. The frame 6 can shield the external environment of the cleaning device 100, so that the interior of the frame 6 is a space with a higher degree of cleanliness. On each loading unit 1, the inspection station 32 is located between the loading station 11 and the unloading station 13. The inspection station 32 is located at a position set for the convenience of inspection. This position is not fixed and the specific position of the inspection station 32 can be changed according to needs.

[0060] The unloading station 13 is located in the inner space of the frame 6 mainly for the convenience of sending the semiconductor workpiece storage device 5 that has passed the inspection into the cleaning unit 4 for cleaning.

[0061] In an optional embodiment, the cleaning equipment also includes a transfer mechanism, which is used to transfer the semiconductor workpiece storage device. The transfer mechanism includes a first transfer mechanism and a second transfer mechanism. The first transfer mechanism is used to transfer the semiconductor workpiece storage device so that it can be transferred between the loading station 11, the inspection station 32 and the cache station 16; the second transfer mechanism is used to transport the semiconductor workpiece storage device to be cleaned located outside the cleaning equipment to the loading station, and to transfer the semiconductor workpiece storage device located at the cache station.

[0062] In an optional embodiment, the detection station 32 is located outside the frame 6, which has the following advantages compared to the traditional cleaning device 100 located inside the closed frame 6:

[0063] First, the inspection station 32 is arranged adjacent to the loading station 11, and both are located outside the frame 6, which makes it convenient to efficiently transfer the semiconductor workpiece storage device 5 to the inspection station 32 for inspection after the semiconductor workpiece storage device 5 is loaded by the loading station 11, thereby greatly reducing the time required for the transportation of the semiconductor workpiece storage device 5; secondly, during the inspection process, the cover 52 and the box body 51 of the semiconductor workpiece storage device 5 are in a separated state, and contaminants may be introduced after the cover 52 and the box body 51 are separated. Therefore, the inspection station 32 is located outside the frame 6 to avoid the situation where contaminants introduced due to inspection cause pollution to the clean environment inside the frame 6.

[0064] In an optional embodiment, the detection station 32 is located inside the frame 6 .

[0065] It can be understood that the first transfer mechanism is used to move the semiconductor workpiece storage device 5 from the loading station 11 to the inspection station 32 inside the frame, and foreign matter inspection is performed on the semiconductor workpiece storage device 5 at the inspection station 32. For example, the inspection station 32 is located above the unloading station 13, which can shorten the distance between the inspection station 32 and other stations, thereby improving the working efficiency of the cleaning equipment.

[0066] In an optional embodiment, the first transfer mechanism includes a slide rail assembly, the slide rail assembly includes a first slide rail assembly 14, the first slide rail assembly 14 is used to transfer the semiconductor workpiece storage device 5 to be cleaned between the loading station 11, the inspection station 32 and the unloading station 13, and the first slide rail assembly 14 is used to transfer the semiconductor workpiece storage device 5 along the loading station 11, the inspection station 32 and the unloading station 13. Figure 2 The transfer is performed in the X-axis direction of the coordinate system shown in FIG.

[0067] In an alternative embodiment, if Figure 4 As shown, the frame 6 is connected to an opening and closing door 61 , which is opened to allow the semiconductor workpiece storage device 5 to enter the frame 6 from the feed port, so that the semiconductor workpiece storage device 5 can be cleaned by the cleaning unit 4 inside the frame 6 .

[0068] It can be understood that when there is no need to move the semiconductor workpiece storage device 5 to be cleaned outside the frame 6, or when the semiconductor workpiece storage device 5 that has been cleaned is moved outside the frame 6, the opening and closing door 61 is in a closed state to ensure the cleanliness inside the frame 6. When it is necessary to move the semiconductor workpiece storage device 5 outside the frame 6 to the inside of the frame 6 for cleaning using the cleaning unit 4, or when the semiconductor workpiece storage device 5 that has been cleaned inside the frame 6 is moved outside the frame 6, the opening and closing door 61 is opened.

[0069] In an optional embodiment, the detection unit 3 further includes a detection component 31 for real-time foreign body detection. When the semiconductor workpiece storage device 5 needs to be inspected, the detection component 31 can be driven by the driving component to move from bottom to top (i.e., Figure 2 The box body 51 of the semiconductor workpiece storage device 5 is scanned from bottom to top in the Z-axis direction of the coordinate system shown in the figure. The box body 51 of the semiconductor workpiece storage device 5 is detected for foreign objects. Compared with the previous weighing comparison method, this bottom-up scanning detection method is more intuitive and detailed and has a higher accuracy in identifying foreign objects.

[0070] In an optional embodiment, the detection component 31 can detect the semiconductor workpiece storage device 5 by weighing.

[0071] In an alternative embodiment, the detection component 31 may also employ an image capture or scanning device such as a camera. In some embodiments, the detection component 31 may employ a laser scanning device. In some embodiments, the laser scanning device employs a beam-type laser scanning device for foreign object detection. The transmitting and receiving components can be mounted relative to each other. When a substrate or wafer blocks light, an output signal is immediately triggered. Simultaneously, in conjunction with a servo-compatible encoder, the thickness of the substrate or wafer can be accurately calculated. Due to its compact size, the small, bright spot is easy to align, resulting in a fast response time (exemplarily 0.25 ms), providing high detection accuracy and reliability. In some embodiments, the laser scanning device employs a reflective laser scanning device for foreign object detection. This also requires laser diffuse reflection technology with a very small spot size and a fast response time to ensure accurate substrate or wafer counting and abnormality detection. After acquiring a scanned image through foreign object detection scanning using a camera, the detection component 31 also performs recognition and judgment on the scanned image, thereby intuitively determining whether a foreign object is present in the semiconductor workpiece storage device 5, improving the accuracy of the recognition and judgment, and precisely determining the specific location of the foreign object.

[0072] In an optional embodiment, the detection component 31 can also use an image capture or scanning device such as a camera in combination with a weighing detection method to detect the semiconductor workpiece storage device 5, thereby ensuring detection accuracy and detection efficiency.

[0073] In an optional embodiment, the first slide rail assembly 14 includes a slide rail and a driving mechanism thereof (not shown in the figure). When the semiconductor workpiece storage device 5 needs to be transferred, the semiconductor workpiece storage device 5 can be driven by the driving mechanism to move along the slide rail to the target position, exemplarily, from the loading station 11 to the inspection station 32.

[0074] In an optional embodiment, the loading unit 1 further includes a buffer station 16, and the slide rail assembly further includes a second slide rail assembly 17. The buffer station 16 and the loading station 11 are located in the same horizontal plane. The second slide rail assembly 17 is used to transfer semiconductor workpiece storage devices 5 that have failed inspection results between the loading station 11 and the buffer station 16. By providing the buffer station 16, semiconductor workpiece storage devices 5 that have failed inspection can be transferred to the buffer station 16 for temporary storage, thereby not affecting subsequent inspections of the semiconductor workpiece storage devices 5. This ensures high efficiency of the inspection process while also improving scheduling and transportation flexibility.

[0075] A first slide rail assembly 14 is provided between the loading station 11 and the unloading station 13, and a second slide rail assembly 17 is provided between the loading station 11 and the cache station 16, which can realize the transportation and scheduling of the semiconductor workpiece storage device 5 between multiple stations. Compared with the scheduling and transportation of the semiconductor workpiece storage device 5 by the robotic arm, it has higher stability.

[0076] In an alternative embodiment, if Figure 5 、 Figure 6a and Figure 6b As shown, the semiconductor workpiece storage device 5 includes a box body 51 and a cover body 52. A gripping portion 511 (also known as a mushroom head, a standard component) is provided on the outer wall of the box body 51. In integrated circuit processing plants, the AMHS (Automatic Material Handling System) gripping mushroom head enables rapid and accurate transport of the semiconductor workpiece storage device 5 between different devices. The box body 51 is provided with multiple grooves (not shown) for accommodating substrates. The substrates placed in the grooves are located parallel to the plane of the box body 51 where the gripping portion 511 is located. The AMHS is the second transfer mechanism.

[0077] In an optional embodiment, the box body 51 and the cover body 52 of the semiconductor workpiece storage device 5 can be unlocked or locked, and the box body 51 and the cover body 52 can be locked or unlocked by the unlocking mechanism 2, that is, the cover body 52 and the box body 51 can be closed and connected, and the cover body 52 and the box body 51 can be separated.

[0078] Specifically, when it is necessary to detect foreign objects in the semiconductor workpiece storage device 5, the unlocking mechanism 2 is used to unlock the cover 52 and separate it from the box body 51. When the foreign object detection is completed, the unlocking mechanism 2 is used again to lock the cover 52 on the box body 51, and then the cover 52 is transported to the next process or the next workstation.

[0079] Figure 6a FIG2 shows a schematic diagram of the positional relationship between the box body 51 and the cover body 52 of the semiconductor workpiece storage device 5, the detection component 31 and the unlocking mechanism 2 before detection. Figure 6aThe cover 52 is locked on the box body 51 , and the detection component 31 is close to the bottom of the box body 51 .

[0080] When it is necessary to detect foreign matter in the semiconductor workpiece storage device 5, the unlocking mechanism 2 is used to separate the cover 52 from the box body 51. Figure 6b Schematic diagram showing the positional relationship between the unlocking mechanism 2, the detection assembly 31 and the box body 51 and the cover body 52 of the semiconductor workpiece storage device 5 during detection after the box body 51 and the cover body 52 are separated. Figure 6b The cover 52 of the semiconductor workpiece storage device 5 is connected to the unlocking mechanism 2 and is away from the box body 51. The detection component 31 is along Figure 6a Move from bottom to top in the direction of arrow s1 to scan the inside of the box body 51.

[0081] The specific locking or unlocking method of the unlocking mechanism 2 is not specifically limited in this embodiment of the application.

[0082] Please refer to Figure 7 The present application also provides a method for transporting and scheduling a semiconductor workpiece storage device to be cleaned, comprising the following steps:

[0083] S1. Loading a semiconductor workpiece storage device to be cleaned into a loading station of a loading unit of a cleaning device, wherein the loading station is located outside the cleaning device.

[0084] S2. Utilize a first transfer mechanism to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the inspection station of the loading unit.

[0085] S3. Utilize the detection unit to detect the semiconductor workpiece storage device to be cleaned.

[0086] S4. If the detection result is unqualified, the semiconductor workpiece storage device to be cleaned is transferred from the loading station to the buffer station of the loading unit by using the first transfer mechanism. The buffer station and the loading station are located on the same side.

[0087] S5. Use a second transfer mechanism located outside the cleaning equipment to transport another semiconductor workpiece storage device to be cleaned to the loading station.

[0088] The above-mentioned transportation scheduling method for semiconductor workpiece storage devices to be cleaned uses a first transfer mechanism to transfer a semiconductor workpiece storage device with an unqualified inspection result to a cache station for temporary storage, so that a second transfer mechanism located outside the cleaning equipment can transfer the semiconductor workpiece storage device with an unqualified inspection result located at the cache station to the next processing station after transporting another semiconductor workpiece storage device to be cleaned to the loading station. Compared with using the second transfer mechanism to transfer a semiconductor workpiece storage device with an unqualified inspection result located at the loading station and then transporting another semiconductor workpiece storage device to be cleaned to the loading station, it not only optimizes the transportation scheduling route, but also provides sufficient flexible scheduling space, greatly improves the transportation scheduling efficiency of the semiconductor workpiece storage device, and further improves the cleaning efficiency of the semiconductor workpiece storage device.

[0089] In an optional embodiment, step S1 includes: a cover of the semiconductor workpiece storage device located on the loading station is located on a side of the box body.

[0090] Step S2 includes:

[0091] The unlocking mechanism is utilized to unlock the box body and the cover body of the semiconductor workpiece storage device, wherein the cover body is located at the side of the box body during the unlocking process.

[0092] It can be understood that the semiconductor workpiece storage device has the same position and posture at the loading station and the testing station. It can also be understood that the position and posture of the semiconductor workpiece storage device does not change during the process of moving the semiconductor workpiece storage device from the loading station to the testing station.

[0093] Compared to the traditional detection scheme that requires the use of a flipping mechanism to flip the semiconductor workpiece storage device so that its cover is located under the box body, the substrate or substrate fragments in the box body are moved to the cover body under the action of their own gravity, and the detection is completed from the gap between the cover body and the box body. The flipping mechanism not only takes up additional space, but also there is a risk that the substrate or substrate fragments will fall during the process of being moved to the cover body, which may affect the cleaning. In the embodiment of the present application, when the unlocking mechanism is used to unlock the semiconductor workpiece storage device, the cover body of the semiconductor workpiece storage device is located on the side of the box body. When the cover body is separated from the box body, the position of the substrate or substrate fragments in the box body will not move, thereby preventing the substrate fragments from falling from the box body and avoiding pollution to the clean environment.

[0094] In an optional embodiment, step S2 further includes:

[0095] The first slide rail assembly of the first transfer mechanism is used to move the box body of the semiconductor workpiece storage device to be cleaned to the unlocking mechanism. The unlocking mechanism unlocks and carries the cover body to move from bottom to top along with the opening and closing door, so that the cover body is separated from the box body.

[0096] In an optional embodiment, by connecting the unlocking mechanism to the opening and closing door and utilizing the same drive for lifting and lowering motion, there is no need for an additional drive to drive the unlocking mechanism to lift and lower. This helps to simplify the equipment structure and can also reduce the introduction of additional particulate contaminants due to friction generated by additional relative motion, thereby reducing the risk of contamination of the semiconductor workpiece storage device when the cover is opened.

[0097] In an optional embodiment, step S3 includes:

[0098] The unlocking mechanism carries the cover body and moves from top to bottom, and locks the cover body and the box body, and the cover body is separated from the unlocking mechanism.

[0099] Regardless of whether the inspection result of the semiconductor workpiece storage device is qualified, the unlocking mechanism needs to move the cover body from top to bottom to lock the cover body and the box body and separate the cover body from the unlocking mechanism.

[0100] When the inspection result of the semiconductor workpiece storage device is qualified, the unlocking mechanism locks the cover body and the box body, and after separating from the cover body, the opening and closing door opens, so that the semiconductor workpiece storage device is moved from the inspection station to the unloading station through the first transfer mechanism, and is sent to the cleaning unit for cleaning.

[0101] When the inspection result of the semiconductor workpiece storage device is unqualified, the unlocking mechanism locks the cover body and the box body and separates from the cover body, and then moves the unqualified semiconductor workpiece storage device to the buffer station via the first transfer mechanism.

[0102] In an optional embodiment, step S3 further includes:

[0103] The semiconductor workpiece storage device to be cleaned is weighed and / or the exterior and / or interior of the semiconductor workpiece storage device to be cleaned is scanned. The measurement and scanning of the semiconductor workpiece storage device is used to determine if there are any issues with the device. Examples of issues with the semiconductor workpiece storage device include manufacturing defects, dimensional conformity, warping, offset, cracks, holes, residual substrates or substrate fragments, damage caused during use, and missing components.

[0104] In an optional embodiment, the transportation scheduling method further includes:

[0105] The identification component is used to identify the type of the semiconductor workpiece storage device to be cleaned located at the loading station and / or the inspection station.

[0106] The identification of the category of semiconductor workpiece storage devices can confirm the specific type of semiconductor workpiece storage devices in the transportation flow process, and can also confirm whether the type of the identified semiconductor workpiece storage device meets the target semiconductor workpiece storage device type, thereby ensuring that the type of the transported semiconductor workpiece storage device meets the process flow requirements.

[0107] After the embodiment of the present application uses the identification component to confirm the type of semiconductor workpiece storage device, it further determines the inspection content based on the confirmed type of semiconductor workpiece storage device and the corresponding qualified parameter range of the inspection content. The inspection content and corresponding qualified parameter range of each type of semiconductor workpiece storage device are different.

[0108] In an alternative embodiment, a detection probe is provided on a carrier for placing semiconductor workpiece storage devices, and the detection probe is used to determine the type of the semiconductor workpiece storage device. Different types of semiconductor workpiece storage devices contact different detection probes when placed on the carrier, thereby enabling the detection probe to identify the type of the current semiconductor workpiece storage device.

[0109] In an optional embodiment, a code scanning device is used to identify an identification code on the semiconductor workpiece storage device, thereby identifying the type of the current semiconductor workpiece storage device. The type of the identification code and the type of the corresponding code scanning device are not specifically limited in this embodiment of the application.

[0110] In an optional embodiment, step S4 includes:

[0111] If the detection result of step S3 is unqualified, the semiconductor workpiece storage device to be cleaned is transferred from the loading station to the buffer station of the loading unit by using the second slide rail assembly of the first transfer mechanism.

[0112] The cleaning equipment includes a loading unit and a unloading unit. The loading unit is used to deliver the semiconductor workpiece storage device to be cleaned into the cleaning equipment, and the unloading unit is used to deliver the cleaned semiconductor workpiece storage device from the cleaning equipment. In order to avoid confusion between the clean semiconductor workpiece storage device and the semiconductor workpiece storage device to be cleaned, the unqualified semiconductor workpiece storage device needs to be delivered from the loading unit.

[0113] It is understandable that if a cache station is not set up, the semiconductor workpiece storage device that fails the inspection and is sent out from the cleaning equipment will occupy the loading station. The second transfer mechanism located outside the cleaning equipment needs to transfer the semiconductor workpiece storage device that fails the inspection before a new semiconductor workpiece storage device can be sent to the loading station. That is, in this process, the moving path of the second transfer mechanism is the loading station-the external station for placing the semiconductor workpiece storage device that fails the inspection-the station for placing the semiconductor workpiece storage device to be cleaned-the loading station.

[0114] In this embodiment, by setting up a cache station, when a semiconductor workpiece storage device fails inspection, the second transfer mechanism can grab the semiconductor workpiece storage device and transfer it to the loading station, and then transfer the unqualified semiconductor workpiece storage device from the cache station. The movement path of the second transfer mechanism is the station where the semiconductor workpiece storage device to be cleaned is placed - the loading station - the cache station - the external station where the unqualified semiconductor workpiece storage device is placed. Compared with the solution without a cache station, the second transfer mechanism in this embodiment needs to move a shorter path to transfer the unqualified semiconductor workpiece storage device, and the efficiency of the second transfer mechanism is higher. In a semiconductor manufacturing plant, the number of second transfer mechanisms is generally fixed, and all equipment needs to share the second transfer mechanism. By improving the working efficiency of the second transfer mechanism, the process capability of the second transfer mechanism can be greatly improved, thereby improving the efficiency of the entire semiconductor manufacturing plant.

[0115] In addition, when the process capacity of the second transfer mechanism is limited, the semiconductor workpiece storage device that fails the inspection can be temporarily stored in the cache station and then transferred when the first transfer mechanism is idle.

[0116] If the detection result of step S3 is qualified, the semiconductor workpiece storage device to be cleaned is transferred from the loading station to the unloading station of the loading unit by using the first slide rail assembly of the first transfer mechanism, so as to be sent to the cleaning unit for cleaning.

[0117] In an optional embodiment, step S4 and step S5 are performed simultaneously, that is, while the semiconductor workpiece storage device with an unqualified inspection result is transferred from the loading station to the cache station by the second slide rail assembly of the first transfer mechanism, another semiconductor workpiece storage device to be cleaned is transported to the loading station by the second transfer mechanism located outside the cleaning equipment, which can greatly improve the transfer efficiency and thus improve the cleaning efficiency of the semiconductor workpiece storage device.

[0118] In an optional embodiment, step S5 further includes the following steps:

[0119] S6. Use the second transfer mechanism to place another semiconductor workpiece storage device to be cleaned at the loading station and then directly move it to the buffer station, and transfer the semiconductor workpiece storage device at the buffer station that has an unqualified test result.

[0120] In step S5 , after the second transfer mechanism transports another semiconductor workpiece storage device to be cleaned to the loading station, it is directly moved to the buffer station to transfer the semiconductor workpiece storage device with an unqualified inspection result from the buffer station to the next processing station.

[0121] When the semiconductor workpiece storage device fails the inspection, the second transfer mechanism is used to grab another semiconductor workpiece storage device to be cleaned and transfer it to the loading station, and then the semiconductor workpiece storage device that fails the inspection is transferred from the cache station. The moving path of the second transfer mechanism is to place the semiconductor workpiece storage device to be cleaned-loading station-cache station-external placement of the semiconductor workpiece storage device that fails the inspection. Compared with the solution without setting up a cache station, the solution of the embodiment of the present application optimizes the transportation scheduling route and improves transportation efficiency.

[0122] In an optional embodiment, step S6 includes:

[0123] A second confirmation is performed on the semiconductor workpiece storage device located at the cache station whose inspection result is unqualified.

[0124] If the confirmation result is qualified, the second transfer mechanism is used to transfer the semiconductor workpiece storage device to be cleaned with the confirmation result qualified to the unloading station of the loading unit, and the unloading station is located inside the cleaning equipment.

[0125] If the confirmation result is unqualified, the semiconductor workpiece storage device to be cleaned with the confirmation result of unqualified is transferred by the second transfer mechanism.

[0126] The embodiment of the present application performs a secondary confirmation on the semiconductor workpiece storage device with an unqualified inspection result, which will not affect the second transfer mechanism from transporting another semiconductor workpiece storage device to be cleaned to the loading station for subsequent operations, and can reduce the risk of false detection and avoid repeated scheduling of transportation processes, thereby optimizing the inspection quality.

[0127] An embodiment of the present application also provides a cleaning method for a semiconductor workpiece storage device, including a transportation scheduling method for a semiconductor workpiece storage device to be cleaned according to any of the above embodiments, the cleaning method including sending the semiconductor workpiece storage device located at an unloading station inside the cleaning equipment into a cleaning unit of the cleaning equipment for cleaning.

[0128] Specifically, the semiconductor workpiece storage device to be cleaned is loaded into a loading station of a loading unit of the cleaning equipment that is located outside the cleaning equipment.

[0129] The semiconductor workpiece storage device to be cleaned is transferred from the loading station to the inspection station of the loading unit located outside the cleaning device by using the first transfer mechanism.

[0130] The semiconductor workpiece storage device to be cleaned is inspected by an inspection unit to determine whether there are foreign objects in the semiconductor workpiece storage device, wherein the foreign objects include substrates and / or substrate fragments.

[0131] If the inspection result is qualified, the semiconductor workpiece storage device to be cleaned is transferred from the inspection station to the unloading station by the first transfer mechanism, and is sent to the cleaning unit of the cleaning equipment for cleaning.

[0132] If the detection result is unqualified, the semiconductor workpiece storage device to be cleaned is transferred from the loading station to the buffer station of the loading unit for temporary storage by using the first transfer mechanism.

[0133] Another semiconductor workpiece storage device to be cleaned is transported to the loading station by a second transfer mechanism located outside the cleaning device.

[0134] The semiconductor workpiece storage device with an unqualified inspection result located at the buffer station is transported by using the second transport mechanism.

[0135] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the claims. Various modifications and variations may be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form additional embodiments of the present invention that may not be explicitly described. Therefore, the above embodiments merely illustrate several implementations of the present invention and do not limit the scope of protection of the patent of this invention.

Claims

1. A method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned, characterized in that: The semiconductor workpiece storage device to be cleaned is cleaned using a cleaning device, and the transportation scheduling method includes: S1. Loading a semiconductor workpiece storage device to be cleaned into a loading station of a loading unit of the cleaning equipment, wherein the loading station is located outside the cleaning equipment; S2, using a first transfer mechanism to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the inspection station of the loading unit; S3, using a detection unit to detect the semiconductor workpiece storage device to be cleaned; S4. If the inspection result is unqualified, the semiconductor workpiece storage device to be cleaned is transported from the loading station to the buffer station of the loading unit by using the first transport mechanism, wherein the buffer station and the loading station are located on the same side; S5. Using a second transfer mechanism located outside the cleaning equipment to transport another semiconductor workpiece storage device to be cleaned to the loading station; S6. The second transfer mechanism places another semiconductor workpiece storage device to be cleaned at the loading station and then moves it directly to the buffer station, and transfers the semiconductor workpiece storage device at the buffer station that has an unqualified inspection result.

2. The method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned according to claim 1, wherein: Step S6 includes: Performing a secondary confirmation on the semiconductor workpiece storage device located at the cache station whose inspection result is unqualified; If the confirmation result is qualified, the second transfer mechanism is used to move the semiconductor workpiece storage device to be cleaned located at the buffer station and having the confirmation result qualified to the unloading station of the loading unit via the loading station, and the unloading station is located inside the cleaning equipment; If the confirmation result is unqualified, the semiconductor workpiece storage device to be cleaned with the confirmation result of unqualified is transferred by the second transfer mechanism.

3. The method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned according to claim 1, wherein: Step S3 includes: The semiconductor workpiece storage device to be cleaned is weighed; and / or the appearance and / or the internal space of the semiconductor workpiece storage device to be cleaned is scanned.

4. The method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned according to claim 1, wherein: Step S1 includes: When the semiconductor workpiece storage device to be cleaned is loaded into the loading station of the loading unit of the cleaning equipment, the cover of the semiconductor workpiece storage device to be cleaned located on the loading station is located on the side of the box body of the semiconductor workpiece storage device to be cleaned, and the cover is detachably connected to the box body; Before step S3, the method further includes: The cover and the box of the semiconductor workpiece storage device to be cleaned are unlocked by using an unlocking mechanism so that the box and the cover of the semiconductor workpiece storage device are separated, wherein during the unlocking process, the cover is located at the side of the box.

5. The method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned according to claim 1, wherein: Step S4 further includes: If the inspection result is qualified, the semiconductor workpiece storage device to be cleaned is transported from the inspection station to the unloading station located inside the cleaning equipment by using the first transport mechanism.

6. The method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned according to any one of claims 1 to 5, characterized in that: The slide rail assembly of the first transfer mechanism is used to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the inspection station and the cache station of the loading unit; and the second transfer mechanism located outside the cleaning equipment is used to transport another semiconductor workpiece storage device to be cleaned to the loading station.

7. The method for transporting and scheduling a storage device for semiconductor workpieces to be cleaned according to claim 1, wherein: The transportation scheduling method further includes: using an identification component to identify the category of the semiconductor workpiece storage device to be cleaned located at the loading station and / or the inspection station.

8. A method for cleaning a semiconductor workpiece storage device, characterized in that: A method for transporting and scheduling a semiconductor workpiece storage device to be cleaned according to any one of claims 1 to 7, the cleaning method comprising: The semiconductor workpiece storage device located at the unloading station inside the cleaning equipment is sent into the cleaning unit of the cleaning equipment for cleaning.

9. A cleaning device for a semiconductor workpiece storage device to be cleaned, characterized in that: The cleaning equipment comprises: frame; A detection unit, used to detect the semiconductor workpiece storage device to be cleaned and obtain a detection result, wherein the detection unit is provided with a detection station; A loading unit, used for loading the semiconductor workpiece storage device to be cleaned, wherein the loading unit is provided with a loading station and a buffer station, and the loading station and the buffer station are both located outside the frame; a transfer mechanism, comprising a first transfer mechanism and a second transfer mechanism, wherein the first transfer mechanism is used to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the inspection station of the loading unit, and to transfer the semiconductor workpiece storage device to be cleaned from the loading station to the buffer station of the loading unit; The second transfer mechanism is used to transport another semiconductor workpiece storage device to be cleaned to the loading station, and to place another semiconductor workpiece storage device to be cleaned at the loading station and then move it directly to the cache station, and to transfer the semiconductor workpiece storage device whose inspection result is unqualified at the cache station.

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