Chip welding control method, electronic equipment and computer readable storage medium

Abstract

The invention discloses a chip welding control method, electronic equipment and a computer readable storage medium, and relates to the field of temperature control. The method comprises the steps that the initial room temperature of chip welding is obtained, target temperature control functions corresponding to a plurality of welding temperature control areas are determined according to the initial room temperature and a preset coefficient, and welding operation of a chip in the welding temperature control areas is controlled according to preset temperature control duration corresponding to the welding temperature control areas and the target temperature control functions. In this way, the target temperature control functions corresponding to the welding temperature control areas are sequentially constructed according to the initial room temperature, the temperatures of the target temperature control functions at different temperature control time are calculated through the preset temperature control duration corresponding to the welding temperature control areas to control chip welding, and therefore the welding temperatures at the different temperature control time are dynamically adjusted; therefore, the specific temperature requirement of the chip during welding is met, and solder ball cavities in the welding process can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of temperature control, and in particular to a chip welding control method, an electronic device and a computer-readable storage medium. Background Art

[0002] Solid-state drives (SSDs) consist of a main control chip, a storage chip, and a PCB board. The main control chip is responsible for data scheduling, the flash chip stores data, and the PCB board provides electrical connections and physical support. Under the surface mount technology (SMT) process, the various components work together, making SSDs the core choice of electronic device storage components due to their advantages such as fast reading and writing, low energy consumption, and strong earthquake resistance. They are widely used in personal computers, servers, etc. At present, the main control and flash of SSDs are mostly packaged in ball grid arrays (BGA), which have dense pin distribution and compact structure. The SMT process improves the integration, reduces the product size, and promotes the development of storage devices in the direction of small size and high performance.

[0003] However, when the SMT process mounts the main control chip and storage chip to the PCB board to produce the PCBA required for SSD, solder balls or solder joint voids are prone to occur. According to statistics, void-related failures account for 20% of PCBA failures. Voids reduce the soldering area and reduce the soldering strength, which will reduce the reliability of the solder joints. During reflow soldering, the gas in the voids expands and pushes the solder, increasing the risk of solder joint short circuits. In addition, voids will increase solder joint resistance, interfere with signal transmission, cause data errors or loss, and affect product reliability and yield.

[0004] In view of this, innovative technical solutions are urgently needed to solve the solder ball void problem and improve the yield rate to meet the market demand for high-performance and high-reliability SSDs. Summary of the invention

[0005] In view of this, the purpose of the present invention is to overcome the deficiencies in the prior art and provide a chip welding control method, an electronic device and a computer-readable storage medium for controlling the temperature of different welding temperature control zones during the welding process to reduce solder ball voids during the welding process.

[0006] The present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides a chip welding control method, comprising:

[0008] Obtain the initial room temperature for chip soldering;

[0009] Determine the target temperature control function corresponding to the plurality of welding temperature control zones according to the initial room temperature and the preset coefficient;

[0010] Control the soldering operation of the chip in each of the soldering temperature control zones according to the preset temperature control duration corresponding to each of the soldering temperature control zones and each of the target temperature control functions.

[0011] In one embodiment, the controlling the soldering operation of the chip in each of the soldering temperature control zones according to the preset temperature control duration corresponding to each of the soldering temperature control zones and each of the target temperature control functions includes:

[0012] Based on each of the preset temperature control durations, determine the zone control temperature at the temperature control time corresponding to each of the soldering temperature control zones according to each of the target temperature control functions;

[0013] Solder the chip in each of the soldering temperature control zones according to each of the temperature control times and the corresponding zone control temperatures.

[0014] In one embodiment, the determining the target temperature control functions corresponding to multiple soldering temperature control zones according to the initial room temperature and the preset coefficients includes:

[0015] Construct an initial temperature control function corresponding to the i-th soldering temperature control zone according to the preset coefficient corresponding to the i-th soldering temperature control zone and the parameter to be determined corresponding to the i-th soldering temperature control zone;

[0016] Determine the target constant corresponding to the i-th soldering temperature control zone according to the initial room temperature;

[0017] Substitute the target constant corresponding to the i-th soldering temperature control zone into the initial temperature control function corresponding to the i-th soldering temperature control zone to obtain the target temperature control function corresponding to the i-th soldering temperature control zone.

[0018] In one embodiment, the determining the target constant corresponding to the i-th soldering temperature control zone according to the initial room temperature includes:

[0019] When i = 1, use the initial room temperature as the target constant corresponding to the i-th soldering temperature control zone;

[0020] When i > 1, determine the termination temperature corresponding to the (i - 1)-th soldering temperature control zone according to the initial temperature control function corresponding to the (i - 1)-th soldering temperature control zone and the preset temperature control termination time corresponding to the (i - 1)-th soldering temperature control zone, and determine the target constant corresponding to the i-th soldering temperature control zone according to the termination temperature corresponding to the (i - 1)-th soldering temperature control zone.

[0021] In one embodiment, the determining the target constant corresponding to the i-th soldering temperature control zone according to the termination temperature corresponding to the (i - 1)-th soldering temperature control zone includes:

[0022] Calculate the initial temperature control function corresponding to the \(i\)th welding temperature control zone according to the termination temperature corresponding to the \((i - 1)\)th welding temperature control zone and the preset temperature control termination time corresponding to the \((i - 1)\)th welding temperature control zone, to obtain the target constant corresponding to the \(i\)th welding temperature control zone.

[0023] In one embodiment, the method further includes:

[0024] If the \(i\)th welding temperature control zone is a constant temperature zone or a reflow zone, then the \(i\)th welding temperature control zone includes a heating zone and a holding zone;

[0025] Use the target temperature control function corresponding to the \(i\)th welding temperature control zone as the target temperature control function corresponding to the heating zone;

[0026] Determine the target temperature control function corresponding to the holding zone according to the preset holding duration and the preset holding temperature corresponding to the holding zone.

[0027] In one embodiment, the method further includes:

[0028] If the \(i\)th welding temperature control zone is a constant temperature zone, use the welding melting point temperature as the preset holding temperature;

[0029] If the \(i\)th welding temperature control zone is a reflow zone, determine the preset holding temperature according to a preset ratio and the welding melting point temperature.

[0030] In one embodiment, the method further includes:

[0031] If the \(i\)th welding temperature control zone is a cooling zone, then the \(i\)th welding temperature control zone includes a first cooling zone and a second cooling zone;

[0032] The termination temperature corresponding to the first cooling zone is a preset temperature value, and the termination temperature corresponding to the second cooling zone is the initial room temperature.

[0033] In a second aspect, the present invention provides a computer device, including a memory and a processor, where the memory stores a computer program, and when the computer program is executed by the processor, it implements the chip welding control method as described in the first aspect.

[0034] In a third aspect, the present invention provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, it implements the chip welding control method as described in the first aspect.

[0035] The chip soldering control method, electronic device, and computer-readable storage medium disclosed by the present invention obtain the initial room temperature of chip soldering; determine the target temperature control functions corresponding to multiple soldering temperature control zones according to the initial room temperature and a preset coefficient; and control the soldering operation of the chip in each of the soldering temperature control zones according to the preset temperature control duration corresponding to each soldering temperature control zone and each of the target temperature control functions. In this way, by sequentially constructing the target temperature control functions corresponding to each soldering temperature control zone according to the initial room temperature, and calculating the temperatures of each target temperature control function at different temperature control times by using the preset temperature control durations corresponding to each soldering temperature control zone to control chip soldering, the soldering temperature at different temperature control times can be dynamically adjusted to meet the specific temperature requirements during chip soldering, thereby reducing the solder ball voids during the soldering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the protection scope of the present invention. In each of the drawings, similar components are denoted by similar reference numerals.

[0037] Figure 1 FIG. shows a flowchart of the chip soldering control method proposed in this embodiment;

[0038] Figure 2 FIG. shows a schematic diagram of a soldering structure proposed in this embodiment;

[0039] Figure 3 FIG. shows another flowchart of the chip soldering control method proposed in this embodiment;

[0040] Figure 4 FIG. shows a schematic diagram of the state of solder balls in traditional process soldering proposed in this embodiment;

[0041] Figure 5 FIG. shows a schematic diagram of the state of solder balls after soldering with the improved process proposed in this embodiment;

[0042] Figure 6 FIG. shows a schematic diagram of the target temperature control function curve proposed in this embodiment;

[0043] Figure 7 FIG. shows a schematic diagram of the structure of the chip soldering control device proposed in this embodiment.

[0044] DESCRIPTION OF THE REFERENCE NUMERALS IN THE DRAWINGS:

[0045] 700 - Chip soldering control device; 701 - Acquisition module; 702 - Determination module; 703 - Control module. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0046] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0047] The components of the embodiments of the present invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the detailed description of the embodiments of the present invention provided in the drawings below is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0048] In the following, the terms "including", "having" and their cognates that can be used in various embodiments of the present invention are only intended to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or increasing the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0049] In addition, terms such as "initial", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0050] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in a general-use dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in various embodiments of the present invention.

[0051] Embodiment 1

[0052] The embodiments of the present disclosure provide a chip soldering control method for controlling the temperatures of different soldering temperature control zones during the soldering process to reduce solder ball voids during the soldering process.

[0053] Please refer to Figure 1 , a chip soldering control method includes steps S101 to S103, and the following is a detailed description of each step.

[0054] Step S101, obtain the initial room temperature of chip soldering.

[0055] In this embodiment, the ambient temperature in the room at the start of chip soldering is obtained to get the initial room temperature, and at the same time, a plurality of soldering temperature control zones that need temperature control during the chip soldering process are determined. Among them, the soldering temperature control zone can be a soldering temperature control process, including but not limited to a preheating zone, a constant temperature zone, a reflow zone, a cooling zone, etc.

[0056] Please refer to Figure 2 , the soldering processes such as preheating, constant temperature, and reflow of the chip on the PCBA are carried out through the upper heating zone and the lower heating zone, and the soldered chip is cooled by the cooling and heat dissipation device.

[0057] Among them, the preheating zone is used to narrow the temperature difference in the reflow soldering area, which can avoid solder paste splashing caused by too fast temperature rise or the formation of voids due to the rapid melting of the solder paste, and avoid the solder paste not having enough time to reach the active temperature due to too slow temperature rise.

[0058] The constant temperature zone, also called the heat absorption zone, can make the temperatures of various components tend to be average, and can avoid phenomena such as tombstoning, false soldering, and offset.

[0059] In the reflow zone, the temperature reaches the peak, the solder paste completely melts and wets the component pads and terminals to form solder joints; in the cooling zone, the temperature rapidly drops from the highest temperature to below 75°C, so that the solder joints are completely solidified and the soldering is finally completed.

[0060] Step S102, determine the target temperature control functions corresponding to the plurality of soldering temperature control zones according to the initial room temperature and a preset coefficient.

[0061] In this embodiment, the target temperature control functions corresponding to each soldering temperature control zone are determined according to the initial room temperature and a preset coefficient. The target temperature control function is a temperature curve that changes with time and is used to guide the temperature control of the corresponding soldering temperature control zone.

[0062] The preset coefficient can be an ambient temperature compensation coefficient, a chip heat capacity coefficient, a solder paste melting characteristic coefficient, a time-temperature integral coefficient. Among them, the ambient temperature compensation coefficient is used to avoid insufficient melting of the solder paste caused by too low ambient temperature or thermal stress caused by too high temperature; the chip heat capacity coefficient is used to ensure that the heating rate of different chips in the same temperature control zone is adapted to avoid local overheating or false soldering; the solder paste melting characteristic coefficient can be used to dynamically adjust the peak temperature to ensure that the solder paste melts within the best range; the time-temperature integral coefficient can be used to prevent chip damage caused by heat accumulation.

[0063] Please refer to Figure 3 , in a specific embodiment, step S102 includes steps S1021 to S1023, and the following is a detailed description of each step.

[0064] Step S1021: Construct the initial temperature control function corresponding to the i-th welding temperature control zone according to the preset coefficient corresponding to the i-th welding temperature control zone and the parameter to be determined corresponding to the i-th welding temperature control zone.

[0065] It should be noted that each welding temperature control zone has its specific temperature control time, that is, the time period during which a specific temperature needs to be maintained within this welding temperature control zone. The temperature control time can be determined according to the requirements of the welding process and the thermal characteristics of the material.

[0066] Each welding temperature control zone has its corresponding temperature change trend, which is represented by a preset coefficient. In addition, the constant term in the initial temperature control function also determines the specific temperature value, but this constant term needs to be determined according to factors such as the initial room temperature, welding melting point, and specific temperature requirements in the specific chip welding scenario. Therefore, this constant term belongs to the parameter to be determined in the initial temperature control function.

[0067] In this embodiment, the initial temperature control function corresponding to the i-th welding temperature control zone is constructed according to the preset coefficient corresponding to the i-th welding temperature control zone and the parameter to be determined corresponding to the i-th welding temperature control zone. For example, the initial temperature control function corresponding to the i-th welding temperature control zone can be y i = i x + σ i where y i is the temperature control temperature corresponding to the i-th welding temperature control zone, k i is the preset coefficient corresponding to the i-th welding temperature control zone, x is the temperature control time, and σ i is the parameter to be determined corresponding to the i-th welding temperature control zone.

[0068] Among them, the temperature control time is the independent variable of the initial temperature control function, the temperature is the dependent variable of the initial temperature control function, the preset coefficient is the slope of the initial temperature control function, and the parameter to be determined is the constant term of the initial temperature control function.

[0069] Step S1022: Determine the target constant corresponding to the i-th welding temperature control zone according to the initial room temperature.

[0070] In this embodiment, the parameter to be determined is an unknown term, that is, the constant term that needs to be determined. The target constant corresponding to each welding temperature control zone can be determined according to the initial room temperature.

[0071] In a specific embodiment, step S1022 includes: when i = 1, taking the initial room temperature as the target constant corresponding to the i-th welding temperature control zone; when i > 1, determining the termination temperature corresponding to the (i - 1)-th welding temperature control zone according to the initial temperature control function corresponding to the (i - 1)-th welding temperature control zone and the preset temperature control termination time corresponding to the (i - 1)-th welding temperature control zone, and determining the target constant corresponding to the i-th welding temperature control zone according to the termination temperature corresponding to the (i - 1)-th welding temperature control zone.

[0072] In this embodiment, for the first welding temperature control zone in the chip welding process, the initial room temperature is taken as the target constant corresponding to the first welding temperature control zone.

[0073] When i > 1, determining the termination temperature corresponding to the (i - 1)-th welding temperature control zone according to the initial temperature control function corresponding to the (i - 1)-th welding temperature control zone and the preset temperature control termination time corresponding to the (i - 1)-th welding temperature control zone, and calculating the target constant corresponding to the i-th welding temperature control zone according to the termination temperature corresponding to the (i - 1)-th welding temperature control zone.

[0074] Step S1023, substituting the target constant corresponding to the i-th welding temperature control zone into the initial temperature control function corresponding to the i-th welding temperature control zone, to obtain the target temperature control function corresponding to the i-th welding temperature control zone.

[0075] In this embodiment, substituting the target constant corresponding to the i-th welding temperature control zone into the initial temperature control function corresponding to the i-th welding temperature control zone, to obtain the target temperature control function corresponding to the i-th welding temperature control zone. For example, the target temperature control function corresponding to the i-th welding temperature control zone can be y i = i x + a i , y i is the temperature controlled by the i-th welding temperature control zone, k i is the preset coefficient corresponding to the i-th welding temperature control zone, x is the temperature control time, and a i is the target constant corresponding to the i-th welding temperature control zone.

[0076] It should be noted that the preset coefficients corresponding to different welding temperature control zones can be determined according to the actual conditions of the welding temperature control zone.

[0077] If the preset coefficient is the environmental temperature compensation coefficient α, then according to the difference between the initial room temperature T 0 and the reference temperature (usually taken as 25 °C), the slope of the temperature control curve can be dynamically adjusted to compensate for the influence of the environment on the welding heat transfer. Formula: α = 1 + m 1 ×ΔT, where ΔT = T 0 - 25 °C, and m 1 is a constant related to the thermal conductivity of the material (such as the thermal conductivity coefficient of the PCB board).

[0078] If the preset coefficient is the chip heat capacity coefficient β, it is set according to the difference in the heat capacity of the packaging materials of the storage chip (NAND Flash) and the main control chip. For example, the main control chip (such as a 6nm process chip) requires more precise temperature control due to its high integration. Formula: β = C 1 / 2 , where C 1 is the heat capacity of the chip packaging material, and C 2 is the heat capacity of the PCB substrate.

[0079] If the preset coefficient is the solder paste melting characteristic coefficient γ, it is set based on the melting temperature range of the solder paste alloy composition (such as Sn - Ag - Cu). For example, the melting point of lead - free solder paste is 217 - 220°C. Formula: γ = (T m - T 0 ) / ΔT max , where T m is the melting point of the solder paste, and ΔT max is the allowable temperature fluctuation range.

[0080] If the preset coefficient is the time - temperature integral coefficient σ, it combines the welding temperature control duration t and the area of the temperature curve ∫T(t)dt to control the total heat input. Formula: σ = m 1 ×∫T(t)dt / ref , where t ref is the reference time (such as the standard reflow soldering cycle).

[0081] In a specific embodiment, determining the target constant corresponding to the i - th welding temperature control zone according to the termination temperature corresponding to the (i - 1) - th welding temperature control zone includes: calculating the initial temperature control function corresponding to the i - th welding temperature control zone according to the termination temperature corresponding to the (i - 1) - th welding temperature control zone and the preset temperature control termination time corresponding to the (i - 1) - th welding temperature control zone, so as to obtain the target constant corresponding to the i - th welding temperature control zone.

[0082] In this embodiment, the termination temperature corresponding to the (i - 1) - th welding temperature control zone is used as the dependent variable in the initial temperature control function corresponding to the i - th welding temperature control zone, and the preset temperature control termination time corresponding to the (i - 1) - th welding temperature control zone is used as the independent variable in the initial temperature control function corresponding to the i - th welding temperature control zone, and calculations are performed. The obtained value is the target constant corresponding to the i - th welding temperature control zone.

[0083] Step S103, control the welding operation of the chip in each of the welding temperature control zones according to the preset temperature control duration corresponding to each of the welding temperature control zones and each of the target temperature control functions.

[0084] In this embodiment, the temperature of each welding temperature control zone is controlled according to the preset temperature control duration corresponding to each welding temperature control zone and each target temperature control function, and the chip is welded based on this temperature control, so as to realize the adaptive adjustment of the chip welding temperature, and further reduce the solder balls and solder joint voids caused by chip welding.

[0085] Please refer to Figure 4 , it can be seen that there are many black holes in the solder ball states shown by 2D X-Ray and 3D X-Ray after welding with the traditional process; please refer to Figure 5 , the existence of black holes is not obvious in the solder ball states shown by 2D X-Ray and 3D X-Ray after welding with the chip welding control method proposed in this embodiment. Therefore, the chip welding control method proposed in this embodiment can utilize the temperature control function to realize the temperature regulation during chip welding.

[0086] In a specific embodiment, based on each of the preset temperature control durations, the regional control temperature at the corresponding temperature control time of each welding temperature control zone is determined according to each of the target temperature control functions; the chip is welded in each welding temperature control zone according to each of the temperature control times and their corresponding regional control temperatures.

[0087] In this embodiment, based on the preset temperature control durations corresponding to each welding temperature control zone, the regional control temperature required for each welding temperature control zone at different temperature control times is calculated according to each target temperature control function; and the chip is welded according to the temperature control time and its corresponding regional control temperature.

[0088] In a specific embodiment, if the i-th welding temperature control zone is a constant temperature zone or a reflow zone, the i-th welding temperature control zone includes a heating zone and a holding zone; the target temperature control function corresponding to the i-th welding temperature control zone is used as the target temperature control function corresponding to the heating zone; the target temperature control function corresponding to the holding zone is determined according to the preset holding duration and the preset holding temperature corresponding to the holding zone.

[0089] In this embodiment, if the i-th welding temperature control zone is a constant temperature zone or a reflow zone, this welding temperature control zone includes a heating zone and a holding zone.

[0090] The target temperature control function corresponding to this welding temperature control zone is used as the target temperature control function corresponding to the heating zone, and the target temperature control function corresponding to the holding zone is determined according to the preset holding duration and the preset holding temperature corresponding to the holding zone.

[0091] For example, if the preset holding duration corresponding to the holding zone is 20s and the preset holding temperature corresponding to the holding zone is 300 °C, the target temperature control function corresponding to the holding zone is determined to be y = 300(20s).

[0092] In a specific embodiment, if the i-th welding temperature control zone is a constant temperature zone, the welding melting point temperature is used as the preset holding temperature; if the i-th welding temperature control zone is a reflow zone, the preset holding temperature is determined according to a preset ratio and the welding melting point temperature.

[0093] In this embodiment, if the i-th welding temperature control zone is a constant temperature zone, the welding melting point temperature is used as the preset holding temperature; if the i-th welding temperature control zone is a reflow zone, the preset holding temperature is determined according to a preset ratio and the welding melting point temperature.

[0094] For example, in the reflow zone, it is required to hold for a period of time at a temperature of 120% of the welding melting point, then the preset ratio is 1.2.

[0095] In a specific embodiment, if the i-th welding temperature control zone is a cooling zone, the i-th welding temperature control zone includes a first temperature reduction zone and a second temperature reduction zone; the termination temperature corresponding to the first temperature reduction zone is a preset temperature value, and the termination temperature corresponding to the second temperature reduction zone is the initial room temperature.

[0096] In this embodiment, if the i-th welding temperature control zone is a cooling zone, the welding temperature control zone includes a first temperature reduction zone and a second temperature reduction zone.

[0097] Among them, the termination temperature corresponding to the first temperature reduction zone is a preset temperature value, and the termination temperature corresponding to the second temperature reduction zone is the initial room temperature. That is to say, the target temperature control functions corresponding to the first temperature reduction zone and the second temperature reduction zone will also be different.

[0098] Exemplarily, please refer to Figure 6 , if the welding temperature control zone sequentially includes a preheating zone, a constant temperature zone, a reflow zone and a cooling zone, and the initial room temperature is 20 °C, then it can be known that the target temperature control function of the preheating zone is y 1 = 1.33 + 20.

[0099] If the temperature control duration of the preheating zone is preset to 90 s, then it can be known that the preset temperature control termination time of the preheating zone is 90 s, and the termination temperature of the preheating zone is 139.7 °C.

[0100] If the initial temperature control function of the temperature rising zone in the constant temperature zone is y 21 = 2x + a 2 , then based on the preset temperature control termination time and termination temperature of the preheating zone, a 2 = -40.3 can be calculated, that is, the target temperature control function of the temperature rising zone in the constant temperature zone is y 21 = 2x - 40.

[0101] If the welding melting point temperature is 200 °C, then the target temperature control function of the holding zone in the constant temperature zone is y 22 = 200, and the preset holding duration is 90 s.

[0102] If the temperature control duration of the heating-up zone in the constant-temperature zone is preset to 30 s, it can be known that the preset temperature control end time of the heating-up zone in the constant-temperature zone is 120 s, and the end temperature of the heating-up zone in the constant-temperature zone is 200 °C.

[0103] At this time, the end temperature of the heating-up zone in the constant-temperature zone is exactly the holding temperature of the holding zone in the constant-temperature zone. Therefore, the temperature can be directly held at the end temperature of the heating-up zone in the constant-temperature zone for 90 s. If the end temperature of the heating-up zone in the constant-temperature zone is not equal to the welding melting point temperature, the temperature is held by adjusting the temperature of the hot air gun to the welding melting point temperature.

[0104] If the initial temperature control function of the heating-up zone in the reflow zone is y 31 = 1.33 + a 3 , then based on the preset temperature control end time and end temperature of the constant-temperature zone, a 3 = -79.3 can be calculated, that is, the target temperature control function of the heating-up zone in the constant-temperature zone is y 31 = 1.33 - 79.1.

[0105] If the welding melting point temperature is 200 °C and the preset ratio is 1.4, the target temperature control function of the holding zone in the reflow zone is y , = 280, and the preset holding duration is 60 s.

[0106] If the temperature control duration of the heating-up zone in the reflow zone is preset to 60 s, it can be known that the preset temperature control end time of the heating-up zone in the reflow zone is 270 s, and the end temperature of the heating-up zone in the reflow zone is 280 °C.

[0107] At this time, the end temperature of the heating-up zone in the reflow zone is exactly the holding temperature of the holding zone in the reflow zone. Therefore, the temperature can be directly held at the end temperature of the heating-up zone in the reflow zone for 60 s. If the end temperature of the heating-up zone in the reflow zone is not equal to the holding temperature of the holding zone in the reflow zone, the temperature is held by adjusting the temperature of the hot air gun to the holding temperature of the holding zone in the reflow zone.

[0108] If the initial temperature control function of the first cooling zone in the cooling zone is y 41 = -7x + a 41 , then based on the preset temperature control end time and end temperature of the reflow zone, a 41 = 2590 can be calculated, that is, the target temperature control function of the first cooling zone in the cooling zone is y 41 = -7 + 2590.

[0109] If the temperature control duration of the first cooling zone is preset to 30 s, it can be known that the preset temperature control end time of the first cooling zone is 360 s, and the end temperature of the first cooling zone is 70 °C.

[0110] If the initial temperature control function of the second temperature reduction zone in the cooling zone is y 42 =-0.83 + a 42 , then based on the preset temperature control termination time and termination temperature of the first temperature reduction zone, a can be calculated 42 = 368.6, that is, the target temperature control function of the second temperature reduction zone in the cooling zone is y 42 =-0.83 + 368.6.

[0111] It should be noted that in the preheating zone, it needs to be slowly increased from room temperature to 70% of the solder paste melting point, in the constant temperature zone, it needs to be slowly heated up to the solder paste melting point, in the reflow zone, it needs to be slowly increased to 140% of the solder paste melting point, and in the cooling zone, it needs to be quickly reduced to 70°C and then slowly reduced to room temperature. Therefore, when determining the preset coefficient and preset temperature control termination time through multiple experiments, the specific temperature requirements of the welding temperature zone need to be considered in combination with the welding melting point temperature.

[0112] It should be added that the target temperature control function of the preheating zone: y 1 = 1.33 + 20 can be further optimized. Specifically, the preset coefficient of the preheating zone is set as the ambient temperature compensation coefficient α, and the preset coefficient is adjusted to obtain the target temperature control function of the preheating zone as where 20 is the initial temperature (initial room temperature), T act is the solder paste activation temperature, and t 1 is the preheating time (adjusted according to the PCB thickness and chip layout).

[0113] Correspondingly, the target temperature control function of the constant temperature zone can be further optimized. Specifically, the preset coefficient of this constant temperature zone is set as the chip heat capacity coefficient β, and the coefficient is adjusted to obtain the target temperature control function of the constant temperature zone as In the formula, T pek is the target peak temperature (corrected by β), and K p , K i , K d are PID control parameters, which are adaptively adjusted according to the ambient temperature (for example, reducing K p in a high-temperature environment to avoid overshoot).

[0114] The chip soldering control method proposed in this embodiment obtains the initial room temperature of chip soldering; determines the target temperature control functions corresponding to multiple soldering temperature control zones according to the initial room temperature and a preset coefficient; and controls the soldering operation of the chip in each soldering temperature control zone according to the preset temperature control duration corresponding to each soldering temperature control zone and each target temperature control function. In this way, by sequentially constructing the target temperature control functions corresponding to each soldering temperature control zone according to the initial room temperature, and calculating the temperatures of each target temperature control function at different temperature control times by using the preset temperature control duration corresponding to each soldering temperature control zone to control chip soldering, the soldering temperature at different temperature control times can be dynamically adjusted to meet the specific temperature requirements during chip soldering, thereby reducing the solder ball voids in the soldering process.

[0115] Embodiment 2

[0116] In addition, an embodiment of the present disclosure provides a chip soldering control device 700. Please refer to Figure 7 , and the device includes:

[0117] An acquisition module 701, configured to acquire the initial room temperature of chip soldering;

[0118] A determination module 702, configured to determine the target temperature control functions corresponding to multiple soldering temperature control zones according to the initial room temperature and a preset coefficient;

[0119] A control module 703, configured to control the soldering operation of the chip in each soldering temperature control zone according to the preset temperature control duration corresponding to each soldering temperature control zone and each target temperature control function.

[0120] Optionally, the control module 703 is further configured to, based on each preset temperature control duration, determine the regional control temperature corresponding to each temperature control time in each soldering temperature control zone according to each target temperature control function; and solder the chip in each soldering temperature control zone according to each temperature control time and its corresponding regional control temperature.

[0121] Optionally, the determination module 702 is further configured to construct the initial temperature control function corresponding to the i-th soldering temperature control zone according to the preset coefficient corresponding to the i-th soldering temperature control zone and the parameter to be determined corresponding to the i-th soldering temperature control zone; determine the target constant corresponding to the i-th soldering temperature control zone according to the initial room temperature; and substitute the target constant corresponding to the i-th soldering temperature control zone into the initial temperature control function corresponding to the i-th soldering temperature control zone to obtain the target temperature control function corresponding to the i-th soldering temperature control zone.

[0122] Optionally, the determining module 702 is further configured to use the initial room temperature as the target constant corresponding to the i-th welding temperature control zone when i = 1; when i>1, determine the termination temperature corresponding to the (i-1)-th welding temperature control zone according to the initial temperature control function corresponding to the (i-1)-th welding temperature control zone and the preset temperature control termination time corresponding to the (i-1)-th welding temperature control zone, and determine the target constant corresponding to the i-th welding temperature control zone according to the termination temperature corresponding to the (i-1)-th welding temperature control zone.

[0123] Optionally, the determining module 702 is further configured to calculate the initial temperature control function corresponding to the i-th welding temperature control zone according to the termination temperature corresponding to the (i-1)-th welding temperature control zone and the preset temperature control termination time corresponding to the (i-1)-th welding temperature control zone, to obtain the target constant corresponding to the i-th welding temperature control zone.

[0124] Optionally, the determining module 702 is further configured to, if the i-th welding temperature control zone is a constant temperature zone or a reflow zone, the i-th welding temperature control zone includes a heating-up zone and a holding zone; use the target temperature control function corresponding to the i-th welding temperature control zone as the target temperature control function corresponding to the heating-up zone; determine the target temperature control function corresponding to the holding zone according to the preset holding duration and the preset holding temperature corresponding to the holding zone.

[0125] Optionally, the determining module 702 is further configured to use the welding melting point temperature as the preset holding temperature if the i-th welding temperature control zone is a constant temperature zone; and determine the preset holding temperature according to a preset ratio and the welding melting point temperature if the i-th welding temperature control zone is a reflow zone.

[0126] Optionally, the determining module 702 is further configured to, if the i-th welding temperature control zone is a cooling zone, the i-th welding temperature control zone includes a first temperature reduction zone and a second temperature reduction zone; the termination temperature corresponding to the first temperature reduction zone is a preset temperature value, and the termination temperature corresponding to the second temperature reduction zone is the initial room temperature.

[0127] The device provided by the embodiments of the present disclosure can execute the steps of the chip welding control method provided in Embodiment 1. To avoid repetition, details are not described herein again.

[0128] The chip soldering control device proposed in this embodiment obtains the initial room temperature of chip soldering; determines the target temperature control functions corresponding to multiple soldering temperature control zones according to the initial room temperature and a preset coefficient; and controls the soldering operation of the chip in each of the soldering temperature control zones according to the preset temperature control duration corresponding to each soldering temperature control zone and each of the target temperature control functions. In this way, by sequentially constructing the target temperature control functions corresponding to each soldering temperature control zone according to the initial room temperature, and calculating the temperatures of each target temperature control function at different temperature control times using the preset temperature control durations corresponding to each soldering temperature control zone to control chip soldering, the soldering temperature at different temperature control times can be dynamically adjusted to meet the specific temperature requirements during chip soldering, thereby reducing solder ball voids during the soldering process.

[0129] Embodiment 3

[0130] In addition, an embodiment of the present disclosure provides a computer device, including a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, it implements the chip soldering control method described in Embodiment 1.

[0131] The device provided in the embodiment of the present disclosure can execute the steps of the chip soldering control method provided in Embodiment 1. To avoid repetition, it will not be elaborated here.

[0132] Embodiment 4

[0133] An embodiment of the present disclosure proposes a computer-readable storage medium that stores a computer program, and when the computer program is executed by a processor, it implements the chip soldering control method described in Embodiment 1 of this example.

[0134] In this embodiment, the computer-readable storage medium can be a read-only memory (ROM for short), a random access memory (RAM for short), a magnetic disk, or an optical disc, etc.

[0135] The computer-readable storage medium provided in this embodiment can implement the chip soldering control method provided in Embodiment 1. To avoid repetition, it will not be elaborated here.

[0136] In all the examples shown and described here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0137] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0138] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all fall within the protection scope of the present invention.

Claims

1. A chip welding control method, characterized in that: include: Obtain the initial room temperature for chip soldering; Determine the target temperature control function corresponding to the plurality of welding temperature control zones according to the initial room temperature and the preset coefficient; The welding operation of the chip in each of the welding temperature control zones is controlled according to the preset temperature control time corresponding to each of the welding temperature control zones and each of the target temperature control functions.

2. The chip bonding control method according to claim 1, characterized in that: The controlling the welding operation of the chip in each welding temperature control zone according to the preset temperature control time corresponding to each welding temperature control zone and each target temperature control function comprises: Based on each of the preset temperature control time lengths, determining the regional control temperature of each of the welding temperature control zones at the corresponding temperature control time according to each of the target temperature control functions; The chip is welded in each welding temperature control zone according to each temperature control time and its corresponding regional control temperature.

3. The chip bonding control method according to claim 1, characterized in that: The step of determining target temperature control functions corresponding to a plurality of welding temperature control zones according to the initial room temperature and a preset coefficient includes: Constructing an initial temperature control function corresponding to the ith welding temperature control zone according to the preset coefficient corresponding to the ith welding temperature control zone and the to-be-determined parameter corresponding to the ith welding temperature control zone; Determine the target constant corresponding to the i-th welding temperature control zone according to the initial room temperature; The target constant corresponding to the i-th welding temperature control zone is substituted into the initial temperature control function corresponding to the i-th welding temperature control zone to obtain the target temperature control function corresponding to the i-th welding temperature control zone.

4. The chip bonding control method according to claim 3, characterized in that: The determining the target constant corresponding to the i-th welding temperature control zone according to the initial room temperature includes: When i=1, the initial room temperature is used as the target constant corresponding to the i-th welding temperature control zone; When i>1, the termination temperature corresponding to the i-1th welding temperature control zone is determined according to the initial temperature control function corresponding to the i-1th welding temperature control zone and the preset temperature control termination time corresponding to the i-1th welding temperature control zone, and the target constant corresponding to the i-th welding temperature control zone is determined according to the termination temperature corresponding to the i-1th welding temperature control zone.

5. The chip bonding control method according to claim 4, characterized in that: The determining the target constant corresponding to the i-th welding temperature control zone according to the termination temperature corresponding to the i-1th welding temperature control zone includes: The initial temperature control function corresponding to the i-th welding temperature control zone is calculated according to the termination temperature corresponding to the i-1th welding temperature control zone and the preset temperature control termination time corresponding to the i-1th welding temperature control zone to obtain the target constant corresponding to the i-th welding temperature control zone.

6. The chip bonding control method according to claim 3, characterized in that: The method further comprises: If the i-th welding temperature control zone is a constant temperature zone or a reflow zone, the i-th welding temperature control zone includes a temperature rising zone and a holding zone; Using the target temperature control function corresponding to the i-th welding temperature control zone as the target temperature control function corresponding to the heating zone; The target temperature control function corresponding to the holding zone is determined according to the preset holding time and the preset holding temperature corresponding to the holding zone.

7. The chip bonding control method according to claim 6, characterized in that: The method further comprises: If the i-th welding temperature control zone is a constant temperature zone, the welding melting point temperature is used as the preset holding temperature; If the i-th welding temperature control zone is a reflow zone, the preset holding temperature is determined according to a preset ratio and the welding melting point temperature.

8. The chip bonding control method according to claim 3, characterized in that: The method further comprises: If the i-th welding temperature control zone is a cooling zone, the i-th welding temperature control zone includes a first temperature reduction zone and a second temperature reduction zone; The termination temperature corresponding to the first cooling zone is a preset temperature value, and the termination temperature corresponding to the second cooling zone is the initial room temperature.

9. A computer device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the chip bonding control method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: It stores a computer program, and when the computer program is executed by a processor, the chip welding control method according to any one of claims 1 to 7 is implemented.

Images