Piezoelectric ceramic piece surface coating polishing device and operation method thereof

Abstract

The invention provides a piezoelectric ceramic piece surface coating grinding device and an operation method thereof, and relates to a grinding structure which comprises a tray carrying mechanism, a material distribution station, a material distribution robot, a bottom shell overturning station, a material carrying mechanism, a grinding stone linkage station and a manual tray feeding rail. The tray carrying mechanism is used for carrying incoming material trays with piezoelectric ceramic pieces to the material distribution station, and the driving end of the material distribution robot is provided with an adsorption head set so as to adsorb coating blank areas of patterned conductive coatings of the piezoelectric ceramic pieces and transfer the piezoelectric ceramic pieces from the material distribution station to the bottom shell overturning station. According to the full-automatic ceramic wafer polishing machine, full-automatic operation of feeding, polishing and discharging of the ceramic wafer through the tray can be achieved, manual intervention transfer is not needed in the midway, touch to a surface coating of the ceramic wafer can be effectively avoided during transition transfer, the smoothness of the coating of the ceramic wafer before polishing is ensured, and the polishing quality of the ceramic wafer is improved. And the grinding efficiency is better.

Description

Technical Field

[0001] The present invention relates to a polishing structure, in particular to a polishing device for the surface coating of a piezoelectric ceramic sheet and an operation method thereof. Background Art

[0002] Piezoelectric ceramics have high hardness and brittleness, and are prone to cracking or chipping. When one side of the piezoelectric ceramic serves as an electrode, a conductive material needs to be coated on the side surface to form an electrical path. Moreover, considering the optimization of electrode performance, improvement of surface quality, ensuring connection reliability, and enhancing the overall performance of the device, it is also necessary to polish the conductive coating on one side of the piezoelectric ceramic;

[0003] Since piezoelectric ceramics have high requirements for the surface finish during polishing, and the existing polishing equipment requires a large amount of manual operation, it is difficult to ensure the surface finish of the piezoelectric ceramic before polishing. Once the surface of the ceramic is dirty before polishing, it is very easy to have polishing errors during polishing, resulting in poor accuracy of the ceramic sheet. At present, the polishing work of the ceramic sheet is also relatively rough and the polishing efficiency is low. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a polishing device for the surface coating of a piezoelectric ceramic sheet and an operation method thereof, which can realize the full-automatic operation of the ceramic sheet from feeding on the tray, polishing, to discharging, without manual intervention and transfer in the middle, and can effectively avoid touching the surface coating of the ceramic sheet during the transition and transfer, ensure the surface finish of the ceramic sheet coating before polishing, and have better polishing efficiency.

[0005] The present invention provides the following technical solutions:

[0006] A piezoelectric ceramic sheet surface coating polishing device and an operating method thereof, comprising a pallet transport mechanism, a material distribution station, a material distribution robot, a bottom shell flipping station, a material transport mechanism, a grinding stone linkage station, and a manual upper plate track, wherein the pallet transport mechanism is used to transport an incoming material pallet with a piezoelectric ceramic sheet to the material distribution station, wherein the piezoelectric ceramic sheet on the incoming material pallet has a patterned conductive coating on its upward surface, and an adsorption head group is installed at the driving end of the material distribution robot to adsorb the coating blank area of ​​the patterned conductive coating of the piezoelectric ceramic sheet, and transfer the piezoelectric ceramic sheet from the material distribution station to the bottom shell flipping station, wherein the bottom shell flipping station is provided with a plurality of adsorption heads, and the plurality of adsorption heads are ... The transfer station includes a flip plate for receiving and adsorbing the feeding of the adsorption head group and a transition plate for receiving the feeding after the flip plate is flipped 180°. When the flip plate receives the material, the conductive coating of the piezoelectric ceramic sheet is still set upward, and after the flip plate is flipped 180°, the conductive coating of the piezoelectric ceramic sheet is set downward. The transition plate is provided with a receiving groove for receiving the piezoelectric ceramic sheet, and the bottom of the receiving groove is provided with a step groove for avoiding the patterned conductive coating. The driving end of the material handling mechanism is equipped with an elastic adsorption group, which is used to adsorb the piezoelectric ceramic sheet in the receiving groove and transport it to the grinding stone linkage station for elastic The polishing is performed after positioning and the polishing is carried to the manual upper plate track. The polishing stone linkage station includes a polishing plate that rotates to horizontally polish the conductive coating of the piezoelectric ceramic piece. The manual upper plate track is provided with a receiving plate for receiving the unloading of the elastic adsorption group. So far, in the overall process, manual work only needs to load the incoming material tray and the receiving plate. Since the piezoelectric ceramic pieces on the incoming material tray are messy and the conductive coating is facing upward, when the material distribution robot, the bottom shell flipping station and the material handling mechanism are used for transition, the conductive coating can be completely avoided before polishing to prevent the conductive coating from being dirty and affecting the polishing accuracy. During polishing, the elastic The elastic adsorption group adsorbs the piezoelectric ceramic sheet so that the side with the conductive coating is pressed against the horizontal grinding disk with a certain elastic force. The piezoelectric ceramic sheet can be grinded by rotating the grinding disk. After the grinding is completed, the elastic adsorption group can continue to drive the piezoelectric ceramic sheet to be transferred to the top of the manual upper disk track. A receiving tray for manual loading is placed on the manual upper disk track for receiving the piezoelectric ceramic sheet. At this point, the ceramic sheet can be fully automatically loaded, polished and unloaded from the tray. There is no need for manual intervention in the transfer in the middle, and the transition transfer can also effectively avoid touching the surface coating of the ceramic sheet, ensuring the smoothness of the ceramic sheet coating before grinding, and the grinding efficiency is also better.

[0007] Preferably, the incoming material trays with piezoelectric ceramic chips are stacked in a palletizing manner in a material box on one side of the material distribution station. The material distribution station includes an empty tray collection area and a material placement area. The tray handling mechanism transports the incoming material trays from the material box to the carrier on the material placement area. A top cylinder is installed at the bottom of the empty tray collection area, and a push plate is also provided on one side of the carrier. After the incoming material tray is emptied, the driving end of the top cylinder moves to be flush with the carrier, and the push plate is activated to drive the emptied incoming material tray to the driving end of the top cylinder. Then, the top cylinder drives the emptied incoming material tray to descend and, when the push plate is activated next time, drives the emptied incoming material tray to move to be flush with the carrier for stacking and palletizing the emptied incoming material trays.

[0008] Preferably, six groups of carrier slots evenly distributed around the central positioning slot are provided on the flipping disk. A set of suction cups is placed at the bottom of each group of carrier slots. The suction head group includes multiple groups of micro suction head units. The multiple groups of micro suction head units jointly adsorb the coating blank area of the patterned conductive coating of the piezoelectric ceramic chip. And a positioning post one for corresponding insertion and positioning with the positioning slot is also provided on one side of the suction head group.

[0009] Preferably, there are six groups of accommodation slots corresponding to the carrier slots one by one, and a positioning post two for insertion and positioning with the positioning slot is also provided at the center of the six groups of accommodation slots.

[0010] Preferably, two sets of flipping disks and two sets of transition disks are provided. The two sets of transition disks are respectively driven by corresponding linear driving parts to move back and forth below the corresponding flipping disks and below the material handling mechanism. And the two sets of transition disks are distributed in a staggered manner during movement. Thus, six piezoelectric ceramic chips can form a unit. When the piezoelectric ceramic chips of a unit are placed on the first set of flipping disks and flipped, the first set of transition disks corresponding to the first set of flipping disks move to below the first set of flipping disks, and the second set of flipping disks can simultaneously continue to be loaded, so as to improve the efficiency of the grinding work. Similarly, when the second set of flipping disks are turned over, the second set of corresponding transition disks move to below the second set of flipping disks, and the first set of transition disks and the second set of transition disks move in a staggered manner to move to below the material handling mechanism to cooperate with it to grab materials.

[0011] Preferably, the elastic adsorption group includes six elastic adsorption head units corresponding one by one to the accommodation grooves on the transition disk and a mounting disk for positioning the six elastic adsorption head units. The mounting disk is installed at the driving end of the material handling mechanism. The six elastic adsorption head units include six fixed sleeves fixedly distributed uniformly along the circumference of the mounting disk. Two guide sleeves are axially guided and connected to both ends of the fixed sleeve. A compression spring is pressed and spaced between the two guide sleeves. The guide sleeve located at the top end of the fixed sleeve is connected to a negative pressure air pipe through a pipeline, and the guide sleeve located at the bottom end of the fixed sleeve is connected with a suction nozzle for adsorbing the piezoelectric ceramic sheet. Thus, during one grinding and handling operation, six piezoelectric ceramic sheets can be synchronously adsorbed and placed on the grinding head. When the grinding head rotates, synchronous grinding of the six grinding heads can be carried out simultaneously to improve the grinding efficiency. Due to the pressing of the compression spring on the guide sleeve, when the material handling mechanism transfers the piezoelectric ceramic sheet above the grinding head and drives the elastic adsorption group to descend, the piezoelectric ceramic sheet can be elastically pressed against the grinding head. That is, due to the pressing of the compression spring, a specific pressing force (such as 2N) can be formed between the piezoelectric ceramic sheet and the grinding head. Thus, stable thickness grinding of the conductive coating of the piezoelectric ceramic sheet can be achieved, and the grinding accuracy is also higher;

[0012] The material distribution robot generally belongs to a manipulator that can be realized by existing technologies to adjust the movement of its driving end in the X, Y, and Z directions. The pallet handling mechanism and the material handling mechanism are linear module type gantry frames that can realize the movement adjustment of their driving ends in the X, Y, and Z directions, which are all existing technologies and will not be elaborated here.

[0013] Preferably, the grinding stone linkage station includes two grinding boxes, a box frame, and a misalignment drive motor; the grinding disc is placed inside the grinding box, and two side plates are provided on both sides of the box frame. Two flared guide grooves are provided on each side plate, and the flared openings of the two guide grooves on each side plate are arranged opposite to each other. The two side plates are located above and the two downward-opening guide grooves are correspondingly arranged, and a grinding box is erected through an X-direction horizontal roller installed in the corresponding guide groove. The X-direction horizontal roller is vertically distributed with the side plate. Two Z-direction slide rails are also provided on both sides of the grinding box. The Z-direction slide rails are slidably connected along the Z direction to a Y-direction slider, and the Y-direction slider is slidably connected along the Y direction to the surface of the side plate. A connecting plate passing through the side plate is also provided on the Y-direction slider. Two drive shafts are rotatably installed between the two side plates. The ends of the two drive shafts on one side plate are connected by a belt to a pulley, and the two connecting plates on one side plate are connected to the belts on both sides of the pulley. The misalignment drive motor installed at the bottom of the box frame is drivingly connected to one of the drive shafts. Therefore, when one drive shaft rotates, the other drive shaft is synchronously driven to rotate by the belt, and the rotation of the belt will also synchronously drive the movement of the connecting plates on the belt. Since the two connecting plates on one side plate are connected to the belts on both sides of the pulley, the rotation of the belt can drive the misaligned reverse movement of the two connecting plates, that is, when one grinding box moves forward, the other grinding box moves backward. Moreover, the flared distribution of the guide grooves and the settings of the Z-direction slide rails and Y-direction sliders can ensure that the two grinding boxes can be misaligned up and down to avoid movement interference.

[0014] Preferably, two corresponding grinding discs are respectively placed in the two grinding boxes. Therefore, when one grinding box moves below the material handling mechanism, one grinding disc can perform the grinding operation, and the other grinding disc can perform the operation of cleaning the grinding disc. The grinding discs in the other misaligned grinding box can perform manual maintenance, replacement, and quality inspection operations to improve efficiency. The bottom rotating block of the grinding disc passes through the grinding box and is rotatably installed at the bottom of the grinding box. Two rotating drive motors are provided and installed on a lifting plate. The lifting plate is drivingly connected to a lifting cylinder installed on the box frame. When the grinding box moves below the material handling mechanism, the lifting cylinder lifts the two rotating drive motors, so that the drive ends of the two rotating drive motors are magnetically connected to the rotating blocks of the two upper grinding discs. Therefore, at this time, since the rotating drive motor can be detachably connected to the grinding disc, the position of the rotating drive motor does not need to move with the grinding box, and only two are needed to complete the corresponding connection of the four grinding discs, which is relatively convenient.

[0015] Preferably, a set of air-blowing groups is further provided on one side of the cartridge rack. The air-blowing group includes an air-blowing box that reciprocates driven by a push cylinder. When the grinding box moves below the material handling mechanism, the air-blowing box is horizontally driven by the push cylinder to cover above the grinding box. On one side of the air-blowing box, there are two groups of high-pressure carbon dioxide gas inlets aligned with the two groups of grinding discs, and on the other side, there are two groups of circulating gas outlets opposite to the two groups of high-pressure carbon dioxide gas inlets. Therefore, when one group of grinding discs is performing grinding operations, the air-blowing box can not only provide a certain degree of protection, but also, on one side of the other group of idle grinding discs, high-pressure carbon dioxide gas can be ejected to blow and clean the grinding discs. The blown gas can be collected by the circulating gas outlet for recycling. Above the air-blowing box, there is also a nozzle for blowing hot air towards the grinding discs to dehumidify.

[0016] In order to further improve the automation efficiency, the manual loading track is set as a conveyor belt track. The operator places the receiving tray for collecting a unit (six groups) of piezoelectric ceramic chips on the conveyor belt track. The elastic adsorption group can then move above the receiving tray driven by the material handling mechanism to unload the piezoelectric ceramic chips. On one side of the manual loading track, there is also a tray automatic loading mechanism, which is used to convey the pallet to move to the side of the unloading manipulator. The unloading manipulator then individually clamps the piezoelectric ceramic chips on the receiving tray and stacks them into the stacking slots of the pallet. The tray automatic loading mechanism includes a set of palletizing and sorting groups. The palletizing and sorting group is a prior art, that is, the sorting claws are used to position the bottom second-to-last layer of the stacked trays. The bottom layer of the stacked trays then falls onto the conveyor belt below and moves to the positioning area with the conveyor belt. In the positioning area, a slot plate driven by a set of top cylinders limits a set of stacked trays to ensure the positioning of the stacked trays. Subsequently, the unloading manipulator is used to transfer the piezoelectric ceramic chips to the stacked trays, and after the stacking is completed, the driving linear module for positioning the set of top cylinders drives the stacked trays after stacking to the next station, waiting for the stacking manipulator to carry the stacked trays.

[0017] An operating method of a piezoelectric ceramic chip surface coating grinding device, based on the above-mentioned piezoelectric ceramic chip surface coating grinding device, includes the following steps:

[0018] S1: First, the operator moves a material box with a set of stacked incoming trays to one side of the tray handling mechanism, and then the tray handling mechanism transports a set of incoming trays to the material distribution station;

[0019] S2: The driving end of the material distribution robot moves above the incoming tray, and adjusts the position of the adsorption head group of the driving end by taking pictures to collect the position and pattern information of the piezoelectric ceramic chips, so as to avoid the patterned conductive coating on the piezoelectric ceramic chips and adsorb the piezoelectric ceramic chips. The material distribution robot transfers the piezoelectric ceramic chips to the flipping plate, and then the flipping plate flips 180° to turn the piezoelectric ceramic chips over and place them on the transition plate;

[0020] S3: The transition plate delivers the piezoelectric ceramic sheet to the bottom of the material handling mechanism, and then the elastic adsorption group of the material handling mechanism adsorbs the piezoelectric ceramic sheet and transports it to the grinding stone linkage station for elastic positioning grinding, and after grinding, continues to transport the piezoelectric ceramic sheet to the manual upper plate track to complete unloading.

[0021] The beneficial effects of the present invention are as follows: a piezoelectric ceramic sheet surface coating polishing device and an operating method thereof provided by the present invention can realize the fully automatic operation of loading, polishing and unloading ceramic sheets from a tray, without the need for manual intervention in the transfer, and the transition transfer can also effectively avoid touching the surface coating of the ceramic sheet, thereby ensuring the smoothness of the coating of the ceramic sheet before polishing, and the polishing efficiency is also better. In the overall process, manual labor only needs to load the incoming material tray and the receiving tray. Since the piezoelectric ceramic sheets placed on the incoming material tray are messy and the conductive coating is facing upward, when the transition is performed through the material distribution robot, the bottom shell flipping station and the material handling mechanism, the conductive coating can be completely avoided before polishing to avoid conductive The coating becomes dirty, which affects the grinding accuracy. During grinding, the elastic adsorption group adsorbs the piezoelectric ceramic sheet so that the side with the conductive coating is pressed on the horizontal grinding disk with a certain elastic force. The piezoelectric ceramic sheet can be grinded by rotating the grinding disk. After grinding, the elastic adsorption group can continue to drive the piezoelectric ceramic sheet to be transferred to the top of the manual upper disk track. A receiving tray for manual loading is placed on the manual upper disk track for receiving the piezoelectric ceramic sheet. At this point, the ceramic sheet can be fully automatically loaded, polished and unloaded from the tray. There is no need for manual intervention in the transfer in the middle, and the transition transfer can also effectively avoid touching the surface coating of the ceramic sheet, ensuring the smoothness of the ceramic sheet coating before grinding, and the grinding efficiency is also better. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0023] Figure 1 It is a schematic diagram of the positions of the material distribution station, the bottom shell turning station, the material handling mechanism, the grinding stone linkage station, and the manual upper plate track in the present invention;

[0024] Figure 2 It is a top view of the position of the pallet handling mechanism, material distribution station, material distribution robot, bottom shell flipping station, material handling mechanism, and grinding stone linkage station;

[0025] Figure 3 It is a structural schematic diagram of the pallet handling mechanism;

[0026] Figure 4 It is a structural diagram of the material distribution station;

[0027] Figure 5 It is a schematic structural diagram of the driving end of the material distribution robot;

[0028] Figure 6 It is a schematic structural diagram of the bottom shell flipping station;

[0029] Figure 7 It is a schematic structural diagram of the transition plate part;

[0030] Figure 8 It is a schematic structural diagram of the flipping plate;

[0031] Figure 9 It is a schematic structural diagram of the material handling mechanism;

[0032] Figure 10 It is a schematic structural diagram of the grinding stone linkage station;

[0033] Figure 11 It is a schematic structural diagram of the elastic adsorption group;

[0034] Figure 12 It is Figure 10 a partial structural diagram of;

[0035] Figure 13 It is a schematic structural diagram of the air blowing box part;

[0036] Figure 14 It is a schematic structural diagram of the manual loading track;

[0037] Figure 15 It is a schematic structural diagram of the automatic pallet loading mechanism;

[0038] Figure 16 It is a schematic structural diagram of the trough plate part;

[0039] Markings in the figure:

[0040] 1. Pallet handling mechanism; 2. Material distribution station; 3. Material distribution robot; 4. Bottom shell turning station; 5. Material handling mechanism; 6. Grinding stone linkage station; 7. Manual loading track; 8. Piezoelectric ceramic sheet; 9. Incoming material pallet; 10. Receiving tray; 11. Pallet automatic loading mechanism; 12. Stacking pallet; 13. Top cylinder; 14. Slot plate; 15. Drive linear module; 21. Material box; 22. Empty material tray collection area; 23. Material placement area; 24. Carrier; 25. Top cylinder; 26. Push plate; 31. Adsorption head group; 41. Turning plate; 42. Transition plate; 43. Container; 44. Step slot; 45. Carrier slot; 46. Suction cup; 47. Positioning Column one; 48, positioning column two; 49, linear drive unit; 51, elastic adsorption group; 61, grinding disc; 62, grinding box; 63, box frame; 64, offset drive motor; 65, side plate; 66, guide groove; 67, X-axis horizontal roller; 68, Z-axis slide rail; 69, Y-axis slide block; 610, connecting plate; 611, drive shaft; 612, lifting plate; 613, lifting cylinder; 614, rotary drive motor; 615, cleaning box; 616, high-pressure carbon dioxide gas inlet; 617, circulating gas outlet; 618, nozzle; 511, mounting plate; 512, elastic adsorption head unit; 5121, fixing sleeve; 5122, guide sleeve; 5123, suction nozzle. DETAILED DESCRIPTION

[0041] Example 1

[0042] like Figure 1-14As shown, a piezoelectric ceramic sheet surface coating polishing device, in this embodiment, includes a pallet handling mechanism 1, a material distribution station 2, a material distribution robot 3, a bottom shell flipping station 4, a material handling mechanism 5, a grinding stone linkage station 6, and a manual upper plate track 7. The pallet handling mechanism 1 is used to carry an incoming material pallet 9 with a piezoelectric ceramic sheet 8 to the material distribution station 2. The piezoelectric ceramic sheet 8 on the incoming material pallet 9 has a patterned conductive coating on its upward surface. The driving end of the material distribution robot 3 is equipped with an adsorption head group 31 to adsorb the coating blank area of ​​the patterned conductive coating of the piezoelectric ceramic sheet 8, and transfer the piezoelectric ceramic sheet 8 from the material distribution station 2 to the bottom shell flipping station 4. The bottom shell flipping station 4 is used to carry the piezoelectric ceramic sheet 8 to the material distribution station 2. The transfer station 4 includes a flip plate 41 for receiving and adsorbing the feeding of the adsorption head group 31 and a transition plate 42 for receiving the feeding of the flip plate 41 after flipping 180°. When the flip plate 41 receives the material, the conductive coating of the piezoelectric ceramic piece 8 is still set upward, and after the flip plate 41 flips 180°, the conductive coating of the piezoelectric ceramic piece 8 is set downward. A receiving groove 43 for receiving the piezoelectric ceramic piece 8 is provided on the transition plate 42, and a step groove 44 for avoiding the patterned conductive coating is provided at the bottom of the receiving groove 43. The driving end of the material handling mechanism 5 is installed with an elastic adsorption group 51, and the elastic adsorption group 51 is used to adsorb the piezoelectric ceramic piece 8 in the receiving groove 43 and transport it to the grinding stone linkage station 6 for elastic positioning grinding and after grinding, it is transported to the manual upper plate track 7. The grinding stone linkage station 6 includes a grinding disc 61 that rotates to horizontally grind the conductive coating of the piezoelectric ceramic piece 8. The manual upper plate track 7 is provided with a receiving tray 10 for receiving the unloading of the elastic adsorption group 51. So far, in the overall process, manual loading only requires the incoming material tray 9 and the receiving tray 10. Since the piezoelectric ceramic piece 8 placed on the incoming material tray 9 is messy and the conductive coating is facing upward, when the material distribution robot 3, the bottom shell flipping station 4 and the material handling mechanism 5 are used for transition, the conductive coating can be completely avoided before grinding to avoid dirt on the conductive coating and affect the grinding accuracy. The elastic adsorption group 51 adsorbs the piezoelectric ceramic sheet 8 so that the side with the conductive coating is pressed against the horizontal grinding disc 61 with a certain elastic force. The grinding disc 61 can rotate to grind the piezoelectric ceramic sheet 8. After the grinding is completed, the elastic adsorption group 51 can continue to drive the piezoelectric ceramic sheet 8 to be transferred to the top of the manual upper disk track 7. A receiving tray 10 for manual loading of the piezoelectric ceramic sheet 8 is provided on the manual upper disk track 7. At this point, the fully automatic operation of loading, grinding and unloading the ceramic sheet from the tray can be realized. There is no need for manual intervention in the transfer in the middle, and the transition transfer can also effectively avoid touching the surface coating of the ceramic sheet, ensuring the smoothness of the ceramic sheet coating before grinding, and the grinding efficiency is also better.

[0043] Example 2

[0044] A piezoelectric ceramic sheet surface coating grinding device, in this embodiment, is further defined based on embodiment 1, such asFigure 2-4 As shown in the figure, the incoming material trays 9 with piezoelectric ceramic chips 8 are stacked in a palletizing manner in the material box 21 on one side of the material distribution station 2. The material distribution station 2 includes an empty tray collection area 22 and a material placement area 23. The tray handling mechanism 1 transports the incoming material tray 9 from the material box 21 to the carrier 24 in the material placement area 23. A push rod cylinder 25 is installed at the bottom of the empty tray collection area 22, and a push plate 26 is also provided on one side of the carrier 24. After the incoming material tray 9 is emptied, the driving end of the push rod cylinder 25 moves to be flush with the carrier 24, and the push plate 26 is activated to drive the emptied incoming material tray 9 to the driving end of the push rod cylinder 25. Then, the push rod cylinder 25 drives the emptied incoming material tray 9 to descend and, when the push plate 26 is activated next time, drives the emptied incoming material tray 9 to move to be flush with the carrier 24 for palletizing and stacking of the emptied incoming material trays 9.

[0045] As Figure 5-8 shown in the figure, six groups of carrier slots 45 are evenly distributed around the central positioning slot on the turning plate 41. A set of suction cups 46 is placed at the bottom of each group of carrier slots 45. The adsorption head group 31 includes multiple groups of micro-adsorption head units. The multiple groups of micro-adsorption head units jointly adsorb the coating blank area of the patterned conductive coating of the piezoelectric ceramic chip 8, and a positioning post one 47 for corresponding insertion and positioning with the positioning slot is also provided on one side of the adsorption head group 31.

[0046] There are six groups of receiving slots 43 corresponding one-to-one to the carrier slots 45, and a positioning post two 48 for insertion and positioning with the positioning slot is also provided at the center of the six groups of receiving slots 43.

[0047] Both the turning plate 41 and the transition plate 42 are provided in two groups. The two groups of transition plates 42 are respectively driven by corresponding linear driving parts 49 (cylinders) to move back and forth below the corresponding turning plate 41 and below the material handling mechanism 5, and the two groups of transition plates 42 are distributed in a staggered manner during movement. Thus, six piezoelectric ceramic chips 8 can form a unit. When the piezoelectric ceramic chips 8 of a unit are placed on the first group of turning plates 41 and turned over, the first group of transition plates 42 corresponding to the first group of turning plates 41 move below the first group of turning plates 41, and the second group of turning plates 41 can simultaneously continue to be loaded, so as to improve the efficiency of the grinding work. Similarly, when the second group of turning plates 41 are turned over, the second group of corresponding transition plates 42 move below the second group of turning plates 41, and the first group of transition plates 42 and the second group of transition plates 42 move in a staggered manner to move below the material handling mechanism 5 to cooperate with it to grab materials.

[0048] As Figure 11As shown in the figure, the elastic adsorption group 51 includes six groups of elastic adsorption head units 512 corresponding one-to-one to the receiving grooves 43 on the transition disk 42, and a mounting disk 511 for positioning the six groups of elastic adsorption head units 512. The mounting disk 511 is installed at the driving end of the material handling mechanism 5. The six groups of elastic adsorption head units 512 include six groups of fixed sleeves 5121 evenly distributed and fixed along the circumferential direction of the mounting disk 511. Two guide sleeves 5122 are axially guided and connected at both ends of the fixed sleeve 5121. A set of compression springs are pressed and spaced between the two guide sleeves 5122. And the guide sleeve 5122 at the top end of the fixed sleeve 5121 is connected to the negative pressure air pipe through a pipeline, and the guide sleeve 5122 at the bottom end of the fixed sleeve 5121 is connected with a nozzle 5123 for adsorbing the piezoelectric ceramic sheet 8. Thus, during one grinding and handling operation, six groups of piezoelectric ceramic sheets 8 can be synchronously adsorbed and placed on the grinding head. When the grinding head rotates, synchronous grinding of the six groups of grinding heads can be carried out simultaneously to improve the grinding efficiency. And due to the pressing of the compression spring on the guide sleeve 5122, when the material handling mechanism 5 transfers the piezoelectric ceramic sheet 8 above the grinding head and drives the elastic adsorption group 51 to descend, the piezoelectric ceramic sheet 8 can be elastically pressed against the grinding head. That is, due to the pressing of the compression spring, a pressing force of a specific magnitude (such as 2N) can be formed between the piezoelectric ceramic sheet 8 and the grinding head. Thus, stable thickness grinding of the conductive coating of the piezoelectric ceramic sheet 8 can be achieved, and the grinding accuracy is also higher;

[0049] The material distribution robot 3 generally belongs to a manipulator that can be realized by existing technologies to adjust the movement of its driving end in the X, Y, and Z directions. The pallet handling mechanism 1 and the material handling mechanism 5 are linear module type gantry frames that can realize the movement adjustment of their driving ends in the X, Y, and Z directions, which are all existing technologies and will not be elaborated here.

[0050] Such as Figure 10 、 12As shown in FIGS. 13, the grinding stone linkage station 6 includes two groups of grinding boxes 62, a box frame 63, and a misalignment drive motor 64; the grinding disc 61 is placed inside the grinding box 62, and two groups of side plates 65 are provided on both sides of the box frame 63. Two groups of flared guide grooves 66 are formed on each group of side plates 65, and the flares of the two groups of guide grooves 66 on each group of side plates 65 are arranged oppositely. The two groups of guide grooves 66 on the two groups of side plates 65 that are located above and open downward are correspondingly arranged, and a grinding box 62 is erected by an X-direction horizontal roller 67 that is guided and installed in the corresponding guide groove 66. The X-direction horizontal roller 67 is vertically distributed with the side plate 65. Two groups of Z-direction slide rails 68 are also provided on both sides of the grinding box 62. The Z-direction slide rails 68 are slidably connected along the Z-direction to a Y-direction slider 69, and the Y-direction slider 69 is slidably connected along the Y-direction to the surface of the side plate 65. A connecting plate 610 that penetrates through the side plate 65 is also provided on the Y-direction slider 69. Two drive shafts 611 are rotatably installed between the two groups of side plates 65. The ends of the two drive shafts 611 on one group of side plates 65 are connected by a belt to a pulley, and the two connecting plates 610 on one group of side plates 65 are connected to the belts on both sides of the pulley. The misalignment drive motor 64 installed at the bottom of the box frame 63 is drivingly connected to one of the drive shafts 611. Therefore, when one of the drive shafts 611 is driven to rotate, the other drive shaft 611 is synchronously driven to rotate by the belt, and the rotation of the belt will also synchronously drive the movement of the connecting plate 610 on the belt. Since the two connecting plates 610 on one group of side plates 65 are connected to the belts on both sides of the pulley, the rotation of the belt can drive the misaligned reverse movement of the two connecting plates 610, that is, when one grinding box 62 moves forward, the other grinding box 62 moves backward. Moreover, the flared distribution of the guide grooves 66 and the settings of the Z-direction slide rails 68 and the Y-direction slider 69 can ensure that the two grinding boxes 62 can achieve vertical misalignment and avoid movement interference.

[0051] Two groups of corresponding grinding discs 61 are respectively arranged in the two groups of grinding boxes 62. Therefore, when one group of grinding boxes 62 moves to the bottom of the material handling mechanism 5, one group of grinding discs 61 can perform grinding operations, and the other group of grinding discs 61 can perform cleaning operations. The grinding discs 61 in the other group of misplaced grinding boxes 62 can be manually maintained, replaced and inspected to improve efficiency. The bottom end rotating block of the grinding disc 61 is installed on the bottom of the grinding box 62 after passing through the grinding box 62. The rotating drive motor 614 is provided with two groups and is installed on a group of lifting plates 612. The plate 612 is driven and connected to the lifting cylinder 613 installed on the box frame 63. When the grinding box 62 moves to the bottom of the material handling mechanism 5, the lifting cylinder 613 lifts the two sets of rotary drive motors 614, so that the driving ends of the two sets of rotary drive motors 614 are magnetically connected to the two sets of grinding discs 61 rotating blocks above. Therefore, at this time, the rotary drive motor 614 can be detachably connected to the grinding disc 61. Therefore, the position of the rotary drive motor 614 does not need to move with the grinding box 62, and only two sets are needed to complete the corresponding connection of four sets of grinding discs 61, which is more convenient.

[0052] A cleaning and blowing group is also provided on one side of the box frame 63, and the cleaning and blowing group includes a cleaning and blowing box 615 driven to reciprocate by a push cylinder. When the grinding box 62 moves to the bottom of the material handling mechanism 5, the cleaning and blowing box 615 is covered above the grinding box 62 under the horizontal drive of the push cylinder. One side of the cleaning and blowing box 615 is provided with two groups of high-pressure carbon dioxide gas inlets 616 corresponding to the two groups of grinding discs 61, and the other side is provided with two groups of circulating gas outlets 617 opposite to the two groups of high-pressure carbon dioxide gas inlets 616. Therefore, when one group of grinding discs 61 is performing grinding operations, the cleaning and blowing box 615 can not only play a certain protective effect, but also one side of the other group of idle grinding discs 61 can spray high-pressure carbon dioxide gas to clean the grinding discs 61, and the sprayed gas can be collected by the circulating gas outlet 617 for recirculation. A nozzle 618 for spraying hot air toward the grinding disc 61 for dehumidification is also provided above the cleaning and blowing box 615.

[0053] Example 3

[0054] like Figure 15-16As shown in the figure, a grinding device for the surface coating of piezoelectric ceramic chips. In this embodiment, it is a further limitation based on Embodiment 2. In order to further improve the automation efficiency, the manual loading track 7 is set as a conveyor belt track. The operator places the receiving tray 10 for collecting a unit (six groups) of piezoelectric ceramic chips 8 on the conveyor belt track. Then, the elastic adsorption group 51 can move above the receiving tray 10 under the drive of the material handling mechanism 5 to unload the piezoelectric ceramic chips 8. On one side of the manual loading track 7, there is also a tray automatic feeding mechanism 11. The tray automatic feeding mechanism 11 is used to convey the pallet 12 to the side of the unloading manipulator. The unloading manipulator then picks up the piezoelectric ceramic chips 8 on the receiving tray 10 one by one and stacks them into the stacking slots of the pallet 12. The tray automatic feeding mechanism 11 includes a set of palletizing and sorting groups. The palletizing and sorting groups are prior art, that is, the sorting claws are used to position the bottom layer and the second-to-last layer of the stacked material trays. The bottom layer of the stacked material trays then falls onto the conveyor belt below and moves to the positioning area with the conveyor belt. In the positioning area, a slot plate 14 driven by a set of top cylinders 13 limits a set of stacked material trays to ensure the positioning of the stacked material trays. Then, the unloading manipulator is used to transfer the piezoelectric ceramic chips 8 to the stacked material trays. And after the stacking is completed, the driving linear module 15 for positioning the set of top cylinders 13 drives the stacked material trays after palletizing to the next station, waiting for the stacking manipulator to carry the stacked material trays.

[0055] Embodiment 4

[0056] An operating method of a grinding device for the surface coating of piezoelectric ceramic chips. Based on a grinding device for the surface coating of piezoelectric ceramic chips in Embodiment 1, it includes the following steps:

[0057] S1: First, the operator moves a material box 21 with a set of stacked incoming material trays 9 to the side of the tray handling mechanism 1, and then the tray handling mechanism 1 transports a set of incoming material trays 9 to the material distribution station 2.

[0058] S2: The driving end of the material distribution robot 3 moves above the incoming material tray 9, and adjusts the position of the adsorption head group 31 at the driving end by taking pictures to collect the position and pattern information of the piezoelectric ceramic chips 8, so as to avoid the patterned conductive coating on the piezoelectric ceramic chips 8 and adsorb the piezoelectric ceramic chips 8. The material distribution robot 3 transfers the piezoelectric ceramic chips 8 to the flipping disk 41, and then the flipping disk 41 flips 180° to turn the piezoelectric ceramic chips 8 over and place them on the transition disk 42.

[0059] S3: The transition disk 42 sends the piezoelectric ceramic chips 8 below the material handling mechanism 5. Then, the elastic adsorption group 51 of the material handling mechanism 5 adsorbs the piezoelectric ceramic chips 8 and transports them to the grinding stone linkage station 6 for elastic positioning grinding, and continues to transport the piezoelectric ceramic chips 8 to the manual loading track 7 after grinding to complete the unloading.

[0060] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A piezoelectric ceramic sheet surface coating polishing device, characterized in that: It includes a pallet handling mechanism, a material distribution station, a material distribution robot, a bottom shell flipping station, a material handling mechanism, a grinding stone linkage station, and a manual upper plate track. The pallet handling mechanism is used to carry the incoming pallet with piezoelectric ceramic sheets to the material distribution station. The piezoelectric ceramic sheets on the incoming pallet have a patterned conductive coating on their upward surfaces. The driving end of the material distribution robot is equipped with an adsorption head group to adsorb the coating blank area of ​​the patterned conductive coating of the piezoelectric ceramic sheets, and transfer the piezoelectric ceramic sheets from the material distribution station to the bottom shell flipping station. The bottom shell flipping station includes a flipping plate for receiving and adsorbing the feeding of the adsorption head group. and a transition plate for receiving the feeding of the flip plate when it flips 180°, the transition plate is provided with a receiving groove for receiving the piezoelectric ceramic sheet, and the bottom of the receiving groove is provided with a step groove for avoiding the patterned conductive coating, the driving end of the material handling mechanism is equipped with an elastic adsorption group, the elastic adsorption group is used to adsorb the piezoelectric ceramic sheet in the receiving groove and transport it to the grinding stone linkage station for elastic positioning grinding and after grinding, it is transported to the artificial upper plate track, the grinding stone linkage station includes a grinding plate that rotates to horizontally grind the conductive coating of the piezoelectric ceramic sheet, and the artificial upper plate track is provided with a receiving plate for receiving the unloading of the elastic adsorption group.

2. A piezoelectric ceramic sheet surface coating polishing device according to claim 1, characterized in that: Incoming material pallets with piezoelectric ceramic sheets are stacked and placed in a material box on one side of a material distribution station. The material distribution station includes an empty material pallet collection area and a material placement area. The pallet transport mechanism transports the incoming material pallets from the material box to the carrier in the material placement area. A lifting cylinder is installed at the bottom of the empty material pallet collection area, and a pushing plate is also provided on one side of the carrier. After the incoming material pallet is emptied, the driving end of the lifting cylinder moves to be flush with the carrier, and the pushing plate is started to drive the incoming material pallet with empty material to move to the driving end of the lifting cylinder, and then the lifting cylinder drives the incoming material pallet with empty material to descend and drives the incoming material pallet with empty material to move to be flush with the carrier when the pushing plate is started next time to stack the incoming material pallets with empty material.

3. A piezoelectric ceramic sheet surface coating polishing device according to claim 1, characterized in that: The flip plate is provided with six groups of loading slots evenly distributed around the central positioning slot, and a group of suction cups are placed at the bottom of each group of loading slots. The adsorption head group includes multiple groups of micro adsorption head units, and the multiple groups of micro adsorption head units are combined to adsorb the coating blank area of ​​the patterned conductive coating of the piezoelectric ceramic sheet, and one side of the adsorption head group is also provided with a positioning column for correspondingly plugging into the positioning slot.

4. A piezoelectric ceramic sheet surface coating polishing device according to claim 3, characterized in that: The receiving slots are six groups corresponding to the carrying slots one by one, and the centers of the six groups of receiving slots are provided with positioning posts 2 which are plugged and positioned with the positioning slots.

5. A piezoelectric ceramic sheet surface coating polishing device according to claim 4, characterized in that: The overturning disc and the transition disc are both arranged in two groups, and the two groups of transition discs are respectively driven by corresponding linear drive parts to move back and forth under the corresponding overturning disc and under the material handling mechanism, and the two groups of transition discs are staggered when moving.

6. A piezoelectric ceramic sheet surface coating polishing device according to claim 5, characterized in that: The elastic adsorption group includes six groups of elastic adsorption head units corresponding one by one to the receiving grooves on the transition plate and a mounting plate for positioning the six groups of elastic adsorption head units, the mounting plate is installed at the driving end of the material handling mechanism, the six groups of elastic adsorption head units include six groups of fixed sleeves evenly distributed and fixed along the circumference of the mounting plate, two groups of guide sleeves are connected to the two ends of the fixed sleeve along the axial guide, a group of top pressure springs are pressed between the two groups of guide sleeves, and the guide sleeve at the top end of the fixed sleeve is connected to the negative pressure air pipe through a pipeline, and the guide sleeve at the bottom end of the fixed sleeve is connected to a suction nozzle for adsorbing piezoelectric ceramic sheets.

7. A piezoelectric ceramic sheet surface coating polishing device according to claim 1, characterized in that: The grinding stone linkage station includes two groups of grinding boxes, a box frame, and a staggered driving motor; the grinding disc is placed in the grinding box, and a group of side panels are respectively provided on both sides of the box frame, and each group of side panels is provided with two groups of flared guide grooves, and the flared openings of the two groups of guide grooves on each group of side panels are arranged oppositely, and the two groups of guide grooves located above the two groups of side panels and opening downward are arranged correspondingly, and a group of grinding boxes are arranged by guiding the X-direction horizontal rollers installed in the corresponding guide grooves, and the X-direction horizontal rollers are vertically distributed with the side panels, and the two sides of the grinding box are also provided with Two groups of Z-direction slide rails, the Z-direction slide rails are slidably mounted on a group of Y-direction sliders along the Z-direction, the Y-direction sliders are slidably mounted on the plate surface of the side plates along the Y-direction, and the Y-direction sliders are also slidably mounted on the plate surface of the side plates. A group of connecting plates that pass through the side plates are also arranged on the Y-direction sliders. Two groups of drive shafts are installed between the two groups of side plates. The ends of the two groups of drive shafts on one group of side plates are connected to a group of belts through pulleys, and the two groups of connecting plates on one group of side plates are connected to the belts on both sides of the pulleys. The offset drive motor installed at the bottom of the box frame is connected to the drive of a group of drive shafts.

8. A piezoelectric ceramic sheet surface coating polishing device according to claim 7, characterized in that: Two groups of corresponding grinding discs are respectively placed in the two groups of grinding boxes, and the bottom rotating blocks of the grinding discs pass through the grinding boxes and are installed on the bottom of the grinding boxes. Two groups of rotary drive motors are provided and are installed on a group of lifting plates. The lifting plates are driven and connected to the lifting cylinders installed on the box frame. When the grinding boxes move to the bottom of the material handling mechanism, the lifting cylinders lift the two groups of rotary drive motors, so that the driving ends of the two groups of rotary drive motors are magnetically connected to the two groups of grinding disc rotating blocks above.

9. A piezoelectric ceramic sheet surface coating polishing device according to claim 8, characterized in that: A cleaning and blowing group is also provided on one side of the box frame, and the cleaning and blowing group includes a cleaning and blowing box driven to reciprocate by a push cylinder. When the grinding box moves to the bottom of the material handling mechanism, the cleaning and blowing box is covered above the grinding box under the horizontal drive of the push cylinder. One side of the cleaning and blowing box is provided with two groups of high-pressure carbon dioxide gas inlets corresponding to the two groups of grinding discs, and the other side is provided with two groups of circulating gas outlets opposite to the two groups of high-pressure carbon dioxide gas inlets. A nozzle for spraying hot air toward the grinding disc for dehumidification is also provided above the cleaning and blowing box.

10. An operating method of a piezoelectric ceramic sheet surface coating grinding device, based on a piezoelectric ceramic sheet surface coating grinding device according to any one of claims 1 to 9, characterized in that: The steps include: S1: First, a group of material boxes stacked with multiple groups of incoming pallets are manually moved to one side of the pallet handling mechanism, and then the pallet handling mechanism transports a group of incoming pallets to the material distribution station; S2: The driving end of the material distribution robot moves to the top of the incoming material tray, and collects the position and pattern information of the piezoelectric ceramic sheet by taking photos to adjust the position of the driving end adsorption head group to avoid the patterned conductive coating on the piezoelectric ceramic sheet to adsorb the piezoelectric ceramic sheet. The material distribution robot transfers the piezoelectric ceramic sheet to the flip plate, and then the flip plate flips 180° to turn the piezoelectric ceramic sheet over and place it on the transition plate; S3: The transition plate delivers the piezoelectric ceramic sheet to the bottom of the material handling mechanism, and then the elastic adsorption group of the material handling mechanism adsorbs the piezoelectric ceramic sheet and transports it to the grinding stone linkage station for elastic positioning grinding, and after grinding, continues to transport the piezoelectric ceramic sheet to the manual upper plate track to complete unloading.

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