Grabbing device and grabbing equipment for quickly picking up silicon wafers

Abstract

The invention relates to the technical field of semiconductor silicon wafer grabbing and transferring, in particular to a grabbing device and grabbing equipment for quickly picking up a silicon wafer, which comprises a fixed bracket, an adhesion and desorption driving module, an adhesion module and a boundary stress control module, the fixed bracket comprises a top plate, a bottom plate and a guide shaft group; the adhesion and desorption driving module comprises a movable plate and a driving assembly; the adhesion module comprises a movable rod and an adhesion film arranged at the free end of the movable rod, and the adhesion film provides adhesion force; the boundary stress control module is arranged on the face, away from the movable plate, of the bottom plate and comprises at least two flexible non-viscous pieces distributed in the circumferential direction of the axis of the movable rod. The free end of the movable rod penetrates through the bottom plate, the adhesion film and the flexible non-adhesive sheet alternately make contact with the silicon wafer, adhesion or desorption of the silicon wafer is achieved in an active control mode, and the device can be used in a vacuum environment. And the flexible non-viscous sheet effectively controls stress diffusion, the acting stress is reduced from the MPa level to KPa, and an effective protection effect on the silicon wafer is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor silicon wafer grasping and transferring, and particularly to a grasping device and a grasping equipment for quickly picking up silicon wafers. Background Art

[0002] With the progress of technology, the thickness of silicon wafers is developing towards ultra-thinness, and the silicon wafers are becoming more and more brittle, which leads to higher requirements for the grippers for grasping and transferring silicon wafers. At present, in the production of solar cells, silicon wafers are transferred to a conveyor belt one by one, subjected to EL or PL tests, and sorted according to quality. These processes usually use suction cups to grasp and transfer silicon wafers, and suction cups are also used in multiple processes in the process of fabricating chips from wafers in a clean environment.

[0003] However, there are some problems with the suction cup grasping method. First of all, the suction cup method needs to use a vacuum pump or an air pump to achieve grasping, which not only results in high energy consumption and high noise, but also makes the air circuit control complex and increases the volume of the overall equipment. Secondly, the release process of the suction cup depends on the gravity of the silicon wafer, which cannot work effectively in a vacuum environment. In addition, the suction cup grasping method has a greater acting stress on the silicon wafer, which easily leads to an increase in the wafer fragmentation rate and is difficult to meet the requirements of high production rhythm and low fragmentation rate. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: to provide a grasping device and a grasping equipment for quickly picking up silicon wafers, effectively solving the problems in the background art.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is: a grasping device for quickly picking up silicon wafers, comprising: A fixed bracket, including a top plate, a bottom plate, and a guide shaft group disposed between the top plate and the bottom plate; An adhesion and detachment driving module, including a movable plate disposed between the top rod and the bottom plate, and a driving component disposed on the top plate for driving the movable plate to move along the axial direction of the guide shaft group; An adhesion module, including a movable rod fixed on the movable plate, and an adhesion film disposed at the free end of the movable rod, the adhesion film providing an adhesion force for picking up the silicon wafer; A boundary stress control module, disposed on a surface of the bottom plate away from the movable plate, including at least two flexible non-adhesive sheets distributed along the circumferential direction of the axis of the movable rod; The free end of the movable rod passes through the bottom plate, and the adhesion film and the flexible non-adhesive sheets alternately contact the silicon wafer to achieve adhesion and detachment of the silicon wafer.

[0006] Further, the boundary stress control module further includes a top rod fixed on the bottom plate and parallel to the movable rod; The flexible non - sticky sheet is arranged at the free end of the ejector rod.

[0007] Furthermore, at least two groups of the adhesion modules are arranged on the movable plate.

[0008] Furthermore, the contact surface between the adhesion film and the silicon wafer is spherical or planar.

[0009] Furthermore, the adhesion film is one of a bionic micro - structure film, a polyurethane film, a PDMS film, a sticky silicone film, a polyacrylate, a polyvinyl alcohol, and a derivative sticky polymer containing the same.

[0010] Furthermore, the flexible non - sticky material is one of non - sticky silicone, non - sticky polyurethane, and textile fabric.

[0011] Furthermore, a movable steel sleeve through which the movable rod slides is arranged on the bottom plate.

[0012] Furthermore, the driving assembly includes a motor, a lead screw, and a nut. The motor is connected to the lead screw. The nut is fixed on the movable plate and cooperates with the lead screw. Wherein, the motor rotates the lead screw, so that the nut moves along the axial direction of the lead screw, driving the movable plate to move up and down. The up - and - down movement of the movable plate is transmitted to the adhesion film. Based on the pre - load force applied by the motor, the adhesion force of the adhesion film to the silicon wafer is regulated.

[0013] Furthermore, the flexible non - sticky sheet is made of a compressible material, and the adhesion force of the adhesion film is greater than the elastic recovery force of the flexible non - sticky sheet.

[0014] The present invention also provides a grasping device, including: the grasping device for quickly picking up a silicon wafer as described above; and a connecting flange arranged on the grasping device; and a robotic arm configured to be able to drive the grasping device to rotate and / or move.

[0015] The beneficial effects of the present invention are as follows: In the present invention, under the control of the adhesion - detachment driving module, the adhesion module cooperates with the boundary stress control module, and adopts an active control method to realize the adhesion or detachment of the silicon wafer, and can be used in a vacuum environment; during the detachment process of the silicon wafer, the flexible non - sticky sheets distributed around the adhesion module can buffer the contact force and effectively control the stress diffusion, reducing the acting stress of the manipulator on the silicon wafer from the MPa level to the KPa level, thereby effectively protecting the silicon wafer.

[0016] In the present invention, the response time for gripping and releasing a silicon wafer is between 0.1 second and 0.5 second, and the acting stress on the silicon wafer is between 10 KPa and 50 KPa. This technology is expected to be used in the production of solar cell wafers and the picking and transferring of silicon wafers in wafer preparation for chip manufacturing. It can also be used to grip smooth and brittle objects in a vacuum environment and a space environment. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Schematic diagram of the adhesion gripping state of the gripping device in the embodiment of the present invention; Figure 2 Schematic diagram of the desorption and release state of the gripping device in the embodiment of the present invention; Figure 3 Schematic diagram of the distribution of the adhesion module and the boundary stress control module in the embodiment of the present invention; Figure 4 Bottom view of the gripping device in the embodiment of the present invention; Figure 5 For Figure 4 A - A cross-sectional view of Figure 6 Graph of the relationship between the preload force and the adhesion force of a single adhesion film at a peeling speed of 10 mm / s; Figure 7 Graph of the relationship between the preload force and the effective contact area of a single adhesion film at a peeling speed of 10 mm / s; Figure 8 SEM of the target adhesion area of the silicon wafer before adhesion gripping of the silicon wafer; Figure 9 SEM of the target adhesion area of the silicon wafer after desorption and release of the silicon wafer.

[0019] Reference numerals: 1, fixed bracket; 11, top plate; 12, bottom plate; 13, guide shaft group; 2, adhesion and desorption drive module; 21, movable plate; 22, drive assembly; 221, motor; 222, lead screw; 223, nut; 3, adhesion module; 31, movable rod; 32, adhesion film; 33, movable steel sleeve; 4, boundary stress control module; 41, flexible non-adhesive sheet; 42, ejector rod. Detailed Embodiments

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0023] As Figures 1 to 5 shown, the gripping device for quickly picking up wafers includes: a fixed bracket 1, an adhesion / detachment driving module 2, an adhesion module 3, and a boundary stress control module 4; the fixed bracket 1 includes a top plate 11, a bottom plate 12, and a guiding shaft group 13 disposed between the top plate 11 and the bottom plate 12; the adhesion / detachment driving module 2 includes a movable plate 21 disposed between a top rod 42 and the bottom plate 12, and a driving assembly 22 disposed on the top plate 11 for driving the movable plate 21 to move along the axial direction of the guiding shaft group 13; the adhesion module 3 includes a movable rod 31 fixed to the movable plate 21, and an adhesion film 32 disposed at the free end of the movable rod 31, and the adhesion film 32 provides an adhesion force for wafer picking; the boundary stress control module 4 is disposed on the side of the bottom plate 12 away from the movable plate 21, and includes at least two flexible non-adhesive sheets 41 distributed along the circumferential direction of the axis of the movable rod 31; the free end of the movable rod 31 passes through the bottom plate 12, and the adhesion film 32 and the flexible non-adhesive sheets 41 alternately contact the wafer to achieve adhesion and detachment of the wafer.

[0024] In the present invention, the top plate 11, the bottom plate 12 and the movable plate 21 are arranged parallel to each other. The guiding shaft group 13 is used for connecting the top plate 11 and the bottom plate 12 and guiding the movement of the movable plate 21 at the same time. Both the adhesion film 32 and the flexible non-adhesive sheet 41 are bonded and fixed by adhesives. The axial direction of the guiding shaft group 13 between the top plate 11 and the bottom plate 12 is arranged parallel to the axis of the movable rod 31. Before picking up the silicon wafer, it is necessary to keep the silicon wafer parallel to the bottom plate 12 and control the gap between the bottom plate 12 and the silicon wafer to be greater than the thickness of the flexible non-adhesive sheet 41 and less than the length of the movable rod 31. The specific implementation process is as follows: start the driving component 22, and the driving component 22 drives the movable plate 21 to descend along the axial direction of the guiding shaft group 13. When the end of the movable rod 31 bonded with the adhesion film 32 extends out of the bottom plate 12 and contacts the silicon wafer, the adhesion force of the adhesion film 32 on the silicon wafer is regulated by controlling the descending distance of the movable rod 31. When the adhesion force meets the requirements, the driving component 22 drives the movable plate 21 to rise a certain distance in the reverse direction. At this time, the flexible non-adhesive sheet 41 does not contact the silicon wafer. After controlling the gripping device to move to the designated position, the parallelism between the bottom plate 12 and the placement surface is adjusted. When the silicon wafer moves to the set position, the driving component 22 continues to drive the movable plate 21 to rise, so that the flexible non-adhesive sheet 41 contacts the silicon wafer. After the silicon wafer is completely peeled off from the adhesion film 32 by the flexible non-adhesive sheet 41, the adhesion gripping and desorption release of the silicon wafer are finally completed.

[0025] In the present invention, the adhesion module 3 is controlled by the adhesion and desorption driving module 2 and cooperates with the boundary stress control module 4 to realize the adhesion gripping or desorption release of the silicon wafer in an active control manner. Its response time and the acting stress on the silicon wafer are equivalent to those of the suction cup method, and it can also be used in a vacuum environment. During the desorption process of the silicon wafer, the flexible non-adhesive sheets 41 distributed around the adhesion module 3 can buffer the contact force and effectively control the stress diffusion, reducing the acting stress on the silicon wafer from the MPa level to the KPa level, thereby effectively protecting the silicon wafer.

[0026] In the present invention, the flexible non-adhesive sheet 41 is directly installed on the bottom plate 12. Since the movement range of the flexible non-adhesive sheet 41 is small, it may not be able to adapt to silicon wafers with large sizes or position changes. Therefore, in another preferred structure, the boundary stress control module 4 further includes a top rod 42 fixed on the bottom plate 12 and parallel to the movable rod 31; the flexible non-adhesive sheet 41 is arranged at the free end of the top rod 42.

[0027] By disposing the flexible non - adhesive sheet 41 at the end of the ejector rod 42 and connecting them using an adhesive, the contact between the flexible non - adhesive sheet 41 and the silicon wafer is planar. During the desorption process, the setting of the ejector rod 42 increases the movement distance of the movable rod 31, facilitating the flexible adjustment of the contact mode and force between the silicon wafer and the adhesion film 32. At the same time, it can accurately control the stress distribution when the flexible non - adhesive sheet 41 contacts the silicon wafer, better disperse the stress, avoid stress concentration from damaging the silicon wafer, and thus better protect the silicon wafer.

[0028] In a preferred embodiment of the present invention, at least two sets of adhesion modules 3 are provided on the movable plate 21. A single adhesion module 3 may cause the silicon wafer to tilt or be locally over - stressed during the picking process due to limited contact area or uneven force. By using multiple adhesion modules 3, the acting points of the force can be better dispersed, making the force on the silicon wafer more uniform during the picking process, and ensuring that the silicon wafer remains horizontal and stable throughout the picking and transfer process.

[0029] As a preferred solution of the present invention, the contact surface between the adhesion film 32 and the silicon wafer is spherical or planar. The planar contact surface can achieve large - area uniform contact with the surface of the silicon wafer, especially suitable for silicon wafers with relatively flat surfaces. This design can ensure uniform distribution of the adhesion force, reduce stress concentration caused by uneven contact, thereby improving the stability of the picking process, and is applicable to application scenarios with high requirements for adhesion uniformity, flat silicon wafer surfaces, and large sizes, and can provide a stable picking effect.

[0030] When the spherical contact surface contacts the silicon wafer, it can enhance the adhesion force by increasing the local pressure at the contact points. It is suitable for situations that require high adhesion force, high protection requirements for silicon wafers, and may have minor surface irregularities, especially showing good adhesion performance in high - humidity environments. As a preferred structure of the present invention, the contact surface between the adhesion film 32 and the silicon wafer is spherical because the spherical contact has a self - contained peeling angle, which is more convenient for desorption.

[0031] In the present invention, the adhesion film 32 is one of a bionic micro - structure film, a polyurethane film, a PDMS film, a viscous silicone film, a polyacrylate, a polyvinyl alcohol, and a derivative viscous polymer containing it; the flexible non - adhesive sheet 41 is one of non - adhesive silicone, non - adhesive polyurethane, and textile fabric.

[0032] The bionic micro - structure film, by mimicking the biological structures in nature (such as the micro - nano structure of a gecko's foot), can provide extremely high adhesion force. This film can adapt to irregular surfaces and provide a stable adhesion effect, especially suitable for silicon wafers with minor surface defects or particles.

[0033] The polyurethane film is heat - resistant, anti - aging, and has excellent reversible adhesion performance. It can maintain stable adhesion performance in harsh environments. The polyurethane film can still maintain flexibility at low temperatures and is suitable for a variety of working environments.

[0034] The PDMS film has a light transmittance of over 93%, a low surface energy, good release effect, is not easily adhered to other materials, and has excellent elasticity and resilience, enabling it to adapt to complex contact and detachment processes.

[0035] The sticky silicone film can provide stable adhesion force, and at the same time has good flexibility, and can still maintain stable adhesion performance in high-temperature environments, and is suitable for various surfaces.

[0036] Polyacrylate and its derivative sticky polymers have super strong adhesion, can provide stable adhesion effect, and at the same time blending it with other polymers can obtain the performance of resisting high and low temperatures and ultraviolet radiation.

[0037] In addition, a combination form of multiple films can also be adopted to integrate the advantages of different materials to meet specific application requirements. The combination of the bionic microstructured film and the PDMS film: Combining the high adhesion of the bionic microstructured film and the high elasticity and low surface energy of the PDMS film can provide stable adhesion effect on complex surfaces and reduce contact damage at the same time; The combination of the polyurethane film and the sticky silicone film: The high strength and wear resistance of the polyurethane film are combined with the high adhesion of the sticky silicone film, which is suitable for application scenarios that require high strength and high adhesion; The combination of the PDMS film and the polyurethane film: The high transparency and low surface energy of the PDMS film are combined with the high strength and weather resistance of the polyurethane film, which is suitable for applications with high optical and mechanical performance requirements.

[0038] In the present invention, a movable steel sleeve 33 through which the movable rod 31 slides is provided on the bottom plate 12. The movable steel sleeve 33 forms a sliding contact with the movable rod 31, which can make the movable plate 21 keep parallel to the lower bottom plate 12 when moving, effectively ensuring the adhesion area when the adhesion film 32 contacts the silicon wafer. Preferably, the movable steel sleeve 33 is one of a linear bearing, a bearing sleeve, a steel sleeve, and a wear-resistant sleeve.

[0039] In a preferred embodiment of the present invention, the driving assembly 22 includes a motor 221, a lead screw 222, and a nut 223; the motor 221 is connected to the lead screw 222, the nut 223 is fixed on the movable plate 21 and cooperates with the lead screw 222; the motor 221 rotates the lead screw 222 to make the nut 223 move along the axial direction of the lead screw 222, driving the movable plate 21 to lift and lower, and the lifting and lowering movement of the movable plate 21 is transmitted to the adhesion film 32, and based on the preload force applied by the motor 221, the regulation of the adhesion force of the adhesion film 32 to the silicon wafer is realized.

[0040] Specifically, the motor 221 adopts a torque control mode, and the preload force applied to the adhesion film 32 is obtained through the torque of the motor 221. From Figure 6 and Figure 7 it can be seen that there is a certain relationship between the adhesion force of the adhesion film 32 and the applied preload force, and its adhesion process control satisfies the following formula: Among them, is the maximum torque output by the control motor 221 during the adhesion process, is the torque output by the motor 221 itself under no-load conditions during the adhesion process, F is the preload force of the adhesion film 32, L is the equivalent arm. By controlling the maximum torque output by the control motor 221 during the adhesion process, the adhesion force of the manipulator can be regulated. Preferably, the motor 221 is one of a stepper motor 221, a DC geared motor 221, a brushless motor 221, a servo motor 221, a servo, a motor 221 for a vacuum environment, and a lead screw motor 221.

[0041] As Figure 6 shown, there is a corresponding relationship between the preload force and the adhesion force of the adhesion film 32 in the present invention. Within a certain range, the greater the preload force, the greater the adhesion force. However, after exceeding a certain range, increasing the preload force, the adhesion force tends to be stable and no longer increases; and the increase in the preload force essentially affects the true effective contact area between the adhesion film 32 and the silicon wafer. Therefore, as Figure 7 shown, the corresponding relationship between the preload force and the contact area can be seen to be consistent with Figure 6 the trend. By utilizing the relationship between the preload force, the contact area, and the adhesion force, the magnitude of the adhesion force of the manipulator is regulated.

[0042] The adhesion force of the manipulator is regulated by controlling the lifting of the motor 221. Even if the silicon wafer is tilted at a certain angle, the motor 221 can still control the lifting height to ensure that as many adhesion films 32 as possible are in contact with the silicon wafer. It should be noted that the self-weight of the silicon wafer is very light, about 10 g (0.1 N). From Figure 6 it can be known that when the preload force of a single adhesion film 32 is 0.1 N, the adhesion force can reach 0.4 N, which is sufficient to lift the silicon wafer. However, considering the stability of grasping and the picking of the edge of the silicon wafer, it is unreliable to pick up the silicon wafer with a single adhesion film 32 under an off-axis load. Therefore, only when two or more adhesion films 32 can be in contact with the silicon wafer, even if the silicon wafer is tilted, stable picking of the silicon wafer can be achieved.

[0043] After picking up the silicon wafer, since the self-weight of the silicon wafer is about 10 g, that is, the gravity of the silicon wafer is about 0.1 N. If the number of adhesion films 32 is 4, the average force on the four adhesion films 32 is 0.025 N, and the true adhesion force of the adhesion film 32 is 0.4 N even under a preload force of 0.1 N. In the picking state, it can be understood that the maximum adhesion force of a single adhesion film 32 is 0.4 N, but in fact, the adhesion force of a single adhesion film 32 only shows 0.025 N, which is similar to the static friction force and the maximum static friction force received by a stationary object.

[0044] In the implementation process of the present invention, during adhesion, the motor 221 drives the lead screw to control the movable plate 21 to move downward. The adhesion film 32 gradually contacts the silicon wafer following the downward movement of the movable plate 21, completing the adhesion and grasping. During desorption, the motor 221 drives the lead screw to control the movable plate 21 to move upward. The boundary stress control module 4 plays a role in support and stress constraint. The adhesion film 32 gradually peels off from the silicon wafer following the upward movement of the movable plate 21, completing the adhesion and grasping. By controlling the downward movement distance of the movable plate 21 by the motor 221, the contact area between the adhesion film 32 and the silicon wafer can be controlled, thereby realizing the regulation of the adhesion force of the adhesion film 32 acting on the silicon wafer.

[0045] Figure 8 SEM of the target adhesion area of the silicon wafer before adhesion and grasping of the silicon wafer Figure 9 SEM of the target adhesion area of the silicon wafer after desorption and release of the silicon wafer. By comparing Figure 8 and Figure 9 the SEM of the target adhesion area, it can be seen that after the silicon wafer is grasped and released, there are no residues and cracks found on its surface, which proves that the grasping and release of the silicon wafer by the present invention are non-destructive.

[0046] In the present invention, the flexible non-adhesive sheet 41 adopts a compressible material, and the adhesion force of the adhesion film 32 is greater than the elastic recovery force of the flexible non-adhesive sheet 41, ensuring that during the picking process, the silicon wafer can be firmly adhered to the adhesion film 32 and will not accidentally fall off due to the elastic recovery force of the flexible non-adhesive sheet 41. At the same time, when the flexible non-adhesive sheet 41 is compressed to the limit position, the stress distribution is more uniform, avoiding damage to the silicon wafer caused by stress concentration.

[0047] Verified by experiments, the grasping device for rapid picking and transfer of silicon wafers in the present invention can be used in a vacuum environment, and has great application potential in the transfer of wafers in a vacuum environment and the transfer of brittle materials in a space environment.

[0048] The present invention also provides a grasping device, including: a grasping device, a connecting flange provided on the grasping device, and a robotic arm configured to be able to drive the grasping device to rotate and / or move.

[0049] The response time of the grasping device in the present invention is between 0.1 second and 0.5 second, and the acting stress on the silicon wafer is between 10 KPa and 50 KPa. This technology is expected to be used in the picking and transfer of silicon wafers in the production of solar cell wafers and the preparation of wafers for chips, and can also be used to grasp smooth brittle objects in a vacuum environment and a space environment.

[0050] Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A gripping device for quickly picking up silicon wafers, characterized in that: include: A fixed bracket, comprising a top plate, a bottom plate, and a guide shaft group arranged between the top plate and the bottom plate; An adhesion and de-adhesion driving module, comprising a movable plate arranged between the top rod and the bottom plate, and a driving assembly arranged on the top plate for driving the movable plate to move along the axial direction of the guide shaft group; An adhesive module, comprising a movable rod fixed on the movable plate, and an adhesive film arranged at a free end of the movable rod, wherein the adhesive film provides adhesive force for picking up the silicon wafer; A boundary stress control module is arranged on a side of the bottom plate away from the movable plate, and comprises at least two flexible non-adhesive sheets distributed along the circumferential direction of the axis of the movable rod; The free end of the movable rod passes through the bottom plate, and the adhesive film and the flexible non-adhesive sheet contact the silicon wafer alternately to achieve adhesion and desorption of the silicon wafer.

2. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The boundary stress control module further includes a top rod fixed to the bottom plate and parallel to the movable rod; The flexible non-adhesive sheet is arranged on the free end of the push rod.

3. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: At least two groups of the adhesion modules are arranged on the movable plate.

4. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The contact surface between the adhesive film and the silicon wafer is a spherical surface or a flat surface.

5. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The adhesive film is one of a bionic microstructure film, a polyurethane film, a PDMS film, a sticky silicone film, a polyacrylate, a polyvinyl alcohol, and a sticky polymer derived therefrom.

6. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The flexible non-sticky material is one of non-sticky silicone, non-sticky polyurethane or textile fabric.

7. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The bottom plate is provided with a movable steel sleeve for the movable rod to slide through.

8. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The driving assembly includes a motor, a screw rod and a nut, wherein the motor is connected to the screw rod, and the nut is fixed to the movable plate and cooperates with the screw rod; The motor drives the screw to rotate, causing the nut to move along the axial direction of the screw, thereby driving the movable plate to rise and fall. The rising and falling movement of the movable plate is transmitted to the adhesive film, and based on the preload force applied by the motor, the adhesion force of the adhesive film to the silicon wafer is regulated.

9. The gripping device for quickly picking up silicon wafers according to claim 1, characterized in that: The flexible non-adhesive sheet is made of a compressible material, and the adhesive force of the adhesive film is greater than the elastic restoring force of the flexible non-adhesive sheet.

10. A gripping device, characterized in that: Comprising: a gripping device for quickly picking up a silicon wafer as described in any one of claims 1 to 9; and a connecting flange provided on the gripping device; And a mechanical arm configured to drive the grasping device to rotate and / or move.

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