Epoxy resin composition, preparation method thereof and wafer packaging structure

Abstract

The invention discloses an epoxy resin composition, a preparation method thereof and a wafer packaging structure, and the epoxy resin composition comprises 85-90% of modified silicon dioxide, 2-4% of epoxy resin, 1-2% of a curing agent, 2-4% of an epoxy active diluent, 0.1-0.2% of a dispersant, 2-5% of a solvent, 0.1-0.2% of a leveling agent and 0.05-0.1% of a coloring agent based on the total weight of 100%. Wherein the modified silicon dioxide is obtained by jointly performing surface modification on silicon dioxide by a silane coupling agent and a titanate coupling agent, and the modification ratio is 0.2-0.5%. The epoxy resin composition is appropriate in viscosity and good in leveling property, when the epoxy resin composition is applied to chip packaging, a formed film surface is smooth and free of cavities, the peeling strength between the film surface and a UV viscosity-reducing adhesive tape is small, and the UV viscosity-reducing adhesive tape is easy to tear off.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor packaging, and particularly relates to an epoxy resin composition, a preparation method thereof, and a wafer packaging structure. Background Art

[0002] Please refer to Figure 1 , which shows a cutting process of a current semiconductor chip. The process is as follows: Copper pillars 2 and cutting grooves 3 are fabricated on a wafer 1. Then, an epoxy resin adhesive 4 is printed. The epoxy resin adhesive 4 covers the copper pillars 2 and fills the grooves 3. After the epoxy resin adhesive 4 is cured, grinding is performed to expose the copper pillars 2. Back thinning of the wafer is carried out. Before that, a UV anti-adhesive tape is attached to the front side of the wafer 1 for protection. A back adhesive film 5 is printed on the back side of the wafer 1, and then individual chips 6 are obtained by cutting along the grooves 3.

[0003] In the above process, after the epoxy resin adhesive 4 fills the grooves 3, during the curing process, affected by the shrinkage and leveling property of the epoxy resin adhesive 4, voids may be formed in the grooves 4. In the back thinning process of the wafer, if there are voids on the film surface formed by the epoxy resin adhesive 4, oxygen is likely to enter the voids. Under ultraviolet light irradiation, oxygen reacts with the photoinitiator in the UV anti-adhesive tape, resulting in an increase in the adhesion between the UV anti-adhesive tape and the film surface, making it difficult to tear off the UV anti-adhesive tape. Summary of the Invention

[0004] One object of this application is to provide an epoxy resin composition. Calculated based on a total weight of 100%, it includes: 85 - 90% of modified silica, 2 - 4% of epoxy resin, 1 - 2% of curing agent, 2 - 4% of epoxy active diluent, 0.1 - 0.2% of dispersant, 2 - 5% of solvent, 0.1 - 0.2% of leveling agent, and 0.05 - 0.1% of colorant; wherein, the modified silica is obtained by jointly performing surface modification on silica with a silane coupling agent and a titanate coupling agent, and the modification ratio is 0.2 - 0.5%.

[0005] The epoxy resin composition of this application has an appropriate viscosity and good leveling property. When it is applied to chip packaging, the formed film surface is flat and void-free, has a small peel strength with the UV anti-adhesive tape, and the UV anti-adhesive tape is easy to tear off.

[0006] In some embodiments, the epoxy resin can be a bisphenol A type epoxy resin.

[0007] In some embodiments, the curing agent can be an amine type curing agent.

[0008] In some embodiments, the epoxy active diluent can be a mono-epoxy active diluent, a bis-epoxy active diluent, or a multi-epoxy active diluent.

[0009] In some embodiments, the dispersant may be an acrylic block polymer-based aqueous dispersant.

[0010] In some embodiments, the solvent may be diethylene glycol butyl ether acetate.

[0011] In some embodiments, the leveling agent may be an acrylate leveling agent, preferably a polyacrylate modified with organosilicon and polyether macromonomers.

[0012] In some embodiments, the amount of modified silica may be 85-89%, 85-88%, 85-87%, 85-86%, 86-89%, 86-88%, 86-87%, 87-89%, 87-88% or 88-89%.

[0013] In some embodiments, the amount of bisphenol A epoxy resin may be 2-3% or 3-4%.

[0014] In some embodiments, the amount of epoxy active diluent may be 3-4%.

[0015] In some embodiments, the amount of solvent may be 2.5-4.5%.

[0016] In some embodiments, the silica is surface-modified with a silane coupling agent and a titanate coupling agent in a dosage ratio of 1:1.

[0017] In some embodiments, the silica is surface-modified with a silane coupling agent and a titanate coupling agent, including: Mix the silane coupling agent and the titanate coupling agent to obtain a composite coupling agent, mix the composite coupling agent, absolute ethanol and water to obtain a first mixture, mix the first mixture, a modification aid and silica to obtain a second mixture, dry the second mixture and add it to a ball mill for ball milling, and modify the surface of silica with the silane coupling agent and the titanate coupling agent during the ball milling process.

[0018] Another object of the present application is to provide a preparation method of the above epoxy resin composition, including: Weigh each raw material according to the ratio, mix and stir to obtain a slurry; Disperse the slurry using a three-roll mill; Then perform vacuum degassing to obtain the epoxy resin composition product.

[0019] In some embodiments, a centrifugal stirrer is used to mix and stir each raw material.

[0020] Furthermore, the rotation speed and revolution speed of the centrifugal stirrer are respectively set to 1000 r / min and 1500 r / min, and the stirring time is 180-220 s.

[0021] Further, the feeding gap and discharging gap of the three-roll cylinder are set to be 70um - 100um and 50um - 70um respectively.

[0022] In some embodiments, a centrifugal mixer is used for vacuum degassing.

[0023] Further, the rotation speed and revolution speed of the centrifugal mixer are set to be 1200 r / min and 1500 r / min respectively, and the vacuum degassing time is 80s.

[0024] The third object of the present application is to provide a wafer packaging structure, which includes a chip and an epoxy resin adhesive wrapping the chip, and the epoxy resin adhesive is the above-mentioned epoxy resin composition.

[0025] Compared with the prior art, the present application has the following advantages and beneficial effects: The epoxy resin composition of the present application has a suitable viscosity and good leveling property. When it is applied to chip packaging, the formed film surface is flat and without voids, the peeling strength between it and the UV release tape is small, and the UV release tape is easy to tear off. Description of the Drawings

[0026] Figure 1 It is a schematic diagram of a cutting process flow of a current semiconductor chip; Figure 2 It is a schematic diagram of a wafer packaging structure in an embodiment; Figure 3 It is an SEM photograph of the film surface formed by the epoxy resin composition in Example 1; Figure 4 It is an SEM photograph of the film surface formed by the epoxy resin composition in Comparative Example 1; Figure 5 It is an SEM photograph of the film surface formed by the epoxy resin composition in Comparative Example 3.

[0027] Reference numerals: wafer 1, copper pillar 2, groove 3, epoxy resin adhesive 4, back adhesive film 5, chip 6, void 7. Detailed Embodiments

[0028] To make the objectives, technical solutions and beneficial effects of the present application clearer and more understandable, the present application will be further described in detail below with reference to the embodiments.

[0029] An epoxy resin composition capable of eliminating voids provided by an embodiment of the present application, based on 100% of the total weight, includes: 85-90% of modified silica, 2-4% of epoxy resin, 1-2% of curing agent, 2-4% of epoxy active diluent, 0.1-0.2% of dispersant, 2-5% of solvent, 0.1-0.2% of leveling agent, and 0.05-0.1% of colorant; wherein, the modified silica is obtained by surface modification of silica with a silane coupling agent and a titanate coupling agent together, and the modification ratio is 0.2-0.5%. Here, the modification ratio refers to the percentage of the mass of the silane coupling agent and the titanate coupling agent added during the surface modification of silica in the mass of silica.

[0030] The curing agent is used to undergo a curing reaction with the epoxy resin at a certain temperature to generate a thermosetting compound with a three-dimensional network structure; a curing agent matching the epoxy resin should be selected. In some embodiments, the epoxy resin can be a bisphenol A type epoxy resin, such as KE-8120, NPEL-128, CYD-011, etc. on the market, and the curing agent can be an amine curing agent, such as methylcyclohexanediamine, polyetheramine, etc.

[0031] The epoxy active diluent also participates in the curing reaction and becomes a part of the three-dimensional network structure, which can reduce the resistance suffered by resin molecules during movement, and macroscopically manifests as reducing the viscosity of the system and increasing the flexibility of the system. In some embodiments, the epoxy active diluent can be a mono-epoxy active diluent, a bis-epoxy active diluent or a multi-epoxy active diluent. For example, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, etc.

[0032] The dispersant is used to improve the dispersion ability of the inorganic filler, thereby reducing the viscosity of the system and preventing the inorganic filler from settling. In some embodiments, the dispersant is an acrylic block polymer-based aqueous dispersant, such as BASF DispexUltra PX 4585.

[0033] The solvent is used to reduce the viscosity of the system, and the leveling agent is used to reduce the surface tension of the system and improve the leveling property of the system. The use of both the solvent and the leveling agent is to enable the epoxy resin composition to be printed on the wafer. In some embodiments, the solvent can be diethylene glycol butyl ether acetate, and the leveling agent can be an acrylate leveling agent, such as BYK3565 of BYK, the component of which is polyacrylate modified by silicone and polyether macromonomer.

[0034] In the present application, the inorganic filler is silica surface-modified by a silane coupling agent and a titanate coupling agent together. Compared with unmodified silica, the dispersibility of the inorganic filler can be further improved. In some embodiments, the silane coupling agent and the titanate coupling agent perform surface modification of silica together at a dosage ratio of 1:1.

[0035] In specific implementation, the surface modification of silica can be carried out by solution blending method or mechanical mixing method. The solution blending method is as follows: adding silica into a solution containing silane coupling agent and titanate coupling agent, and reacting the silane coupling agent, titanate coupling agent with the surface of silica in the solution, so as to modify silica. The mechanical mixing method is as follows: mechanically mixing silica, silane coupling agent and titanate coupling agent in a ball milling device, and reacting the silane coupling agent, titanate coupling agent with the surface of silica during the mixing process, so as to modify silica.

[0036] The modification ratio refers to the percentage of the mass of the added silane coupling agent and titanate coupling agent in the mass of silica.

[0037] The following will provide a specific method for modifying silica: mixing a silane coupling agent and a titanate coupling agent in a mass ratio of 1:1 to obtain a composite coupling agent, mixing the composite coupling agent, absolute ethanol and water in a mass ratio of 1:2:1 to obtain a first mixture, mixing the first mixture, a modification aid and silica to obtain a second mixture, drying the second mixture, and then adding it into a ball mill for ball milling for 60 min to 90 min, and discharging to obtain modified silica.

[0038] In the above modification method, the second mixture is preheated at a temperature of 100 - 110 °C for 50 min to 60 min for drying.

[0039] In the above modification method, the dosage of the composite coupling agent is 0.2 - 0.5% of the dosage of silica, that is, the modification ratio is 0.2 - 0.5%; the modification aid is used to adjust the pH value, and an ammonia water solution with a mass concentration of 1% can be selected, and the dosage of the ammonia water solution is 1 - 1.5% of the mass of silica.

[0040] In this application, using a silane coupling agent to modify silica can reduce the hydrogen bond interaction and surface tension between silica particles, and reduce the agglomeration phenomenon between silica particles. Using a titanate coupling agent to modify silica, the inorganic group - philic group in the titanate coupling agent molecule chemically reacts with the hydroxyl groups on the surface of silica to form a monolayer on the surface of silica, which is firmly bonded to the surface of silica; the long - chain part in the titanate coupling agent molecule is an organic group - philic group, which can entangle with polymer molecules, improve the miscibility with polymers, help reduce the surface energy of silica, can significantly reduce the viscosity of the obtained epoxy resin composition, and improve the lubricity and leveling property of the obtained epoxy resin composition.

[0041] When a polyacrylate leveling agent modified with silicone and polyether macromonomers is selected, both the acrylic main chain and the silicone- and polyether-modified side chains migrate to the surface of the epoxy resin to form a spread, which can simultaneously adjust the short-wave leveling and long-wave leveling of the epoxy resin composition, helping to further improve the leveling property of the epoxy resin composition, and thus obtaining a flat and hole-free film surface.

[0042] The wafer packaging structure provided by the embodiments of the present application is shown in Figure 2 , which includes a chip 6 and an epoxy resin adhesive 4 wrapping the chip 6, and the epoxy resin adhesive 4 is the above-mentioned epoxy resin composition.

[0043] The specific raw materials used in the examples and comparative examples are as follows: Inorganic filler: spherical silica with a particle size of 2.5um - 27.5um purchased from the market; self-made modified silica: Bisphenol A epoxy resin: KE-8120 type bisphenol A epoxy resin with a room temperature viscosity of 4000cps - 6000cps and an epoxy equivalent of 170g / eq - 175g / eq; NPEL-128 type bisphenol A epoxy resin with a viscosity of 12000cps - 15000cps and an epoxy equivalent of 184g / eq - 190g / eq; CYD-011 type bisphenol A epoxy resin with a room temperature viscosity of 2500cps and an epoxy equivalent of 450g / eq - 500g / eq; Curing agent: commercially available methylcyclohexanediamine curing agent and polyetheramine D4000; Epoxy active diluent: commercially available product LS-501A, the component of which is butyl glycidyl ether; commercially available 1,4-butanediol diglycidyl ether; Dispersant: Dispex Ultra PX 4585; Solvent: commercially available diethylene glycol butyl ether acetate; Leveling agent: BYK-3565; Colorant: carbon black.

[0044] The modified silica used in the following examples and comparative examples was prepared by the following method: The silane coupling agent and the titanate coupling agent were mixed in a mass ratio of 1:1 to obtain a composite coupling agent. The composite coupling agent, anhydrous ethanol and water were mixed in a mass ratio of 1:2:1 to obtain a first mixture. The first mixture, the modification assistant and spherical silica with a particle size of 2.5um - 27.5um were mixed to obtain a second mixture. The second mixture was preheated at 110°C for 55 min for drying, and then added to a ball mill for ball milling for 80 min , and the modified silica was obtained after discharging.

[0045] In the above method, the modifying agent is an ammonia water solution with a mass concentration of 1%, and the dosage of the modifying agent is 1% of the mass of silica.

[0046] In the above method, the silane coupling agent is KH560, and the titanate coupling agent is CS-101.

[0047] The examples and comparative examples provided in this application are as follows: Example 1 The raw materials and the dosage of each raw material in this example are as follows: 85% of modified silica, 4% of KE-8120 type bisphenol A epoxy resin, 2% of methylcyclohexanediamine curing agent, 4% of 1,4-butanediol diglycidyl ether, 0.2% of PX 4585 dispersant, 4.5% of diethylene glycol monobutyl ether acetate solvent, 0.2% of BYK-3565 leveling agent, and 0.1% of carbon black.

[0048] In this example, the modification ratio of the modified silica is 0.2%, that is, the dosage of the composite coupling agent is 0.2% of the dosage of silica.

[0049] Example 2 The raw materials and the dosage of each raw material in this example are as follows: 87% of modified silica, 2% of KE-8120 type bisphenol A epoxy resin, 2% of D4000 curing agent, 4% of 1,4-butanediol diglycidyl ether, 0.2% of PX 4585 dispersant, 4.5% of diethylene glycol monobutyl ether acetate solvent, 0.2% of BYK-3565 leveling agent, and 0.1% of carbon black.

[0050] In this example, the modification ratio of the modified silica is 0.3%, that is, the dosage of the composite coupling agent is 0.3% of the dosage of silica.

[0051] Example 3 The raw materials and the dosage of each raw material in this example are as follows: 89% of modified silica, 3% of KE-8120 type bisphenol A epoxy resin, 2% of methylcyclohexanediamine curing agent, 3% of LS-501A epoxy active diluent, 0.2% of PX 4585 dispersant, 2.5% of diethylene glycol monobutyl ether acetate solvent, 0.2% of BYK-3565 leveling agent, and 0.1% of carbon black.

[0052] In this example, the modification ratio of the modified silica is 0.5%, that is, the dosage of the composite coupling agent is 0.5% of the dosage of silica.

[0053] Example 4 The raw materials and their dosages in this embodiment are as follows: modified silica 86%, CYD-011 type bisphenol A epoxy resin 3%, methylcyclohexanediamine curing agent 2%, 1,4-butanediol diglycidyl ether 4%, PX 4585 dispersant 0.2%, diethylene glycol monobutyl ether acetate solvent 4.5%, BYK-3565 leveling agent 0.2%, carbon black 0.1%.

[0054] In this embodiment, the modification ratio of the modified silica is 0.4%, that is, the dosage of the composite coupling agent is 0.4% of the dosage of silica.

[0055] Example 5 The raw materials and their dosages in this embodiment are as follows: modified silica 88%, NPEL-128 type bisphenol A epoxy resin 4%, methylcyclohexanediamine curing agent 2%, 1,4-butanediol diglycidyl ether 3%, PX 4585 dispersant 0.2%, diethylene glycol monobutyl ether acetate solvent 2.5%, BYK-3565 leveling agent 0.2%, carbon black 0.1%.

[0056] In this embodiment, the modification ratio of the modified silica is 0.5%, that is, the dosage of the composite coupling agent is 0.5% of the dosage of silica.

[0057] Comparative Example 1 The raw materials and their dosages in this comparative example are as follows: unmodified spherical silica 89%, KE-8120 type bisphenol A epoxy resin 3%, methylcyclohexanediamine curing agent 2%, LS-501A epoxy active diluent 3%, PX 4585 dispersant 0.2%, diethylene glycol monobutyl ether acetate solvent 2.5%, BYK-3565 leveling agent 0.2%, carbon black 0.1%.

[0058] Comparative Example 2 The raw materials and their dosages in this comparative example are as follows: modified silica 89%, KE-8120 type bisphenol A epoxy resin 3%, methylcyclohexanediamine curing agent 2%, LS-501A epoxy active diluent 3%, PX 4585 dispersant 0.2%, diethylene glycol monobutyl ether acetate solvent 2.5%, BYK-3565 leveling agent 0.2%, carbon black 0.1%.

[0059] In this embodiment, the modification ratio of the modified silica is 0.6%, that is, the dosage of the composite coupling agent is 0.6% of the dosage of silica.

[0060] Comparative Example 3 The raw materials and the amounts of each raw material in this comparative example are as follows: 84% of modified silica, 5% of NPEL-128 type bisphenol A epoxy resin, 3% of D4000 curing agent, 5% of LS-501A epoxy active diluent, 0.2% of PX 4585 dispersant, 2.5% of diethylene glycol butyl ether acetate solvent, 0.2% of BYK-3565 leveling agent, and 0.1% of carbon black.

[0061] In this example, the modification ratio of the modified silica is 0.3%, that is, the amount of the composite coupling agent is 0.3% of the amount of silica.

[0062] Comparative Example 4 The raw materials and the amounts of each raw material in this comparative example are as follows: 91% of modified silica, 1% of NPEL-128 type bisphenol A epoxy resin, 0.5% of D4000 curing agent, 5% of LS-501A epoxy active diluent, 0.2% of PX 4585 dispersant, 2% of diethylene glycol butyl ether acetate solvent, 0.2% of BYK-3565 leveling agent, and 0.1% of carbon black.

[0063] In this example, the modification ratio of the modified silica is 0.5%, that is, the amount of the composite coupling agent is 0.5% of the amount of silica.

[0064] The preparation processes of the products in the above examples and comparative examples are the same, and are as follows: (1) Take each raw material according to the ratio and add it to a stirring cup, and use a centrifugal stirrer to stir to obtain a slurry; the rotation speed and revolution speed of the centrifugal stirrer are 1000 r / min and 1500 r / min respectively, and the stirring time is 200 s; (2) Use a three-roll mill to disperse the slurry, and the feeding gap of the three-roll mill is 80 um and the discharging gap is 60 um; (3) Use a centrifugal stirrer to perform vacuum degassing on the uniformly dispersed epoxy resin composition to obtain the final product. The rotation speed and revolution speed of the centrifugal stirrer are 1200 r / min and 1500 r / min respectively, and the vacuum degassing time is 80 s.

[0065] The detection methods for the performance parameters of the products in the above examples and comparative examples are as follows: I. Viscosity: Use a digital display rotational viscometer to measure the viscosity at 25 °C, select a 14# rotor, and the rotation speed is 20 r / min.

[0066] II. Peel strength: The epoxy resin composition is printed on the wafer and cured to form a film layer on the wafer. The curing conditions are as follows: first, hold at 60 °C for 1 h, and then hold at 180 °C for 2 h; a 25 mm × 200 mm UV release tape is attached to the film layer with a force of 2 kg, and after UV irradiation for 2 min, the UV release tape is peeled off with a tensile testing machine to test the peel strength.

[0067] III. Void detection: Refer to Figure 1 , the epoxy resin composition is printed on the wafer 1 so that the epoxy resin composition covers the copper pillar 2 and fills the groove 3; after curing, the wafer 1 is polished until the copper pillar 2 is exposed, and the void phenomenon on the epoxy resin is observed under SEM. The curing conditions are as follows: first, hold at 60 °C for 1 h, and then hold at 180 °C for 2 h The test data of the above examples and comparative products are shown in Table 1 below: Table 1 Performance parameter data of examples and comparative products The epoxy resin composition products of Example 1 and Comparative Examples 1 and 3 are taken for void detection, as shown in Figures 3 - 5 , it can be seen from the figure that the film surface of the product of Example 1 is flat and void-free, while the film surfaces of the products of Comparative Examples 1 and 3 have voids. Therefore, it can be proved that the product of the present application can solve the void problem.

[0068] In Comparative Example 1, due to the use of unmodified silica, the dispersibility of silica is poor, the viscosity of the obtained epoxy resin composition is large, the leveling property is also poor by visual observation, and voids are generated on the film surface. The existence of voids results in a large peel strength between the film surface and the UV release tape, and the UV release tape is difficult to tear off. Although Comparative Examples 2 to 4 use silica modified with a silane coupling agent and a titanate coupling agent together, in Comparative Example 2, the modification ratio of silica is large, the viscosity of the obtained epoxy resin composition is significantly reduced, but the formed film surface is uneven, and the peel strength between the film surface and the UV release tape is still large, and the UV release tape is difficult to tear off. In Comparative Examples 3 to 4, the modification ratio of silica is moderate, but due to the non-specific dosages of silica and epoxy resin, the void problem still exists.

[0069] However, the epoxy resin compositions of Examples 1 to 5 of the present application have appropriate viscosities, good leveling properties by visual inspection, the formed film surfaces are flat and void-free, the peel strength between the film surface and the UV release tape is small, and the UV release tape is easy to tear off.

[0070] The above embodiments are only for clearly illustrating the implemented examples and are not a limitation on the implementation manners. For those of ordinary skill in the art, based on the above description, other different forms of changes or modifications can be made. It is not necessary and impossible to enumerate all the implementation manners here. Therefore, the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. An epoxy resin composition, characterized in that: Taking the total weight as 100%, it includes: 85-90% of modified silicon dioxide, 2-4% of epoxy resin, 1-2% of curing agent, 2-4% of epoxy reactive diluent, 0.1-0.2% of dispersant, 2-5% of solvent, 0.1-0.2% of leveling agent and 0.05-0.1% of colorant; wherein, the modified silicon dioxide is obtained by surface modification of silicon dioxide by using silane coupling agent and titanate coupling agent, and the modification ratio is 0.2-0.5%.

2. The epoxy resin composition according to claim 1, wherein: The silane coupling agent and the titanate coupling agent are used together in a dosage ratio of 1:1 to modify the surface of silicon dioxide.

3. The epoxy resin composition according to claim 1, wherein: The preparation method of the modified silicon dioxide is: A silane coupling agent and a titanate coupling agent are mixed to obtain a composite coupling agent, the composite coupling agent, anhydrous ethanol and water are mixed to obtain a first mixture, the first mixture, a modification aid and silicon dioxide are mixed to obtain a second mixture, the second mixture is dried and added to a ball mill for ball milling, and the silane coupling agent and the titanate coupling agent are used to modify the silicon dioxide surface during the ball milling process.

4. The epoxy resin composition according to claim 1, wherein: The epoxy resin is bisphenol A type epoxy resin.

5. The epoxy resin composition according to claim 1, wherein: The curing agent is an amine curing agent.

6. The epoxy resin composition according to claim 1, wherein: The epoxy reactive diluent is a monoepoxy reactive diluent, a diepoxy reactive diluent or a polyepoxy reactive diluent.

7. The epoxy resin composition according to claim 1, wherein: The dispersant is an acrylic acid block polymer aqueous dispersant.

8. The epoxy resin composition according to claim 1, wherein: The solvent is diethylene glycol butyl ether acetate.

9. The epoxy resin composition according to claim 1, wherein: The leveling agent is an acrylic leveling agent.

10. The epoxy resin composition according to claim 1, wherein: The leveling agent is polyacrylate modified by organosilicon and polyether macromolecular monomer.

11. The method for preparing the epoxy resin composition according to any one of claims 1 to 10, characterized in that: include: Mix and stir the raw materials according to the proportion to obtain a slurry; Use three rollers to disperse the slurry; The mixture is then stirred and vacuum degassed to obtain an epoxy resin composition product.

12. A wafer packaging structure, characterized in that: include: A chip and an epoxy resin adhesive for wrapping the chip, wherein the epoxy resin adhesive is the epoxy resin composition according to any one of claims 1 to 10.

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