Display panel evaporation alignment device and evaporation equipment

Abstract

The present application is applicable to the technical field of display panel evaporation alignment devices, and provides a display panel evaporation alignment device and evaporation equipment. The display panel evaporation alignment device includes: a substrate carrying mechanism, a mask carrying mechanism and a temperature-controlled magnetic platform, wherein the substrate carrying mechanism is arranged in a metal evaporation chamber; the mask carrying mechanism is movably arranged in the metal evaporation chamber; the temperature-controlled magnetic platform is movably arranged in the metal evaporation chamber, and the temperature-controlled magnetic platform includes a temperature-controlled magnetic assembly, a plurality of carrier positioning pin assemblies and at least one anti-warping support pin assembly. The carrier positioning pin assembly is used to apply a first pressing force to the substrate to press the aligned substrate and mask, and the anti-warping support pin assembly is used to apply a second pressing force to the edge area of ​​the substrate. The display panel evaporation alignment device provided by the present application can offset the warping of the substrate caused by the pressing of the carrier positioning pin assembly, thereby significantly improving the evaporation shadow effect and improving the uniformity of the evaporation film layer.

Description

Technical Field

[0001] The present application belongs to the technical field of display panel evaporation alignment devices, and more specifically, relates to a display panel evaporation alignment device and evaporation equipment. Background Art

[0002] In traditional display panel manufacturing, pixel patterning is typically achieved through a fine metal mask (FMM). FMM technology has become the mainstream evaporation process due to its mature process system, high-precision alignment capabilities, and extensive mass production experience.

[0003] In the existing display panel evaporation process, there is a problem of warping of the edge area of ​​the substrate, which affects the performance of the display panel and the product yield. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a display panel evaporation alignment device and evaporation equipment, aiming to solve the problem of warping of the edge area of ​​the substrate in the display panel evaporation process in the prior art, which affects the technical problem of display panel performance and product yield.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present application, a display panel evaporation alignment device is provided, which is arranged in the metal evaporation chamber of the evaporation equipment and is used to align the substrate and the mask. The display panel evaporation alignment device includes: a temperature-controlled magnetic platform, the temperature-controlled magnetic platform includes a temperature-controlled magnetic component, a plurality of carrier positioning pin components and at least one anti-warping support pin component, the temperature-controlled magnetic component is movably arranged in the metal evaporation chamber, the carrier positioning pin component and the anti-warping support pin component are both arranged on the temperature-controlled magnetic component ; Wherein, when the substrate and the mask are aligned, the position of the carrier positioning pin assembly corresponds to the edge area of ​​the substrate, and the carrier positioning pin assembly is used to apply a first pressing force to the edge area of ​​the substrate to press the substrate and the mask, and to space the substrate and the temperature-controlled magnetic assembly by a preset distance; after the edge area of ​​the substrate is subjected to the first pressing force, a corresponding edge warping area is formed, and the position of the anti-warping support pin assembly corresponds to the edge warping area, and is used to apply a second pressing force to the edge warping area to offset the warping of the substrate caused by the first pressing force.

[0006] Optionally, the first pressing force is directed toward the mask, and the magnitude of the first pressing force is a, 10N≤a≤13N; and / or, the second pressing force is directed toward the mask, and the magnitude of the second pressing force is b, 0.8N≤b≤5N; and / or, the magnitude of the preset distance is c, 1mm≤c≤1.5mm.

[0007] Optionally, the display panel evaporation alignment device also includes: a substrate carrying mechanism, which is arranged in the metal evaporation chamber and is used to carry the substrate; a mask carrying mechanism, which is movably arranged in the metal evaporation chamber and is located below the substrate carrying mechanism, and is used to carry the mask and align the mask and the substrate; a temperature-controlled magnetic suction component is located on the side of the substrate carrying mechanism away from the mask carrying mechanism, and when the substrate and the mask are aligned, a plurality of stage positioning pin assemblies are arranged at intervals along the edge contour direction of the substrate.

[0008] Optionally, the substrate is a rectangular substrate having a first long side, a first short side, a second long side and a second short side arranged in sequence, and a plurality of carrier positioning pin assemblies are arranged at intervals along the edge contour direction of the first long side, the first short side, the second long side and the second short side.

[0009] Optionally, the number of carrier positioning pin assemblies is d, 10≤d≤30; and / or, e carrier positioning pin assemblies are respectively arranged at equal intervals in the edge contour directions of the first long side and the second long side, 3≤e≤10; and / or, f carrier positioning pin assemblies are respectively arranged at equal intervals in the edge contour directions of the first short side and the second short side, 2≤f≤5.

[0010] Optionally, there are multiple anti-warping support pin assemblies, and when the substrate and the mask are aligned, the multiple anti-warping support pin assemblies are arranged at intervals along the edge contour direction of the aligned substrate.

[0011] Optionally, a plurality of anti-warping support pin assemblies are arranged at intervals along the edge contour direction of the first short side and the second short side.

[0012] Optionally, the number of anti-warping support pin assemblies is g, g≥4; and / or, h carrier positioning pin assemblies are equally spaced in the edge contour direction of the first short side and the second short side, h≥2.

[0013] Optionally, the temperature-controlled magnetic assembly includes a magnetic plate assembly. When the substrate and the mask are aligned, the magnetic plate assembly is used to apply a magnetic force directed toward the substrate to the mask so that the mask and the substrate are fitted together.

[0014] Optionally, when the substrate and the mask are aligned, the temperature-controlled magnetic platform has a pressing state and an avoidance state; when the temperature-controlled magnetic platform is in the pressing state, the carrier positioning pin assembly and the anti-warping support pin assembly are both in contact with the side of the substrate facing away from the mask, and the carrier positioning pin assembly applies a first pressing force to the edge area of ​​the substrate, and the anti-warping support pin assembly applies a second pressing force to the edge area of ​​the substrate that is prone to warping; when the temperature-controlled magnetic platform is in the avoidance state, the carrier positioning pin assembly and the anti-warping support pin assembly are both separated from the substrate and avoid the substrate.

[0015] Optionally, the temperature-controlled magnetic assembly also includes a cooling plate assembly, which is arranged on the magnetic plate assembly. When the substrate and the mask are aligned, the cooling plate assembly is located on the side of the magnetic plate assembly close to the substrate and is spaced apart from the substrate for regulating the temperature of the substrate and the mask. When the temperature-controlled magnetic platform is in a pressed state, the cooling plate assembly is spaced apart from the substrate by a preset distance.

[0016] Optionally, the anti-warping support pin assembly includes a connecting base, a pressure head assembly and an elastic reset mechanism. The connecting base is fixedly mounted on the temperature-controlled magnetic platform, the pressure head assembly is slidably arranged on the connecting base, and the elastic reset mechanism is arranged on the connecting base. The two ends of the elastic reset mechanism are respectively abutted against the connecting base and the pressure head assembly, and the elastic reset mechanism applies a second pressing force to the substrate through the pressure head assembly.

[0017] Optionally, a plurality of screw holes distributed along a first direction are provided on the temperature-controlled magnetic platform, and a plurality of fixing holes are provided on the connecting base. The plurality of fixing holes can correspond to the plurality of screw holes to achieve rough positioning of the connecting base in the first direction, wherein the first direction is parallel to the lower surface of the temperature-controlled magnetic platform.

[0018] Optionally, the temperature-controlled magnetic platform has a groove extending along the second direction, and a positioning protrusion is provided on the connecting base, which can cooperate with the groove to realize the positioning of the connecting base in the second direction, wherein the second direction is parallel to the lower surface of the temperature-controlled magnetic platform and perpendicular to the first direction.

[0019] Optionally, the screw hole extends along a third direction, and the anti-warping support pin assembly also includes a fixing screw, which passes through the fixing hole and is screwed into the screw hole to fix the connecting base in the third direction, wherein the third direction is perpendicular to the lower surface of the temperature-controlled magnetic platform.

[0020] Optionally, the pressure head assembly includes a pressure head adjustment assembly and a pressure head body, the pressure head body is slidably arranged on the connecting base through the pressure head adjustment assembly, and the pressure head adjustment assembly is used to adjust the relative position between the pressure head body and the elastic reset mechanism when not subjected to external force; and / or, the anti-warping support pin assembly also includes an elastic force adjustment assembly, the elastic force adjustment assembly is arranged on the connecting base, the elastic reset mechanism includes a compression spring, the first end of the compression spring abuts against the pressure head assembly, and the second end of the compression spring abuts against the connecting base through the elastic force adjustment assembly, and the elastic force adjustment assembly is used to adjust the compression amount of the compression spring to change the magnitude of the second pressing force applied to the substrate by the elastic reset mechanism through the pressure head assembly.

[0021] According to another aspect of the present application, an evaporation device is provided, which includes an equipment body and a display panel evaporation alignment device. A metal evaporation cavity is provided in the equipment body, and the display panel evaporation alignment device is provided in the metal evaporation cavity. The display panel evaporation alignment device is the above-mentioned display panel evaporation alignment device.

[0022] The beneficial effect of the display panel evaporation alignment device provided by the present application is that compared with the prior art, the display panel evaporation alignment device provided by the present application sets a plurality of carrier positioning pin assemblies, so that the temperature-controlled magnetic platform can press the aligned substrate and the mask through the plurality of carrier positioning pin assemblies, and maintain a preset distance of heat dissipation interval between the temperature-controlled magnetic assembly and the substrate. At the same time, by setting an anti-warping support pin assembly, the temperature-controlled magnetic platform can offset the warping of the substrate caused by pressing the carrier positioning pin assembly through the anti-warping support pin assembly, thereby significantly improving the evaporation shadow effect and improving the uniformity of the evaporated film layer. Moreover, through the non-contact design between the substrate and the temperature-controlled magnetic assembly, the risk of sticking and electrostatic damage caused by traditional mechanical pressing can be avoided, so that the substrate can obtain stable support while maximizing the utilization of the effective area of ​​the substrate, taking into account both production yield and economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 A schematic diagram of the structure of pressing a substrate and a mask using a peripheral pressing mechanism of an existing evaporation equipment;

[0025] Figure 2 for Figure 1 A partial enlarged view of area A in the middle;

[0026] Figure 3 A schematic diagram of the structure of a temperature-controlled magnetic platform for laminating and aligning a substrate and a mask provided in an embodiment of the present application;

[0027] Figure 4 A schematic diagram of the distribution of the stage positioning pin assembly and the anti-warping support pin assembly on the substrate provided in an embodiment of the present application;

[0028] Figure 5 A schematic structural diagram of an anti-warping support pin assembly provided in an embodiment of the present application;

[0029] Figure 6 A schematic structural diagram of an anti-warping support pin assembly from another perspective provided in an embodiment of the present application;

[0030] Figure 7 A schematic structural diagram of the indenter body provided in an embodiment of the present application;

[0031] The reference numerals used in the above drawings are as follows:

[0032] 11", peripheral pressing mechanism; 132", cooling plate; 20", substrate; 30", mask;

[0033] 10. Temperature-controlled magnetic platform; 11. Carrier positioning pin assembly; 12. Anti-warping support pin assembly; 121. Connecting base; 1211. Fixing hole; 1212. Positioning protrusion; 1213. Spring positioning pin; 122. Press head assembly; 1221. Press head adjustment assembly; 1222. Press head body; 123. Elastic reset mechanism; 124. Elastic force adjustment assembly; 13. Temperature-controlled magnetic assembly; 131. Magnetic plate assembly; 132. Cooling plate assembly;

[0034] 20. Substrate; 21. Edge warping area;

[0035] 30. Mask;

[0036] 40. Substrate carrying mechanism;

[0037] 50. Mask carrying mechanism. DETAILED DESCRIPTION

[0038] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. The embodiments and features in the embodiments of this application may be combined with each other unless there is a conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0040] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0042] As mentioned in the background, traditional display panel manufacturing typically uses a fine metal mask (FMM) to pattern light-emitting pixels. FMM technology, due to its mature process system, high-precision alignment capabilities, and extensive mass production experience, has become the mainstream evaporation process solution.

[0043] In the display panel evaporation process, the metal chamber of the evaporation equipment usually uses a peripheral pressing mechanism 11" to press the aligned substrate 20" and the mask 30", and balances heat conduction and mechanical stress by controlling the distance between the cooling plate 132" and the substrate 20". Figure 1 and Figure 2 As shown, the existing evaporation equipment presses the edge area of ​​the substrate 20" through the peripheral pressing mechanism 11", so that after the substrate 20" and the mask 30" are pressed, there is a certain distance between the substrate 20" and the cooling plate 132". At this time, the edge of the substrate 20" that is prone to warping will warp. When large-size panels are produced or high-utilization substrates are cut, the edge warping will aggravate the shadow effect during the evaporation process, resulting in the extension of the edge of the metal film layer, and then causing the display panel packaging to fail, affecting the display panel performance and product yield.

[0044] In the existing display panel evaporation process, in order to solve the problem of warping in the edge area of ​​​​the substrate 20", two technical solutions are mainly adopted: one is to reduce the gap between the substrate 20" and the cooling plate 132", but this solution has significant defects: after long-term evaporation operation, the cooling plate 132" is prone to sticking to the substrate 20", resulting in a decrease in yield; at the same time, the large-area contact between the cooling plate 132" and the substrate 20" will cause electrostatic damage defects, and the parallelism matching requirements between the mechanism and the mask 30" are strict, which greatly increases the risk of pressing and breaking during production. The second is to limit the arrangement position of the effective area of ​​the product to avoid the warped area at the edge of the substrate 20", but this method will significantly reduce the economic cutting utilization rate of the substrate 20", and cannot meet the current large-size display panel production demand for maximizing the utilization rate of the substrate 20".

[0045] See also Figures 3 to 7As shown, in order to solve the above problems, according to one aspect of the present application, an embodiment of the present application provides a display panel evaporation alignment device, which is arranged in a metal evaporation chamber of the evaporation equipment and is used to align the substrate 20 and the mask 30. The display panel evaporation alignment device includes: a temperature-controlled magnetic platform 10, the temperature-controlled magnetic platform 10 includes a temperature-controlled magnetic component 13, a plurality of carrier positioning pin components 11 and at least one anti-warping support pin component 12, the temperature-controlled magnetic component 13 is movably arranged in the metal evaporation chamber, the carrier positioning pin component 11 and the anti-warping support pin component 12 are both arranged on the temperature-controlled magnetic component 13; wherein, when the substrate 20 and the mask 30 are aligned, the position of the stage positioning pin assembly 11 corresponds to the edge area of ​​the substrate 20, and the stage positioning pin assembly 11 is used to apply a first pressing force to the edge area of ​​the substrate 20 to press the substrate 20 and the mask 30, and to space the substrate 20 and the temperature-controlled magnetic assembly 13 by a preset distance; after the edge area of ​​the substrate 20 is subjected to the first pressing force, an edge easy-to-warp area 21 is formed correspondingly, and the position of the anti-warping support pin assembly 12 corresponds to the edge easy-to-warp area 21, and is used to apply a second pressing force to the edge easy-to-warp area 21 to offset the warping of the substrate 20 caused by the first pressing force. The display panel evaporation alignment device provided in this embodiment is provided with a plurality of carrier positioning pin assemblies 11, so that the temperature-controlled magnetic platform 10 can press the aligned substrate 20 and the mask 30 through the plurality of carrier positioning pin assemblies 11, and maintain a preset distance of heat dissipation interval between the temperature-controlled magnetic assembly and the substrate 20. At the same time, by providing an anti-warping support pin assembly 12, the temperature-controlled magnetic platform 10 can offset the warping of the substrate 20 caused by the pressing of the carrier positioning pin assembly 11 through the anti-warping support pin assembly 12, thereby significantly improving the evaporation shadow effect and improving the uniformity of the evaporated film layer. In addition, the non-contact design between the substrate 20 and the temperature-controlled magnetic assembly can avoid the risks of sticking and electrostatic damage caused by traditional mechanical pressing, so that the substrate 20 can obtain stable support while maximizing the utilization of the effective area of ​​the substrate 20, taking into account both production yield and economic benefits.

[0046] It should be noted that the edge warping area 21 in this embodiment refers to a specific deformation area generated at the edge of the substrate 20 due to uneven distribution of the pressing force when the first pressing force is applied only by the stage positioning pin assembly 11 to achieve pressing of the substrate 20 and the mask 30.

[0047] It can be understood that in this solution, the edge area of ​​the substrate 20 specifically refers to the inner transition area between the outer side of the effective display area of ​​the substrate 20 and the physical edge of the substrate, that is, the edge area of ​​the substrate 20 has the outermost circuit line of the effective display area of ​​the substrate 20 as the inner boundary and the physical cutting edge of the substrate 20 as the outer boundary.

[0048] In a specific embodiment, the first pressing force in this embodiment is directed toward the mask 30 , and the magnitude of the first pressing force is a, where 10 N ≤ a ≤ 13 N. It should be noted that the first pressing force in this embodiment refers to the mechanical pressure applied by the stage positioning pin assembly 11 to the substrate 20 , which is perpendicular to the plane of the substrate 20 and directed toward the mask 30 .

[0049] In some embodiments, the magnitude of the first pressing force is controlled within a range of 10N to 13N, which can ensure stable pressing contact between the substrate 20 and the mask 30, avoid gaps during the evaporation process that may lead to evaporation shadows, and prevent excessive deformation or damage to the substrate 20 due to excessive pressure.

[0050] In a specific embodiment, the second pressing force in this embodiment is directed toward the mask 30 , and the magnitude of the second pressing force is b, where 0.8 N ≤ b ≤ 5 N. It should be noted that the second pressing force in this embodiment refers to the compensatory mechanical pressure applied by the anti-warpage support pin assembly 12 to the edge region of the substrate 20 , perpendicular to the plane of the substrate 20 and directed toward the mask 30 .

[0051] In some embodiments, controlling the magnitude of the second pressing force to be between 0.8N and 5N can accurately offset the warping deformation of the edge of the substrate 20 caused by the first pressing force, ensuring that the edge area of ​​the substrate 20 maintains good contact with the mask 30, while also avoiding reverse deformation of the substrate 20 due to excessive compensation pressure.

[0052] See also Figure 3 As shown, in a specific embodiment, the preset distance in this embodiment is c, 1mm≤c≤1.5mm. The preset distance in this embodiment refers to the constant distance between the upper surface of the substrate 20 and the lower surface of the temperature-controlled magnetic platform 10.

[0053] In some embodiments, controlling the size of the preset distance to 1 mm to 1.5 mm can ensure that the substrate 20 obtains sufficient heat conduction cooling effect, so that the substrate 20 and the temperature-controlled magnetic platform 10 maintain a non-contact state to avoid damage to the surface of the substrate 20, while providing operating space for the compensatory movement of the anti-warping support pin assembly 12.

[0054] See also Figure 4As shown, in a specific embodiment, the display panel evaporation alignment device further includes: a substrate supporting mechanism 40, which is disposed in the metal evaporation chamber and is used to support the substrate 20; a mask supporting mechanism 50, which is movably disposed in the metal evaporation chamber and located below the substrate supporting mechanism 40, and is used to support the mask 30 and align the mask 30 with the substrate 20; a temperature-controlled magnetic attraction assembly 13 is located on the side of the substrate supporting mechanism 40 facing away from the mask supporting mechanism 50. When the substrate 20 and the mask 30 are aligned, the multiple stage positioning pin assemblies 11 in this embodiment are arranged at intervals along the edge contour of the substrate 20. The multiple stage positioning pin assemblies 11 are arranged at intervals along the edge contour of the substrate 20 so that the first pressing force forms a force ring at the edge of the substrate 20, ensuring the overall pressing stability between the substrate 20 and the mask 30 while avoiding local stress concentration.

[0055] It should be noted that the substrate support mechanism 40 in this embodiment refers to a dedicated support structure disposed within the metal evaporation chamber, used to support and hold the substrate 20 during the evaporation process. Specifically, it includes, but is not limited to, a vacuum adsorption platform, a mechanical clamping device, or an electrostatic chuck. Through non-contact support or partial contact design, it ensures the positional stability of the substrate 20 while physically avoiding the evaporation area of ​​the substrate 20 to avoid obstructing the deposition path of the evaporation material. The mask support mechanism refers to a precision positioning device movably disposed within the metal evaporation chamber, used to support the mask 30 and achieve patterned alignment with the substrate 20. Specifically, it includes a high-precision linear drive module, a fine-tuning alignment mechanism, and a mask fixing assembly. The position of the mask 30 is adjusted through closed-loop control to ensure that its patterned opening area precisely matches the substrate 20. The mask support mechanism 50 avoids the evaporation beam path during the evaporation process to prevent mechanical interference.

[0056] See also Figure 4 As shown, in some embodiments, the substrate 20 in this embodiment is a rectangular substrate having a first long side, a first short side, a second long side, and a second short side arranged in sequence, and a plurality of carrier positioning pin assemblies 11 are arranged at intervals along the edge contour direction of the first long side, the first short side, the second long side, and the second short side; the plurality of carrier positioning pin assemblies 11 are arranged at intervals along the edge contour direction of the aligned rectangular substrate, so that the first pressing force forms a force ring at the edge of the substrate 20, thereby suppressing bending deformation caused by the large span of the long side area and avoiding local warping caused by insufficient support in the short side area. Of course, in other embodiments, the substrate 20 in this embodiment can also be of other shapes.

[0057] In some embodiments, the substrate 20 in this embodiment is made of glass. Of course, in other embodiments, the substrate 20 in this embodiment may also be made of other materials.

[0058] In some embodiments, the number of the carrier positioning pin assemblies 11 in this embodiment is d, 10≤d≤30; setting the number of the carrier positioning pin assemblies 11 to 10 to 30 can ensure the stable positioning of the substrate 20, reduce the impact of edge warping on the evaporation accuracy, and improve the alignment yield.

[0059] In some embodiments, e carrier positioning pin assemblies 11 are respectively arranged at equal intervals in the edge contour directions of the first long side and the second long side in this embodiment, 3≤e≤10; the number of carrier positioning pin assemblies 11 arranged at equal intervals in the edge contour directions of the first long side and the second long side is set to 3 to 10, which can evenly distribute the positioning constraint force, effectively suppress the warping and deformation of the edge of the substrate, and at the same time avoid the stress concentration problem caused by excessive constraint, thereby improving the evaporation alignment accuracy and yield.

[0060] In some embodiments, f stage positioning pin assemblies 11 are arranged at equal intervals along the edge contours of the first short side and the second short side, respectively, where 2≤f≤5. Setting the number of stage positioning pin assemblies 11 arranged at equal intervals along the edge contours of the first short side and the second short side to 2 to 5 ensures substrate positioning stability, suppresses edge warping, and avoids structural complexity and increased costs caused by excessive positioning points.

[0061] See also Figure 4 As shown, in some specific embodiments, the number of carrier positioning pin assemblies 11 in this embodiment is 20, with 8 carrier positioning pin assemblies 11 arranged at equal intervals along the edge contours of the first long side and the second long side, and 2 carrier positioning pin assemblies 11 arranged at equal intervals along the edge contours of the first short side and the second short side. By providing 8 equally spaced carrier positioning pin assemblies 11 on each of the two long sides, the long sides of the substrate 20 can be fully supported, and by providing 2 positioning pin assemblies on each of the two short sides, the positioning requirements of the short sides can be met while avoiding excessive constraint on the short sides of the rectangular substrate.

[0062] See also Figure 4 As shown, in a specific embodiment, the number of anti-warping support pin assemblies 12 in this embodiment is multiple. When the substrate and the mask are aligned, the multiple anti-warping support pin assemblies 12 are arranged at intervals along the edge contour direction of the substrate 20. By arranging the multiple anti-warping support pin assemblies 12 at intervals along the edge contour direction of the aligned substrate 20, each anti-warping support pin assembly 12 can specifically offset the local deformation of the edge area of ​​the substrate 20, effectively eliminating the edge warping phenomenon caused by traditional peripheral pressing while maintaining the overall flatness of the substrate 20, thereby significantly improving the deposition uniformity of the evaporation material in the edge area of ​​the substrate 20 and solving the evaporation shadow problem caused by edge warping in the prior art.

[0063] See also Figure 4 As shown, in some embodiments, multiple anti-warping support pin assemblies 12 in this embodiment are arranged at intervals along the edge contour direction of the first short side and the second short side; by arranging multiple anti-warping support pin assemblies 12 at intervals along the edge contour direction of the first short side and the second short side, the local warping deformation of the short side of the substrate 20 caused by the pressing of the carrier positioning pin assembly 11 can be effectively offset, so that the warping amount of the short side area of ​​the rectangular substrate is significantly reduced.

[0064] In some embodiments, the number of anti-warping support pin assemblies 12 in this embodiment is g, g≥4; setting the number of anti-warping support pin assemblies 12 to be greater than or equal to 4 can enable the substrate to be evenly supported through multiple points during the evaporation process, ensuring precise alignment between the mask and the substrate, and improving the evaporation yield and product performance of the display panel.

[0065] In some embodiments, h stage positioning pin assemblies are arranged at equal intervals along the edge contours of the first short side and the second short side, respectively, where h ≥ 2. Setting the number of stage positioning pin assemblies arranged at equal intervals along the edge contours of the first short side and the second short side to 2 or greater can form symmetrical constraints on the short sides of the substrate, coordinating with the long side positioning to suppress overall warping and deformation, thereby ensuring stable alignment accuracy between the substrate and the mask during the evaporation process.

[0066] See also Figure 4 As shown, in some specific embodiments, the number of anti-warping support pin assemblies 12 in this embodiment is 4, and 2 anti-warping support pin assemblies 12 are respectively arranged at equal intervals in the edge contour direction of the first short side and the second short side of the rectangular substrate; by setting 2 equidistantly distributed anti-warping support pin assemblies 12 on the two relatively short sides of the rectangular substrate, symmetrical compensation force application points can be formed on the rectangular substrate, thereby effectively covering the main deformation positions of the short side areas of the rectangular substrate, and each anti-warping support pin assembly 12 applies precise compensation force according to the local deformation characteristics of its corresponding area, so that the short side area of ​​the rectangular substrate can obtain sufficient deformation compensation, and the edge warping of the rectangular substrate is significantly reduced, while also avoiding the stress superposition caused by excessively dense support points.

[0067] In a specific embodiment, the anti-warping support pin assembly 12 in this embodiment is located between two adjacent stage positioning pin assemblies 11. It should be noted that the anti-warping support pin assembly 12 being located between two adjacent stage positioning pin assemblies 11 means that the anti-warping support pin assembly 12 and the stage positioning pin assembly 11 are alternately arranged in the edge area of ​​the substrate 20, and the anti-warping support pin assembly 12 is arranged in the direction of the perpendicular line connecting the two stage positioning pin assemblies 11.

[0068] In some embodiments, the anti-warping support pin assembly 12 is set to be located between two adjacent carrier positioning pin assemblies 11, so that the support pin assembly can accurately act on the maximum warping area generated after the carrier positioning pin assembly 11 applies force, and at the same time form a triangular stable support structure to ensure that the deformation compensation force of each edge area of ​​the substrate 20 is evenly distributed.

[0069] See also Figure 3 As shown, in a specific embodiment, the temperature-controlled magnetic attraction assembly in this embodiment includes a magnetic attraction plate assembly 131. When the substrate 20 and the mask 30 are aligned, the magnetic attraction plate assembly 131 is used to apply a magnetic attraction force directed toward the substrate 20 to the mask 30, so that the mask 30 and the substrate 20 are adhered. It should be noted that the magnetic attraction plate assembly 131 in this embodiment refers to an electromagnetic adsorption device integrated in the temperature-controlled magnetic attraction assembly. After the substrate 20 and the mask 30 are aligned, the magnetic attraction plate assembly 131 generates a gradient magnetic field perpendicular to the plane of the mask 30 and pointing in the direction of the substrate 20, so that the mask 30 is subjected to a uniformly distributed magnetic attraction force and actively adheres to the substrate 20. The mask 30 in this embodiment is a metal mask with magnetic response.

[0070] In a specific embodiment, when the substrate 20 and the mask 30 are aligned, the temperature-controlled magnetic platform 10 has a pressing state and an avoidance state; when the temperature-controlled magnetic platform 10 is in the pressing state, the stage positioning pin assembly 11 and the anti-warping support pin assembly 12 are both in contact with the side of the substrate 20 away from the mask 30, and the stage positioning pin assembly 11 applies a first pressing force to the edge area of ​​the substrate 20, and the anti-warping support pin assembly 12 applies a second pressing force to the edge area of ​​the substrate 20 that is prone to warping; when the temperature-controlled magnetic platform 10 is in the avoidance state, the stage positioning pin assembly 11 and the anti-warping support pin assembly 12 are both separated from the substrate 20 and avoid the substrate. It should be noted that , the pressing state and avoidance state of the temperature-controlled magnetic platform 10 in this embodiment refer to the two working modes of the temperature-controlled magnetic platform 10. In the pressing state, the carrier positioning pin assembly 11 and the anti-warping support pin assembly 12 on the temperature-controlled magnetic platform 10 are in contact with the upper surface of the substrate 20 respectively, wherein the carrier positioning pin assembly 11 applies a first pressing force perpendicular to the plane of the substrate 20 and directed to the mask 30 to the edge area of ​​the substrate 20, and the anti-warping support pin assembly 12 applies a second pressing force in the same direction to the edge warping-prone area 21 of the substrate 20; in the avoidance state, the carrier positioning pin assembly 11 and the anti-warping support pin assembly 12 maintain a separation distance from the substrate 20 to achieve process avoidance.

[0071] In some embodiments, the switching between the pressing state and the avoidance state of the temperature-controlled magnetic platform 10 in this embodiment is achieved by lifting and lowering the temperature-controlled magnetic platform 10, wherein the first pressing force is used to maintain the precise alignment of the substrate 20 and the mask 30, and the second pressing force is dedicated to compensating for the edge deformation of the substrate 20. Through the synergistic effect of the first pressing force and the second pressing force, it can be ensured that the substrate 20 has a higher flatness during the evaporation process.

[0072] See also Figure 3 As shown, in some embodiments, the temperature-controlled magnetic suction assembly in this embodiment further includes a cooling plate assembly 132, which is arranged on the magnetic suction plate assembly 131. When the substrate 20 and the mask 30 are aligned, the cooling plate assembly 132 is located on the side of the magnetic suction plate assembly 131 close to the substrate 20 and is spaced apart from the substrate 20 for regulating the temperature of the substrate 20 and the mask 30. When the temperature-controlled magnetic suction platform 10 is in a pressed state, the cooling plate assembly 132 is spaced apart from the substrate 20 by a preset distance. It should be noted that the cooling plate assembly 132 in this embodiment refers to an active temperature control system integrated in the temperature-controlled magnetic suction assembly. In the pressed state, the cooling plate assembly 132 maintains a preset distance of 0.5 to 1.5 mm from the substrate 20 to form a non-contact heat conduction area.

[0073] See also Figures 5 to 7 As shown in a specific embodiment, the anti-warping support pin assembly 12 in this embodiment includes a connecting base 121, a pressing head assembly 122 and an elastic reset mechanism 123. The connecting base 121 is fixedly installed on the temperature-controlled magnetic platform 10, the pressing head assembly 122 is slidably arranged on the connecting base 121, and the elastic reset mechanism 123 is arranged on the connecting base 121. The two ends of the elastic reset mechanism 123 are respectively in contact with the connecting base 121 and the pressing head assembly 122. The elastic reset mechanism 123 is pressed by the pressure. The head assembly 122 applies a second pressing force to the substrate 20; by slidably arranging the pressure head assembly 122 on the connecting base 121, and making the two ends of the elastic reset mechanism 123 respectively abut against the connecting base 121 and the pressure head assembly 122, the elastic reset mechanism 123 can apply a second pressing force to the substrate 20 through the pressure head assembly 122. The second pressing force can offset the warping deformation of the edge of the substrate 20, thereby significantly improving the overall flatness of the substrate 20 and the uniformity of the film layer in the edge area during the evaporation process.

[0074] It should be noted that the pressing head assembly 122 in this embodiment forms a sliding fit with the connecting base 121 through a linear guide rail.

[0075] See also Figures 5 to 7As shown, in some embodiments, the temperature-controlled magnetic platform 10 in this embodiment is provided with a plurality of screw holes distributed along a first direction, and the connecting base 121 is provided with a plurality of fixing holes 1211, and the plurality of fixing holes 1211 can correspond to the plurality of screw holes to achieve rough positioning of the connecting base 121 in the first direction, wherein the first direction is parallel to the lower surface of the temperature-controlled magnetic platform 10; through the alignment of the plurality of screw holes and the plurality of fixing holes 1211, the connecting base 121 can be quickly and accurately preliminarily positioned along the first direction. It should be noted that the temperature-controlled magnetic platform 10 in this embodiment is the temperature-controlled magnetic platform 10 of the existing evaporation equipment, and the plurality of screw holes thereon are the original positioning holes of the equipment. The plurality of fixing holes 1211 set on the connecting base 121 are adapted to the original positioning holes. By reusing the hole resources of the existing equipment, the influence of additional processing of the holes on the structural integrity of the equipment can be avoided, and the modification construction period can be significantly shortened.

[0076] In some embodiments, the temperature-controlled magnetic platform 10 in this embodiment has a groove extending along the second direction, and a positioning protrusion 1212 is provided on the connecting base 121. The positioning protrusion 1212 can cooperate with the groove to realize the positioning of the connecting base 121 in the second direction, wherein the second direction is parallel to the lower surface of the temperature-controlled magnetic platform 10 and perpendicular to the first direction; through the cooperation between the groove and the positioning protrusion 1212, the connecting base 121 can be quickly and accurately positioned along the second direction. It should be noted that the temperature-controlled magnetic platform 10 in this embodiment is the temperature-controlled magnetic platform 10 of the existing evaporation equipment, and the groove thereon is the original positioning groove of the equipment. The positioning protrusion 1212 provided on the connecting base 121 is adapted to the original positioning groove. By reusing the groove resources of the existing equipment, the impact of additional processing of the groove on the structural integrity of the equipment can be avoided, and the modification construction period can be significantly shortened.

[0077] In some embodiments, the positioning protrusion 1212 in this embodiment has a side positioning surface, and the positioning protrusion 1212 in this embodiment is limited by the cooperation between the side positioning surface and the groove.

[0078] In some embodiments, the screw hole in this embodiment extends along a third direction, and the anti-warping support pin assembly 12 also includes a fixing screw, which passes through the fixing hole 1211 and is screwed into the screw hole to achieve fixation of the connecting base 121 in the third direction, wherein the third direction is perpendicular to the lower surface of the temperature-controlled magnetic platform 10; it should be noted that the fixing screw in this embodiment is a standard fastener, and by passing the fixing screw through the fixing hole 1211 and screwing it into the screw hole, the connecting base 121 can be accurately positioned and fixed in the original coordinate system of the device.

[0079] In some embodiments, the first direction and the second direction in this embodiment are horizontal directions, and the third direction is a vertical direction.

[0080] In some embodiments, the pressure head assembly 122 in this embodiment includes a pressure head adjustment assembly 1221 and a pressure head body 1222. The pressure head body 1222 can be slidably arranged on the connecting base 121 through the pressure head adjustment assembly 1221. The pressure head adjustment assembly 1221 is used to adjust the relative position between the pressure head body 1222 and the elastic reset mechanism 123 when not subject to external force; through the pressure head adjustment assembly 1221 in this embodiment, the initial position of the pressure head body 1222 relative to the connecting base 121 can be accurately controlled, so that the anti-warping support pin assembly 12 can adapt to the deformation compensation requirements of substrates 20 of different thicknesses.

[0081] In some embodiments, the specific structure of the pressure head adjustment assembly 1221 in this embodiment is a conventional structure in the prior art and will not be described in detail here.

[0082] In some embodiments, the material of the pressing head body 1222 in this embodiment is polyetheretherketone. Of course, in other embodiments, the pressing head body 1222 in this embodiment can also be made of other materials.

[0083] In some embodiments, the anti-warping support pin assembly 12 in this embodiment further includes an elastic force adjustment assembly 124, which is disposed on the connection base 121. The elastic reset mechanism 123 includes a compression spring, the first end of which abuts the pressure head assembly 122, and the second end of which abuts the connection base 121 via the elastic force adjustment assembly 124. The elastic force adjustment assembly 124 is used to adjust the compression amount of the compression spring to change the magnitude of the second pressing force applied by the elastic reset mechanism 123 to the substrate 20 via the pressure head assembly 122. It should be noted that the compression amount of the compression spring in this embodiment refers to the initial compression amount of the compression spring. Adjusting the initial compression amount of the compression spring can change the magnitude of the second pressing force, allowing the anti-warping support pin assembly 12 to compensate for edge warping caused by different process conditions.

[0084] In some embodiments, the elastic force adjustment component 124 in this embodiment is an elastic force adjustment knob, and its specific structure is a conventional structure in the prior art and will not be described in detail here.

[0085] In some embodiments, a spring positioning pin 1213 is fixedly provided on the connection base 121 of this embodiment. The compression spring in this embodiment is positioned on the connection base 121 by cooperating with the spring positioning pin 1213. It should be noted that the compression spring in this embodiment can be mounted outside the spring positioning pin 1213 or passed through the spring positioning pin 1213. The spring positioning pin 1213 is used to limit the radial movement of the compression spring and guide the expansion and contraction of the compression spring.

[0086] It should be noted that after the substrate 20 and the mask 30 in this embodiment are aligned, the temperature-controlled magnetic platform 10, the substrate carrying mechanism 40 and the mask carrying mechanism 50 are arranged in sequence from top to bottom, wherein the substrate carrying mechanism 40 and the mask carrying mechanism 50 directly adopt the original configuration of the existing evaporation equipment. The temperature-controlled magnetic platform 10 in this embodiment, based on the temperature-controlled magnetic platform 10 of the existing evaporation equipment, utilizes the original structure of the existing temperature-controlled magnetic platform 10, and adds an anti-warping support pin assembly 12, while completely retaining the magnetic distribution and temperature control function of the original platform, achieving precise compensation for the edge deformation of the substrate 20.

[0087] According to another aspect of the present application, an evaporation device is provided, which includes an equipment body and a display panel evaporation alignment device. A metal evaporation cavity is provided in the equipment body, and the display panel evaporation alignment device is provided in the metal evaporation cavity. The display panel evaporation alignment device is the above-mentioned display panel evaporation alignment device.

[0088] In some embodiments, the evaporation equipment in this embodiment further includes a vacuum device, which is disposed on the equipment body and communicated with the metal evaporation chamber for evacuating the metal evaporation chamber.

[0089] In some embodiments, the evaporation equipment in this embodiment also includes a metal evaporation device, which is arranged in a metal evaporation chamber. After the substrate 20 and the mask 30 are aligned and the substrate 20 and the mask 30 are bonded, the metal evaporation device can evaporate a metal material layer on the surface of the substrate 20 through the mask 30.

[0090] In summary, the display panel evaporation alignment device and evaporation equipment provided in this embodiment have at least the following beneficial technical effects: the display panel evaporation alignment device provided in this embodiment sets a plurality of carrier positioning pin assemblies 11, so that the temperature-controlled magnetic platform 10 can press the aligned substrate 20 and the mask 30 through the plurality of carrier positioning pin assemblies 11, and maintain a preset distance of heat dissipation interval between the temperature-controlled magnetic assembly and the substrate 20; at the same time, by setting the anti-warping support pin assembly 12, the temperature-controlled magnetic platform 10 can offset the warping of the substrate 20 caused by the pressing of the carrier positioning pin assembly 11 through the anti-warping support pin assembly 12, thereby significantly improving the evaporation shadow effect and improving the uniformity of the evaporated film layer; and, through the non-contact design between the substrate 20 and the temperature-controlled magnetic assembly, the risk of sticking and electrostatic damage caused by traditional mechanical pressing can be avoided, so that the substrate 20 can obtain stable support while maximizing the utilization of the effective area of ​​the substrate 20, taking into account both production yield and economic benefits.

[0091] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A display panel evaporation alignment device, arranged in a metal evaporation chamber of an evaporation device, for aligning a substrate (20) and a mask (30), characterized in that: The display panel evaporation alignment device includes: A temperature-controlled magnetic platform (10), comprising a temperature-controlled magnetic assembly (13), a plurality of carrier positioning pin assemblies (11) and at least one anti-warping support pin assembly (12), wherein the temperature-controlled magnetic assembly (13) is movably disposed in the metal evaporation chamber, and the carrier positioning pin assembly (11) and the anti-warping support pin assembly (12) are both disposed in the temperature-controlled magnetic assembly (13); Wherein, when the substrate (20) and the mask (30) are aligned, the position of the carrier positioning pin assembly (11) corresponds to the edge area of ​​the substrate (20), and the carrier positioning pin assembly (11) is used to apply a first pressing force to the edge area of ​​the substrate (20) to press the substrate (20) and the mask (30) together, and to space the substrate (20) and the temperature-controlled magnetic attraction assembly (13) at a preset distance; After the edge area of ​​the substrate (20) is subjected to the first pressing force, an edge easy-to-warp area (21) is correspondingly formed. The position of the anti-warping support pin assembly (12) corresponds to the edge easy-to-warp area (21) and is used to apply a second pressing force to the edge easy-to-warp area (21) to offset the warping of the substrate (20) caused by the first pressing force.

2. The display panel evaporation alignment device according to claim 1, characterized in that: The first pressing force is directed toward the mask (30), and the magnitude of the first pressing force is a, 10N≤a≤13N; And / or, the second pressing force is directed toward the mask (30), and the magnitude of the second pressing force is b, 0.8N≤b≤5N; And / or, the preset distance is c, 1mm≤c≤1.5mm.

3. The display panel evaporation alignment device according to claim 1, wherein: The display panel evaporation alignment device further includes: a substrate carrying mechanism (40), the substrate carrying mechanism (40) being arranged in the metal evaporation chamber and being used to carry the substrate (20); a mask carrying mechanism (50), the mask carrying mechanism (50) being movably disposed in the metal evaporation chamber and located below the substrate carrying mechanism (40), for carrying the mask (30) and aligning the mask (30) with the substrate (20); The temperature-controlled magnetic attraction component (13) is located on a side of the substrate carrying mechanism (40) that is away from the mask carrying mechanism (50). When the substrate (20) and the mask plate (30) are aligned, a plurality of the stage positioning pin components (11) are arranged at intervals along the edge contour direction of the substrate (20).

4. The display panel evaporation alignment device according to claim 3, characterized in that: The substrate (20) is a rectangular substrate having a first long side, a first short side, a second long side and a second short side arranged in sequence, and a plurality of the carrier positioning pin assemblies (11) are arranged at intervals along the edge contour direction of the first long side, the first short side, the second long side and the second short side.

5. The display panel evaporation alignment device according to claim 4, characterized in that: The number of the carrier positioning pin assemblies (11) is d, 10≤d≤30; And / or, e number of the platform positioning pin assemblies (11) are respectively arranged at equal intervals in the edge contour direction of the first long side and the second long side, 3≤e≤10; And / or, f number of the platform positioning pin assemblies (11) are arranged at equal intervals in the edge contour direction of the first short side and the second short side, respectively, and 2≤f≤5.

6. The display panel evaporation alignment device according to claim 4, characterized in that: The number of the anti-warping support pin assemblies (12) is multiple, and when the substrate (20) and the mask (30) are aligned, the multiple anti-warping support pin assemblies (12) are arranged at intervals along the edge contour direction of the substrate (20).

7. The display panel evaporation alignment device according to claim 6, characterized in that: The plurality of anti-warping support pin assemblies (12) are arranged at intervals along the edge contour direction of the first short side and the second short side.

8. The display panel evaporation alignment device according to claim 7, characterized in that: The number of the anti-warping support pin assemblies (12) is g, where g is ≥ 4; And / or, h number of the platform positioning pin assemblies (11) are arranged at equal intervals in the edge contour direction of the first short side and the second short side, respectively, and h≥2.

9. The display panel evaporation alignment device according to claim 1, characterized in that: The temperature-controlled magnetic attraction component (13) comprises a magnetic attraction plate component (131). When the substrate (20) and the mask (30) are aligned, the magnetic attraction plate component (131) is used to apply a magnetic attraction force directed toward the substrate (20) to the mask (30), so that the mask (30) and the substrate (20) are in contact.

10. The display panel evaporation alignment device according to claim 9, characterized in that: When the substrate (20) and the mask (30) are aligned, the temperature-controlled magnetic platform (10) has a pressing state and an avoiding state; When the temperature-controlled magnetic platform (10) is in the pressed state, the carrier positioning pin assembly (11) and the anti-warping support pin assembly (12) are both in contact with the side of the substrate (20) facing away from the mask (30), and the carrier positioning pin assembly (11) applies the first pressing force to the edge area of ​​the substrate (20), and the anti-warping support pin assembly (12) applies the second pressing force to the edge area (21) of the substrate (20) that is prone to warping; When the temperature-controlled magnetic platform (10) is in the avoidance state, the platform positioning pin assembly (11) and the anti-warping support pin assembly (12) are both separated from the substrate (20), and avoid the substrate (20).

11. The display panel evaporation alignment device according to claim 10, characterized in that: The temperature-controlled magnetic attraction component further includes a cooling plate component (132), wherein the cooling plate component (132) is arranged on the magnetic attraction plate component (131). When the substrate (20) and the mask (30) are aligned, the cooling plate component (132) is located on a side of the magnetic attraction plate component (131) close to the substrate (20) and is spaced apart from the substrate (20) for regulating the temperature of the substrate (20) and the mask (30). When the temperature-controlled magnetic attraction platform (10) is in the pressed state, the cooling plate component (132) and the substrate (20) are spaced apart by the preset distance.

12. The display panel evaporation alignment device according to any one of claims 1 to 11, characterized in that: The anti-warping support pin assembly (12) includes a connecting base (121), a pressure head assembly (122) and an elastic reset mechanism (123), wherein the connecting base (121) is fixedly mounted on the temperature-controlled magnetic platform (10), the pressure head assembly (122) is slidably arranged on the connecting base (121), and the elastic reset mechanism (123) is arranged on the connecting base (121), and the two ends of the elastic reset mechanism (123) are respectively in contact with the connecting base (121) and the pressure head assembly (122), and the elastic reset mechanism (123) applies the second pressing force to the substrate (20) through the pressure head assembly (122).

13. The display panel evaporation alignment device according to claim 12, wherein: The temperature-controlled magnetic platform (10) is provided with a plurality of screw holes distributed along a first direction, and the connection base (121) is provided with a plurality of fixing holes (1211), and the plurality of fixing holes (1211) can correspond to the plurality of screw holes to achieve rough positioning of the connection base (121) in the first direction, wherein the first direction is parallel to the lower surface of the temperature-controlled magnetic platform (10).

14. The display panel evaporation alignment device according to claim 13, wherein: The temperature-controlled magnetic platform (10) has a groove extending along a second direction, and the connection base (121) is provided with a positioning protrusion (1212), and the positioning protrusion (1212) can cooperate with the groove to achieve the positioning of the connection base (121) in the second direction, wherein the second direction is parallel to the lower surface of the temperature-controlled magnetic platform (10) and perpendicular to the first direction.

15. The display panel evaporation alignment device according to claim 13, wherein: The screw hole extends along a third direction, and the anti-warping support pin assembly (12) further includes a fixing screw, which passes through the fixing hole (1211) and is screwed into the screw hole to achieve the fixation of the connection base (121) in the third direction, wherein the third direction is perpendicular to the lower surface of the temperature-controlled magnetic platform (10).

16. The display panel evaporation alignment device according to claim 12, characterized in that: The pressure head assembly (122) comprises a pressure head adjustment assembly (1221) and a pressure head body (1222); the pressure head body (1222) is slidably arranged on the connection base (121) via the pressure head adjustment assembly (1221); the pressure head adjustment assembly (1221) is used to adjust the relative position between the pressure head body (1222) and the elastic reset mechanism (123) when no external force is applied; And / or, the anti-warping support pin assembly (12) further includes an elastic force adjustment assembly (124), the elastic force adjustment assembly (124) is arranged on the connecting base (121), the elastic reset mechanism (123) includes a compression spring, the first end of the compression spring abuts against the pressure head assembly (122), the second end of the compression spring abuts against the connecting base (121) through the elastic force adjustment assembly (124), and the elastic force adjustment assembly (124) is used to adjust the compression amount of the compression spring to change the magnitude of the second pressing force applied by the elastic reset mechanism (123) to the substrate (20) through the pressure head assembly (122).

17. A vapor deposition device, characterized in that: The evaporation equipment includes an equipment body and a display panel evaporation alignment device. A metal evaporation cavity is provided in the equipment body. The display panel evaporation alignment device is provided in the metal evaporation cavity. The display panel evaporation alignment device is the display panel evaporation alignment device according to any one of claims 1 to 16.

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