VCP wire on-line copper sludge extraction system and use method

Abstract

The invention discloses a VCP wire on-line copper sludge extraction system and a use method, and the VCP wire on-line copper sludge extraction system comprises an electroplating cylinder; the anode assembly is arranged in the electroplating cylinder and comprises a mounting frame, a titanium basket and an anode material, the titanium basket is connected to the mounting frame, and the anode material is stored in the titanium basket and immersed in the electroplating cylinder; the cleaning assembly is connected to the electroplating cylinder and comprises a precipitation cylinder, a mud pumping pipe and a liquid return pipe, the precipitation cylinder and the electroplating cylinder are arranged in a separated mode, one end of the mud pumping pipe is connected to the bottom of the titanium basket and used for pumping copper mud to the precipitation cylinder, and one end of the liquid return pipe is communicated with the upper side of the precipitation cylinder and used for pumping the copper mud after the copper mud is precipitated to the precipitation cylinder; and the liquid return pipe extracts the supernatant to the electroplating cylinder. Through automatic control, copper sludge is effectively extracted in a non-stop state, the electroplating cylinder is kept clean, and the TOC growth speed is slowed down, so that the carbon treatment period is prolonged to more than one year, the production efficiency is improved, and the maintenance frequency and the manpower and material resource consumption are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing, and particularly to an on-line copper sludge extraction system for a VCP line, as well as a usage method applied to an on-line copper sludge extraction system for a VCP line. Background Art

[0002] In the vertical continuous plating (VCP) process, copper balls are usually placed in titanium baskets as anode materials and wrapped with titanium basket bags to prevent direct mixing of copper sludge into the plating solution. However, during the actual production process, copper ions will deposit inside the titanium basket bags to form copper sludge. As the production time extends, the copper sludge gradually accumulates, leading to a series of technical and operational problems.

[0003] First of all, as the copper sludge continuously deposits in the titanium basket bags, it will gradually reduce the effective working area, thereby affecting the current distribution and deep plating ability during the electroplating process. To maintain product quality, it is necessary to adjust the electroplating parameters according to the degree of copper sludge deposition, which increases the complexity and instability of production and there is a risk of uneven copper layer thickness.

[0004] Secondly, the existing production process requires regular carbon treatment to remove the accumulated copper sludge. This process requires stopping the entire production line, cleaning out all the titanium baskets and washing the copper balls, and at the same time replacing the new titanium basket bags. The entire maintenance cycle is about once a week, which not only consumes a large amount of human and material resources, but also significantly reduces the effective operation time and production capacity utilization rate of the production line.

[0005] In addition, due to the traditional design being unable to achieve on-line treatment of copper sludge, the carbon treatment cycle of the electroplating tank is limited between 6 and 7 months. In contrast, according to the TOC (total organic carbon) control standard provided by the chemical supplier, the ideal carbon treatment cycle should exceed one year. This difference reflects the limitations of the existing technology in extending the equipment maintenance cycle, further exacerbating the problems of low production efficiency and increased costs. Summary of the Invention

[0006] The present invention aims to at least solve one of the technical problems existing in the prior art. For this reason, the present invention proposes an on-line copper sludge extraction system for a VCP line, which realizes effective extraction of copper sludge in a non-stop state, keeps the electroplating tank clean, slows down the growth rate of TOC, thereby extending the carbon treatment cycle to more than one year. This system not only improves production efficiency, reduces the maintenance frequency and consumption of human and material resources, ensures the stability of product quality, but also further enhances the operation convenience and safety through automatic control, and overall greatly improves the economic benefits and environmental protection performance of the production line.

[0007] The present invention also proposes a usage method applied to an on-line copper sludge extraction system for a VCP line.

[0008] An on-line copper sludge extraction system for a VCP line according to the present invention includes: An electroplating tank; An anode assembly disposed in the electroplating tank. The anode assembly includes a mounting frame, a titanium basket, and anode materials. The titanium basket is connected to the mounting frame, and the anode materials are stored in the titanium basket and immersed in the electroplating tank; A cleaning assembly connected to the electroplating tank. The cleaning assembly includes a sedimentation tank, a sludge extraction pipe, and a return liquid pipe. The sedimentation tank is arranged separately from the electroplating tank. One end of the sludge extraction pipe is connected to the bottom of the titanium basket and is used to extract copper sludge to the sedimentation tank. One end of the return liquid pipe is communicated with the upper side of the sedimentation tank. After the copper sludge precipitates to the sedimentation tank, the return liquid pipe extracts the supernatant to the electroplating tank.

[0009] An on-line copper sludge extraction system for a VCP line according to the present invention has at least the following beneficial effects: By providing a sedimentation tank, a sludge extraction pipe, and a return liquid pipe, wherein one end of the sludge extraction pipe is connected to the bottom of the titanium basket and is used to extract copper sludge into the sedimentation tank, and the return liquid pipe is used to re-transport the supernatant after static separation back into the electroplating tank, ensuring that there is no copper sludge residue in the electroplating tank body, maintaining the cleanliness of the electroplating tank, thereby effectively reducing the growth rate of TOC and extending the carbon treatment cycle to more than one year; In addition, since the copper sludge cleaning work can be carried out without stopping the machine, the system significantly reduces the downtime caused by maintenance, saves a large amount of human and material resources, and improves the overall production efficiency and product quality stability. At the same time, by reducing the frequent downtime maintenance requirements, the safety and operation convenience of the production line are also indirectly improved, which is of great significance for realizing an efficient, environmentally friendly and economical electroplating production process.

[0010] In an on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, the mounting frame is provided with a temporary storage tank located at the bottom of the titanium basket. The bottom of the titanium basket is provided with a discharge port for the copper sludge to enter the temporary storage tank, and the sludge extraction pipe is used to extract the copper sludge located in the temporary storage tank.

[0011] In an on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, the mounting frame is provided with a first mounting hole and a second mounting hole. The titanium basket is vertically penetrated through the first mounting hole, and the sludge extraction pipe is vertically penetrated through the second mounting hole.

[0012] In an on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, the mounting frame is sleeved with a sleeve bag to block the copper sludge.

[0013] An on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, wherein a liquid extraction pump and a filter are provided on the liquid return pipe, the liquid extraction pump is used to extract the supernatant liquid, and after flowing through the filter, it flows into the electroplating bath.

[0014] An on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention further includes a control device. A valve is provided on the sludge extraction pipe. There are multiple electroplating baths, anode assemblies and valves. The electroplating baths, anode assemblies and valves are arranged in one-to-one correspondence. The control device integrally controls multiple valves to extract the copper sludge of several anode assemblies to the precipitation tank.

[0015] An on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, wherein the sludge extraction pipe includes a main pipe and branch pipes. There are multiple branch pipes which are respectively connected to the titanium baskets in multiple electroplating baths. The valves are arranged in one-to-one correspondence on the branch pipes. A sludge extraction pump is provided on the main pipe. The sludge extraction pump is used to extract the copper sludge in the branch pipes to the precipitation tank.

[0016] An on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, wherein a discharge assembly is connected to the precipitation tank to discharge the copper sludge in the precipitation tank.

[0017] An on-line copper sludge extraction system for a VCP line according to some embodiments of the present invention, wherein the discharge assembly is provided with a sludge outlet pipe and a water inlet pipe. The sludge outlet pipe communicates with the bottom of the precipitation tank. The water inlet pipe is used to flush the copper sludge to drive the copper sludge to be discharged. After the copper sludge is discharged, the water inlet pipe can flush the precipitation tank.

[0018] According to the usage method of the present invention, it is applied to an on-line copper sludge extraction system for a VCP line according to the present invention; The usage method includes the following steps: Start sludge extraction: Divide multiple electroplating baths into multiple groups, and the control device integrally controls multiple valves to extract the copper sludge group by group; Pause sludge extraction: After starting sludge extraction, detect the liquid level height of the precipitation tank. When the liquid level height is higher than the preset value, pause extracting the copper sludge; Static precipitation: After pausing sludge extraction, after the precipitation tank stands for a preset time, the copper sludge precipitates downward and the supernatant liquid is separated out on the upper layer; Liquid reflux: After static precipitation, the liquid return pipe extracts the supernatant liquid and flows back to the electroplating bath; Sludge discharge and cleaning: After starting the sludge pumping, if it is necessary to clean the sedimentation tank, open the sludge outlet pipe and the water inlet pipe, flush the copper sludge and discharge it from the water inlet pipe. After the copper sludge is discharged, the water inlet pipe flushes the sedimentation tank.

[0019] According to the usage method of the present invention, it has at least the following beneficial effects: First, by grouping multiple electroplating tanks and using a control device to integrally control multiple valves, the process of extracting copper sludge group by group is realized. This method not only improves the efficiency of copper sludge extraction and the stability of system operation, but also allows for flexible adjustment of the extraction sequence according to the actual production situation, ensuring the continuity and high efficiency of the production line; Then, after starting the sludge pumping, by real-time monitoring the liquid level height of the sedimentation tank, when the liquid level height is higher than the preset value, the sludge pumping is paused. This process ensures that the sedimentation tank will not be overloaded and maintains the stable operation of the system; Subsequently, after pausing the sludge pumping, let the sedimentation tank stand for a period of time so that the copper sludge can fully settle and separate the supernatant. This step is crucial for ensuring the quality of the liquid flowing back to the electroplating tank, helping to maintain the purity of the electroplating solution and the stability of product quality; In addition, in the liquid reflux step, the return liquid pipe extracts the supernatant and returns it to the electroplating tank, which not only saves resources but also reduces the cost of waste liquid treatment, reflecting the dual considerations of environmental protection and economy; Finally, when it is necessary to clean the sedimentation tank, by opening the sludge outlet pipe and the water inlet pipe, the copper sludge can be effectively flushed and discharged to ensure that the sludge discharge system is not blocked. At the same time, the water inlet pipe can also flush the sedimentation tank to ensure that its interior is clean without copper sludge residue. This not only simplifies the maintenance work but also extends the service life of the equipment. The design of the entire operation process greatly optimizes the copper sludge management, reduces the frequent shutdown requirements in the traditional process, significantly improves the production efficiency and economic benefits, and also helps to improve the quality and consistency of electroplated products.

[0020] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where: Figure 1 is a schematic structural diagram of an on-line copper sludge extraction system for a VCP line according to an embodiment of the present invention; Figure 2 is a schematic structural diagram of an anode assembly of an on-line copper sludge extraction system for a VCP line according to an embodiment of the present invention; Figure 3 is a schematic structural diagram of an installation frame of an on-line copper sludge extraction system for a VCP line according to an embodiment of the present invention; Figure 4Schematic diagram of the structure of the titanium basket of an on-line copper sludge extraction system for a VCP line in an embodiment of the present invention; Figure 5 Flow chart of the usage method of the titanium basket of an on-line copper sludge extraction system for a VCP line in an embodiment of the present invention.

[0022] Explanation of the reference numerals in the drawings: Plating tank 100; Anode assembly 200; Installation frame 210; Temporary storage tank 2101; First installation hole 2102; Second installation hole 2103; Titanium basket 220; Drain outlet 2201; Cleaning assembly 300; Precipitation tank 310; Mud discharge pipe 311; Water inlet pipe 312; Overflow pipe 313; Mud suction pipe 320; Main pipe 321; Mud suction pump 3211; Branch pipe 322; Valve 3221; Return liquid pipe 330; Liquid suction pump 331; Filter 332; Control device 400. Detailed implementation manners

[0023] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0024] In the description of the present invention, it should be understood that the orientation descriptions such as up, down, front, back, left, right, etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0025] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0027] In the description of the present invention, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0028] In the vertical continuous plating (VCP) process, copper balls are usually placed in a titanium basket as the anode material and wrapped with a titanium basket bag to prevent direct mixing of copper sludge into the plating solution. However, during the actual production process, copper ions will deposit inside the titanium basket bag to form copper sludge. As the production time extends, the copper sludge gradually accumulates, leading to a series of technical and operational problems.

[0029] First, as the copper sludge continuously deposits in the titanium basket bag, it will gradually reduce the effective working area, thereby affecting the current distribution and throwing power during the plating process. To maintain product quality, it is necessary to adjust the plating parameters according to the degree of copper sludge deposition, which increases the complexity and instability of production and there is a risk of uneven copper layer thickness.

[0030] Second, the existing production process requires regular carbon treatment to remove the accumulated copper sludge. This process requires stopping the entire production line, cleaning out all the titanium baskets and washing the copper balls, and at the same time replacing the new titanium basket bags. The entire maintenance cycle is about once a week, which not only consumes a large amount of human and material resources but also significantly reduces the effective operation time and production capacity utilization rate of the production line.

[0031] In addition, due to the traditional design being unable to achieve on-line treatment of copper sludge, the carbon treatment cycle of the plating tank is limited to between 6 and 7 months. In contrast, according to the TOC (total organic carbon) control standard provided by the chemical supplier, the ideal carbon treatment cycle should exceed one year. This difference reflects the limitations of the existing technology in extending the equipment maintenance cycle, further exacerbating the problems of low production efficiency and increased costs.

[0032] For this reason, as Figures 1 to 4As shown, an on-line copper sludge extraction system for a VCP line proposed by the present invention includes a plating bath 100, an anode assembly 200 disposed in the plating bath 100, and a cleaning assembly 300 connected to the plating bath 100. Among them, the anode assembly 200 includes a mounting frame 210, a titanium basket 220 connected to the mounting frame 210, and anode materials stored in the titanium basket 220 and immersed in the plating bath 100. Further, the cleaning assembly 300 includes a sedimentation tank 310, a sludge extraction pipe 320, and a return liquid pipe 330. The sedimentation tank 310 is arranged separately from the plating bath 100, and a circulation system is formed through the sludge extraction pipe 320 and the return liquid pipe 330. Specifically, one end of the sludge extraction pipe 320 is connected to the bottom of the titanium basket 220 and is used to extract copper sludge to the sedimentation tank 310. One end of the return liquid pipe 330 communicates with the upper side of the sedimentation tank 310. After the copper sludge precipitates to the sedimentation tank 310, the return liquid pipe 330 extracts the supernatant to the plating bath 100. It should be noted that by providing the sedimentation tank 310, the sludge extraction pipe 320, and the return liquid pipe 330, one end of the sludge extraction pipe 320 is connected to the bottom of the titanium basket 220 and is used to extract the copper sludge into the sedimentation tank 310, while the return liquid pipe 330 is used to re-transport the supernatant after static separation back into the plating bath 100, ensuring that there is no copper sludge residue in the tank body of the plating bath 100, maintaining the cleanliness of the plating bath 100, thereby effectively reducing the growth rate of TOC and extending the carbon treatment cycle to more than one year. In addition, since the copper sludge cleaning work can be carried out without stopping the machine, this system significantly reduces the downtime caused by maintenance, saves a large amount of human and material resources, and improves the overall production efficiency and product quality stability. At the same time, by reducing the frequent downtime maintenance requirements, the safety and operation convenience of the production line are also indirectly improved, which is of great significance for realizing an efficient, environmentally friendly and economical electroplating production process.

[0033] In some embodiments of the present invention, as Figure 4 shown, the bottom end of the titanium basket 220 is closed, and a discharge port 2201 is provided at the bottom of the titanium basket 220. The end of the sludge extraction pipe 320 can be connected to the discharge port 2201 to extract the copper sludge at the bottom of the titanium basket 220. Refer to Figure 2 and Figure 3, in some embodiments of the present invention, the mounting frame 210 is provided with a temporary storage slot 2101. The temporary storage slot 2101 is located at the bottom of the titanium basket 220. The bottom of the titanium basket 220 is provided with a discharge port 2201 for the copper sludge to enter the temporary storage slot 2101. The sludge suction pipe 320 is used to extract the copper sludge located in the temporary storage slot 2101. At this time, the bottom end of the titanium basket 220 can be open, and the discharge port 2201 is located at the bottom end of the titanium basket 220. In this regard, the titanium basket 220 has a hollow structure, and it is more convenient to take out and clean the copper sludge attached to its inner wall; alternatively, the bottom end of the titanium basket 220 is closed, and the bottom of the titanium basket 220 is provided with a discharge port 2201. In this regard, the copper sludge can be discharged through the discharge port 2201 into the temporary storage slot 2101. It should be noted that the design of the temporary storage slot 2101 not only optimizes the collection process of the copper sludge, but also reduces the possible solution disturbance caused by directly extracting the copper sludge from the electroplating tank 100, which helps to maintain the stability of the electroplating solution. In addition, this structure is convenient for maintenance and cleaning, further improving the operation efficiency and reliability of the system.

[0034] Referring again to Figure 2 and Figure 3 , in some embodiments of the present invention, the mounting frame 210 is provided with a first mounting hole 2102 and a second mounting hole 2103. The titanium basket 220 is vertically inserted through the first mounting hole 2102, and the sludge suction pipe 320 is vertically inserted through the second mounting hole 2103. On the one hand, it ensures the relative position between the titanium basket 220 and the sludge suction pipe 320 is fixed, improving the stability and consistency of the entire system, which is beneficial to maintaining a good electroplating effect; on the other hand, the vertical insertion installation method simplifies the installation and disassembly process, which is not only convenient for adding anode materials, such as adding copper balls from the upper end of the titanium basket 220, but also convenient for the daily maintenance of the sludge suction pipe 320 and the cleaning of the titanium basket 220, helping to improve production efficiency.

[0035] In some embodiments of the present invention, a sleeve bag is sleeved on the mounting frame 210 to block the copper sludge, which can effectively isolate the copper sludge and prevent the copper sludge from spreading to other areas during the electroplating process of the circuit board, thus ensuring the purity of the electroplating solution and the quality stability of the product. In addition, the presence of the sleeve bag also reduces the pollution inside the titanium basket 220, making some copper sludge adhere to the inner wall of the sleeve bag, reducing the cleaning difficulty of the titanium basket 220, and extending the service life of the equipment. Overall, it not only improves the continuity of production, but also reduces the downtime caused by frequent cleaning, which plays an important role in improving the overall production efficiency. It is easy to understand that the sleeve bag does not block the anode ions precipitated from the anode material and can be conveniently replaced after being overly polluted by the copper sludge after being used for a period of time.

[0036] Referring again to Figure 1, in some embodiments of the present invention, an on-line copper sludge extraction system for VCP lines further includes a control device 400. Among them, a valve 3221 is provided on the sludge extraction pipe 320. There are multiple electroplating tanks 100, anode assemblies 200, and valves 3221. The electroplating tanks 100, anode assemblies 200, and valves 3221 are arranged in one-to-one correspondence. In this regard, the control device 400 integrally controls multiple valves 3221 to extract the copper sludge of several anode assemblies 200 to the precipitation tank 310, realizing precise control of the copper sludge extraction of multiple electroplating tanks 100 and their anode assemblies 200. This design can flexibly adjust the copper sludge extraction sequence and time of each tank according to actual needs, ensuring the high efficiency and stability of the system operation. In addition, the automated control method not only reduces manual intervention but also improves the safety and accuracy of operation, providing a technical basis for realizing intelligent and unmanned production. Optionally, the valve 3221 is a pneumatic valve. Further, the sludge extraction pipe 320 includes a main pipe 321 and branch pipes 322. There are multiple branch pipes 322, which are respectively connected to the titanium baskets 220 in multiple electroplating tanks 100. The valves 3221 are provided on the branch pipes 322 in one-to-one correspondence. A sludge extraction pump 3211 is provided on the main pipe 321. The sludge extraction pump 3211 is used to extract the copper sludge of the branch pipes 322 to the precipitation tank 310. By providing the main pipe 321 and branch pipes 322 and equipping each branch pipe 322 with an independent valve 3221, it is ensured that the copper sludge extraction of each electroplating tank 100 can be carried out independently. This modular design increases the flexibility and adaptability of the system and is convenient for adjusting operation parameters according to different production requirements. At the same time, by centrally extracting the copper sludge through the sludge extraction pump 3211 on the main pipe 321, the extraction efficiency is improved, the energy consumption is reduced, and the economic and environmental protection performance of the system is further enhanced. It is easy to understand that the sludge extraction pump 3211 provides the extraction force on the main pipe 321, and the opening of the valve 3221 on the branch pipe 322 determines the extraction of the copper sludge in the corresponding electroplating tank 100. Optionally, the sludge extraction pump 3211 is a pneumatic pump and can use the same gas circuit system as the pneumatic valve.

[0037] In some embodiments of the present invention, referring to Figure 1, a liquid return pipe 330 is provided with a liquid extraction pump 331 and a filter 332. The liquid extraction pump 331 is used to extract the supernatant liquid, which flows into the electroplating tank 100 after passing through the filter 332. Furthermore, before the supernatant liquid is re-transported back to the electroplating tank 100, it can be filtered to ensure that the quality of the returned liquid meets the requirements. This measure effectively purifies the electroplating solution, avoids secondary pollution of impurities, and helps to improve the quality and uniformity of the electroplating layer. At the same time, by using the liquid extraction pump 331, the recycling of the liquid can be completed more efficiently, further enhancing the automation level and operation convenience of the system. Optionally, there are two filters 332 which form a secondary filtration system. For example, in the output direction of the liquid extraction pump, a 25um bag filter and a 5um bag filter are arranged in sequence. Similar to the sludge extraction pump 3211, the liquid extraction pump 331 is a pneumatic pump, and the whole can share a set of gas circuit systems.

[0038] In some embodiments of the present invention, the precipitation tank 310 is connected with a discharge assembly to discharge the copper sludge in the precipitation tank 310, ensuring that the system can operate continuously and stably, which is of great significance for improving production efficiency and product quality. Specifically, referring again to Figure 1 , the discharge assembly is provided with a sludge outlet pipe 311 and a water inlet pipe 312. The sludge outlet pipe 311 communicates with the bottom of the precipitation tank 310, and the water inlet pipe 312 is used to flush the copper sludge to drive the copper sludge out. After the copper sludge is discharged, the water inlet pipe 312 can flush the precipitation tank 310. In this regard, the copper sludge in the precipitation tank 310 can be smoothly discharged through the effective cooperation of the sludge outlet pipe 311 and the water inlet pipe 312 without causing blockage, which not only simplifies the process of discharging the copper sludge, ensures the smoothness of the copper sludge discharge, but also ensures the cleanliness of the precipitation tank 310, reducing the maintenance frequency and maintenance workload.

[0039] Referring again to Figure 5 , according to the usage method of the embodiment of the present invention, it is applied to an on-line copper sludge extraction system of a VCP line according to the embodiment of the present invention. Among them, the usage method includes the following steps: S100, start sludge extraction: Divide multiple electroplating tanks 100 into multiple groups, and the control device 400 integrally controls multiple valves 3221 to extract copper sludge group by group. For example, there are 4 electroplating tanks 100 which are divided into 4 groups, and the copper sludge in the electroplating tanks 100 is extracted one by one; S200, pause sludge extraction: After starting the sludge extraction, detect the liquid level height of the precipitation tank 310. When the liquid level height is higher than the preset value, pause the extraction of copper sludge; S300, static precipitation: After pausing the sludge extraction, after the precipitation tank 310 stands for a preset time, the copper sludge precipitates downward and the supernatant liquid is separated in the upper layer; S400, liquid return: After static precipitation, the liquid return pipe 330 extracts the supernatant liquid and flows it back to the electroplating tank 100; Optionally, the standing time is 4 hours; S500, Mud Discharge and Cleaning: After starting the mud pumping, if the sedimentation tank 310 needs to be cleaned, open the mud outlet pipe 311 and the water inlet pipe 312 to flush and discharge the copper mud. After the copper mud is discharged, the water inlet pipe 312 flushes the sedimentation tank 310.

[0040] According to the usage method of the embodiment of the present invention, by adopting an on-line copper mud extraction system for a VCP line in the embodiment of the present invention, first, by grouping multiple electroplating tanks 100 and using the control device 400 to integrally control multiple valves 3221, the process of extracting copper mud group by group is realized. This method not only improves the efficiency of copper mud extraction and the stability of system operation, but also allows flexible adjustment of the extraction sequence according to the actual production situation, ensuring the continuity and high efficiency of the production line. Then, after starting the mud pumping, by real-time monitoring of the liquid level height of the sedimentation tank 310, when the liquid level height is higher than the preset value, the mud pumping is paused. This process ensures that the sedimentation tank 310 will not be overloaded and maintains the stable operation of the system. Subsequently, after pausing the mud pumping, let the sedimentation tank 310 stand for a period of time so that the copper mud can fully settle and separate the supernatant. This step is crucial for ensuring the quality of the liquid flowing back to the electroplating tank 100, helping to maintain the purity of the electroplating solution and the stability of product quality. In addition, in the liquid return step, the return pipe 330 extracts the supernatant and returns it to the electroplating tank 100, which not only saves resources but also reduces the cost of waste liquid treatment, reflecting the dual considerations of environmental protection and economy. Finally, when the sedimentation tank 310 needs to be cleaned, by opening the mud outlet pipe 311 and the water inlet pipe 312, the copper mud can be effectively flushed and discharged to ensure that the mud discharge system is not blocked. At the same time, the water inlet pipe 312 can also flush the sedimentation tank 310 to ensure that its interior is clean without copper mud residue. This not only simplifies the maintenance work but also extends the service life of the equipment. The design of the entire operation process greatly optimizes the copper mud management, reduces the frequent shutdown requirements in the traditional process, significantly improves the production efficiency and economic benefits, and also helps to improve the quality and consistency of electroplated products.

[0041] Refer again to Figure 1 , in order to avoid the liquid level in the sedimentation tank 310 from being too high, an overflow pipe 313 is connected to the upper part of the sedimentation tank 310. When the liquid level height is too high, the liquid flows out through the overflow pipe 313.

[0042] Other components and operations of the usage method according to the embodiment of the present invention are known to those of ordinary skill in the art and will not be described in detail here.

[0043] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the gist of the present invention.

Claims

1. A VCP line online copper sludge extraction system, characterized in that: include: Electroplating tank; An anode assembly is arranged in the electroplating tank, the anode assembly comprises a mounting frame, a titanium basket and an anode material, the titanium basket is connected to the mounting frame, the anode material is stored in the titanium basket and immersed in the electroplating tank; A cleaning component is connected to the electroplating cylinder, and the cleaning component includes a sedimentation cylinder, a mud extraction pipe and a liquid return pipe. The sedimentation cylinder is separated from the electroplating cylinder, one end of the mud extraction pipe is connected to the bottom of the titanium basket and is used to extract copper mud into the sedimentation cylinder, one end of the liquid return pipe is connected to the upper side of the sedimentation cylinder, and after the copper mud is precipitated in the sedimentation cylinder, the liquid return pipe extracts supernatant into the electroplating cylinder.

2. A VCP line online copper sludge extraction system according to claim 1, characterized in that: The mounting frame is provided with a temporary storage tank, and the temporary storage tank is located at the bottom of the titanium basket. The bottom of the titanium basket is provided with a discharge port for the copper mud to enter the temporary storage tank, and the mud extraction pipe is used to extract the copper mud located in the temporary storage tank.

3. A VCP line online copper sludge extraction system according to claim 1, characterized in that: The mounting frame is provided with a first mounting hole and a second mounting hole, the titanium basket is vertically penetrated through the first mounting hole, and the mud extraction pipe is vertically penetrated through the second mounting hole.

4. A VCP line online copper sludge extraction system according to claim 1, characterized in that: The installation frame is covered with a bag to block the copper mud.

5. According to claim 1, a VCP line online copper sludge extraction system is characterized by: The liquid return pipe is provided with a liquid pump and a filter. The liquid pump is used to extract the supernatant liquid, and the supernatant liquid flows into the electroplating tank after passing through the filter.

6. A VCP line online copper sludge extraction system according to claim 1, characterized in that: It also includes a control device, the mud extraction pipe is provided with a valve, there are multiple electroplating cylinders, anode assemblies and valves, the electroplating cylinders, anode assemblies and valves are arranged in one-to-one correspondence, and the control device integrates and controls multiple valves to extract the copper mud from several anode assemblies into the sedimentation cylinder.

7. A VCP line online copper sludge extraction system according to claim 6, characterized in that: The mud extraction pipe includes a main pipe and a branch pipe. There are multiple branch pipes and they are respectively connected to the titanium baskets in the multiple electroplating cylinders. The valves are arranged on the branch pipes one by one. The main pipe is provided with a mud extraction pump, and the mud extraction pump is used to extract the copper mud from the branch pipe to the sedimentation cylinder.

8. A VCP line online copper sludge extraction system according to claim 6 or 7, characterized in that: The sedimentation tank is connected with a discharge assembly to discharge the copper mud in the sedimentation tank.

9. A VCP line online copper sludge extraction system according to claim 8, characterized in that: The discharge assembly is provided with a mud outlet pipe and a water inlet pipe, the mud outlet pipe is connected to the bottom of the sedimentation tank, the water inlet pipe is used to flush the copper mud to drive the copper mud to be discharged, and after the copper mud is discharged, the water inlet pipe can flush the sedimentation tank.

10. Method of use, characterized in that: A VCP line online copper sludge extraction system applied to claim 9; The method of use comprises the following steps: Start the mud extraction: divide the plurality of electroplating cylinders into a plurality of groups, and the control device integrates and controls the plurality of valves to extract the copper mud group by group; Suspending sludge extraction: After starting sludge extraction, detecting the liquid level of the sedimentation tank, when the liquid level is higher than a preset value, suspending extraction of the copper sludge; Standing sedimentation: after suspending the sludge pumping, the sedimentation tank is left standing for a preset time, the copper sludge settles downward and the supernatant is separated from the upper layer; Liquid reflux: after static sedimentation, the liquid return pipe extracts the supernatant and flows it back to the electroplating tank; Mud discharge and cleaning: After starting the mud pumping, if the sedimentation tank needs to be cleaned, open the mud discharge pipe and the water inlet pipe to disperse the copper mud and discharge it from the water inlet pipe. After the copper mud is discharged, the water inlet pipe flushes the sedimentation tank.

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