Golden finger structure for testing semiconductor structure and testing equipment

Abstract

The invention provides a golden finger structure for testing a semiconductor structure and testing equipment. The golden finger structure comprises a plurality of extension parts and a plurality of terminal parts. The plurality of extension parts are arranged in parallel; the extension part is used for being electrically connected with a tester. The plurality of terminal parts are arranged in parallel; one end of each terminal part is connected with one extension part; the test ends, far away from the extension parts, of the terminal parts are used for being in contact with pins of the semiconductor structure, the test ends of at least two adjacent terminal parts are connected, and the connected test ends are used for being flush with all parts of the surfaces in contact with the pins. The test equipment comprises a tester, a first golden finger structure and a second golden finger structure. The first golden finger structure and the second golden finger structure are the golden finger structures respectively. The signal output end of the tester is electrically connected with the extension part of the first golden finger structure; and the signal input end of the tester is electrically connected with the extension part of the second golden finger structure. And the terminal part of the first golden finger structure and the terminal part of the second golden finger structure are arranged in a mirror image manner.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a finger structure and a testing device for testing a semiconductor structure. Background Art

[0002] After a semiconductor structure is fabricated, it needs to be tested. Specifically, the terminal part of the finger structure contacts the pin of the semiconductor structure, and the tester provides a test signal to the pin through the terminal part. After receiving the test signal, the semiconductor structure provides a feedback signal to the tester, and then it can be determined whether the semiconductor structure is qualified according to the feedback signal.

[0003] The finger structure includes a plurality of spaced-apart terminal parts. When the finger structure contacts the pins of the semiconductor structure, it is easy to have a situation where the contact area between the terminal part and the pin is small or even the two do not contact, resulting in the terminal part being burned out by the current signal provided by the tester. Summary of the Invention

[0004] Embodiments of this application provide a finger structure and a testing device for testing a semiconductor structure.

[0005] According to a first aspect of the embodiments of this application, there is provided a finger structure for testing a semiconductor structure. The finger structure includes:

[0006] A plurality of extension parts; the plurality of extension parts are arranged in parallel; the extension parts are used for electrically connecting with a tester;

[0007] A plurality of terminal parts; the plurality of terminal parts are arranged in parallel; one end of each terminal part is connected to one of the extension parts; the test end of the terminal part away from the extension part is used for contacting the pin of the semiconductor structure, and the test ends of at least two adjacent terminal parts are connected, and the surfaces of the connected test ends for contacting the pin are flush everywhere.

[0008] In one embodiment, the terminal parts whose test ends are connected are all connected to the same extension part.

[0009] In one embodiment, the finger structure further includes a connection part, and one end of at least two extension parts away from the terminal parts is connected to the same connection part.

[0010] In one embodiment, among two extension parts connected to the same connection part, at least one extension part is connected to at least two adjacent terminal parts whose test ends are connected; there is at least one extension part between two extension parts connected to the same connection part.

[0011] In one embodiment, among the plurality of extension parts, two of the extension parts are connected to the same connection part, one extension part is located between the two extension parts connected to the connection part, and one extension part is located on one side of the two extension parts connected to the connection part.

[0012] In one embodiment, the material of the test end includes at least one of tungsten steel alloy and tungsten copper alloy.

[0013] In one embodiment, the length range of the test end is 1 cm to 3 cm.

[0014] In one embodiment, the terminal part includes a first section and a second section; one end of the first section is connected to the extension part, and the other end is connected to the second section; the extending direction of the first section intersects with the extending direction of the second section;

[0015] The gold finger structure further includes a support part, and the first section of the terminal part passes through the support part; part of the support part is located on the side of the first section facing the second section, and part of the support part is located on the side of the first section away from the second section; the material of the support part is an insulating material.

[0016] In one embodiment, the gold finger structure further includes a fixing part, and the material of the fixing part is an insulating material; the fixing part is provided with a plurality of through holes arranged side by side, and one extension part passes through one of the through holes.

[0017] In one embodiment, the fixing part includes a first sub-fixing part and a second sub-fixing part oppositely arranged to the first sub-fixing part, and the first sub-fixing part is detachably connected to the second sub-fixing part; the extension part is located between the first sub-fixing part and the second sub-fixing part.

[0018] According to a second aspect of the embodiments of the present application, there is provided a test device for testing a semiconductor structure, and the test device includes a tester, a first gold finger structure and a second gold finger structure; the first gold finger structure and the second gold finger structure are respectively the above-mentioned gold finger structures;

[0019] The signal output end of the tester is electrically connected to the extension part of the first gold finger structure to provide a test signal to the first gold finger structure; the signal input end of the tester is electrically connected to the extension part of the second gold finger structure to receive a feedback signal provided by the semiconductor structure through the second gold finger structure; the terminal parts of the first gold finger structure and the second gold finger structure are mirror-symmetrically arranged.

[0020] The main technical effects achieved by the embodiments of the present application are:

[0021] The finger structure and test equipment for testing a semiconductor structure provided by an embodiment of the present application. The test end of the terminal part can be in contact with the pin of the semiconductor structure to transmit the test signal provided by the tester to the semiconductor structure, or transmit the feedback signal output by the semiconductor structure through the pin to the tester. Since the test ends of at least two adjacent terminal parts are connected and the surfaces of the connected test ends for contacting the pins are flush everywhere, compared with the scheme in which the test ends of adjacent terminal parts are arranged at intervals, the area of the connected test ends of the terminal parts for contacting the pins can be increased, which helps to increase the contact area when the terminal part contacts the pin, reduce the contact resistance between the terminal part and the pin, meet the test requirements of large current and high voltage of the semiconductor structure, and avoid the problem that the terminal part is burned out due to the small contact area or non-contact between the terminal part and the pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a top view of a finger structure provided by an exemplary embodiment of the present application;

[0023] Figure 2 is a side view of a finger structure provided by an exemplary embodiment of the present application from one perspective;

[0024] Figure 3 is a side view of a finger structure provided by an exemplary embodiment of the present application from another perspective;

[0025] Figure 4 is a side view of a test equipment provided by an exemplary embodiment of the present application from one perspective;

[0026] Figure 5 is a side view of a test equipment provided by an exemplary embodiment of the present application from another perspective. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0028] The terms used in the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0029] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to a determination".

[0030] The following will, with reference to the accompanying drawings, elaborate on some embodiments of this application. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0031] An embodiment of this application provides a gold finger structure for testing a semiconductor structure. As Figure 1 and Figure 2 shown, the gold finger structure includes a plurality of terminal portions 10 and a plurality of extension portions 20.

[0032] The plurality of extension portions 20 are arranged in parallel, and the extension portions 20 are used for electrical connection with a tester. The plurality of terminal portions 10 are arranged in parallel. One end of each terminal portion 10 is connected to one of the extension portions 20, and the test end 101 of the terminal portion 10 away from the extension portion 20 is used for contacting a pin of the semiconductor structure. The test ends 101 of at least two adjacent terminal portions 10 are connected, and the surfaces of the connected test ends 101 for contacting the pin are flush everywhere.

[0033] For the gold finger structure for testing a semiconductor structure provided by an embodiment of this application, the test end of the terminal portion can contact the pin of the semiconductor structure to transmit the test signal provided by the tester to the semiconductor structure, or transmit the feedback signal output by the semiconductor structure through the pin to the tester; since the test ends of at least two adjacent terminal portions are connected and the surfaces of the connected test ends for contacting the pin are flush everywhere, compared with the scheme in which the test ends of adjacent terminal portions are spaced apart, it can increase the area of the test ends of the connected terminal portions for contacting the pin, which helps to increase the contact area when the terminal portion contacts the pin, reduce the contact resistance between the terminal portion and the pin, can meet the test requirements of large current and large voltage of the semiconductor structure, and avoid the problem that the terminal portion is burned out due to the small contact area or non-contact between the terminal portion and the pin.

[0034] In one embodiment, as Figure 1 and Figure 2As shown, the gold finger structure includes seven terminal portions 10. Terminal portion 11 is adjacent to terminal portion 12 and is connected to the test end 101 of the extension portion 20 away from it. Terminal portions 13, 14, and 15 are adjacent to each other and are connected to the test end 101 of the extension portion 20 away from it. When testing the semiconductor structure, the test end 101 where terminal portion 11 and terminal portion 12 are connected together can contact two pins of the semiconductor structure, and these two pins are electrically connected to the same electrode of the semiconductor structure; the test end 101 where terminal portions 13, 14, and 15 are connected together can contact three pins of the semiconductor structure, and these three pins are electrically connected to the same electrode of the semiconductor structure. Terminal portion 17 is located between terminal portion 12 and terminal portion 13, and terminal portion 16 is located on the side of terminal portion 11 away from terminal portion 12.

[0035] In one embodiment, the adjacent and connected test ends are of an integral structure, which helps to improve the strength of the connected test ends.

[0036] In one embodiment, the terminal portions 10 where the adjacent test ends 101 are connected are connected to the same extension portion 20. With this arrangement, the number of extension portions 20 can be reduced, and thus the number of wires used for welding the extension portions 20 to the electrodes of the tester can be reduced, improving the welding efficiency between the tester and the gold finger structure. Also, it helps to avoid the situation where, due to a large number of extension portions, the welding of different electrodes of the tester to the extension portions is not corresponding; and the signals received by multiple terminal portions 10 connected to the same extension portion 20 are the same. Compared with the scheme where different terminal portions 10 in contact with multiple pins electrically connected to the same electrode of the semiconductor structure are respectively connected to different extension portions 20, it can avoid differences in the test signals provided by different electrodes, resulting in mutual inductance between the terminal portions 10 and affecting the accuracy of the signals received by the pins of the semiconductor structure, and further affecting the accuracy of the test results of the semiconductor structure. Figure 1 In the shown embodiment, both terminal portion 11 and terminal portion 12 are connected to the connection extension portion 21, and terminal portions 13, 14, and 15 are all connected to the extension portion 22.

[0037] In one embodiment, as Figure 1 shown, the gold finger structure further includes a connection portion 30. The ends of at least two extension portions 20 away from the terminal portions 10 are connected to the same connection portion 30. With this arrangement, the extension portions connected to the same connection portion 30 can be welded to the electrode of the tester through one wire, further reducing the welding difficulty and improving the welding efficiency. Figure 1In the illustrated embodiment, both the extension portion 21 and the extension portion 22 are connected to the connection portion 30. The extension portion 21 and the extension portion 22 can be electrically connected to the electrodes of the tester through a wire. The terminal portions 11 and 12 connected to the extension portion 21, and the terminal portions 13, 14, and 15 connected to the extension portion 22 are used to contact five pins in the semiconductor structure that are electrically connected to the same electrode. The semiconductor structure may include three electrodes: a source electrode, a drain electrode, and a gate electrode. The semiconductor structure may include seven pins, among which five pins may be electrically connected to the source electrode, one pin is electrically connected to the gate electrode, and another pin is electrically connected to the drain electrode. The terminal portions 11, 12, 13, 14, and 15 may all be used to contact the pins electrically connected to the source electrode, the terminal portion 16 is used to contact the gate electrode, and the terminal portion 17 is used to contact the drain electrode. In other embodiments, when the number of pins connected to each electrode of the semiconductor structure is different, the structure of the gold finger structure changes accordingly.

[0038] In one embodiment, as Figure 1 and Figure 2 shown, among the two extension portions 20 connected to the same connection portion 30, at least one of the extension portions 20 is connected to at least two adjacent terminal portions 10 connected to the test ends, and at least one extension portion 20 is provided between the two extension portions 20 connected to the same connection portion 30. With such an arrangement, when a plurality of terminal portions 17 for contacting a plurality of pins corresponding to the same electrode of the semiconductor structure are connected to two extension portions 20, and other extension portions are provided between these two extension portions, and these two extension portions are connected through the connection portion 30, the tester can be electrically connected to the connection portion 30 through a wire to simultaneously provide test signals to these two extension portions 20. Furthermore, the signals received by each of the terminal portions 10 connected to these two extension portions 20 are the same, and mutual inductance between different terminal portions 10 can be avoided. Figure 1 In the illustrated embodiment, the extension portion 21 and the extension portion 22 are connected to the connection portion 30. The extension portion 21 is connected to the terminal portions 13, 14, and 15, and the extension portion 22 is connected to the terminal portions 11 and 12. An extension portion 23 is provided between the extension portion 21 and the extension portion 22.

[0039] In one embodiment, as Figure 1As shown, among the multiple extension parts, two of the extension parts 20 are connected to the same connection part 30. One of the extension parts 20 is located between the two extension parts 20 connected to the connection part 30, and one of the extension parts 20 is located on one side of the two extension parts 30 connected to the connection part 30. With such an arrangement, the shape of the extension part connected to the connection part and the connection part as a whole structure, the shape of the extension part located between the two extension parts connected to the connection part, and the shape of the extension part located on one side of the two extension parts connected to the connection part are all different, and the positions of the extension part located between the two extension parts connected to the connection part and the extension part located on one side of the two extension parts connected to the connection part are different. When welding the electrodes of the tester to the gold finger structure, by combining the shapes and positions of these several extension parts, it is easy to distinguish each extension part, which helps to avoid the situation where the electrodes of the tester are connected to the non-corresponding extension part. Figure 1 In the illustrated embodiment, the extension part 21 and the extension part 22 are connected to the same connection part 30. The extension part 23 is located between the extension part 21 and the extension part 22, and the extension part 24 is located on the same side of the extension part 21 and the extension part 22.

[0040] In one embodiment, as Figure 3 shown, the terminal part 10 includes a first section 11 and a second section 12; one end of the first section 11 is connected to the extension part 20, and the other end is connected to the second section 12; the extending direction of the first section 11 intersects with the extending direction of the second section 12. The test end 101 is the end of the second section 12 away from the first section 11. In some embodiments, the extending direction of the first section 11 and the extending direction of the second section 12 may be substantially perpendicular.

[0041] In one embodiment, the material of the test end 101 includes at least one of tungsten steel alloy and tungsten copper alloy. For example, the material of the test end 101 can be tungsten steel alloy or tungsten copper alloy. With such an arrangement, the test end 101 has better wear resistance, which can improve the problem that the contact area between the test end and the pin is reduced due to the wear of the test end 101, and helps to extend the service life of the gold finger structure.

[0042] Furthermore, the test end 101 further includes gold coated on the outside of the tungsten steel alloy and tungsten copper alloy. This helps to improve the electrical conductivity of the test end 101.

[0043] In one embodiment, the test end 101 can be welded to the other parts of the terminal part 10. With such an arrangement, the connection between the test part 101 and the other parts of the terminal part 10 can be made relatively firm, preventing the two from separating.

[0044] In one embodiment, the length range of the test end 101 is 1 cm to 3 cm. The length of the test end 101 refers to the dimension of the test end 101 in the direction perpendicular to the surface of the test end 101 that contacts the pin. With such a setting, it can be avoided that the length of the test end 101 is too small, which is not convenient for welding the test end 101 to other parts of the terminal part 10, and it can also be avoided that the length of the test end 101 is too large, resulting in a relatively large resistance of the terminal part 101. In some embodiments, the length of the test end 101 can be 1 cm, 1.5 cm, 2 cm, 2.5 cm, 1 cm, etc.

[0045] In one embodiment, the material of the part of the terminal part 10 other than the test end 101 may include copper and gold coated on the outside of the copper. This helps to reduce the resistance of the terminal part 10.

[0046] In one embodiment, as Figure 1 and Figure 3 shown, the gold finger structure further includes a support part 40, and the first end 11 of the terminal part 10 passes through the support part 40; part of the support part 40 is located on the side of the first section 11 facing the second section 12, and part is located on the side of the first section 11 away from the second section 12; the material of the support part 40 is an insulating material. With such a setting, the support part 40 can provide support for the terminal part 10 to prevent the terminal part 10 from deforming under the action of gravity, thereby affecting the contact between the test end 101 of the terminal part 10 and the pin; since part of the support part 40 is located on the side of the first section 11 facing the second section 12 and part is located on the side of the first section 11 away from the second section 12, when using the gold finger structure to test the semiconductor structure, whether the second section 12 is located above the first section 11 or the second section 12 is located below the first section 11, the support part 40 can be in contact with the operating table to support the terminal part 10.

[0047] In one embodiment, as Figure 2 shown, the support part 40 includes a first sub - support part 41 and a second sub - support part 42, the first sub - support part 41 and the second sub - support part 42 are arranged oppositely and detachably connected, and the terminal part 10 is located between the first sub - support part 41 and the second sub - support part 42. With such a setting, it is convenient to install the support part 40 and the terminal part 10 together. The first sub - support part 41 and the second support part 42 can be respectively provided with installation holes, and a connecting piece can pass through the installation holes of the first support part and the second support part to connect the two.

[0048] In one embodiment, each terminal portion 10 may pass through the same support portion 40. The support portion 40 may be provided with a plurality of through holes arranged at intervals, and each terminal portion 10 passes through one through hole. Specifically, the first sub-support portion 41 may be provided with a plurality of grooves, and the second sub-support portion 42 may be provided with a plurality of grooves corresponding one-to-one to the grooves of the first sub-support portion 41. When the first sub-support portion 41 is connected to the second sub-support portion 42, the grooves of the first sub-support portion 41 and the corresponding grooves of the second sub-support portion 42 are opposite to form through holes.

[0049] In some embodiments, the material of the support portion 40 may be fiberglass. With such a setting, on the premise of ensuring the insulation performance of the support portion 40, the support portion 40 has a relatively high strength and a good support effect on the terminal portion 10.

[0050] In one embodiment, as Figure 1 and Figure 3 shown, the gold finger structure further includes a fixing portion 50, and the material of the fixing portion 40 is an insulating material; the fixing portion 50 is provided with a plurality of through holes arranged side by side, and one extension portion 20 passes through one of the through holes. The fixing portion 50 can provide support for the extension portion 20 to prevent the extension portion 20 from deforming under the action of gravity and affecting the contact between the test end and the pin; all the extension portions 20 can be limited by one fixing portion 50 to prevent adjacent extension portions 20 from contacting and causing a short circuit.

[0051] In one embodiment, a part of the fixing portion 50 is located on the side of the extension portion 20 facing the second section 12, and a part is located on the side of the extension portion 20 away from the second section 12. With such a setting, when using the gold finger structure to test the semiconductor structure, whether the extension portion 20 is located on the upper side of the second section 12 or the extension portion 20 is located on the lower side of the second section 12, the fixing portion 50 can be in contact with the operating table to support the extension portion 20.

[0052] In one embodiment, as Figure 3 shown, the fixing portion 50 includes a first sub-fixing portion 51 and a second sub-fixing portion 52 disposed opposite to the first sub-fixing portion 51, and the first sub-fixing portion 51 and the second sub-fixing portion 52 are detachably connected; the extension portion 20 is located between the first sub-fixing portion 51 and the second sub-fixing portion 52. With such a setting, it is convenient to install the fixing portion 50 and the extension portion 20 together. The first sub-fixing portion 51 may be provided with a plurality of grooves, and the second sub-fixing portion 52 may be provided with a plurality of grooves corresponding one-to-one to the grooves of the first sub-fixing portion 51. When the first sub-fixing portion 51 is connected to the second sub-fixing portion 52, the grooves of the first sub-fixing portion 51 and the corresponding grooves of the second sub-fixing portion 52 are opposite to form through holes.

[0053] In one embodiment, the first sub-fixing part 51 and the second sub-fixing part 52 may be respectively provided with mounting holes, and a connecting piece may pass through the mounting holes of the first sub-fixing part 51 and the second sub-fixing part 52 to connect the two. When installing the fixing part 50 and each extension part 20 together, first place the extension part 20 in the groove of the first sub-fixing part 51, then place the second sub-fixing part 52 opposite to the first sub-fixing part 51, and then use a connecting piece to connect the first sub-fixing part 51 and the second sub-fixing part 52, so as to realize the installation of the fixing part 50 and the extension part 20. Compared with the solution in which each extension part 20 is connected to the fixing part 50 through a connecting piece, the installation efficiency of the fixing part 50 and the extension part 20 can be reduced.

[0054] In some embodiments, the material of the fixing part 50 may be glass fiber. With such a setting, on the premise of ensuring the insulation performance of the fixing part 50, the fixing part 50 has a relatively high strength and a good supporting effect on the extension part 20.

[0055] In one embodiment, the surface of the fixing part 50 on the side of the extension part 20 facing the second section 12 and the surface of the supporting part 40 on the same side are in the same plane. In this way, when the gold finger structure is placed on the operating table and the second section 12 is located below the first section 11, the surface of the fixing part 50 on the side of the extension part 20 facing the second section 12 and the surface of the supporting part 40 on the same side respectively abut against the same plane of the operating table, and both the supporting part 40 and the fixing part 50 play a supporting role.

[0056] In one embodiment, the surface of the fixing part 50 on the side of the extension part 20 away from the second section 12 and the surface of the supporting part 40 on the same side are in the same plane. In this way, when the gold finger structure is placed on the operating table and the second section 12 is located above the first section 11, the surface of the fixing part 50 on the side of the extension part 20 away from the second section 12 and the surface of the supporting part 40 on the same side respectively abut against the same plane of the operating table, and both the supporting part 40 and the fixing part 50 play a supporting role.

[0057] The embodiment of the present application also provides a test device for testing a semiconductor structure. As Figure 4 shown, the test device includes a tester 130, a first gold finger structure 110 and a second gold finger structure 120; the first gold finger structure 110 and the second gold finger structure 120 are respectively the gold finger structures described in any of the above embodiments. The signal output end of the tester 130 is electrically connected to the extension part 20 of the first gold finger structure 110 to provide a test signal to the first gold finger structure 110. The signal input end of the tester 130 is electrically connected to the extension part 20 of the second gold finger structure 120 to receive the feedback signal provided by the semiconductor structure through the second gold finger structure 120. As Figure 5As shown, the terminal portions of the first gold finger structure 110 and the second gold finger structure 120 are mirror - image arranged.

[0058] When using the test device provided by the embodiment of the present application to test a semiconductor structure, the pins of the semiconductor structure are located between the terminal portions of the first gold finger structure 110 and the second gold finger structure 120. Each pin contacts the surface of the first gold finger structure 110 facing the first gold finger structure 110 and contacts the terminal portion of the second gold finger structure 120 facing the second gold finger structure 120. The test signal output by the tester is transmitted to the pins of the semiconductor structure through the first gold finger structure 110; after receiving the test signal, the semiconductor structure outputs a feedback signal, and the feedback signal is transmitted to the tester through the second gold finger structure 120. The tester processes according to the received feedback signal to determine whether the semiconductor structure is qualified. Since the terminal portions of the first gold finger structure 110 and the second gold finger structure 120 are mirror - image arranged, it can make the contact areas between the connected terminal portions in the first gold finger 110 and the second gold finger 120 and the pins all larger, and the multiple pins contacting the connected terminal portions in the first gold finger 110 contact the opposite and connected terminal portions in the second gold finger 120 at the same time. That is, the connected terminal portions in the first gold finger 110 and the second gold finger 120 are symmetrically arranged and the connected terminal portions are all in contact with the pins electrically connected to the same electrode of the semiconductor structure, which can avoid signal crosstalk.

[0059] In one embodiment, as Figure 4 and Figure 5 shown, the first gold finger structure is located above the second gold finger structure. In other embodiments, the second gold finger structure may be located above the first gold finger structure.

[0060] It should be noted that in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. And it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Additionally, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Like reference numerals throughout the specification indicate like elements.

[0061] Other embodiments of the present application will be readily apparent to those skilled in the art upon consideration of the specification and practice of the disclosure herein. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and examples are only illustrative, and the true scope and spirit of the present application are pointed out by the following claims.

[0062] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A finger structure for testing a semiconductor structure, characterized in that, the finger structure includes: a plurality of extension parts; the plurality of extension parts are arranged in parallel; the extension parts are used for electrical connection with a tester; a plurality of terminal parts; the plurality of terminal parts are arranged in parallel; one end of each terminal part is connected to one of the extension parts; the test end of the terminal part far from the extension part is used for contacting a pin of the semiconductor structure, and the test ends of at least two adjacent terminal parts are connected, and the surfaces of the connected test ends for contacting the pin are flush everywhere.

2. The finger structure for testing a semiconductor structure according to claim 1, characterized in that, each of the terminal parts connected to the test end is connected to the same extension part.

3. The finger structure for testing a semiconductor structure according to claim 1, characterized in that, the finger structure further includes a connecting part, and one ends of at least two extension parts far from the terminal parts are connected to the same connecting part.

4. The finger structure for testing a semiconductor structure according to claim 3, characterized in that, among the two extension parts connected to the same connecting part, at least one extension part is connected to at least two adjacent terminal parts whose test ends are connected; at least one extension part is provided between the two extension parts connected to the same connecting part.

5. The finger structure for testing a semiconductor structure according to claim 3, characterized in that, among the plurality of extension parts, two extension parts are connected to the same connecting part, one extension part is located between the two extension parts connected to the connecting part, and one extension part is located on one side of the two extension parts connected to the connecting part.

6. The finger structure for testing a semiconductor structure according to claim 1, characterized in that, the material of the test end includes at least one of tungsten steel alloy and tungsten copper alloy; the length range of the test end is 1 cm to 3 cm.

7. The finger structure for testing a semiconductor structure according to claim 1, characterized in that, the terminal part includes a first section and a second section; one end of the first section is connected to the extension part, and the other end is connected to the second section; the extending direction of the first section intersects with the extending direction of the second section; the finger structure further includes a supporting part, and the first section of the terminal part passes through the supporting part; part of the supporting part is located on the side of the first section facing the second section, and part of the supporting part is located on the side of the first section far from the second section; the material of the supporting part is an insulating material.

8. The finger structure for testing a semiconductor structure according to claim 1, characterized in that, the finger structure further includes a fixing part, the material of the fixing part is an insulating material; the fixing part is provided with a plurality of through holes arranged in parallel, and one extension part passes through one of the through holes.

9. The finger structure for testing a semiconductor structure according to claim 8, characterized in that, The fixing part includes a first sub-fixing part and a second sub-fixing part arranged opposite to the first sub-fixing part, and the first sub-fixing part is detachably connected to the second sub-fixing part; the extending part is located between the first sub-fixing part and the second sub-fixing part.

10. A test device for testing a semiconductor structure, characterized in that the test device includes a tester, a first gold finger structure and a second gold finger structure; the first gold finger structure and the second gold finger structure are respectively the gold finger structures described in any one of claims 1 to 9; the signal output end of the tester is electrically connected to the extending part of the first gold finger structure to provide a test signal to the first gold finger structure; the signal input end of the tester is electrically connected to the extending part of the second gold finger structure to receive the feedback signal provided by the semiconductor structure through the second gold finger structure; the terminal parts of the first gold finger structure and the second gold finger structure are arranged in a mirror image.

Images