Adjustable microelectronic sensor array probe assembly

Abstract

The invention provides an adjustable microelectronic sensor array probe assembly, the assembly comprises a pressing piece, a sensor to be tested, a probe and an excitation circuit board, at least two adjustable units are arranged on a base, the distance between the adjustable units is adjusted to adapt to different models of sensors to be tested, the sensors to be tested are placed on the base through a positioning plate, and the pressing piece is arranged on the base. The relative positions of the to-be-tested sensor and the sliding adjustable unit are restrained through the positioning plate, accurate positioning of the probe on the to-be-tested sensor is achieved, different types of to-be-tested sensors are adapted through the position-adjustable adjustable unit, the probe is provided with an asymmetric elastic structure to guide elastic deformation of the probe, and contact damage to welding spots is avoided. The device can adapt to different types of sensors, and reduces the damage to welding spots during testing.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectronic sensor arrays, and particularly to an adjustable probe assembly for a microelectronic sensor array. Background Art

[0002] A microelectronic sensor array is a system in which multiple micro-sensor units are integrated on a single chip or substrate. It can detect multiple physical, chemical, or biological signals simultaneously, and has the characteristics of high sensitivity, multi-parameter detection ability, and miniaturized integration. It is widely used in fields such as medical health, environmental monitoring, and autonomous driving. Detecting a microelectronic sensor array is a key step to ensure its performance, reliability, and safety. It not only helps to optimize the manufacturing process and improve product performance, but also supports R & D innovation, meets industry standards, and ultimately reduces costs and risks. Through comprehensive detection, it can ensure that the sensor array plays its best role in various applications and provides users with high-quality products and services.

[0003] When detecting a microelectronic sensor array (integrated circuit board), it is necessary to contact key parts such as solder joints, test points, pins, or signal lines on the circuit board through probes. The multi-channel microelectronic sensor array can be 8-channel, 16-channel, 32-channel, etc. The volume sizes, circuit layouts, and test points to be detected of the microelectronic sensors with different numbers of channels above are quite different. It is necessary to design a special probe assembly to detect the corresponding microelectronic sensor array. The universality of the detection probe assembly is poor, and it is easy to damage the solder joints on the circuit board to be tested when using the probe for detection. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides an adjustable probe assembly for a microelectronic sensor array. An adjustable probe assembly is used to adapt to different types of sensors to be tested, and an asymmetric elastic structure is arranged on the probe to guide its elastic deformation and avoid contact damage to the solder joints.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An adjustable microelectronic sensor array probe assembly includes a pressing member, a sensor to be measured, a probe, and an excitation circuit board. The probe and the excitation circuit board are arranged in an adjustable unit that can slide on a base. There are at least two adjustable units provided on the base, and the distance between the adjustable units is adjusted to adapt to different models of sensors to be measured. The sensor to be measured is placed on the base through a positioning plate, and the relative positions of the sensor to be measured and the sliding adjustable unit are restricted through the positioning plate to achieve precise positioning of the probe on the sensor to be measured. The probe is fixed in the adjustable unit through a mounting assembly, and a space is formed between multiple probes through the mounting assembly to adapt to the circuit structure on the sensor to be measured. The probe includes an elastic part and a conduction end that contacts the sensor to be measured, and the conduction end has an elastic structure to prevent damage to the solder joints on the sensor to be measured.

[0007] Further, the bottom of the adjustable unit is slidably supported on the guide rail of the base. A guide member and a lead screw are provided on one side of the sliding seat body of the adjustable unit. The guide member is slidably supported on both sides of the nut seat of the base. The lead screw is in transmission connection with the nut in the middle of the nut seat, and an operation part is provided at the outer end of the lead screw.

[0008] Further, the lower end of the positioning plate is provided with a first positioning part that cooperates with and is fixed to the bracket of the base and a second positioning part that abuts against and positions the adjustable unit. The first direction of the first positioning part is inserted into the first positioning groove on the bracket; the second direction of the first positioning part is inserted into the second positioning groove on the bracket; the sensor to be measured is placed in the placement groove at the upper end of the positioning plate.

[0009] Further, the main body seat of the adjustable unit houses the probe and the mounting assembly; an upper sliding seat is provided at the upper end of the main body seat, and the conduction end of the probe extends out of the through hole on the upper sliding seat and contacts the sensor to be measured; a lower fixing seat is provided at the lower end of the main body seat, and the excitation circuit board is installed on the lower fixing seat; the excitation end of the probe contacts the excitation circuit board.

[0010] Further, support platforms are provided on both sides of the main body seat, and both ends of the upper sliding seat extend into the support platforms; an elastic member is provided between the upper sliding seat and the support platforms; a limiting groove is provided at the upper end of the upper sliding seat; a through hole is provided in the limiting groove to enable the conduction end of the probe to extend out and contact the sensor to be measured.

[0011] Further, the installation assembly includes a plurality of fixing frames arranged side by side, and a plurality of fixing units are fixedly installed in the fixing frames; a card slot is provided on the fixing unit; the installation part of the probe is arranged in the card slot of the fixing unit; a plurality of protrusions are provided on the first surface of the fixing unit; a plurality of grooves are provided on the second surface of the fixing unit; the protrusions of the fixing unit are inserted and fixed in the grooves of another adjacent fixing unit; the fixing units at a predetermined position in the plurality of fixing frames do not install probes, so as to form a vacant space on the contact surface between the probe and the sensor to be measured.

[0012] Further, the probe includes an excitation end and a conduction end located at both ends; the part adjacent to the excitation end is the installation part, and the part adjacent to the conduction end is the elastic part; a torsion part is further provided between the elastic part and the installation part; the torsion part causes the elastic part and the conduction end to generate torsion in a plane perpendicular to the extension direction of the probe; through the torsion of the torsion part, a large-volume elastic part can be arranged on the probe.

[0013] Further, the elastic part is composed of a plurality of bending parts with a U-shaped structure; the number of the bending parts is an odd number, so that the extension directions of the conduction end and the excitation end are basically collinear; when the bending part deforms, the conduction end rotates by a certain amplitude; an asymmetric elastic structure is provided on the conduction end to compensate for the rotation; a long hole consistent with the extension direction of the bending part is provided at the bending part.

[0014] Further, the conduction end of the probe includes two branches, and an open opening is formed between the two branches; a transverse body is provided at the end of each branch, and the two transverse bodies are arranged oppositely; a guiding part is provided at the lower end of the transverse body far from the bending part among the two transverse bodies; a contact surface is formed between the guiding part and the transverse body.

[0015] Further, the conduction end of the probe includes two branches, and an open opening is formed between the two branches, and a transverse body is provided at the end of each branch, and the two transverse bodies are arranged oppositely; or, the conduction end of the probe includes one branch, a transverse body is provided at the end of the branch, and a guiding part is provided at the lower end of the transverse body.

[0016] Compared with the prior art, the present invention provides an adjustable microelectronic sensor array probe assembly, which has the following beneficial technical effects: For microelectronic sensors with different channel numbers and specifications, the present invention adapts to microelectronic sensors of different sizes through an adjustable unit that can slide on the base, and realizes the precise positioning of the probe and the sensor to be measured through the positioning plate; The probe is fixed in the adjustable unit through the fixing unit in the mounting assembly, and the probe can be removed from the fixing unit at a specific position to adapt to the detection needs of different types of sensors to be measured; A torsion structure is provided on the probe, so that under the same probe pitch, the probe can have a larger elastic part to improve the elastic performance of the probe, ensure the extrusion force during detection, and avoid damaging the solder joints on the circuit board; An asymmetric elastic structure is provided at the end of the probe, which can guide the end of the probe to elastically deform and avoid excessive extrusion of the solder joints. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of an adjustable microelectronic sensor array probe assembly provided by an embodiment of the present invention;

[0019] Figure 2 It is an exploded view of the probe assembly provided by an embodiment of the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of the positioning plate provided by an embodiment of the present invention;

[0021] Figure 4 It is a cross-sectional view of the base and the positioning plate provided by an embodiment of the present invention;

[0022] Figure 5 It is a top view of the base and the probe assembly provided by an embodiment of the present invention;

[0023] Figure 6 It is a schematic diagram of the structure of the base provided by an embodiment of the present invention;

[0024] Figure 7 It is a schematic diagram of the structure of the probe assembly provided by an embodiment of the present invention;

[0025] Figure 8 It is a cross-sectional view of the probe assembly provided by an embodiment of the present invention;

[0026] Figure 9Schematic diagram of the installation method of the probe provided by the embodiment of the present invention Figure 1 ;

[0027] Figure 10 Exploded view of the probe and the mounting component provided by the embodiment of the present invention;

[0028] Figure 11 Side view of the probe assembly provided by the embodiment of the present invention;

[0029] Figure 12 Top view of the probe assembly provided by the embodiment of the present invention;

[0030] Figure 13 Schematic diagram of the installation method of the probe provided by the embodiment of the present invention Figure 2 ;

[0031] Figure 14 Schematic diagram of the structure of the installation unit provided by the embodiment of the present invention;

[0032] Figure 15 Schematic diagram of the structure of the conduction end provided by the embodiment of the present invention Figure 1 ;

[0033] Figure 16 Schematic diagram of the structure of the conduction end provided by the embodiment of the present invention Figure 2 ;

[0034] Figure 17 Schematic diagram of the structure of the conduction end provided by the embodiment of the present invention Figure 3 ;

[0035] Figure 18 Schematic diagram of the probe contacting the solder joint of the sensor circuit board to be measured.

[0036] Description of the reference numerals in the drawings: 1 - pressing member, 2 - sensor to be measured, 20 - solder joint, 3 - positioning plate, 31 - first positioning portion, 311 - first-direction positioning, 312 - second-direction positioning, 32 - second positioning portion, 33 - placement groove, 4 - base, 41 - bracket, 411 - supporting surface, 42 - first positioning groove, 43 - bottom plate, 44 - nut seat, 45 - second positioning groove, 46 - guide rail, 5 - adjustable unit, 51 - sliding seat body, 52 - guiding member, 53 - lead screw, 54 - operating portion, 55 - main body seat, 551 - supporting table, 56 - upper sliding seat, 561 - elastic member, 562 - limiting groove, 57 - lower fixing seat, 6 - probe, 61 - mounting portion, 62 - excitation end, 63 - torsion portion, 64 - elastic portion, 640 - bending portion, 65 - conduction end, 650 - space, 601 - branch, 602 - transverse body, 603 - guiding portion, 604 - contact surface, 7 - excitation circuit board, 8 - mounting assembly, 81 - fixing bracket, 82 - fixing unit, 821 - clamping groove, 822 - protrusion, 823 - groove. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] The adjustable microelectronic sensor array probe assembly of the present invention, as Figure 1 , Figure 2 , Figure 10 and Figure 13 shown, includes a pressing member 1, a sensor 2 to be measured, a probe 6, and an excitation circuit board 7. The probe 6 and the excitation circuit board 7 are arranged in an adjustable unit 5 that can slide on a base 4. At least two adjustable units 5 are arranged on the base 4, and the distance between the adjustable units 5 is adjusted to adapt to different models of sensors 2 to be measured. The sensor 2 to be measured is placed on the base 4 through a positioning plate 3, and the relative positions of the sensor 2 to be measured and the sliding adjustable unit 5 are restricted by the positioning plate 3 to achieve precise positioning of the probe 6 on the sensor 2 to be measured. The probe 6 is fixed in the adjustable unit 5 through a mounting assembly 8, and a space 650 is formed between multiple probes 6 through the mounting assembly 8 to adapt to the circuit structure on the sensor 2 to be measured. The probe 6 includes an elastic portion 64 and a conduction end 65 that contacts the sensor 2 to be measured, and the conduction end 65 has an elastic structure to prevent damage to the solder joints 20 on the sensor 2 to be measured.

[0039] Among them, the pressing member 1 is connected to the movable end of the upper liftable device, and the sensor to be measured 2 is a multi-channel microelectronic sensor array, specifically, it can be 8 channels, 16 channels, 32 channels, etc. The volume sizes and circuit layouts of the sensors to be measured 2 with different numbers of channels above are different. In an embodiment of the present invention, two adjustable units 5 are symmetrically arranged on the base 4, and by adjusting the distance between the adjustable units 5, different types of sensors to be measured 2 can be adapted. The probes 6 are arranged in the adjustable units 5 in an array manner through the mounting assembly 8. As Figure 13 shown, according to the type of the sensor to be measured 2, the probes 6 can not be installed on the fixing unit 82 of the mounting assembly 8, so as to form a space 650 to meet the needs of different types of sensors to be measured 2. When detecting the sensor to be measured 2, the probes 6 can contact key parts such as solder joints, test points, pins or signal lines. Excessive pressure during contact with the solder joint 20 may damage the solder joint, such as causing deformation of the BGA solder balls, while too little pressure may result in poor contact. Moreover, the solder joints on the sensor to be measured 2 may have position deviations due to improper pad design, insufficient mounting accuracy, or improper control of temperature and time during the welding process. When the probes 6 contact the solder joints 20 with position deviations, it is more difficult to control the contact pressure. In the embodiment of the present invention, the conducting end 65 of the probe 6 has branches 601 to generate elastic deformation, so as to maintain the contact pressure with the solder joint 20 through elastic deformation.

[0040] The bottom of the adjustable unit 5 is slidably supported on the guide rail 46 of the base 4. One side of the sliding seat body 51 of the adjustable unit 5 is provided with a guide member 52 and a lead screw 53; the guide member 52 is slidably supported on both sides of the nut seat 44 of the base 4; the lead screw 53 is in transmission connection with the nut in the middle of the nut seat 44, and an operation part 54 is arranged at the outer end of the lead screw 53.

[0041] Specifically, in an embodiment of the present invention, the sliding seat bodies 51 of the two adjustable units 5 are symmetrically arranged on the base 4. In other embodiments, the sliding seat bodies 51 can be four and are symmetrically arranged on the base 4 along the X-axis and Y-axis. By operating the operation part 54 on the lead screw 53, the sliding seat bodies 51 of the adjustable units 5 are driven to slide under the guidance of the guide rail 46 and the guide member 52, and the relative positions between the adjustable units 5 are changed to adapt different types of sensors to be measured 2.

[0042] As Figures 2 - 6 shown, the lower end of the positioning plate 3 is provided with a first positioning part 31 that cooperates with and is fixed to the bracket 41 of the base 4 and a second positioning part 32 that abuts against and positions the adjustable unit 5; the first-direction positioning 311 of the first positioning part 31 is inserted into the first positioning groove 42 on the bracket 41; the second-direction positioning 312 of the first positioning part 31 is inserted into the second positioning groove 45 on the bracket 41; the sensor to be measured 2 is placed in the placement groove 33 at the upper end of the positioning plate 3.

[0043] Among them, different types of sensors 2 to be measured have exclusive positioning plates 3. The positions of the first positioning part 31 and the second positioning part 32 on the positioning plate 3 are determined according to the type of the sensor 2 to be measured. For example, Figure 5 As shown, the first positioning groove 42 and the first direction positioning 311 on the bracket 41 determine the lateral position of the positioning plate 3 on the bracket 41, and the second positioning groove 45 and the second direction positioning 312 on the bracket 41 determine the longitudinal position of the positioning plate 3 on the bracket 41. Specifically, there are two symmetrically arranged brackets 41, and the protrusions on the two sides of the two brackets 41 form the second positioning groove 45 between the two protrusions. For example, Figure 5 As shown, the position of the sensor 2 to be measured in the placement groove 33 on the base 4 is thus determined. The operating part 54 on the operating lead screw 53 makes the sliding seat body 51 of the adjustable unit 5 abut against the second positioning part 32 of the positioning plate 3. For example, Figure 4 As shown, the position of the adjustable unit 5 relative to the positioning plate 3 is thus determined, and the precise positioning of the probe 6 in the adjustable unit 5 and the sensor 2 to be measured on the positioning plate 3 is determined. It should be noted that the positioning of the probe 6 and the sensor 2 to be measured is achieved. Due to the position deviation of the solder joint 20 on the sensor 2 to be measured, there is still a position deviation within a controllable range between the probe 6 and the solder joint 20. For example, Figure 18 As shown, the elastic structure on the conducting end 65 of the probe 6 is used to relieve the position deviation between the probe 6 and the solder joint 20, and control the contact pressure of the probe 6 on the solder joint 20.

[0044] The main body seat 55 of the adjustable unit 5 internally accommodates the probe 6 and the mounting component 8; for example, Figure 7 As shown, an upper sliding seat 56 is provided at the upper end of the main body seat 55. The conducting end 65 of the probe 6 extends out of the through hole on the upper sliding seat 56 and contacts the sensor 2 to be measured; a lower fixing seat 57 is provided at the lower end of the main body seat 55, and the excitation circuit board 7 is installed on the lower fixing seat 57; the excitation end 62 of the probe 6 contacts the excitation circuit board 7, and the sliding seat body 51 includes the main body seat 55, the upper sliding seat 56 and the lower fixing seat 57.

[0045] Specifically, the mounting component 8 is fixed at the lower end of the accommodating space of the main body seat 55. For example, Figure 8 As shown, a plurality of probes 6 are fixed on the mounting component 8. The excitation end 62 of the probe 6 extends downward out of the mounting component 8 and contacts and conducts with the excitation circuit board 7 below.

[0046] Carriage platforms 551 are provided on both sides of the main body seat 55, and both ends of the upper sliding seat 56 extend into the carriage platforms 551; an elastic member 561 is provided between the upper sliding seat 56 and the carriage platforms 551; a limiting groove 562 is provided at the upper end of the upper sliding seat 56; a through hole is provided in the limiting groove 562 to enable the conducting end 65 of the probe 6 to extend out and contact the sensor 2 to be measured.

[0047] Specifically, during detection, the sensor 2 to be tested is placed in the placement groove 33 of the positioning plate 3 and supported on the upper end surface of the upper sliding seat 56. The pressing member 1 presses down on the sensor 2 to be tested, causing the upper sliding seat 56 to descend. The conducting end 65 of the probe 6 extends from the upper sliding seat 56 and contacts the sensor 2 to be tested, generating a contact pressure. By controlling the descent of the upper sliding seat 56, the deformation amount generated after the probe 6 contacts the sensor 2 to be tested is controlled, thereby controlling the contact pressure generated when the probe 6 contacts the sensor 2 to be tested, preventing damage to the solder joints 20 on the sensor 2 to be tested due to excessive pressure, and also avoiding poor contact due to too little pressure.

[0048] As Figure 9 As shown, the mounting assembly 8 has a plurality of fixing frames 81 arranged side by side. A plurality of fixing units 82 are fixedly installed in the fixing frames 81; a card slot 821 is provided on the fixing unit 82; the mounting portion 61 of the probe 6 is disposed in the card slot 821 of the fixing unit 82; a plurality of protrusions 822 are provided on the first surface of the fixing unit 82; a plurality of grooves 823 are provided on the second surface of the fixing unit 82; the protrusions 822 of the fixing unit 82 are inserted and fixed in the grooves 823 of another adjacent fixing unit 82; the probe 6 is not installed on the fixing units 82 at a predetermined position in the plurality of fixing frames 81, forming a vacant space 650 on the contact surface between the probe 6 and the sensor 2 to be tested.

[0049] Specifically, the fixing unit 82 of the mounting assembly 8 has a square structure. The card slot 821 in the middle of the square structure is in a T shape, and the shape of the card slot 821 is adapted to the mounting portion 61 of the probe 6. As Figure 14 shown, a plurality of protrusions 822 with different positions are provided on the front surface of the fixing unit 82. Corresponding to the positions of the protrusions 822, a plurality of grooves 823 are provided on the back surface of the fixing unit 82. The protrusions 822 on the front surface of the fixing unit 82 are inserted and fixed in the grooves 823 on the back surface of the front fixing unit 82, so that the plurality of fixing units 82 are sequentially installed and fixed in the fixing frames 81 by end-to-end insertion.

[0050] As Figure 13 shown, a plurality of probes 6 are installed on the mounting assembly 8 in an array form, and a vacant space 650 is formed at the position of the conducting end 65 of the probe 6. The probe 6 is not installed on the fixing unit 82 corresponding to the position of the vacant space 650. Through this space 650, the detection requirements of sensors 2 to be tested of different types and specifications can be met.

[0051] The probe 6 includes an excitation end 62 and a conduction end 65 located at both ends; an installation part 61 is adjacent to the excitation end 62, and an elastic part 64 is adjacent to the conduction end 65; a torsion part 63 is further arranged between the elastic part 64 and the installation part 61; the torsion part 63 causes the elastic part 64 and the conduction end 65 to generate torsion in a plane perpendicular to the extension direction of the probe 6; through the torsion of the torsion part 63, a large-volume elastic part 64 can be arranged on the probe 6.

[0052] As Figure 11 and 12 shown, the distance between two adjacent rows of probes 6 is the distance D. If there is no torsion part 63, the width L of the elastic part 64 on the probe 6 must be less than the distance D to avoid contact and interference between two adjacent rows of probes 6; in the embodiment of the present invention, due to the existence of the torsion part 63, the width L of the elastic part 64 can be greater than the distance between two rows of probes 6, so that on the premise of the same probe pitch, a larger-volume elastic part 64 can be formed on the probe 6, thereby improving the elastic performance of the probe 6, better avoiding damage to the solder joint 20 by the probe 6, and at the same time ensuring the contact pressure between the probe 6 and the sensor 2 to be measured, ensuring the stability of detection.

[0053] The elastic part 64 is composed of a plurality of bending parts 640 with a U-shaped structure; the number of the bending parts 640 is an odd number so that the extension directions of the conduction end 65 and the excitation end 62 are basically collinear; when the bending part 640 deforms, the conduction end 65 rotates by a certain amplitude; an asymmetric elastic structure is arranged on the conduction end 65 to compensate for the rotation; a long hole consistent with the extension direction of the bending part 640 is arranged at the bending part 640.

[0054] Specifically, in an embodiment of the present invention, the number of the bending parts 640 is three, as Figure 15 shown, the three bending parts 640 are connected end to end in sequence, so that the extension directions of the conduction end 65 and the excitation end 62 are basically on the same straight line, that is, the bending part 640 is located on one side of the straight line where the conduction end 65 and the excitation end 62 are located. The above structure enables the probe 6 to bend after contacting the sensor 2 to be measured. Due to the extrusion deformation of the bending part 640, the conduction end 65 will generate a certain amplitude of tilting rotation, as Figure 18 the arrow direction in, and due to the limitation of the through hole in the limiting groove 562 of the upper slide seat 56 on the conduction end 65 of the probe 6, the amplitude of the tilting rotation is small. Specifically, the asymmetric structure on the conduction end 65 is a structure with one side longer and one side shorter. When the conduction end 65 generates as Figure 18When the asymmetric structure rotates slightly in the direction indicated by the arrow, the longer part in the asymmetric structure is lifted, enabling it to slide better to the side of the solder joint 20 and playing a guiding role to cause elastic deformation of the two branches 601 of the conduction end 65. In addition, when the longer part in the asymmetric structure rotates in the direction indicated by the arrow in Figure 18 it can better cope with the skew of the position of the solder joint 20 on the sensor 2 to be measured. As shown by the dotted line in Figure 18 for different positions of the solder joint 20, the longer part in the asymmetric structure can play a guiding role and can prevent the conduction end 65 of the probe 6 from damaging the solder joint 20.

[0055] The conduction end 65 of the probe 6 includes two branches 601, and an open opening is formed between the two branches 601; a transverse body 602 is provided at the end of each branch 601, and the two transverse bodies 602 are arranged oppositely; a guiding portion 603 is provided at the lower end of the transverse body 602 that is far from the bending portion 640 among the two transverse bodies 602; a contact surface 604 is formed between the guiding portion 603 and the transverse body 602.

[0056] Specifically, the two branches 601 extend along the vertical direction as shown in Figure 15 and the two transverse bodies 602 extend along the horizontal direction as shown in Figure 15 An open V-shaped opening is formed between the two branches 601 to provide elastic deformation. The relative arrangement of the two transverse bodies 602 can provide a larger contact area with the solder joint 20. A guiding portion 603 is provided at the lower end of one of the transverse bodies 602 that is far from the bending portion 640 among the two transverse bodies 602, that is, Figure 18 at the lower end of the transverse body 602 on the side towards which the conduction end 65 rotates in

[0057] The conduction end 65 of the probe 6 includes two branches 601, and an open opening is formed between the two branches 601. A transverse body 602 is provided at the end of each branch 601, and the two transverse bodies 602 are arranged oppositely; or, the conduction end 65 of the probe 6 includes one branch 601, a transverse body 602 is provided at the end of the branch 601, and a guiding portion 603 is provided at the lower end of the transverse body 602.

[0058] In other embodiments, as shown in Figure 16 transverse bodies 602 are provided at the lower ends of the two branches 601, and no guiding portion 603 is provided at the lower ends of the transverse bodies 602. When contacting the solder joint 20, the two branches 601 are driven to deform by the transverse bodies 602. In another embodiment, as shown in Figure 17, the conducting end 65 of the probe 6 only includes one branch 601, and the width of the branch 601 gradually decreases in the direction towards the end of the conducting end 65 to provide elastic deformation. A guiding portion 603 is provided at the lower end of the transverse body 602 at the end of the branch 601. Through the guiding portion 603, the branch 601 is guided to elastically deform in the expected direction to avoid excessive extrusion and damage to the solder joint 20.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An adjustable microelectronic sensor array probe assembly, comprising a pressing member (1), a sensor to be tested (2), a base (4), a probe (6) and an excitation circuit board (7), characterized in that: The probe (6) and the excitation circuit board (7) are arranged in an adjustable unit (5) that can slide on the base (4); At least two adjustable units (5) are arranged on the base (4), and the distance between the adjustable units (5) is adjusted to adapt to different models of sensors (2) to be tested; The sensor to be tested (2) is placed on the base (4) via a positioning plate (3), and the relative positions of the sensor to be tested (2) and the sliding adjustable unit (5) are constrained by the positioning plate (3), thereby achieving accurate positioning of the probe (6) on the sensor to be tested (2); The probes (6) are fixed in the adjustable unit (5) via a mounting assembly (8), and a space (650) is formed between the plurality of probes (6) via the mounting assembly (8) to adapt to the circuit structure on the sensor (2) to be tested; The probe (6) comprises an elastic portion (64) and a conducting end (65) in contact with the sensor to be tested (2), wherein the conducting end (65) has an elastic structure for preventing damage to a solder joint (20) on the sensor to be tested (2).

2. The sensor array probe assembly according to claim 1, characterized in that: The bottom of the adjustable unit (5) is slidably supported on the guide rail (46) of the base (4), and a guide member (52) and a screw rod (53) are provided on one side of the slide seat body (51) of the adjustable unit (5); The guide member (52) is slidably supported on both sides of the nut seat (44) of the base (4); The screw rod (53) is drivingly connected to a nut in the middle of the nut seat (44), and an operating portion (54) is provided at the outer end of the screw rod (53).

3. The sensor array probe assembly according to claim 2, characterized in that: The lower end of the positioning plate (3) is provided with a first positioning portion (31) that cooperates and fixes with the bracket (41) of the base (4) and a second positioning portion (32) that abuts and positions with the adjustable unit (5); The first direction positioning (311) of the first positioning portion (31) is inserted into the first positioning groove (42) on the bracket (41); The second direction positioning portion (312) of the first positioning portion (31) is inserted into a second positioning groove (45) on the bracket (41); The sensor to be tested (2) is placed in a placement groove (33) at the upper end of the positioning plate (3).

4. The sensor array probe assembly according to claim 3, characterized in that: The main body (55) of the adjustable unit (5) accommodates the probe (6) and the mounting assembly (8) inside; An upper slide seat (56) is provided at the upper end of the main body seat (55), and the conducting end (65) of the probe (6) extends out of a through hole on the upper slide seat (56) and contacts the sensor (2) to be tested; A lower fixing seat (57) is provided at the lower end of the main body seat (55), and the excitation circuit board (7) is mounted on the lower fixing seat (57); The excitation end (62) of the probe (6) is in contact with the excitation circuit board (7).

5. The sensor array probe assembly according to claim 4, characterized in that: Support platforms (551) are provided on both sides of the main body seat (55), and both ends of the upper slide seat (56) extend into the support platforms (551); An elastic member (561) is provided between the upper slide seat (56) and the support platform (551); A limiting groove (562) is provided at the upper end of the upper slide seat (56); A through hole is provided in the limiting groove (562) to allow the conducting end (65) of the probe (6) to extend out and contact the sensor (2) to be tested.

6. The sensor array probe assembly according to claim 5, characterized in that: The installation assembly (8) has a plurality of fixing frames (81) arranged side by side, and a plurality of fixing units (82) are fixedly installed in the fixing frames (81); The fixing unit (82) is provided with a card slot (821); The mounting portion (61) of the probe (6) is arranged in a slot (821) of the fixing unit (82); The first surface of the fixing unit (82) is provided with a plurality of protrusions (822); The second surface of the fixing unit (82) is provided with a plurality of grooves (823); The protrusion (822) of the fixing unit (82) is inserted and fixed in the groove (823) of another adjacent fixing unit (82); The probe (6) is not installed on the fixing unit (82) at a predetermined position in the plurality of fixing frames (81), and an empty space (650) is formed on the contact surface between the probe (6) and the sensor (2) to be tested.

7. The sensor array probe assembly according to claim 6, characterized in that: The two ends of the probe (6) are respectively an excitation end (62) and a conduction end (65); The mounting portion (61) is adjacent to the excitation end (62), and the elastic portion (64) is adjacent to the conduction end (65); A torsion portion (63) is further provided between the elastic portion (64) and the mounting portion (61); The twisting portion (63) causes the elastic portion (64) and the conducting end (65) to twist in a plane perpendicular to the extension direction of the probe (6).

8. The sensor array probe assembly according to claim 7, characterized in that: The elastic portion (64) is composed of a plurality of U-shaped bending portions (640); The number of the bent portions (640) is an odd number, so that the extension directions of the conduction end (65) and the excitation end (62) are colinear; When the bending portion (640) is deformed, the conducting end (65) is caused to rotate; An asymmetric elastic structure is provided on the conducting end (65) to compensate for the rotation; The bending portion (640) is provided with a long hole in the same extension direction as the bending portion (640).

9. The sensor array probe assembly according to claim 8, characterized in that: The conducting end (65) of the probe (6) comprises two branches (601), and an open opening is formed between the two branches (601); A transverse body (602) is disposed at the end of each branch (601), and the two transverse bodies (602) are disposed opposite to each other; A guide portion (603) is provided at the lower end of the transverse body (602) away from the bending portion (640) in the two transverse bodies (602); A contact surface (604) is formed between the guide portion (603) and the transverse body (602).

10. The sensor array probe assembly according to claim 8, characterized in that: The conducting end (65) of the probe (6) comprises two branches (601), an open opening is formed between the two branches (601), a transverse body (602) is arranged at the end of each branch (601), and the two transverse bodies (602) are arranged opposite to each other; Alternatively, the conducting end (65) of the probe (6) comprises a branch (601), the end of the branch (601) is provided with a transverse body (602), and the lower end of the transverse body (602) is provided with a guide portion (603).

Images