Chip aging machine temperature control detection system

Abstract

The invention belongs to the technical field of semiconductor testing, and particularly relates to a chip aging machine temperature control detection system which comprises an aging machine, a data conversion transmission circuit and a temperature calibration box. The temperature sensor A is in signal connection with the data conversion and transmission circuit and feeds back temperature information to a temperature analysis system of the aging machine in real time, nine temperature sensors B are arranged on the periphery and the center point of the temperature calibration box, and the nine temperature sensors B are all in signal connection with a temperature and humidity field inspection instrument. The temperature and humidity field inspection instrument obtains temperature information of the periphery and the center point of the temperature calibration box in real time through nine temperature sensors B. According to the invention, omnibearing and high-precision monitoring of the internal temperature environment of the aging machine is realized, the stability, accuracy and comprehensiveness of the whole system are enhanced, the precision of the actual temperature state in the aging test is ensured, and the aging test effect of the chip is ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor testing, and particularly relates to a temperature control detection system for a chip aging machine. Background Art

[0002] HTOL (High Temperature Operating Life) test (high temperature operating life test) is a method for accelerating the simulation of chip operation aging. It provides power supply pressurization for the chip in a high temperature environment and working state to detect product design deficiencies and manufacturing process defects in advance, and can evaluate the product life in a short time; in the chip mass production shipping test process, adding an aging test (Burn In) program can screen out chips with potential failure risks and ensure the reliability and stability of the product. As a key device for performing HTOL tests, the aging machine needs to provide a stable high temperature environment, power supply, and required current and working vectors for the chips. It is mainly divided into an independent temperature control aging machine and a non-independent temperature control aging machine. The independent temperature control aging machine has the ability to provide independent temperature control for each chip, provides more power supply groups and larger power consumption, and has a relatively large vector depth. The non-independent temperature control aging machine uses the overall furnace temperature of the machine as the temperature control, provides fewer power supply groups, smaller power consumption, and relatively small vector depth.

[0003] In the temperature monitoring design of the independent temperature control machine, it usually includes three blocks: the temperature analysis system at the machine end, the data conversion and transmission circuit on the BIB (a certain intermediate board or conversion board), and the sensor on the Socket (socket). At present, the independent temperature control detection system mainly compares the temperature data after temperature analysis at the machine end. When the comparison result confirms that the temperature analyzed at the machine end is accurate, the temperature data is considered correct. However, this verification method ignores possible failures in the BIB data conversion and transmission, as well as the Socket sensor. These failures can easily lead to incorrect temperature analysis at the machine end, thus seriously affecting the effect of chip aging tests.

[0004] There are studies on the temperature calibration of aging test fixtures in the prior art. For example, in patent application CN119063877A - Aging Test Fixture Temperature Calibration Method, System, Electronic Device, and Storage Medium, by setting multiple temperature calibration points, using a standard thermometer to measure the standard temperature of the aging test fixture, and comparing it with the temperature reading of the temperature detection device of the aging test fixture itself, a mapping relationship table between voltage and temperature is established to achieve the temperature calibration of the aging test fixture. However, the existing calibration method only calibrates the temperature of the aging test fixture, ignoring the correctness of the data at each slot or each site of the BIB after the aging machine performs temperature conversion calculations, resulting in difficulty in ensuring the accuracy of the actual temperature state in the aging test, and thus it is difficult to prove the correctness of the temperature on each unit under test of the independent temperature control machine, seriously affecting the aging test effect of the unit under test. Therefore, a new technical solution is needed to solve the above technical problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a temperature control detection system for a chip aging machine to solve the problems in the above - mentioned background technology that the current temperature calibration method ignores the correctness of the data at each slot or each site of the BIB after the aging machine performs temperature conversion calculations, resulting in difficulty in ensuring the accuracy of the actual temperature state in the aging test, and thus it is difficult to prove the correctness of the temperature on each unit under test of the independent temperature control machine, seriously affecting the aging test effect of the unit under test.

[0006] To achieve the above - mentioned purpose, the present invention provides the following technical solution: A temperature control detection system for a chip aging machine includes an aging machine, a data conversion and transmission circuit inserted on the temperature analysis system at the end of the aging machine, and a temperature calibration box connected to the data conversion and transmission circuit. There are several temperature sensors A in the temperature calibration box. The temperature sensors A are signal - connected to the data conversion and transmission circuit and real - time feedback temperature information to the temperature analysis system of the aging machine. Nine temperature sensors B are arranged around the perimeter and at the center point of the temperature calibration box. All nine temperature sensors B are signal - connected to a temperature and humidity field inspection instrument. The temperature and humidity field inspection instrument obtains the temperature information around the perimeter and at the center point of the temperature calibration box through the nine temperature sensors B. An inspection door is provided at the front side of the temperature calibration box.

[0007] Further, the temperature calibration box is divided into an upper detection area, a middle detection area, and a lower detection area from top to bottom; four temperature sensors B are respectively arranged around the upper detection area; one temperature sensor B is arranged at the center point of the middle detection area; four temperature sensors B are respectively arranged around the lower detection area; the four temperature sensors B in the upper detection area, the one temperature sensor B in the middle detection area, and the four temperature sensors B in the lower detection area are all used as calibration values for temperature comparison, are signal-connected to the temperature and humidity field inspection instrument, and simultaneously feedback temperature information to the temperature and humidity field inspection instrument in real time.

[0008] Further, the temperature calibration box is divided into several detection layers, and six temperature sensors A are evenly distributed in each detection layer; the six temperature sensors A in each detection layer are signal-connected to the data conversion and transmission circuit, and the temperature information is feedback to the temperature analysis system of the aging machine through the data conversion and transmission circuit in real time and is simultaneously displayed on the display screen of the temperature analysis system; the temperature detected by the temperature sensor A is compared and verified with the calibrated temperature detected by the temperature sensor B.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. By arranging multiple temperature sensors A and nine temperature sensors B in the temperature calibration box, the present invention realizes the all-round and high-precision monitoring of the internal temperature environment of the aging machine. The temperature sensors A are signal-connected to the data conversion and transmission circuit, so that the temperature information of each layer in the temperature calibration box can be feedback to the temperature analysis system of the aging machine in real time, ensuring that the temperature data of each layer can be accurately recorded and analyzed. At the same time, the temperature and humidity field inspection instrument is used to obtain the temperature conditions around the perimeter and at the center point of the temperature calibration box through the temperature sensors B in real time. By comparing the temperature data detected by the temperature sensors A and the temperature sensors B, not only can the influence of temperature non-uniformity on the test results be eliminated, effectively improving the accuracy and reliability of the aging test, but also the possible fault points in the temperature monitoring system can be discovered and located in time. Whether it is a problem with the data conversion and transmission circuit or the failure of the Socket sensor, it can be quickly identified and corrected through the abnormal fluctuation of the temperature data, avoiding the expansion of the fault, thereby enhancing the stability, accuracy, and comprehensiveness of the entire temperature control detection system, ensuring the accuracy of the actual temperature state in the aging test, and guaranteeing the aging test effect of the chip; 2. The present invention divides nine temperature sensors B into a 4 + 1 + 4 pattern and places them around the upper detection area, at the center of the middle detection area, and around the lower detection area respectively, enabling the temperature and humidity field inspection instrument to more comprehensively and accurately monitor the temperature distribution inside the temperature calibration chamber, further improving the accuracy of temperature detection. By arranging six temperature sensors A in each detection layer of the temperature calibration chamber, the temperature analysis system can obtain the temperature information at various positions inside the temperature calibration chamber and compare it with the temperature conditions obtained by the temperature and humidity field inspection instrument, effectively reducing the interference of temperature differences and deviation factors on the detection results, and further improving the reliability of temperature detection; 3. Through precise temperature monitoring and calibration, the present invention ensures the accuracy of the actual temperature state in the aging test. It not only helps to detect potential defects in the chip product design and manufacturing process earlier but also can accurately evaluate the product's lifespan in a short time. Adding this temperature control detection system to the chip mass production shipment test process can more effectively screen out chips with potential failure risks, thereby significantly improving the reliability and stability of the product and ensuring the quality of the final product. Compared with traditional temperature calibration methods, this temperature detection system simplifies the temperature calibration process through an integrated design. Through the real-time feedback and direct comparison of the data of temperature sensor A and temperature sensor B, it realizes the precise collection and comparison of temperature data at different positions, further improving the accuracy and operability of the calibration, making the temperature calibration work more efficient and convenient; 4. The chip aging machine temperature control detection system of the present invention not only has the function of temperature calibration but also can, by comparing the temperature data displayed by the temperature analysis system and the temperature and humidity field inspection instrument, promptly discover and locate potential fault areas, effectively eliminate fault factors, thereby significantly enhancing the reliability of the aging test and providing new ideas and directions for the technological innovation and development in the field of chip aging testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of the overall process structure of the present invention; Figure 2 is a schematic side view of the temperature calibration chamber in Embodiment 1 of the present invention Figure 1 ; Figure 3 is a schematic diagram of the distribution of four temperature sensors B in the upper detection area of the present invention; Figure 4 is a schematic diagram of the distribution of one temperature sensor B in the middle detection area of the present invention; Figure 5 is a schematic diagram of the distribution of four temperature sensors B in the lower detection area of the present invention; Figure 6 is a schematic side view of the temperature calibration chamber in Embodiment 1 of the present inventionFigure 2 ; Figure 7 Schematic structural diagram of the six temperature sensors A of the present invention distributed in each detection layer; Figure 8 Schematic side view of the temperature calibration chamber of Embodiment 2 of the present invention.

[0011] Wherein: 1. Aging machine; 101. Temperature analysis system; 2. Data conversion and transmission circuit; 3. Temperature calibration chamber; 4. Temperature sensor A; 5. Temperature sensor B; 6. Temperature and humidity field inspection instrument; 7. Maintenance door; 8. Upper detection area; 9. Middle detection area; 10. Lower detection area; 11. Detection layer. Specific embodiments

[0012] The following embodiments are used to further illustrate the content of the present invention and do not limit the application of the present invention.

[0013] Embodiment 1 (taking 24 temperature sensors A4 as an example): Please refer to Figures 1-7 , this embodiment provides a temperature control detection system for a chip aging machine, including an aging machine 1 for aging tests, a data conversion and transmission circuit 2 inserted on the temperature analysis system 101 at the end of the aging machine and used for temperature conversion and transmission, and a temperature calibration chamber 3 connected to the data conversion and transmission circuit 2 and used for temperature detection. There are twenty-four temperature sensors A4 in the temperature calibration chamber 3 for detecting the temperature of four layers in the temperature calibration chamber 3. The temperature sensors A4 are signal-connected to the data conversion and transmission circuit 2 and feedback temperature information to the temperature analysis system 101 of the aging machine 1 in real time. Nine temperature sensors B5 for detecting the temperature around and at the center point of the temperature calibration chamber 3 are provided around and at the center point of the temperature calibration chamber 3. The nine temperature sensors B5 are all signal-connected to a temperature and humidity field inspection instrument 6 for displaying the temperature detected by the temperature sensors B5. The temperature and humidity field inspection instrument 6 obtains the temperature information around and at the center point of the temperature calibration chamber 3 through the nine temperature sensors B5 in real time. A maintenance door 7 for maintaining the temperature calibration chamber 3 is provided at the front side of the temperature calibration chamber 3.

[0014] Please refer to Figures 2-5 , the temperature calibration chamber 3 is divided into an upper detection area 8, a middle detection area 9 and a lower detection area 10 from top to bottom; four temperature sensors B5 are respectively provided around the upper detection area 8, and the four temperature sensors B5 here are numbered one, two, three and four; one temperature sensor B5 is provided at the center point of the middle detection area 9, and the one temperature sensor B5 here is numbered five; four temperature sensors B5 are respectively provided around the lower detection area 10, and the four temperature sensors B5 here are numbered six, seven, eight and nine; Four temperature sensors B5 labeled one, two, three, and four, one temperature sensor B5 labeled five, and four temperature sensors B5 labeled six, seven, eight, and nine are all used as calibration values for temperature comparison, are signal-connected to the temperature and humidity field inspection instrument 6, and at the same time, the temperature information is real-time fed back to the temperature and humidity field inspection instrument 6.

[0015] Please refer to Figures 6-7 , the temperature calibration box 3 is divided into four detection layers 11, and six temperature sensors A4 are evenly distributed in each detection layer 11. The labeling formulas of the six temperature sensors A4 in each detection layer 11 are , , , , , (that is, the labels of the six temperature sensors A4 in the first detection layer 11 are S1, S2, S3, S4, S5, and S6, the labels of the six temperature sensors A4 in the second detection layer 11 are S7, S8, S9, S10, S11, and S12, the labels of the six temperature sensors A4 in the third detection layer 11 are S13, S14, S15, S16, S17, and S18, and the labels of the six temperature sensors A4 in the fourth detection layer 11 are S19, S20, S21, S22, S23, and S24); The six temperature sensors A4 in the first detection layer 11 labeled S1, S2, S3, S4, S5, and S6, the six temperature sensors A4 in the second detection layer 11 labeled S7, S8, S9, S10, S11, and S12, the six temperature sensors A4 in the third detection layer 11 labeled S13, S14, S15, S16, S17, and S18, and the six temperature sensors A4 in the fourth detection layer 11 labeled S19, S20, S21, S22, S23, and S24 are all signal-connected to the data conversion and transmission circuit 2, and through the data conversion and transmission circuit 2, the temperature information is real-time fed back to the temperature analysis system 101 of the aging machine 1 and at the same time displayed on the display screen of the temperature analysis system 101; the temperatures detected by the above twenty-four temperature sensors A4 are compared and verified with the calibration temperatures detected by the nine temperature sensors B.

[0016] The working principle and usage process of the present invention: As Figures 1-7It is shown that after the temperature control detection system of the chip aging machine is assembled, it is integrally installed in the chip testing equipment. Its purpose is to achieve all-round and high-precision monitoring of the internal temperature environment of the aging machine, which can not only eliminate the influence of temperature non-uniformity on the test results, effectively improve the accuracy and reliability of the aging test, but also timely detect and locate the possible fault points in the temperature monitoring system. Whether it is a problem with the data conversion and transmission circuit or the failure of the Socket sensor, it can be quickly identified and corrected through the abnormal fluctuation of the temperature data, avoiding the expansion of the fault, thus enhancing the stability, accuracy and comprehensiveness of the entire temperature control detection system, ensuring the accuracy of the actual temperature state in the aging test, and guaranteeing the aging test effect of the chip; When the chip aging machine needs to perform temperature calibration, the operator first divides the nine temperature sensors B into four, one and four, and places them on the upper detection area 8, the middle detection area 9 and the lower detection area 10 of the temperature calibration box 3 respectively. Then, the nine temperature sensors B are all signal-connected to the temperature and humidity field inspection instrument 6, so that the temperature data detected by the nine temperature sensors B can be displayed on the temperature and humidity field inspection instrument 6 as calibration values. Then, the twenty-four temperature sensors A4 are evenly distributed on the four detection layers 11 in the temperature calibration box 3, so that six temperature sensors A4 are distributed in each detection layer 11. Then, the twenty-four temperature sensors A4 are all signal-connected to the data conversion and transmission circuit 2, and the data conversion and transmission circuit 2 is inserted into the temperature analysis system 101 at the end of the aging machine 1, so that the temperature data detected by the twenty-four temperature sensors A4 can be displayed on the display screen of the temperature analysis system 101. Finally, the temperature data displayed on the display screen of the temperature analysis system 101 is compared and verified with the calibration temperature displayed on the temperature and humidity field inspection instrument 6. When the difference between the temperature data on the display screen of the temperature analysis system 101 and the calibration temperature on the temperature and humidity field inspection instrument 6 is less than the preset temperature difference range, the temperature calibration of the temperature sensor A4 is successfully completed; when the difference between the temperature data on the display screen of the temperature analysis system 101 and the calibration temperature on the temperature and humidity field inspection instrument 6 is greater than the preset temperature difference range, the fault factors need to be eliminated and then the temperature calibration is carried out.

[0017] Embodiment 2 (taking 48 temperature sensors A4 as an example): Please refer to Figure 8 , the setting structure of the temperature control detection system of the chip aging machine in this embodiment is the same as that in Embodiment 1, only the number of detection layers 11 and temperature sensors A4 set in the temperature calibration box 3 is different, that is, the temperature calibration box 3 is divided into eight detection layers 11, and six temperature sensors A4 are evenly distributed in each detection layer 11, with a total of forty-eight temperature sensors A4.

[0018] Similarly, the working principle and usage process of the temperature control detection system of the chip aging machine in this example are also the same as those in Embodiment 1.

Claims

1. A chip aging machine temperature control detection system, comprising an aging machine, a data conversion and transmission circuit inserted into a temperature analysis system at the aging machine end, and a temperature calibration box connected to the data conversion and transmission circuit, characterized in that: Several temperature sensors A are provided in the temperature calibration box. The temperature sensors A are connected to the data conversion transmission circuit signal and feed back the temperature information to the temperature analysis system of the aging machine in real time. Nine temperature sensors B are provided around and at the center of the temperature calibration box. The nine temperature sensors B are all connected to the temperature and humidity field inspection instrument. The temperature and humidity field inspection instrument obtains the temperature information around and at the center of the temperature calibration box in real time through the nine temperature sensors B.

2. A chip aging machine temperature control detection system according to claim 1, characterized in that: The temperature calibration box is divided into an upper detection area, a middle detection area and a lower detection area from top to bottom.

3. A chip aging machine temperature control detection system according to claim 2, characterized in that: Four temperature sensors B are respectively arranged around the upper detection area.

4. A chip aging machine temperature control detection system according to claim 3, characterized in that: A temperature sensor B is provided at the center point of the middle layer detection area.

5. A chip aging machine temperature control detection system according to claim 4, characterized in that: Four temperature sensors B are respectively arranged around the lower detection area.

6. A chip aging machine temperature control detection system according to claim 5, characterized in that: The four temperature sensors B in the upper detection area, the one temperature sensor B in the middle detection area and the four temperature sensors B in the lower detection area are all used as calibration values ​​for temperature comparison and are connected to the temperature and humidity field inspection meter signal and at the same time feed back the temperature information to the temperature and humidity field inspection meter in real time.

7. A chip aging machine temperature control detection system according to claim 1, characterized in that: The temperature calibration box is divided into a plurality of detection layers, and six temperature sensors A are evenly distributed in each detection layer.

8. A chip aging machine temperature control detection system according to claim 7, characterized in that: The six temperature sensors A in each detection layer are all connected to the data conversion transmission circuit signal, and the temperature information is fed back to the temperature analysis system of the aging machine in real time through the data conversion transmission circuit and is simultaneously displayed on the display screen of the temperature analysis system.

9. A chip aging machine temperature control detection system according to claim 8, characterized in that: The temperature detected by the temperature sensor A is compared with the calibration temperature detected by the temperature sensor B to verify the setting.

10. The chip aging machine temperature control detection system according to claim 1, characterized in that: The front side of the temperature calibration box is provided with an inspection door.

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