Semiconductor chip aging detection equipment and detection method

Abstract

The invention relates to the technical field of semiconductor testing, and particularly discloses semiconductor chip aging detection equipment and a detection method, which are used for solving the problem that the performance of a semiconductor cannot be obtained in real time in the prior art. Comprising a test box, a plurality of supporting legs are arranged at the bottom of the test box, a hot air part used for providing hot air for the test box is arranged on the test box, a control panel is arranged on the outer side of the test box, a touch display screen is arranged on the control panel, and a plurality of horizontal through holes are formed in the end of the test box. And a test sliding seat is arranged at the position of each horizontal through hole in a sliding manner. The device is designed according to existing requirements, the working condition of a semiconductor chip in an extreme environment can be obtained, dynamic testing of the semiconductor chip is better completed, meanwhile, multiple sets of testing modules are constructed, the testing reliability is guaranteed, in addition, airflow layers corresponding to the testing modules are constructed, and the problem that the testing environment is not uniform is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing, in particular to a semiconductor chip aging detection device and a detection method. Background Art

[0002] In the semiconductor industry, it is necessary to conduct aging tests on the produced semiconductor chips to determine their service life and product performance. Currently, when the test chamber is in use, the selected chip samples to be detected are placed on the sample rack in the inner cylinder, and high temperature and high relative humidity are used to accelerate the moisture to test the chips. For example, the aging detection device for silicon carbide semiconductor chips in the existing patent publication number records that multiple groups of support screws with adjustable heights are installed on the sample rack, and at the same time, a telescopic pressure plate is used to position the four corners of the chip, so that the chip is suspended and positioned in the inner cylinder to reduce the influence of other factors on the test. However, when testing the semiconductor here, the real-time working state of the semiconductor cannot be obtained in real time, resulting in the durability of the semiconductor performance changing with the temperature environment being unknown, which is not conducive to controlling the semiconductor performance.

[0003] Based on this, a semiconductor chip aging detection device and a detection method are now provided, which can eliminate the drawbacks of the existing devices. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor chip aging detection device and a detection method, which solve the problem that the semiconductor performance cannot be obtained in real time in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions: A semiconductor chip aging detection device includes a test chamber. A plurality of legs are provided at the bottom of the test chamber. A hot air component for providing hot air for it is provided on the test chamber. The hot air component can provide a corresponding environment for chip testing so as to carry out test operations. A control panel is provided on the outer side of the test chamber. A touch display screen is provided on the control panel. A plurality of horizontal through holes are opened at the end of the test chamber. A test sliding seat is slidably provided at each horizontal through hole position. Sealing clamping plates matching the upper and lower end faces of the test sliding seat are provided at the end of the test chamber. A sealing pad matching the test sliding seat is provided at the lower end of the sealing clamping plate. A plurality of guiding grooves matching the semiconductor chips are distributed at the upper end of the test sliding seat. A positioning groove is provided in each guiding groove, and the positioning groove can fix the bottom of the semiconductor chip. A pressing contact component for electrically connecting with a single semiconductor chip is provided in the test chamber.

[0006] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions: In an alternative solution: The downward pressing contact component includes a downward pressing frame arranged above the test slide, multiple suspension rods are provided at the lower end of the downward pressing frame, the lower ends of the suspension rods are connected to the chip contacts, the chip contacts are matched with the guiding grooves, a power connection end matched with the upper end contacts of the semiconductor chip is provided at the lower end of the chip contacts, side rods are symmetrically arranged on both sides of the downward pressing frame, the side rods are slidably arranged on the guiding vertical rods, the guiding vertical rods are vertically fixed inside the test box, a positioning side ring is fixedly arranged on the guiding vertical rod above the test slide, the positioning side ring is connected to the side rod through a return spring, and a downward pressing push member for driving the downward pressing frame to press down is arranged on the test slide.

[0007] In an alternative solution: The downward pressing push member includes a guiding frame arranged at the inner end of the downward pressing frame, the guiding frame is a hook structure arranged downward, a guiding hole is horizontally penetrated through the central position of the test slide, a triggering slide bar is slidably arranged in the guiding hole, a triggering pin for generating a thrust on the inclined surface of the guiding frame is arranged at the inner end of the triggering slide bar, a regulating screw rod is threadedly arranged in the screw hole at the outer end of the triggering slide bar, the regulating screw rod is rotationally connected to the bearing frame outside the test slide, a rotating handle is fixedly arranged at the outer end of the regulating screw rod, and a limiting vertical plate for limiting the sliding stroke of the test slide is arranged inside the test box.

[0008] In an alternative solution: A guiding mechanism is arranged between the test slide and the test box, the guiding mechanism includes a guiding bottom block arranged at the bottom of the test slide, the guiding bottom block is arranged close to the inner end of the test slide, a horizontal guiding rod is slidably arranged in the guiding bottom block, and both ends of the horizontal guiding rod are supported on the inner wall of the test box.

[0009] In an alternative solution: The hot air component includes a plurality of single-layer buffer boxes symmetrically arranged on both sides of the test box, the air inlet end of each single-layer buffer box is communicated with a branch pipe, the branch pipe is communicated with an air guide pipe, the air guide pipe is communicated with a heating box, a circulation fan for promoting air flow is arranged on one of the air guide pipes, a heating pipe group for heating air is arranged in the heating box, a temperature sensor is arranged in the heating box, and a cooling component for cooling is arranged on the surface of the heating box.

[0010] In an alternative solution: The cooling component includes heat dissipation fins arranged on the heating surface of the heating box, a heat dissipation cover plate is arranged on the surface of the heating box where the heat dissipation fins are located, a water falling partition plate is arranged at the inner top of the heat dissipation cover plate, a plurality of water falling holes are distributed on the water falling partition plate, the bottom of the heat dissipation cover plate is communicated with a water cooling box through a downstream pipe, a coolant pump is arranged outside the water cooling box, the output end of the coolant pump is communicated with the lower end of a water supply pipe, the upper end of the water supply pipe is communicated with the air inlet of the upper end of the water falling partition plate, and the water suction end of the coolant pump extends into the water cooling box.

[0011] In an alternative solution: A humidifier and a humidity sensor are also arranged in the heating box.

[0012] In an alternative solution: an auxiliary card slot is provided at the upper end of the test slide, an auxiliary card holder is fitted in the auxiliary card slot, a plurality of guiding grooves for placing semiconductor chips are distributed on the surface of the auxiliary card holder, positioning grooves are provided at the bottoms of the guiding grooves, and a discharging groove for easily pulling away the auxiliary card holder is provided on the surface of the auxiliary card holder.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The present invention is designed for the existing needs, and the working conditions of semiconductor chips under extreme environments can be obtained, so as to better complete the dynamic testing of semiconductor chips. At the same time, multiple groups of testing modules are constructed here to ensure the reliability of the testing. In addition, an air flow layer corresponding to the testing module is constructed to avoid the problem of uneven testing environment.

[0014] 2. The present invention constructs a drawer-type loading and unloading method, which can ensure a relatively sealed state during the material taking process, avoid damaging the internal environment of the test, and also reduce the pollution of the working environment, saving energy and being environmentally friendly.

[0015] 3. Through the optimization of the test slide, the present invention enables overall loading and unloading of materials, improving the efficiency of material replacement. Description of the Drawings

[0016] Figure 1 It is a schematic structural view of one side of the present invention.

[0017] Figure 2 It is a schematic structural view of the other side of the present invention.

[0018] Figure 3 It is a schematic structural view of the internal one side of the present invention.

[0019] Figure 4 It is a schematic structural view of the internal other side of the present invention.

[0020] Figure 5 It is a schematic structural view of one side of the test slide of the present invention.

[0021] Figure 6 It is a schematic structural view of the other side of the test slide of the present invention.

[0022] Figure 7 It is a schematic structural view of the optimized test slide of the present invention.

[0023] Figure 8 It is a schematic structural view of the internal part of the heat dissipation cover plate of the present invention.

[0024] Annotation of reference numerals: test chamber 100, support legs 101, control panel 102, sealing splints 103; Single-layer cache box 201, branch pipe 202, coolant pump 203, water-cooling box 204, down-flow pipe 205, air guide pipe 206, heat dissipation cover plate 207, water supply pipe 208, heating box 209, circulation fan 210, heat dissipation fins 211, water-falling partition plate 212, water-falling holes 213; Test slide 300, rotary handle 301, guiding groove 302, positioning groove 303, trigger slide bar 304, trigger pin 305, horizontal guide rod 306, guiding bottom block 307, adjusting screw 308, guiding hole 309, bearing bracket 310; Auxiliary clamping seat 311, auxiliary clamping groove 312, unloading chute 313; Side rod 400, return spring 401, positioning side ring 402, guiding vertical rod 403, pressing frame 404, chip contact 405, limiting vertical plate 406, guiding frame 407. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] As Figures 1-8 shown, the embodiment of the present invention provides a semiconductor chip aging detection device, including a test box 100. A plurality of legs 101 are provided at the bottom of the test box 100. A hot air component for providing hot air for it is provided on the test box 100. The hot air component can provide a corresponding environment for chip testing so as to perform test operations. A control panel 102 is provided on the outer side of the test box 100. A touch display screen is provided on the control panel 102. A plurality of horizontal through holes are opened at the end of the test box 100. A test slide 300 is slidably provided at each horizontal through hole position. A sealing clamping plate 103 matching the upper and lower end faces of the test slide 300 is provided at the end of the test box 100. A sealing gasket matching the test slide 300 is provided at the lower end of the sealing clamping plate 103. A plurality of guiding grooves 302 matching the semiconductor chips are distributed at the upper end of the test slide 300. A positioning groove 303 is provided in each guiding groove 302. The positioning groove 303 can fix the bottom of the semiconductor chip. A pressing contact component for electrically connecting with a single semiconductor chip is provided in the test box 100. It is electrically connected with a plurality of semiconductor chips through a pressing contact module so as to timely detect its real-time state; The downward pressing contact component includes a downward pressing frame 404 arranged above the test slide 300. A plurality of suspension rods are provided at the lower end of the downward pressing frame 404, and the lower ends of the suspension rods are connected to the chip contacts 405. The chip contacts 405 are matched with the guiding grooves 302. The lower ends of the chip contacts 405 are provided with power connection ends matched with the upper end contacts of the semiconductor chip. Side rods 400 are symmetrically arranged on both sides of the downward pressing frame 404. The side rods 400 are slidably arranged on the guiding vertical rods 403, and the guiding vertical rods 403 are vertically fixed inside the test box 100. A positioning side ring 402 is fixedly arranged on the guiding vertical rod 403 above the test slide 300. The positioning side ring 402 is connected to the side rod 400 through a return spring 401. Under the traction of the return spring 401, the side rod 400 will drive the downward pressing frame 404 away from the test slide 300. A downward pressing push member for driving the downward pressing frame 404 to press down so that the chip contacts 405 contact the semiconductor chip is arranged on the test slide 300. After the test slide 300 is transferred into the test box 100, the downward pressing push member drives the downward pressing frame 404 to move downward. The chip contacts 405 at the lower end of the downward pressing frame 404 are inserted into the guiding grooves 302, and the contacts at the ends of the chip contacts 405 are electrically connected to the semiconductor chip, and thus its real-time data will be transmitted to the control panel 102, and its operating state will be acquired by the control panel 102 so as to obtain the usage state of the semiconductor chip; The downward pressing push member includes a guiding frame 407 arranged at the inner end of the downward pressing frame 404. The guiding frame 407 is a hook structure arranged downward. A guiding hole 309 is horizontally penetrated through the central position of the test slide 300. A trigger slide bar 304 is slidably arranged in the guiding hole 309. A trigger pin 305 for generating a thrust on the inclined surface of the guiding frame 407 is arranged at the inner end of the trigger slide bar 304. An adjusting screw rod 308 is threadedly arranged in the screw hole at the outer end of the trigger slide bar 304. The adjusting screw rod 308 is rotatably connected to the bearing frame 310 outside the test slide 300. A rotating handle 301 is fixedly arranged at the outer end of the adjusting screw rod 308. A limiting vertical plate 406 for limiting the sliding stroke of the test slide 300 is arranged inside the test box 100 to limit the final sliding position of the test slide 300. By driving the adjusting screw rod 308 to rotate relative to the trigger slide bar 304 through the rotating handle 301, under the action of the thread, the trigger slide bar 304 slides along the guiding hole 309, so that the trigger pin 305 generates power on the inclined surface of the guiding frame 407, and the downward pressing frame 404 obtains the power to move downward; A guide mechanism is provided between the test slide 300 and the test box 100, and the guide mechanism makes the horizontal movement of the test slide 300 more stable. The guide mechanism includes a guide bottom block 307 provided at the bottom of the test slide 300, and the guide bottom block 307 is provided close to the inner end of the test slide 300. A horizontal guide rod 306 is slidably provided in the guide bottom block 307, and both ends of the horizontal guide rod 306 are mounted on the inner wall of the test box 100, so that when the test slide 300 slides horizontally, the guide bottom block 307 can slide along the horizontal guide rod 306, thereby making the sliding stable; The hot air component includes a plurality of single-layer buffer boxes 201 symmetrically arranged on both sides of the test box 100, the air inlet end of each single-layer buffer box 201 is connected to a branch pipe 202, the branch pipe 202 is connected to an air guide pipe 206, the air guide pipe 206 is connected to a heating box 209, one of the air guide pipes 206 is provided with a circulating fan 210 for promoting air flow, the heating box 209 is provided with a heating pipe group for heating air, the heating box 209 is provided with a temperature sensor, and the surface of the heating box 209 is provided with a cooling component for cooling, so as to adjust the air flow temperature in the heating box 209, under the action of the heating component, the hot air inside the heating box 209 will be heated, under the action of the circulating fan 210, the hot air in the heating box 209 will enter the single-layer buffer box 201, and then form multiple layers of hot air in the test box 100, so that the hot air inside the test box 100 is more uniform, and the exhaust end of the single-layer buffer box 201 is provided with a uniform air grid, so that the air intake is more uniform, which is conducive to the accuracy of the test: The cooling component includes a heat dissipation fin 211 arranged on the heating surface of the heating box 209, a heat dissipation cover plate 207 is provided on the surface of the heating box 209 where the heat dissipation fin 211 is located, a water drop baffle 212 is provided on the top of the heat dissipation cover plate 207, and a plurality of water drop holes 213 are distributed on the water drop baffle plate 212. The bottom of the heat dissipation cover plate 207 is connected to the water cooling box 204 through a downflow pipe 205, and a coolant pump 203 is provided on the outside of the water cooling box 204. The output end of the coolant pump 203 is connected to the lower end of the water supply pipe 208, and the upper end of the water supply pipe 208 is connected to the air inlet at the upper end of the water drop baffle 212. The water suction end of the coolant pump 203 extends to the inside of the water cooling box 204. Under the action of the coolant pump 203, the water in the water cooling box 204 flows along the water supply pipe 208 into the top of the water drop baffle 212, and the water flows down along the water drop hole 213, and then takes away the heat on the surface of the heat dissipation fin 211, so as to achieve cooling; The heating box 209 is also provided with a humidifier to adjust the humidity of the air, and the heating box 209 is provided with a humidity sensor; In order to facilitate material removal and loading, an auxiliary card slot 312 is opened at the upper end of the test slide 300, and an auxiliary card seat 311 is arranged in the auxiliary card slot 312. The surface of the auxiliary card seat 311 is distributed with a plurality of guide grooves 302 for convenient placement of semiconductor chips, and a positioning groove 303 is provided at the bottom of the guide groove 302. The surface of the auxiliary card seat 311 is provided with a unloading groove 313 for convenient pulling away the auxiliary card seat 311. In this way, the auxiliary card seat 311 can be removed as a whole by tools, so as to quickly install or remove the test object, which helps to improve efficiency.

[0027] Working principle: In actual use, a plurality of semiconductor chips are placed in the positioning groove 303, and then the test slide 300 carrying the semiconductor chips is transferred to the test box 100, and then under the action of the heating component, the hot air inside the heating box 209 will be heated, and under the action of the circulating fan 210, the hot air in the heating box 209 will enter the single-layer cache box 201, and then form multiple layers of hot air in the test box 100, so that the hot air inside the test box 100 is more uniform, and the exhaust end of the single-layer cache box 201 is provided with an air-uniform grid, so that the air intake is more uniform, which is conducive to the accuracy of the test, and then the lower pressing frame 404 is driven to move downward by the pressing pusher, and the chip contact 405 at the lower end of the lower pressing frame 404 is inserted into the guide groove 302, and the contact at the end of the chip contact 405 is electrically connected to the semiconductor chip, so that its real-time data will be transmitted to the control panel 102, and its operating status will be acquired by the control panel 102, so as to acquire the use status of the semiconductor chip; After the test of the object on a single test slide 300 is completed, it is only necessary to drive the lower pressure frame 404 to move upward through the lower pressure pusher to release the contact state, and then pull the test slide 300 outward. When taking the material here, it still maintains a sealed state, and the inner cavity of the test box 100 is still isolated from the outside world, avoiding the overflow of high-temperature air inside, which is energy-saving and environmentally friendly.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip aging detection device, comprising a test box (100), wherein a plurality of legs (101) are provided at the bottom of the test box (100), a hot air component for providing hot air to the test box (100) is provided on the test box (100), and a control panel (102) is provided on the outside of the test box (100), characterized in that: The control panel (102) is provided with a touch display screen, the end of the test box (100) is provided with a plurality of horizontal through-holes, a test slide (300) is slidably arranged at each horizontal through-hole position, the end of the test box (100) is provided with a sealing clamp (103) matching the upper and lower end surfaces of the test slide (300), the lower end of the sealing clamp (103) is provided with a sealing gasket matching the test slide (300), the upper end of the test slide (300) is provided with a plurality of guide grooves (302) matching the semiconductor chip, each guide groove (302) is provided with a positioning groove (303), the positioning groove (303) can fix the bottom of the semiconductor chip, and the test box (100) is provided with a press-down contact component for electrically connecting to a single semiconductor chip.

2. The semiconductor chip aging detection device according to claim 1, characterized in that: The contact pressing component comprises a lower pressing frame (404) arranged above the test slide (300); a plurality of suspension rods are arranged at the lower end of the lower pressing frame (404); the lower ends of the suspension rods are connected to chip contacts (405); the chip contacts (405) match the guide grooves (302); the lower ends of the chip contacts (405) are provided with power connection terminals matching the contacts at the upper ends of the semiconductor chips; side rods (400) are symmetrically arranged on both sides of the lower pressing frame (404); the side rods (400) are slidably arranged on guide vertical rods (403); the guide vertical rods (403) are vertically fixed inside the test box (100); a positioning side ring (402) is fixedly arranged on the guide vertical rods (403) above the test slide (300); the positioning side ring (402) is connected to the side rods (400) via a reset spring (401); and a pressing pusher for driving the lower pressing frame (404) to press downward is arranged on the test slide (300).

3. The semiconductor chip aging detection device according to claim 2, characterized in that: The downward pressing pusher comprises a guide frame (407) arranged at the inner end of the downward pressing frame (404), the guide frame (407) being a bent hook structure arranged downward, a guide hole (309) being horizontally penetrated at the center position of the test slide (300), a trigger slide bar (304) being slidably arranged in the guide hole (309), a trigger pin (305) being arranged at the inner end of the trigger slide bar (304) for generating a thrust on the inclined surface of the guide frame (407), an adjusting screw (308) being threadedly arranged in a screw hole at the outer end of the trigger slide bar (304), the adjusting screw (308) being rotatably connected to a bearing frame (310) outside the test slide (300), a rotating handle (301) being fixedly arranged at the outer end of the adjusting screw (308), and a limiting vertical plate (406) for limiting the sliding stroke of the test slide (300) being arranged inside the test box (100).

4. The semiconductor chip aging detection device according to claim 1, characterized in that: A guide mechanism is provided between the test slide (300) and the test box (100), the guide mechanism comprising a guide bottom block (307) arranged at the bottom of the test slide (300), the guide bottom block (307) being arranged close to the inner end of the test slide (300), a horizontal guide rod (306) being slidably provided in the guide bottom block (307), and two ends of the horizontal guide rod (306) being mounted on the inner wall of the test box (100).

5. The semiconductor chip aging detection device according to claim 1, characterized in that: The hot air component comprises a plurality of single-layer buffer boxes (201) symmetrically arranged on both sides of the test box (100), the air inlet end of each single-layer buffer box (201) being connected to a branch pipe (202), the branch pipe (202) being connected to an air guide pipe (206), the air guide pipe (206) being connected to a heating box (209), one of the air guide pipes (206) being provided with a circulating fan (210) for promoting air flow, a heating pipe group for heating air being provided in the heating box (209), a temperature sensor being provided in the heating box (209), and a cooling component for cooling being provided on the surface of the heating box (209).

6. The semiconductor chip aging detection device according to claim 5, characterized in that: The cooling component comprises a heat dissipation fin (211) arranged on the heating surface of the heating box (209); a heat dissipation cover plate (207) is provided on the surface of the heating box (209) where the heat dissipation fin (211) is located; a water drop baffle (212) is provided on the top of the heat dissipation cover plate (207); a plurality of water drop holes (213) are distributed on the water drop baffle plate (212); the bottom of the heat dissipation cover plate (207) is connected to the water cooling box (204) through a downflow pipe (205); a coolant pump (203) is provided on the outside of the water cooling box (204); an output end of the coolant pump (203) is connected to the lower end of a water supply pipe (208); an upper end of the water supply pipe (208) is connected to an air inlet at the upper end of the water drop baffle plate (212); and a water suction end of the coolant pump (203) extends to the inside of the water cooling box (204).

7. The semiconductor chip aging detection device according to claim 5, characterized in that: A humidifier and a humidity sensor are also provided in the heating box (209).

8. The semiconductor chip aging detection device according to claim 1, characterized in that: An auxiliary card slot (312) is provided at the upper end of the test slide (300), an auxiliary card seat (311) is provided in the auxiliary card slot (312), a plurality of guide grooves (302) for facilitating the placement of semiconductor chips are distributed on the surface of the auxiliary card seat (311), a positioning groove (303) is provided at the bottom of the guide groove (302), and a discharge groove (313) is provided on the surface of the auxiliary card seat (311) for facilitating the removal of the auxiliary card seat (311).

9. A detection method for semiconductor chip aging detection equipment according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1: In actual use, a plurality of semiconductor chips are placed in the positioning grooves (303), and then the test slide (300) carrying the semiconductor chips is transferred to the test box (100). Then, under the action of the hot air component, the hot air inside the test box (100) is heated to a target state. Step 2: The lower pressing frame (404) is driven to move downward by the pressing pusher, and the chip contact (405) at the lower end of the lower pressing frame (404) is inserted into the guide groove (302). The contact point at the end of the chip contact (405) is electrically connected to the semiconductor chip, so that its real-time data is transmitted to the control panel (102), and its operating status is obtained by the control panel (102) so as to obtain the use status of the semiconductor chip; Step 3: Complete real-time testing of multiple semiconductor chips.

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