COB packaged Combo PON structure and packaging method thereof

Abstract

The invention discloses a COB (Chip On Board) packaged Combo PON (Passive Optical Network) structure and a packaging method thereof. The COB packaged Combo PON structure comprises a PCBA (Printed Circuit Board Assembly) board and a metal table, the metal table comprises a bearing table and a plurality of supporting columns arranged at the bottom of the bearing table. A first light emitting chip, a first collimating lens, a second light emitting chip, a second collimating lens, a wave combining plate, a first filter plate, a second filter plate, a converging lens and an optical fiber optical port are arranged on the bearing table according to a preset optical path; the first light emitting chip and the second light emitting chip are electrically connected with the PCBA board; a light receiving assembly is arranged on the PCBA board, the first filter is coupled with the light receiving assembly through the first through hole, and the second filter is coupled with the light receiving assembly through the second through hole. According to the COB packaged Combo PON structure, the coupling mounting process is reduced, the integration level is improved, the space is greatly saved, and the cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of communication technologies, and particularly to a COB-packaged Combo PON structure and its packaging method. Background Art

[0002] Common packaging methods for optical devices include TO packaging, COB packaging, and BOX packaging. Since the Combo PON optical device structure includes optical paths corresponding to a total of four optical chips, two for transmission and two for reception, and the four optical paths involve spatial light or optical path coupling in the three-dimensional direction, while the COB packaging method is generally used to package optical devices with optical paths in the same plane or the same direction. Therefore, currently common Combo PON packaging structures include: one is to use TO packaging, that is, first package the four optical chips into TO optical components respectively, and then install and fix these four discrete TO optical components on a metal part to form a Combo PON device. Additionally, to meet the miniaturization requirements, Combo PON often adopts a BOX packaging structure, that is, directly integrating the four optical chips in a box packaging. Summary of the Invention

[0003] In order to enrich the product types of Combo PON structure devices, simplify the structure of Combo PON structure devices, and reduce the manufacturing cost of Combo PON structure devices, embodiments of the present invention provide a COB-packaged Combo PON structure and its packaging method.

[0004] In a first aspect, embodiments of the present invention provide a COB-packaged Combo PON structure, including a PCBA board and a metal stage;

[0005] The metal stage includes a carrier stage and a plurality of support columns arranged at the bottom of the carrier stage;

[0006] The bottoms of the plurality of support columns are fixed to the PCBA board;

[0007] On the carrier stage, a first optical emission chip, a first collimating lens, a second optical emission chip, a second collimating lens, a multiplexer, a first filter, a second filter, a converging lens, and an optical fiber optical port are arranged according to a preset optical path;

[0008] The first optical emission chip and the second optical emission chip are electrically connected to the PCBA board;

[0009] An optical receiving component is arranged on the PCBA board. The carrier stage is provided with a first through hole and a second through hole. The first filter is coupled to the optical receiving component through the first through hole, and the second filter is coupled to the optical receiving component through the second through hole.

[0010] In one or some alternative embodiments, the emitting end of the first optical emission chip is aligned with the first collimating lens;

[0011] The emitting end of the second optical emission chip is aligned with the second collimating lens;

[0012] A first preset angle is formed between the first collimating lens and the second collimating lens, and the multiplexer is disposed on the angular bisector of the angle formed between the first collimating lens and the second collimating lens.

[0013] In one or some alternative embodiments, the first filter, the second filter, the converging lens, and the fiber optic port are sequentially disposed on the optical emission direction of the first optical emission chip and are sequentially coupled.

[0014] In one or some alternative embodiments, the first filter and the second filter respectively form an angle of a second preset angle with the carrier stage.

[0015] In one or some alternative embodiments, a lens assembly is disposed in the carrier stage;

[0016] The lens assembly includes a first lens and a second lens;

[0017] The first lens is disposed in the first through hole;

[0018] The second lens is disposed in the second through hole;

[0019] The optical receiving assembly includes a first optical receiving chip and a second optical receiving chip;

[0020] The first filter, the first lens, and the first optical receiving chip are sequentially coupled;

[0021] The second filter, the second lens, and the second optical receiving chip are sequentially coupled.

[0022] In one or some alternative embodiments, the COB-packaged Combo PON structure further includes a first adapter circuit board and a second adapter circuit board;

[0023] The first optical emission chip and the second optical emission chip are disposed on two adjacent edges of the carrier stage;

[0024] The first adapter circuit board and the second adapter circuit board stand upright on the PCBA board and are closely attached to the side surface of the carrier stage;

[0025] The first adapter circuit board is electrically connected to the PCBA board and the first optical emission chip respectively;

[0026] The second adapter circuit board is electrically connected to the PCBA board and the second light emitting chip respectively.

[0027] In a second aspect, an embodiment of the present invention provides a packaging method for the COB packaged Combo PON structure according to the first aspect, comprising:

[0028] After coupling the converging lens with the optical fiber port, fix them to the corresponding position of the carrier platform;

[0029] Mounting the wave combiner, the first filter and the second filter on the carrier in sequence;

[0030] Mounting the light receiving assembly on the PCBA board and electrically connecting the PCBA board;

[0031] Moving the metal stage, coupling the first filter and the second filter to the light receiving component respectively, and then fixing a plurality of support columns of the metal stage to the PCBA board;

[0032] Mounting the first light emitting chip and the second light emitting chip on the carrier respectively, and electrically connecting them to the PCBA board;

[0033] After coupling the first collimating lens to the first light emitting chip, the first collimating lens is fixed to the corresponding position of the supporting platform; and after coupling the second collimating lens to the second light emitting chip, the second collimating lens is fixed to the corresponding position of the supporting platform.

[0034] In one or some optional embodiments, the step of coupling the converging lens with the optical fiber port and fixing the converging lens to a corresponding position of the supporting platform comprises:

[0035] Placing a beam quality analyzer on the side of the converging lens facing away from the optical fiber port, inputting light from the optical fiber port, and measuring the spot parameters of the light emitted to the beam quality analyzer after being de-collimated by the converging lens;

[0036] Move the converging lens and monitor the spot parameters measured by the beam quality analyzer until the parallel light index is met, and then determine the corresponding position as the coupling target position of the converging lens;

[0037] The converging lens is fixed at a coupling target position on the supporting platform.

[0038] In one or some optional embodiments, the movable metal stage, after coupling the first filter and the second filter with the light receiving component respectively, fixes a plurality of support columns of the metal stage to the PCBA board, including:

[0039] Fixing the first lens to the first through hole, and fixing the second lens to the second through hole;

[0040] Power on the PCBA board to make the first optical receiving chip and the second optical receiving chip work, and input light corresponding to the receiving wavelengths of the first optical receiving chip and the second optical receiving chip from the fiber optic port, so that after the light is reversely collimated by the converging lens, it is reflected by the first filter and the second filter to the first optical receiving chip and / or the second optical receiving chip respectively;

[0041] Move the metal stage and monitor the responsivities of the first optical receiving chip and the second optical receiving chip until the responsivities of both the first optical receiving chip and the second optical receiving chip reach the first preset range, and fix the metal stage at the corresponding position on the PCBA board.

[0042] In one or some alternative embodiments, after coupling the first collimating lens with the first optical transmitting chip and fixing it to the corresponding position on the carrier stage, and after coupling the second collimating lens with the second optical transmitting chip and fixing it to the corresponding position on the carrier stage, it includes:

[0043] Power on the first optical transmitting chip, move the position of the first collimating lens, and measure the optical power output from the fiber optic port until the optical power reaches the second preset range, and fix the first collimating lens at the corresponding position on the carrier stage;

[0044] Power on the second optical transmitting chip, move the position of the second collimating lens, and measure the optical power output from the fiber optic port until the optical power reaches the third preset range, and fix the second collimating lens at the corresponding position on the carrier stage.

[0045] The beneficial effects of the above technical solutions provided in the embodiments of the present invention at least include:

[0046] The Combo PON structure of the COB package provided in the embodiments of the present invention integrates optical path components such as the first optical transmitting chip, the first collimating lens, the second optical transmitting chip, the second collimating lens, the multiplexer, the first filter, and the second filter on the carrier stage, and first through holes and second through holes are provided inside the carrier stage, so that the first filter can be coupled with the optical receiving component through the first through hole, and the second filter can be coupled with the optical receiving component through the second through hole, thereby realizing three-dimensional optical transmission. Different from the traditional packaging method of separately coupling four TO lenses and then mounting them all on the PCBA board, the optical receiving component is directly packaged on the PCBA board of the backend product, reducing the coupling and mounting processes, improving the integration degree, greatly saving space, being beneficial to the miniaturization of the structure, and at the same time, effectively reducing the cost.

[0047] Other features and advantages of the present invention will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of the present invention. The objectives and other advantages of the present invention may be realized and attained by the structure particularly pointed out in the written description and the drawings.

[0048] The technical solutions of the present invention will be further described in detail below with reference to the drawings and embodiments. Description of the Drawings

[0049] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0050] Figure 1 It is a schematic side structure diagram of the Combo PON structure with COB packaging provided in the embodiment of the present invention;

[0051] Figure 2 It is a schematic top structure diagram of the Combo PON structure with COB packaging provided in the embodiment of the present invention.

[0052] Reference Signs

[0053] 1, PCBA board; 11, circuit board bonding area; 2, metal platform; 21, carrier platform; 211, first through hole; 212, second through hole; 22, support column; 31, first optical emission chip; 32, second optical emission chip; 41, first collimating lens; 42, second collimating lens; 43, converging lens; 44, first lens; 45, second lens; 51, wavelength multiplexer; 52, first filter; 53, second filter; 6, fiber optic port; 71, first optical receiving chip; 72, second optical receiving chip. Detailed Embodiments

[0054] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0055] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "far", "near", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0056] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0057] The inventors found that the TO-packaged Combo PON device has a large volume, and the production coupling process is numerous and the efficiency is not high. Although the BOX-packaged Combo PON device has a smaller volume, due to the materials and processes of the BOX package itself, the cost is relatively high.

[0058] In addition, in practical applications, the TO-packaged and BOX-packaged Combo PON devices need to be welded and fixed on the PCBA board of backend products such as optical network terminals, so generally a relatively large space needs to be reserved on the circuit board.

[0059] Based on this, the embodiments of the present invention provide a COB-packaged Combo PON structure and its packaging method, which will be described in detail through specific embodiments below.

[0060] Embodiment 1

[0061] The embodiments of the present invention provide a COB-packaged Combo PON structure. Referring to Figure 1 and Figure 2 as shown, it includes a PCBA board 1 and a metal platform 2;

[0062] The metal platform 2 includes a bearing platform 21 and a plurality of support columns 22 arranged at the bottom of the bearing platform 21;

[0063] The bottoms of the plurality of support columns 22 are fixed to the PCBA board 1;

[0064] On the carrier stage 21, a first optical emission chip 31, a first collimating lens 41, a second optical emission chip 32, a second collimating lens 42, a wavelength multiplexer 51, a first filter 52, a second filter 53, a converging lens 43, and an optical fiber port 6 are arranged according to a preset optical path.

[0065] The first optical emission chip 31 and the second optical emission chip 32 are electrically connected to the PCBA board 1.

[0066] An optical receiving component is arranged on the PCBA board 1. The carrier stage 21 is provided with a first through hole 211 and a second through hole 212. The first filter 52 is coupled to the optical receiving component through the first through hole 211, and the second filter 53 is coupled to the optical receiving component through the second through hole 212.

[0067] In the embodiment of the present invention, referring to Figure 1 and Figure 2 As shown, the optical receiving component includes a first optical receiving chip 71 and a second optical receiving chip 72, which are respectively used for receiving optical signal of corresponding wavelengths. Specifically, the support posts 22 are arranged at the bottom edge of the carrier stage 21 to support the carrier stage 21 above the PCBA board 1, so that there is a certain spatial distance between the bottom of the carrier stage 21 and the upper surface of the PCBA board 1. The first filter 52, the first through hole 211, and the first optical receiving chip 71 correspond to each other, so that the light transmitted or reflected by the first filter 52 can pass through the first through hole 211 and shoot towards the first optical receiving chip 71, realizing the coupling between the first filter 52 and the first optical receiving chip 71. Similarly, the second filter 53, the second through hole 212, and the second optical receiving chip 72 correspond to each other, so that the light transmitted or reflected by the second filter 53 can pass through the second through hole 212 and shoot towards the second optical receiving chip 72, realizing the coupling between the second filter 53 and the second optical receiving chip 72.

[0068] In the embodiment of the present invention, the first optical emission chip 31 and the second optical emission chip 32 are respectively used for emitting signal lights of different wavelengths. The first collimating lens 41 is used for converting the signal light emitted by the first optical emission chip 31 from a divergent light into a parallel light, and the second collimating lens 42 is used for converting the signal light emitted by the second optical emission chip 32 from a divergent light into a parallel light. The wavelength multiplexer 51 is arranged between the first collimating lens 41 and the second collimating lens 42, and is used for transmitting or reflecting the two collimated signal lights and guiding the two signal lights to the same transmission path. The first filter 52 and the second filter 53 are used for filtering the signal light, that is, selectively transmitting, reflecting, or blocking lights of different wavelengths, so as to control the transmission of the signal light. The converging lens 43 is used for converging the signal light to the optical fiber port 6.

[0069] In the embodiment of the present invention, the surfaces of the first filter 52 and the second filter 53 close to the optical fiber port 6 are reflective surfaces, which are used to reflect the signal light to the first optical receiving chip 71 and the second optical receiving chip 72.

[0070] In an alternative embodiment, a lens assembly is provided inside the carrier 21. Specifically, referring to Figure 1 and Figure 2 as shown, the lens assembly includes a first lens 44 and a second lens 45. The first lens 44 is disposed in the first through hole 211, and the second lens 45 is disposed in the second through hole 212. The first lens 44 is used to converge the signal light reflected by the first filter 52 to the first optical receiving chip 71, and the second lens 45 is used to converge the signal light reflected by the second filter 53 to the second optical receiving chip 72, so as to realize the sequential coupling of the first filter 52, the first lens 44 and the first optical receiving chip 71, and the sequential coupling of the second filter 53, the second lens 45 and the second optical receiving chip 72.

[0071] In the embodiment of the present invention, the preset optical path is a complex optical path system, which integrates the optical paths corresponding to four optical chips of two receivers and two transmitters. The four optical paths involve the coupling of spatial light or the optical paths in the three-dimensional direction, and can realize the effective transmission and processing of light.

[0072] For the light emitting part of the preset optical path, two independent optical emitting chips are provided, namely, the first optical emitting chip 31 and the second optical emitting chip 32. Specifically, referring to Figure 1 and Figure 2 as shown:

[0073] (1) The signal light emitted by the first optical emitting chip 31 first undergoes the collimation effect of the first collimating lens 41, so that the signal light becomes parallel light. After passing through the wavelength multiplexer 51, the parallel light continues to pass through the first filter 52 and the second filter 53. After filtering out the unnecessary wavelength components through the first filter 52 and the second filter 53, finally, through the focusing effect of the focusing lens 43, the light is converged to the optical fiber port 6 for output;

[0074] (2) The signal light emitted by the second optical emitting chip 32 first undergoes the collimation effect of the second collimating lens 42, so that the signal light becomes parallel light. The parallel light reaches the wavelength multiplexer 51 and is reflected by the wavelength multiplexer 51 to the first filter 52, so as to guide the light of the second optical emitting chip 32 to the same output path as the first optical emitting chip 31. Then it continues to pass through the first filter 52 and the second filter 53. After filtering out the unnecessary wavelength components through the first filter 52 and the second filter 53, finally, through the focusing effect of the focusing lens 43, the light is converged to the optical fiber port 6 for output.

[0075] The light receiving part of the preset optical path is equipped with two independent light receiving chips, namely, the first light receiving chip 71 and the second light receiving chip 72, which also have the ability to process two independent optical paths. Taking the first received light and the second received light input through the fiber optic port 6 as an example, specifically, referring to Figure 1 and Figure 2 as shown:

[0076] (1) When the first received light is input from the fiber optic port 6, the signal light first undergoes the reverse collimation effect of the converging lens 43 and is restored to divergent light. Subsequently, the divergent signal light passes through the second filter 53 and is reflected by the first filter 52. The reflected signal light is then focused by the first lens 44 and finally converges to the first light receiving chip 71 on the PCBA board 1.

[0077] (2) When the second received light is input from the fiber optic port 6, the signal light first undergoes the reverse collimation effect of the converging lens 43 and is restored to divergent light. Subsequently, the divergent signal light is reflected by the second filter 53. The reflected signal light is then focused by the second lens 45 and finally converges to the second light receiving chip 72 on the PCBA board 1.

[0078] In the embodiment of the present invention, according to the preset optical path, the installation positions of each optical path element such as the first light emitting chip 31, the first collimating lens 41, the second light emitting chip 32, the second collimating lens 42, and the multiplexer 51 are determined and installed.

[0079] In an alternative embodiment, referring to Figure 1 and Figure 2 as shown, the first light emitting chip 31 and the first collimating lens 41 are coaxial, and the emitting end of the first light emitting chip 31 is aligned with the first collimating lens 41. Similarly, the second light emitting chip 32 and the second collimating lens 42 are coaxial, and the emitting end of the second light emitting chip 32 is aligned with the second collimating lens 42, so as to ensure that the signal light emitted by the first light emitting chip 31 becomes parallel light after passing through the first collimating lens 41, and the signal light emitted by the second light emitting chip 32 becomes parallel light after passing through the second collimating lens 42.

[0080] In an alternative embodiment, referring to Figure 1 and Figure 2As shown, the first optical emission chip 31 and the second optical emission chip 32 are respectively disposed at two adjacent edges of the carrier 21, so that the optical emission directions of the first optical emission chip 31 and the second optical emission chip 32 are perpendicular to each other. Further, a 90° angle is formed between the first collimating lens 41 and the second collimating lens 42, and the multiplexer 51 is disposed on the angular bisector of the angle between the first collimating lens 41 and the second collimating lens 42, and forms a 45° angle with the optical emission directions of the first optical emission chip 31 and the second optical emission chip 32 respectively. The wavelength of the signal light emitted by the first collimating lens 41 corresponds to the transmission range of the multiplexer 51 and can pass through the multiplexer 51 and be incident on the first filter 52. The wavelength of the signal light emitted by the second collimating lens 42 corresponds to the reflection range of the multiplexer 51 and can be reflected by the multiplexer 51 to the first filter 52. Therefore, the signal light emitted by the first collimating lens 41 and the signal light emitted by the second collimating lens 42 can be guided by the multiplexer 51 to the same transmission path.

[0081] In an alternative embodiment, referring to Figure 1 and Figure 2 As shown, the first filter 52, the second filter 53, the focusing lens 43 and the fiber optic port 6 are sequentially disposed on the optical emission direction of the first optical emission chip 31 and are sequentially coupled. The signal light emitted by the first collimating lens 41 and the signal light emitted by the second collimating lens 42 can be guided by the multiplexer 51 to the first filter 52, and sequentially pass through the first filter 52 and the second filter 53. After the unnecessary wavelength components are filtered out by the first filter 52 and the second filter 53, finally, through the focusing action of the focusing lens 43, the light is focused on the fiber optic port 6 for output.

[0082] In an alternative embodiment, referring to Figure 1 and Figure 2 As shown, the first optical receiving chip 71 and the second optical receiving chip 72 are disposed on the PCBA board 1 below the carrier 21. In order to enable the reflecting surfaces of the first filter 52 and the second filter 53 to reflect the signal light to the first optical receiving chip 71 and the second optical receiving chip 72, the first filter 52 and the second filter 53 respectively form an angle of a second preset angle with the carrier 21. Specifically, since the input directions of the fiber optic port 6 are perpendicular to the optical receiving directions of the first optical receiving chip 71 and the second optical receiving chip 72 respectively, the second preset angle is 45°.

[0083] In an alternative embodiment, the COB-packaged Combo PON structure further includes a first adapter circuit board (not shown in the figure) and a second adapter circuit board (not shown in the figure), which are used to electrically connect the first optical emission chip 31 and the second optical emission chip 32 to the PCBA board 1 respectively. Specifically, the first optical emission chip 31 and the second optical emission chip 32 are disposed on two adjacent edges of the carrier 21 and are perpendicular to each other. The first adapter circuit board and the second adapter circuit board stand upright on the PCBA board 1 and are respectively close to the corresponding side surfaces of the carrier 21. The first adapter circuit board electrically connects the PCBA board 1 and the first optical emission chip 31 respectively, and the second adapter circuit board electrically connects the PCBA board 1 and the second optical emission chip 32 respectively, thereby realizing the electrical connection between the first optical emission chip 31 and the second optical emission chip 32 and the PCBA board 1.

[0084] Specifically, referring to Figure 1 and Figure 2 as shown, two circuit board bonding areas 11 are provided on the PCBA board 1, and the first adapter circuit board and the second adapter circuit board stand upright in the corresponding circuit board bonding areas 11 respectively. Moreover, the first optical emission chip 31 is electrically connected to the first adapter circuit board through a gold wire, and the second optical emission chip 32 is electrically connected to the second adapter circuit board through a gold wire, and then is electrically connected to the PCBA board 1 through the first adapter circuit board and the first adapter circuit board respectively.

[0085] The inventors found that the existing Combo PON structure packaged by the TO packaging method has the following problems:

[0086] (1) Relatively large volume. Since the TO packaging requires four optical chips to be respectively packaged into independent TO optical components and these components are installed on a metal part, the volume of the entire Combo PON structure is relatively large, which is not conducive to miniaturization and integration.

[0087] (2) High assembly complexity. The assembly process of TO packaging is relatively complex and requires precise installation and fixation of multiple discrete components, which increases the manufacturing cost and manufacturing time, and may also affect the reliability and stability of the device.

[0088] (3) Poor heat dissipation performance. Since the TO packaged device has a relatively large volume and contains multiple discrete components, it is difficult to dissipate heat, which may cause the device temperature to rise, thereby affecting its performance and lifespan.

[0089] The Combo PON structure with COB packaging provided by the embodiments of the present invention encapsulates the first optical emission chip 31 and the second optical emission chip 32 on the metal stage 2, and directly encapsulates the first optical reception chip 71 and the second optical reception chip 72 on the PCBA board 1 of the backend product. Cooperating with other optical path components on the carrier stage 21 and the PCBA board 1, it realizes the optical path coupling of four optical paths in the three-dimensional direction, thereby realizing the Combo PON structure encapsulated by the COB packaging method. Compared with the combopon structure with TO packaging, it is not necessary to separately package four optical chips into independent TO optical components and install them together on a metal part, reducing the mounting process, saving manufacturing costs and manufacturing time. Moreover, since the metal stage 2 is closely connected to the PCBA board 1, the integration degree of the optical path components is greatly improved, which is beneficial to miniaturization. The optical path components on the metal stage 2 and the PCBA board 1 are simple and orderly, with a small volume, reducing the difficulty of heat dissipation, effectively improving the heat dissipation performance, and being beneficial to extending the service life.

[0090] In addition, for the existing Combo PON structure with BOX packaging, although it can meet the miniaturization requirements, it is necessary to directly integrate four optical chips in a compact packaging box. The manufacturing process is relatively complex, the manufacturing cost is high, and the price of the packaging box with BOX packaging is also high, further increasing the material cost. However, for the Combo PON structure with COB packaging provided by the embodiments of the present invention, adopting the COB packaging method, no separate packaging box is required, and the optical chips and other optical path components are directly packaged on the metal stage 2 or the PCBA board 1 of the backend product, with both the manufacturing cost and the material cost being relatively low, which is beneficial to improving the economic benefits.

[0091] The inventor also found that whether it is the Combo PON structure with TO packaging or the Combo PON structure with BOX packaging, a certain space needs to be reserved on the circuit board to accommodate the Combo PON structure device, which is not conducive to miniaturization. In electronic devices with limited space, it may become a limiting factor. However, for the Combo PON structure with COB packaging provided by the embodiments of the present invention, the optical chips and other optical path components are directly packaged on the metal stage 2 or the PCBA board 1 of the backend product, effectively improving the integration degree, saving space, having a simple product structure, greatly saving the coupling production process, and reducing the cost.

[0092] The Combo PON structure with COB packaging provided by the embodiments of the present invention integrates optical path components such as a first optical emission chip 31, a first collimating lens 41, a second optical emission chip 32, a second collimating lens 42, a wavelength multiplexer 51, a first filter 52, and a second filter 53 on a carrier 21, and first through holes 211 and second through holes 212 are arranged inside the carrier 21, so that the first filter 52 can be coupled with an optical receiving component through the first through hole 211, and the second filter 53 can be coupled with the optical receiving component through the second through hole 212, thereby realizing three-dimensional optical transmission. Different from the traditional packaging method of respectively coupling four TO lenses and then mounting them all on the PCBA board 1, the optical receiving component is directly packaged on the PCBA board 1 of the backend product, reducing the coupling and mounting processes, improving the integration degree, greatly saving space, facilitating the miniaturization of the structure, and at the same time effectively reducing the cost.

[0093] Embodiment 2

[0094] Based on the same inventive concept, the embodiments of the present invention further provide a packaging method for the Combo PON structure with COB packaging described in Embodiment 1, including:

[0095] S101: After coupling the converging lens 43 with the fiber optic port 6, fix it to the corresponding position on the carrier 21;

[0096] S102: Mount the wavelength multiplexer 51, the first filter 52, and the second filter 53 on the carrier 21 in sequence;

[0097] S103: Mount the optical receiving component on the PCBA board 1 and electrically connect to the PCBA board 1;

[0098] S104: Move the metal stage 2, after coupling the first filter 52 and the second filter 53 with the optical receiving component respectively, fix the multiple support columns 22 of the metal stage 2 to the PCBA board 1;

[0099] S105: Mount the first optical emission chip 31 and the second optical emission chip 32 on the carrier 21 respectively and electrically connect to the PCBA board 1;

[0100] S106: After coupling the first collimating lens 41 with the first optical emission chip 31, fix it to the corresponding position on the carrier 21, and after coupling the second collimating lens 42 with the second optical emission chip 32, fix it to the corresponding position on the carrier 21.

[0101] In the embodiments of the present invention, for step S101: After coupling the converging lens 43 with the fiber optic port 6, fix it to the corresponding position on the carrier 21, it may specifically include:

[0102] Place the beam quality analyzer on the side of the converging lens 43 facing away from the fiber optic port 6, input light from the fiber optic port 6, and measure the spot parameters of the light after being anti-collimated by the converging lens 43 and directed towards the beam quality analyzer;

[0103] Move the converging lens 43 and monitor the spot parameters measured by the beam quality analyzer until the collimated light index is satisfied, then determine the corresponding position as the coupling target position of the converging lens 43;

[0104] Fix the converging lens 43 at the coupling target position on the carrier 21.

[0105] In the embodiment of the present invention, step S102: Mount the multiplexer 51, the first filter 52, and the second filter 53 on the carrier 21 in sequence, which may specifically include:

[0106] Mount the multiplexer 51, the first filter 52, and the second filter 53 on the carrier 21 in sequence according to the positions of the optical path components in the preset optical path, and ensure that the first filter 52 and the second filter 53 form an angle of 45° with the surface of the carrier 21.

[0107] In the embodiment of the present invention, step S103: Mount the optical receiving component on the PCBA board 1 and electrically connect it to the PCBA board 1, which may specifically include:

[0108] Mount the first optical receiving chip 71 and the second optical receiving chip 72 on the PCBA board 1 and electrically connect them to the PCBA board 1.

[0109] In the embodiment of the present invention, step S104: Move the metal stage 2, couple the first filter 52 and the second filter 53 with the optical receiving component respectively, and then fix the plurality of support columns 22 of the metal stage 2 on the PCBA board 1, which may specifically include:

[0110] Fix the first lens 44 in the first through hole 211 and fix the second lens 45 in the second through hole 212;

[0111] Apply power to the PCBA board 1 to make the first optical receiving chip 71 and the second optical receiving chip 72 work, and input light corresponding to the receiving wavelengths of the first optical receiving chip 71 and the second optical receiving chip 72 from the fiber optic port 6, so that after the light is anti-collimated by the converging lens 43, it is reflected by the first filter 52 and the second filter 53 to the first optical receiving chip 71 and / or the second optical receiving chip 72 respectively;

[0112] Move the metal stage 2 and monitor the responsivities of the first optical receiving chip 71 and the second optical receiving chip 72 until the responsivities of both the first optical receiving chip 71 and the second optical receiving chip 72 reach the first preset range, and then fix the metal stage 2 at the corresponding position on the PCBA board 1.

[0113] In the embodiment of the present invention, step S105: Mount the first optical transmitting chip 31 and the second optical transmitting chip 32 on the carrier stage 21 respectively and electrically connect them to the PCBA board 1, which may specifically include:

[0114] Mount the first optical transmitting chip 31 and the second optical transmitting chip 32 on two edges of the carrier stage 21 respectively;

[0115] Fix the first adapter circuit board and the second adapter circuit board to the corresponding circuit board bonding areas on the PCBA board 1;

[0116] Electrically connect the first optical transmitting chip 31 to the first adapter circuit board through a gold wire, electrically connect the second optical transmitting chip 32 to the second adapter circuit board through a gold wire, and then electrically connect the first optical transmitting chip 31 and the second optical transmitting chip 32 to the PCBA board 1 through the first adapter circuit board and the first adapter circuit board respectively.

[0117] In the embodiment of the present invention, step S106: After coupling the first collimating lens 41 with the first optical transmitting chip 31, fix it at the corresponding position on the carrier stage 21, and after coupling the second collimating lens 42 with the second optical transmitting chip 32, fix it at the corresponding position on the carrier stage 21, which may specifically include:

[0118] Apply power to the first optical transmitting chip 31, move the position of the first collimating lens 41, and measure the optical power output from the optical fiber optical port 6 until the optical power reaches the second preset range, and then fix the first collimating lens 41 at the corresponding position on the carrier stage 21;

[0119] Apply power to the second optical transmitting chip 32, move the position of the second collimating lens 42, and measure the optical power output from the optical fiber optical port 6 until the optical power reaches the third preset range, and then fix the second collimating lens 42 at the corresponding position on the carrier stage 21.

[0120] The packaging method of the COB packaged Combo PON structure provided in the embodiment of the present invention first couples and fixes the converging lens 43 close to the optical fiber port 6, then mounts the wave combiner 51, the first filter 52, the second filter 53 and other components required to realize the optical path, and directly couples and fixes the metal stage 2 to the PCBA board 1 by coupling the responsivity of the two light receiving chips on the PCBA board 1, and finally separately mounts the two light emitting chips, and electrically connects the two light emitting chips to the PCBA board 11 through the adapter circuit board, and finally separately couples the collimating lens corresponding to the light emitting chip. Since the coupling and mounting are respectively performed on the metal stage 2 and the PCBA board 1, and the metal stage 2 is directly coupled and fixed to the PCBA board 1 by coupling the responsivity of the two light receiving chips on the PCBA board 1, the coupling and fixing process is simple and the production efficiency is high.

[0121] The packaging method of the COB packaged Combo PON structure provided in the embodiment of the present invention fixes the metal stage 2 on the PCBA board 1, and then directly mounts and couples the optical transmission chip on the fixed metal stage 2, which is beneficial to improving the coupling power of the transmitting end. Compared with the conventional method of first coupling the optical transmission chip, then mounting other components, and then coupling with the optical receiving chip, the coupling difficulty is reduced, the mounting process is reduced, and the problem of complex coupling affecting the coupling power of the optical transmission chip and causing the coupling power to drop can be effectively solved.

[0122] Obviously, various changes and modifications may be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention. The present disclosure is not limited to the precise structure described above and shown in the accompanying drawings, and various changes and modifications may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims. Thus, if these changes and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these changes and modifications.

Claims

1. A COB packaged Combo PON structure, characterized in that: Including PCBA board and metal table; The metal platform includes a carrying platform and a plurality of supporting columns arranged at the bottom of the carrying platform; The bottoms of the plurality of support columns are fixed to the PCBA board; The support platform is provided with a first light emitting chip, a first collimating lens, a second light emitting chip, a second collimating lens, a wave combining plate, a first filter, a second filter, a converging lens and an optical fiber port according to a preset optical path; The first light emitting chip and the second light emitting chip are electrically connected to the PCBA board; The PCBA board is provided with a light receiving component, the carrier platform is provided with a first through hole and a second through hole, the first filter is coupled to the light receiving component through the first through hole, and the second filter is coupled to the light receiving component through the second through hole.

2. The COB packaged Combo PON structure according to claim 1, characterized in that: The emitting end of the first light emitting chip is aligned with the first collimating lens; The emission end of the second light emitting chip is aligned with the second collimating lens; An included angle of a first preset angle is formed between the first collimating lens and the second collimating lens, and the wave combiner is arranged on the bisector of the included angle between the first collimating lens and the second collimating lens.

3. The COB packaged Combo PON structure according to claim 1, characterized in that: The first filter, the second filter, the converging lens and the optical fiber port are sequentially arranged in the light emitting direction of the first light emitting chip and are coupled in sequence.

4. The COB packaged Combo PON structure according to claim 3, characterized in that: The first filter plate and the second filter plate respectively form an included angle of a second preset angle with the supporting platform.

5. The COB packaged Combo PON structure according to claim 1, characterized in that: A lens assembly is arranged in the carrying platform; The lens assembly includes a first lens and a second lens; The first lens is disposed in the first through hole; The second lens is disposed in the second through hole; The light receiving assembly includes a first light receiving chip and a second light receiving chip; The first filter, the first lens and the first light receiving chip are coupled in sequence; The second filter, the second lens and the second light receiving chip are coupled in sequence.

6. The COB packaged Combo PON structure according to claim 1, characterized in that: Also includes a first adapter circuit board and a second adapter circuit board; The first light emitting chip and the second light emitting chip are disposed on two adjacent edges of the supporting platform; The first adapter circuit board and the second adapter circuit board are erected on the PCBA board and are closely attached to the side surface of the carrying platform; The first adapter circuit board is electrically connected to the PCBA board and the first light emitting chip respectively; The second adapter circuit board is electrically connected to the PCBA board and the second light emitting chip respectively.

7. A packaging method for a COB packaged Combo PON structure according to any one of claims 1 to 6, characterized in that: include: After coupling the converging lens with the optical fiber port, fix them to the corresponding position of the carrier platform; Mounting the wave combiner, the first filter and the second filter on the carrier in sequence; Mounting the light receiving assembly on the PCBA board and electrically connecting the PCBA board; Moving the metal stage, coupling the first filter and the second filter to the light receiving component respectively, and then fixing a plurality of support columns of the metal stage to the PCBA board; Mounting the first light emitting chip and the second light emitting chip on the carrier respectively, and electrically connecting them to the PCBA board; After coupling the first collimating lens to the first light emitting chip, the first collimating lens is fixed to the corresponding position of the supporting platform; and after coupling the second collimating lens to the second light emitting chip, the second collimating lens is fixed to the corresponding position of the supporting platform.

8. The packaging method of the COB packaged Combo PON structure according to claim 7, characterized in that: After coupling the converging lens with the optical fiber port, fixing them to the corresponding position of the supporting platform includes: Placing a beam quality analyzer on the side of the converging lens facing away from the optical fiber port, inputting light from the optical fiber port, and measuring the spot parameters of the light emitted to the beam quality analyzer after being de-collimated by the converging lens; Move the converging lens and monitor the spot parameters measured by the beam quality analyzer until the parallel light index is met, and then determine the corresponding position as the coupling target position of the converging lens; The converging lens is fixed at a coupling target position on the supporting platform.

9. The packaging method of the COB packaged Combo PON structure according to claim 7, characterized in that: The movable metal stage, after coupling the first filter and the second filter with the light receiving component respectively, fixes a plurality of support columns of the metal stage to the PCBA board, comprises: Fixing the first lens to the first through hole, and fixing the second lens to the second through hole; Power on the PCBA board to operate the first light receiving chip and the second light receiving chip, and input light corresponding to the receiving wavelengths of the first light receiving chip and the second light receiving chip from the optical fiber port, so that the light is reversely collimated by the converging lens and then reflected by the first filter and the second filter to the first light receiving chip and / or the second light receiving chip respectively; The metal stage is moved and the responsiveness of the first light receiving chip and the second light receiving chip is monitored until the responsiveness of the first light receiving chip and the second light receiving chip both reach a first preset range, and the metal stage is fixed to a corresponding position of the PCBA board.

10. The packaging method of the COB packaged Combo PON structure according to claim 7, characterized in that: The method of coupling the first collimating lens with the first light emitting chip and fixing them to the corresponding position of the carrier platform, and coupling the second collimating lens with the second light emitting chip and fixing them to the corresponding position of the carrier platform comprises: Powering on the first light emitting chip, moving the position of the first collimating lens, measuring the optical power output from the optical fiber port until the optical power reaches a second preset range, and fixing the first collimating lens at a corresponding position of the carrier platform; The second light emitting chip is powered on, the position of the second collimating lens is moved, the optical power output from the optical fiber port is measured until the optical power reaches a third preset range, and the second collimating lens is fixed to the corresponding position of the carrier.

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