Control method, device, equipment and computer storage medium for chip sealing and testing shrapnel

Abstract

The present application discloses a control method, device, equipment and computer storage medium for a chip sealing and testing shrapnel, which relates to the technical field of chip sealing and testing shrapnel, and is applied to a control device for a chip sealing and testing shrapnel including an environmental collector and a pressure controller. The control method obtains shrapnel status information collected by the environmental collector, and the shrapnel status information includes pressure information and communication connection information of the chip sealing and testing shrapnel; a shrapnel control mode is determined according to the pressure information and the communication connection information, and the shrapnel control mode includes a first control mode for adjusting the pressure of the shrapnel and a second control mode for adjusting the deformation of the shrapnel; in the first control mode, a first pressure instruction is determined according to the communication connection information, and the pressure controller is controlled based on the first pressure instruction; in the second control mode, a second pressure instruction is determined according to the working status of the shrapnel collected by the environmental collector, and the pressure controller is controlled based on the second pressure instruction, thereby improving the control accuracy of the chip sealing and testing shrapnel.

Description

Technical Field

[0001] The present application relates to the technical field of chip sealing and testing shrapnel, and in particular to a control method, device, equipment and computer storage medium for chip sealing and testing shrapnel. Background Art

[0002] As chip sealing and testing shrapnel are used more and more frequently in different fields, users have also put forward higher requirements for the control methods of chip sealing and testing shrapnel.

[0003] The traditional chip sealing and testing shrapnel control method is to ensure stable contact between the chip and the packaging substrate through the mechanical pressure provided by itself. This chip sealing and testing shrapnel control method has a big defect, and there will be a phenomenon that it can only be controlled by the mechanical pressure provided by itself (at this time there will be a normal mechanical connection, but the actual chip and the packaging substrate will be broken). That is, this chip sealing and testing shrapnel control method will only be controlled by the mechanical pressure provided by itself, which will cause the control accuracy of the chip sealing and testing shrapnel to be low.

[0004] The above content is only used to assist in understanding the technical solution of this application and does not constitute an admission that the above content is prior art. Summary of the Invention

[0005] The main purpose of this application is to provide a control method, device, equipment and computer storage medium for chip sealing and testing springs, aiming to solve the technical problem of low control accuracy of chip sealing and testing springs.

[0006] To achieve the above objectives, the present application proposes a control method for a chip sealing and testing spring. The control method for a chip sealing and testing spring is applied to a control device for a chip sealing and testing spring. The control device for the chip sealing and testing spring includes an environment collector and a pressure controller. The control method for the chip sealing and testing spring includes:

[0007] Acquire the shrapnel status information collected by the environment collector, wherein the shrapnel status information includes the pressure bearing information and communication connection information of the chip sealing and testing shrapnel;

[0008] Determining a spring control mode according to the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the spring pressure and a second control mode for adjusting the spring deformation;

[0009] When the spring control mode is the first control mode, determining a first pressure instruction according to the communication connection information, and controlling the pressure controller based on the first pressure instruction;

[0010] When the spring control mode is the second control mode, a second pressure instruction is determined according to the spring working state collected by the environment collector, and the pressure controller is controlled based on the second pressure instruction.

[0011] In one embodiment, the pressure information includes a pressure value and a deformation state of the spring, and the communication connection information includes a communication state. The step of determining the spring control mode according to the pressure information and the communication connection information includes:

[0012] When the communication state does not match the preset communication setting state, detecting whether the pressure value matches the preset pressure threshold, and whether the deformation state of the spring matches the preset normal deformation state;

[0013] When the pressure value matches a preset pressure threshold and the deformation state of the spring piece matches a preset normal deformation state, determining that the spring piece control mode is the first control mode;

[0014] When the pressure value does not match the preset pressure threshold, or the deformation state of the spring does not match the preset normal deformation state, the spring control mode is determined to be the second control mode.

[0015] In one embodiment, the step of determining the spring control mode according to the pressure information and the communication connection information includes:

[0016] When the communication state matches a preset communication setting state, determining an abnormal deformation state in the deformation state of the spring piece;

[0017] When the abnormal deformation state matches the preset excessive deformation state, the position of the first spring piece corresponding to the abnormal deformation state is determined, and the position of the first spring piece is controlled based on a preset pressure reduction instruction;

[0018] When the abnormal deformation state matches the preset too-short deformation state, the position of the second spring piece corresponding to the abnormal deformation state is determined, and the position of the second spring piece is controlled based on the preset pressure increase instruction.

[0019] In one embodiment, the step of determining the first pressure instruction according to the communication connection information includes:

[0020] Determining a wire connection length in the communication connection information, and determining a first control pressure corresponding to the wire connection length in a preset pressure movement table;

[0021] When the sum of the first control pressure and the current control pressure is less than a preset pressure threshold, outputting the first control pressure as a first pressure instruction;

[0022] When the sum of the first control pressure and the current control pressure is greater than or equal to a preset pressure threshold, the pressure threshold is output as a first pressure instruction;

[0023] The pressure controller includes a first pressure controller for controlling the front and rear sides of the chip sealing and testing spring, and the step of controlling the pressure controller based on the first pressure instruction includes:

[0024] The first pressure controller is controlled based on the pressure value in the first pressure command.

[0025] In one embodiment, the step of determining the second pressure instruction according to the working state of the spring collected by the environment collector includes:

[0026] Determining the states of the front and rear spring fragments in the spring fragment working states collected by the environment collector, and determining the mis-contact states of the front and rear spring fragments;

[0027] When the miscontact state matches the preset front-side miscontact state, determining the preset tail-side compression instruction as the second pressure instruction;

[0028] When the miscontact state matches the preset tail-side miscontact state, the preset head-side compression instruction is determined as the second pressure instruction.

[0029] In one embodiment, the step of determining the second pressure instruction according to the working state of the spring collected by the environment collector includes:

[0030] Determine the overall state of the shrapnel in the working state of the shrapnel collected by the environment collector, and determine the state of the partial shrapnel of the overall state of the shrapnel;

[0031] For each state of the partial spring piece, a maximum control pressure is determined in a preset pressure threshold table, and the maximum control pressure is used as a second pressure instruction, wherein the maximum control pressure controls the spring piece corresponding to the partial spring piece state respectively.

[0032] In one embodiment, after the step of controlling the pressure controller based on the second pressure instruction, the following steps are included:

[0033] Acquire a real-time control state collected by the environment collector under the control of the second pressure instruction, wherein the real-time control state includes the division state of the spring fragment corresponding to the state of each division spring fragment;

[0034] If a first subdivision state matching a preset excessive pressure state exists among the subdivision states, and a second subdivision state matching a preset insufficient pressure state exists among the subdivision states, the chip sealing and testing spring is controlled based on the first subdivision state and the second subdivision state;

[0035] If there is no first subdivision state matching the preset excessive pressure state in the subdivision state, or if there is no second subdivision state matching the preset insufficient pressure state in the subdivision state, the chip sealing and testing spring is controlled based on a preset locking instruction.

[0036] In addition, to achieve the above-mentioned purpose, the present application also proposes a control device for a chip sealing and testing spring, the control device for the chip sealing and testing spring comprising a spring controller, an environment collector, and a pressure controller, the spring controller being connected to the environment collector and the pressure controller, and the spring controller comprising:

[0037] An information acquisition module, configured to acquire the shrapnel status information collected by the environment collector, wherein the shrapnel status information includes pressure bearing information and communication connection information of the chip sealing and testing shrapnel;

[0038] a mode determination module, configured to determine a spring-flake control mode according to the pressure information and the communication connection information, wherein the spring-flake control mode includes a first control mode for adjusting the spring-flake pressure and a second control mode for adjusting the spring-flake deformation;

[0039] a first control module, configured to determine a first pressure instruction according to the communication connection information when the spring control mode is the first control mode, and control the pressure controller based on the first pressure instruction;

[0040] The second control module is configured to determine a second pressure instruction according to the working state of the spring collected by the environment collector when the spring control mode is the second control mode, and control the pressure controller based on the second pressure instruction.

[0041] In addition, to achieve the above-mentioned purpose, the present application also proposes a control device for a chip sealing and testing spring, which includes: a memory, a processor, and a computer program stored on the memory and runnable on the processor, and the computer program is configured to implement the steps of the control method for the chip sealing and testing spring as described above.

[0042] In addition, to achieve the above-mentioned purpose, the present application also proposes a computer storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the control method of the chip sealing and testing spring are implemented as described above.

[0043] An embodiment of the present application provides a control method for a chip sealing and testing spring, which is applied to a control device for a chip sealing and testing spring, wherein the control device for the chip sealing and testing spring includes an environment collector and a pressure controller, and obtains spring status information collected by the environment collector, wherein the spring status information includes pressure information and communication connection information of the chip sealing and testing spring; determines a spring control mode according to the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the spring pressure and a second control mode for adjusting the spring deformation; when the spring control mode is the first control mode, determines a first pressure instruction according to the communication connection information, and controls the pressure controller based on the first pressure instruction; when the spring control mode is the second control mode, determines a first pressure instruction according to the communication connection information, and controls the pressure controller based on the first pressure instruction; when the spring control mode is the second control mode, determines a first pressure instruction according to the communication connection information, and controls the pressure controller based on the first pressure instruction; when the spring control mode is the second control mode, determines a first pressure instruction according to the communication connection information, and controls the pressure controller based on the first pressure instruction The second pressure instruction is determined based on the working state of the shrapnel, and the pressure controller is controlled based on the second pressure instruction. This control method for the chip sealing and testing shrapnel determines the shrapnel control mode through the pressure information and the communication connection information. In different modes, the first pressure instruction is determined based on the communication connection information to control the pressure controller, so as to realize one control of the chip sealing and testing shrapnel, or, the second pressure instruction is determined based on the working state of the shrapnel collected by the environmental collector to control the pressure controller, so as to realize another control of the chip sealing and testing shrapnel (that is, feedback control based on the real-time detected pressure information and communication connection information), and avoids the problem of being able to control only by the mechanical pressure provided by itself (at this time there will be a normal mechanical connection, but the actual chip and the packaging substrate will be disconnected), thereby improving the control accuracy of the chip sealing and testing shrapnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a flow chart of a first embodiment of a method for controlling a chip sealing and testing spring in accordance with the present application;

[0045] Figure 2 This is a schematic diagram of an implementation flow of the control method for chip sealing and testing springs of this application;

[0046] Figure 3 This is a flow chart of a second embodiment of the method for controlling chip sealing and testing springs of the present application;

[0047] Figure 4 This is a module diagram of the control device for chip sealing and testing shrapnel in this application;

[0048] Figure 5 This is a schematic diagram of the device structure of the hardware operating environment involved in this application.

[0049] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0050] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0051] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0052] The control method of traditional chip sealing and testing shrapnel is generally as follows: 1. The pressure parameters of the shrapnel (such as elastic modulus and pre-stress deformation) are determined in the design stage, and a fixed contact pressure is provided by material properties (such as the elasticity of beryllium copper alloy) and geometric structures (such as cantilever beams and coil springs); 2. Passive pressure maintenance: the shrapnel only relies on the pre-stress deformation during initial installation to provide pressure. During subsequent work, it is unable to dynamically adjust the pressure or compensate for deformation according to actual working conditions (such as temperature changes, mechanical vibrations, and contact surface wear). Therefore, the traditional chip sealing and testing shrapnel control method has been difficult to meet the needs of high-precision and high-reliability chip packaging due to its defects such as static pressure dependence, poor environmental adaptability and lack of real-time feedback. Especially in advanced processes and complex application scenarios, the decoupling problem of mechanical pressure and electrical connection has become a key bottleneck restricting the sealing and testing yield and product life. It is urgent to break through the limitations of traditional methods through multi-source data fusion and dynamic closed-loop control technology.

[0053] Therefore, based on the deficiencies of the above control schemes for chip sealing and testing shrapnel, a control method for chip sealing and testing shrapnel of the present application is proposed. The solution of the embodiment of the present application is: after determining the shrapnel control mode by bearing pressure information and communication connection information, in different modes, a first pressure instruction is determined based on the communication connection information to control the pressure controller to achieve one control of the chip sealing and testing shrapnel, or a second pressure instruction is determined based on the working state of the shrapnel collected by the environment collector to control the pressure controller to achieve another control of the chip sealing and testing shrapnel (i.e., feedback control based on the bearing pressure information and communication connection information detected in real time), thereby avoiding the problem of being able to control only by the mechanical pressure provided by itself (at this time, there will be a normal mechanical connection, but the problem of disconnection between the actual chip and the packaging substrate), thereby improving the accuracy of the control of the chip sealing and testing shrapnel.

[0054] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, mobile phone, etc., or a device capable of performing the above functions, a control device for chip sealing and testing springs, etc. The following uses the control device for chip sealing and testing springs as an example to illustrate this embodiment and the following embodiments.

[0055] Based on this, the embodiment of the present application provides a control method for chip sealing and testing springs, referring to Figure 1 , Figure 1This is a flow chart of the first embodiment of the control method for chip sealing and testing springs of the present application.

[0056] Reference Figure 1 The present application provides a control method for a chip sealing and testing shrapnel. The control method for a chip sealing and testing shrapnel is applied to a control device for the chip sealing and testing shrapnel. The control device for the chip sealing and testing shrapnel includes an environment collector and a pressure controller. The control method for the chip sealing and testing shrapnel includes:

[0057] Step S10, obtaining the shrapnel status information collected by the environment collector, wherein the shrapnel status information includes the pressure bearing information and communication connection information of the chip sealing and testing shrapnel;

[0058] Step S20, determining a spring control mode according to the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the spring pressure and a second control mode for adjusting the spring deformation;

[0059] In this embodiment, when the chip sealing and testing shrapnel needs to be controlled, the shrapnel status information collected by the environmental collector will be obtained, wherein the shrapnel status information includes the pressure information and communication connection information of the chip sealing and testing shrapnel. At this time, it can be obtained in real time or based on a fixed time period, which is not limited here. The control device of the chip sealing and testing shrapnel can include a shrapnel controller for the chip sealing and testing shrapnel, that is, a controller that controls the chip components, an environmental collector that collects information related to the chip sealing and testing shrapnel, such as a pressure sensor that collects pressure on the chip sealing and testing shrapnel, an image sensor that collects the compressed state of the chip sealing and testing shrapnel, or a pressure sensor that determines the compressed state based on the direct distance between the two ends of the chip sealing and testing shrapnel. The pressure controller can be a telescopic device, such as a precise motor to achieve compression. The telescopic device can control the compression of the front and rear ends of the chip sealing and testing shrapnel at the same time, or control the compression of the front and middle ends at the same time, that is, the chip sealing and testing shrapnel can be controlled by the pressure controller to achieve compression between the front and tail, the front and middle, and the tail and middle. Of course, it can also be further refined into between the front and tail, so that the front and tail are divided into multiple sections for compression. The pressure-bearing information refers to the pressure value exerted on the chip sealing and testing shrapnel, which at least includes the pressure value of the entire chip sealing and testing shrapnel and the pressure values ​​between the head and tail, the head in the middle, and the tail in the middle. The communication connection information refers to the communication status between the devices or chips connected at the head and tail of the chip sealing and testing shrapnel, such as whether normal communication is established or not, or whether the communication is disconnected. At this time, it can be determined whether control is required based on the pressure-bearing information and the communication connection information. If control is required, the shrapnel control mode will be determined based on the above two information, that is, the shrapnel control mode includes a first control mode for adjusting the pressure of the shrapnel and a second control mode for adjusting the deformation of the shrapnel, that is, the first control mode is to directly control the overall pressure of the chip sealing and testing shrapnel, and the second control mode refers to indirect pressure control based on the deformation of the chip sealing and testing shrapnel, and then subsequent control can be performed based on different control modes to ensure the accuracy of the control of the chip sealing and testing shrapnel in different modes, thereby ensuring the accuracy and efficiency of the chip sealing and testing shrapnel use environment.

[0060] Step S30, when the spring control mode is the first control mode, determining a first pressure instruction according to the communication connection information, and controlling the pressure controller based on the first pressure instruction;

[0061] Step S40: When the spring control mode is the second control mode, a second pressure instruction is determined according to the spring working state collected by the environment collector, and the pressure controller is controlled based on the second pressure instruction.

[0062] In this embodiment, after determining the control mode, control is performed based on two different control modes. In the first control mode, a first pressure instruction is directly determined based on the actual communication connection information. Specifically, the length of the communication disconnection in the actual communication connection information is determined, and a pressure value is generated based on the length. The pressure controller is controlled based on this pressure value to achieve normal communication of the chip sealing and testing spring. The first pressure instruction refers to a pressure value determined based on the communication connection information in the first control mode. In this case, the pressure controller controls the chip sealing and testing spring to compress or stretch based on this pressure value, thereby restoring the normal communication function of the chip sealing and testing spring. In the second control mode, control is performed based on deformation. The working state of the spring collected by the environmental collector is then obtained. A second pressure instruction is then determined based on the working state of the spring, and the pressure controller is controlled based on the second pressure instruction. Specifically, the chip sealing and testing spring is judged based on the actual working state of the spring, and then whether segmented compression or other methods can be performed to avoid over-compression or over-stretching of the chip sealing and testing spring, thereby ensuring the service life of the chip sealing and testing spring. Among them, the actual working state of the shrapnel refers to the actual compression of each part of the chip sealing and testing shrapnel, such as the first middle section is shorter after compression, the first middle section is longer after compression, etc. The second pressure instruction refers to a pressure value determined based on the actual working state of the shrapnel in the second control mode. At this time, the pressure controller will control the compression or stretching of the chip sealing and testing shrapnel based on the pressure value to restore the normal communication function of the chip sealing and testing shrapnel. This control method for chip sealing and testing shrapnel can dynamically respond to the state changes of the shrapnel during the test process by collecting the pressure information and communication connection status of the shrapnel in real time, combining two control modes (pressure adjustment / deformation adjustment). For example, when the communication connection is unstable, the pressure value can be directly adjusted by the first control mode to quickly restore the contact reliability; and when there is a contact problem caused by deformation, the deformation of the shrapnel is adjusted by the second control mode to avoid mechanical damage. Combining the pressure information with the communication connection status for analysis avoids the limitations of single parameter control (such as relying solely on pressure may cause overload or poor contact), and significantly improves the stability of the contact between the chip and the shrapnel during the sealing and testing process.

[0063] In one embodiment, referring to Figure 2 , Figure 2This is a flow chart of an implementation method of the control method of the chip sealing and testing shrapnel of the present application. By obtaining the status information of the chip sealing and testing shrapnel (pressure bearing information and communication connection information), the mode of controlling the chip sealing and testing shrapnel can be determined based on the pressure bearing information and communication connection information, that is, it includes a first control mode for adjusting the pressure of the shrapnel (i.e. direct pressure control) and a second control mode for adjusting the deformation of the shrapnel (i.e. indirect pressure control). At this time, when the mode is the direct pressure control mode, the chip sealing and testing shrapnel will be directly thermally controlled based on the communication connection information and other information in the status information, that is, at this time, the process of determining the first pressure instruction according to the communication connection information and controlling the pressure controller based on the first pressure instruction is executed; when the mode is the indirect pressure control mode, the chip sealing and testing shrapnel will be indirectly thermally controlled based on the working status collected by the environmental collector, that is, at this time, the process of determining the second pressure instruction according to the working status of the shrapnel collected by the environmental collector is executed, and the process of controlling the pressure controller based on the second pressure instruction is executed. At this time, the feedback control influence of pressure information and communication connection information on the chip sealing and testing shrapnel is taken into consideration, and at the same time, it can only be controlled by the mechanical pressure provided by itself (at this time there will be a normal mechanical connection, but the actual chip and the packaging substrate will be disconnected). This can improve the control accuracy of the chip sealing and testing shrapnel.

[0064] In the present embodiment, a control method for a chip sealing and testing spring is provided, which is applied to a control device for a chip sealing and testing spring. The control device for the chip sealing and testing spring includes an environment collector and a pressure controller. The method obtains spring status information collected by the environment collector, wherein the spring status information includes pressure information and communication connection information of the chip sealing and testing spring; a spring control mode is determined according to the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the spring pressure and a second control mode for adjusting the spring deformation; when the spring control mode is the first control mode, a first pressure instruction is determined according to the communication connection information, and the pressure controller is controlled based on the first pressure instruction; when the spring control mode is the second control mode, a second pressure instruction is determined according to the working state of the spring collected by the environment collector. Force instruction, and controls the pressure controller based on the second pressure instruction. This control method for chip sealing and testing spring determines the spring control mode through the pressure information and the communication connection information. In different modes, the first pressure instruction is determined based on the communication connection information to control the pressure controller to achieve one control of the chip sealing and testing spring, or the second pressure instruction is determined based on the working state of the spring collected by the environment collector to control the pressure controller to achieve another control of the chip sealing and testing spring (i.e. feedback control based on the real-time detected pressure information and communication connection information), and avoids the problem of being able to control only by the mechanical pressure provided by itself (at this time there will be a normal mechanical connection, but the actual chip and the packaging substrate will be disconnected), thereby improving the accuracy of the control of the chip sealing and testing spring.

[0065] Furthermore, based on the first embodiment of the present application, a second embodiment of the control method for the chip sealing and testing spring of the present application is proposed. In this embodiment, in the above step S20, the pressure information includes the pressure value and the deformation state of the spring, and the communication connection information includes the communication state. The step of determining the spring control mode according to the pressure information and the communication connection information includes:

[0066] Step S201: When the communication state does not match the preset communication setting state, detecting whether the pressure value matches a preset pressure threshold (which can be adaptively updated with usage time), and whether the deformation state of the spring matches a preset normal deformation state;

[0067] Step S202: when the pressure value matches the preset pressure threshold and the deformation state of the spring piece matches the preset normal deformation state, determining that the spring piece control mode is the first control mode;

[0068] Step S203 : when the pressure value does not match the preset pressure threshold, or the deformation state of the spring does not match the preset normal deformation state, determining that the spring control mode is the second control mode.

[0069] In this embodiment, when determining the spring control mode based on the pressure information and communication connection information, the determination is mainly based on the pressure value and spring deformation state in the pressure information, as well as the communication state in the communication connection information. The pressure value refers to the pressure of the entire chip sealing and testing spring, the spring deformation state refers to the deformation of the entire chip sealing and testing spring, and the communication state refers to the connection state of the chip sealing and testing spring at the ends. Because the chip sealing and testing spring may be disconnected at the ends, causing communication interruption, or disconnected at a certain position in the middle, the communication information between the two sides can be checked to determine whether the communication is normal. That is, the environment collector can communicate with the two communication chips connected to the chip sealing and testing spring (assuming that the chip sealing and testing spring is connected to two communication chips) to collect information to determine whether the communication is normal. It can also notify one of the communication chips to perform a communication test to determine whether the communication is normal when control is required. When the communication state does not match the preset communication setting state, that is, the preset communication setting state is the set normal communication state, that is, the communication is abnormal at this time, and then the pressure value and spring deformation state will be used to determine which control mode to operate in. By determining that the pressure value matches the preset pressure threshold (that is, the pressure value is less than the preset pressure threshold), and the deformation state of the spring matches the preset normal deformation state, the spring control mode is determined to be the first control mode, that is, at this time, each time the maximum pressure value of the chip sealing and testing spring is reached, it will not cause damage to the chip sealing and testing spring. The preset pressure threshold refers to the maximum pressure value of the chip sealing and testing spring, and matches the preset normal deformation state (no excessive compression or stretching). At this time, the distance between the head and tail, the head and the tail of the chip sealing and testing spring can be determined based on the pressure controller. That is, when it is determined that the distance is not within the normal setting range, it will be determined that the chip sealing and testing spring is in a normal deformation state at this time. Otherwise, it is determined that the chip sealing and testing spring is in an abnormal deformation state at this time. That is, at this time, the chip sealing and testing spring can also perform overall pressure control, that is, the spring control mode is determined to be the first control mode. On the contrary, when it is determined that the pressure value does not match the preset pressure threshold (that is, the pressure value is greater than or equal to the preset pressure threshold), or the deformation state of the spring does not match the preset normal deformation state, it will be determined that the chip sealing and testing spring cannot perform overall pressure control (the overall control will damage the performance of the chip sealing and testing spring), that is, the spring control mode is determined to be the second control mode, so as to control the chip sealing and testing spring based on different control modes, thereby ensuring the accuracy of subsequent control of the chip sealing and testing spring, and at the same time improving the service life of the chip sealing and testing spring (without excessive compression or stretching) and the use effect of the chip sealing and testing spring (normal communication can be guaranteed).

[0070] In one embodiment, the step of determining the spring control mode according to the pressure information and the communication connection information includes:

[0071] Step S211, when the communication state matches the preset communication setting state, determining an abnormal deformation state in the deformation state of the spring;

[0072] Step S212, when the abnormal deformation state matches the preset excessive deformation state, determining the position of the first spring piece corresponding to the abnormal deformation state, and controlling the position of the first spring piece based on the preset pressure reduction instruction;

[0073] Step S213 : when the abnormal deformation state matches the preset too-short deformation state, the position of the second spring piece corresponding to the abnormal deformation state is determined, and the position of the second spring piece is controlled based on the preset pressure increase instruction.

[0074] In this embodiment, because the chip sealing and testing shrapnel may be subject to environmental influences that may cause different usage ranges (i.e., external factors may cause one portion to be frequently used, such as rust caused by moisture, while another portion may rust and be unable to be used normally, thereby affecting the service life of the entire chip sealing and testing shrapnel), when the communication state matches the preset communication setting state, the abnormal deformation state of the shrapnel deformation state will continue to be determined (a state where the compression deformation is too large or too small, and if it does not exist, the current control process will be terminated). That is, it is determined that the state is not deformed normally under pressure, that is, the distance between the head center and the tail center (assuming it is divided into two stages of control, of course, it can also be divided into multiple stages of control) can be determined, and then compared with the theoretical distance (theoretical pressure distance correspondence table, that is, the distance that the chip sealing and testing shrapnel should have under theoretical pressure, which can be updated according to the length of time the shrapnel is used) to determine whether it is an abnormal deformation state. For example, under pressure A, the normal distance between the head center and the tail center is A1±3, but the head center is actually A1-6, then it is determined that there is an over-compression problem in the head center. It can be determined that when the abnormal deformation state matches the preset excessive deformation state (referring to the state of longer deformation, that is, the situation of shorter compression), that is, the spring piece corresponding to the abnormal deformation state is harder and cannot be compressed normally, the position of the first spring piece corresponding to the abnormal deformation state will be determined, that is, the position of the abnormal deformation state on the chip sealing and testing spring piece will be determined, such as the first center, and then the position of the first spring piece will be controlled based on the preset pressure reduction instruction (referring to the instruction to reduce the pressure), that is, the pressure between the first center is controlled to reduce, so as to reduce the deformation between the first center, so as to ensure the consistency of the use of the overall chip sealing and testing spring piece. When it is determined that the abnormal deformation state matches the preset too-short deformation state (referring to the state of shorter deformation, that is, the situation of longer compression), that is, the spring piece at the position corresponding to the abnormal deformation state is softer and the compression is too obvious, the position of the second spring piece corresponding to the abnormal deformation state will be determined, that is, the position of the abnormal deformation state on the chip sealing and testing spring piece will be determined, such as the first center, and then the position of the second spring piece will be controlled based on the preset pressure increase instruction (referring to the instruction to increase pressure), that is, the pressure between the first center is controlled to increase, so as to increase the deformation between the first center to ensure the consistency of the use of the overall chip sealing and testing spring piece. It is worth noting that controlling the position of the first spring clip based on a preset pressure reduction instruction means controlling the pressure controller to control the position of the first spring clip based on a preset pressure reduction instruction, such as reducing the pressure value between the first and the middle. Of course, the same is true for the control of the position of the second spring clip. Moreover, after the first spring clip position is controlled by the preset pressure reduction instruction, other positions must be controlled to ensure that the length of the overall chip sealing and testing spring clip remains unchanged, thereby ensuring normal communication of the chip sealing and testing spring clip, and at the same time ensuring the consistency of use between different parts of the chip sealing and testing spring clip, so as to improve the service life of the chip sealing and testing spring clip.

[0075] Furthermore, based on the first and / or second embodiments of the present application, a third embodiment of the method for controlling a chip sealing and testing spring of the present application is proposed. In this embodiment, step S30, the step of determining the first pressure instruction based on the communication connection information, includes:

[0076] Step S31, determining the wire connection length in the communication connection information, and determining a first control pressure corresponding to the wire connection length in a preset pressure movement table;

[0077] Step S32: when the sum of the first control pressure and the current control pressure is less than a preset pressure threshold, outputting the first control pressure as a first pressure instruction;

[0078] Step S33: When the sum of the first control pressure and the current control pressure is greater than or equal to a preset pressure threshold, the output pressure threshold is used as a first pressure instruction.

[0079] In this embodiment, under the control of the first control mode, the wire connection length in the communication connection information will be determined, because the chip sealing and testing shrapnel has a communication line and a connecting metal. If there is a communication line break, the communication line plus part of the connecting metal can still realize the level transmission between the two communication chips. At this time, the length of the connected part of the connecting metal will be determined based on the size of the level transmission, and then used as the wire connection length. Of course, it can be determined based on other methods. For example, in some cases, the wire connection length is the sum of the gap lengths between all chip sealing and testing shrapnel (the broken line can be directly ignored), that is, the chip sealing and testing shrapnel is directly fitted to communicate. The wire connection length refers to the length that needs to be moved and compressed, which is generally the length of the compressed connecting metal. At this time, the first control pressure corresponding to the wire connection length will be determined in the preset pressure movement table, that is, the pressure value required to achieve the wire connection length will be determined, and then the first control pressure will be increased to the current control pressure (the current pressure value of the chip sealing and testing spring). Then, when the sum of the first control pressure and the current control pressure is less than the preset pressure threshold, the first control pressure will be output as the first pressure instruction, that is, the pressure controller uses the first control pressure to control the pressure on the front and rear sides of the chip sealing and testing spring. Conversely, when the sum of the first control pressure and the current control pressure is greater than or equal to the preset pressure threshold, the output pressure threshold will be used as the first pressure instruction, that is, the pressure controller uses the output pressure threshold to control the pressure on the front and rear sides of the chip sealing and testing spring, and simultaneously executes the step of obtaining the spring status information collected by the environmental collector to determine whether normal communication can be achieved under the control of the output pressure threshold, thereby ensuring the accuracy of the entire chip sealing and testing spring control. It is worth noting that at this time, the pressure can also be directly increased based on a preset step size to detect whether the communication connection information is normal, and the step of detecting whether the pressure is less than the preset pressure threshold is executed after the communication connection information is normal. The pressure controller includes a first pressure controller for controlling the front and rear sides of the chip sealing and testing spring. The steps of controlling the pressure controller based on the first pressure instruction include:

[0080] Step S34: controlling the first pressure controller based on the pressure value in the first pressure instruction.

[0081] In this embodiment, when the pressure controller controls the chip sealing and testing spring, it is divided into a first pressure controller that controls the head and tail sides of the chip sealing and testing spring (correspondingly, there is a second pressure controller that controls the head and middle sides of the chip sealing and testing spring and a third pressure controller that controls the middle and tail sides of the chip sealing and testing spring). At this time, the first pressure controller can be controlled based on the pressure value in the first pressure instruction, and then the first pressure controller can be used to compress or stretch the entire chip sealing and testing spring. At this time, the control of the entire chip sealing and testing spring is based on actual feedback information (pressure information and communication connection information) and the properties of the chip sealing and testing spring itself (preset pressure threshold and preset normal deformation state, etc.) to improve the control accuracy of the chip sealing and testing spring.

[0082] Furthermore, the step of determining the second pressure instruction according to the working state of the shrapnel collected by the environment collector includes:

[0083] Step S401, determining the states of the front and rear spring fragments in the spring fragment working states collected by the environment collector, and determining the miscontact states of the front and rear spring fragments;

[0084] Step S402: when the mis-contact state matches the preset front-side mis-contact state, determining the preset tail-side compression instruction as the second pressure instruction;

[0085] Step S403: When the mis-contact state matches the preset tail-side mis-contact state, a preset head-side compression instruction is determined as the second pressure instruction.

[0086] In this embodiment, under the control of the second control mode, on the one hand, the head and tail sides of the chip sealing and testing spring will be detected to avoid the phenomenon of short-circuiting multiple communication chip terminals on the head and tail sides of the chip sealing and testing spring (that is, this is a state of abnormal communication), that is, assuming that the terminal B1 of the communication chip B and the terminal C1 of the communication chip C are connected through the chip sealing and testing spring, but due to excessive pressure on the chip sealing and testing spring, the terminal B1 of the communication chip B and the terminal C1 of the communication chip C and the terminal C2 of the communication chip C form a communication connection line. At this time, it can be determined based on the communication between the communication chips, that is, the terminal B1 of the communication chip B gives a high level, and the terminal C1 and terminal C2 of the communication chip C both receive the high level, then it can be determined that the terminal C1 and terminal C2 of the communication chip C are short-circuited. At this time, the level can be output in different directions to verify whether the other side is short-circuited. The head and tail spring status refers to the status of the connection terminals on the head and tail sides of the chip sealing and testing spring, and the false contact status refers to the state of the head and tail sides of the chip sealing and testing spring short-circuited. When it is determined that the miscontact state matches the preset front-side miscontact state, the preset tail-side compression instruction is determined as the second pressure instruction. The front-side miscontact state refers to the state in which a short circuit occurs on the front side of the chip sealing and testing shrapnel. The preset tail-side compression instruction refers to an instruction to increase the pressure and compress the tail side of the chip sealing and testing shrapnel, while reducing the pressure value on the front side, but ensuring that the length of the entire chip sealing and testing shrapnel remains unchanged. The chip sealing and testing shrapnel can be controlled based on the second pressure instruction. When it is determined that the miscontact state matches the preset tail-side miscontact state, the preset front-side compression instruction is determined as the second pressure instruction. The tail-side miscontact state refers to the state in which a short circuit occurs on the tail side of the chip sealing and testing shrapnel. The preset front-side compression instruction refers to an instruction to increase the pressure and compress the front side of the chip sealing and testing shrapnel, while reducing the pressure value on the tail side, but ensuring that the length of the entire chip sealing and testing shrapnel remains unchanged. The chip sealing and testing shrapnel can be controlled based on the second pressure instruction, and ultimately the accuracy of the control of the entire chip sealing and testing shrapnel can be guaranteed. It is worth mentioning that at this time the entire chip sealing and testing shrapnel will be divided into three parts, the head and tail of the chip sealing and testing shrapnel, and the head and tail will be controlled separately to ensure the accuracy of control.

[0087] Furthermore, based on the first, second, and / or third embodiments of the present application, a fourth embodiment of the method for controlling a chip sealing and testing spring is proposed. In this embodiment, step S40, determining a second pressure instruction based on the spring's working state collected by the environmental collector, includes:

[0088] Step a, determining the overall state of the shrapnel in the working state of the shrapnel collected by the environment collector, and determining the states of the sub-shrapnel of the overall state of the shrapnel;

[0089] Step b: for each state of the partial spring piece, determine the maximum control pressure in the preset pressure threshold table, and use the maximum control pressure as the second pressure instruction, wherein the maximum control pressure controls the spring piece corresponding to the partial spring piece state respectively.

[0090] In this embodiment, under the control of the second control mode, on the other hand, the overall shrapnel state in the shrapnel working state will be monitored, and at the same time, the partial shrapnel state based on the overall shrapnel state will be monitored, wherein the overall shrapnel state refers to the overall state of the entire chip sealing and testing shrapnel, and the partial shrapnel state refers to the partial state of the chip sealing and testing shrapnel divided into the head, middle and tail based on the control (that is, this is another state of communication abnormality). Then, for each partial spring state, the maximum control pressure is determined in the preset pressure threshold table, and the maximum control pressure is used as the second pressure instruction, wherein the maximum control pressure controls the spring corresponding to the partial spring state respectively, that is, the pressure value of the entire chip sealing and testing spring may not pass, but the pressure value of the division can still continue to increase, because the pressure value of the entire chip sealing and testing spring changes with time, but the division may have differences in usage time or environmental impact, and then the maximum control pressure can be determined in the preset pressure threshold table, and each partial spring state can be controlled based on the maximum control pressure to avoid the overall pressure affecting the service life. The maximum control pressure refers to the maximum pressure that a certain partial spring state can withstand, and then the corresponding pressure controller (such as the second pressure controller and / or the third pressure controller) can be controlled to control the corresponding part to ensure the accuracy of the control of the chip sealing and testing spring, so as to improve the performance of the chip sealing and testing spring. It is worth noting that if the control process of the second pressure instruction above is executed at this time, the overall pressure will generally not be collected until the communication is ended or the chip sealing and testing shrapnel is replaced. Because the overall pressure of the segmented control method is generally greater than the overall set maximum pressure, in order to avoid a dead loop, the control can be locked at this time, thereby ensuring the accuracy of the entire control.

[0091] Further, refer to Figure 3 , Figure 3 This is a flow chart of a second embodiment of the control method for chip sealing and testing springs of the present application, which includes the following steps after the step of controlling the pressure controller based on the second pressure instruction:

[0092] Step c, obtaining the real-time control state collected by the environment collector under the control of the second pressure instruction, wherein the real-time control state includes the state of each sub-shrapnel corresponding to the state of each sub-shrapnel;

[0093] Step d: If a first subdivision state exists in the subdivision states that matches the preset excessive pressure state, and a second subdivision state exists in the subdivision states that matches the preset insufficient pressure state, the chip sealing and testing spring is controlled based on the first subdivision state and the second subdivision state;

[0094] In step e, if there is no first division state in the division state that matches the preset excessive pressure state, or there is no second division state in the division state that matches the preset insufficient pressure state, the chip sealing and testing spring is controlled based on the preset locking instruction (locked control instruction, until the locking instruction is turned off at the next set start time, and the next set start time can be the next communication demand or the next control).

[0095] In this embodiment, after control is performed based on the second pressure instruction, the real-time control state collected by the environmental collector under the control of the second pressure instruction will be obtained. The real-time control state includes the partial state of the spring corresponding to the state of each partial spring, and the partial state is the compression or stretching state in the head, middle and tail. If there is a first partial state in the partial state that matches the preset pressure too large state (referring to the maximum pressure value corresponding to the partial state, which can be updated based on time), and there is a second partial state in the partial state that matches the preset pressure too small state (referring to the minimum pressure value corresponding to the partial state, which can be updated based on time), the chip sealing and testing spring is controlled based on the first partial state and the second partial state, that is, the pressure value of the first partial state can be reduced based on the set pressure step, but at this time the pressure value of the second partial state should be appropriately increased, while ensuring that the length of the overall chip sealing and testing spring remains unchanged, thereby ensuring the accuracy of the chip sealing and testing spring control. When there is no first division state in the division state that matches the preset excessive pressure state, or there is no second division state in the division state that matches the preset insufficient pressure state, the chip sealing and testing shrapnel will be locked to avoid the control from falling into an infinite loop, thereby improving the accuracy of the use of the chip sealing and testing shrapnel.

[0096] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the control method of the chip sealing and testing springs of the present application. More simple transformations based on this technical concept are all within the scope of protection of the present application.

[0097] The present application also provides a control device for chip sealing and testing springs, which includes a spring controller, an environment collector and a pressure controller. The spring controller is connected to the environment collector and the pressure controller. Please refer to Figure 4 , the spring controller includes:

[0098] The information acquisition module 10 is used to obtain the state information of the shrapnel collected by the environment collector, wherein the shrapnel state information includes the pressure information and communication connection information of the chip sealing and testing shrapnel;

[0099] A mode determination module 20 is configured to determine a spring control mode based on the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the spring pressure and a second control mode for adjusting the spring deformation;

[0100] The first control module 30 is used to determine the first pressure instruction according to the communication connection information when the spring control mode is the first control mode, and control the pressure controller based on the first pressure instruction;

[0101] The second control module 40 is configured to determine a second pressure instruction according to the working state of the spring collected by the environment collector when the spring control mode is the second control mode, and control the pressure controller based on the second pressure instruction.

[0102] The control device for chip sealing and testing springs provided in this application adopts the control method for chip sealing and testing springs in the above-mentioned embodiments, which can solve the technical problem of low control accuracy of chip sealing and testing springs. Compared with the prior art, the beneficial effects of the control device for chip sealing and testing springs provided in this application are the same as the beneficial effects of the control method for chip sealing and testing springs provided in the above-mentioned embodiments. The other technical features of the control device for chip sealing and testing springs are the same as those disclosed in the above-mentioned embodiments and are not further described here.

[0103] The present application provides a control device for a chip sealing and testing spring, and the control device for the chip sealing and testing spring includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the control method for the chip sealing and testing spring in the above-mentioned embodiment one.

[0104] Reference below Figure 5 , which shows a schematic diagram of the structure of a control device suitable for implementing the chip sealing and testing spring in the embodiment of the present application. The control device of the chip sealing and testing spring in the embodiment of the present application can include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., as well as fixed terminals such as digital TVs and desktop computers. Figure 5 The control device for the chip sealing and testing spring shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0105] like Figure 5 As shown, the control device of the chip sealing and testing shrapnel may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM: Read Only Memory) 1002 or the program loaded from the storage device 1003 to the random access memory (RAM: Random Access Memory) 1004. Various programs and data required for the operation of the control device of the chip sealing and testing shrapnel are also stored in RAM1004. The processing device 1001, ROM1002 and RAM1004 are connected to each other through a bus 1005. The input / output (I / O) interface 1006 is also connected to the bus. Typically, the following devices can be connected to the I / O interface 1006: input devices 1007 including, for example, a touch screen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices 1003 including, for example, a magnetic tape, hard disk, etc.; and communication devices 1009. The communication device 1009 can allow the control device of the chip sealing and testing shrapnel to communicate wirelessly or wired with other devices to exchange data. Although the figure shows a control device of the chip sealing and testing shrapnel with various devices, it should be understood that it is not required to implement or have all the devices shown. More or fewer devices can be implemented or have instead.

[0106] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program comprising program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0107] The control device for chip sealing and testing shrapnel provided in this application adopts the control method for chip sealing and testing shrapnel in the above-mentioned embodiment, which can solve the technical problem of low control accuracy of chip sealing and testing shrapnel. Compared with the existing technology, the beneficial effects of the control device for chip sealing and testing shrapnel provided in this application are the same as the beneficial effects of the control method for chip sealing and testing shrapnel provided in the above-mentioned embodiment. The other technical features of the control device for chip sealing and testing shrapnel are the same as those disclosed in the method of the above-mentioned embodiment, and are not further described here.

[0108] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0109] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

[0110] The present application provides a computer storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the control method of the chip sealing and testing spring in the above-mentioned embodiment.

[0111] The computer storage medium provided in this application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor devices, apparatuses or components, or any combination thereof. More specific examples of computer storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this embodiment, the computer storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution device, apparatus or component. The program code contained on the computer storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0112] The above-mentioned computer storage medium can be included in the control device of the chip sealing and testing shrapnel; or it can exist independently and not be assembled into the control device of the chip sealing and testing shrapnel.

[0113] The computer storage medium carries one or more programs. When the one or more programs are executed by the control device of the chip sealing and testing shrapnel, the control device of the chip sealing and testing shrapnel:

[0114] Obtaining the shrapnel status information collected by the environment collector, wherein the shrapnel status information includes the pressure bearing information and communication connection information of the chip sealing and testing shrapnel;

[0115] Determining a spring control mode according to the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the spring pressure and a second control mode for adjusting the spring deformation;

[0116] When the spring control mode is the first control mode, determining a first pressure instruction according to the communication connection information, and controlling the pressure controller based on the first pressure instruction;

[0117] When the spring fragment control mode is the second control mode, the second pressure instruction is determined according to the spring fragment working state collected by the environment collector, and the pressure controller is controlled based on the second pressure instruction.

[0118] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0119] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the devices, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of the boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based device that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0120] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0121] The computer storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned control method for chip sealing and testing springs, thereby resolving the technical problem of low control accuracy for chip sealing and testing springs. Compared to the prior art, the beneficial effects of the computer storage medium provided in this application are the same as those of the control method for chip sealing and testing springs provided in the aforementioned embodiments, and are not further elaborated here.

[0122] The present application also provides a computer program product, including a computer program, which implements the steps of the above-mentioned chip sealing and testing spring control method when executed by a processor.

[0123] The computer program product provided in this application can solve the technical problem of low accuracy in controlling chip sealing and testing shrapnel. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as those of the control method for chip sealing and testing shrapnel provided in the above embodiment, and will not be elaborated here.

[0124] The above are only some embodiments of the present application and are not intended to limit the patent scope of the present application. All equivalent structural transformations made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A method for controlling a chip sealing and testing spring, characterized in that: The control method of the chip sealing and testing spring is applied to a control device of the chip sealing and testing spring, the control device of the chip sealing and testing spring includes an environment collector and a pressure controller, and the control method of the chip sealing and testing spring includes: Acquire the shrapnel status information collected by the environment collector, wherein the shrapnel status information includes the pressure bearing information and communication connection information of the chip sealing and testing shrapnel; Determining a spring fragment control mode based on the pressure information and the communication connection information, wherein the spring fragment control mode includes a first control mode for adjusting the spring fragment pressure and a second control mode for adjusting the spring fragment deformation, the pressure information includes a pressure value and a spring fragment deformation state, and the communication connection information includes a communication state. The step of determining the spring fragment control mode based on the pressure information and the communication connection information includes: When the communication state does not match the preset communication setting state, detecting whether the pressure value matches the preset pressure threshold and whether the deformation state of the spring piece matches the preset normal deformation state; when the pressure value matches the preset pressure threshold and the deformation state of the spring piece matches the preset normal deformation state, determining that the spring piece control mode is the first control mode; when the pressure value does not match the preset pressure threshold or the deformation state of the spring piece does not match the preset normal deformation state, determining that the spring piece control mode is the second control mode; When the spring control mode is the first control mode, determining a first pressure instruction according to the communication connection information, and controlling the pressure controller based on the first pressure instruction; When the spring control mode is the second control mode, a second pressure instruction is determined according to the spring working state collected by the environment collector, and the pressure controller is controlled based on the second pressure instruction.

2. The control method for chip sealing and testing shrapnel according to claim 1, characterized in that: The step of determining the spring fragment control mode according to the pressure bearing information and the communication connection information includes: When the communication state matches a preset communication setting state, determining an abnormal deformation state in the deformation state of the spring piece; When the abnormal deformation state matches the preset excessive deformation state, the position of the first spring piece corresponding to the abnormal deformation state is determined, and the position of the first spring piece is controlled based on a preset pressure reduction instruction; When the abnormal deformation state matches the preset too-short deformation state, the position of the second spring piece corresponding to the abnormal deformation state is determined, and the position of the second spring piece is controlled based on the preset pressure increase instruction.

3. The control method for chip sealing and testing shrapnel according to claim 1, characterized in that: The step of determining the first pressure instruction according to the communication connection information includes: Determining a wire connection length in the communication connection information, and determining a first control pressure corresponding to the wire connection length in a preset pressure movement table; When the sum of the first control pressure and the current control pressure is less than a preset pressure threshold, outputting the first control pressure as a first pressure instruction; When the sum of the first control pressure and the current control pressure is greater than or equal to a preset pressure threshold, the pressure threshold is output as a first pressure instruction; The pressure controller includes a first pressure controller for controlling the front and rear sides of the chip sealing and testing spring, and the step of controlling the pressure controller based on the first pressure instruction includes: The first pressure controller is controlled based on the pressure value in the first pressure command.

4. The control method for chip sealing and testing shrapnel according to claim 1, characterized in that: The step of determining the second pressure instruction according to the working state of the shrapnel collected by the environment collector includes: Determining the states of the front and rear spring fragments in the spring fragment working states collected by the environment collector, and determining the mis-contact states of the front and rear spring fragments; When the miscontact state matches the preset front-side miscontact state, determining the preset tail-side compression instruction as the second pressure instruction; When the miscontact state matches the preset tail-side miscontact state, the preset head-side compression instruction is determined as the second pressure instruction.

5. The control method for chip sealing and testing shrapnel according to claim 1, characterized in that: The step of determining the second pressure instruction according to the working state of the shrapnel collected by the environment collector includes: Determine the overall state of the shrapnel in the working state of the shrapnel collected by the environment collector, and determine the state of the partial shrapnel of the overall state of the shrapnel; For each state of the partial spring piece, a maximum control pressure is determined in a preset pressure threshold table, and the maximum control pressure is used as a second pressure instruction, wherein the maximum control pressure controls the spring piece corresponding to the partial spring piece state respectively.

6. The control method for chip sealing and testing shrapnel according to claim 5, characterized in that: After the step of controlling the pressure controller based on the second pressure instruction, the method further includes: Acquire a real-time control state collected by the environment collector under the control of the second pressure instruction, wherein the real-time control state includes the division state of the spring fragment corresponding to the state of each division spring fragment; If a first subdivision state matching a preset excessive pressure state exists among the subdivision states, and a second subdivision state matching a preset insufficient pressure state exists among the subdivision states, the chip sealing and testing spring is controlled based on the first subdivision state and the second subdivision state; If there is no first subdivision state matching the preset excessive pressure state in the subdivision state, or if there is no second subdivision state matching the preset insufficient pressure state in the subdivision state, the chip sealing and testing spring is controlled based on a preset locking instruction.

7. A control device for chip sealing and testing shrapnel, characterized in that: The control device of the chip sealing and testing spring comprises a spring controller, an environment collector and a pressure controller, wherein the spring controller is connected to the environment collector and the pressure controller, and the spring controller comprises: An information acquisition module, configured to acquire the shrapnel status information collected by the environment collector, wherein the shrapnel status information includes pressure bearing information and communication connection information of the chip sealing and testing shrapnel; a mode judgment module, configured to determine a spring control mode according to the pressure information and the communication connection information, wherein the spring control mode includes a first control mode for adjusting the pressure of the spring and a second control mode for adjusting the deformation of the spring, the pressure information includes a pressure value and a deformation state of the spring, and the communication connection information includes a communication state, and the step of determining the spring control mode according to the pressure information and the communication connection information includes: when the communication state does not match a preset communication setting state, detecting whether the pressure value matches a preset pressure threshold and whether the deformation state of the spring matches a preset normal deformation state; when the pressure value matches the preset pressure threshold and the deformation state of the spring matches the preset normal deformation state, determining that the spring control mode is the first control mode; when the pressure value does not match the preset pressure threshold or the deformation state of the spring does not match the preset normal deformation state, determining that the spring control mode is the second control mode; a first control module, configured to determine a first pressure instruction according to the communication connection information when the spring control mode is the first control mode, and control the pressure controller based on the first pressure instruction; The second control module is configured to determine a second pressure instruction according to the working state of the spring collected by the environment collector when the spring control mode is the second control mode, and control the pressure controller based on the second pressure instruction.

8. A control device for chip sealing and testing shrapnel, characterized in that: The control device of the chip sealing and testing spring comprises: a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the control method of the chip sealing and testing spring as described in any one of claims 1 to 6.

9. A computer storage medium, characterized in that The computer storage medium stores a computer program, which, when executed by a processor, implements the steps of the method for controlling a chip sealing and testing spring as claimed in any one of claims 1 to 6.

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