Packaging manufacturing equipment for integrated circuit

Abstract

The invention relates to the field of integrated circuit manufacturing, in particular to package manufacturing equipment for an integrated circuit. The packaging device comprises a packaging manufacturing box, a clamping assembly and a packaging assembly. Conveying units are arranged on the two sides of the packaging manufacturing box respectively, an in-out unit is arranged at the upper end of the middle, and a discharging table is arranged at the lower end of the middle; the clamping assembly is arranged to be of a frame-shaped structure composed of two sets of transverse positioning pieces and two sets of longitudinal positioning pieces, clamps an unsegmented chip from the periphery and enters the packaging manufacturing box in a suspended mode through the in-out unit. And the packaging assemblies are arranged on the conveying unit, are matched in pairs and are used for packaging and disconnecting the chip on the clamping assembly from the two sides. According to the invention, through automatic and high-quality packaging of the chip, high-efficiency and batch manufacturing of the integrated circuit is promoted.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit manufacturing, and particularly to a packaging manufacturing device for integrated circuits. Background Art

[0002] The integrated circuit manufacturing process is mainly divided into three core stages:

[0003] 1. Wafer manufacturing: Fabricating circuit structures such as transistors and interconnections on a silicon wafer.

[0004] 2. Wafer testing: Conducting preliminary electrical tests on the chips on the wafer.

[0005] 3. Packaging and testing: Dicing the wafer, packaging the chips, and conducting final tests.

[0006] Among them, packaging belongs to the backend process and is the last key step before the chip leaves the factory. It can provide physical protection, prevent mechanical damage, block moisture, oxygen, corrosive gases (such as sulfides), and dust in the air, and avoid oxidation or short - circuit of the internal circuits of the chip. It can also make electrical connections, provide a stable power distribution network, and optimize high - frequency signals.

[0007] When the existing packaging manufacturing device for integrated circuits packages chips, chip packaging and pin cutting need to rely on different devices and are operated separately. Not only is the number of chips that can be packaged in a single time limited, but also there are many manual operation links to rely on. All of the above factors will affect the efficiency of integrated circuit manufacturing. Summary of the Invention

[0008] In view of the problems in the background art, a packaging manufacturing device for integrated circuits is proposed. It includes a packaging manufacturing box, a clamping component, and a packaging component. Conveyor units are respectively arranged on both sides of the packaging manufacturing box, an access unit is arranged at the upper middle part, and a discharge table is arranged at the lower middle part; the clamping component is arranged as a frame - type structure composed of two groups of transverse positioning members and two groups of longitudinal positioning members, which clamps an un - sliced version of chips from the outside and is suspended into the packaging manufacturing box through the access unit; the packaging component is arranged on the conveyor unit and is paired, and packages and disconnects a version of chips on the clamping component from both sides; each pair of packaging components is arranged in a mirror image on both sides of the clamping component, and corresponding packaging ends corresponding to the chip positions and cutting ends corresponding to the pin positions are respectively arranged on the opposite sides; the packaging ends inject raw materials to perform synchronous injection molding packaging on a version of chips from both sides; the cutting ends synchronously cut the rows of pins from both sides; after the chips are packaged and disconnected, they leave the packaging manufacturing box from the discharge table.

[0009] Preferably, the access unit includes a track located at the top of the packaging manufacturing box; a slider is slidably arranged on the track; a mounting frame is connected below the slider through a lifting driving member; and a group of transverse positioning members is connected to the mounting frame.

[0010] Preferably, the lateral positioning member includes a lateral positioning frame; the lateral positioning frame located above the frame structure is connected to the mounting frame, and lateral clamping grooves are provided at the opposite ends of the upper and lower lateral positioning frames; a lateral clamping plate is arranged in the lateral clamping groove, and the two sides of the upper and lower lateral positioning frames are connected to the moving blocks through a first telescopic driving member; the longitudinal positioning member includes a second telescopic driving member located between the upper and lower groups of moving blocks, and also includes a longitudinal positioning frame connected to the outer shell of the second telescopic driving member; longitudinal clamping grooves are provided at the opposite ends of the left and right longitudinal positioning frames; a longitudinal clamping plate is arranged in the longitudinal clamping groove.

[0011] Preferably, both the longitudinal clamping plates and the lateral clamping plates are arranged in pairs and clamp from both sides, and the clamping distance is adjustable; distance sensors facing the inner frame of the frame structure are arranged on both the longitudinal clamping plates and the lateral clamping plates.

[0012] Preferably, the conveying unit includes a conveyor belt that rotates in opposite directions, one on the left and one on the right; the encapsulation assembly is arranged on the conveyor belt and moves synchronously with the rotation of the conveyor belt.

[0013] Preferably, the encapsulation assembly includes a mounting seat detachably installed on the conveyor belt; a translation driving member is arranged on the mounting seat; the encapsulation plate is driven by the translation driving member and moves outside the mounting seat, and a feed pipe and a gas charging and discharging pump are arranged outside the encapsulation plate; both the cutting end and the encapsulation end are arranged on the encapsulation side of the encapsulation plate.

[0014] Preferably, the encapsulation end is set as an array of encapsulation grooves arranged in a row corresponding to the positions of the chips one by one; a feed hole communicating with the feed pipe is arranged on the groove wall of the encapsulation groove, and a heat setting layer is also arranged, an air hole communicating with the gas charging and discharging pump is arranged at the top of the groove, and an air outlet member that movably covers the air hole is also arranged; the cutting end is set as a cutting groove corresponding to the positions of the rows of pins; the cutting groove is located above and below each row of encapsulation grooves, and a cutting member is arranged in the groove; limiting grooves for positioning the pins and communicating with the cutting groove are arranged at the upper and lower ends of the encapsulation groove.

[0015] Preferably, a gas storage cavity is arranged behind the encapsulation groove; a piston plate that moves back and forth is arranged in the gas storage cavity, the front end of the gas storage cavity is communicated with the air hole through an air duct, and the rear end is communicated with the gas charging and discharging pump through a trachea; the air outlet member is set to have a one-way air outlet, and under the buoyancy effect, the air outlet member moves up and down at the position of the air hole.

[0016] Preferably, an outward expansion opening is arranged at the orifice of the air hole, and a circle of limiting holes is arranged on the outer periphery of the air hole; the air outlet member includes a floating cover plate that matches the outward expansion opening; a plug that matches the orifice of the air hole is arranged at the center of the floating cover plate, and one-way valve openings and limiting rods are alternately arranged on the outer periphery; the limiting rods slide into the limiting holes.

[0017] Preferably, the cutting member includes a cutting frame slidably arranged in the cutting groove; a retractable cutting knife is arranged on the cutting frame.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects: By setting up the cooperation between the conveying unit and the feeding and discharging unit, the staff can load and unload materials outside the encapsulation manufacturing box, and the whole encapsulation process is automatic with simple operation. By setting up the cooperation between the clamping component and the encapsulation component, the clamping component uses the moving block to move left and right to adjust the width of the frame structure, and uses the extending moving block to move up and down to adjust the length of the frame structure, so that the frame structure matches the overall size of the chip board. When fixing the chip, it is ensured that the chip is laid flat and in precise position for subsequent one-to-one corresponding encapsulation. The encapsulation component moves to both sides of the chip and introduces raw materials into the encapsulation groove through the feeding hole to encapsulate the chip. During encapsulation, an air outlet part and a piston plate are set to cooperate to gradually extract the air in the encapsulation groove to avoid generating encapsulation bubbles and affecting the encapsulation quality. After encapsulation, the cutting part cuts off the pins at the set positions. Finally, through the movement of the piston plate, air can be exhausted into the encapsulation groove to accelerate the cooling and demolding of the encapsulated chip, improving the encapsulation effect and efficiency. Ultimately, the present invention promotes the efficient and batch manufacturing of integrated circuits through the automatic and high-quality encapsulation of chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a structural diagram of an encapsulation manufacturing device for integrated circuits;

[0020] Figure 2 is Figure 1 an enlarged view of part A in

[0021] Figure 3 is a structural diagram of the feeding and discharging unit and the clamping component;

[0022] Figure 4 is a structural diagram of the clamping component;

[0023] Figure 5 is Figure 4 an enlarged view of part B in

[0024] Figure 6 is a structural diagram of the conveying unit and the encapsulation component;

[0025] Figure 7 is a structural diagram of the encapsulation component;

[0026] Figure 8 is Figure 7 an enlarged view of part C in

[0027] Figure 9 is Figure 7 a cross-sectional view of part C in

[0028] Figure 10 is Figure 9 an enlarged view of part D in

[0029] Reference numerals: 1, encapsulation manufacturing box; 2, conveying unit; 201, conveyor belt; 202, drive box; 203, conveying roller; 3, discharge table; 4, inlet and outlet unit; 401, track; 402, slider; 403, lifting drive member; 404, mounting bracket; 5, clamping assembly; 501, lateral positioning member; 50101, lateral positioning frame; 50102, moving block; 50103, lateral clamping plate; 502, longitudinal positioning member; 50201, longitudinal positioning frame; 50202, second telescopic drive member; 50203, longitudinal clamping plate; 503, distance sensor; 504 conveyor belt; 6, encapsulation assembly; 601, encapsulation end; 602, cutting end; 603, encapsulation plate; 604, limiting groove; 605, mounting seat; 606, groove; 607, feed pipe; 608, inflation and deflation pump; 609, air outlet member; 60901, floating cover plate; 60902, one-way valve port; 60903, limiting rod; 60904, plug; 610, cutting member; 61001, cutting frame; 61002, cutting knife; 611, air storage cavity; 612, piston plate; 613, feed hole; 614, air passage; 615, outward expansion port; 616, limiting hole; 617, air pipe; 7, chip; 8, pin; 9, frame. Detailed implementation manners

[0030] Example 1, as Figure 1 - Figure 2 shown, the present invention provides an encapsulation manufacturing device for integrated circuits, including an encapsulation manufacturing box 1, a clamping assembly 5 and an encapsulation assembly 6. Conveying units 2 are respectively arranged on both sides of the encapsulation manufacturing box 1, an inlet and outlet unit 4 is arranged at the upper end of the middle part, and a discharge table 3 is arranged at the lower end of the middle part; the clamping assembly 5 is arranged as a frame structure composed of two groups of lateral positioning members 501 and two groups of longitudinal positioning members 502, clamps a plate of uncut chips 7 from the outer periphery, and is suspended into the encapsulation manufacturing box 1 through the inlet and outlet unit 4; the encapsulation assembly 6 is arranged on the conveying unit 2 and is paired and cooperated to encapsulate and disconnect a plate of chips 7 on the clamping assembly 5 from both sides.

[0031] Each pair of encapsulation assemblies 6 is arranged in a mirror image on both sides of the clamping assembly 5, and an encapsulation end 601 corresponding to the position of the chip 7 one by one and a cutting end 602 corresponding to the position of the pin 8 are respectively arranged on the opposite sides; the encapsulation end 601 injects raw materials to synchronously injection-mold and encapsulate a plate of chips 7 from both sides; the cutting end 602 synchronously cuts off the row of pins 8 from both sides; after the chips 7 are encapsulated and disconnected, they leave the encapsulation manufacturing box 1 from the discharge table 3.

[0032] As Figure 3 shown, the inlet and outlet unit 4 includes a track 401 located at the top of the encapsulation manufacturing box 1; a slider 402 is slidably arranged on the track 401; a mounting bracket 404 is connected below the slider 402 through a lifting drive member 403; a group of lateral positioning members 501 is connected to the mounting bracket 404.

[0033] The head end of the track 401 extends outside the encapsulation manufacturing box 1 for the staff to operate, and the tail end extends between the two sets of conveying units 2 so as to be opposite to the position of the encapsulation component 6; the slider 402 is driven by the driving structure of the track 401 to drive the clamping component 5 to move in and out along the track 401.

[0034] As Figure 4 - Figure 5 shown, the lateral positioning member 501 includes a lateral positioning frame 50101; the lateral positioning frame 50101 located above the frame structure is connected to the mounting frame 404, and lateral clamping grooves are provided at the opposite ends of the upper and lower lateral positioning frames 50101; a lateral clamping plate 50103 is arranged in the lateral clamping groove, and the two sides of the upper and lower lateral positioning frames 50101 are connected to the moving block 50102 through a first telescopic driving member.

[0035] The longitudinal positioning member 502 includes a second telescopic driving member 50202 located between the upper and lower sets of moving blocks 50102, and also includes a longitudinal positioning frame 50201 connected to the outer shell of the second telescopic driving member 50202; longitudinal clamping grooves are provided at the opposite ends of the left and right longitudinal positioning frames 50201; a longitudinal clamping plate 50203 is arranged in the longitudinal clamping groove.

[0036] It should be further noted that the first telescopic driving member is a single-headed cylinder, and the two single-headed cylinder telescopic rod ends drive the moving block 50102 to move left and right synchronously to adjust the width of the frame structure to match the uncut chip 7. The frames 9 at the upper and lower ends of the chip 7 board are respectively clamped by the lateral clamping plates 50103 at the corresponding positions.

[0037] It should be further noted that the second telescopic driving member 50202 is a double-headed bidirectional cylinder, which drives the moving block 50102 to move up and down through the double-headed bidirectional cylinder to adjust the length of the frame structure to match the uncut chip 7; the frames 9 on the left and right sides of the chip 7 board are respectively clamped by the longitudinal clamping plates 50203 at the corresponding positions.

[0038] Finally, by adjusting the frame structure to be the same size as the chip 7 board and then clamping and fixing it, the chip 7 is suspended and flattened to ensure the subsequent encapsulation effect.

[0039] It should be further noted that both the longitudinal clamping plate 50203 and the lateral clamping plate 50103 are arranged in pairs and clamp from both sides, and the clamping distance can be adjusted by the cylinder to ensure the clamping force on the frame 9; distance sensors 503 are arranged on both the longitudinal clamping plate 50203 and the lateral clamping plate 50103 and face the inner frame of the frame structure.

[0040] The distance sensor 503 positions the outermost chips 7. When assisting the staff in the clamping operation, the plate of chips 7 is fixed at the center of the frame structure for subsequent further precise encapsulation.

[0041] As Figure 6 shown, the conveying unit 2 includes left and right conveyor belts 201 that rotate in opposite directions; the encapsulation assembly 6 is arranged on the conveyor belt 201 and moves synchronously with the rotation of the conveyor belt 201.

[0042] It should be further noted that the conveyor belts 201 are arranged in pairs, and the drive box 202 drives the upper and lower conveyor rollers 203 to rotate; the conveyor belts 201 are sleeved on the conveyor rollers 203; the encapsulation assembly 6 is arranged between each pair of conveyor belts 201 and is driven to move by the conveyor belts 201 on both sides.

[0043] When the encapsulation assemblies 6 move to face each other, the chips 7 between them can be encapsulated. When the encapsulation assemblies 6 move apart, the cut chips 7 after encapsulation are peeled off.

[0044] As Figure 7 shown, the encapsulation assembly 6 includes a mounting seat 605 detachably installed on the conveyor belt 201; a translation driving member is arranged on the mounting seat 605; the encapsulation plate 603 is driven by the translation driving member to move outside the mounting seat 605, and a feed pipe 607 and a gas charging and discharging pump 608 are arranged outside the encapsulation plate 603; the cutting end 602 and the encapsulation end 601 are both arranged on the encapsulation side of the encapsulation plate 603.

[0045] It should be further noted that the translation driving member is set as a translation cylinder located between each pair of conveyor belts 201 for driving the encapsulation plate 603 to translate.

[0046] When two sets of opposite encapsulation plates 603 move to fit the chips 7, the chips 7 can be positioned, encapsulated, and cut one by one. When two sets of opposite encapsulation plates 603 move away from the chips 7, the encapsulated chips 7 can be peeled off.

[0047] As Figure 7 - Figure 8 shown, the encapsulation end 601 is set as an array of encapsulation grooves corresponding to the positions of the chips 7 one by one; feed holes 613 communicating with the feed pipe 607 are arranged on the groove walls of the encapsulation grooves, and a heat setting layer is also arranged. Air holes communicating with the gas charging and discharging pump 608 are arranged at the top of the grooves, and an air outlet member 609 that movably covers the air holes is also arranged. The cutting end 602 is set as a cutting groove corresponding to the positions of the rows of pins 8; the cutting groove is located above and below each row of encapsulation grooves, and a cutting member 610 is arranged in the groove. Limiting grooves 604 for positioning the pins 8 and communicating with the cutting groove are arranged at the upper and lower ends of the encapsulation grooves, and grooves 606 corresponding to the internal frame 9 are also arranged.

[0048] During encapsulation, the two groups of encapsulation boards 603 move to face each other, and the chips 7 are respectively snapped into the notches of the encapsulation slots, and the pins 8 are stuck in the limiting slots 604. Then, the feed pipe 607 is connected to the raw material end, and the raw material can be introduced into the encapsulation slot through the feed hole 613. As the raw material increases and the liquid level rises, the air inside is pumped out through the air holes, and the air outlet part 609 finally seals the air holes as the liquid level rises. The cutting part 610 can cut off the pins 8 at the notch by extending out of the cutting slot.

[0049] As Figure 9 - Figure 10 shown, a gas storage cavity 611 is arranged behind the encapsulation slot; a piston plate 612 that moves back and forth is arranged in the gas storage cavity 611. The front end of the gas storage cavity 611 is communicated with the air hole through an air duct 614, and the rear end is communicated with an air charging and discharging pump 608 through an air pipe 617; the air outlet part 609 is set to discharge air unidirectionally, and under the buoyancy effect, the air outlet part 609 moves up and down at the position of the air hole.

[0050] When the liquid level of the raw material is insufficient, the air outlet part 609 leaves the air hole under its own weight. By moving the piston plate 612, the gas on one side of the chip 7 can be pumped away. As the liquid level rises, the air outlet part 609 gradually seals the air hole. After the encapsulation is formed, by moving the piston plate 612, the encapsulation slot can be exhausted to accelerate cooling and demolding.

[0051] It should be further noted that an outward expansion port 615 is arranged at the orifice of the air hole, and a circle of limiting holes 616 is arranged on the outer periphery of the air hole; the air outlet part 609 includes a floating cover plate 60901 that matches the outward expansion port 615; a plug 60904 that matches the orifice of the air hole is arranged at the center of the floating cover plate 60901, and one-way valve ports 60902 and limiting rods 60903 are alternately arranged on the outer periphery; the limiting rods 60903 slide into the limiting holes 616.

[0052] When the liquid level is insufficient, the floating cover plate 60901 extends out of the outward expansion port 615. There is a ventilation space left on the outer periphery of the floating cover plate 60901. As the liquid level rises, the floating cover plate 60901 moves up to seal the outward expansion port 615. The plug 60904 enters the air hole. After the encapsulation is formed, the one-way valve port 60902 discharges air to the encapsulation slot to accelerate cooling and demolding.

[0053] As Figure 9 shown, the cutting part 610 includes a cutting frame 61001 that is slidably arranged in the cutting slot; a retractable cutting knife 61002 is arranged on the cutting frame 61001.

[0054] The cutting frame 61001 drives the up and down movement through a combined structure of a lead screw and a motor to adjust the cutting position. The cutting knives 61002 that are arranged one on the left and one on the right are extended at the corresponding positions to cut off the pins 8.

[0055] Embodiment 2. Based on the packaging manufacturing equipment for integrated circuits in Embodiment 1, a chip packaging method for integrated circuit manufacturing is proposed, and the steps are as follows:

[0056] S1. The staff stands outside the packaging manufacturing box 1; the slider 402 is driven by the driving structure of the track 401, driving the clamping assembly 5 to move out of the packaging manufacturing box 1 along the track 401;

[0057] S2. The moving block 50102 is driven by the telescopic driving member 1 to move left and right to adjust the width of the frame structure to match the uncut chip 7; the frames 9 at the upper and lower ends of the chip 7 board are respectively clamped by the transverse clamping plates 50103 at the corresponding positions; the moving block 50102 is driven by the telescopic driving member 2 50202 to move up and down to adjust the length of the frame structure to match the uncut chip 7; the frames 9 on the left and right sides of the chip 7 board are respectively clamped by the longitudinal clamping plates 50203 at the corresponding positions; the distance sensor 503 positions the outermost chips 7 to assist the staff in the clamping operation;

[0058] S3. The clamping assembly 5 clamping the chip 7 enters the packaging manufacturing box 1 along the track 401 and moves to between the two conveyor belts 201;

[0059] S4. The packaging components 6 move to face each other in pairs, and the chips 7 are respectively snapped into the openings of the packaging slots, and the pins 8 are stuck in the limiting slots 604; then the feed pipe 607 is connected to the raw material end, and the raw material can be introduced into the packaging slot through the feed hole 613; when the liquid level is insufficient, the floating cover plate 60901 extends out of the outer expansion port 615; there is a ventilation space left on the outer periphery of the floating cover plate 60901; as the liquid level rises, the floating cover plate 60901 moves up to seal the outer expansion port 615, and the gas on one side of the chip 7 can be pumped away by the movement of the piston plate 612; when there is more and more raw material and the liquid level is getting higher and higher, the air outlet member 609 gradually seals the air holes, and the injection molding is accelerated by heating;

[0060] S5. The cutting frame 61001 drives the up and down movement through the combined structure of the lead screw and the motor to adjust the cutting position; the cutting knives 61002 on the left and right are extended at the corresponding positions to cut off the pins 8, separating the adjacent chips 7;

[0061] S6. After the packaging is formed, the air in the packaging slot can be exhausted by the movement of the piston plate 612 to accelerate cooling and demolding;

[0062] S7. The packaging components 6 move to separate, and the packaged and cut chips 7 are peeled off and fall on the discharge table 3.

[0063] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those skilled in the relevant art.

Claims

1. An integrated circuit packaging manufacturing device, characterized in that: include: A packaging manufacturing box (1), wherein conveying units (2) are respectively arranged on both sides of the packaging manufacturing box (1), an inlet and outlet unit (4) is arranged at the middle upper end, and a discharge platform (3) is arranged at the middle lower end; A clamping assembly (5), the clamping assembly (5) is configured as a frame structure consisting of two groups of transverse positioning members (501) and two groups of longitudinal positioning members (502), clamping an uncut chip (7) from the periphery, and hanging it into the packaging manufacturing box (1) through the entry and exit unit (4); and a packaging assembly (6), which is arranged on the conveying unit (2) and cooperates in pairs to package and disconnect a chip (7) on the clamping assembly (5) from both sides; Each pair of packaging components (6) is arranged in a mirror image on both sides of the clamping component (5), and packaging ends (601) corresponding to the positions of the chips (7) and cutting ends (602) corresponding to the positions of the pins (8) are respectively arranged on the opposite sides; the packaging ends (601) are injected with raw materials to perform synchronous injection molding packaging on a board of chips (7) from both sides; the cutting ends (602) are used to synchronously cut off rows of pins (8) from both sides; and after the chips (7) are packaged and disconnected, they leave the packaging manufacturing box (1) from the discharge table (3).

2. The integrated circuit packaging manufacturing equipment according to claim 1, characterized in that: The in-and-out unit (4) comprises a track (401) located at the top of the packaging manufacturing box (1); a slider (402) is slidably arranged on the track (401); a mounting frame (404) is connected to the bottom of the slider (402) via a lifting drive member (403); and a group of transverse positioning members (501) are connected to the mounting frame (404).

3. The integrated circuit packaging manufacturing equipment according to claim 2, characterized in that: The transverse positioning member (501) comprises a transverse positioning frame (50101); the transverse positioning frame (50101) located above the frame structure is connected to the mounting frame (404), and transverse clamping grooves are arranged on opposite ends of the upper and lower transverse positioning frames (50101); transverse clamping plates (50103) are arranged in the transverse clamping grooves, and both sides of the upper and lower transverse positioning frames (50101) are connected to the moving block (50102) through a telescopic driving member; The longitudinal positioning member (502) includes a telescopic driving member 2 (50202) located between the upper and lower groups of moving blocks (50102), and also includes a longitudinal positioning frame (50201) connected to the outer shell of the telescopic driving member 2 (50202); longitudinal clamping grooves are arranged on the opposite ends of the longitudinal positioning frames (50201) on the left and right sides; and a longitudinal clamping plate (50203) is arranged in the longitudinal clamping groove.

4. The integrated circuit packaging manufacturing equipment according to claim 3, characterized in that: The longitudinal clamping plates (50203) and the transverse clamping plates (50103) are arranged in pairs, clamping from both sides, and the clamping distance is adjustable; Both the longitudinal clamping plate (50203) and the transverse clamping plate (50103) are provided with distance sensors (503) facing the inner frame of the frame-shaped structure.

5. The integrated circuit packaging manufacturing equipment according to claim 1, characterized in that: The conveying unit (2) comprises a conveying belt (201) which rotates in opposite directions, left and right; the packaging assembly (6) is arranged on the conveying belt (201) and moves synchronously with the rotation of the conveying belt (201).

6. The integrated circuit packaging manufacturing equipment according to claim 5, characterized in that: The packaging assembly (6) comprises a mounting seat (605) which is detachably mounted on the conveyor belt (201); a translation driving member is arranged on the mounting seat (605); the packaging plate (603) is driven by the translation driving member to move outside the mounting seat (605), and a feeding pipe (607) and an air charging and discharging pump (608) are arranged outside the packaging plate (603); the cutting end (602) and the packaging end (601) are both arranged on the packaging side of the packaging plate (603).

7. The integrated circuit packaging manufacturing equipment according to claim 6, characterized in that: The packaging end (601) is configured as packaging grooves arranged in a row corresponding to the positions of the chips (7); a feeding hole (613) connected to a feeding pipe (607) is provided on the groove wall of the packaging groove, and a heating and shaping layer is also provided; an air hole connected to a charging and discharging air pump (608) is provided at the top of the groove, and an air outlet member (609) movably covering the air hole is also provided; The cutting end (602) is arranged as a cutting groove corresponding to the position of the rows of pins (8); the cutting groove is located above and below each row of packaging grooves, and a cutting piece (610) is arranged in the groove; The upper and lower ends of the packaging groove are provided with limiting grooves (604) which are connected to the cutting groove and are used to position the pin (8).

8. The integrated circuit packaging manufacturing equipment according to claim 7, characterized in that: An air storage chamber (611) is arranged behind the packaging groove; a piston plate (612) that moves forward and backward is arranged in the air storage chamber (611); the front end of the air storage chamber (611) is connected to the air hole through the air channel (614), and the rear end is connected to the charging and discharging air pump (608) through the air pipe (617); The air outlet member (609) is configured to allow air to be discharged in one direction, and the air outlet member (609) moves up and down at the air hole position under the action of buoyancy.

9. The integrated circuit packaging manufacturing equipment according to claim 8, characterized in that: An outer expansion opening (615) is provided on the opening of the air hole, and a circle of limiting holes (616) is provided on the outer periphery of the air hole; The air outlet member (609) comprises a floating cover plate (60901) matched with the outer expansion port (615); a plug (60904) matched with the air hole port is arranged at the center of the floating cover plate (60901), and a one-way valve port (60902) and a limit rod (60903) are alternately arranged on the periphery; the limit rod (60903) slides and extends into the limit hole (616).

10. The integrated circuit packaging manufacturing equipment according to claim 7, characterized in that: The cutting member (610) comprises a cutting frame (61001) slidably arranged in the cutting groove; a retractable cutting knife (61002) is arranged on the cutting frame (61001).

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