Substrate transfer and semiconductor manufacturing apparatus

Abstract

The invention provides a substrate conveying device and semiconductor manufacturing equipment. The substrate conveying device comprises a center fixing shaft, a substrate conveying mechanism and a substrate conveying mechanism, the first conveying roller comprises a first fixing piece and a first rolling piece, the first fixing piece is fixed to the center fixing shaft, the periphery of the first fixing piece is sleeved with the first rolling piece, and the first rolling piece can rotate around the center fixing shaft; the first rolling piece comprises a plurality of first through holes; the air exhaust channel comprises a first air exhaust pipeline, the first air exhaust pipeline is located in the first fixing piece and comprises a first air inlet pipe opening formed in the direction of the plane where the base plate is located, and one first through hole of the first rolling piece communicates with the first air inlet pipe opening. According to the substrate conveying device, damage of mechanical stress to the surface of the substrate is avoided in an adsorption conveying mode, and the problems of substrate breakage, film layer stripping and the like caused by the mechanical stress are solved.

Description

Technical Field

[0001] The present application relates to the technical field of cleaning equipment, and particularly to a substrate transfer device and a semiconductor manufacturing equipment. Background Art

[0002] In the display industry, glass substrates need to undergo corresponding processes during transfer in wet etching, photolithography processes, and cleaning processes. For example, the devices used in existing wet process methods for substrates usually use transfer rollers (Rollers) arranged in sequence on a conveyor belt to carry glass substrates and complete the transfer of substrates between processes. However, during the transfer process, the substrate may be damaged by the upper transfer rollers, resulting in product fragmentation or damage to the surface film layer. Summary of the Invention

[0003] In view of this, the purpose of the present application is to provide a substrate transfer device and a semiconductor manufacturing equipment, which solve the problems of breakage and film layer peeling caused by mechanical pressure through the adsorption transfer method, and at the same time improve the transfer stability.

[0004] Based on the above purpose, the present application provides a substrate transfer device, which includes: A central fixed shaft; A first transfer roller, including a first fixing member and a first rolling member. The first fixing member is fixed to the central fixed shaft, the first rolling member is sleeved outside the first fixing member, and the first rolling member can rotate around the central fixed shaft; the first rolling member includes a plurality of first through holes; An air extraction channel, including a first air extraction pipeline. The first air extraction pipeline is located inside the first fixing member. The first air extraction pipeline includes a first air inlet port arranged in the direction of the plane where the substrate is located, and one of the first through holes of the first rolling member is communicated with the first air inlet port.

[0005] Optionally, the substrate transfer device further includes: A second transfer roller, including a second fixing member and a second rolling member. The second fixing member is fixed to the central fixed shaft, the second rolling member is sleeved outside the second fixing member, and the second rolling member can rotate around the central fixed shaft; the second rolling member includes a plurality of second through holes; Wherein, the second transfer roller and the first transfer roller are arranged at an axial interval along the central fixed shaft. The air extraction channel includes a second air extraction pipeline. The second air extraction pipeline is located inside the second fixing member. The second air extraction pipeline includes a second air inlet port arranged in the direction of the plane where the substrate is located, and one of the second through holes of the second rolling member is communicated with the second air inlet port.

[0006] Optionally, the air extraction channel includes a central pipeline located within the central fixed shaft; The first air extraction pipeline includes a first connection pipe orifice disposed opposite to the first air inlet orifice, and the first connection pipe orifice communicates with the central pipeline; The second air extraction pipeline includes a second connection pipe orifice disposed opposite to the second air inlet orifice, and the second connection pipe orifice communicates with the central pipeline.

[0007] Optionally, the first conveying roller includes a first bearing located between the first fixing member and the first rolling member, and there is a gap between the first fixing member and the first rolling member.

[0008] Optionally, a plurality of first through holes are uniformly distributed along the circumferential direction of the first rolling member.

[0009] Optionally, the first rolling member includes a first supporting portion and first side wall portions located on both sides of the first supporting portion. The first supporting portion covers the outer peripheral surface of the first fixing member, and the first side wall portions cover the side wall surfaces of the first fixing member.

[0010] Optionally, the second conveying roller includes a second bearing located between the second fixing member and the second rolling member, and there is a gap between the second fixing member and the second rolling member.

[0011] Optionally, a plurality of second through holes are uniformly distributed along the circumferential direction of the second rolling member.

[0012] Optionally, the second rolling member includes a second supporting portion and second side wall portions located on both sides of the second supporting portion. The second supporting portion covers the outer peripheral surface of the second fixing member, and the second side wall portions cover the side wall surfaces of the second fixing member.

[0013] Optionally, the substrate conveying device further includes: A rotation driving assembly, including a driving member, a first transmission member, and a second transmission member. The output end of the driving member is connected to the first rolling member through the first transmission member; the second rolling member is connected to the first rolling member through the second transmission member, so that the second rolling member rotates synchronously with the first rolling member.

[0014] Optionally, the substrate conveying device further includes: A vacuum pumping device connected to the central pipeline.

[0015] Optionally, the substrate conveying device includes a plurality of parallel central fixed shafts.

[0016] Optionally, a plurality of the first transfer rollers and a plurality of the second transfer rollers are provided on the same central fixed shaft; On the same central fixed shaft, the first air extraction pipeline in each of the first transfer rollers and the second air extraction pipeline in each of the second transfer rollers communicate with the same central pipeline.

[0017] Based on the same inventive concept, the present application also provides a substrate transfer device for carrying and transferring a substrate; the substrate transfer device includes: A central fixed shaft; A first transfer roller, including a first fixing member and a first rolling member, the first fixing member is fixed to the central fixed shaft, the first rolling member is sleeved around the periphery of the first fixing member, and the first rolling member can rotate around the central fixed shaft; the first rolling member includes a plurality of first through holes; A second transfer roller, including a second fixing member and a second rolling member, the second fixing member is fixed to the central fixed shaft, the second rolling member is sleeved around the periphery of the second fixing member, and the second rolling member can rotate around the central fixed shaft; the second rolling member includes a plurality of second through holes; An air extraction channel, including a first air extraction pipeline, a second air extraction pipeline and a central pipeline, the central pipeline is located inside the central fixed shaft, the first air extraction pipeline is located inside the first fixing member and communicates with at least one of the first through holes; the second air extraction pipeline is located inside the second fixing member and communicates with at least one of the second through holes; the first air extraction pipeline and the second air extraction pipeline respectively communicate with the central pipeline; both the first air extraction pipeline and the second air extraction pipeline extend in a direction perpendicular to the direction of the substrate.

[0018] Based on the same inventive concept, the present application also provides a semiconductor manufacturing device, including the substrate transfer device described in any one of the above.

[0019] The substrate transfer device provided by the present application is communicated with the air extraction channel through the first through holes of the first rolling member, and an adsorption area can be formed on the surface of the first rolling member, so as to stably adsorb the substrate on the surface of the first rolling member by using negative pressure, replacing the traditional mechanical clamping or pressure contact method, avoiding damage to the surface of the substrate caused by mechanical stress, and solving problems such as substrate fragmentation and film layer peeling caused by mechanical pressure. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic structural diagram of a related substrate transfer device; Figure 2 It is a schematic structural diagram of the substrate transfer device provided by an embodiment of the present application; Figure 3 It is a schematic internal structure diagram of the substrate transfer device provided by an embodiment of the present application; Figure 4 It is a schematic internal structure diagram of the substrate transfer device provided by another embodiment of the present application; Figure 5 It is Figure 4 A cross-sectional view along the A-A direction; Figure 6 It is a schematic structural diagram of the substrate transfer device provided by another embodiment of the present application; Figure 7 It is a schematic internal structure diagram of the substrate transfer device provided by another embodiment of the present application; Figure 8 It is a schematic structural diagram of the substrate transfer device provided by another embodiment of the present application in a working state; Figure 9 It is a top view of the substrate transfer device provided by an embodiment of the present application in a working state; Figure 10 It is a schematic partial structure diagram of a display panel manufactured by a semiconductor manufacturing device provided by an embodiment of the present application.

[0022] Marking description: 100. Substrate transfer device; 1. Central fixed shaft; 2. First transfer roller; 21. First fixing member; 22. First rolling member; 220. First through hole; 221. First supporting portion; 222. First side wall portion; 23. First bearing; 3. Second transfer roller; 31. Second fixing member; 32. Second rolling member; 320. Second through hole; 321. Second supporting portion; 322. Second side wall portion; 33. Second bearing; 4. Air extraction channel; 40. Central pipeline; 41. First air extraction pipeline; 411. First air inlet; 412. First connection port; 42. Second air extraction pipeline; 421. Second air inlet; 422. Second connection port; 5. Rotating drive assembly; 50. Driving member; 51. First transmission member; 52. Second transmission member; 6. Vacuum pumping device; 7. Substrate; 71. Light emitting unit; 711. Anode layer; 712. Light emitting functional layer; 713. Cathode layer; 72. Pixel definition layer; 720. Pixel opening; 73. Isolation structure; 730. Isolation opening; 731. Supporting portion; 732. Blocking portion; 74. Encapsulation unit. Detailed implementation manners

[0023] To make the objectives, technical solutions, and advantages of this application more clear and understandable, the following further elaborates on this application in detail with reference to specific embodiments and the accompanying drawings.

[0024] It should be noted that unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the ordinary meanings understood by those with ordinary skills in the field to which this application belongs. The "first", "second", and similar terms used in the embodiments of this application do not denote any order, quantity, or importance, but are only used to distinguish different components. Words such as "including" or "comprising" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. Words such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0025] In the semiconductor manufacturing process, since the film layer deposited on the substrate needs to be etched, a wet cleaning device is often used to clean the substrate during the etching process. For example, the substrate needs to be cleaned by high-pressure water washing, air knives, or liquid knife units. To prevent the substrate from floating or shifting under the impact of high-pressure fluids, a double-roller (Double Roller) mechanical fixing scheme is usually adopted.

[0026] Figure 1 It is a schematic structural diagram of a related substrate transfer device. As Figure 1 shown, in the related art, transfer rollers are respectively arranged on the upper and lower sides of the substrate 7, and the upper and lower surfaces of the substrate 7 are contacted by the transfer rollers on both sides, thereby realizing the transfer of the substrate 7.

[0027] Through research by the inventors of this application, it is found that the related art adopts a double-roller scheme with upper and lower settings, and there are the following problems: The upper transfer roller directly presses on the surface of the substrate. If the substrate has a brittle film layer (such as an ITO film), the pressure is likely to cause the film layer to peel off, and the fragments contaminate the process environment and reduce the yield. The fixing method of the double rollers is mechanical fixing. If the gap between the double rollers becomes smaller due to vibration or installation errors, it may cause the substrate to be crushed under pressure. Mechanical fixing is difficult to completely suppress the minute vibrations of the substrate during high-speed transfer or high-pressure impact, affecting the process accuracy.

[0028] Based on this, this application provides a substrate transfer device and a semiconductor manufacturing equipment to solve the above problems.

[0029] Figure 2 It is a schematic structural diagram of the substrate transfer device provided by an embodiment of this application.Figure 3 The figure is a schematic internal structure diagram of a substrate transfer device provided by an embodiment of the present application. As Figure 2 , Figure 3 shown, an embodiment of the present application provides a substrate transfer device. The substrate transfer device 100 is used to carry and transfer a substrate 7. The substrate transfer device 100 includes a central fixed shaft 1, a first transfer roller 2, and an air extraction channel 4. The first transfer roller 2 includes a first fixing member 21 and a first rolling member 22. The first fixing member 21 is fixed to the central fixed shaft 1. The first rolling member 22 is sleeved around the periphery of the first fixing member 21, and the first rolling member 22 can rotate around the central fixed shaft 1. The first rolling member 22 includes a plurality of first through holes 220. The air extraction channel 4 includes a first air extraction pipeline 41. The first air extraction pipeline 41 is located inside the first fixing member 21. The first air extraction pipeline 41 includes a first air inlet 411 arranged in the direction of the plane where the substrate 7 is located. One of the first through holes 220 on the first rolling member 22 is communicated with the first air inlet 411.

[0030] For example, relative to the transfer roller on the central fixed shaft 1, the direction of the plane where the substrate 7 is located is the upward direction. Then, the first air inlet 411 is located at the upper end of the first air extraction pipeline 41. The first through hole 220 currently communicated with the first air inlet 411 contacts the passing substrate 7. After the air extraction operation, an adsorption area is formed on the surface of the transfer roller.

[0031] Specifically, the first fixing member 21 and the central fixed shaft 1 are fixedly connected. For example, the first fixing member 21 and the central fixed shaft 1 can be integrally formed or welded and fixed. Or, for the convenience of installation, the first fixing member 21 and the central fixed shaft 1 are detachably fixedly connected. The first rolling member 22 is installed around the periphery of the first fixing member 21 by sleeving and can rotate around the central fixed shaft 1. A plurality of first through holes 220 are provided on the surface of the first rolling member 22. The first air extraction pipeline 41 of the air extraction channel 4 is arranged inside the first fixing member 21 and is communicated with one of the first through holes 220 above. When the air extraction channel 4 is started, the vacuum adsorption force acts on the substrate 7 through the first through hole 220 communicated with the first air inlet 411, and the substrate 7 is adsorbed on the surface of the first rolling member 22, thereby realizing stable transfer.

[0032] The substrate transfer device 100 according to the embodiment of the present application is communicated with the air extraction channel 4 through the first through hole 220 of the first rolling member 22 that is currently in contact with the substrate 7, and a vacuum adsorption point can be formed at the position of the first through hole 220, so as to stably adsorb the substrate 7 on the surface of the first rolling member 22 by using negative pressure, replacing the traditional mechanical clamping or pressure contact method, avoiding damage to the substrate surface caused by mechanical stress, and solving problems such as substrate fragmentation and film layer peeling caused by mechanical pressure. Among them, the first rolling member 22 can rotate around the central fixed shaft 1, so that the substrate 7 rolls forward with the roller during the transfer process, reducing sliding friction and reducing the risk of scratching the substrate surface. The nested design of the first fixing member 21 and the first rolling member 22, combined with the built-in air extraction channel 4, realizes the integration of the support and adsorption functions, simplifies the device structure, and is convenient for installation and maintenance.

[0033] Figure 4 It is a schematic internal structure diagram of a substrate transfer device provided in another embodiment of the present application; Figure 5 is Figure 4 a cross-sectional view taken along the A-A direction. As Figure 4 、 Figure 5 shown, in some embodiments, the first transfer roller 2 includes a first bearing 23, the first bearing 23 is located between the first fixing member 21 and the first rolling member 22, and there is a gap between the first fixing member 21 and the first rolling member 22.

[0034] Specifically, a first bearing 23 is provided in the first transfer roller 2, which is located between the first fixing member 21 and the first rolling member 22, and there is a gap (not shown in the figure) between the first fixing member 21 and the first rolling member 22 to avoid affecting the relative rotation of the two. The friction between the first rolling member 22 and the first fixing member 21 is reduced by the first bearing 23, so that the first rolling member 22 rotates more smoothly, and at the same time, vibration caused by mechanical contact is avoided. Among them, the bearing support enables the first rolling member to rotate freely, reduces the mechanical friction between the rolling member and the fixing member, reduces power loss, and prolongs the service life of the device. The gap design allows the rolling member to float radially or axially within a small range, adapts to the position deviation or vibration during the substrate transfer process, avoids stress concentration caused by rigid connection, and reduces the risk of substrate breakage due to jamming or excessive resistance.

[0035] In some embodiments, a plurality of first through holes 220 are evenly distributed along the circumferential direction of the first rolling member 22.

[0036] Specifically, the first through-holes 220 form adsorption points with a uniform layout on the first rolling member 22, which can ensure balanced force on the substrate surface. Among them, the circumferentially uniform through-hole layout makes the vacuum suction force symmetrically distributed on the surface of the rolling member, avoiding too strong or too weak local suction force, and preventing the substrate from deforming (such as bending, wrinkling) or sliding and shifting due to uneven adsorption. The uniform adsorption points ensure full contact between the substrate and the surface of the rolling member. Especially during high-speed transmission, it reduces the influence of air retention or air flow disturbance on the adsorption effect and improves the adsorption reliability.

[0037] In some embodiments, the first rolling member 22 includes a first support portion 221 and first side wall portions 222 located on both sides of the first support portion 221. The first support portion 221 covers the outer peripheral surface of the first fixing member 21, and the first side wall portions 222 cover the side wall surfaces of the first fixing member 21.

[0038] Specifically, the first rolling member 22 includes a first support portion 221 and first side wall portions 222 on both sides. Among them, the support portion covers the outer peripheral surface of the fixing member, and the side wall portions cover the side wall surfaces of the fixing member, forming a wrapping structure for the fixing member, enhancing the structural strength of the roller, and at the same time preventing external impurities from entering the bearing area. Among them, the support portion and the side wall portions form a complete covering structure, increasing the effective contact area between the rolling member and the substrate, expanding the action range of the adsorption force, especially providing additional support for the substrate in the edge area to prevent the edge from warping or detaching from the adsorption. Covering the side wall surface of the fixing member can block impurities such as dust and liquid from entering the gap between the fixing member and the rolling member, protect the internal bearing and the exhaust pipeline, reduce the maintenance frequency, and adapt to complex working conditions such as wet cleaning and coating.

[0039] Figure 6 Schematic structural diagram of a substrate transfer device provided by another embodiment of the present application; Figure 7 Schematic internal structural diagram of a substrate transfer device provided by another embodiment of the present application; Figure 8 Schematic structural diagram of a substrate transfer device provided by another embodiment of the present application in the working state.

[0040] Such as Figure 6 、 Figure 7 、 Figure 8As shown, in some other embodiments, in some embodiments, the substrate conveying device 100 further includes a second conveying roller 3, including a second fixing member 31 and a second rolling member 32, the second fixing member 31 is fixed to the central fixed shaft 1, the second rolling member 32 is sleeved on the periphery of the second fixing member 31, and the second rolling member 32 can rotate around the central fixed shaft 1; the second rolling member 32 includes a plurality of second through holes 320. Among them, the second conveying roller 3 and the first conveying roller 2 are arranged axially spaced from each other along the central fixed shaft 1, the exhaust channel 4 includes a second exhaust pipe 42, the second exhaust pipe 42 is located in the second fixing member 31, the second exhaust pipe 42 includes a second air inlet port 421 arranged in the direction of the plane where the substrate 7 is located, and one of the second through holes 320 on the second rolling member 32 is connected to the second air inlet port 421.

[0041] For example, relative to the conveying roller on the central fixed axis 1, the direction of the plane where the substrate 7 is located is upward, then the second air inlet pipe port 421 is located at the upper end of the second exhaust pipe 42, and the second through hole 320 currently connected to the second air inlet pipe port 421 contacts the passing substrate 7.

[0042] Specifically, the structure of the second conveying roller 3 is substantially the same as that of the first conveying roller 2. The second fixing member 31 is fixed to the central fixed shaft 1, and the second rolling member 32 is installed on the periphery of the second fixing member 31 by sleeve arrangement, and is provided with a second through hole 320. The second exhaust pipe 42 is embedded in the second fixing member 31 and communicated with the second through hole 320. The first and second conveying rollers are arranged axially at intervals along the central fixed shaft 1, and the central pipe 40 of the exhaust channel 4 is located at the center of the central fixed shaft 1, and is communicated with the corresponding through holes on the two rollers through the first connecting pipe port 412 and the second connecting pipe port 422, respectively. Among them, the multiple rollers are distributed along the axial direction to form multiple adsorption points, which are particularly suitable for large-size substrates, avoiding sagging or vibration in the middle caused by the weight of the substrate or external loads (such as high-pressure water washing, air knife blowing) when supported by a single roller, and improving the transmission stability. The multi-roller structure makes the substrate evenly stressed, offsets the lateral force that may be generated during the transmission process, prevents the substrate from shifting or tilting, and ensures the accuracy of linear transmission. It should be noted that the number and spacing of the first conveying rollers 2 and the second conveying rollers 3 can be flexibly adjusted according to the size of the substrate, and are not specifically limited.

[0043] Further, the air extraction channel 4 includes a central pipeline 40, and the central pipeline 40 is located in the central fixed axis 1. Among them, the first air extraction pipeline 41 includes a first connecting pipe port 412 arranged opposite to the first air inlet pipe port 411, the first air inlet pipe port 411 is used to connect to the first through hole 220, and the first connecting pipe port 412 is connected to the central pipeline 40. The second air extraction pipeline 42 includes a second connecting pipe port 422 arranged opposite to the second air inlet pipe port 421, the second air inlet pipe port 421 is used to connect to the second through hole 320, and the second connecting pipe port 422 is connected to the central pipeline 40.

[0044] Among them, the central pipeline 40 is located inside the central fixed shaft 1. The first air extraction pipeline 41 and the second air extraction pipeline 42 are respectively communicated with the central pipeline 40 through the first connection pipe orifice 412 and the second connection pipe orifice 422. The first air inlet orifice 411 and the second air inlet orifice 421 respectively correspond to the first through hole 220 and the second through hole 320, forming a vacuum path from the central pipeline to the adsorption area. This design simplifies the pipeline layout and ensures uniform distribution of the adsorption force. Through unified regulation by the central pipeline 40, the vacuum degree of each roller adsorption area is ensured to be consistent, avoiding uneven stress or adsorption failure of the substrate caused by local suction differences, especially suitable for multi-roller collaborative working scenarios.

[0045] As Figure 7 shown, in some embodiments, the second transfer roller 3 includes a second bearing 33. The second bearing 33 is located between the second fixing member 31 and the second rolling member 32, and there is a gap between the second fixing member 31 and the second rolling member 32. Similar to the first rolling member, it is ensured that the second rolling member also has low-friction rotation and self-adaptive adjustment capabilities, enabling the double-roller system to maintain consistency in rotational flexibility and stress buffering, and avoiding deviation in substrate transfer synchronism caused by jamming of a single roller.

[0046] In some embodiments, a plurality of second through holes 320 are evenly distributed along the circumferential direction of the second rolling member 32. In this way, the uniformity of the adsorption force of the second transfer roller 3 is ensured, and together with the first transfer roller 2, it forms multi-point uniform adsorption, jointly ensuring the smoothness and position accuracy of the substrate 7 during the transfer process.

[0047] As Figure 7 shown, in some embodiments, the second rolling member 32 includes a second support portion 321 and second side wall portions 322 located on both sides of the second support portion 321. The second support portion 321 covers the outer peripheral surface of the second fixing member 31, and the second side wall portions 322 cover the side wall surface of the second fixing member 31.

[0048] Among them, the structure of the second transfer roller 3 corresponds to that of the first transfer roller 2, including a second bearing 33, evenly distributed second through holes 320, and a second support portion 321 and second side wall portions 322. In this way, it can be ensured that the second transfer roller 3 is symmetric and works collaboratively with the first transfer roller 2 in function.

[0049] As Figure 8As shown, in some embodiments, the substrate transfer device 100 further includes a rotation driving assembly 5. The rotation driving assembly 5 includes a driving member 50, a first transmission member 51, and a second transmission member 52. The output end of the driving member 50 is connected to the first rolling member 22 through the first transmission member 51. The second rolling member 32 is connected to the first rolling member 22 through the second transmission member 52, so that the second rolling member 32 rotates synchronously with the first rolling member 22. Among them, the driving member 50 drives the first rolling member 22 to rotate through the first transmission member 51, and at the same time drives the second rolling member 32 to rotate synchronously through the second transmission member 52. The synchronous driving mechanism ensures that the substrate is uniformly stressed during the transfer process, avoiding substrate distortion caused by differences in roller rotation speeds.

[0050] In some embodiments, the substrate transfer device 100 further includes a vacuum pumping device 6. The vacuum pumping device 6 is connected to the central pipeline 40. Among them, the vacuum pumping device is connected to the central pipeline to provide a vacuum source. The vacuum pumping device ensures that the central pipeline and each extraction pipeline maintain a continuous and stable negative pressure. Even during high-load or dynamic transfer processes, sufficient adsorption force can be maintained to prevent the substrate from falling off due to vacuum fluctuations. It can be adapted to complex environments such as high-pressure water washing, high temperature, and high dust. By stabilizing the vacuum adsorption to offset external interference forces (such as air flow and liquid impact), the transfer reliability of the substrate under harsh working conditions is guaranteed.

[0051] Figure 9 This is a top view of the substrate transfer device provided in an embodiment of the present application in the working state. As Figure 9 shown, in some embodiments, the substrate transfer device 100 includes a plurality of parallel central fixed shafts 1. Among them, the parallel shaft layout can increase the number of rolling members, form a dense adsorption support array, adapt to the transfer of large-size or extra-large-size substrates, disperse the substrate load, and avoid deformation caused by excessive single-point stress. Specifically, the parallel shaft spacing between the central fixed shafts 1 is adjustable and can be adjusted according to the substrate width or equipment space to adapt to production lines of different specifications.

[0052] In some embodiments, a plurality of first transfer rollers 2 and a plurality of second transfer rollers 3 are provided on the same central fixed shaft 1. On the same central fixed shaft 1, the first extraction pipeline 41 in each first transfer roller 2 and the second extraction pipeline 42 in each second transfer roller 3 are communicated with the same central pipeline 40.

[0053] Among them, a plurality of first conveying rollers 2 and a plurality of second conveying rollers 3 on each central fixed shaft 1 are connected through the same central pipeline 40 to achieve unified control of the vacuum suction force, ensuring synchronous start-stop and adjustment of the adsorption forces of the rollers on the same shaft, and avoiding the substrate from falling or the conveying getting stuck due to local adsorption failure. The modular design enables a single central fixed shaft 1 to be used as an independent unit, facilitating mass production and maintenance and reducing costs; at the same time, the dense arrangement of multiple rollers can enhance the support capacity of a single shaft to meet the requirements of heavy-load or high-precision conveying.

[0054] Based on the same inventive concept, an embodiment of the present application further provides a substrate conveying device 100 for carrying and conveying a substrate 7. The substrate conveying device 100 includes a central fixed shaft 1, a first conveying roller 2, a second conveying roller 3, and an air extraction channel 4. The first conveying roller 2 includes a first fixing member 21 and a first rolling member 22. The first fixing member 21 is fixed to the central fixed shaft 1, and the first rolling member 22 is sleeved around the first fixing member 21, and the first rolling member 22 can rotate around the central fixed shaft 1; the first rolling member 22 includes a plurality of first through holes 220. The second conveying roller 3 includes a second fixing member 31 and a second rolling member 32. The second fixing member 31 is fixed to the central fixed shaft 1, and the second rolling member 32 is sleeved around the second fixing member 31, and the second rolling member 32 can rotate around the central fixed shaft 1; the second rolling member 32 includes a plurality of second through holes 320. The air extraction channel 4 includes a first air extraction pipeline 41, a second air extraction pipeline 42, and a central pipeline 40. The central pipeline 40 is located inside the central fixed shaft 1, the first air extraction pipeline 41 is located inside the first fixing member 21, the second air extraction pipeline 42 is located inside the second fixing member 31, and the first air extraction pipeline 41 and the second air extraction pipeline 42 are respectively connected to the central pipeline 40; both the first air extraction pipeline 41 and the second air extraction pipeline 42 extend in a direction perpendicular to the direction of the substrate 7.

[0055] Exemplarily, the first air extraction pipeline 41 is connected to one or more first through holes 220 corresponding to its pipe orifice position, and the second air extraction pipeline 42 is connected to one or more second through holes 320 corresponding to its pipe orifice position. After the air extraction operation, a downward suction force can be provided when the substrate 7 passes over the first conveying roller 2 and the second conveying roller 3.

[0056] The substrate transfer device 100 according to the embodiment of the present application is communicated with the air extraction channel 4 through the first through hole 220 of the first rolling member 22 and is communicated with the air extraction channel 4 through the second through hole 320 of the second rolling member 32, and different vacuum adsorption areas can be formed, so as to stably adsorb the substrate 7 on the surfaces of the first rolling member 22 and the second rolling member 32 by using negative pressure, replacing the traditional mechanical clamping or pressure contact method, avoiding damage to the surface of the substrate caused by mechanical stress, and solving problems such as fragmentation and film layer peeling of the substrate 7 caused by mechanical pressure. Among them, the extending directions of the first air extraction pipeline 41 and the second air extraction pipeline 42 are perpendicular to the substrate 7, so that the vacuum suction force acts directly on the substrate 7 along the normal direction, reducing the lateral component force, avoiding the deviation or warping of the substrate 7 caused by the inclination of the suction force, and improving the adsorption efficiency and stability. In addition, multi-point uniform adsorption is formed to jointly ensure the smoothness and position accuracy of the substrate 7 during the transfer process.

[0057] Based on the same inventive concept, an embodiment of the present application further provides a semiconductor manufacturing device, including the substrate transfer device 100 in any of the above embodiments.

[0058] Specifically, the semiconductor manufacturing device is used to manufacture semiconductor devices, such as display panels. In some display panels, adjacent functional film layers of light-emitting units can be separated by setting an isolation structure. In this way, in the evaporation process of the functional film layer, only the whole surface of the display panel needs to be evaporated, without the need to separately prepare the functional film layer of each light-emitting unit by means of a metal mask. This technology is a fine metal maskless technology and does not need to consider the alignment accuracy problem during evaporation, so that the gap design of the light-emitting units can be made into a smaller size. For example, referring to Figure 10 As shown, such display panels generally include a substrate 7, a pixel definition layer 72, an isolation structure 73, a plurality of light-emitting units 71, and a plurality of encapsulation units 74. Among them, the pixel definition layer 72 includes a plurality of pixel openings 720. The isolation structure 73 is located on the side of the pixel definition layer 72 away from the substrate 7. The isolation structure 73 includes a plurality of isolation openings 730, and the pixel openings 720 are correspondingly connected to the isolation openings 730 for accommodating the light-emitting units 71. Among them, the isolation structure 73 includes a support portion 731 and a shielding portion 732. The shielding portion 732 is located on the side of the support portion 731 away from the substrate 7, and the orthographic projection of the support portion 731 on the substrate 7 is located within the orthographic projection of the shielding portion 732 on the substrate 7. The encapsulation unit 74 is disposed on the side of the light-emitting unit 71 away from the substrate 7, and the encapsulation unit 74 extends from within the pixel opening 720 along the side wall of the isolation structure 73 to the side of the isolation structure 73 away from the substrate 7.

[0059] The substrate transfer device 100 provided by the embodiments of the present application can be applied to wet processing equipment for substrate manufacturing, including wet etching equipment, cleaning and stripping equipment, etc. The substrate transfer device 100 can also be used for substrate transportation in other semiconductor manufacturing equipment, and can transport the substrate through transfer rollers, so as to stack film layers on the substrate to manufacture corresponding semiconductor devices.

[0060] Further, the substrate can be simultaneously transferred through the transfer rollers on multiple central fixed shafts 1, which increases the transfer speed of the substrate. On the production line, the substrate can be quickly transferred from one process to another process, reducing the waiting time during the production process and improving the overall production efficiency. In terms of transfer stability, the transfer rollers adsorb and support the substrate above, making the substrate more stable during the transfer process and reducing the possibility of shaking and offset.

[0061] Although the present application has been described in conjunction with specific embodiments of the present application, many substitutions, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description.

[0062] It should be noted that some embodiments of the present application have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the above embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0063] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. A substrate conveying device, used for carrying and conveying a substrate; characterized in that: include: Central fixed axis; The first conveying roller comprises a first fixing member and a first rolling member, wherein the first fixing member is fixed to the central fixing shaft, the first rolling member is sleeved on the periphery of the first fixing member, and the first rolling member can rotate around the central fixing shaft; the first rolling member comprises a plurality of first through holes; The exhaust channel includes a first exhaust pipeline, the first exhaust pipeline is located in the first fixing member, the first exhaust pipeline includes a first air inlet pipe port arranged toward the plane where the substrate is located, and one of the first through holes of the first rolling member is connected to the first air inlet pipe port.

2. The substrate conveying device according to claim 1, characterized in that: The substrate conveying device further comprises: The second conveying roller comprises a second fixing member and a second rolling member, wherein the second fixing member is fixed to the central fixing shaft, the second rolling member is sleeved on the periphery of the second fixing member, and the second rolling member can rotate around the central fixing shaft; the second rolling member comprises a plurality of second through holes; Among them, the second conveying roller and the first conveying roller are arranged at an axial interval along the central fixed axis, the exhaust channel includes a second exhaust pipe, the second exhaust pipe is located in the second fixing member, the second exhaust pipe includes a second air inlet pipe port arranged toward the plane direction of the substrate, and one of the second through holes of the second rolling member is connected to the second air inlet pipe port.

3. The substrate conveying device according to claim 2, characterized in that: The air extraction channel includes a central pipeline, and the central pipeline is located in the central fixed shaft; The first air extraction pipeline includes a first connecting pipe opening arranged opposite to the first air inlet pipe opening, and the first connecting pipe opening is connected to the central pipeline; The second air extraction pipeline includes a second connecting pipe opening arranged opposite to the second air inlet pipe opening, and the second connecting pipe opening is communicated with the central pipeline.

4. The substrate conveying device according to claim 1, characterized in that: The first conveying roller includes a first bearing, and the first bearing is located between the first fixing member and the first rolling member, and a gap exists between the first fixing member and the first rolling member.

5. The substrate conveying device according to claim 1, characterized in that: The plurality of first through holes are evenly distributed along the circumference of the first rolling element.

6. The substrate conveying device according to claim 1, characterized in that: The first rolling member includes a first supporting portion and first side wall portions located on both sides of the first supporting portion, the first supporting portion covers the outer peripheral surface of the first fixing member, and the first side wall portion covers the side wall surface of the first fixing member.

7. The substrate conveying device according to claim 2, characterized in that: The second conveying roller includes a second bearing, the second bearing is located between the second fixing member and the second rolling member, and a gap exists between the second fixing member and the second rolling member.

8. The substrate conveying device according to claim 2, characterized in that: The plurality of second through holes are evenly distributed along the circumference of the second rolling element.

9. The substrate conveying device according to claim 2, characterized in that: The second rolling member includes a second supporting portion and second side wall portions located at both sides of the second supporting portion, the second supporting portion covers the outer peripheral surface of the second fixing member, and the second side wall portion covers the side wall surface of the second fixing member.

10. The substrate conveying device according to claim 2, characterized in that: The substrate conveying device further comprises: The rotation drive assembly includes a driving member, a first transmission member and a second transmission member. The output end of the driving member is connected to the first rolling member through the first transmission member; the second rolling member is connected to the first rolling member through the second transmission member, so that the second rolling member rotates synchronously with the first rolling member.

11. The substrate conveying device according to claim 3, characterized in that: The substrate conveying device further comprises: A vacuum pumping device is connected to the central pipeline.

12. The substrate conveying device according to claim 1, wherein: The substrate transfer device includes a plurality of parallel central fixed shafts.

13. The substrate conveying device according to claim 3, characterized in that: A plurality of the first conveying rollers and a plurality of the second conveying rollers are arranged on the same central fixed shaft; On the same central fixed shaft, the first air extraction pipeline in each of the first conveying rollers and the second air extraction pipeline in each of the second conveying rollers are communicated with the same central pipeline.

14. A substrate conveying device, used for carrying and conveying a substrate; characterized in that: include: Central fixed axis; The first conveying roller comprises a first fixing member and a first rolling member, wherein the first fixing member is fixed to the central fixing shaft, the first rolling member is sleeved on the periphery of the first fixing member, and the first rolling member can rotate around the central fixing shaft; the first rolling member comprises a plurality of first through holes; The second conveying roller comprises a second fixing member and a second rolling member, wherein the second fixing member is fixed to the central fixing shaft, the second rolling member is sleeved on the periphery of the second fixing member, and the second rolling member can rotate around the central fixing shaft; the second rolling member comprises a plurality of second through holes; The exhaust channel includes a first exhaust pipeline, a second exhaust pipeline and a central pipeline, wherein the central pipeline is located in the central fixed axis, the first exhaust pipeline is located in the first fixing member and is connected to at least one of the first through holes; the second exhaust pipeline is located in the second fixing member and is connected to at least one of the second through holes; the first exhaust pipeline and the second exhaust pipeline are respectively connected to the central pipeline; the first exhaust pipeline and the second exhaust pipeline both extend in a direction perpendicular to the substrate.

15. A semiconductor manufacturing equipment, characterized in that: It comprises a substrate conveying device as described in any one of claims 1-14.

Images