Semiconductor chip packaging structure and heat dissipation method thereof

Abstract

The invention provides a semiconductor chip packaging structure and a heat dissipation method thereof, and relates to the technical field of semiconductor packaging. The structure comprises a resin packaging body, a bonding wire, a first lead base, a second lead base, solder paste, a chip, a ceramic chip copper layer and a ceramic chip, one side of the ceramic chip copper layer is attached to the ceramic chip, and the other side of the ceramic chip copper layer is attached to the chip through solder paste; one side of the chip is respectively connected with the first lead base and the second lead base; the first lead base is electrically connected with the second lead base through a bonding wire; the pin of the first lead base and the pin of the second lead base are oppositely arranged on the two sides of the resin packaging body and extend out of the resin packaging body; one side of the resin packaging body is provided with a heat dissipation opening. According to the structure, the effect of optimizing the performance of a semiconductor is achieved by adjusting the structural form of the cooling fins, meanwhile, packaging quality detection based on the visual technology is carried out in packaging production, and it is effectively guaranteed that quality problems caused by packaging are corrected and controlled in time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more particularly, to a semiconductor chip packaging structure and a heat dissipation method thereof. Background Art

[0002] At present, some products in the market have heat sinks packaged downward onto the circuit board, resulting in heat being directly transferred to the PCB board, increasing the heat of the board and the internal consumption of the product. Moreover, the heat sink is made of copper, which cannot avoid the special application environments of some chips. For example, when the product needs to consider reverse voltage breakdown and requires an internal insulation design, that is, the copper material does not have such functional requirements. Some products in the market have long leads or are bent along the outside of the product, resulting in slightly poor stability of the entire finished product after being mounted on the board. Some products in the market are all packaged with the chips facing upward and forward, which requires wire bonding and results in an overly thick product thickness, affecting the use space and heat dissipation. How to reasonably arrange the positions of the heat sinks and optimize the structure of semiconductor devices has become an important research content.

[0003] At the same time, for semiconductor packaging technology, with the development of science and technology, the packaging process has gradually become automated and the packaging process has gradually matured. The impact of packaging on products mainly lies in the control of packaging accuracy to ensure that the packaged semiconductor products have ideal performance. With the development of vision technology, this packaging control can be achieved through the acquisition of image data for real-time and efficient inspection and verification. Therefore, adding the detection of the real-time state of packaging in the packaging process helps to promptly discover problems existing at the packaging site and make reasonable and effective adjustments.

[0004] Therefore, designing a semiconductor chip packaging structure and a heat dissipation method thereof to optimize the performance of semiconductors by adjusting the structural form of the heat sink, and at the same time performing packaging quality detection based on vision technology during packaging production to effectively ensure the timely correction and control of quality problems caused by packaging is an urgent problem to be solved at present. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor chip packaging structure. By setting a ceramic copper layer above the chip, the insulation and heat dissipation functions in the packaged semiconductor can be effectively guaranteed. A heat dissipation opening is provided on the resin package corresponding to the ceramic chip, and directly exposing the ceramic chip can improve the heat dissipation of the ceramic chip, greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base adopt planar pins, which can increase the electrical connection area and improve the connection stability, and can also reduce the increase in installation space caused by the pin structure during the installation of the packaged semiconductor, making the overall structure compact and greatly reducing the overall thickness of the product.

[0006] Another object of the present invention is to provide a packaging method. By packaging the model structure data of a semiconductor, the extraction of the external dimension information for different viewing directions is carried out to establish the basic reference information for subsequent comparative analysis of the external dimension information based on vision technology. At the same time, it is also possible to extract the deviation parameters of the qualified external dimensions from the historical image pixels extracted during the historical production process, so as to define the allowable range of the finished product appearance dimensions of the packaged semiconductor. In this way, during the production process of the packaged semiconductor, these characteristic data can be used for efficient and accurate analysis and judgment of the packaging quality. While ensuring the packaging quality, it is also possible to monitor the packaging situation efficiently and in a timely manner, effectively ensuring the timely and accurate acquisition of packaging problems, and realizing the timely correction and control of the quality problems caused by packaging.

[0007] Another object of the present invention is to provide a heat dissipation method. This method transfers the heat of the lead base away from the circuit board to avoid thermal damage to the circuit board. At the same time, the heat is dissipated through the ceramic chip. On the one hand, since the ceramic chip is made of ceramic material, it can effectively avoid the situation of electrical breakdown. On the other hand, it can also play a good heat dissipation role, and when part of the surface is directly exposed, the heat dissipation efficiency is greatly improved, and the heat resistance of the packaging structure is overall enhanced.

[0008] In a first aspect, the present invention provides a semiconductor chip packaging structure, including: a resin package, bonding wires, a first lead base, a second lead base, solder paste, a chip, a ceramic chip copper layer, and a ceramic chip; one side of the ceramic chip copper layer is attached to the ceramic chip, and the other side is attached to the chip through the solder paste; the side of the chip away from the ceramic chip copper layer is connected to the first lead base and the second lead base respectively through the solder paste; the first lead base and the second lead base are electrically connected through the bonding wires; the bonding wires, the first lead base, the second lead base, the solder paste, the chip, the ceramic chip copper layer, and the ceramic chip are all arranged in the resin package; the pins of the first lead base and the pins of the second lead base are oppositely arranged on both sides of the resin package, and the pins of the first lead base and the pins of the second lead base both extend outside the resin package; a heat dissipation opening is provided on the side of the resin package close to the ceramic chip, and the heat dissipation opening exposes the side of the ceramic chip away from the ceramic chip copper layer.

[0009] In the present invention, this structure can effectively ensure the insulation and heat dissipation functions in the packaged semiconductor by arranging the ceramic chip copper layer above the chip. By opening a heat dissipation opening on the resin package corresponding to the ceramic chip and directly exposing the ceramic chip, the heat dissipation performance of the ceramic chip can be improved, greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base adopt planar pins. While increasing the electrical connection area and improving the connection stability, it can also reduce the increase in the installation space caused by the pin structure during the installation of the packaged semiconductor, making the overall structure compact and greatly reducing the overall thickness of the product.

[0010] As a possible implementation, the pins of the first lead base are on the same plane as the outer surface of the resin encapsulation on the side far from the chip; the pins of the second lead base are on the same plane as the outer surface of the resin encapsulation on the side far from the chip; a plurality of creepage grooves are provided in parallel and spaced apart on the plane of the resin encapsulation on the side far from the ceramic chip.

[0011] In the present invention, here, having the plane where the pins are installed on the same plane as the outer surface of the resin encapsulation can not only ensure the tight fit with the board when the packaged semiconductor is installed, reducing the occupied height and space, but also avoid damage to the pins caused by not being on the same plane during long-term use. In addition, providing creepage grooves on the resin encapsulation can increase the creepage distance, and the design of the grooves greatly increases the withstand voltage value of the product, enabling the packaged semiconductor to be applicable to a higher working voltage environment and improving the applicable range of the packaged semiconductor.

[0012] In a second aspect, the present invention provides a packaging method, including: obtaining packaging finished product model data, extracting feature information for the external dimensions, and forming model appearance reference feature data; collecting packaging product image data, and performing positioning range analysis in combination with the model appearance parameter feature data to form product packaging dimension range feature data; obtaining target image data of the target product, and performing packaging dimension verification in combination with the product packaging dimension range feature data to form packaging verification result data.

[0013] In the present invention, this method extracts external dimension information for different viewing directions through the model structure data of the packaged semiconductor to establish basic reference information for subsequent comparison and analysis of external dimension information based on vision technology. At the same time, it can also extract the qualified deviation parameters of the external dimensions from the historical image pixels extracted during the historical production process to define the allowable range of the finished product appearance dimensions of the packaged semiconductor. In this way, during the production process of the packaged semiconductor, these feature data can be used for efficient and accurate packaging quality analysis and judgment. While ensuring the packaging quality, it can also monitor the packaging situation efficiently and in a timely manner, effectively ensuring the timely and accurate acquisition of packaging problems and realizing the timely correction and control of the quality problems generated during packaging.

[0014] As a possible implementation, obtain the encapsulated finished product model data, extract the feature information for the external dimensions, and form the model appearance reference feature data, including: according to the encapsulated finished product model data, extract the top view image information of the model that matches the production line position, the first side view image information of the model, and the second side view image information of the model, and form the model perspective azimuth image data; according to the model perspective azimuth image data, perform positioning analysis to determine the perspective azimuth positioning information under different perspective azimuths; according to the perspective azimuth positioning information and in combination with the model perspective azimuth image data, extract the appearance reference dimensions to form the model appearance reference feature data.

[0015] In the present invention, to obtain the feature information related to encapsulation from the model, first, it is necessary to understand that for the encapsulated semiconductor, due to the optimization of the component layout and structure, the overall external dimensions of the encapsulated semiconductor have changed, and this change in external dimensions is essentially an expression of the quality of the encapsulation process. Therefore, obtaining the external dimension data from the model is an important means to achieve effective and reasonable encapsulation quality inspection. Here, when extracting the external dimension feature information, two aspects are mainly considered. On the one hand, since the extracted external dimension data will be used as the dimension data reference for the corresponding position information in the future, it is necessary to reasonably position the extracted external dimension data and extract the external dimension data information in a specific direction, so that the physical object and the theoretical data can be quickly matched and corresponded using the direction positioning information during the subsequent real-time comparison and inspection. On the other hand, for the encapsulated product, the directions in which image information can be collected online are limited. In order to extract data to the maximum extent, the determined image directions need to be reasonably considered. Therefore, the present invention extracts the model reference data by obtaining the image data in three directions that can be efficiently and quickly obtained on the production line. The model appearance reference feature data obtained through these two aspects of consideration is more comparable and reasonable.

[0016] As a possible implementation, based on the model perspective azimuth image data, perform positioning analysis to determine the perspective azimuth positioning information under different perspective azimuths, including: for the model top-view image information, extract the top-view contour information of the encapsulated product model, and perform positioning calibration on the image frame of the top-view contour to determine the model top-view direction positioning point; according to the top-view contour information, determine two different model top-view positioning dimension groups, where: each model top-view positioning dimension group includes two top-view dimension boundary lines, and the two top-view dimension boundary lines are two intersecting boundary lines on the contour boundary; there are no identical top-view dimension boundary lines in different model top-view positioning dimension groups; combine the two different model top-view positioning dimension groups and the model top-view direction positioning point to form the top-view azimuth positioning information; for the model first side-view image information, extract the first side-view contour information of the encapsulated product model, and perform positioning calibration on the image frame of the first side-view contour to determine the model first side-view direction positioning point; according to the first side-view contour information, determine two different model first side-view positioning dimension groups, where: each model first side-view positioning dimension group includes two first side-view dimension boundary lines, and the two first side-view dimension boundary lines are two intersecting boundary lines on the contour boundary; there are no identical first side-view dimension boundary lines in different model first side-view positioning dimension groups; combine the two different model first side-view positioning dimension groups and the model first side-view direction positioning point to form the first side-view azimuth positioning information; for the model second side-view image information, extract the second side-view contour information of the encapsulated product model, and perform positioning calibration on the image frame of the second side-view contour to determine the model second side-view direction positioning point; according to the second side-view contour information, determine two different model second side-view positioning dimension groups, where: each model second side-view positioning dimension group includes two second side-view dimension boundary lines, and the two second side-view dimension boundary lines are two intersecting boundary lines on the contour boundary; there are no identical second side-view dimension boundary lines in different model second side-view positioning dimension groups; combine the two different model second side-view positioning dimension groups and the model second side-view direction positioning point to form the second side-view azimuth positioning information.

[0017] In the present invention, for the extraction of the perspective range positioning information, first, it is necessary to determine the direction of the model appearance parameters under different perspectives based on the reference points, and then, by using the data after determining the direction, the position of the encapsulated semiconductor body is located to obtain the positioning data information corresponding to the perspective. It should be noted that considering that the direction of the model under the perspective can be quickly determined, the formed image frame is used as the positioning object to achieve this. After all, the frames of the acquired image data are unified. For the selection of the positioning points from the corresponding perspective, the present invention considers that there will be a large data error in making a data comparison only once in the same perspective. Therefore, two positioning dimension groups are selected for each perspective to provide a reference for subsequent real-time comparison and analysis. And the boundary lines selected in these two positioning dimension groups should be completely different, so as to avoid the situation that the boundary data overlap and the comparison and verification effect cannot be achieved.

[0018] As a possible implementation manner, according to the perspective positioning information and combined with the model perspective image data, the extraction of the appearance reference dimensions is carried out to form the model appearance reference feature data, including: for the top view contour information, a model top view coordinate system is established with the intersection point of two top view dimension boundary lines in any one model top view positioning dimension group as the origin, and the model top view contour is parameterized according to the model top view coordinate system to form the model top view appearance dimension feature information; for the first side view contour information, a model first side view coordinate system is established with the intersection point of two first side view dimension boundary lines in any one model first side view positioning dimension group as the origin, and the model first side view contour is parameterized according to the model first side view coordinate system to form the model first side view appearance dimension feature information; for the second side view contour information, a model second side view coordinate system is established with the intersection point of two second side view dimension boundary lines in any one model second side view positioning dimension group as the origin, and the model second side view contour is parameterized according to the model second side view coordinate system to form the model second side view appearance dimension feature information; the model top view appearance dimension feature information, the model first side view appearance dimension feature information, and the model second side view appearance dimension feature information are combined to form the model appearance reference feature data.

[0019] In the present invention, the extraction of the appearance reference dimensions is mainly to parameterize the contour information of the model under different perspectives in the coordinate system, so as to provide accurate and quantitative reference data for subsequent real-time comparison. Of course, considering the uniqueness of the model data information, only one positioning dimension group under each perspective is used for the extraction of the contour information.

[0020] As a possible implementation method, collect the image data of the packaged product, and combine it with the characteristic data of the model appearance parameters to analyze the positioning range, and form the characteristic data of the product packaging size range, including: obtaining the product top-view image information, the product first side-view image information, and the product second side-view image information corresponding to different qualified packaged products in the packaged product image data, and forming the product perspective azimuth image data of different packaged products; for different packaged products, according to the corresponding product perspective azimuth image data, and combining the perspective azimuth positioning information and the model appearance reference characteristic data, conduct the positioning size range analysis of the product perspective azimuth, and form the corresponding product qualified size range data: for different packaged products, extract the product top-view contour information in the corresponding product top-view image information, and conduct the direction position positioning of the image frame according to the model top-view direction positioning point; for the product top-view contour information, respectively establish a product top-view coordinate system with the intersection points of the two top-view size boundary lines in different model top-view positioning size groups as the origin and the same coordinate azimuth, and parameterize the coordinates of the product top-view contour according to the product top-view coordinate system, and form a set of product top-view appearance size characteristic information and a second set of product top-view appearance size characteristic information; compare the set of product top-view appearance size characteristic information with the model top-view appearance size characteristic information, and determine the overall size deviation of the product top-view contour in the two directions of the coordinate system, and form a set of product top-view overall size deviation Among them, n takes x and y. When n takes x, it is the overall size deviation in the horizontal axis direction of the coordinate system, and when n takes y, it is the overall size deviation in the vertical axis direction of the coordinate system; compare the second set of product top-view appearance size characteristic information with the model top-view appearance size characteristic information, and determine the overall size deviation of the product top-view contour in the two directions of the coordinate system, and form a second set of product top-view overall size deviation Take the set of product top-view overall size deviation and the second set of product top-view overall size deviation The minimum value in different directions is determined as the product top-view appearance size deviation For different packaged products, extract the product first side-view contour information in the corresponding product first side-view image information, and conduct the direction position positioning of the image frame according to the model first side-view direction positioning point; for the product first side-view contour information, respectively establish a product first side-view coordinate system with the intersection points of the two first side-view size boundary lines in different model first side-view positioning size groups as the origin and the same coordinate azimuth, and parameterize the coordinates of the product first side-view contour according to the product first side-view coordinate system, and form a set of product first side-view appearance size characteristic information and a second set of product first side-view appearance size characteristic information; compare the set of product first side-view appearance size characteristic information with the model first side-view appearance size characteristic information, and determine the overall size deviation of the product first side-view contour in the two directions of the coordinate system, and form a set of product first side-view overall size deviation Compare the first side view appearance dimension feature information of two groups of products with the first side view appearance dimension feature information of the model to determine the overall dimension deviation of the first side view contour of the product in two directions of the coordinate system, and form the first side view overall dimension deviation of the two groups of products Take the first side view overall dimension deviation of one group of products and the first side view overall dimension deviation of the two groups of products The minimum value in different directions is determined as the first side view appearance dimension deviation of the product For different packaged products, extract the second side view contour information in the corresponding second side view image information of the product, and perform the orientation positioning of the image frame according to the second side view direction positioning point of the model; for the second side view contour information of the product, establish a product second side view coordinate system with the intersection points of the two second side view dimension boundary lines in different model second side view positioning dimension groups as the origin and the same coordinate orientation respectively, and parameterize the coordinates of the second side view contour of the product according to the product second side view coordinate system to form the first group of product second side view appearance dimension feature information and the second group of product second side view appearance dimension feature information; compare the first group of product second side view appearance dimension feature information with the second side view appearance dimension feature information of the model to determine the overall dimension deviation of the second side view contour of the product in two directions of the coordinate system, and form the first group of product second side view overall dimension deviation Compare the second group of product second side view appearance dimension feature information with the second side view appearance dimension feature information of the model to determine the overall dimension deviation of the second side view contour of the product in two directions of the coordinate system, and form the second group of product second side view overall dimension deviation Take the first group of product second side view overall dimension deviation and the second group of product second side view overall dimension deviation The minimum value in different directions is determined as the second side view appearance dimension deviation of the product Combine the product top view appearance dimension deviation The first side view appearance dimension deviation of the product and the second side view appearance dimension deviation of the product Form the product qualified dimension range data; combine the product qualified dimension range data corresponding to different packaged products, and perform the dimension positioning range analysis to form the product packaging dimension range feature data: for all packaged products, compare the different product top view appearance dimension deviations The maximum value in different directions is determined as the allowable deviation of the product packaging top view dimension Compare the different product first side view appearance dimension deviations The maximum value in different directions is determined as the allowable deviation of the product packaging first side view dimension Compare the different product second side view appearance dimension deviations Determine the maximum value in different directions as the allowable deviation of the second side view dimension of the product package Aggregate the allowable deviation of the top view dimension of the product package Allowable deviation of the first side view dimension of the product package And the allowable deviation of the second side view dimension of the product package Form the characteristic data of the dimension range of the product package

[0021] In the present invention, for the analysis of the positioning range of the package product image data, on the one hand, it is to use big data information to determine the reasonable dimension deviation range of the package product in different perspective orientations, and on the other hand, it is to determine the allowable deviation in each perspective orientation that can be accepted, so as to avoid the situation where the reference based directly on the model data is invalid and reduces the qualified rate of the product. At the same time, it can accurately refer to the verification and inspection of qualified products. Because there are two reference positioning dimension groups in each perspective orientation, there will be two groups of deviation data when extracting the deviation data in each perspective orientation from the historical data. And each group of deviation data considers the data characteristics of the established plane coordinate system. The recorded deviation information is the deviation in two directions under the coordinate system. It can be understood that if the parametric contour information is used and the length and position of each boundary line are analyzed, it will reduce the data complexity and analysis efficiency. Therefore, it is more reasonable and efficient to extract the total deviation data in two directions of the coordinate system by accumulation. Of course, in order to ensure the strict control of the package product under the historical big data, both groups of deviation data use the smaller value as the allowable deviation limit, which can improve the quality of the product package to a certain extent. Of course, under big data, for different qualified package products, the dimension deviation ranges in three perspective orientations are obtained. Then, the reasonable union operation of the dimension deviation range data of all package products in the same perspective orientation can determine the reference of the allowable dimension deviation range provided by the big data

[0022] As a possible implementation method, obtain the target image data of the target product, combine it with the characteristic data of the dimension range of the product package for package dimension verification, and form the package verification result data, including: according to the target image data, respectively extract the target top view image information, the target first side view image information and the target second side view image information of the target product; extract the target top view contour information in the target top view image information, and combine the perspective orientation positioning information and the model appearance reference characteristic data to determine the dimension deviation of the target top view contour information relative to the two model top view positioning dimension groups after coordinate parameterization and the model top view appearance dimension characteristic information, and form a group of target top view overall dimension deviations And a second group of target top view overall dimension deviations Extract the target first side view contour information from the target first side view image information, and combine the perspective orientation positioning information and the model appearance reference feature data to determine the dimensional deviations between the target first side view contour information and the model first side view appearance dimensional feature information after coordinate parameterization with respect to two groups of model first side view positioning dimensional groups, forming a group of target first side view overall dimensional deviations and a second group of target first side view overall dimensional deviations Extract the target second side view contour information from the target second side view image information, and combine the perspective orientation positioning information and the model appearance reference feature data to determine the dimensional deviations between the target second side view contour information and the model second side view appearance dimensional feature information after coordinate parameterization with respect to two groups of model second side view positioning dimensional groups, forming a group of target second side view overall dimensional deviations and a second group of target second side view overall dimensional deviations According to a group of target top view overall dimensional deviations a second group of target top view overall dimensional deviations a group of target first side view overall dimensional deviations a second group of target first side view overall dimensional deviations a group of target second side view overall dimensional deviations a second group of target second side view overall dimensional deviations Product package top view dimensional tolerance Product package first side view dimensional tolerance and product package second side view dimensional tolerance Perform the following package dimensional verification and analysis: If all of the following are satisfied simultaneously:

[0023] Then form package verification passed information; If not all of the above are satisfied simultaneously: Then calibrate and output the overall dimensional deviations that do not meet the requirements.

[0024] In the present invention, the inspection of the target product is to use the dimensional range feature data to perform comparative analysis on the basis of obtaining the current overall dimensional information of the target product at three perspective orientations to determine whether the target product is qualified, thereby completing the real-time and efficient inspection of the target product. Of course, only when the overall dimensional deviations in different directions at each perspective orientation meet the requirements can it be determined that the target product is qualified; otherwise, the dimensions that exceed the range need to be calibrated to provide a reference for subsequent targeted package process inspection and adjustment.

[0025] In a third aspect, the present invention provides a heat dissipation method, including: the heat of the first lead base and the second lead base is transferred to the ceramic chip through the solder paste between the chips and via the ceramic chip copper layer for heat dissipation; a part of the heat transferred to the ceramic chip is dissipated through the resin encapsulation body, and another part is in contact with air through the heat dissipation holes provided on the resin encapsulation body for heat dissipation; the heat dissipated through the heat dissipation holes on the resin encapsulation body is greater than the heat dissipated through the resin encapsulation body.

[0026] In the present invention, this method transfers the heat of the lead base away from the circuit board to avoid thermal damage to the circuit board. At the same time, the heat is dissipated through the ceramic chip. On the one hand, since the ceramic chip is made of ceramic material, it can effectively avoid the situation of electric breakdown. On the other hand, it can also play a good role in heat dissipation. And when part of the surface is directly exposed, the heat dissipation efficiency is greatly improved, and the heat resistance of the packaging structure is generally enhanced.

[0027] As a possible implementation, the ceramic chip copper layer disperses and transfers the heat to the ceramic chip.

[0028] In the present invention, the setting of the ceramic chip copper layer improves the efficiency of heat transfer, and at the same time avoids uneven heat dissipation and local overheating of the ceramic chip receiving the heat caused by concentrated heat transfer.

[0029] The beneficial effects of a semiconductor chip packaging structure and its heat dissipation method provided by the present invention are as follows:

[0030] This structure can effectively ensure the insulation and heat dissipation functions in the packaged semiconductor by setting a ceramic chip copper layer above the chip. Heat dissipation openings are provided on the resin encapsulation body corresponding to the ceramic chip, and directly exposing the ceramic chip can improve the heat dissipation of the ceramic chip, greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base adopt planar pins. While increasing the electrical connection area and improving the connection stability, it can also reduce the increase in installation space caused by the pin structure during the installation of the packaged semiconductor, making the overall structure compact and greatly reducing the overall thickness of the product.

[0031] This packaging method extracts the contour dimension information of different perspective directions based on the model structure data of the packaged semiconductor to establish the basic reference information for subsequent contour dimension information comparison and analysis based on vision technology. At the same time, it can also extract the qualified deviation parameters of the contour dimensions from the historical pixels extracted during the historical production process, realizing the definition of the allowable range of the finished product appearance dimensions of the packaged semiconductor. In this way, during the production process of the packaged semiconductor, these characteristic data can be used for efficient and accurate packaging quality analysis and judgment. While ensuring the packaging quality, it can also monitor the packaging situation efficiently and in a timely manner, effectively ensuring the timely and accurate acquisition of packaging problems, and realizing the timely correction and control of the quality problems generated during packaging.

[0032] This heat dissipation method avoids thermal damage to the circuit board by transferring the heat of the lead base away from the circuit board. At the same time, the heat is dissipated through the ceramic chip. On the one hand, since the ceramic chip is made of ceramic material, the situation of electric breakdown can be effectively avoided. On the other hand, it can also play a good role in heat dissipation. And when part of the surface is directly exposed, the heat dissipation efficiency is greatly improved, and the heat resistance of the packaging structure is improved as a whole. Brief Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0034] Figure 1 It is a schematic structural diagram of a semiconductor chip packaging structure provided by an embodiment of the present invention;

[0035] Figure 2 It is a step diagram of a packaging method provided by an embodiment of the present invention.

[0036] Reference Signs: 01, resin package; 02, bonding wire; 03, first lead base; 04, second lead base; 05, solder paste; 06, chip; 07, ceramic chip copper layer; 08, ceramic chip; 09, creepage groove. Detailed Embodiments

[0037] Next, the technical solutions in the embodiments of the present invention will be described in conjunction with the drawings in the embodiments of the present invention.

[0038] At present, some products on the market have heat sinks packaged downward onto the circuit board, resulting in heat being directly transferred to the PCB board, increasing the heat of the board and the internal consumption of the product. Moreover, the heat sink is made of copper, and it is impossible to avoid the special application environment of some chips. For example, when the product needs to consider reverse voltage breakdown and requires internal insulation design, that is, the copper material does not have such functional requirements; some products on the market have long leads or are bent along the outside of the product, resulting in slightly poor stability of the entire finished product after the product is mounted on the board; some products on the market are all packaged with the chip facing upward and require bonding wires, resulting in too thick product thickness; affecting the use space and heat dissipation. How to reasonably arrange the position of the heat sink and optimize the structure of the semiconductor device has become an important research content.

[0039] Meanwhile, for semiconductor packaging technology, with the development of science and technology, the packaging process has gradually become automated and the packaging process has gradually matured. The impact of packaging on products mainly lies in the control of packaging accuracy to ensure that the packaged semiconductor products have ideal performance. With the development of vision technology, this packaging control can be achieved through the acquisition of image data for real-time and efficient inspection and verification. Therefore, adding the detection of the real-time state of packaging to the packaging process helps to promptly discover problems existing in the packaging site and make reasonable and effective adjustments.

[0040] Reference Figure 1 - Figure 2 , an embodiment of the present invention provides a semiconductor chip packaging structure, including: a resin package 01, bonding wires 02, a first lead base 03, a second lead base 04, solder paste 05, a chip 06, a ceramic copper layer 07, and a ceramic 08; one side of the ceramic copper layer 7 is attached to the ceramic 08, and the other side is attached to the chip 06 through the solder paste 05; the side of the chip 06 away from the ceramic copper layer 7 is connected to the first lead base 03 and the second lead base 04 respectively through the solder paste 05; the first lead base 03 and the second lead base 04 are electrically connected through the bonding wires 02; the bonding wires 02, the first lead base 03, the second lead base 04, the solder paste 05, the chip 06, the ceramic copper layer 07, and the ceramic 08 are all arranged in the resin package 01; the pins of the first lead base 03 and the pins of the second lead base 04 are arranged opposite to each other on both sides of the resin package 01, and the pins of the first lead base 03 and the pins of the second lead base 04 both extend outside the resin package 01; a heat dissipation opening is provided on one side of the resin package 01 close to the ceramic 08, and the heat dissipation opening exposes the side of the ceramic 08 away from the ceramic copper layer 7.

[0041] This structure can effectively ensure the insulation and heat dissipation functions in the packaged semiconductor by setting a ceramic copper layer above the chip. By opening a heat dissipation opening on the resin package corresponding to the ceramic, directly exposing the ceramic can improve the heat dissipation of the ceramic, greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base adopt planar pins, which can increase the electrical connection area to improve the connection stability, and at the same time, can reduce the increase in installation space caused by the pin structure during the installation of the packaged semiconductor, making the overall structure compact and greatly reducing the overall thickness of the product.

[0042] Among them, the pins of the first lead base 03 are on the side far from the chip 06 and are in the same plane as the outer surface of the resin package 01; the pins of the second lead base 04 are on the side far from the chip 06 and are in the same plane as the outer surface of the resin package 01; a plurality of creepage grooves 09 are provided in parallel at intervals on the plane of the resin package 01 on the side far from the ceramic chip 08. Here, making the plane where the pins are installed be in the same plane as the outer surface of the resin package can not only ensure the tight fit between the packaged semiconductor and the board during installation, reducing the occupied height and space, but also avoid damage to the pins caused by not being in the same plane during long-term use. In addition, providing creepage grooves on the resin package can increase the creepage distance, and the design of the grooves greatly increases the withstand voltage value of the product, enabling the packaged semiconductor to be applicable to a higher working voltage environment and improving the applicable range of the packaged semiconductor.

[0043] The present invention also provides a packaging method. This method extracts the external dimension information for different viewing directions through the model structure data of the packaged semiconductor to establish the basic reference information for subsequent comparative analysis of the external dimension information based on vision technology. At the same time, it can also extract the qualified deviation parameters of the external dimensions from the historical pixels extracted during the historical production process, so as to define the allowable range of the finished product appearance dimensions of the packaged semiconductor. In this way, during the production process of the packaged semiconductor, these characteristic data can be used for efficient and accurate packaging quality analysis and judgment. While ensuring the packaging quality, it can also monitor the packaging situation efficiently and in a timely manner, effectively ensuring the timely and accurate acquisition of packaging problems, and realizing the timely correction and control of the quality problems generated during packaging.

[0044] The method for dissipating heat from the front of the semiconductor chip specifically includes the following steps:

[0045] S1: Obtain the model data of the packaged finished product, extract the characteristic information for the external dimensions, and form the model appearance reference characteristic data.

[0046] Obtaining the model data of the packaged finished product, extracting the characteristic information for the external dimensions, and forming the model appearance reference characteristic data includes: according to the model data of the packaged finished product, extracting the model top-view image information, the model first side-view image information, and the model second side-view image information that match the production line position to form the model perspective azimuth image data; according to the model perspective azimuth image data, performing positioning analysis to determine the perspective azimuth positioning information in different perspective azimuths; according to the perspective azimuth positioning information and combining with the model perspective azimuth image data, extracting the appearance reference dimensions to form the model appearance reference characteristic data.

[0047] To obtain the feature information related to packaging from the model, the first thing to understand is that for packaged semiconductors, the overall appearance size of the packaged semiconductor has changed due to the optimization of the component layout and structure, and this change in appearance size is essentially an expression of the quality of the packaging process. Therefore, obtaining appearance size data from the model is an important means to achieve effective and reasonable packaging quality inspection. Here, when extracting appearance size feature information, two aspects are mainly considered. On the one hand, since the extracted appearance size data will be used as a reference for the size data of the corresponding position information in the future, it is necessary to reasonably locate the extracted appearance size data and extract the appearance size data information in a specific direction, so that the physical object and the theoretical data can be quickly matched and corresponding during the subsequent real-time comparison and inspection. On the other hand, for packaged products, the directions in which image information can be collected online are limited. In order to extract data to the greatest extent, the determined image direction needs to be reasonably considered. Therefore, the present invention extracts the model reference data by obtaining image data in three directions that can be efficiently and quickly obtained on the production line. The model appearance reference feature data obtained through these two aspects of consideration is more comparable and reasonable.

[0048] Based on the model perspective azimuth image data, perform positioning analysis to determine the perspective azimuth positioning information under different perspective azimuths, including: for the model top-view image information, extract the top-view contour information of the encapsulated product model, and perform positioning calibration on the image frame of the top-view contour to determine the model top-view direction positioning point; according to the top-view contour information, determine two different model top-view positioning dimension groups, where: each model top-view positioning dimension group includes two top-view dimension boundary lines, and the two top-view dimension boundary lines are two intersecting boundary lines on the contour boundary; there are no identical top-view dimension boundary lines in different model top-view positioning dimension groups; combine the two different model top-view positioning dimension groups and the model top-view direction positioning point to form the top-view azimuth positioning information; for the model first side-view image information, extract the first side-view contour information of the encapsulated product model, and perform positioning calibration on the image frame of the first side-view contour to determine the model first side-view direction positioning point; according to the first side-view contour information, determine two different model first side-view positioning dimension groups, where: each model first side-view positioning dimension group includes two first side-view dimension boundary lines, and the two first side-view dimension boundary lines are two intersecting boundary lines on the contour boundary; there are no identical first side-view dimension boundary lines in different model first side-view positioning dimension groups; combine the two different model first side-view positioning dimension groups and the model first side-view direction positioning point to form the first side-view azimuth positioning information; for the model second side-view image information, extract the second side-view contour information of the encapsulated product model, and perform positioning calibration on the image frame of the second side-view contour to determine the model second side-view direction positioning point; according to the second side-view contour information, determine two different model second side-view positioning dimension groups, where: each model second side-view positioning dimension group includes two second side-view dimension boundary lines, and the two second side-view dimension boundary lines are two intersecting boundary lines on the contour boundary; there are no identical second side-view dimension boundary lines in different model second side-view positioning dimension groups; combine the two different model second side-view positioning dimension groups and the model second side-view direction positioning point to form the second side-view azimuth positioning information.

[0049] For the extraction of the perspective range positioning information, first, it is necessary to determine the directions of the model appearance parameters under different perspectives based on the reference points, and then use the data after determining the directions to locate the position of the encapsulated semiconductor body to obtain the positioning data information corresponding to the perspective. It should be noted that considering that the model under the perspective can be quickly directionally determined, the formed image frame is used as the positioning object to achieve this. After all, the frames of the obtained image data are unified. For the selection of the positioning points from the corresponding perspective, the present invention considers that there will be a large data error in making a data comparison only once in the same perspective. Therefore, two positioning size groups are selected for each perspective to provide a reference for subsequent real-time comparison and analysis. And the boundary lines selected in these two positioning size groups should be completely different, so as to avoid the failure to achieve the effect of comparison and verification after the boundary data overlap.

[0050] According to the perspective positioning information and combined with the model perspective image data, extract the appearance reference dimensions to form the model appearance reference feature data, including: for the top view contour information, establish a model top view coordinate system with the intersection of two top view size boundary lines in any one model top view positioning size group as the origin, and parameterize the coordinates of the model top view contour according to the model top view coordinate system to form the model top view appearance size feature information; for the first side view contour information, establish a model first side view coordinate system with the intersection of two first side view size boundary lines in any one model first side view positioning size group as the origin, and parameterize the coordinates of the model first side view contour according to the model first side view coordinate system to form the model first side view appearance size feature information; for the second side view contour information, establish a model second side view coordinate system with the intersection of two second side view size boundary lines in any one model second side view positioning size group as the origin, and parameterize the coordinates of the model second side view contour according to the model second side view coordinate system to form the model second side view appearance size feature information; combine the model top view appearance size feature information, the model first side view appearance size feature information, and the model second side view appearance size feature information to form the model appearance reference feature data.

[0051] The extraction of the appearance reference dimensions is mainly to parameterize the contour information of the model under different perspectives in the coordinate system to provide accurate and quantitative reference data for subsequent real-time comparison. Of course, considering the uniqueness of the model data information, only one positioning size group under each perspective is used when extracting the contour information.

[0052] S2: Collect the image data of the encapsulated product, and combine it with the model appearance parameter feature data to conduct a positioning range analysis to form the product encapsulation size range feature data.

[0053] Collect the image data of the encapsulated product, and perform positioning range analysis by combining the feature data of the model appearance parameters to form the feature data of the product encapsulation size range, including: obtaining the product top-view image information, the product first side-view image information, and the product second side-view image information corresponding to different qualified encapsulated products in the encapsulated product image data to form the product perspective azimuth image data of different encapsulated products; for different encapsulated products, perform positioning size range analysis of the product perspective azimuth according to the corresponding product perspective azimuth image data, in combination with the perspective azimuth positioning information and the model appearance reference feature data, to form the corresponding product qualified size range data: for different encapsulated products, extract the product top-view contour information in the corresponding product top-view image information, and perform the direction position positioning of the image frame according to the model top-view direction positioning point; for the product top-view contour information, respectively establish a product top-view coordinate system with the intersection points of the two top-view size boundary lines in different model top-view positioning size groups as the origin and the same coordinate azimuth, and perform coordinate parameterization on the product top-view contour according to the product top-view coordinate system to form a set of product top-view appearance size feature information and a second set of product top-view appearance size feature information; compare the set of product top-view appearance size feature information with the model top-view appearance size feature information to determine the overall size deviation of the product top-view contour in two directions of the coordinate system, and form a set of product top-view overall size deviation Among them, n takes x and y. When n takes x, it is the overall size deviation in the horizontal axis direction of the coordinate system, and when n takes y, it is the overall size deviation in the vertical axis direction of the coordinate system; compare the second set of product top-view appearance size feature information with the model top-view appearance size feature information to determine the overall size deviation of the product top-view contour in two directions of the coordinate system, and form a second set of product top-view overall size deviation Take the set of product top-view overall size deviation and the second set of product top-view overall size deviation The minimum value in different directions is determined as the product top-view appearance size deviation For different encapsulated products, extract the product first side-view contour information in the corresponding product first side-view image information, and perform the direction position positioning of the image frame according to the model first side-view direction positioning point; for the product first side-view contour information, respectively establish a product first side-view coordinate system with the intersection points of the two first side-view size boundary lines in different model first side-view positioning size groups as the origin and the same coordinate azimuth, and perform coordinate parameterization on the product first side-view contour according to the product first side-view coordinate system to form a set of product first side-view appearance size feature information and a second set of product first side-view appearance size feature information; compare the set of product first side-view appearance size feature information with the model first side-view appearance size feature information to determine the overall size deviation of the product first side-view contour in two directions of the coordinate system, and form a set of product first side-view overall size deviation Compare the first-side view appearance dimension feature information of two groups of products with the first-side view appearance dimension feature information of the model to determine the overall dimension deviation of the first-side view contour of the product in two directions of the coordinate system, and form the first-side view overall dimension deviation of the two groups of products The first-side view overall dimension deviation of one group of products and the first-side view overall dimension deviation of two groups of products The minimum value in different directions is determined as the first-side view appearance dimension deviation of the product For different packaged products, extract the second-side view contour information in the corresponding second-side view image information of the product, and perform the orientation and position positioning of the image frame according to the second-side view direction positioning points of the model; for the second-side view contour information of the product, respectively establish a product second-side view coordinate system with the intersection points of the two second-side view dimension boundary lines in different model second-side view positioning dimension groups as the origin and the same coordinate orientation, and parameterize the coordinates of the second-side view contour of the product according to the product second-side view coordinate system to form the first-side view appearance dimension feature information of one group of products and the first-side view appearance dimension feature information of two groups of products; compare the first-side view appearance dimension feature information of one group of products with the first-side view appearance dimension feature information of the model to determine the overall dimension deviation of the second-side view contour of the product in two directions of the coordinate system, and form the first-side view overall dimension deviation of one group of products Compare the first-side view appearance dimension feature information of two groups of products with the first-side view appearance dimension feature information of the model to determine the overall dimension deviation of the second-side view contour of the product in two directions of the coordinate system, and form the first-side view overall dimension deviation of two groups of products The first-side view overall dimension deviation of one group of products and the first-side view overall dimension deviation of two groups of products The minimum value in different directions is determined as the second-side view appearance dimension deviation of the product Combine the top-view appearance dimension deviation of the product The first-side view appearance dimension deviation of the product and the second-side view appearance dimension deviation of the product to form the product qualified dimension range data; combine the product qualified dimension range data corresponding to different packaged products, and perform the dimension positioning range analysis to form the product packaging dimension range feature data: for all packaged products, compare the different top-view appearance dimension deviations of the products The maximum value in different directions is determined as the allowable deviation of the packaged top-view dimension of the product Compare the different first-side view appearance dimension deviations of the products The maximum value in different directions is determined as the allowable deviation of the packaged first-side view dimension of the product Compare the different second-side view appearance dimension deviations of the products Determine the maximum value in different directions as the allowable deviation of the second side view dimension of the product package Aggregate the allowable deviation of the top view dimension of the product package Allowable deviation of the first side view dimension of the product package And the allowable deviation of the second side view dimension of the product package Form the characteristic data of the product package size range

[0054] The analysis of the positioning range of the package product image data, on the one hand, is to use big data information to determine the reasonable size deviation range of the package product in different perspective orientations, and on the other hand, is to determine the allowable deviation in each perspective orientation that can be accepted, avoiding the situation where the reference based directly on the model data is invalid and reduces the product qualification rate, and at the same time being able to accurately refer to the verification and inspection of qualified products. Because there are two reference positioning size groups in each perspective orientation, there will be two groups of deviation data when extracting the deviation data in each perspective orientation of the historical data, and each group of deviation data considers the data characteristics of the established plane coordinate system. The recorded deviation information is the deviation in two directions under the coordinate system. It can be understood that if the parametric contour information is used and the length and position of each boundary line are analyzed, it will cause the complexity of the data to reduce the analysis efficiency. Therefore, it is more reasonable and efficient to extract the total deviation data in two directions of the coordinate system by accumulation. Of course, in the historical big data, in order to ensure strict control of the package product, both groups of deviation data use the smaller value as the allowable deviation limit, which can improve the quality of the product package to a certain extent. Of course, under big data, for different qualified package products, the size deviation ranges in three perspective orientations are obtained. Then, the reasonable union operation of the size deviation range data of all package products in the same perspective orientation can determine the reference of the allowable size deviation range provided by the big data

[0055] S3: Obtain the target image data of the target product, combine it with the product package size range characteristic data for package size verification, and form the package verification result data

[0056] Obtain the target image data of the target product, combine it with the product package size range characteristic data for package size verification, and form the package verification result data, including: according to the target image data, respectively extract the target top view image information, target first side view image information, and target second side view image information of the target product; extract the target top view contour information in the target top view image information, and combine the perspective orientation positioning information and the model appearance reference characteristic data to determine the size deviation of the target top view contour information relative to the two model top view positioning size groups after coordinate parameterization and the model top view appearance size characteristic information, and form a group of target top view overall size deviations And a second group of target top view overall size deviations Extract the target first side view contour information from the target first side view image information, combine the perspective orientation positioning information and the model appearance reference feature data, and determine the dimensional deviations between the target first side view contour information after coordinate parameterization with respect to two groups of model first side view positioning dimensions and the model first side view appearance dimension feature information, forming a group of target first side view overall dimensional deviations and a second group of target first side view overall dimensional deviations Extract the target second side view contour information from the target second side view image information, combine the perspective orientation positioning information and the model appearance reference feature data, and determine the dimensional deviations between the target second side view contour information after coordinate parameterization with respect to two groups of model second side view positioning dimensions and the model second side view appearance dimension feature information, forming a group of target second side view overall dimensional deviations and a second group of target second side view overall dimensional deviations According to a group of target top view overall dimensional deviations a second group of target top view overall dimensional deviations a group of target first side view overall dimensional deviations a second group of target first side view overall dimensional deviations a group of target second side view overall dimensional deviations a second group of target second side view overall dimensional deviations Product package top view dimension allowable deviation Product package first side view dimension allowable deviation and product package second side view dimension allowable deviation Perform the following package dimension verification analysis: If all of the following are satisfied simultaneously: then form package verification passed information; if not all are satisfied simultaneously: then calibrate and output the overall dimensional deviations that are not satisfied.

[0057] The inspection of the target product is to, under the condition of obtaining the current overall dimension information of the target product from three perspective orientations, use the dimensional range feature data for comparative analysis to determine whether the target product is qualified, thereby completing the real-time and efficient inspection of the target product. Of course, only when the overall dimensional deviations in different directions of each perspective orientation all meet the requirements can it be determined that the target product is qualified; otherwise, the dimensions that exceed the range need to be calibrated to provide a reference for subsequent targeted package process inspection and adjustment.

[0058] The present invention also provides a heat dissipation method, including: the heat of the first lead base and the second lead base is transferred to the ceramic chip through the solder paste between the chips and via the ceramic chip copper layer for heat dissipation; part of the heat transferred to the ceramic chip is dissipated through the resin encapsulation body, and the other part is in contact with air through the heat dissipation holes provided on the resin encapsulation body for heat dissipation; the heat dissipated through the heat dissipation holes on the resin encapsulation body is greater than the heat dissipated through the resin encapsulation body.

[0059] This heat dissipation method transfers the heat of the lead base away from the circuit board to avoid thermal damage to the circuit board. At the same time, the heat is dissipated through the ceramic chip. On the one hand, since the ceramic chip is made of ceramic material, the situation of electric breakdown can be effectively avoided. On the other hand, it can also play a good role in heat dissipation. And when part of the surface is directly exposed, the heat dissipation efficiency is greatly improved, and the heat resistance of the packaging structure is improved as a whole.

[0060] In summary, the beneficial effects of a semiconductor chip packaging structure and its heat dissipation method provided by the embodiments of the present invention are as follows:

[0061] This structure can effectively ensure the insulation and heat dissipation functions in the packaged semiconductor by setting a ceramic chip copper layer above the chip. Heat dissipation openings are provided on the resin encapsulation body corresponding to the ceramic chip, and directly exposing the ceramic chip can improve the heat dissipation of the ceramic chip, greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base adopt planar pins. While increasing the electrical connection area and improving the connection stability, it can also reduce the increase in the installation space caused by the pin structure during the installation of the packaged semiconductor, making the overall structure compact and greatly reducing the overall thickness of the product.

[0062] This packaging method extracts the contour dimension information of different viewing directions based on the model structure data of the packaged semiconductor to establish the basic reference information for subsequent contour dimension information comparison and analysis based on vision technology. At the same time, it can also extract the qualified deviation parameters of the contour dimensions from the historical pixels extracted during the historical production process to define the allowable range of the finished product appearance dimensions of the packaged semiconductor. In this way, during the production process of the packaged semiconductor, these characteristic data can be used for efficient and accurate packaging quality analysis and judgment. While ensuring the packaging quality, it can also monitor the packaging situation efficiently and in a timely manner, effectively ensuring the timely and accurate acquisition of packaging problems and realizing the timely correction and control of the quality problems generated by the packaging.

[0063] This heat dissipation method avoids thermal damage to the circuit board by transferring the heat of the lead base away from the circuit board. At the same time, the heat is dissipated through the ceramic chip. On the one hand, since the ceramic chip is made of ceramic material, it can effectively avoid the situation of electric breakdown. On the other hand, it can also play a good role in heat dissipation. And when part of the surface is directly exposed, the heat dissipation efficiency is greatly improved, and the heat resistance of the packaging structure is improved as a whole.

[0064] In the embodiments of the present invention, "indication" may include direct indication and indirect indication, and may also include explicit indication and implicit indication. The information indicated by a certain piece of information is called the information to be indicated. In the specific implementation process, there are many ways to indicate the information to be indicated. For example, but not limited to, the information to be indicated can be directly indicated, such as the information to be indicated itself or the index of the information to be indicated, etc. It is also possible to indirectly indicate the information to be indicated by indicating other information, where there is an association relationship between the other information and the information to be indicated. It is also possible to only indicate a part of the information to be indicated, while the other parts of the information to be indicated are known or pre-agreed. For example, it is also possible to use the arrangement order of each piece of information pre-agreed (such as stipulated by the protocol) to realize the indication of specific information, thereby reducing the indication overhead to a certain extent. At the same time, the common parts of each piece of information can be identified and indicated uniformly to reduce the indication overhead caused by separately indicating the same information.

[0065] In addition, the specific indication method can also be various existing indication methods, such as but not limited to, the above indication methods and their various combinations, etc. The specific details of various indication methods can refer to the prior art and will not be elaborated herein. As can be seen from the above, for example, when it is necessary to indicate multiple pieces of information of the same type, there may be a situation where the indication methods of different pieces of information are different. In the specific implementation process, the required indication method can be selected according to specific needs. The embodiments of the present invention do not limit the selected indication method. In this way, the indication methods involved in the embodiments of the present invention should be understood to cover various methods that can enable the party to be indicated to obtain the information to be indicated.

[0066] It should be understood that the information to be indicated can be sent as a whole or divided into multiple sub-information and sent separately, and the sending periods and / or sending times of these sub-information can be the same or different. The specific sending method is not limited in the embodiments of the present invention. Among them, the sending periods and / or sending times of these sub-information can be predefined, such as predefined according to the protocol, or can be configured by the sending end device by sending configuration information to the receiving end device.

[0067] "Pre - defined" or "pre - configured" can be achieved by pre - storing corresponding codes, tables or other means that can be used to indicate relevant information in the device. The embodiments of the present invention do not limit the specific implementation methods thereof. Among them, "storage" may refer to storage in one or more memories. The one or more memories may be separately provided, or may be integrated in an encoder, a decoder, a processor, or a communication device. The one or more memories may also be partially separately provided and partially integrated in a decoder, a processor, or a communication device. The type of memory may be any form of storage medium, and the embodiments of the present invention do not limit this.

[0068] The "protocol" involved in the embodiments of the present invention may refer to a protocol family in the communication field, a standard protocol with a frame structure similar to that of a protocol family, or a relevant protocol applied to future communication systems. The embodiments of the present invention do not make specific limitations on this.

[0069] In the embodiments of the present invention, descriptions such as "when...", "in the case of...", "if", and "when" all mean that the device will perform corresponding processing under certain objective circumstances, which does not limit time, and does not require the device to have a judgment action during implementation, nor does it mean the existence of other limitations.

[0070] In the description of the embodiments of the present invention, unless otherwise specified, " / " indicates that the objects associated before and after are in an "or" relationship. For example, A / B may represent A or B. The "and / or" in the embodiments of the present invention is merely a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Here, A and B can be singular or plural. Also, in the description of the embodiments of the present invention, unless otherwise specified, "a plurality of" means two or more than two. "At least one (item)" or its similar expression refers to any combination of these items, including any combination of a single item or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c can be single or multiple. Additionally, for the convenience of clearly describing the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish the same or similar items with basically the same functions and roles. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and "first", "second", etc. do not necessarily mean different. At the same time, in the embodiments of the present invention, words such as "exemplary" or "for example" are used to represent examples, illustrations, or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, using words such as "exemplary" or "for example" aims to present relevant concepts in a specific way for easy understanding.

[0071] It should be understood that the processor in the embodiments of the present invention can be a central processing unit (CPU), and this processor can also be other general - purpose processors, digital signal processors (DSPs), application - specific integrated circuits (ASICs), field - programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general - purpose processor can be a microprocessor or this processor can also be any conventional processor, etc.

[0072] It should also be understood that the memory in the embodiments of the present invention may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of random access memory (RAM) are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM), and direct rambus RAM (DR RAM).

[0073] The above embodiments can be implemented in whole or in part by software, hardware (such as circuits), firmware, or any combination thereof. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions described in the embodiments of the present invention are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wired (such as infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that contains one or more collections of available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, or magnetic tape), an optical medium (such as a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state drive.

[0074] It should be understood that the term "and / or" in this document is merely a description of the association relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Here, A and B can be singular or plural. In addition, the character " / " in this document generally represents an "or" relationship between the associated objects before and after, but it may also represent an "and / or" relationship, which can be specifically understood by referring to the context before and after.

[0075] In the present invention, "at least one" means one or more, and "a plurality" means two or more. "At least one of the following" or its similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, and c can be single or multiple.

[0076] It should be understood that in various embodiments of the present invention, the magnitudes of the sequence numbers of the above processes do not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0077] Those of ordinary skill in the art will realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled professionals can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of the present invention.

[0078] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0079] In several embodiments provided by the present invention, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces, and the indirect couplings or communication connections of the devices or units can be in electrical, mechanical, or other forms.

[0080] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0081] In addition, the functional units in each embodiment of the present invention can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0082] When the above-mentioned functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0083] As described above, the above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A semiconductor chip packaging structure, characterized in that: include: A resin package, a welding wire, a first lead base, a second lead base, solder paste, a chip, a ceramic copper layer and a ceramic; one side of the ceramic copper layer is bonded to the ceramic, and the other side is bonded to the chip through the solder paste; a side of the chip away from the ceramic copper layer is connected to the first lead base and the second lead base respectively through the solder paste; the first lead base and the second lead base are electrically connected through the welding wire; the welding wire, the first lead base, the second lead base, the solder paste, the chip, the ceramic copper layer and the ceramic are all arranged in the resin package; the pins of the first lead base and the pins of the second lead base are arranged on both sides of the resin package opposite to each other, and the pins of the first lead base and the pins of the second lead base are both extended outside the resin package; a heat dissipation opening is opened on the side of the resin package close to the ceramic, and the heat dissipation opening exposes the side of the ceramic away from the ceramic copper layer.

2. The semiconductor chip packaging structure according to claim 1, characterized in that: The pins of the first lead base are located in the same plane as the outer surface of the resin package on the side away from the chip; the pins of the second lead base are located in the same plane as the outer surface of the resin package on the side away from the chip; and a plurality of creepage grooves are provided in parallel and spaced apart on a plane on the side of the resin package away from the ceramic chip.

3. A packaging method, applied to the semiconductor chip packaging structure according to any one of claims 1 or 2, characterized in that: include: Obtain the model data of the packaged finished product, extract the feature information of the external dimensions, and form the model appearance reference feature data; Collecting packaged product image data, and performing positioning range analysis in combination with the model appearance parameter feature data to form product package size range feature data; The target image data of the target product is acquired, and the package size verification is performed in combination with the package size range feature data of the product to form package verification result data.

4. The packaging method according to claim 3, characterized in that: The step of obtaining the packaged finished product model data and extracting feature information of the external dimensions to form model appearance reference feature data includes: Extracting model top view image information, model first side view image information and model second side view image information matching the production line position according to the packaged finished product model data to form model viewing angle azimuth image data; Performing positioning analysis based on the model viewing angle orientation image data to determine viewing angle orientation positioning information under different viewing angle orientations; According to the view orientation positioning information and in combination with the model view orientation image data, the appearance reference size is extracted to form the model appearance reference feature data.

5. The packaging method according to claim 4, characterized in that: The method of performing positioning analysis based on the model viewing angle orientation image data to determine viewing angle orientation positioning information under different viewing angles includes: Extracting top view contour information of the packaged product model from the top view image information of the model, and positioning and calibrating the image frame of the top view contour to determine the top view direction positioning point of the model; According to the top view profile information, two different model top view positioning dimension groups are determined, wherein: The model top-view positioning dimension group includes two top-view dimension boundary lines, and the two top-view dimension boundary lines are two boundary lines intersecting on the contour boundary; Different model top-view positioning dimension groups do not have the same top-view dimension boundary line; Combining two different model overlooking positioning dimension groups and model overlooking direction positioning points to form overlooking azimuth positioning information; Extracting first side view contour information of the packaged product model from the first side view image information of the model, and positioning and calibrating the image frame of the first side view contour to determine a first side view direction positioning point of the model; According to the first side view profile information, two different model first side view positioning dimension groups are determined, wherein: The first side-view positioning dimension group of the model includes two first side-view dimension boundary lines, and the two first side-view dimension boundary lines are two boundary lines intersecting on the contour boundary; Different first side-view positioning dimension groups of the models do not have the same first side-view dimension boundary line; Gather two different first side view positioning dimension groups of the model and first side view direction positioning points of the model to form first side view azimuth positioning information; Extracting the second side view contour information of the packaged product model from the second side view image information of the model, and positioning and calibrating the image frame of the second side view contour to determine the positioning point of the second side view direction of the model; According to the second side view profile information, two different model second side view positioning dimension groups are determined, wherein: The second side-view positioning dimension group of the model includes two second side-view dimension boundary lines, and the two second side-view dimension boundary lines are two boundary lines intersecting on the contour boundary; The second side-view positioning dimension groups of different models do not have the same second side-view dimension boundary line; Two different second side view positioning dimension groups of the model and second side view direction positioning points of the model are assembled to form second side view azimuth positioning information.

6. The packaging method according to claim 5, characterized in that: The extracting of the appearance reference size according to the view orientation positioning information and in combination with the model view orientation image data to form the model appearance reference feature data includes: For the top view contour information, a model top view coordinate system is established with the intersection of two top view dimension boundary lines in any one of the model top view positioning dimension groups as the origin, and the model top view contour is coordinate parameterized according to the model top view coordinate system to form the model top view appearance dimension feature information; For the first side-view contour information, a model first side-view coordinate system is established with the intersection of two first side-view dimension boundary lines in any one of the model first side-view positioning dimension groups as the origin, and the model first side-view contour is coordinate-parameterized according to the model first side-view coordinate system to form the model first side-view appearance dimension feature information; For the second side-view contour information, a model second side-view coordinate system is established with the intersection of two second side-view dimension boundary lines in any one of the model second side-view positioning dimension groups as the origin, and the model second side-view contour is coordinate-parameterized according to the model second side-view coordinate system to form the model second side-view appearance dimension feature information; The model appearance reference feature data is formed by combining the model top view appearance dimension feature information, the model first side view appearance dimension feature information and the model second side view appearance dimension feature information.

7. The packaging method according to claim 6, characterized in that: The collecting of packaged product image data and combining the model appearance parameter feature data to perform positioning range analysis to form product package size range feature data include: Acquire product top view image information, product first side view image information and product second side view image information corresponding to different qualified packaged products in the packaged product image data to form product viewing angle azimuth image data of different packaged products; For different packaged products, according to the corresponding product viewing angle orientation image data, combined with the viewing angle orientation positioning information and the model appearance reference feature data, the product viewing angle orientation positioning size range analysis is performed to form the corresponding product qualified size range data: For different packaged products, extract the top view contour information of the corresponding product in the top view image information, and locate the direction of the image frame according to the top view direction positioning point of the model; For the product top view contour information, respectively establish a product top view coordinate system with the intersection of two top view dimension boundary lines in different model top view positioning dimension groups as the origin and with the same coordinate orientation, and perform coordinate parameterization on the product top view contour according to the product top view coordinate system to form one set of product top view appearance dimension feature information and two sets of product top view appearance dimension feature information; Compare the set of product top view appearance dimension feature information with the model top view appearance dimension feature information to determine the overall dimension deviation of the product top view contour in two directions of the coordinate system, and form a set of product top view overall dimension deviation Wherein, n is x, y, when n is x, it is the overall size deviation in the horizontal axis direction of the coordinate system, when n is y, it is the overall size deviation in the vertical axis direction of the coordinate system; The two groups of product top view appearance dimension feature information are compared with the model top view appearance dimension feature information to determine the overall dimension deviation of the product top view contour in two directions of the coordinate system, forming the two groups of product top view overall dimension deviation The overall size deviation of the group of products is viewed from above Deviation of overall dimensions from the two groups of products viewed from above The minimum value in different directions is determined as the product top view dimension deviation For different packaged products, extract the first side view contour information of the corresponding product in the first side view image information, and locate the direction position of the image frame according to the first side view direction positioning point of the model; For the first side view contour information of the product, respectively establish a first side view coordinate system of the product with the intersection of two first side view dimension boundary lines in different first side view positioning dimension groups of the model as the origin and with the same coordinate orientation, and coordinate parameterize the first side view contour of the product according to the first side view coordinate system of the product to form one group of first side view appearance dimension feature information of the product and two groups of first side view appearance dimension feature information of the product; Compare the first side view appearance size feature information of the set of products with the first side view appearance size feature information of the model to determine the overall size deviation of the first side view contour of the product in two directions of the coordinate system, and form a set of first side view overall size deviation of the product The first side view appearance size feature information of the two groups of products is compared with the first side view appearance size feature information of the model to determine the overall size deviation of the first side view contour of the product in two directions of the coordinate system, forming the first side view overall size deviation of the two groups of products The overall size deviation of the group of products is first viewed from the side The overall size deviation of the first side view of the two groups of products The minimum value in different directions is determined as the product's first side view appearance dimension deviation For different packaged products, extract the second side view contour information of the corresponding product in the second side view image information, and locate the direction position of the image frame according to the second side view direction positioning point of the model; For the second side view contour information of the product, respectively establish a second side view coordinate system of the product with the intersection of two second side view dimension boundary lines in different second side view positioning dimension groups of the model as the origin and with the same coordinate orientation, and coordinate parameterize the second side view contour of the product according to the second side view coordinate system of the product to form one group of second side view appearance dimension feature information of the product and two groups of second side view appearance dimension feature information of the product; Compare the second side view appearance size feature information of the set of products with the second side view appearance size feature information of the model to determine the overall size deviation of the second side view contour of the product in two directions of the coordinate system, and form a set of second side view overall size deviation of the product The second side view appearance size feature information of the two groups of products is compared with the second side view appearance size feature information of the model to determine the overall size deviation of the second side view contour of the product in two directions of the coordinate system, forming the second side view overall size deviation of the two groups of products The second side view of the overall size deviation of the group of products The overall size deviation of the second side view of the two groups of products The minimum value in different directions is determined as the product's second side view appearance dimension deviation Combined with the product top view appearance size deviation The first side view of the product's appearance size deviation And the second side view of the product appearance size deviation Forming qualified size range data of the product; Combined with the product qualified size range data corresponding to different packaged products, size positioning range analysis is performed to form the product package size range characteristic data: For all the packaged products, compare the top view dimensional deviations of different products. The maximum value in different directions is determined as the allowable deviation of the top view size of the product package Compare the first side view of different products and their dimensional deviations The maximum value in different directions is determined as the allowable deviation of the first side view dimension of the product package Compare the second side view of different products and their dimensional deviations The maximum value in different directions is determined as the allowable deviation of the second side view dimension of the product package. The allowable deviation of the top view dimensions of the product package The allowable deviation of the first side view dimension of the product package And the allowable deviation of the second side view dimension of the product package Form the product packaging size range characteristic data.

8. The packaging method according to claim 7, characterized in that: The step of acquiring target image data of a target product and performing package size verification in combination with package size range feature data of the product to form package verification result data includes: According to the target image data, respectively extracting target top view image information, target first side view image information and target second side view image information of the target product; Extract the target top view contour information from the target top view image information, combine the viewing angle azimuth positioning information and the model appearance reference feature data, determine the size deviation of the target top view contour information after coordinate parameterization with the model top view appearance size feature information relative to the two model top view positioning size groups, and form a set of target top view overall size deviation The overall size deviation of the two groups of targets when viewed from above Extract the target first side view contour information from the target first side view image information, combine the viewing angle orientation positioning information and the model appearance reference feature data, determine the size deviation of the target first side view contour information after coordinate parameterization with the model first side view appearance size feature information after two model first side view positioning size groups are respectively performed, and form a set of target first side view overall size deviation The overall size deviation of the first side view of the two groups of targets Extract the target second side view profile information from the target second side view image information, combine the viewing angle orientation positioning information and the model appearance reference feature data, determine the size deviation of the target second side view profile information after coordinate parameterization with the model second side view appearance size feature information after two model second side view positioning size groups are respectively performed, and form a set of target second side view overall size deviation The overall size deviation of the second side view of the two groups of targets Looking down on the overall size deviation according to the set of targets The overall size deviation of the two groups of targets when viewed from above The first side view overall size deviation of a set of targets The overall size deviation of the first side view of the two groups of targets The second side view overall size deviation of a set of targets The second side view overall size deviation of the two groups of targets The allowable deviation of the top view dimensions of the product package The allowable deviation of the first side view dimension of the product package And the allowable deviation of the second side view dimension of the product package Perform the following package size verification analysis: If both of them are met: Then the encapsulation verification pass information is formed; If not satisfied at the same time: The overall dimensional deviation that is not satisfied will be calibrated and output.

9. A heat dissipation method, applied to the semiconductor chip packaging structure according to any one of claims 1 or 2, characterized in that: include: The heat of the first lead base and the second lead base is transferred to the ceramic chip through the solder paste between the chips and the copper layer of the ceramic chip for dissipation; part of the heat transferred to the ceramic chip is dissipated through the resin package, and the other part is dissipated through contact with the air through the heat dissipation holes opened on the resin package; the heat dissipated through the heat dissipation holes on the resin package is greater than the heat dissipated through the resin package.

10. The heat dissipation method according to claim 9, characterized in that: The copper layer of the ceramic sheet disperses and transfers the heat to the ceramic sheet.

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