Antenna assembly including negative harmonic-ground

Abstract

The present disclosure includes a negative harmonic-ground antenna assembly. A radio frequency (RF) signal processor includes a circuit board having an integrated circuit configured to process a radio frequency (RF) signal and a conductive trace extending from the integrated circuit; a waveguide plate over the circuit board, the waveguide plate including a waveguide configured to direct the RF signal to and / or from the conductive trace; and a conductive top plate positioned above the waveguide plate. The conductive top plate comprises an outer surface and an inner surface facing the waveguide plate, and the outer surface is opposite to the inner surface; a plurality of slots aligned with the waveguide and extending through the conductive top plate; and a jack recessed beneath the outer surface beside the plurality of slots, the jack configured to modify a radiation pattern of the RF signal transmitted from the plurality of slots through the jack.

Description

Technical Field

[0001] The present disclosure relates to an antenna assembly including a negative harmonic - ground. Background Art

[0002] This section provides background information related to the present disclosure, which is not necessarily prior art.

[0003] Radar uses electromagnetic signals to detect and track objects. One or more antennas are used to transmit and receive electromagnetic signals. Antennas can be characterized by gain and beamwidth, or more specifically, by a radiation pattern, which is a measure of gain as a function of direction. By modifying the antenna radiation pattern, the antenna can be customized for a specific application. Summary of the Invention

[0004] This section provides a general overview of the present disclosure and is not an exhaustive disclosure of its full scope or all of its features.

[0005] Among various features, the present disclosure provides an antenna assembly including: a circuit board including an integrated circuit configured to process radio frequency (RF) signals and conductive traces extending from the integrated circuit; a waveguide plate located above the circuit board, the waveguide plate including waveguides configured to direct the RF signals to and / or from the conductive traces; and a conductive top plate located above the waveguide plate. The conductive top plate includes: an outer surface and an inner surface facing the waveguide plate, the outer surface being opposite to the inner surface; a plurality of slots aligned with the waveguides and extending through the conductive top plate; and sockets recessed below the outer surface next to the plurality of slots, the sockets being configured to modify the radiation pattern of the RF signals transmitted through the sockets from the plurality of slots.

[0006] In a further feature, the sockets define at least one channel extending parallel to the plurality of slots.

[0007] In a further feature, the sockets define at least one ridge recessed below the outer surface.

[0008] In a further feature, the plurality of slots are aligned along the conductive top plate in a first direction; and the sockets define a pair of channels separated by a first ridge recessed below the outer surface, the pair of channels being spaced apart in a second direction perpendicular to the first direction.

[0009] In a further feature, the pair of channels are spaced apart with a period of 1.3 mm.

[0010] In a further feature, the jack defines a second ridge that extends from the base of the jack to a maximum height coplanar with the outer surface of the conductive top plate, and the second ridge is spaced from the first ridge in the second direction.

[0011] In a further feature, the pair of channels and the jack extend parallel to the plurality of slots in the first direction.

[0012] In a further feature, the second ridge is adjacent to one of the pair of channels.

[0013] In a further feature, the first ridge extends 0.8 mm from the base of the jack; the maximum cross-sectional width of the first ridge is 1.3 mm; the second ridge extends 1.1 mm from the base to a maximum height coplanar with the outer surface of the conductive top plate; and the maximum cross-sectional width of the second ridge is 0.9 mm.

[0014] In a further feature, the jack is a first jack located on a first side of the plurality of slots, the plurality of slots being aligned in a first direction; a second jack is recessed below the outer surface on a second side of the plurality of slots opposite the first side, the second jack being spaced from the plurality of slots in a second direction perpendicular to the first direction, the second jack being configured to modify the radiation pattern of the RF signal emitted from the plurality of slots; and the plurality of slots are located between the first jack and the second jack.

[0015] In a further feature, the plurality of slots are a plurality of first slots, and the waveguide is a first waveguide; the conductive top plate further includes a plurality of second slots extending through the waveguide plate to the inner surface, the plurality of second slots being aligned parallel to the plurality of first slots above a second waveguide of the waveguide plate; and the first jack is located between the plurality of first slots and the plurality of second slots.

[0016] In a further feature, the plurality of slots are aligned in a first direction; and the jack defines a plurality of ridges, each of the plurality of ridges extending in the first direction, spaced in a second direction perpendicular to the first direction, and recessed below the outer surface.

[0017] In a further feature, the plurality of slots are aligned in a first direction; the jack defines a plurality of ridges, each of the plurality of ridges extending in the first direction and spaced in a second direction perpendicular to the first direction; and the height of the plurality of ridges gradually decreases as it moves away from the plurality of slots along the second direction.

[0018] Among various features, the present disclosure also provides an antenna assembly, which includes: a circuit board, the circuit board includes an integrated circuit configured to process radio frequency (RF) signals and conductive traces extending from the integrated circuit; a waveguide plate located above the circuit board, the waveguide plate includes waveguides, the waveguides are configured to guide the RF signals to the conductive traces and / or guide the RF signals from the conductive traces; and a conductive top plate located above the waveguide plate. The conductive top plate includes: an outer surface and an inner surface facing the waveguide plate, the outer surface is opposite to the inner surface; a plurality of openings, the plurality of openings extend through the conductive top plate to the waveguides, the plurality of openings are aligned in a first direction above the waveguides; and a plurality of channels, the plurality of channels are defined adjacent to the plurality of openings below the outer surface, each of the plurality of channels extends in the first direction and is spaced apart in a second direction perpendicular to the first direction.

[0019] In additional features, a plurality of ridges define the plurality of channels, and each of the plurality of ridges has a maximum height at or below a plane extending across the outer surface.

[0020] In additional features, the plurality of ridges include a first ridge and a second ridge, and the first ridge is shorter than the second ridge.

[0021] In additional features, each of the first ridges is located between two of the second ridges.

[0022] In additional features, the second ridge is closer to the plurality of openings than the first ridge.

[0023] In additional features, a plurality of the first ridges are located between two of the second ridges.

[0024] Among various features, the present disclosure provides an antenna assembly that includes: a circuit board including an integrated circuit configured to process radio frequency (RF) signals and conductive traces extending from the integrated circuit; a waveguide plate located above the circuit board, the waveguide plate including a waveguide configured to direct the RF signal to and / or from the conductive traces; and a conductive top plate located above the waveguide plate. The conductive top plate includes: an outer surface and an inner surface facing the waveguide plate, the outer surface being opposite to the inner surface; a plurality of slots extending through the waveguide plate to the waveguide, the plurality of slots being aligned in a first direction above the waveguide; and a channel recessed below a plane extending across the outer surface, the channel extending in the first direction parallel to the plurality of slots and spaced apart in a second direction perpendicular to the first direction, the channel being defined by ridges extending in the first direction, each of the ridges having a maximum height at or below the outer surface.

[0025] Based on the description provided herein, other applicable fields will become apparent. The description in this summary and the specific embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The purpose of the drawings described herein is only to illustrate the selected embodiments and not all possible implementation manners, and is not intended to limit the scope of the present disclosure.

[0027] Figure 1 is an exploded view of the antenna assembly according to the present disclosure;

[0028] Figure 2 is Figure 1 a plan view of the outer surface of the conductive top plate of the antenna assembly of

[0029] Figure 3 is Figure 2 a perspective view of a region of the conductive top plate of

[0030] Figure 4 is a cross-sectional view taken along line 4-4 of Figure 3 of

[0031] Figure 5 is a cross-sectional view of another conductive top plate according to the present disclosure;

[0032] Figure 6 is a cross-sectional view of an additional conductive top plate according to the present disclosure; and

[0033] Figure 7 is a graph showing an exemplary radiation pattern of the antenna assembly according to the present disclosure.

[0034] In the views of the drawings, corresponding reference numerals indicate corresponding components. Detailed Description

[0035] Exemplary embodiments will now be described more fully with reference to the drawings.

[0036] The present disclosure provides an antenna having a conductive outer plate that includes a negative-wave connection adjacent to a slot of the antenna. The negative-wave connection is in the form of a receptacle defined by the conductive outer plate. The receptacle is recessed below a plane extending across the outermost surface of the outer plate. The receptacle includes a plurality of ridges that define a channel. The receptacle can be customized to produce a radiation pattern of a customized width and total gain to suit any suitable application. For example, as explained herein, the height, width, spacing, and number of the ridges can be varied to customize the radiation pattern.

[0037] Figure 1 An exemplary antenna assembly 10 according to the present disclosure is shown. The antenna assembly 10 is configured for any suitable application, such as in combination with an adaptive cruise control system for a vehicle. The antenna assembly 10 can also be configured for any other suitable automotive or non-automotive use.

[0038] The antenna assembly 10 generally includes a circuit board 20, a waveguide plate 30, and a conductive top plate 50. The circuit board 20, the waveguide plate 30, and the conductive top plate 50 are fixed together in any suitable manner, such as using any suitable fasteners 12. The waveguide plate 30 is fixed between the circuit board 20 and the conductive top plate 50.

[0039] The circuit board 20 includes an integrated circuit (IC) 22 configured to process radio frequency (RF) signals. Conductive traces 24 extend from the IC 22 and are electrically connected to the IC 22. Conductive pads 26 are located at the distal ends of the traces 24. The pads 26 and the traces 24 are configured to conduct RF signals electrically to and from the IC 22.

[0040] The waveguide plate 30 is mounted above the circuit board 20. The waveguide plate 30 defines a plurality of waveguides 32. The waveguides 32 extend from feed holes 34. The feed holes 34 are aligned with the pads 26 of the circuit board 20. RF signals sent from the IC 22 are conducted along the traces 24 to the pads 26 and then conducted through the feed holes 34 of the waveguide plate 30 to the waveguides 32. Conversely, received RF signals are guided by the waveguides 32 to the feed holes 34 and then guided to the IC 22 by means of the pads 26 and the traces 24. The distal ends 36 of the waveguides 32 opposite the feed holes 34 are positioned and shaped to correspond to the slots of the conductive top plate 50, as explained herein.

[0041] The conductive top plate 50 has an outer surface 52 and an inner surface 54. The outer surface 52 is opposite to the inner surface 54. The inner surface 54 faces the waveguide plate 30. The outer surface 52 is the outer surface of the antenna assembly 10. The conductive top plate 50 is made of any suitable conductive material, such as any suitable metallic material.

[0042] Continuing to refer Figure 1 , and additionally referring Figures 2 to 4 , the conductive top plate 50 defines a plurality of slots 56 that extend through the conductive top plate 50 to the waveguide plate 30. The slots 56 are aligned with the distal end 36 of the waveguide 32. The slots 56 are configured to direct received RF signals to the distal end 36 of the waveguide 32 and / or direct RF signals away from the distal end 36 of the waveguide 32 during RF transmission. To facilitate the reception and / or transmission of RF signals, the conductive top plate 50 defines an inclined surface 58 adjacent to the plurality of slots 56. The inclined surface 58 extends from the outer surface 52 towards the slots 56 into the conductive top plate 50.

[0043] The plurality of slots 56 are arranged in respective groups, and each group is an antenna configured to receive and / or transmit RF signals based on the configuration of the IC 22. The conductive top plate 50 may include any suitable number of groups of slots 56. In the illustrated embodiment, the conductive top plate 50 includes eight groups: a first group 60A; a second group 60B; a third group 60C; a fourth group 60D; a fifth group 60E; a sixth group 60F; a seventh group 60G; and an eighth group 60H. Each of the groups 60A - 60H includes a plurality of slots 56, for example, six slots 56 in the illustrated embodiment. Each of the groups 60A - 60H is aligned / arranged along the conductive top plate 50 in a first direction. In Figure 2 the embodiment of, the first direction is along the Y-axis. Although eight groups 60A - 60H are shown, the conductive top plate 50 may include any suitable number of groups of slots 56.

[0044] Each of the groups 60A - 60D of slots 56 may be configured as a transmitting antenna, a receiving antenna, or a transceiver antenna. For example, the groups 60A - 60D may be configured as transmitting antennas, and the groups 60E - 60H may be configured as receiving antennas. Alternatively, the groups 60E to 60H may be configured as transmitting antennas, and the groups 60A to 60D may be configured as receiving antennas.

[0045] The conductive top plate 50 further includes a plurality of jacks 70A - 70L that are recessed below the outer surface 52 of the top plate 50. Any suitable number of jacks 70A - 70L may be included. In Figure 2In an embodiment, the conductive top plate 50 includes twelve jacks 70A - 70L. The jacks 70A - 70L are adjacent to groups 60A - 60H of slots 56. The jacks 70A - 70L can be located on only one side of the plurality of slots 56, or on both sides of the plurality of slots 56. The jacks 70A - 70L are configured to modify RF signals transmitted from or received by the plurality of slots 56, as explained herein.

[0046] Specifically referring to Figure 4 , for example, each of the jacks 70A - 70L defines at least one channel 72. The channels 72 extend parallel to groups 60A - 60H of slots 56. In the illustrated embodiment, the channels 72 extend along the Y - axis (see Figure 2 ) that extends in a first direction. The channels 72 are spaced from groups 60A - 60H of slots 56 in a second direction along the X - axis, the second direction being perpendicular to the first direction.

[0047] The channels 72 are defined by ridges within the jacks 70A - 70L. As shown in the embodiment of Figure 4 , each of the jacks 70A, 70B, and 70C includes a first ridge 74. The first ridge 74 extends parallel to the slots 56 along the Y - axis in the first direction. The first ridge 74 extends from the base 80 of the jacks 70A - 70C along the Z - axis. The first ridge 74 extends from the base 80 to a maximum height below the outer surface 52 of the conductive top plate 50. The first ridge 74 defines a pair of channels 72 on its opposite sides. In Figure 4 's embodiment, each of the first ridges 74 is spaced from groups 60A, 60A of slots 56 in a second direction along the X - axis, the second direction along the X - axis being perpendicular to the first direction along the Y - axis.

[0048] In Figure 4 's embodiment, the jacks 70A - 70C are further defined with a second ridge 82. The second ridge 82 extends from the base 80 to the outer surface 52. The second ridge 82 has a maximum height coplanar with the outer surface 52. Thus, the second ridge 82 is higher than the first ridge 74 in the Z - axis direction. The second ridge 82 extends parallel to the first ridge 74 in the first direction along the Y - axis. In Figure 4 's embodiment, each of the second ridges 82 is spaced from groups 60A, 60A of slots 56 in a second direction along the X - axis, the second direction along the X - axis being perpendicular to the first direction along the Y - axis. In the direction of the X - axis, each of the jacks 70A - 70C includes an outermost second ridge 82 that is adjacent to the inclined surface 58.

[0049] Regarding Figure 4In an embodiment, each ridge in the first ridges 74 is between two second ridges 82. One of the second ridges 82 is between two first ridges 74. This second ridge 82 is at an intermediate position between the outermost second ridges 82 along the X-axis and at the center of the jacks 70A, 70B, 70C. The outermost ridges in the second ridges 82 are adjacent to the inclined surface 58 and generally define the outermost boundaries of the jacks 70A, 70B, and 70C in the X-axis direction.

[0050] The first ridges 74 can extend from the base 80 to any suitable maximum height below the outer surface 52. For example, the first ridges 74 can extend to a first height A that is 0.8 mm from the base 80, or about 0.8 mm from the base 80. The first ridges 74 can have a maximum cross-sectional width B of, for example, 1.3 mm or about 1.3 mm. The channels 72 defined on opposite sides of the first ridges 74 can be sinusoidally spaced apart at a distance of 1.3 mm, about 1.3 mm, or any other suitable distance. The second ridges 82 extend from the base 80 to a maximum height C of, for example, 1.1 mm. The second ridges 82 can have a maximum cross-sectional width D of, for example, 0.9 mm.

[0051] Any one of the other jacks 70D - 70L can be configured with the first ridges 74 and the second ridges 82 as described above and as shown in Figure 4 or configured in any other suitable manner. For example, due to the position of the eighth group 60H of slots 56 at the distal side of the conductive top plate 50, the jacks 70K and 70L on opposite sides of the group 60H will be relatively narrower along the X-axis due to the size of the top plate 50. For example, each of the jacks 70K and 70L can include only one ridge in the first ridges 74 and one ridge in the second ridges 82. Alternatively, the jacks 70K and 70L can each include only one ridge or two ridges in the first ridges 74 and not include any of the ridges in the second ridges 82.

[0052] Figure 5 An additional exemplary configuration of the jacks 70A, 70B, and 70C is shown. In Figure 5 's embodiment, each of the jacks 70A, 70B, and 70C includes three first ridges 74, each having a maximum height below the outer surface 52 of the conductive top plate 50. The three first ridges 74 of each of the jacks 70A, 70B, 70C are between two second ridges 82 adjacent to the inclined surface 58. Any one of the other jacks 70D - 70L can be configured relative to the jacks 70A - 70C as Figure 5 shown. The other jacks 70D - 70L can include any other suitable arrangement of the first ridges 74 and / or the second ridges 82.

[0053] Figure 6Additional exemplary configurations of jacks 70A, 70B, and 70C are shown. In Figure 6 the embodiment of, each of the jacks 70A, 70B, and 70C includes a third ridge 84 at its center along the X-axis, which extends in a second direction perpendicular to the set of slots 56. The third ridge 84 is shorter than the first ridge 74 along the Z-axis and thus does not extend as far from the base surface 80 as the first ridge 74. Each third ridge 84 is located between two first ridges 74. The second ridge 82 is located outside the first ridge 74 in the X-axis direction and is adjacent to the inclined surface 58. Thus, the height of the ridges decreases from the second ridge 82 to the first ridge 74 and to the third ridge 84 toward the centers of the jacks 70A, 70B, and 70C. Any of the other jacks 70D - 70L can be configured relative to the jacks 70A - 70C as Figure 6 shown. The other jacks 70D - 70L can include any other suitable arrangement of the first ridge 74, the second ridge 82, and / or the third ridge 84.

[0054] Figure 7 Two exemplary radiation patterns of the antenna assembly 10 are shown: a first radiation pattern A and a second radiation pattern B. The radiation pattern represents the tunability of the antenna assembly 10 and specifically represents the tunability of the jacks 70A - 70L of the antenna assembly 10. The first radiation pattern A represents an antenna assembly 10 that is configured in the jacks 70A - 70L with ridges having a relatively larger number of uniform peaks. The second radiation pattern B represents an antenna assembly 10 that is configured in the jacks 70A - 70L with ridges having a relatively smaller number of uniform peaks. Thus, the first radiation pattern A can be produced by Figure 5 the configuration of, in which each of the jacks 70A - 70C (and potentially the jacks 70D - 70L) includes: three first ridges 74 of the same height in a row; and two second ridges 82 of the same height adjacent to the inclined surface 58. The first radiation pattern A has the advantage of a wider pattern compared to the second radiation pattern B, but has a lower gain at the center.

[0055] The second radiation pattern B has the advantage of a higher total gain at its center compared to the first radiation pattern A, but is narrower compared to the first radiation pattern A. The second radiation pattern B represents an antenna assembly 10 that is configured in the jacks 70A - 70L with ridges 74, 82, 84 having fewer uniform peaks. For example, the second radiation pattern B can be produced by Figure 4 or Figure 6 the configuration of, in which the peaks of the ridges are less uniform. In Figure 4 and Figure 6 the embodiments of, none of the adjacent ridges have the same Z-axis height and thus none are uniform.

[0056] Accordingly, the present disclosure advantageously provides an antenna assembly 10 having a top plate 50 that can be modified to customize the radiation pattern. In particular, the jacks 70A - 70L serve as negative-wave connections that modify the RF signals transmitted through or from the slot 56 to the jacks 70A - 70L. The negative-wave connections of the jacks 70A - 70L can be customized to customize the radiation pattern. In particular, the ridges 74, 78, and 82 can vary in height, width, spacing, and / or position with respect to the jacks 70A - 70L to achieve a radiation pattern suitable for a particular application, such as Figure 7 radiation pattern A or radiation pattern B.

[0057] The above description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. The various elements or features of a particular embodiment are generally not limited to that particular embodiment and, where applicable, can be interchanged and used in a selected embodiment even if not specifically shown or described. This can also vary in many ways. Such variations should not be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

[0058] Exemplary embodiments are provided so that this disclosure will be thorough and will convey the full scope of the disclosure to those skilled in the art. To enable a thorough understanding of the embodiments of this disclosure, many specific details are set forth (such as examples of specific components, devices, and methods). It will be apparent to those skilled in the art that the exemplary embodiments can be embodied in many different forms without the use of specific details and that neither form should be construed as limiting the scope of the disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies have not been described in detail.

[0059] The terms used herein are for the purpose of describing particular exemplary embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "the", and "said" are also intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprising", "including", and "having" are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein should not be construed as necessarily occurring in the particular order discussed or illustrated unless the order of performance is specifically specified. It should also be understood that additional or alternative steps can be employed.

[0060] When an element or layer is referred to as being on, "attached to", "connected to", or "coupled to" another element or layer, the element or layer can be directly on, attached to, connected to, or coupled to the other element or layer; or there can be intervening elements or layers. In contrast, when an element is referred to as being directly on, "directly attached to", "directly connected to", or "directly coupled to" another element or layer, there can be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0061] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another region, layer, or section. Terms such as "first", "second", and other numerical terms do not imply an order or sequence when used herein, unless the context clearly indicates otherwise. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0062] For ease of description, spatial relative terms (such as "inner", "outer", "beneath", "below", "lower", "above", "upper", etc.) may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures. In addition to the orientation depicted in the figures, the spatial relative terms may also include different orientations of the device during use or operation. For example, if the device in the figures is turned over, then other elements or features described as "beneath" or "below" other elements or features would be oriented as "above" the other elements or features. Thus, the example term "beneath" can include both an orientation of "above" and "beneath". The device may be oriented in other ways (rotated 90 degrees or other orientations), and the spatial relative descriptors used herein may be interpreted accordingly.

Claims

1. An antenna assembly, comprising: a circuit board including an integrated circuit configured to process radio frequency signals (RF signals) and conductive traces extending from the integrated circuit; a waveguide plate located above the circuit board, the waveguide plate comprising a waveguide configured to guide the RF signal to and / or from the conductive trace; as well as A conductive top plate located above the waveguide plate, the conductive top plate comprising: an outer surface and an inner surface facing the waveguide plate, the outer surface being opposite to the inner surface; a plurality of slots aligned with the waveguides and extending through the conductive top plate; and A jack is recessed beneath the outer surface adjacent to the plurality of slots, the jack being configured to modify a radiation pattern of the RF signals transmitted from the plurality of slots through the jack.

2. The antenna assembly according to claim 1, wherein: The receptacle defines at least one channel extending parallel to the plurality of slots.

3. The antenna assembly according to claim 1, wherein: The receptacle defines at least one ridge recessed below the outer surface.

4. The antenna assembly according to claim 1, wherein: The plurality of slots are aligned along the conductive top plate in a first direction; and The receptacle defines a pair of channels separated by a first ridge recessed below the outer surface, the pair of channels being spaced apart in a second direction that is perpendicular to the first direction.

5. The antenna assembly according to claim 4, wherein: The pair of channels are spaced apart at a period of 1.3 mm.

6. The antenna assembly according to claim 4, wherein: The receptacle defines a second ridge extending from a base of the receptacle to a maximum height coplanar with the outer surface of the conductive top plate, the second ridge being spaced apart from the first ridge in the second direction.

7. The antenna assembly according to claim 6, wherein: The pair of channels and the receptacle extend parallel to the plurality of slots in the first direction.

8. The antenna assembly according to claim 7, wherein: The second ridge is adjacent to one of the pair of channels.

9. The antenna assembly of claim 8, wherein: The first ridge extends 0.8 mm from the base of the socket; The maximum cross-sectional width of the first ridge is 1.3 mm; The second ridge extends 1.1 mm from the base to a maximum height coplanar with the outer surface of the conductive top plate; and The maximum cross-sectional width of the second ridge is 0.9 mm.

10. The antenna assembly of claim 1, wherein: The receptacle is a first receptacle located on a first side of the plurality of slots, the plurality of slots being aligned in a first direction; a second jack recessed below the outer surface at a second side of the plurality of slots opposite the first side, the second jack being spaced apart from the plurality of slots in a second direction perpendicular to the first direction, the second jack being configured to modify the radiation pattern of the RF signal emitted from the plurality of slots; and The plurality of slots are located between the first receptacle and the second receptacle.

11. The antenna assembly of claim 10, wherein: The plurality of slots are a plurality of first slots, and the waveguide is a first waveguide; The conductive top plate further includes a plurality of second slots extending through the waveguide plate to the inner surface, the plurality of second slots being aligned parallel to the plurality of first slots over a second waveguide of the waveguide plate; and The first insertion hole is located between the plurality of first slots and the plurality of second slots.

12. The antenna assembly of claim 1, wherein: The plurality of slots are aligned in a first direction; and The receptacle defines a plurality of ridges, each of the plurality of ridges extending in the first direction, spaced apart in a second direction perpendicular to the first direction, and recessed below the outer surface.

13. The antenna assembly of claim 1, wherein: The plurality of slots are aligned in a first direction; the receptacle defines a plurality of ridges, each of the plurality of ridges extending in the first direction and spaced apart in a second direction perpendicular to the first direction; and The heights of the plurality of ridges gradually decrease as they move away from the plurality of slots along the second direction.

14. An antenna assembly, comprising: a circuit board including an integrated circuit configured to process radio frequency signals (RF signals) and conductive traces extending from the integrated circuit; a waveguide plate located above the circuit board, the waveguide plate comprising a waveguide configured to guide the RF signal to and / or from the conductive trace; as well as A conductive top plate, the conductive top plate is located above the waveguide plate, and the conductive top plate comprises: an outer surface and an inner surface facing the waveguide plate, the outer surface being opposite to the inner surface; a plurality of openings extending through the conductive top plate to the waveguide, the plurality of openings being aligned in a first direction above the waveguide; and A plurality of channels are defined beneath the outer surface adjacent the plurality of openings, each of the plurality of channels extending in the first direction and spaced apart in a second direction perpendicular to the first direction.

15. The antenna assembly of claim 14, further comprising a plurality of ridges defining the plurality of channels, the plurality of ridges each having a maximum height at or below a plane extending across the outer surface.

16. The antenna assembly according to claim 15, wherein: The plurality of ridges include a first ridge and a second ridge, the first ridge being shorter than the second ridge.

17. The antenna assembly according to claim 16, wherein: Each of the first ridges is located between two of the second ridges.

18. The antenna assembly according to claim 16, wherein: The second ridge is closer to the plurality of openings than the first ridge.

19. The antenna assembly according to claim 16, wherein: A plurality of first ridges among the first ridges are located between two second ridges among the second ridges.

20. An antenna assembly, comprising: a circuit board including an integrated circuit configured to process radio frequency signals (RF signals) and conductive traces extending from the integrated circuit; a waveguide plate located above the circuit board, the waveguide plate comprising a waveguide configured to guide the RF signal to and / or from the conductive trace; as well as A conductive top plate, the conductive top plate is located above the waveguide plate, and the conductive top plate comprises: an outer surface and an inner surface facing the waveguide plate, the outer surface being opposite to the inner surface; a plurality of slots extending through the waveguide plate to the waveguide, the plurality of slots being aligned in a first direction over the waveguide; and a channel recessed below a plane extending across the outer surface, the channel extending in the first direction parallel to the plurality of slots and spaced apart in a second direction perpendicular to the first direction, the channel being defined by ridges extending in the first direction, each of the ridges having a maximum height at or below the outer surface.

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