A bus duct for connecting electric power grid construction

Abstract

The present invention belongs to the technical field of power grid construction, and specifically relates to a bus duct connected to the construction of an electric power grid. The bus duct connected to the construction of an electric power grid comprises: a mounting frame for supporting and fixing the overall structure; an outer shell installed on the inner side of the mounting frame, the outer shell comprising a bottom shell and a top cover, and auxiliary heat sinks are provided on the surfaces of the bottom shell and the top cover; a bus bar arranged inside the outer shell for conducting electricity; a thermal pad affixed to the outer side of the bus bar for conducting heat; the problem to be solved in this solution is that conventional bus ducts are prone to excessive local temperature rise, uneven heat dissipation, and poor structural stability; the solution of the present invention is to absorb heat through a heat-absorbing pipe and an internal medium, and cooperate with the operation of a heat pump to make the medium flow to the heat dissipation pipe, and quickly dissipate heat outward through the connecting pipe and the heat dissipation pipe, and cooperate with the thermal pad and the auxiliary heat sink to assist in the outward heat dissipation, so that the bus bar can be quickly dissipated.

Description

Technical Field

[0001] The present invention belongs to the technical field of power grid construction, and in particular relates to a bus duct connected to a power grid construction. Background Art

[0002] With the continuous expansion of modern power systems and the rapid development of renewable energy generation technologies, grid construction has placed higher demands on the reliability, safety, and efficiency of transmission and distribution equipment. Busbars, as core components responsible for the transmission and distribution of high currents in power systems, are widely used in substations, industrial plants, data centers, and renewable energy power generation sites. Their performance directly impacts the operational efficiency and power supply quality of power networks.

[0003] In the existing technology, conventional bus ducts mostly adopt natural convection heat dissipation structures, such as surface heat sinks or air convection designs. However, when operating under long-term high loads, they have the following defects:

[0004] Excessive local temperature rise: Low natural heat dissipation efficiency causes the local temperature of the busbar to reach over 70°C, accelerating the aging of the insulation material;

[0005] Uneven heat dissipation: Heat tends to accumulate in the gaps between busbars, creating a "heat island effect" and increasing the risk of short circuits.

[0006] Poor structural stability: Traditional support structures have difficulty adapting to thermal expansion deformation, resulting in seal failure or loose connections;

[0007] Therefore, it is necessary to design a bus duct for connecting power grid construction to solve the above problems. Summary of the Invention

[0008] The object of the present invention is to provide a bus duct for connecting to an electric power grid so as to solve the problems raised in the above background technology.

[0009] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a bus duct for connecting an electric power grid, comprising:

[0010] Mounting frame, used to support and fix the overall structure;

[0011] A housing is installed inside the mounting frame, the housing comprising a bottom shell and a top cover, and auxiliary heat sinks are provided on the surfaces of the bottom shell and the top cover;

[0012] A busbar is provided inside the housing and is used for conducting electricity;

[0013] A thermal pad is attached to the outside of the busbar to conduct heat;

[0014] The heat dissipation mechanism includes a heat absorbing pipe, a heat dissipating pipe, a heat pump and a connecting pipe, wherein the heat absorbing pipe is installed between the busbars and is connected to the heat dissipating pipe and the heat pump through the connecting pipe to form a circulating heat dissipation channel, and the main heat sink is welded on the surface of the heat dissipating pipe;

[0015] The supporting mechanism is used to fix the heat absorbing tube and ensure its sealed connection with the connecting tube.

[0016] Preferably, the cross-section of the heat absorbing tube and the heat dissipating tube is square, the heat dissipating tube is fixed to the outside of the bottom shell, and a sealing ring is provided at the connection between the connecting tube and the heat absorbing tube.

[0017] Preferably, the support mechanism includes a support main board, a support push plate and a pushing screw. The support push plate is driven by the pushing screw. Both ends of the pushing screw are provided with threads with opposite rotation directions and are screwed with a pushing nut. A transmission rod is rotatably installed on the outer side of the pushing nut. The other end of the transmission rod is rotatably connected to the support push plate. The pushing screw is rotatably connected to the support main board through a bearing.

[0018] Preferably, a mounting pad is provided on one side of the support push plate, a positioning slot is provided on one side of the heat absorption tube, and the mounting pad is engaged with the positioning slot; the adjusting head of the pushing screw is hidden in a hidden slot of the support main board.

[0019] Preferably, the busbar includes a busbar body, an insulating layer and an insulating sheath, and the thermal pad is composed of a thermal conductive plate, a thermal conductive carbon fiber layer and a thermal conductive graphite film.

[0020] Preferably, the mounting frame includes a mounting hanger plate, a mounting support plate and a limiting clamping plate, the mounting support plate is fixed to the bottom shell by limiting bolts, and a ventilation fan is provided in the vent of the mounting hanger plate.

[0021] Preferably, the inner wall of the heat absorbing tube is provided with heat-conducting capillary protrusions for accelerating heat exchange.

[0022] Preferably, a guide slot is provided on the inner side of the supporting main board, and the pushing nut is slidably connected to the guide slot via a guide slider.

[0023] Preferably, the heat dissipation pump drives the heat dissipation medium to circulate between the heat absorption pipe and the heat dissipation pipe.

[0024] Preferably, the auxiliary heat sink cooperates with the thermal pad to form a multi-layer heat dissipation path.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. Through the designed heat dissipation mechanism, the heat absorption tube is supported between the busbars. The heat absorption tube and the internal cooling medium absorb heat, and the operation of the heat pump makes the cooling medium flow to the heat dissipation tube. The heat is quickly dissipated outward through the connecting tube and the heat dissipation tube. In addition, the heat dissipation is assisted by the thermal pad and auxiliary heat sink. The ventilation fan assists the heat dissipation mechanism to quickly dissipate heat, which can accelerate the heat dissipation of the busbars for a second time. The capillary structure of the thermal capillary protrusions facilitates rapid heat exchange with the internal cooling medium during heat conduction, further enhancing heat dissipation.

[0027] 2. Through the designed support mechanism, when the busbar and the heat absorption tube are installed alternately in use, the support mechanism supports the heat absorption tubes between them, thereby ensuring that the heat absorption tubes are stably installed inside the bottom shell. The support of the heat absorption tubes ensures stable communication between the heat absorption tubes and the connecting tubes, avoiding leakage at the connecting points.

[0028] 3. Through the designed mounting bracket, the shell is installed through the mounting bracket during use, and the shell is composed of a bottom shell and a top cover. The bottom shell can be clamped and positioned by the cooperation of the limiting card plate and the mounting support plate of the mounting bracket, thereby ensuring that the shell is more stable when installed and used through the mounting bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention;

[0031] Figure 3 Schematic diagram of the heat dissipation structure of the present invention;

[0032] Figure 4 It is a schematic structural diagram of the support mechanism of the present invention;

[0033] Figure 5 Schematic diagram of the support adjustment structure of the present invention;

[0034] Figure 6 Schematic diagram of the thermal pad structure of the present invention;

[0035] Figure 7 Schematic diagram of the busbar structure of the present invention;

[0036] Figure 8 It is a schematic diagram of the mounting frame structure of the present invention;

[0037] Figure 9 It is a schematic diagram of the top view of the structure of the present invention;

[0038] Figure 10 This is a schematic diagram of the heat absorption tube positioning and installation structure of the present invention;

[0039] In the figure: 1. outer shell; 11. bottom shell; 12. top cover; 2. heat dissipation mechanism; 21. heat pump; 22. heat dissipation pipe; 23. heat absorption pipe; 231. thermal capillary protrusion; 232. positioning slot; 24. connecting pipe; 25. main heat sink; 26. auxiliary heat sink; 3. supporting mechanism; 31. supporting mainboard; 32. supporting push plate; 321. mounting pad; 33. adjusting turntable; 34. pushing screw; 35. pushing nut; 36. transmission rod; 37. hidden slot; 4. busbar; 41. busbar body; 42. insulation layer; 43. insulation sheath; 5. thermal pad; 51. thermal conductive plate; 52. thermal conductive carbon fiber layer; 53. thermal conductive graphite film; 6. mounting frame; 61. mounting hanger; 62. mounting support plate; 63. limiting bolt; 64. limiting card; 65. vent; 66. ventilation fan. DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0041] Example 1: A bus duct connected to a power grid construction includes a mounting frame 6 and a shell 1 installed inside the mounting frame 6. A bus bar 4 is installed inside the shell 1, a thermal pad 5 is provided on the outside of the bus bar 4, and a heat dissipation mechanism 2 is provided on the outside of the shell 1; the shell 1 includes a bottom shell 11 and a top cover 12 fixedly installed on the bottom shell 11, and auxiliary heat sinks 26 are provided on the surfaces of the bottom shell 11 and the top cover 12; the heat dissipation mechanism 2 includes a heat dissipation pipe 22 fixed on the outside of the bottom shell 11 and a heat absorption pipe 23 installed between the bus bars 4, a support mechanism 3 is provided between the heat absorption pipes 23, and one end of the heat dissipation pipe 22 is connected to a heat dissipation pump 21. The heat dissipation pump 21 has a flow range of 0.8-2 L / min and a power consumption of ≤50 W; the heat pump 21 and the heat pipe 22 are connected to the heat absorption pipe 23 through the connecting pipe 24. The busbar 4 generates heat, which is absorbed by the heat absorption pipe 23. At the same time, the operation of the heat pump 21 drives the cooling medium to circulate between the heat absorption pipe 23 and the heat dissipation pipe 22, thereby assisting the heat absorption pipe 23 to quickly absorb the heat of the busbar 4, and then dissipate the heat outward through the heat dissipation pipe 22 and the main heat sink 25; the heat dissipation pipe 22 is fixedly mounted on the outside of the bottom shell 11, and the cross-sectional shapes of the heat absorption pipe 23 and the heat dissipation pipe 22 are both set to be square, which is convenient for installation between the busbar 4 when in use, and facilitates the circulation of internal cooling medium for heat absorption and heat dissipation; the connecting pipe 24 is fixedly mounted on one end of the heat dissipation pipe 22 and one end of the heat pump 21. The two ends of the heat absorption pipe 23 are provided with bayonet holes corresponding to the positions of the connecting pipe 24, and a sealing ring is provided on the inside of the bayonet hole, which facilitates the rapid connection between the connecting pipe 24 and the heat absorption pipe 23 when in use.

[0042] The busbar 4 includes a busbar body 41, and an insulating layer 42 is provided on the outside of the busbar body 41. The insulating layer 42 is made of epoxy resin EP-230 (temperature resistance grade H, dielectric strength ≥30 kV / mm). An insulating sheath 43 is provided on the outside of the insulating layer 42 to enhance the insulation capability of the busbar body 41 and facilitate installation and use. The thermal pad 5 includes a thermal conductive plate 51, which is attached to the bottom shell 11 and the top cover 12. A thermal conductive carbon fiber layer 52 is provided on one side of the thermal conductive plate 51, and a thermal conductive graphite film 53 is provided on one side of the thermal conductive carbon fiber layer 52. The directional heat conduction of the thermal conductive carbon fiber layer 52 and the horizontal heat conduction of the thermal conductive graphite film 53 avoid local overheating and facilitate rapid heat conduction and heat dissipation.

[0043] As can be seen from the above description, the present invention has the following beneficial effects: when in use, the heat absorbing tube 23 is supported between the busbars 4, and heat is absorbed by the heat absorbing tube 23 and the internal cooling medium. In conjunction with the operation of the heat pump 21, the cooling medium flows to the heat dissipation tube 22, and the heat is quickly dissipated outward through the connecting tube 24 and the heat dissipation tube 22. In addition, the heat conductive pad 5 and the auxiliary heat sink 26 assist in the outward heat dissipation, thereby quickly dissipating heat from the busbar 4.

[0044] Embodiment 2: On the basis of embodiment 1, a support mechanism 3 is provided, including a support main board 31, support push plates 32 are slidably installed on both sides of the support main board 31, and guide plates are provided at both ends of the support push plates 32. The support push plates 32 are slidably installed in the support main board 31, and a pushing screw 34 is rotatably installed in the middle of the support main board 31. A pushing nut 35 is sleeved on the outer side of the pushing screw 34, and a transmission rod 36 is rotatably installed on one side of the pushing nut 35. One end of the transmission rod 36 is rotatably installed on one side of the support push plate 32, and one end of the pushing screw 34 passes through the support main board 31 and is provided with an adjusting head 33. The support mechanism 3 is installed between the heat absorption tubes 23, and a tool is used to rotate The movable adjusting head 33 drives the pushing screw 34 to rotate, and the pushing screw 34 drives the pushing nut 35 to move, thereby driving the transmission rod 36 to rotate, so that the transmission rod 36 pushes the support push plate 32 to slide and support on the heat absorption tube 23; the end of the support main board 31 is provided with a hidden groove 37, the adjusting head 33 is located inside the hidden groove 37, and the shape of the adjusting head 33 is set to a hexagonal column, which is convenient for hiding the adjusting head 33 when in use; the inner side of the support main board 31 is provided with a guide groove, and a guide slider is provided on one side of the pushing nut 35. The pushing nut 35 is slidably installed in the supporting main board 31 through the guide slider and the guide groove, and the sliding of the pushing nut 35 is more stable during adjustment.

[0045] When the support mechanism 3 of the above technical solution is used, when the busbar 4 and the heat absorption tube 23 are installed alternately in sequence, the support mechanism 3 supports the heat absorption tube 23, thereby ensuring that the heat absorption tube 23 is stably installed inside the bottom shell 11. The support of the heat absorption tube 23 ensures stable communication between the heat absorption tube 23 and the connecting tube 24, avoiding leakage at the connection point.

[0046] The inner wall of the heat absorbing tube 23 is provided with heat-conducting capillary protrusions 231. The heat-conducting capillary protrusions 231 are made of a copper-based composite material with a density of ≥2000 / cm². A positioning slot 232 is provided on one side of the heat absorbing tube 23. A mounting pad 321 is fixedly mounted on one side of the support push plate 32. The support push plate 32 is engaged with the heat absorbing tube 23 via the mounting pad 321 and the positioning slot 232.

[0047] The positioning slot 232 and the mounting pad 321 of the above-mentioned technical solution are used to position the support push plate 32 and the heat absorption tube 23 during use, thereby facilitating positioning and installation when installing the heat absorption tube 23 and the support push plate 32. The capillary structure of the heat-conducting capillary protrusion 231 facilitates rapid heat exchange with the internal cooling medium during heat conduction, thereby accelerating heat dissipation.

[0048] Furthermore, the mounting frame 6 includes a mounting hanger plate 61, a mounting support plate 62 is installed at the lower end of the mounting hanger plate 61, limiting bolts 63 are set at both ends of the mounting support plate 62, and a limiting clamping plate 64 is set on one side of the mounting hanger plate 61. The bottom shell 11 is supported on the mounting support plate 62, and the limiting clamping plate 64 is clamped on the outer side of the bottom shell 11. The outer shell 1 is clamped and supported by the mounting support plate 62 and the limiting clamping plate 64, and is hoisted in the use position by the mounting hanger plate 61. A vent 65 is set on one side of the mounting hanger plate 61 corresponding to the position of the limiting clamping plate 64, and a ventilation fan 66 is set on the inner side of the vent 65. When hoisted in the use position, the ventilation fan 66 can blow air to the main heat sink 25, thereby accelerating heat dissipation.

[0049] The mounting frame 6 using the above technical solution is used to install the outer shell 1 through the mounting frame 6 during use, and the outer shell 1 is composed of a bottom shell 11 and a top cover 12. The bottom shell 11 can be positioned and clamped by cooperating with the limiting card plate 64 and the mounting support plate 62 of the mounting frame 6, thereby ensuring that the outer shell 1 is more stable when installed and used through the mounting frame 6.

[0050] The working principle and use process of the present invention are as follows: During installation, place the thermal pad 5 into the bottom of the bottom shell 11, then place the busbar 4, place the heat absorbing tube 23 on the busbar 4, and install the support mechanism 3 between the heat absorbing tubes 23. Use a tool to rotate the adjusting head 33 to drive the pushing screw 34 to rotate, and the pushing screw 34 drives the pushing nut 35 to move, thereby driving the transmission rod 36 to rotate, so that the transmission rod 36 pushes the support push plate 32 to slide and support on the heat absorbing tube 23, so that the bayonet on one side of the heat absorbing tube 23 is tightly fitted with one end of the connecting tube 24, ensuring the connection while strengthening the seal, and then install the busbar 4 and the heat absorbing tube 23 in sequence. Finally, place the thermal pad 5 on the top, cover the top cover 12 on the upper side of the bottom shell 11 and fix it with bolts. When installed and used, the shell 1 is clamped and supported by the installation support plate 62 and the limit card plate 64, and is hoisted in the use position by installing the hanging plate 61. When in use, the busbar 4 generates heat, which is absorbed by the heat absorption pipe 23. At the same time, the heat pump 21 runs to drive the cooling medium to circulate between the heat absorption pipe 23 and the heat dissipation pipe 22, thereby assisting the heat absorption pipe 23 to quickly absorb the heat of the busbar 4, and then dissipate the heat outward through the heat dissipation pipe 22 and the main heat sink 25. At the same time, the heat dissipation outward is assisted by the thermal pad 5 and the auxiliary heat sink 26.

[0051] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0052] The above description is only used to illustrate the technical solution of the present invention and is not intended to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A bus duct for connecting power grid construction, characterized in that: include: A mounting frame (6) for supporting and fixing the entire structure; A housing (1) is mounted on the inner side of the mounting frame (6), the housing (1) comprising a bottom housing (11) and a top cover (12), and auxiliary heat sinks (26) are provided on the surfaces of the bottom housing (11) and the top cover (12); A busbar (4) is arranged inside the housing (1) and is used for conducting electricity; A thermal pad (5) is attached to the outside of the busbar (4) and is used to conduct heat; A heat dissipation mechanism (2) comprising a heat absorbing pipe (23), a heat dissipation pipe (22), a heat dissipation pump (21) and a connecting pipe (24), wherein the heat absorbing pipe (23) is installed between the busbars (4) and is connected to the heat dissipation pipe (22) and the heat dissipation pump (21) via the connecting pipe (24) to form a circulating heat dissipation channel, and a main heat sink (25) is welded to the surface of the heat dissipation pipe (22); A supporting mechanism (3) for fixing the heat absorbing tube (23) and ensuring a sealed connection between the heat absorbing tube (23) and the connecting tube (24); The support mechanism (3) includes a support main plate (31), a support push plate (32) and a push screw (34), wherein the support push plate (32) is driven by the push screw (34), and both ends of the push screw (34) are provided with threads with opposite rotation directions and are screwed with a push nut (35), and a transmission rod (36) is rotatably mounted on the outer side of the push nut (35), and the other end of the transmission rod (36) is rotatably connected to the support push plate (32), and the push screw (34) is rotatably connected to the support main plate (31) through a bearing; A mounting pad (321) is provided on one side of the support push plate (32), and a positioning slot (232) is provided on one side of the heat absorption tube (23), wherein the mounting pad (321) is engaged with the positioning slot (232); the adjusting rotary head (33) of the pushing screw (34) is hidden in the hidden slot (37) of the support main plate (31); The mounting frame (6) includes a mounting hanger plate (61), a mounting support plate (62) and a limiting clamping plate (64); the mounting support plate (62) is fixed to the bottom shell (11) via a limiting bolt (63); a ventilation fan (66) is provided in the vent (65) of the mounting hanger plate (61); The inner wall of the heat absorbing tube (23) is provided with heat-conducting capillary protrusions (231) for accelerating heat exchange.

2. The bus duct according to claim 1, wherein: The cross-sections of the heat absorbing tube (23) and the heat dissipating tube (22) are square, the heat dissipating tube (22) is fixed to the outside of the bottom shell (11), and a sealing ring is provided at the connection between the connecting tube (24) and the heat absorbing tube (23).

3. The bus duct according to claim 1, wherein: The busbar (4) comprises a busbar body (41), an insulating layer (42) and an insulating sheath (43); the thermal pad (5) is composed of a thermal conductive plate (51), a thermal conductive carbon fiber layer (52) and a thermal conductive graphite film (53).

4. The bus duct according to claim 1, wherein: A guide slot is provided on the inner side of the support main plate (31), and the push nut (35) is slidably connected to the guide slot via a guide slider.

5. The bus duct according to claim 1, characterized in that: The heat dissipation pump (21) drives the heat dissipation medium to circulate between the heat absorption pipe (23) and the heat dissipation pipe (22).

6. The bus duct according to claim 1, wherein: The auxiliary heat sink (26) cooperates with the thermal pad (5) to form a multi-layer heat dissipation path.

Images