High-heat dissipation double-sided copper substrate and manufacturing method thereof, electronic equipment, and storage medium

Abstract

The present invention discloses a double-sided copper substrate with high heat dissipation, a manufacturing method thereof, an electronic device, and a storage medium, and relates to the field of packaging substrate technology. The method comprises: obtaining a copper substrate; laminating a prepreg and a first copper foil on the first surface of the copper substrate to form a first substrate; providing a groove on the second surface of the copper substrate; placing an RCC layer in the groove, and laminating the RCC layer and the first substrate by a laminating mechanism to form a second substrate; drilling the second substrate once to form a first through hole, and plugging the first through hole with resin; drilling the resin twice to form a second through hole, and metalizing the hole wall and surface of the second through hole; providing a first blind hole in the RCC layer, and providing a first circuit on the surface of the RCC layer; providing a second blind hole between the first copper foil and the copper substrate, and providing a second circuit on the surface of the first copper foil. The method according to the embodiment of the present invention can significantly improve heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging substrates, and in particular to a double-sided copper substrate with high heat dissipation, a manufacturing method thereof, electronic equipment, and a storage medium. Background Art

[0002] With the development of the electronics industry, high-power, high-current electronic products are increasingly being used. This places increasing demands on the packaging substrates that serve as carriers for electronic components, with a particular emphasis on heat dissipation. Due to the high power and current draw of these electronic products, they generate significant heat. Failure to properly address this heat dissipation issue can significantly impact product performance. The current heat dissipation method typically involves embedding copper blocks within the FR4 packaging substrate. While this method has some effectiveness, the increasing density of circuitry within the packaging substrate and the proliferation of electronic components have led to an increase in heat generation, making this method inefficient. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a high-heat dissipation double-sided copper substrate and its manufacturing method, electronic equipment, and storage medium, which can improve heat dissipation capabilities and meet the needs of high-power, high-current electronic products.

[0004] On the one hand, a method for manufacturing a double-sided copper substrate with high heat dissipation according to an embodiment of the present invention includes the following steps:

[0005] Obtain a copper substrate; the copper substrate has a first surface and a second surface opposite to each other;

[0006] Laminating a prepreg and a first copper foil on the first surface of the copper substrate to form a first substrate;

[0007] forming a groove on the second surface of the copper substrate;

[0008] placing an RCC layer in the groove, and pressing the RCC layer and the first substrate by a pressing mechanism to form a second substrate;

[0009] Drilling the second substrate once to form a first through hole, and plugging the first through hole with resin;

[0010] Performing secondary drilling on the resin to form a second through hole, and metallizing the hole wall and surface of the second through hole;

[0011] A first blind hole is provided in the RCC layer, and a first circuit is provided on the surface of the RCC layer, so that the first circuit is connected to the copper substrate through the first blind hole;

[0012] A second blind hole is provided between the first copper foil and the copper substrate, and a second circuit is provided on the surface of the first copper foil, so that the second circuit is connected to the copper substrate through the second blind hole.

[0013] According to some embodiments of the present invention, the step of forming a groove on the second surface of the copper substrate includes:

[0014] Using a cleaning agent to remove grease and oxides from the copper substrate, and rinsing the copper substrate with deionized water;

[0015] Evenly coating the surface of the copper substrate with photoresist by spin coating;

[0016] exposing and developing the photoresist to form a window;

[0017] Immersing the copper substrate in an etching solution to etch the window to form the groove;

[0018] The photoresist is removed.

[0019] According to some embodiments of the present invention, the method further comprises:

[0020] Grooving the side of the second substrate provided with the first copper foil to form a through groove communicating with the copper substrate;

[0021] A heat dissipation copper block is arranged in the through groove.

[0022] According to some embodiments of the present invention, the method further comprises:

[0023] Disposing a solder resist layer on the surface of the second substrate;

[0024] Opening windows in the solder resist layer to form solder pads;

[0025] The pad is subjected to electro-gold treatment.

[0026] According to some embodiments of the present invention, the step of providing a second blind hole between the first copper foil and the copper substrate, providing a second circuit on the surface of the first copper foil, and conducting the second circuit with the copper substrate through the second blind hole includes:

[0027] etching the first copper foil to form a tooth-like rough profile on a surface of the first copper foil;

[0028] Adhering a first photosensitive dry film on the surface of the first copper foil, and exposing and developing the first photosensitive dry film;

[0029] Drilling the first copper foil to form a second blind hole communicating with the copper substrate;

[0030] removing the first photosensitive dry film, attaching a second photosensitive dry film to the surface of the first copper foil, and exposing and developing the second photosensitive dry film;

[0031] Performing electroplating on the second substrate to achieve filling of the second blind holes with electroplating, and forming a second circuit on the surface of the first copper foil, so that the second circuit is electrically connected to the copper substrate through the second blind holes;

[0032] The second photosensitive dry film is removed.

[0033] According to some embodiments of the present invention, the step of placing an RCC layer in the groove and laminating the RCC layer and the first substrate by a laminating mechanism to form the second substrate includes:

[0034] removing contaminants in the groove;

[0035] performing micro-etching on the surface of the groove;

[0036] placing the RCC layer in the groove;

[0037] The RCC layer and the first substrate are pressed together by the pressing mechanism to form a second substrate.

[0038] According to some embodiments of the present invention, the pressing mechanism includes a frame, a lower pressing mechanism provided on the surface of the frame, a lifting mechanism provided on the frame and located above the lower pressing mechanism, and a blanking device provided on one side of the lower pressing mechanism, the lifting mechanism is provided with a liftable upper pressing mechanism, a positioning groove is provided in the lower pressing mechanism, a jacking mechanism is provided at the bottom of the positioning groove, and both the upper pressing mechanism and the lower pressing mechanism are provided with a heating device; the step of pressing the RCC layer and the copper substrate by the pressing mechanism to form a second substrate includes:

[0039] placing the RCC layer and the first substrate in the positioning groove;

[0040] After the lifting mechanism drives the upper pressing mechanism to descend to a preset height, the upper pressing mechanism continues to descend until it contacts the lower pressing mechanism;

[0041] After the heating device preheats the upper pressing mechanism and the lower pressing mechanism to a preset temperature, the upper pressing mechanism and the lower pressing mechanism pressurize the RCC layer and the copper substrate to a preset pressure, and press the RCC layer and the first substrate to form a second substrate;

[0042] After pressing, the heating device gradually lowers the temperature. After the temperature is lowered, the upper pressing mechanism rises, and the lifting mechanism drives the upper pressing mechanism to reset.

[0043] The lifting mechanism pushes the second substrate to rise and move away from the lower pressing mechanism to rise, and the unloading device unloads the second substrate.

[0044] On the other hand, the high heat dissipation double-sided copper substrate according to an embodiment of the present invention is manufactured by the high heat dissipation double-sided copper substrate manufacturing method of the above-mentioned embodiment.

[0045] On the other hand, an electronic device according to an embodiment of the present invention includes:

[0046] a memory for storing program instructions;

[0047] The processor is used to call the program instructions stored in the memory and execute the above-mentioned method for manufacturing a high-heat dissipation double-sided copper substrate according to the obtained program instructions.

[0048] On the other hand, a storage medium according to an embodiment of the present invention stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the above-mentioned method for manufacturing a double-sided copper substrate with high heat dissipation.

[0049] The high-heat dissipation double-sided copper substrate and its manufacturing method, electronic device, and storage medium according to the embodiments of the present invention have at least the following beneficial effects: by adopting a copper substrate instead of a traditional FR4 copper-clad substrate, it has better heat dissipation performance, and the copper substrate is provided with a groove, and the RCC layer is placed in the groove, so that the surface of the RCC layer is flush with the surface of the copper substrate, which facilitates the copper substrate to dissipate heat from the RCC layer, so that the finally formed second substrate has good heat dissipation performance and meets the needs of high-power, high-current electronic products.

[0050] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0052] Figure 1 A flowchart of the steps of a method for manufacturing a double-sided copper substrate with high heat dissipation according to an embodiment of the present invention;

[0053] Figure 2 This is a schematic structural diagram of a copper substrate according to an embodiment of the present invention;

[0054] Figure 3is a structural schematic diagram of a first substrate according to an embodiment of the present invention;

[0055] Figure 4 This is a schematic structural diagram of a copper substrate after grooves are formed in an embodiment of the present invention;

[0056] Figure 5 This is a schematic diagram of the structure after an RCC layer is placed in a groove according to an embodiment of the present invention;

[0057] Figure 6 This is a structural diagram of an embodiment of the present invention after a heat dissipation copper block is provided on the second substrate;

[0058] Figure 7 Schematic diagram of the structure of the pressing mechanism according to an embodiment of the present invention;

[0059] Reference numerals:

[0060] Copper substrate 100, first surface 110, second surface 120, groove 130, prepreg 200, first copper foil 300, RCC layer 400, second substrate 500, heat dissipation copper block 600, pressing mechanism 700, frame 710, lower pressing mechanism 720, lifting mechanism 730, lifting rod 731, screw rod 732, driver 733, upper pressing mechanism 740, positioning groove 750, lifting mechanism 760, heating device 770. DETAILED DESCRIPTION

[0061] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. The step numbers in the following embodiments are provided only for the convenience of explanation and do not limit the order of the steps. The order of execution of the steps in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0062] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0063] The terms "first," "second," "third," and "fourth," etc., in the specification, claims, and accompanying drawings of the present invention are used to distinguish between different items, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0064] References to "embodiments" in this disclosure mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0065] With the development of the electronics industry, high-power, high-current electronic products are increasingly being used. This places increasing demands on the packaging substrates that serve as carriers for electronic components, with a particular emphasis on heat dissipation. Due to the high power and current draw of these electronic products, they generate significant heat. Failure to properly address this heat dissipation issue can significantly impact product performance. The current heat dissipation method typically involves embedding copper blocks within the FR4 packaging substrate. While this method has some effectiveness, the increasing density of circuitry within the packaging substrate and the proliferation of electronic components have led to an increase in heat generation, making this method inefficient.

[0066] To this end, an embodiment of the present invention provides a double-sided copper substrate with high heat dissipation, a manufacturing method thereof, an electronic device, and a storage medium. By adopting a copper substrate instead of a traditional FR4 copper-clad substrate, it has better heat dissipation performance, and the copper substrate is provided with a groove, and an RCC layer is placed in the groove, so that the surface of the RCC layer is flush with the surface of the copper substrate, which facilitates the copper substrate to dissipate heat from the RCC layer, so that the second substrate finally formed has good heat dissipation performance, meeting the needs of high-power, high-current electronic products.

[0067] The following describes in detail a high heat dissipation double-sided copper substrate and its manufacturing method, electronic equipment, and storage medium according to embodiments of the present invention in conjunction with the accompanying drawings.

[0068] On the one hand, if Figure 1 As shown, the method for manufacturing a double-sided copper substrate with high heat dissipation according to an embodiment of the present invention includes the following steps:

[0069] Step S100: obtaining a copper substrate 100;

[0070] Specifically, if Figure 2 As shown, the copper substrate 100 has a first surface 110 and a second surface 120 that are opposite to each other. When manufacturing a circuit board, the material is first cut and the copper substrate 100 is prepared according to the design dimensions. Compared to traditional FR4 copper-clad substrates, copper substrate 100 has better heat dissipation capabilities, significantly improving the heat dissipation of subsequent circuit boards.

[0071] Step S200: Laminating the prepreg 200 and the first copper foil 300 on the first surface 110 of the copper substrate 100;

[0072] Specifically, before lamination, the surfaces of the copper substrate 100 and the first copper foil 300 are pretreated. The pretreatment step includes cleaning and removing the oxide layer on the copper surface, for example, by sanding with sandpaper, or treating the surfaces of the copper substrate 100 and the first copper foil 300 with an acidic detergent such as dilute hydrochloric acid or sulfuric acid, so as to improve the subsequent lamination effect. After the pretreatment is completed, Figure 3 As shown, the copper substrate 100, the semi-cured sheet 200 and the first copper foil 300 are stacked and arranged in order, and then the copper substrate 100, the semi-cured sheet 200 and the first copper foil 300 are laminated by a laminating machine. Before laminating, set the appropriate temperature, pressure and time, then put the stacked materials into the laminating machine and start the laminating process. During the laminating process, the temperature gradually rises and the pressure also gradually increases. Both the heating rate and the laminating time need to be strictly controlled to avoid problems such as the wettability of the semi-cured sheet 200 becoming poor, the resin fluidity being too large or the laminate lacking glue. After reaching the set temperature, keep it warm for a period of time so that the semi-cured sheet 200 is fully melted and tightly fitted with the first copper foil 300. Then a cooling process is carried out to solidify the semi-cured sheet 200 and complete the bonding.

[0073] Step S300: forming a groove 130 on the second surface 120 of the copper substrate 100;

[0074] Specifically, if Figure 4 As shown, a groove 130 is formed in a predetermined area of ​​the second surface 120 of the copper substrate 100. In order to form the groove 130 on the copper substrate 100, step S300 specifically includes the following five steps:

[0075] Step S310: using a cleaning agent to remove grease and oxides from the copper substrate 100, and rinsing the copper substrate 100 with deionized water;

[0076] Step S320: evenly coating the surface of the copper substrate 100 with photoresist by spin coating;

[0077] Step S330: exposing and developing the photoresist to form a window;

[0078] Step S340: immersing the copper substrate 100 in an etching solution to etch the window to form a groove 130;

[0079] Step S350: removing the photoresist.

[0080] Particularly, first adopt cleaning agent (as acetone or isopropyl alcohol etc.), remove grease and the oxide compound of the second surface 120 of copper substrate 100, then rinse copper substrate 100 with deionized water, and carry out drying.Then, adopt spin coating, evenly coat photoresist on the surface of copper substrate 100, ensure that coating thickness is even.Then photoresist is exposed and developed, window is formed at the position to form groove 130, and the position that does not need to form groove 130 is then all protected by photoresist, then copper substrate 100 is immersed in etching solution (as ferric chloride or ammonium persulfate etc.), etching solution can dissolve the copper at window place, by controlling etching time to regulate the degree of depth of groove 130, the longer the time, the larger the degree of depth.After etching is completed, take out copper substrate 100 and rinse with deionized water, then use suitable solvent to remove remaining photoresist protective layer.

[0081] Step S400: placing the RCC layer 400 in the groove 130, and laminating the RCC layer 400 and the first substrate by the laminating mechanism 700 to form the second substrate 600;

[0082] like Figure 5As shown, after the RCC layer 400 is placed in the groove 130, the RCC layer 400 and the copper substrate 100 are pressed together by a pressing mechanism 700 so that the surface of the RCC layer 400 is flush with the surface of the copper substrate 100. It should be noted that the RCC layer 400 refers to resin-coated copper or resin-coated copper, which is a new type of printed circuit board (PCB) material. The RCC layer 400 is made by coating a layer of resin on the surface of a copper film. This layer of resin not only enhances the mechanical strength of the copper foil, but also improves its electrical properties and processing performance. The RCC layer 400 is suitable for the manufacture of high-density circuits (HDI boards), especially in situations where the ability to increase the production of high-density small holes and fine lines is required. The combination of the resin layer and the copper foil gives the RCC layer 400 excellent thermal conductivity, which helps dissipate heat and maintain the stability of the circuit board. Moreover, the RCC layer 400 has no glass fiber structure, which is easy to process and laser-drill, and the hole quality is stable, which helps improve the production accuracy and efficiency of the circuit board. Since the RCC layer 400 is arranged in the groove 130 and the surface of the RCC layer 400 is flush with the surface of the copper substrate 100, when circuits are subsequently made and components are placed on the surface of the RCC layer 400, the circuits / components can be directly connected to the surface of the copper substrate 100, and the high heat dissipation performance of the copper substrate 100 is utilized for heat dissipation, which is beneficial to improving the heat dissipation efficiency of the entire circuit board.

[0083] Step S500: drilling the second substrate 500 once to form a first through hole, and plugging the first through hole with resin;

[0084] Specifically, laser drilling or mechanical drilling is used to drill the second substrate 500 once to form an initial hole structure, i.e., a first through hole, on the second substrate 500. The aperture of the first through hole is usually larger to reserve space for subsequent resin filling. After the first through hole is formed, screen printing or vacuum plugging is used to fill the first through hole with resin to ensure that the resin fills the hole without voids or depressions. Then, the resin is pre-cured to prevent the resin from flowing and deforming, which is convenient for subsequent grinding. The resin is ground to ensure that the board surface is flat, and then the resin is cured at high temperature to ensure that the resin is completely hardened. Among them, the copper substrate 100 itself is a conductor. In order to avoid the phenomenon of short circuit between the upper and lower surfaces of the second substrate 500, it is necessary to fill the first through hole with resin, and the resin plays an insulating role.

[0085] Step S600: performing secondary drilling on the resin to form a second through hole, and metallizing the hole wall and surface of the second through hole;

[0086] Specifically, the resin is drilled a second time to form a second through hole in the resin. The second through hole is used as a conductive hole for the circuits on the upper and lower surfaces of the second substrate 500. In order to achieve the conductive function of the second through hole, the hole wall and surface of the second through hole need to be metallized, and chemical deposition can be used for metallization.

[0087] Step S700: a first blind hole is provided in the RCC layer 400, and a first circuit is provided on the surface of the RCC layer 400, so that the first circuit is electrically connected to the copper substrate 100 through the first blind hole;

[0088] Specifically, laser drilling can be used to drill holes through the RCC layer 400, reaching the surface of the copper substrate 100. An alkaline or acidic solution is then used to remove residual resin carbide within the hole, followed by micro-etching of the resin on the hole wall to enhance subsequent metallization adhesion. Subsequently, electroless copper deposition and electroplating are used to form the first blind via. After the first blind via is formed, exposure, development, and etching are performed to form the outer layer circuitry in the RCC layer 400. The first blind via serves as an interlayer interconnection channel.

[0089] Step S800 : providing a second blind hole between the first copper foil 300 and the copper substrate 100 , and providing a second circuit on the surface of the first copper foil 300 , so that the second circuit is connected to the copper substrate 100 through the second blind hole.

[0090] It should be noted that the method for making the second blind via and the second circuit is similar to the method for making the first blind via and the first circuit, and will not be described in detail here. In this way, the first circuit and the second circuit are made on the upper and lower surfaces of the second substrate 500, and the first circuit and the second circuit are connected through the second through hole.

[0091] According to the method for manufacturing a double-sided copper substrate with high heat dissipation in an embodiment of the present invention, a copper substrate 100 is used instead of a traditional FR4 copper-clad substrate to have better heat dissipation performance, and the copper substrate 100 is provided with a groove 130, and an RCC layer 400 is placed in the groove 130, so that the surface of the RCC layer 400 is flush with the surface of the copper substrate 100, which facilitates the copper substrate 100 to dissipate heat from the RCC layer 400, so that the finally formed second substrate 500 has good heat dissipation performance and meets the needs of high-power, high-current electronic products.

[0092] Furthermore, if Figure 6 As shown, in some embodiments of the present invention, the method for manufacturing a double-sided copper substrate with high heat dissipation further includes the following steps:

[0093] A groove is formed on the side of the second substrate 500 where the first copper foil 300 is provided, to form a through groove communicating with the copper substrate 100;

[0094] A heat dissipation copper block 600 is disposed in the through slot.

[0095] Specifically, a controlled depth groove method is adopted to groove one side of the second substrate 500 to form a through groove connected to the copper substrate 100, and then a heat dissipation copper block 600 is set in the through groove. The heat dissipation copper block 600 dissipates heat for the first copper foil 300, further improving the heat dissipation capacity of the second substrate 500.

[0096] Furthermore, in some embodiments of the present invention, the method for manufacturing a double-sided copper substrate with high heat dissipation further includes the following steps:

[0097] Disposing a solder resist layer on the surface of the second substrate 500;

[0098] Open windows in the solder mask layer to form pads;

[0099] Perform electro-gold treatment on the pads.

[0100] Specifically, the solder mask layer protects circuit components by preventing undesired areas from being accidentally soldered during the soldering process, potentially preventing short circuits. It also protects the copper layer from oxidation and corrosion, extending the lifespan of the circuit board. To create the solder mask layer, it can be applied by applying solder mask ink and UV curing it. After forming the solder mask layer, it is necessary to create windows in the layer by applying a film, exposing it, and developing it to expose the locations of the pads. To prevent oxidation on the pad surface, it is also necessary to electroplate gold onto the pad surface to protect it, reduce wear and damage during the soldering process, and extend the lifespan of the pad.

[0101] Furthermore, in some embodiments of the present invention, the above-mentioned step S800 of providing a second blind via between the first copper foil 300 and the copper substrate 100, providing a second circuit on the surface of the first copper foil 300, and conducting the second circuit with the copper substrate 100 through the second blind via includes the following six steps:

[0102] Step S810: etching the first copper foil 300 to form a tooth-like rough profile on the surface of the first copper foil 300;

[0103] Step S820: attaching a first photosensitive dry film to the surface of the first copper foil 300, and exposing and developing the first photosensitive dry film;

[0104] Step S830: drilling the first copper foil 300 to form a second blind via communicating with the copper substrate 100;

[0105] Step S840: removing the first photosensitive dry film, attaching a second photosensitive dry film to the surface of the first copper foil 300, and exposing and developing the second photosensitive dry film;

[0106] Step S850: electroplating the second substrate 500 to fill the second blind hole with electroplating, and forming a second circuit on the surface of the first copper foil 300, so that the second circuit is connected to the copper substrate 100 through the second blind hole;

[0107] Step S860: removing the second photosensitive dry film.

[0108] Specifically, the surface of the first copper foil 300 is etched to form a serrated rough profile. This rough profile improves the bonding strength between the dielectric layer, the first copper foil 300, and the subsequent second circuit. A first photosensitive dry film is then applied to the surface of the first copper foil 300, exposed and developed, and then laser drilled to form a second blind via connected to the copper substrate 100. After laser drilling, the first photosensitive dry film is retained, and the second blind via is plasma cleaned to remove any residual adhesive residue from the inner wall of the second blind via. The first photosensitive dry film protects areas other than the second blind via from attack, thereby preserving the rough profile of the first copper foil 300. After removing the first photosensitive dry film and applying a second photosensitive dry film to the surface of the first copper foil 300, the second photosensitive dry film is exposed and developed to expose the pattern of the second blind via and the second circuit, facilitating subsequent via-filling electroplating of the second blind via and electroplating of the circuit on the surface of the first copper foil 300. After the second circuit is fabricated, the second photosensitive dry film is removed, followed by the excess first metal seed layer. By first etching the first copper foil 300 and forming the first metal seed layer before laser drilling, etching of the first copper foil 300 can be effectively avoided, effectively preventing the bottom and sidewalls of the second blind via from being corroded, and ensuring the bonding strength between the first copper foil 300 and the second circuit.

[0109] Furthermore, in some embodiments of the present invention, the above-mentioned step S400 of placing the RCC layer 400 in the groove 130 and laminating the RCC layer 400 and the copper substrate 100 by the laminating mechanism 700 to form the second substrate 500 includes the following four steps:

[0110] Step S410: removing contaminants in the groove 130;

[0111] Step S420: micro-etching the surface of the groove 130;

[0112] Step S430: placing the RCC layer 400 in the groove 130;

[0113] Step S440 : pressing the RCC layer 400 and the copper substrate 100 together by a pressing mechanism to form a second substrate 500 .

[0114] First, the contaminants in the groove 130 are removed by cleaning to improve the pressing quality of the RCC layer 400 and the copper substrate 100. Then, the surface of the groove 130 is micro-etched to increase the roughness of the surface of the groove 130, thereby improving the bonding strength between the RCC layer 400 and the copper substrate 100. Finally, the RCC layer 400 and the copper substrate 100 are pressed together to ensure the pressing quality.

[0115] Furthermore, if Figure 7 As shown, in some embodiments of the present invention, the pressing mechanism 700 includes a frame 710, a lower pressing mechanism 720 arranged on the surface of the frame 710, and a lifting mechanism 730 arranged on the frame 710 and located above the lower pressing mechanism 720. The lifting mechanism 730 is provided with an upper pressing mechanism 740 that can be lifted and lowered. A positioning groove 750 is provided in the lower pressing mechanism 720, and a lifting mechanism 760 is provided at the bottom of the positioning groove 750. The upper pressing mechanism 740 and the lower pressing mechanism 720 are both provided with a heating device 770, and a blanking device (not shown) is provided on one side of the lower pressing mechanism 720. The above-mentioned step S400: the step of pressing the RCC layer 400 and the copper substrate 100 by the pressing mechanism 700 to form the second substrate 500 includes:

[0116] Place the RCC layer 400 and the first substrate in the positioning groove 750;

[0117] After the lifting mechanism 730 drives the upper pressing mechanism 740 to descend to a preset height, the upper pressing mechanism 740 continues to descend until it contacts the lower pressing mechanism 720;

[0118] After the heating device 770 preheats the upper pressing mechanism 740 and the lower pressing mechanism 720 to a preset temperature, the upper pressing mechanism 740 and the lower pressing mechanism 720 pressurize the RCC layer 400 and the copper substrate 100 to a preset pressure, and press the RCC layer 400 and the first substrate to form the second substrate 500;

[0119] After the heating device 770 gradually lowers the temperature, the upper pressing mechanism 740 rises, and the lifting mechanism 730 drives the upper pressing mechanism 740 to return to its original position;

[0120] The lifting mechanism 760 pushes the second substrate 500 away from the lower pressing mechanism 720 , and the unloading device unloads the second substrate 500 .

[0121] Specifically, in this example, the lifting mechanism 730 includes a lifting rod 731, a screw rod 732 and a driver 733. The lifting rod 731 is threadedly connected to the screw rod 732, and the driver 733 is used to drive the screw rod 732 to rotate, thereby driving the lifting rod 731 to rise or fall. When pressing, the lifting rod 731 remains different after descending a certain height, and the upper pressing mechanism 740 continues to descend until it contacts the lower pressing mechanism 720 for pressing. It should be noted that the upper pressing mechanism 740 is also provided with a telescopic gas rod for driving the upper pressing mechanism 740 to rise and fall. During pressing, the heating device 770 preheats the upper pressing mechanism 740 and the lower pressing mechanism 720 to a preset temperature so that the resin of the RCC layer 400 softens, and then applies high pressure to make the resin flow and fill the gap, and maintains a high temperature until the resin is completely cured. Subsequently, the temperature is slowly lowered to prevent internal stress. After the temperature drops to a certain level, the upper pressing mechanism 740 rises, and the lifting mechanism 730 drives the upper pressing mechanism 740 to reset. Then, the lifting mechanism 760 pushes the second substrate 500 away from the lower pressing mechanism 720, facilitating the unloading device to unload the second substrate 500. The unloading device can include a moving mechanism, a suction cup, and an unloading platform. When unloading, the moving mechanism drives the suction cup to move above the positioning groove, then drives the suction cup down to absorb the second substrate 500. The moving mechanism then drives the suction cup to move to the unloading platform for unloading.

[0122] On the other hand, an embodiment of the present invention further provides a double-sided copper substrate with high heat dissipation, which is manufactured by the method for manufacturing a double-sided copper substrate with high heat dissipation described in the embodiment of the above aspect.

[0123] According to an embodiment of the present invention, the high-heat dissipation double-sided copper substrate has better heat dissipation performance by adopting a copper substrate 100 instead of a traditional FR4 copper-clad substrate. The copper substrate 100 is provided with a groove 130, and the RCC layer 400 is placed in the groove 130, so that the surface of the RCC layer 400 is flush with the surface of the copper substrate 100, which facilitates the copper substrate 100 to dissipate heat from the RCC layer 400, so that the finally formed second substrate 500 has good heat dissipation performance and meets the needs of high-power and high-current electronic products.

[0124] It should be noted that the contents of the above method embodiments are all applicable to this embodiment. The functions specifically implemented by this embodiment are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0125] On the other hand, an embodiment of the present invention further provides an electronic device, including:

[0126] The processor may be implemented as a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0127] The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory and is called by the processor to execute the method for manufacturing a high-heat dissipation double-sided copper substrate in the embodiments of this application.

[0128] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned high-heat dissipation double-sided copper substrate is realized.

[0129] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory optionally includes a memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of the above-mentioned networks include but are not limited to the Internet, an intranet, a local area network, a mobile communication network and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are located in one place, or may be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0130] Those skilled in the art will appreciate that all or some of the steps and systems in the method disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include computer storage media (or non-transitory media) and communication media (or temporary media). As known to those skilled in the art, the term computer storage media is included in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data) and is volatile and non-volatile, removable, and non-removable. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory, or other memory technology, CD-ROM, digital versatile disks (DVD), or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage, or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, as is well known to those skilled in the art, communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0131] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above implementation. Those skilled in the art can also make various equivalent modifications or substitutions under the shared conditions that do not violate the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A method for manufacturing a double-sided copper substrate with high heat dissipation, characterized in that: The following steps are involved: Obtain a copper substrate; The copper substrate has a first surface and a second surface opposite to each other; Laminating a prepreg and a first copper foil on the first surface of the copper substrate to form a first substrate; forming a groove on the second surface of the copper substrate; placing an RCC layer in the groove, and pressing the RCC layer and the first substrate by a pressing mechanism to form a second substrate; Drilling the second substrate once to form a first through hole, and plugging the first through hole with resin; Performing secondary drilling on the resin to form a second through hole, and metallizing the hole wall and surface of the second through hole; A first blind hole is provided in the RCC layer, and a first circuit is provided on the surface of the RCC layer, so that the first circuit is connected to the copper substrate through the first blind hole; A second blind hole is provided between the first copper foil and the copper substrate, and a second circuit is provided on the surface of the first copper foil, so that the second circuit is connected to the copper substrate through the second blind hole.

2. The method for manufacturing a double-sided copper substrate with high heat dissipation according to claim 1, wherein: The step of forming a groove on the second surface of the copper substrate includes: Using a cleaning agent to remove grease and oxides from the copper substrate, and rinsing the copper substrate with deionized water; Evenly coating the surface of the copper substrate with photoresist by spin coating; exposing and developing the photoresist to form a window; Immersing the copper substrate in an etching solution to etch the window to form the groove; The photoresist is removed.

3. The method for manufacturing a double-sided copper substrate with high heat dissipation according to claim 1, wherein: The method further comprises: Grooving the side of the second substrate provided with the first copper foil to form a through groove communicating with the copper substrate; A heat dissipation copper block is arranged in the through groove.

4. The method for manufacturing a double-sided copper substrate with high heat dissipation according to claim 1, wherein: The method further comprises: Disposing a solder resist layer on the surface of the second substrate; Opening windows in the solder resist layer to form solder pads; The pad is subjected to electro-gold treatment.

5. The method for manufacturing a double-sided copper substrate with high heat dissipation according to claim 1, wherein: The step of providing a second blind hole between the first copper foil and the copper substrate, providing a second circuit on the surface of the first copper foil, and making the second circuit conductive with the copper substrate through the second blind hole includes: etching the first copper foil to form a tooth-like rough profile on a surface of the first copper foil; Adhering a first photosensitive dry film on the surface of the first copper foil, and exposing and developing the first photosensitive dry film; Drilling the first copper foil to form a second blind hole communicating with the copper substrate; removing the first photosensitive dry film, attaching a second photosensitive dry film to the surface of the first copper foil, and exposing and developing the second photosensitive dry film; Performing electroplating on the second substrate to achieve filling of the second blind holes with electroplating, and forming a second circuit on the surface of the first copper foil, so that the second circuit is electrically connected to the copper substrate through the second blind holes; The second photosensitive dry film is removed.

6. The method for manufacturing a double-sided copper substrate with high heat dissipation according to claim 1, wherein: The step of placing an RCC layer in the groove and pressing the RCC layer and the first substrate by a pressing mechanism to form a second substrate includes: removing contaminants in the groove; performing micro-etching on the surface of the groove; placing the RCC layer in the groove; The RCC layer and the first substrate are pressed together by the pressing mechanism to form a second substrate.

7. The method for manufacturing a double-sided copper substrate with high heat dissipation according to claim 6, characterized in that: The pressing mechanism includes a frame, a lower pressing mechanism arranged on the surface of the frame, a lifting mechanism arranged on the frame and located above the lower pressing mechanism, and a blanking device arranged on one side of the lower pressing mechanism, the lifting mechanism is provided with a liftable upper pressing mechanism, a positioning groove is provided in the lower pressing mechanism, a lifting mechanism is provided at the bottom of the positioning groove, and both the upper pressing mechanism and the lower pressing mechanism are provided with a heating device; the step of pressing the RCC layer and the copper substrate by the pressing mechanism to form a second substrate includes: placing the RCC layer and the first substrate in the positioning groove; After the lifting mechanism drives the upper pressing mechanism to descend to a preset height, the upper pressing mechanism continues to descend until it contacts the lower pressing mechanism; After the heating device preheats the upper pressing mechanism and the lower pressing mechanism to a preset temperature, the upper pressing mechanism and the lower pressing mechanism pressurize the RCC layer and the copper substrate to a preset pressure, and press the RCC layer and the first substrate to form a second substrate; After pressing, the heating device gradually lowers the temperature. After the temperature is lowered, the upper pressing mechanism rises, and the lifting mechanism drives the upper pressing mechanism to reset. The lifting mechanism pushes the second substrate to rise and move away from the lower pressing mechanism to rise, and the unloading device unloads the second substrate.

8. A double-sided copper substrate with high heat dissipation, characterized in that: The double-sided copper substrate is manufactured by the method for manufacturing a high heat dissipation double-sided copper substrate according to any one of claims 1 to 7.

9. An electronic device, characterized in that: include: a memory for storing program instructions; The processor is configured to call the program instructions stored in the memory and execute the method for manufacturing a high-heat dissipation double-sided copper substrate according to any one of claims 1 to 7 according to the obtained program instructions.

10. A storage medium, characterized in that: The storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the method for manufacturing a high-heat dissipation double-sided copper substrate according to any one of claims 1 to 7.

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