Inspection clamp

Abstract

The present invention relates to an inspection jig (10) for a semiconductor device provided with a plurality of pins (14), the inspection jig (10) being provided with: a contact part (16) in which a contact electrode (20) is formed at a valley part of a first sawtooth (18); and a pressing part (22) in which a second sawtooth (24) is formed, the contact part (16) being disposed such that the valley portion of the first sawtooth (18) corresponds to the plurality of pins (14) during inspection of the semiconductor device, and the pressing part (22) being disposed such that the second sawtooth (24) presses the plurality of pins (14) toward the valley portion of the first sawtooth (18). The pressing part (22) applies pressing force to the contact part (16) in the extending direction of the plurality of pins (14), so that the pressing part (22) is integrated with the contact part (16) and moves in the extending direction of the plurality of pins (14).

Description

Technical Field

[0001] The present disclosure relates to an inspection jig for a semiconductor device having a plurality of pins. Background Art

[0002] Some semiconductor devices have a plurality of pins. Since the pins are easily bent, the pins may be bent before the process of inspecting the semiconductor device due to various undesirable stresses during the assembly process.

[0003] Patent Document 1 discloses an inspection jig for correcting the bending of pins. In this inspection jig, the bending of the pins is corrected by guiding the pins into the recesses formed in the contact push rods.

[0004] Patent Document 1: Japanese Patent Laid-Open No. 6-018614

[0005] However, in the inspection jig disclosed in Patent Document 1, the effect of correcting the bending of the pins is limited. In the inspection jig of Patent Document 1, when the bending of the pins is large, the pins cannot be guided into the recesses formed in the contact push rods. Therefore, for pins with large bending, the bending must be corrected in advance with other jigs, and there is a problem that the time required for the inspection process increases. Summary of the Invention

[0006] The present disclosure has been made to solve the above problems, and an object thereof is to obtain an inspection jig that can shorten the time required for the inspection process even when the bending of the pins is large.

[0007] The inspection jig according to the present disclosure is an inspection jig for a semiconductor device having a plurality of pins, wherein the inspection jig includes: a contact portion formed with first saw teeth having the same pitch as the plurality of pins, and contact electrodes formed at the valleys of the first saw teeth; and a pressing portion formed with second saw teeth having the same pitch as the plurality of pins. During the inspection of the semiconductor device, the contact portion is arranged such that the valleys of the first saw teeth correspond to the plurality of pins, and the pressing portion is arranged such that the second saw teeth face the first saw teeth and the second saw teeth apply a pressing force toward the valleys of the first saw teeth to the plurality of pins, thereby electrically connecting the plurality of pins to the contact electrodes. The pressing portion applies a pressing force to the contact portion in the direction in which the plurality of pins extend, whereby the pressing portion and the contact portion are integrated and move in the direction in which the plurality of pins extend.

[0008] According to the present disclosure, an inspection jig can be obtained that can shorten the time required for the inspection process even when the bending of the pins is large. Brief Description of the Drawings

[0009] Figure 1 It is a side view of the inspection jig and the semiconductor device according to Embodiment 1.

[0010] Figure 2 It is a top view of the inspection jig and the semiconductor device according to Embodiment 1.

[0011] Figure 3 It is a diagram for explaining the process of inspecting a semiconductor device using the inspection jig according to Embodiment 1.

[0012] Figure 4 It is a diagram for explaining the process of inspecting a semiconductor device using the inspection jig according to Embodiment 1.

[0013] Figure 5 It is a diagram for explaining the process of inspecting a semiconductor device using the inspection jig according to Embodiment 1.

[0014] Figure 6 It is a side view of the inspection jig and the semiconductor device according to Embodiment 2.

[0015] Figure 7 It is a side view of the inspection jig and the semiconductor device according to Embodiment 3.

[0016] Figure 8 It is a diagram for explaining the process of inspecting a semiconductor device using the inspection jig according to Embodiment 3.

[0017] Figure 9 It is a side view of the inspection jig and the semiconductor device according to Embodiment 4. Detailed Embodiment

[0018] Embodiment 1

[0019] Figure 1 and Figure 2 Shows the inspection jig 10 according to Embodiment 1. Figure 1 and Figure 2 It is a side view and a top view of the inspection jig 10 and the semiconductor device 12 to be inspected. The inspection jig 10 includes a contact portion 16, a pressing portion 22, and a guide rail 26. The semiconductor device 12 includes a plurality of pins 14 arranged in a row so as to protrude outward.

[0020] First serrations 18 having the same pitch as the plurality of pins 14 are formed in the contact portion 16. Here, a serration refers to a structure in which peak portions and valley portions are regularly repeated. Contact electrodes 20 are formed in the valley portions of the first serrations 18. The contact electrodes 20 are electrically connected to an inspection device (not shown) and are used for applying a power supply voltage, transmitting and receiving electrical signals, etc.

[0021] Second serrations 24 having the same pitch as the plurality of pins 14 are formed in the pressing portion 22. A spring 28 is installed in the pressing portion 22, and by the contracting force of the spring 28, in the direction in which the plurality of pins 14 extend (Figure 2 Apply a force in the right direction).

[0022] The contact portion 16 is disposed above the guide rail 26. The contact portion 16 can move along the guide rail 26 in the direction in which the plurality of pins 14 extend.

[0023] Here, the inspection of the semiconductor device will be described. During the inspection of the semiconductor device, first, as Figure 3 shown, the contact portion 16 is arranged such that the valleys of the first serrations 18 correspond to the plurality of pins 14. Here, the valleys of the first serrations 18 corresponding to the plurality of pins 14 means that the direction in which the first serrations 18 are arranged ( Figure 3 left - right direction) is perpendicular to the direction in which the plurality of pins 14 extend ( Figure 3 direction from the back side of the paper surface toward the front), and the plurality of pins 14 are in contact with or near the contact electrodes 20 formed in the valleys of the first serrations 18. At this time, the contact portion 16 is preferably arranged near the roots of the plurality of pins 14 where the bending is small. However, as long as the valleys of the first serrations 18 can correspond to the plurality of pins 14, it is not limited to the vicinity of the roots.

[0024] Next, as Figure 4 shown, the pressing portion 22 is arranged such that the second serrations 24 face the first serrations 18 and the valleys of the second serrations 24 apply a pressing force toward the valleys of the first serrations 18 to the plurality of pins 14. By arranging in this way, the plurality of pins 14 are electrically connected to the contact electrodes 20. At this time, a part of the pressing portion 22 is Figure 4 hidden inside the contact portion 16 on the paper surface. Figure 2 This is a view of observing this situation from above. As Figure 2 shown, the pressing portion 22 is arranged at a position closer to the roots of the plurality of pins 14 than the contact portion 16.

[0025] Next, as Figure 5 shown, by the contraction force of the spring 28, the pressing portion 22 is moved in the direction in which the plurality of pins 14 extend. At this time, the peaks of the second serrations 24 apply a pressing force to the peaks of the first serrations 18 in the direction in which the plurality of pins 14 extend. Thereby, the pressing portion 22 and the contact portion 16 are integrated and move along the guide rail 26 in the direction in which the plurality of pins 14 extend. By this movement, the bending of the plurality of pins 14 is corrected. Thereafter, the semiconductor device is inspected via the contact electrodes 20 electrically connected to the inspection device. In addition, a stopper may be provided on the guide rail 26 to stop the contact portion 16 by the stopper.

[0026] As described above, according to this embodiment, in a state where the valleys of the first serrations 18 correspond to the plurality of pins 14 and pressing is applied to the plurality of pins 14 through the valleys of the second serrations 24, the contact portion 16 and the pressing portion 22 are moved in the direction in which the plurality of pins 14 extend. Therefore, even when the bending of the plurality of pins 14 is large, the bending can be corrected, and the inspection can be immediately performed after the correction. Therefore, the time required for the inspection process can be shortened.

[0027] In addition, the pressing portion 22 may be moved by a force other than a spring. For example, an electric motor or a hydraulic pressure may be used as a power source to move the pressing portion 22, or it may be moved by the hand of an inspector.

[0028] Embodiment 2

[0029] In Embodiment 2, different from Embodiment 1, as Figure 6 shown, the cross-sectional shape of the plurality of pins 44 is a rectangle having sides parallel to the direction in which the plurality of pins 44 are arranged ( Figure 6 the left-right direction), and the valleys of the first serrations 48 and the second serrations 54 have a planar shape. Here, the rectangle includes a square. In addition, the planar shape refers to the shape of a plane perpendicular to the direction in which the teeth of the serrations protrude ( Figure 6 the up-down direction).

[0030] In this embodiment, since the cross-sections of the plurality of pins 44 are rectangular and the valleys of the first serrations 48 and the second serrations 54 have a planar shape, the electrical connection between the plurality of pins 44 and the contact electrodes 50 becomes good, and in addition, the pressing applied by the pressing portion 52 to the plurality of pins 44 becomes uniform.

[0031] Embodiment 3

[0032] In Embodiment 3, different from Embodiment 1, as Figure 7 shown, a guide pin 90 is formed at the peak of the first serration 78, and a guide hole 92 is formed at the valley of the second serration 84. When pressing is applied to the plurality of pins 14 during inspection, it is the peak of the second serration 84 that applies the pressing to the plurality of pins 14. In addition, when the peak of the second serration 84 applies pressing to the plurality of pins 14, the guide pin 90 is inserted into the guide hole 92.

[0033] As Figure 8 shown, when viewed from above, the first serration 78 of the contact portion 76 and the second serration 84 of the pressing portion 82 overlap in the direction in which the plurality of pins 14 extend. In Figure 8 this case, the contact portion 76 is hidden under the pressing portion 82.

[0034] During inspection, the guide pin 90 applies pressing to the side surface of the guide hole 92, so that the pressing portion 82 and the contact portion 76 are integrated and move in the direction in which the plurality of pins 14 extend.

[0035] In this embodiment, when the peak portion of the second serration 84 presses against the plurality of pins 14, the guide pin 90 is inserted into the guide hole 92, thereby fixing the contact portion 76 and the pressing portion 82. Therefore, when the contact portion 76 and the pressing portion 82 move integrally, they can move stably.

[0036] Embodiment 4

[0037] In Embodiment 4, different from Embodiment 3, there are no guide pins and guide holes. As Figure 9 shown, in the pressing portion 112, when viewed from the direction in which the plurality of pins 14 extend ( Figure 9 near the plane of the paper), a covering portion 124 that covers the valley portion of the second serration 114 is formed inside the second serration 114. During inspection, the covering portion 124 presses against the peak portion of the first serration 108, so that the pressing portion 112 and the contact portion 16 become integral and move in the direction in which the plurality of pins 14 extend.

[0038] In this embodiment, the covering portion 124 presses against the peak portion of the first serration 108 and moves, so that it can move stably.

[0039] Description of Reference Numerals

[0040] 10, 40, 70, 100... inspection jigs; 12... semiconductor device; 14, 44... plurality of pins; 16, 46, 76... contact portions; 18, 48, 78, 108... first serrations; 20, 50, 80... contact electrodes; 22, 52, 82, 112... pressing portions; 24, 54, 84, 114... second serrations; 90... guide pin; 92... guide hole; 124... covering portion.

Claims

1. An inspection jig, which is an inspection jig for a semiconductor device having a plurality of pins, wherein, the inspection jig includes: a contact portion formed with first sawteeth having a pitch equal to that of the plurality of pins, and contact electrodes are formed in the valleys of the first sawteeth; and a pressing portion formed with second sawteeth having a pitch equal to that of the plurality of pins, when inspecting the semiconductor device, the contact portion is arranged such that the valleys of the first sawteeth correspond to the plurality of pins, the pressing portion is arranged such that the second sawteeth face the first sawteeth and the second sawteeth apply a pressing force towards the valleys of the first sawteeth to the plurality of pins, thereby electrically connecting the plurality of pins to the contact electrodes, the pressing portion applies a pressing force to the contact portion in the direction in which the plurality of pins extend, whereby the pressing portion and the contact portion are integrated and move in the direction in which the plurality of pins extend.

2. The inspection jig according to claim 1, wherein, when inspecting the semiconductor device, the valleys of the second sawteeth apply a pressing force to the plurality of pins, the peaks of the second sawteeth apply a pressing force to the peaks of the first sawteeth, whereby the pressing portion and the contact portion are integrated and move in the direction in which the plurality of pins extend.

3. The inspection jig according to claim 2, wherein, the cross-sectional shape of the plurality of pins is a rectangle having sides parallel to the direction in which the plurality of pins are arranged, the valleys of the first sawteeth and the second sawteeth have a flat shape.

4. The inspection jig according to claim 1, wherein, guide pins are formed at the peaks of the first sawteeth, guide holes are formed in the valleys of the second sawteeth, when inspecting the semiconductor device, the peaks of the second sawteeth apply a pressing force to the plurality of pins, when the peaks of the second sawteeth apply a pressing force to the plurality of pins, the guide pins are inserted into the guide holes, the guide pins apply a pressing force to the sides of the guide holes, whereby the pressing portion and the contact portion are integrated and move in the direction in which the plurality of pins extend.

5. The inspection jig according to claim 1, wherein, a covering portion covering the valleys of the second sawteeth is formed on the pressing portion, when inspecting the semiconductor device, the peaks of the second sawteeth apply a pressing force to the plurality of pins, the covering portion applies a pressing force to the peaks of the first sawteeth, whereby the pressing portion and the contact portion are integrated and move in the direction in which the plurality of pins extend.

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