Electronic component

Abstract

The technical problem of the present invention is to improve the utilization efficiency of a conductor layer in an electronic component having a structure in which the conductor layer including an inductor and a resin layer are alternately laminated. This electronic component (1) is provided with conductor layers (M1-M4) and resin layers (21-23), which are alternately laminated. The conductor layer (M2) includes a conductor pattern (63), and the conductor layer (M3) includes a conductor pattern (80). The conductor pattern (63) includes a support portion (63A) overlapping the terminal electrode (13), and coil portions (63B, 63C) connected to the support portion (63A) without overlapping the terminal electrode (13). The conductor pattern (80) is provided with: a support section (83A) that overlaps the terminal electrode (13) and is connected to the terminal electrode (13) via a through-hole (93) provided in the resin layer (23); and a coil section (83B) that is connected to the support section (83A) without overlapping the terminal electrode (13). The coil sections (63B, 63C) are connected via a support section (63A), and the entire surface of the support section (63A) is covered by a resin layer (22).

Description

Technical Field

[0001] The present disclosure relates to an electronic component, and more particularly to an electronic component having an inductor. Background Art

[0002] In Patent Document 1, there is disclosed an electronic component in which a conductor layer including an inductor and a resin layer are alternately laminated, and the uppermost conductor layer forms a terminal electrode. In each resin layer, through holes are provided at positions overlapping the terminal electrode, whereby all the conductor patterns overlapping the terminal electrode are short-circuited.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-094391 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] However, if all the conductor patterns overlapping the terminal electrode are short-circuited, the utilization efficiency of each conductor layer is reduced.

[0008] In the present disclosure, a technique for improving the utilization efficiency of a conductor layer in an electronic component having a structure in which a conductor layer including an inductor and a resin layer are alternately laminated will be described.

[0009] Means for Solving the Problems

[0010] An electronic component according to an aspect of the present disclosure includes: a first conductor layer; a first resin layer that buries the first conductor layer; a second conductor layer formed on an upper surface of the first resin layer or on an upper surface of another resin layer covering the first resin layer; a second resin layer that covers the upper surface of the first resin layer so as to bury the second conductor layer; and a terminal electrode formed on an upper surface of the second resin layer. The first conductor layer includes a first conductor pattern, the second conductor layer includes a second conductor pattern, the first conductor pattern includes: a first support portion at least a part of which overlaps the terminal electrode, and a first coil portion and a second coil portion that do not overlap the terminal electrode and are connected to the first support portion, the second conductor pattern includes: a second support portion that overlaps the terminal electrode and is connected to the terminal electrode via a through hole provided in the second resin layer; and a third coil portion that does not overlap the terminal electrode and is connected to the second support portion. The first coil portion and the second coil portion are electrically connected via the first support portion, and the entire surface of the first support portion is covered with the first resin layer.

[0011] Advantages of the Invention

[0012] According to the present disclosure, a technique for improving the utilization efficiency of a conductor layer in an electronic component having a structure in which a conductor layer including an inductor and a resin layer are alternately laminated is provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 FIG. 1 is a schematic perspective view showing the appearance of an electronic component 1 according to an embodiment of the present disclosure.

[0014] Figure 2 FIG. 2 is a schematic exploded perspective view of the electronic component 1.

[0015] Figure 3 FIG. 3 is a schematic top view showing the pattern shape of the conductor layer M1.

[0016] Figure 4 FIG. 4 is a schematic top view showing the pattern shape of the conductor layer MM.

[0017] Figure 5 FIG. 5 is a schematic top view showing the position of the through holes provided in the resin layer 21.

[0018] Figure 6 FIG. 6 is a schematic top view showing the pattern shape of the conductor layer M2.

[0019] Figure 7 FIG. 7 is a schematic top view showing the position of the through holes provided in the resin layer 22.

[0020] Figure 8 FIG. 8 is a schematic top view showing the pattern shape of the conductor layer M3.

[0021] Figure 9 FIG. 9 is a schematic top view showing the position of the through holes provided in the resin layer 23.

[0022] Figure 10 FIG. 10 is a schematic top view showing the pattern shape of the conductor layer M4.

[0023] Figure 11 FIG. 11 is a schematic partial cross-sectional view of the electronic component 1. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the drawings.

[0025] Figure 1 FIG. 1 is a schematic perspective view showing the appearance of an electronic component 1 according to an embodiment of the present disclosure.

[0026] The electronic component 1 according to the present embodiment is a surface-mount type LC filter, as Figure 1As shown, it includes a support substrate 20, a plurality of resin layers 21 to 23 laminated on the surface of the support substrate 20, and terminal electrodes 11 to 14 formed on the mounting surface. As the material of the support substrate 20, there is no particular limitation as long as it is chemically stable / thermally stable, generates little stress, and can maintain the smoothness of the surface. Single crystal silicon, alumina, sapphire, aluminum nitride, MgO single crystal, SrTiO 3 single crystal, surface silicon oxide, glass, quartz, ferrite, etc. can be used.

[0027] Figure 2 is a schematic exploded perspective view of the electronic component 1.

[0028] As Figure 2 shown, on the support substrate 20, there are conductor layers M1, MM, M2, M3, M4 made of Cu or the like. Among them, the conductor layer M1 is provided on a planarization layer 24 covering the surface of the support substrate 20 and is embedded in the resin layer 21. As the planarization layer 24, alumina, silicon oxide, etc. can be used. The conductor layer M2 is provided on the upper surface of the resin layer 21 and is embedded in the resin layer 22. The conductor layer M3 is provided on the upper surface of the resin layer 22 and is embedded in the resin layer 23. The conductor layer M4 is composed of the terminal electrodes 11 to 14 provided on the upper surface of the resin layer 23. In addition, the conductor layer MM is provided on the upper surface of the conductor layer M1 via a capacitor insulating film (not shown) and is embedded in the resin layer 21.

[0029] As Figure 3 shown, the conductor layer M1 includes a plurality of conductor patterns 31 to 37. Among them, the conductor patterns 31 to 34 overlap with the terminal electrodes 11 to 14 respectively in a top view. Figure 3 The regions 11a to 14a shown by the dashed lines in Figure 6 and Figure 8 described later are the regions that overlap with the terminal electrodes 11 to 14 respectively in a top view. The same applies to

[0030] The conductor pattern 33 is composed of a support portion 33A that at least partially overlaps with the terminal electrode 13, and coil portions 33B and 33C that do not overlap with the terminal electrode 13. The coil portions 33B and 33C are connected to different positions of the support portion 33A, whereby the coil portions 33B and 33C are connected via the support portion 33A. Similarly, the conductor pattern 34 is composed of a support portion 34A that at least partially overlaps with the terminal electrode 14, and coil portions 34B and 34C that do not overlap with the terminal electrode 14. The coil portions 34B and 34C are connected to different positions of the support portion 34A, whereby the coil portions 34B and 34C are connected via the support portion 34A. In addition, the configuration and shape of the portion connecting the support portion 33A to the coil portions 33B and 33C are not particularly limited, and it may be formed such that at least a part thereof overlaps with the terminal electrode 13 in a top view, or it may be formed at a position that does not overlap with the terminal electrode 13. The same applies to the support portion 34A.

[0031] As Figure 4 shown, the conductor layer MM includes a plurality of conductor patterns 43 to 46. The conductor patterns 43 and 45 are provided via a capacitive insulating film on the conductor pattern 33 located in the conductor layer M1. Similarly, the conductor patterns 44 and 46 are provided via a capacitive insulating film on the conductor pattern 34 located in the conductor layer M1. Thus, the conductor patterns 43 to 46 function as the upper electrodes of the capacitor, and a part of the conductor patterns 33 and 34 functions as the lower electrodes of the capacitor. Here, the conductor pattern 43 overlaps with a part of the support portion 33A and a part of the coil portion 33B of the conductor pattern 33. Similarly, the conductor pattern 44 overlaps with a part of the support portion 34A and a part of the coil portion 34B of the conductor pattern 34. That is, the conductor patterns 43 and 44 at least partially overlap with the terminal electrodes 13 and 14, respectively, in a top view.

[0032] As Figure 5 shown, in the resin layer 21, a plurality of through holes 51 to 58 are provided. Among them, the through holes 51 and 52 expose the conductor pattern 33 located in the conductor layer M1, the through holes 57 and 58 expose the conductor pattern 34 located in the conductor layer M1, and the through holes 53 to 56 expose the conductor patterns 43 to 46 located in the conductor layer MM, respectively. Here, the through holes 51 and 52 expose the coil portions 33B and 33C of the conductor pattern 33, respectively, and the through holes 57 and 58 expose the coil portions 34B and 34C of the conductor pattern 34, respectively. In addition, the through hole 53 is disposed at a position overlapping with the coil portion 33B of the conductor pattern 33, and the through hole 54 is disposed at a position overlapping with the coil portion 34B of the conductor pattern 34. In the resin layer 21, through holes are not provided at positions overlapping with the support portions 31A to 34A, and the entire surface of the support portions 31A to 34A is covered by the resin layer 21.

[0033] As Figure 6As shown, the conductor layer M2 includes a plurality of conductor patterns 61 to 67. Among them, the conductor patterns 61 to 64 respectively overlap with the terminal electrodes 11 to 14 in a top view. The conductor pattern 61 is composed of a support portion 61A that at least partially overlaps with the terminal electrode 11 and coil portions 61B and 61C that do not overlap with the terminal electrode 11. The conductor pattern 62 is composed of a support portion 62A that at least partially overlaps with the terminal electrode 12 and coil portions 62B and 62C that do not overlap with the terminal electrode 12. The conductor pattern 63 is composed of a support portion 63A that at least partially overlaps with the terminal electrode 13 and coil portions 63B and 63C that do not overlap with the terminal electrode 13. The conductor pattern 64 is composed of a support portion 64A that at least partially overlaps with the terminal electrode 14 and coil portions 64B and 64C that do not overlap with the terminal electrode 14.

[0034] The coil portions 61B and 61C are connected to different positions of the support portion 61A, whereby the coil portions 61B and 61C are connected via the support portion 61A. The coil portions 62B and 62C are connected to different positions of the support portion 62A, whereby the coil portions 62B and 62C are connected via the support portion 62A. The coil portions 63B and 63C are connected to different positions of the support portion 63A, whereby the coil portions 63B and 63C are connected via the support portion 63A. The coil portions 64B and 64C are connected to different positions of the support portion 64A, whereby the coil portions 64B and 64C are connected via the support portion 64A. In addition, the configuration and shape of the portions connecting the support portion 61A to the coil portions 61B and 61C are not particularly limited, and may be formed such that at least a part thereof overlaps with the terminal electrode 11 in a top view, or may be formed at a position that does not overlap with the terminal electrode 11. The same applies to the support portions 62A, 63A, and 64A.

[0035] The coil portion 61B is connected to the coil portion 33B of the conductor pattern 33 located in the conductor layer M1 via a through hole 51 provided in the resin layer 21. The coil portion 62B is connected to the coil portion 34B of the conductor pattern 34 located in the conductor layer M1 via a through hole 57 provided in the resin layer 21. The coil portion 63B is connected to the coil portion 33C of the conductor pattern 33 located in the conductor layer M1 via a through hole 52 provided in the resin layer 21. The coil portion 64B is connected to the coil portion 34C of the conductor pattern 34 located in the conductor layer M1 via a through hole 58 provided in the resin layer 21. The conductor patterns 65 and 66 are respectively connected to the conductor patterns 45 and 46 located in the conductor layer MM via through holes 55 and 56 provided in the resin layer 21. The conductor pattern 67 is connected to the conductor patterns 43 and 44 located in the conductor layer MM via through holes 53 and 54 provided in the resin layer 21.

[0036] As Figure 7As shown, in the resin layer 22, a plurality of through holes 71 to 77 are provided. These through holes 71 to 77 expose the conductor patterns 61 to 67 located in the conductor layer M2. Here, the through hole 71 is disposed at a position overlapping with the coil portion 61C of the conductor pattern 61, the through hole 72 is disposed at a position overlapping with the coil portion 62C of the conductor pattern 62, the through hole 73 is disposed at a position overlapping with the coil portion 63C of the conductor pattern 63, and the through hole 74 is disposed at a position overlapping with the coil portion 64C of the conductor pattern 64. In the resin layer 22, through holes are not provided at positions overlapping with the support portions 61A to 64A, and the entire surfaces of the support portions 61A to 64A are covered with the resin layer 22.

[0037] As Figure 8 shown, the conductor layer M3 includes a plurality of conductor patterns 80 to 82. Among them, the conductor patterns 81 and 82 overlap with the terminal electrodes 11 and 12, respectively, in a top view, and the conductor pattern 83 overlaps with the terminal electrodes 13 and 14 in a top view. The conductor pattern 81 is composed of a support portion 81A that at least partially overlaps with the terminal electrode 11 and coil portions 81B and 81C that do not overlap with the terminal electrode 11. The conductor pattern 82 is composed of a support portion 82A that at least partially overlaps with the terminal electrode 12 and coil portions 82B and 82C that do not overlap with the terminal electrode 12. The conductor pattern 80 is composed of a support portion 83A that at least partially overlaps with the terminal electrode 13, a support portion 84A that at least partially overlaps with the terminal electrode 14, and coil portions 83B, 83C, and 80C that do not overlap with the terminal electrodes 13 and 14.

[0038] The coil portions 81B and 81C are connected to different positions of the support portion 81A, whereby the coil portions 81B and 81C are connected via the support portion 81A. The coil portions 82B and 82C are connected to different positions of the support portion 82A, whereby the coil portions 82B and 82C are connected via the support portion 82A. The coil portions 83B and 80C are connected to different positions of the support portion 83A, whereby the coil portions 83B and 80C are connected via the support portion 83A. The coil portions 84B and 80C are connected to different positions of the support portion 84A, whereby the coil portions 84B and 80C are connected via the support portion 84A. In addition, the configuration and shape of the portions connecting the support portion 81A to the coil portions 81B and 81C are not particularly limited, and at least a part thereof may overlap with the terminal electrode 11 in a top view, or may be formed at a position not overlapping with the terminal electrode 11. The same applies to the support portions 82A, 83A, and 84A.

[0039] The coil portion 81B is connected to the coil portion 61C of the conductor pattern 61 located in the conductor layer M2 via the through-hole 71 provided in the resin layer 22. The coil portion 81C is connected to the conductor pattern 65 located in the conductor layer M2 via the through-hole 75 provided in the resin layer 22. The coil portion 82B is connected to the coil portion 62C of the conductor pattern 62 located in the conductor layer M2 via the through-hole 72 provided in the resin layer 22. The coil portion 82C is connected to the conductor pattern 66 located in the conductor layer M2 via the through-hole 76 provided in the resin layer 22. The coil portion 83B is connected to the coil portion 63C of the conductor pattern 63 located in the conductor layer M2 via the through-hole 73 provided in the resin layer 22. The coil portion 84B is connected to the coil portion 64C of the conductor pattern 64 located in the conductor layer M2 via the through-hole 74 provided in the resin layer 22. The coil portion 80C is connected to the conductor pattern 67 located in the conductor layer M2 via the through-hole 77 provided in the resin layer 22.

[0040] As Figure 9 shown, in the resin layer 23, a plurality of through-holes 91 to 94 are provided. These through-holes 91 to 94 expose the support portions 81A to 84A located in the conductor layer M3, respectively. Therefore, the through-holes 91 to 94 overlap with the terminal electrodes 11 to 14, respectively.

[0041] As Figure 10 shown, the conductor layer M4 includes a plurality of terminal electrodes 11 to 14. These terminal electrodes 11 to 14 are connected to the support portions 81A to 84A located in the conductor layer M3 via the through-holes 91 to 94, respectively.

[0042] With the above structure, an inductor composed of the coil portion 81B and the conductor pattern 61 and a capacitor with the conductor pattern 45 as the upper electrode are connected in parallel between the terminal electrode 11 and the conductor pattern 33. Similarly, an inductor composed of the coil portion 82B and the conductor pattern 62 and a capacitor with the conductor pattern 46 as the upper electrode are connected in parallel between the terminal electrode 12 and the conductor pattern 34. In addition, an inductor composed of the coil portion 83B and the conductor pattern 63 and a capacitor with the conductor pattern 43 as the upper electrode are connected in parallel between the terminal electrode 13 and the conductor pattern 33. Similarly, an inductor composed of the coil portion 84B and the conductor pattern 64 and a capacitor with the conductor pattern 44 as the upper electrode are connected in parallel between the terminal electrode 14 and the conductor pattern 34. And the conductor patterns 33 and 34 themselves also function as inductors. Thus, an LC filter is formed with the terminal electrodes 11 and 12 as input / output terminals and the terminal electrodes 13 and 14 as ground terminals.

[0043] Figure 11 is a schematic cross-sectional view of a part of the electronic component 1.

[0044] As Figure 11As shown, directly below the terminal electrode 13, there are a conductor pattern 80 in the conductor layer M3, a conductor pattern 63 in the conductor layer M2, and a conductor pattern 33 in the conductor layer M1. The terminal electrode 13 is connected to the support portion 83A of the conductor pattern 80 via a through hole 93 provided in the resin layer 23. In this way, the terminal electrode 13 is connected to the support portion 83A of the conductor pattern 80 directly below via the through hole 93, so the bonding strength is improved.

[0045] In contrast, no through hole connecting the support portion 83A of the conductor pattern 80 and the support portion 63A of the conductor pattern 63 is provided in the resin layer 22. Similarly, no through hole connecting the support portion 63A of the conductor pattern 63 and the support portion 33A of the conductor pattern 33 is provided in the resin layer 21. As a result, the stress applied to the electronic component 1 via the terminal electrode 13 is absorbed by the resin layers 21 and 22, so it is not easy to damage the underlying conductor layer. Therefore, even when a part of the conductor pattern 43, which is the upper electrode of the capacitor, is arranged via the capacitive insulating film 25 at a position overlapping with the support portion 33A of the conductor pattern 33, it is not easy to damage the capacitor, so the capacitance variation caused by damage can be suppressed. In addition, the area where the upper electrode of the capacitor can be arranged is enlarged, so the design freedom is improved.

[0046] Moreover, the coil portions 63B and 63C in the conductor layer M2 are connected to each other via the support portion 63A, so the support portion 63A functions as part of the coil pattern. Similarly, the coil portions 33B and 33C in the conductor layer M1 are connected to each other via the support portion 33A, so the support portion 33A functions as part of the coil pattern. That is, in the conductor layers M1 and M2, a part of the coil pattern is arranged at a position overlapping with the terminal electrode 13, so the chip size can be suppressed and sufficient inductance can be obtained.

[0047] In addition, the support portions 63A and 33A overlap with most of the terminal electrode 13, so the flatness of the base of the terminal electrode 13 can also be ensured.

[0048] The conductor patterns directly below the terminal electrode 13 have been described above, but the same applies to the conductor patterns directly below the other terminal electrodes 11, 12, and 14.

[0049] In this way, according to the electronic component 1 of the present embodiment, for the conductor pattern in the conductor layer M3, it is connected to the terminal electrodes 11 to 14 directly above via through holes. On the other hand, the front surfaces of the regions of the conductor patterns in the conductor layers M1 and M2 that overlap with the terminal electrodes 11 to 14 are covered with resin layers, so the stress applied to the electronic component 1 via the terminal electrodes 11 to 14 can be alleviated, the chip size can be suppressed, and a larger inductance can be obtained.

[0050] As described above, embodiments of the technology related to the present disclosure have been described. However, the technology related to the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof, and these are of course included within the scope of the present disclosure.

[0051] For example, when viewed from above the terminal electrode side, the support portions 33A, 63A, 83A may completely overlap the terminal electrode 13, or at least a part thereof may not overlap. Similarly, when viewed from above the terminal electrode side, the support portions 34A, 64A, 84A may completely overlap the terminal electrode 14, or at least a part thereof may not overlap. When viewed from above the terminal electrode side, the support portions 61A, 81A may completely overlap the terminal electrode 11, or at least a part thereof may not overlap. When viewed from above the terminal electrode side, the support portions 62A, 82A may completely overlap the terminal electrode 12, or at least a part thereof may not overlap.

[0052] The technology according to the present disclosure includes, but is not limited to, the following structural examples.

[0053] An electronic component according to one aspect of the present disclosure includes: a first conductor layer; a first resin layer that embeds the first conductor layer; a second conductor layer formed on an upper surface of the first resin layer or an upper surface of another resin layer covering the first resin layer; a second resin layer that covers the upper surface of the first resin layer so as to embed the second conductor layer; and a terminal electrode formed on the upper surface of the second resin layer. The first conductor layer includes a first conductor pattern, the second conductor layer includes a second conductor pattern, the first conductor pattern includes: a first support portion that at least partially overlaps the terminal electrode, and a first coil portion and a second coil portion that do not overlap the terminal electrode and are connected to the first support portion. The second conductor pattern includes: a second support portion that overlaps the terminal electrode and is connected to the terminal electrode via a through hole provided in the second resin layer; and a third coil portion that does not overlap the terminal electrode and is connected to the second support portion. The first coil portion and the second coil portion are electrically connected via the first support portion, and the entire surface of the first support portion is covered by the first resin layer. Thereby, the stress applied to the first conductor layer via the terminal electrode is alleviated, and the utilization efficiency of the first conductor layer is improved.

[0054] Alternatively, the above-described electronic component further includes: a third conductor layer; and a third resin layer that buries the third conductor layer. The first conductor layer is formed on the upper surface of the third resin layer. The third conductor layer includes a third conductor pattern, and the third conductor pattern includes: a third support portion that at least partially overlaps with the terminal electrode, and a fourth coil portion and a fifth coil portion that do not overlap with the terminal electrode and are connected to the third support portion. The fourth coil portion and the fifth coil portion are electrically connected via the third support portion, and the entire surface of the third support portion is covered by the third resin layer. Thus, the stress applied to the first and third conductor layers via the terminal electrode is alleviated, and the utilization efficiency of the first and third conductor layers is improved.

[0055] Alternatively, the above-described electronic component further includes: a third conductor layer formed on the upper surface of the first resin layer; and a third resin layer that covers the upper surface of the first resin layer in a manner of burying the third conductor layer. The second conductor layer is formed on the upper surface of the third resin layer. The third conductor layer includes a third conductor pattern, and the third conductor pattern includes: a third support portion that at least partially overlaps with the terminal electrode, and a fourth coil portion and a fifth coil portion that do not overlap with the terminal electrode and are connected to the third support portion. The fourth coil portion and the fifth coil portion are electrically connected via the third support portion, and the entire surface of the third support portion is covered by the third resin layer. Thus, the stress applied to the first and third conductor layers via the terminal electrode is alleviated, and the utilization efficiency of the first and third conductor layers is improved.

[0056] Alternatively, the above-described electronic component further includes: a third conductor layer; and a third resin layer that buries the third conductor layer. The first conductor layer is formed on the upper surface of the third resin layer. The third conductor layer includes a third conductor pattern, and the third conductor pattern includes: a third support portion that at least partially overlaps with the terminal electrode; and a lower electrode, a part of which overlaps with the terminal electrode and the remaining part does not overlap with the terminal electrode, and the lower electrode is covered by an upper electrode via a capacitive insulating film. Thus, the area where the upper electrode of the capacitor can be arranged is enlarged, and therefore the design freedom is improved.

[0057] This application claims the benefit of Japanese Patent Application No. 2022-180499 filed on November 10, 2022, the entire disclosure of which is incorporated herein by reference.

[0058] Description of Reference Numerals

[0059] 1 Electronic component

[0060] 11 - 14 Terminal electrodes

[0061] 11a - 14a Regions overlapping with the terminal electrodes

[0062] 20 Support substrate

[0063] 21 - 23 Resin layers

[0064] 24 Flattening layer

[0065] 25 Capacitor insulating film

[0066] 31 - 37 Conductor patterns

[0067] 33A, 34A Support parts

[0068] 33B, 33C, 34B, 34C Coil parts

[0069] 43 - 46 Conductor patterns

[0070] 51 - 58 Through - holes

[0071] 61 - 67 Conductor patterns

[0072] 61A - 64A Support parts

[0073] 61B - 64B, 61C - 64C Coil parts

[0074] 71 - 77 Through - holes

[0075] 80 - 82 Conductor patterns

[0076] 81A - 84A Support parts

[0077] 81B - 84B, 80C - 82C Coil parts

[0078] 91 - 94 Through - holes

[0079] M1, MM, M2, M3, M4 Conductor layers.

Claims

1. An electronic component, wherein, it includes: a first conductor layer; a first resin layer that buries the first conductor layer; a second conductor layer that is formed on the upper surface of the first resin layer or on the upper surface of another resin layer covering the first resin layer; a second resin layer that covers the upper surface of the first resin layer in such a manner as to bury the second conductor layer; and a terminal electrode that is formed on the upper surface of the second resin layer, the first conductor layer includes a first conductor pattern, the second conductor layer includes a second conductor pattern, the first conductor pattern includes: a first support portion at least a part of which overlaps with the terminal electrode, and a first coil portion and a second coil portion that do not overlap with the terminal electrode and are connected to the first support portion; the second conductor pattern includes: a second support portion that overlaps with the terminal electrode and is connected to the terminal electrode via a through hole provided in the second resin layer; and a third coil portion that does not overlap with the terminal electrode and is connected to the second support portion; the first coil portion and the second coil portion are electrically connected via the first support portion, the entire surface of the first support portion is covered by the first resin layer.

2. The electronic component according to claim 1, wherein, it further includes: a third conductor layer; and a third resin layer that buries the third conductor layer, the first conductor layer is formed on the upper surface of the third resin layer, the third conductor layer includes a third conductor pattern, the third conductor pattern includes: a third support portion at least a part of which overlaps with the terminal electrode, and a fourth coil portion and a fifth coil portion that do not overlap with the terminal electrode and are connected to the third support portion; the fourth coil portion and the fifth coil portion are electrically connected via the third support portion, the entire surface of the third support portion is covered by the third resin layer.

3. The electronic component according to claim 1, wherein, it further includes: a third conductor layer that is formed on the upper surface of the first resin layer; and a third resin layer that covers the upper surface of the first resin layer in such a manner as to bury the third conductor layer, the second conductor layer is formed on the upper surface of the third resin layer, the third conductor layer includes a third conductor pattern, the third conductor pattern includes: a third support portion at least a part of which overlaps with the terminal electrode, and a fourth coil portion and a fifth coil portion that do not overlap with the terminal electrode and are connected to the third support portion; the fourth coil portion and the fifth coil portion are electrically connected via the third support portion, the entire surface of the third support portion is covered by the third resin layer.

4. The electronic component according to claim 1, wherein, it further includes: a third conductor layer; and a third resin layer that buries the third conductor layer, the first conductor layer is formed on the upper surface of the third resin layer, the third conductor layer includes a third conductor pattern, the third conductor pattern includes: a third support portion at least a part of which overlaps with the terminal electrode; and a lower electrode, a part of which overlaps with the terminal electrode and the remaining part does not overlap with the terminal electrode, the lower electrode is covered by an upper electrode via a capacitive insulating film.

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