Laser repair device and laser repair method

Abstract

The invention discloses a laser repairing device and a laser repairing method. The laser repairing device comprises a bearing module, a supplementary material providing module and a laser projection module. The bearing module is configured to bear an object to be repaired, and a first conductive element and a second conductive element of the object to be repaired are not connected with each other. The repair material providing module is configured to provide a repair liquid between the first conductive element and the second conductive element, wherein the repair liquid comprises a plurality of repair materials. The laser projection module is configured to project a pulsed laser beam to the plurality of supplements to sinter the plurality of supplements and drive the plurality of supplements to form a conductive block. The conductive block is communicated with the first conductive element and the second conductive element. According to the laser repairing device and the laser repairing method, the yield of the electronic components can be increased, and the production cost can be reduced.

Description

Technical Field

[0001] This application relates to the field of laser repair devices, and particularly to a laser repair device and a laser repair method capable of locally electrically repairing electronic components. Background Art

[0002] With the development and progress of technology, the functions of electronic devices (such as displays, smart phones, etc.) are not only constantly increasing and updated, but also the required electronic components (such as flexible circuit boards, display panels, etc.) are becoming more and more numerous and refined.

[0003] Among them, when the local circuits and circuits of electronic components are broken or defective, some functions of the electronic device cannot operate. Therefore, the current solution is to scrap the defective electronic components and replace them with new ones. However, this solution not only increases the production cost, but also causes problems such as excessive waste of materials and excessive environmental pollution.

[0004] Therefore, how to overcome the above defects has become one of the important issues to be solved in the technical field. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a laser repair device and a laser repair method in view of the deficiencies of the prior art.

[0006] To solve the above technical problem, one of the technical solutions adopted by this application is to provide a laser repair device, including a carrying module, a filling material providing module, and a laser projection module. The carrying module is configured to carry at least one object to be repaired; wherein, the at least one object to be repaired has a first conductive element and a second conductive element, and the first conductive element and the second conductive element are not connected to each other. The filling material providing module is adjacent to the carrying module, and the filling material providing module is configured to provide a repair liquid between the first conductive element and the second conductive element, and the repair liquid contains a plurality of filling material pieces. The laser projection module is adjacent to the carrying module, and the laser projection module is configured to project at least one pulsed laser beam onto the plurality of filling material pieces to sinter the plurality of filling material pieces and drive the plurality of filling material pieces to form a conductive block. Wherein, the conductive block electrically connects the first conductive element and the second conductive element.

[0007] In one feasible or preferred embodiment, the pulse width of the at least one pulsed laser beam is in the femtosecond order of magnitude (10 -15(seconds), the pulse width of the at least one pulsed laser beam is less than 500 fs, the pulse repetition frequency of the at least one pulsed laser beam is greater than 1 MHz, the wavelength of the at least one pulsed laser beam is between 980 - 1080 nm or 465 - 5650 nm, and the spot size of the at least one pulsed laser beam is between 10 - 100 μm. Alternatively, the pulse width of the at least one pulsed laser beam is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 - 1000 μJ. Among them, the laser projection module includes a pulsed laser generation unit, a laser modulation unit, and a laser amplification unit. The pulsed laser generation unit is used to generate a laser with multiple pulse signals. The laser modulation unit is adjacent to the pulsed laser generation unit, and the laser modulation unit is configured to increase the repetition frequency of the laser and to generate a pulsed train laser with multiple pulsed trains based on the laser with the increased repetition frequency. The laser amplification unit is adjacent to the laser modulation unit, and the laser amplification unit is configured to increase the pulse energy of the pulsed train laser to generate the pulsed laser beam, where the multiple pulsed trains include the multiple pulse signals, and the frequency of the multiple pulse signals is between 1 - 2000 KHz.

[0008] In one possible or preferred embodiment, the replenishing member is a nanoparticle. Among them, the laser repair device further includes a beam adjustment module, an optical module, and a focusing module. The beam adjustment module corresponds to the laser projection module, and the beam adjustment module is configured to receive the at least one pulsed laser beam and to convert the at least one pulsed laser beam into a first modulated laser beam. The optical module corresponds to the beam adjustment module, and the optical module is configured to receive the first modulated laser beam and to convert the first modulated laser beam into a second modulated laser beam. The focusing module corresponds to the optical module, and the focusing module is configured to receive the second modulated laser beam and to convert the second modulated laser beam into a flat-top laser beam.

[0009] In one possible or preferred embodiment, the laser repair device further includes a scanning module, the scanning module is located between the optical module and the focusing module, and the scanning module is configured to receive the second modulated laser beam and to selectively project the second modulated laser beam in at least one projection direction.

[0010] In one possible or preferred embodiment, the laser repair device further includes an analysis module, a beam splitting module, and a detection module. The analysis module is connected to the laser projection module. The beam splitting module corresponds to the analysis module, and the beam splitting module is configured to receive the first modulated laser beam, the second modulated laser beam, or the flat-top laser beam. The detection module is adjacent to the carrier module, the detection module is connected to the laser projection module, and the detection module is configured to detect the heating condition of the conductive block by means of spectral detection, electrical detection, or fluorescence detection, so as to correspondingly generate at least one heating data, and the detection module transmits at least one of the heating data to the laser projection module. Among them, when the beam splitting module receives the first modulated laser beam, the beam splitting module projects a part of the first modulated laser beam onto the optical module, and projects another part of the first modulated laser beam onto the analysis module, so that the analysis module generates a first beam energy analysis signal accordingly, and the analysis module transmits the first beam energy analysis signal to the laser projection module. Among them, when the beam splitting module receives the second modulated laser beam, the beam splitting module projects a part of the second modulated laser beam onto the scanning module, and projects another part of the second modulated laser beam onto the analysis module, so that the analysis module generates a second beam energy analysis signal accordingly, and the analysis module transmits the second beam energy analysis signal to the laser projection module. Among them, when the beam splitting module receives the flat-top laser beam, the beam splitting module projects a part of the flat-top laser beam onto the plurality of replenishing members, and projects another part of the flat-top laser beam onto the analysis module, so that the analysis module generates a third beam energy analysis signal accordingly, and the analysis module transmits the third beam energy analysis signal to the laser projection module. Among them, the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of a spot shape, a spot position, and a beam energy.

[0011] To solve the above technical problems, another technical solution adopted by this application is to provide a laser repair method, including the following steps: carrying at least one object to be repaired by a carrying module; wherein, the at least one object to be repaired has a first conductive element and a second conductive element, and the first conductive element and the second conductive element are not connected to each other; using a filler supply module to supply a repair liquid between the first conductive element and the second conductive element, wherein the repair liquid contains a plurality of filler pieces; projecting at least one pulsed laser beam onto the plurality of filler pieces through a laser projection module to sinter the plurality of filler pieces, and driving the plurality of filler pieces to form a conductive block; and using the conductive block to electrically connect the first conductive element and the second conductive element.

[0012] In one possible or preferred embodiment, the pulse width of the at least one pulsed laser beam is in the femtosecond range (10 -15 seconds), the pulse width of the at least one pulsed laser beam is less than 500 fs, the pulse repetition frequency of the at least one pulsed laser beam is greater than 1 MHz, the wavelength of the at least one pulsed laser beam is between 980 - 1080 nm or 465 - 5650 nm, and the spot size of the at least one pulsed laser beam is between 10 - 100 μm. Or, the pulse width of the at least one pulsed laser beam is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 - 1000 μJ. Among them, in the step of providing the at least one pulsed laser beam, the following steps are further included: generating a laser with a plurality of pulse signals by a pulsed laser generating unit; using a laser modulation unit to increase the repetition frequency of the laser, and generating a pulsed train laser with a plurality of pulsed trains according to the increased laser; and increasing the pulse energy of the pulsed train laser by a laser amplifying unit to generate the at least one pulsed laser beam, wherein the plurality of pulsed trains include the plurality of pulse signals, and the frequency of the plurality of pulse signals is between 1 - 2000 KHz.

[0013] In one possible or preferred embodiment, after the step of providing the repair liquid between the first conductive element and the second conductive element, the laser repair method further includes the following steps: providing at least one pulsed laser beam through the laser projection module, wherein the pulse width of the at least one pulsed laser beam is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 - 1000 μJ; receiving the at least one pulsed laser beam by the beam adjustment module and converting the at least one pulsed laser beam into a first modulated laser beam; receiving the first modulated laser beam by the optical module and converting the first modulated laser beam into a second modulated laser beam; and receiving the second modulated laser beam by a focusing module and converting the second modulated laser beam into a flat-top laser beam projected onto the plurality of filler parts.

[0014] In one possible or preferred embodiment, before the step of receiving the second modulated laser beam by the focusing module, the laser repair method further includes the following steps: receiving the second modulated laser beam by the scanning module and selectively projecting the second modulated laser beam in at least one projection direction.

[0015] In one of the feasible or preferred embodiments, after the step of generating the first modulated laser beam, the following steps are further included: receiving the first modulated laser beam by a beam splitting module, projecting a part of the first modulated laser beam to the optical module, and projecting another part of the first modulated laser beam to the analysis module; and using the analysis module to receive the other part of the first modulated laser beam, generating a first beam energy analysis signal therefrom, and transmitting the first beam energy analysis signal to the laser projection module. Among them, after the step of generating the second modulated laser beam, the following steps are further included: receiving the second modulated laser beam by the beam splitting module, projecting a part of the second modulated laser beam to the scanning module, and projecting another part of the second modulated laser beam to the analysis module; and using the analysis module to receive the other part of the second modulated laser beam, generating a second beam energy analysis signal therefrom, and transmitting the second beam energy analysis signal to the laser projection module. Among them, after the step of generating the flat-top laser beam, the following steps are further included: receiving the flat-top laser beam by the beam splitting module, projecting a part of the flat-top laser beam to the plurality of feeding members, and projecting another part of the flat-top laser beam to the analysis module; and using the analysis module to receive the other part of the flat-top laser beam, generating a third beam energy analysis signal therefrom, and transmitting the third beam energy analysis signal to the laser projection module. Among them, the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of spot shape, spot position, and beam energy. Among them, the laser repair method further includes the following steps: detecting the heat absorption condition of the conductive block by a detection module in a manner of spectral detection, electrical detection, or fluorescence detection to correspondingly generate at least one heat absorption data; and using the detection module to transmit at least one of the heat absorption data to the laser projection module.

[0016] One of the beneficial effects of the present application is that the laser repair device provided by the present application can increase the yield rate of electronic components and reduce production costs through the technical solution of "the carrying module is configured to carry at least one object to be repaired; wherein, the at least one object to be repaired has a first conductive element and a second conductive element, and the first conductive element and the second conductive element are not connected to each other. The filling material providing module is adjacent to the carrying module, and the filling material providing module is configured to provide a repair liquid between the first conductive element and the second conductive element, and the repair liquid contains a plurality of filling material pieces. The laser projection module is adjacent to the carrying module, and the laser projection module is configured to project at least one pulsed laser beam onto the plurality of filling material pieces to sinter the plurality of filling material pieces and drive the plurality of filling material pieces to form a conductive block. Wherein, the conductive block electrically connects the first conductive element and the second conductive element".

[0017] Another beneficial effect of the present application is that the laser repair method provided by the present application can increase the yield rate of electronic components and reduce production costs through the technical solution of "carrying at least one object to be repaired through a carrying module; wherein, the at least one object to be repaired has a first conductive element and a second conductive element, and the first conductive element and the second conductive element are not connected to each other; using a filling material providing module to provide a repair liquid between the first conductive element and the second conductive element, wherein the repair liquid contains a plurality of filling material pieces; projecting at least one pulsed laser beam onto the plurality of filling material pieces through a laser projection module to sinter the plurality of filling material pieces and drive the plurality of filling material pieces to form a conductive block; and using the conductive block to electrically connect the first conductive element and the second conductive element".

[0018] To further understand the features and technical content of the present application, please refer to the following detailed description and drawings of the present application. However, the provided drawings are only for reference and illustration, and are not used to limit the present application. Brief Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the first usage state of the laser repair device according to the first embodiment of the present application.

[0020] Figure 2 It is a schematic diagram of the second usage state of the laser repair device according to the first embodiment of the present application.

[0021] Figure 3 It is a schematic diagram of the third usage state of the laser repair device according to the first embodiment of the present application.

[0022] Figure 4 It is a schematic diagram of the first structure of the laser repair device according to the first embodiment of the present application.

[0023] Figure 5 It is a second structural schematic diagram of the laser repair device according to the first embodiment of the present application.

[0024] Figure 6 It is a third structural schematic diagram of the laser repair device according to the first embodiment of the present application.

[0025] Figure 7 It is a functional block diagram of the laser repair device according to the first embodiment of the present application.

[0026] Figure 8 It is a schematic flow chart of the laser repair method according to the first embodiment of the present application.

[0027] Figure 9 It is a schematic diagram of the architecture of the laser projection module of the laser repair device according to the second embodiment of the present application.

[0028] Figure 10 It is a schematic diagram of multiple pulse trains of the pulsed laser beam of the laser projection module of the laser repair device according to the second embodiment of the present application.

[0029] Figure 11 It is a structural schematic diagram of the laser repair device according to the third embodiment of the present application.

[0030] Reference numerals:

[0031] Z: Laser repair device; 1: Carrying module; 2: Feeding supply module; 200: Feeding head; 3: Laser projection module; 300: Pulsed laser generation unit; 310: Laser modulation unit; 320: Laser amplification unit; 4: Beam adjustment module; 5: Optical module; 6: Focusing module; 7: Analysis module; 8: Beam splitting module; 9: Control module; 10: Detection module; 11: Scanning module; 1100: First beam scanning unit; 1101: Second beam scanning unit; B: Object to be repaired; B1: First conductive element; B2: Second conductive element; B3: Polymer material layer; C: Conductive block; P1, P2, Pn: Pulse trains; Q1, Q2, Qn: Pulse signals; R: Repair solution; R1: Feeding part; R2: Solution; FL: First modulated laser beam; L: Pulsed laser beam; L1: Laser; L2: Pulse train laser; SL: Second modulated laser beam; TL: Flat-top laser beam. Detailed implementation manners

[0032] The following are specific embodiments to illustrate the implementation manners of the "laser repair device and laser repair method" disclosed in the present application. Those skilled in the art can understand the advantages and effects of the present application from the content disclosed in this specification. The present application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are only for simple schematic illustration and are not drawn according to actual dimensions. The following embodiments will further detail the related technical content of the present application, but the disclosed content is not intended to limit the protection scope of the present application.

[0033] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein should, depending on the actual situation, may include any one or a combination of more of the associated listed items.

[0034] First Embodiment

[0035] Please refer to Figures 1 to 5 , which are respectively the first usage state schematic diagram, the second usage state schematic diagram, the third usage state schematic diagram, the first structure schematic diagram, the second structure schematic diagram, the third structure schematic diagram, the functional block diagram of the laser repair device of the first embodiment of the present application, and the flow schematic diagram of the laser repair method. As shown in the above diagrams, the first embodiment of the present application provides a laser repair device Z, which may include a carrier module 1, a filler supply module 2, and a laser projection module 3.

[0036] Cooperating with Figures 1 to 6 As shown, the carrier module 1 of the present application can be configured to carry at least one object to be repaired B. Among them, at least one object to be repaired B may have a first conductive element B1 and a second conductive element B2, and the first conductive element B1 and the second conductive element B2 are not connected to each other. For example, the carrier module 1 can be a biaxial (X-axis, Y-axis) or multi-axial (X-axis, Y-axis, Z-axis, but not limited thereto) mobile stage device. The object to be repaired B can be an electronic component, such as a flexible printed circuit (FPC), but not limited thereto; the first conductive element B1 and the second conductive element B2 can be metal circuits or metal patterns provided on the object to be repaired B; and, the object to be repaired B may also have a polymer material layer B3, such as: a polyimide (PI) layer, but not limited thereto. The object to be repaired B can be carried on the upper surface of the carrier module 1.

[0037] Next, cooperating withFigure 1 As shown, the replenishment supply module 2 of the present application can be adjacent to the carrier module 1. The replenishment supply module 2 can be configured to provide a repair liquid R between the first conductive element B1 and the second conductive element B2. The repair liquid R includes a plurality of replenishment parts R1. For example, the replenishment supply module 2 can be a liquid supply device and can store the repair liquid R. Among them, the repair liquid R includes a plurality of replenishment parts R1 and a solution R2. The replenishment parts R1 can be silver nanoparticles (AgNanoparticle), and the solution R2 can be a solvent. The plurality of replenishment parts R1 and the solution R2 can be mixed to form the repair liquid R.

[0038] Next, in cooperation with Figures 2 to 6 As shown, the laser projection module 3 of the present application can be adjacent to the carrier module 1. The laser projection module 3 can be configured to project at least one pulsed laser beam L onto the plurality of replenishment parts R1 to sinter the plurality of replenishment parts R1 and drive the plurality of replenishment parts R1 to form a conductive block C. For example, the laser projection module 3 can be a laser projection device. The laser projection module 3 can project at least one pulsed laser beam L. The pulse width of the pulsed laser beam L can be in the femtosecond order of magnitude (10 -15 seconds), the pulse width of the pulsed laser beam L can be less than 500 fs, the pulse repetition frequency of the pulsed laser beam L can be greater than 1 MHz, the wavelength of the pulsed laser beam L can be between 980 - 1080 nm or 465 - 5650 nm, and the spot size of the pulsed laser beam L can be between 10 - 100 μm.

[0039] Therefore, in cooperation with Figures 1 to 6 As shown, when the laser repair device Z of the present application is in use, at least one object to be repaired B can be first placed on the carrier module 1. Then, the replenishment supply module 2 can be controlled to drive the replenishment supply module 2 to drip the repair liquid R between the first conductive element B1 and the second conductive element B2 by using the supply head 200, and the repair liquid R contacts the first conductive element B1 and the second conductive element B2.

[0040] Next, the object to be repaired B is left standing to allow the solution R2 in the repair liquid R to evaporate and volatilize, leaving only the plurality of replenishment parts R1 on the object to be repaired B. Then, a pulsed laser beam L with a pulse width in the femtosecond order of magnitude (10 -15 seconds) can be projected onto the plurality of replenishment parts R1 on the object to be repaired B by controlling the laser projection module 3 to sinter the plurality of replenishment parts R1, and the plurality of replenishment parts R1 are sintered into a single conductive block C. The conductive block C can electrically connect the first conductive element B1 and the second conductive element B2.

[0041] Thus, through the above technical solution, the laser repair device Z of the present application uses the filler supply module 2 to provide the repair liquid R containing silver nanoparticles onto the local surface of the object B to be repaired, and projects a pulsed laser beam L with a pulse width in the femtosecond order of magnitude (10 -15 seconds) onto the silver nanoparticles through the laser projection module 3, so that the silver nanoparticles are sintered into a conductive block C, and then the first conductive element B1 and the second conductive element B2 are electrically connected by using the conductive block C to achieve the purpose and effect of conducting electricity in a local area. Moreover, since the pulsed laser beam L in the femtosecond order of magnitude (10 -15 seconds) has the effect of generating a very small heat affected zone, therefore, in the above manner, the pulsed laser beam L will not affect the polymer material or polymer material layer B3 adjacent to the first conductive element B1 and the second conductive element B2, and deformation of the polymer material can be avoided; furthermore, the pulsed laser beam L will not affect the circuit structures of the first conductive element B1, the second conductive element B2 and the object B to be repaired, and damage to the circuit structures of the first conductive element B1, the second conductive element B2 and the object B to be repaired can be avoided.

[0042] Furthermore, the laser repair device Z of the present application may further include a beam adjustment module 4, an optical module 5 and a focusing module 6.

[0043] Cooperating with Figures 4 to 6 as shown, the beam adjustment module 4 may correspond to the laser projection module 3. The beam adjustment module 4 may be configured to receive at least one pulsed laser beam L and to convert the at least one pulsed laser beam L into a first modulated laser beam FL. For example, the beam adjustment module 4 may be a laser beam expander. The beam adjustment module 4 may expand the laser spot of the pulsed laser beam L to generate a first modulated laser beam FL.

[0044] Next, cooperating with Figures 4 to 6 as shown, the optical module 5 corresponds to the beam adjustment module 4. The optical module 5 is configured to receive the first modulated laser beam FL and to convert the first modulated laser beam FL into a second modulated laser beam SL. For example, the optical module 5 may be a diffractive optical element (DOE) or a top-hat beam shaper DOE. The optical module 5 may be a lens or may be a long tube lens group. The optical module 5 may convert the laser spot of the first modulated laser beam FL into a spot with a specific pattern (such as a circle, a square or other geometric shapes), and may convert the first modulated laser beam FL into a flat-top light, thereby forming a second modulated laser beam SL.

[0045] Next, cooperating with Figures 4 to 6As shown, the focusing module 6 corresponds to the optical module 5. The focusing module 6 is configured to receive the second modulated laser beam SL and convert the second modulated laser beam SL into a flat-top laser beam TL. For example, the focusing module 6 can be a flat-field focusing lens (F-Theta Lens). The focusing module 6 can focus the second modulated laser beam SL into a flat-top laser beam TL with a predetermined aspect ratio and then project the flat-top laser beam TL onto a plurality of filler parts R1. Among them, the laser projection module 3, the beam adjustment module 4, the optical module 5, and the focusing module 6 can be arranged on the same optical path.

[0046] Therefore, the laser repair device Z of the present application can also be provided with a beam adjustment module 4, an optical module 5, and a focusing module 6 between the laser projection module 3 and the carrier module 1. And, the pulsed laser beam L projected by the laser projection module 3 is converted into a flat-top laser beam TL by the beam adjustment module 4, the optical module 5, and the focusing module 6 and projected onto a plurality of filler parts R1. Since the front end of the flat-top laser beam TL has a flat-top shape, when the flat-top laser beam TL is projected onto the filler part R1, the flat-top laser beam TL can avoid damaging the object to be repaired B or the polymer material layer B3 and only heat the filler part R1.

[0047] Furthermore, the laser repair device Z of the present application can also include an analysis module 7 and a beam splitting module 8.

[0048] Cooperate with Figures 4 to 6 As shown, the analysis module 7 is connected to the laser projection module 3. For example, the analysis module 7 can be a laser beam analysis device, and the analysis module 7 is electrically connected to the laser projection module 3.

[0049] Next, cooperate with Figures 4 to 6 As shown, the beam splitting module 8 corresponds to the analysis module 7. The beam splitting module 8 is configured to receive the first modulated laser beam FL, the second modulated laser beam SL, or the flat-top laser beam TL. For example, the beam splitting module 8 can be a cube beam splitter, a flat plate beam splitter, a polarization beam splitter, or other types of beam splitting optical elements; and, the beam splitting module 8 can be arranged between the beam adjustment module 4 and the optical module 5, between the optical module 5 and the focusing module 6, or between the focusing module 6 and the carrier module 1.

[0050] Among them, when the beam splitting module 8 can be arranged between the beam adjustment module 4 and the optical module 5 and the beam splitting module 8 receives the first modulated laser beam FL, the beam splitting module 8 can project a part of the beam of the first modulated laser beam FL onto the optical module 5 and project another part of the beam of the first modulated laser beam FL onto the analysis module 7, so that the analysis module 7 generates a first beam energy analysis signal accordingly, and the analysis module 7 transmits the first beam energy analysis signal to the laser projection module 3.

[0051] Alternatively, when the beam splitting module 8 can be disposed between the optical module 5 and the focusing module 6, and the beam splitting module 8 receives the second modulated laser beam SL, the beam splitting module 8 can project a part of the second modulated laser beam SL to the scanning module, and project another part of the second modulated laser beam SL to the analysis module 7, so that the analysis module 7 generates a second beam energy analysis signal accordingly, and the analysis module 7 transmits the second beam energy analysis signal to the laser projection module 3.

[0052] Or, when the beam splitting module 8 can be disposed between the focusing module 6 and the carrier module 1, and the beam splitting module 8 receives the flat-top laser beam TL, the beam splitting module 8 can project a part of the flat-top laser beam TL to the plurality of replenishing members R1, and project another part of the flat-top laser beam TL to the analysis module 7, so that the analysis module 7 generates a third beam energy analysis signal accordingly, and the analysis module 7 transmits the third beam energy analysis signal to the laser projection module 3.

[0053] Among the above, the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of spot shape, spot position, and beam energy.

[0054] Therefore, the analysis module 7 can transmit the first beam energy analysis signal, the second beam energy analysis signal, or the third beam energy analysis signal to the laser projection module 3; and the laser projection module 3 can selectively adjust at least one of the spot shape, spot position, and beam energy of the pulsed laser beam L according to the data of the first beam energy analysis signal, the second beam energy analysis signal, or the third beam energy analysis signal.

[0055] Furthermore, as shown in Figure 7 the laser repair device Z of the present application may further include a control module 9, and the control module 9 can be a control device. The control module 9 can be electrically connected to the carrier module 1, the replenishing material providing module 2, the laser projection module 3, the beam adjustment module 4, and the analysis module 7, and the control module 9 can be configured to control each of the above modules. Among them, the analysis module 7 can also transmit the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal to the control module 9, and the control module 9 can drive the laser projection module 3 to selectively adjust at least one of the spot shape, spot position, and beam energy of the pulsed laser beam L according to the data of the first beam energy analysis signal, the second beam energy analysis signal, or the third beam energy analysis signal.

[0056] Furthermore, as shown in Figure 2 、 Figure 3 and Figure 7As shown, the laser repair device Z of the present application may further include a detection module 10. The detection module 10 is adjacent to the carrying module 1. The detection module 10 can be electrically connected to the laser projection module 3, the control module 9, or both. The detection module 10 can be configured to detect the heat condition of the conductive block C to correspondingly generate at least one heat data. For example, the detection module 10 can be a hyperspectral imaging detection device. After multiple filler parts R1 are sintered into the conductive block C, the laser repair device Z of the present application can perform spectral detection on the conductive block C through the detection module 10 to obtain the heat condition of the conductive block C itself or a partial area, and correspondingly generate heat data regarding the conductive block C itself or a partial area of the conductive block C, such as spectral data of the heat source distribution, but not limited thereto.

[0057] Next, the detection module 10 can transmit the heat data to the laser projection module 3, the control module 9, or both. Among them, when the laser projection module 3 receives the heat data, the laser projection module 3 can selectively adjust at least one of the spot shape, spot position, and beam energy of the pulsed laser beam L according to the heat data; when the control module 9 receives the heat data, the control module 9 can selectively adjust at least one of the spot shape, spot position, and beam energy of the pulsed laser beam L according to the heat data.

[0058] It is worth mentioning that the detection module 10 of the laser repair device Z of the present application can also detect the heat condition of the conductive block C itself or a partial area by performing electrical detection (such as detecting the resistance value) or fluorescence detection on the conductive block C, etc., and obtain corresponding heat data. Among them, the detection module 10 can be a resistance tester or a fluorescence spectrometer, but not limited thereto.

[0059] In addition, according to the above content, and in cooperation with Figures 1 to 8 As shown, the present application further proposes a laser repair method, which includes the following steps:

[0060] Step S100: Carry at least one object to be repaired B through the carrying module 1;

[0061] Step S102: Use the filler supply module 2 to provide a repair liquid R between the first conductive element B1 and the second conductive element B2;

[0062] Step S104: Project at least one pulsed laser beam L onto multiple filler parts R1 through a laser projection module 3 to sinter the multiple filler parts R1, and drive the multiple filler parts R1 to form a conductive block C; and

[0063] Step S106: Use the conductive block C to electrically connect the first conductive element B1 and the second conductive element B2.

[0064] Furthermore, in cooperation with Figures 1 to 8As shown, after step S102 of providing the repair fluid R between the first conductive element B1 and the second conductive element B2, the laser repair method of the present application further includes the following steps:

[0065] Step S108: Provide at least one pulsed laser beam L through the laser projection module 3, wherein the pulse width of the at least one pulsed laser beam L is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam L is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam L is between 100 - 1000 μJ;

[0066] Step S110: Use a beam adjustment module 4 to receive the at least one pulsed laser beam L and convert the at least one pulsed laser beam L into a first modulated laser beam FL;

[0067] Step S112: Receive the first modulated laser beam FL through an optical module 5 and convert the first modulated laser beam FL into a second modulated laser beam SL; and

[0068] Step S114: Receive the second modulated laser beam SL through a focusing module 6 and convert the second modulated laser beam SL into a flattened-top laser beam TL projected onto a plurality of replenishing parts R1.

[0069] Furthermore, in coordination with Figures 1 to 8 As shown, after the step of generating the first modulated laser beam FL, the following steps are further included:

[0070] Receive the first modulated laser beam FL through a beam splitting module 8, project a part of the first modulated laser beam FL onto the optical module 5, and project another part of the first modulated laser beam FL onto the analysis module 7; and

[0071] Use the analysis module 7 to receive another part of the first modulated laser beam FL, generate a first beam energy analysis signal based on it, and transmit the first beam energy analysis signal to the laser projection module 3.

[0072] Furthermore, in coordination with Figures 1 to 8 As shown, after the step of generating the second modulated laser beam SL, the following steps are further included:

[0073] Receive the second modulated laser beam SL through a beam splitting module 8, project a part of the second modulated laser beam SL onto the scanning module, and project another part of the second modulated laser beam SL onto the analysis module 7; and

[0074] The analysis module 7 receives another part of the second modulated laser beam SL, generates a second beam energy analysis signal based on this, and transmits the second beam energy analysis signal to the laser projection module 3.

[0075] Furthermore, in coordination with Figures 1 to 8 as shown, after the step of generating the flat-top laser beam TL, the following steps are further included:

[0076] The beam splitting module 8 receives the flat-top laser beam TL, projects a part of the flat-top laser beam TL onto a plurality of replenishing members R1, and projects another part of the flat-top laser beam TL onto the analysis module 7; and

[0077] The analysis module 7 receives another part of the flat-top laser beam TL, generates a third beam energy analysis signal based on this, and transmits the third beam energy analysis signal to the laser projection module 3.

[0078] Among them, the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of the spot shape, spot position, and beam energy.

[0079] In addition, the laser repair device Z of the present application can also be applied to plate welding. For example, referring to Figure 2 and Figure 3 , two plate members (not shown in the figure) are placed on the carrying module 1. Then, a pulsed laser beam L with a pulse width in the femtosecond order of magnitude (10 -15 seconds) and a pulse width of 70 fs can be projected through the laser projection module 3 into the gap between the two plate members; at this time, the pulsed laser beam L can melt a part of the upper structure of each plate member near the gap. After the two plate members are cooled and recrystallized with each other, the two plate members are bonded together.

[0080] Next, a bonding test can be performed on the two bonded plate members to obtain shear-related data (such as shear height data, but not limited thereto) at the joint of the two bonded plate members, and then the bonding strength data of the joint can be obtained.

[0081] However, the above examples are only one feasible embodiment and are not intended to limit the present application.

[0082] Second Embodiment

[0083] Please refer to Figure 9 and Figure 10 , which are respectively a schematic structural diagram of the laser projection module of the laser repair device according to the second embodiment of the present application and a schematic diagram of a plurality of pulse trains of the pulsed laser beam of the laser projection module, and please also refer to Figures 1 to 8As shown in the figure, the laser repair device Z of this embodiment is substantially similar to the laser repair device Z of the above embodiment. Therefore, the setting or operation of the same components will not be elaborated herein. The difference between the laser repair device Z of this embodiment and the laser repair device Z of the above first embodiment is that, in this embodiment, the pulse width of at least one pulsed laser beam L generated by the laser projection module 3 is between 50 - 500 fs, the repetition frequency of at least one pulsed laser beam L is between 0.5 - 10 GHz, and the pulse energy of at least one pulsed laser beam L is between 100 - 1000 μJ. Moreover, the laser projection module 3 may include a pulsed laser generation unit 300, a laser modulation unit 310, and a laser amplification unit 320.

[0084] Cooperate with Figures 4 to 6 and Figure 9 , 10 As shown, the pulsed laser generation unit 300 can be used to generate a laser L1 with multiple pulse signals. For example, the pulsed laser generation unit 300 can be configured to generate a laser L1 with multiple pulse signals Q1 - Qn; wherein, the pulsed laser generation unit 300 can be a pulsed laser generator.

[0085] Next, cooperate with Figure 9 and Figure 10 As shown, the laser modulation unit 310 is adjacent to the pulsed laser generation unit 300. The laser modulation unit 310 can be configured to increase the repetition frequency of the laser L1 and generate a pulsed train laser L2 with multiple pulsed trains P1 - Pn based on the increased laser L1. For example, the laser modulation unit 310 can be an acousto - optic modulator (AOM) or other devices of the same type, and the repetition frequency of the pulsed train laser L2 can be between 0.5 - 10 GHz (for example, any positive integer between 0.5 - 10 GHz), but not limited thereto.

[0086] Next, cooperate with Figure 9 and Figure 10 As shown, the laser amplification unit 320 is adjacent to the laser modulation unit 310. The laser amplification unit 320 can be configured to increase the pulse energy of the pulsed train laser L2 to generate a pulsed laser beam L; wherein, the multiple pulsed trains P1 - Pn include multiple pulse signals Q1 - Qn, and the frequency of the multiple pulse signals can be between 1 - 2000 KHz.

[0087] Therefore, cooperate with Figure 9 and Figure 10As shown, multiple pulse trains P1 - Pn may include multiple pulse signals Q1 - Qn; that is, multiple pulse signals Q1 form pulse train P1, multiple pulse signals Q2 form pulse train P2, ..., multiple pulse signals Qn form pulse train Pn, such that multiple pulse trains P1 - Pn respectively form multiple pulse signals Q1 - Qn. Among them, the pulse widths of multiple pulse signals Q1 - Qn are between 50 - 500 fs (for example, any positive integer between 50 - 500 fs), the number of multiple pulse signals Q1 - Qn is between 50 - 1000 (for example, any positive integer between 50 - 1000), and the frequencies of multiple pulse signals Q1 - Qn are between 1 - 2000 KHz (for example, any positive integer between 1 - 2000 KHz), but not limited thereto.

[0088] Moreover, the pulsed laser beam L can be adjusted by the laser projection module 3. The pulse width of the pulsed laser beam L (i.e., the pulse widths of multiple pulse signals Q1 - Qn) can be between 50 - 500 fs, the repetition frequency of the pulsed laser beam L (i.e., the repetition frequency of the pulsed train laser L2) can be between 0.5 - 10 GHz, and the average power of the pulsed laser beam L can be determined according to the pulse energy and the repetition frequency, but not limited thereto. It should be noted that the pulse width of the pulsed laser beam L, the pulse energy of the pulsed laser beam L, the frequencies of multiple pulse signals Q1 - Qn, the repetition frequency of the pulsed laser beam L, and the number of multiple pulse signals Q1 - Qn can be appropriately adjusted according to actual requirements.

[0089] Furthermore, according to the above content, in the step of providing at least one pulsed laser beam L in the laser repair method of the present application, the following steps may further be included:

[0090] Generate a laser L1 with multiple pulse signals through the pulsed laser generation unit 300;

[0091] Utilize the laser modulation unit 310 to increase the repetition frequency of the laser L1, and generate a pulsed train laser L2 with multiple pulse trains according to the increased laser L1; and

[0092] Increase the pulse energy of the pulsed train laser L2 through the laser amplification unit 320 to generate at least one pulsed laser beam L.

[0093] However, the examples cited above are only one feasible embodiment and are not intended to limit the present application.

[0094] Third Embodiment

[0095] Please refer to Figure 11 which is a schematic structural diagram of the laser repair device according to the third embodiment of the present application, and please also refer to Figures 1 to 10As shown in the figure, the laser repair device Z of this embodiment is substantially similar to the laser repair device Z of the above embodiment. Therefore, the setting or operation of the same components will not be described herein again. The difference between the laser repair device Z of this embodiment and the laser repair device Z of the above first embodiment is that, in this embodiment, the laser repair device Z of the present application may further include a scanning module 11, and the scanning module 11 is located between the optical module 5 and the focusing module 6. The scanning module 11 can be configured to receive the second modulated laser beam SL and selectively project the second modulated laser beam SL in at least one projection direction; wherein, the scanning module 11 can be a laser galvanometer scanning module with a scanning galvanometer, a laser focusing module with a fixed focusing processing head, or other types of galvanometer scanning modules. Among them, the laser projection module 3, the beam adjustment module 4, the optical module 5, the scanning module 11, and the focusing module 6 can be arranged on the same optical path.

[0096] For example, in cooperation with Figure 11 As shown, when the laser repair device Z of the present application is operating, after the laser projection module 3 projects at least one pulsed laser beam L, the beam adjustment module 4 can receive the at least one pulsed laser beam L and convert the at least one pulsed laser beam L into a first modulated laser beam FL. Then, the optical module 5 can receive the first modulated laser beam FL and convert the first modulated laser beam FL into a second modulated laser beam SL; wherein, the optical module 5 can convert the laser spot of the first modulated laser beam FL into a spot of a specific shape (such as a circle, a square, an elongated strip, a thick elongated strip, or other geometric shapes), and can convert the first modulated laser beam FL into a flat-top beam, thereby forming the second modulated laser beam SL.

[0097] Next, the scanning module 11 can receive the second modulated laser beam SL and selectively project the second modulated laser beam SL in at least one projection direction. Further, the scanning module 11 can include a first beam scanning unit 1100 and a second beam scanning unit 1101. The first beam scanning unit 1100 can correspond to the optical module 5 and the second beam scanning unit 1101 and be located between the optical module 5 and the second beam scanning unit 1101; while the second beam scanning unit 1101 can correspond to the first beam scanning unit 1100 and the focusing module 6 and be located between the first beam scanning unit 1100 and the focusing module 6, but not limited thereto. The first beam scanning unit 1100 can be a galvanometer capable of adjusting the displacement of the second modulated laser beam SL in a first axial direction (e.g., the direction of the X-axis or Y-axis); for example, the first beam scanning unit 1100 can reflect the second modulated laser beam SL according to a plurality of rotation angles in the X-axis direction (e.g., 0°, 30°, 60°, etc.), that is, the first beam scanning unit 1100 generates at least one rotation angle in the X-axis direction through rotational motion, and reflects the second modulated laser beam SL with a mirror at different angles. In contrast, the second beam scanning unit 1101 can be a galvanometer capable of adjusting the displacement of the second modulated laser beam SL in a second axial direction (e.g., the direction of the X-axis or Y-axis); that is, the second beam scanning unit 1101 can also generate a plurality of rotation angles in the Y-axis direction through rotational motion, and reflect the second modulated laser beam SL with a mirror at different angles. Wherein, the first axial direction is different from the second axial direction, and the first axial direction and the second axial direction are preferably perpendicular to each other. Therefore, when the optical module 5 converts the laser spot into an elongated or thick elongated (the length is greater than any side length of the surface of the object to be repaired B) spot, the scanning module 11 can project the second modulated laser beam SL in a linear (linear) manner and scan the object to be repaired B; and when the optical module 5 converts the laser spot into a circular or square (the shape is smaller than the size of the surface of the object to be repaired B) spot, the scanning module 11 can project the second modulated laser beam SL in a non-linear manner (e.g., S-shaped or other non-linear paths) and scan the object to be repaired B.

[0098] It is worth mentioning that in other embodiments, if the scanning module 11 adopts a galvanometer scanning module, the galvanometer scanning module can reflect the second modulated laser beam SL according to multiple rotation angles (for example, 0°, 30°, 60°, …); that is, the galvanometer scanning module performs a rotational motion to generate multiple rotation angles, so that the galvanometer scanning module reflects the second modulated laser beam SL with a mirror surface at different angles. Further, the operator can input a control instruction to the control module 9 according to the processing requirement, and the control module 9 can send a corresponding driving instruction to the galvanometer scanning module according to the control instruction, so that the galvanometer scanning module can perform corresponding driving rotation according to the driving instruction to generate multiple rotation angles, and further drive the galvanometer scanning module to reflect the second modulated laser beam SL with a mirror surface at different angles according to the processing requirement. In addition, in other embodiments, if the scanning module 11 adopts a laser focusing module, the laser focusing module can reflect the second modulated laser beam SL by a reflection angle; that is, the laser focusing module reflects the second modulated laser beam SL with a mirror surface at a fixed reflection angle.

[0099] Next, the focusing module 6 is used to receive the second modulated laser beam SL, convert the second modulated laser beam SL into a flat-top laser beam TL, and then project the flat-top laser beam TL onto a plurality of replenishing elements R1.

[0100] However, the above examples are only one feasible embodiment and are not intended to limit this application.

[0101] Beneficial effects of the embodiment

[0102] One of the beneficial effects of this application is that the laser repair device Z provided by this application can increase the yield of electronic components and reduce production costs through the technical solution of "the carrying module 1 is configured to carry at least one object to be repaired B; wherein, at least one object to be repaired B has a first conductive element B1 and a second conductive element B2, and the first conductive element B1 and the second conductive element B2 are not connected to each other. The replenishing material providing module 2 is adjacent to the carrying module 1, and the replenishing material providing module 2 is configured to provide a repair liquid R between the first conductive element B1 and the second conductive element B2, and the repair liquid R includes a plurality of replenishing elements R1. The laser projection module 3 is adjacent to the carrying module 1, and the laser projection module 3 is configured to project at least one pulsed laser beam L onto a plurality of replenishing elements R1 to sinter the plurality of replenishing elements R1 and drive the plurality of replenishing elements R1 to form a conductive block C. Wherein, the conductive block C electrically connects the first conductive element B1 and the second conductive element B2".

[0103] Another beneficial effect of the present application lies in that the laser repair method provided by the present application can "carry at least one object to be repaired B through a carrying module 1; wherein, at least one object to be repaired B has a first conductive element B1 and a second conductive element B2, and the first conductive element B1 and the second conductive element B2 are not connected to each other; use a repair material supply module 2 to supply a repair liquid R between the first conductive element B1 and the second conductive element B2, wherein the repair liquid R contains a plurality of repair material pieces R1; project at least one pulsed laser beam L onto the plurality of repair material pieces R1 through a laser projection module 3 to sinter the plurality of repair material pieces R1, and drive the plurality of repair material pieces R1 to form a conductive block C; and use the conductive block C to electrically connect the first conductive element B1 and the second conductive element B2" technical solution to increase the yield of electronic components and reduce production costs.

[0104] Furthermore, through the above technical solution, the laser repair device Z of the present application uses the repair material supply module 2 to supply the repair liquid R containing silver nanoparticles onto the local surface of the object to be repaired B, and projects different types of pulsed laser beams L onto the silver nanoparticles through the laser projection module 3 to sinter the silver nanoparticles into a conductive block C, and then uses the conductive block C to electrically connect the first conductive element B1 and the second conductive element B2 to achieve the purpose and effect of local conduction. Moreover, in the above manner, the pulsed laser beam L will not affect the polymer material or the polymer material layer B3 adjacent to the first conductive element B1 and the second conductive element B2, and the deformation of the polymer material can be avoided.

[0105] The content disclosed above is only the preferred feasible embodiment of the present application, and does not limit the protection scope of the claims of the present application. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present application are included in the protection scope of the claims of the present application.

Claims

1. A laser repair device, characterized in that, Comprising: A carrying module configured to carry at least one object to be repaired; wherein the at least one object to be repaired has a first conductive element and a second conductive element, and the first conductive element and the second conductive element are not connected to each other; A filler supply module adjacent to the carrying module, the filler supply module being configured to supply a repair liquid between the first conductive element and the second conductive element, the repair liquid containing a plurality of filler pieces; and A laser projection module adjacent to the carrying module, the laser projection module being configured to project at least one pulsed laser beam onto the plurality of filler pieces to sinter the plurality of filler pieces and drive the plurality of filler pieces to form a conductive block; Wherein the conductive block electrically connects the first conductive element and the second conductive element.

2. The laser repair device according to claim 1, characterized in that, The pulse width of the at least one pulsed laser beam is on the order of femtoseconds, 10 -15 seconds. The pulse width of the at least one pulsed laser beam is less than 500 fs. The pulse repetition frequency of the at least one pulsed laser beam is greater than 1 MHz. The wavelength of the at least one pulsed laser beam is between 980 - 1080 nm or 465 - 5650 nm. The spot size of the at least one pulsed laser beam is between 10 - 100 μm; or Wherein the pulse width of the at least one pulsed laser beam is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 - 1000 μJ; wherein the laser projection module includes: A pulsed laser generation unit for generating a laser having a plurality of pulsed signals; A laser modulation unit adjacent to the pulsed laser generation unit, the laser modulation unit being configured to increase the repetition frequency of the laser and to generate a pulsed train laser having a plurality of pulsed trains based on the increased laser; and A laser amplification unit adjacent to the laser modulation unit, the laser amplification unit being configured to increase the pulse energy of the pulsed train laser to generate the pulsed laser beam, wherein the plurality of pulsed trains include the plurality of pulsed signals, and the frequency of the plurality of pulsed signals is between 1 - 2000 KHz.

3. The laser repair device according to claim 1, characterized in that, The filler piece is a nanoparticle; wherein the laser repair device further includes: A beam adjustment module corresponding to the laser projection module, the beam adjustment module being configured to receive the at least one pulsed laser beam and to convert the at least one pulsed laser beam into a first modulated laser beam; An optical module corresponding to the beam adjustment module, the optical module being configured to receive the first modulated laser beam and to convert the first modulated laser beam into a second modulated laser beam; and A focusing module corresponding to the optical module, the focusing module being configured to receive the second modulated laser beam and to convert the second modulated laser beam into a flat-top laser beam.

4. The laser repair device according to claim 3, characterized in that, The laser repair device further includes a scanning module located between the optical module and the focusing module, the scanning module being configured to receive the second modulated laser beam and to selectively project the second modulated laser beam in at least one projection direction.

5. The laser repair device according to claim 4, characterized in that, The laser repair device further includes: An analysis module, the analysis module being connected to the laser projection module; A beam splitting module, the beam splitting module corresponding to the analysis module, the beam splitting module being configured to receive the first modulated laser beam, the second modulated laser beam, or the flat-top laser beam; and A detection module, the detection module being adjacent to the carrying module, the detection module being connected to the laser projection module, the detection module being configured to detect the heat condition of the conductive block in a manner of spectral detection, electrical detection, or fluorescence detection, so as to correspondingly generate at least one heat data, and the detection module transmitting at least one of the heat data to the laser projection module; Wherein, when the beam splitting module receives the first modulated laser beam, the beam splitting module projects a part of the first modulated laser beam onto the optical module, and projects another part of the first modulated laser beam onto the analysis module, so that the analysis module generates a first beam energy analysis signal accordingly, and the analysis module transmits the first beam energy analysis signal to the laser projection module; Wherein, when the beam splitting module receives the second modulated laser beam, the beam splitting module projects a part of the second modulated laser beam onto the scanning module, and projects another part of the second modulated laser beam onto the analysis module, so that the analysis module generates a second beam energy analysis signal accordingly, and the analysis module transmits the second beam energy analysis signal to the laser projection module; Wherein, when the beam splitting module receives the flat-top laser beam, the beam splitting module projects a part of the flat-top laser beam onto the plurality of filler components, and projects another part of the flat-top laser beam onto the analysis module, so that the analysis module generates a third beam energy analysis signal accordingly, and the analysis module transmits the third beam energy analysis signal to the laser projection module; Wherein, the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of a spot shape, a spot position, and a beam energy.

6. A laser repair method, characterized in that, Including the following steps: Carrying at least one object to be repaired through a carrying module; wherein, the at least one object to be repaired has a first conductive element and a second conductive element, and the first conductive element and the second conductive element are not connected to each other; Using a filler providing module to provide a repair liquid between the first conductive element and the second conductive element, wherein, the repair liquid includes a plurality of filler components; Projecting at least one pulsed laser beam onto the plurality of filler components through a laser projection module to sinter the plurality of filler components, so as to drive the plurality of filler components to form a conductive block; and Electrically connecting the first conductive element and the second conductive element by using the conductive block.

7. The laser repair method according to claim 6, characterized in that, The pulse width of the at least one pulsed laser beam is on the order of femtoseconds, 10 -15 seconds. The pulse width of the at least one pulsed laser beam is less than 500 fs. The pulse repetition frequency of the at least one pulsed laser beam is greater than 1 MHz. The wavelength of the at least one pulsed laser beam is between 980 - 1080 nm or 465 - 5650 nm. The spot size of the at least one pulsed laser beam is between 10 - 100 μm; or Wherein, the pulse width of the at least one pulsed laser beam is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 - 1000 μJ; wherein, in the step of providing the at least one pulsed laser beam, the following steps are further included: Generating a laser with multiple pulse signals by a pulsed laser generating unit; Using a laser modulation unit to increase the repetition frequency of the laser, and generating a pulsed train laser with multiple pulsed trains based on the laser with the increased repetition frequency; and Increasing the pulse energy of the pulsed train laser by a laser amplification unit to generate the at least one pulsed laser beam, wherein the multiple pulsed trains include the multiple pulse signals, and the frequency of the multiple pulse signals is between 1 - 2000 KHz.

8. The laser repair method according to claim 6, characterized in that, After the step of providing the repair liquid between the first conductive element and the second conductive element, the laser repair method further includes the following steps: Providing at least one pulsed laser beam through the laser projection module, wherein the pulse width of the at least one pulsed laser beam is between 50 - 500 fs, the repetition frequency of the at least one pulsed laser beam is between 0.5 - 10 GHz, and the pulse energy of the at least one pulsed laser beam is between 100 - 1000 μJ; Receiving the at least one pulsed laser beam by a beam adjustment module and converting the at least one pulsed laser beam into a first modulated laser beam; Receiving the first modulated laser beam by an optical module and converting the first modulated laser beam into a second modulated laser beam; and Receiving the second modulated laser beam by a focusing module and converting the second modulated laser beam into a flat-top laser beam projected onto the multiple filler parts.

9. The laser repair method according to claim 8, characterized in that, Before the step of receiving the second modulated laser beam by the focusing module, the laser repair method further includes the following steps: Receiving the second modulated laser beam by a scanning module and selectively projecting the second modulated laser beam in at least one projection direction.

10. The laser repair method according to claim 9, It is characterized in that Wherein After the step of generating the first modulated laser beam, the following steps are further included: Receiving the first modulated laser beam by a beam splitting module, projecting a part of the first modulated laser beam onto the optical module, and projecting another part of the first modulated laser beam onto an analysis module; and Receiving the another part of the first modulated laser beam by the analysis module, generating a first beam energy analysis signal based on it, and transmitting the first beam energy analysis signal to the laser projection module; Wherein, after the step of generating the second modulated laser beam, the following steps are further included: Receiving the second modulated laser beam by a beam splitting module, projecting a part of the second modulated laser beam onto the scanning module, and projecting another part of the second modulated laser beam onto an analysis module; and The analysis module is used to receive the other part of the second modulated laser beam, generate a second beam energy analysis signal based on this, and transmit the second beam energy analysis signal to the laser projection module; Wherein, after the step of generating the flat-top laser beam, the following steps are further included: The beam splitting module is used to receive the flat-top laser beam, project one part of the flat-top laser beam onto the plurality of feeding members, and project the other part of the flat-top laser beam onto the analysis module; and The analysis module is used to receive the other part of the flat-top laser beam, generate a third beam energy analysis signal based on this, and transmit the third beam energy analysis signal to the laser projection module; Wherein, the first beam energy analysis signal, the second beam energy analysis signal, and the third beam energy analysis signal include at least one of a spot shape, a spot position, and a beam energy; Wherein, the laser repair method further includes the following steps: The detection module is used to detect the heat absorption condition of the conductive block by means of spectral detection, electrical detection, or fluorescence detection, so as to correspondingly generate at least one heat absorption data; and The detection module is used to transmit at least one of the heat absorption data to the laser projection module.

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