Substrate corner processing device and substrate corner processing method

Abstract

An embodiment of the present invention provides a substrate corner processing apparatus, comprising: an imaging unit that obtains image information of a reference substrate and a target substrate; a control unit that sets a reference processing path of the reference substrate and a new processing path of the target substrate on the basis of the image information obtained by the imaging unit; the processing part moves along the set new processing path of the target substrate so as to process the corner part of the target substrate; the control unit calculates a first distance between an identification mark of the reference substrate and an edge from the image information of the reference substrate, and calculates a second distance between an identification mark of the target substrate and an edge from the image information of the target substrate. And setting a new processing path of the target substrate by using the first distance and the second distance.

Description

Technical Field

[0001] Embodiments of the present invention relate to a substrate corner processing apparatus and a substrate corner processing method. Background Art

[0002] In a flat panel display panel such as a liquid crystal display (LCD) panel or an organic light emitting diodes (OLED) panel, a flat substrate is used. Such a flat panel display panel is completed through the following processes: first, the substrate is cut into a predetermined size, the cut edges and corner portions are processed, and then the processed edge and corner portions are inspected.

[0003] Generally, a processing apparatus for processing the corners of a cut substrate includes a workbench and a grinding wheel. While the substrate is placed on the workbench, the grinding wheel is moved along a preset processing path to process the corners of the substrate.

[0004] However, in the prior art, when the substrate is placed on the workbench, due to the slight tolerances of each substrate, the processing path inevitably has errors. As a result, the processing start point where the grinding wheel begins to contact the substrate changes, and a tangential breaking problem occurs where the non-processed part and the processed part cannot be smoothly connected.

[0005] To prevent processing defects caused by such tangential breaking and improve the processing quality of the substrate, methods such as re-grinding the part where tangential breaking occurs in the substrate or cutting the entire edge portion of the substrate have been considered. However, in such cases, the time required for substrate processing increases, the parts lost due to processing in the substrate increase, resulting in a problem of decreased yield. Summary of the Invention

[0006] Technical Problem

[0007] Embodiments of the present invention aim to solve the above problems, and the purpose is to provide a substrate corner processing apparatus and a substrate corner processing method that can correct the tolerances of the substrate to accurately perform substrate corner processing.

[0008] However, such problems are exemplary, and the scope of the present invention is not limited thereby.

[0009] Technical Solution

[0010] An embodiment of the present invention provides a substrate corner processing device, including: a photographing unit that obtains image information of a reference substrate and a target substrate; a control unit that sets a reference processing path of the reference substrate and a new processing path of the target substrate based on the image information obtained by the photographing unit; and a processing unit that moves along the set new processing path of the target substrate to process a corner of the target substrate; wherein the control unit calculates a first distance between an identification mark and an edge of the reference substrate from the image information of the reference substrate, calculates a second distance between an identification mark and an edge of the target substrate from the image information of the target substrate, and sets the new processing path of the target substrate by using the first distance and the second distance.

[0011] Another embodiment of the present invention provides a substrate corner processing method, including: a step of confirming a first distance from an identification mark of the reference substrate to an edge adjacent in a first direction by using image information of the reference substrate; a step of setting a reference processing path of the reference substrate; a step of confirming a second distance from an identification mark of the target substrate to an edge adjacent in the first direction by using image information of the target substrate; and a step of setting a new processing path of the target substrate by using the first distance and the second distance.

[0012] Through the following drawings, claims and the description of the invention, other aspects, features and advantages other than the foregoing will become apparent.

[0013] Advantages of the Invention

[0014] The substrate corner processing device and the substrate corner processing method according to an embodiment of the present invention can calculate a tolerance value for various forms of substrates and use the calculated tolerance value to determine a processing path, thereby preventing processing defects such as tangential cracking and improving processing quality.

[0015] In addition, the processing of the substrate corner can be accurately and precisely performed, the time required for substrate corner processing can be shortened, and productivity can be improved.

[0016] In addition, the portion removed from the substrate due to processing can be minimized, thereby saving manufacturing costs.

[0017] Of course, the scope of the present invention is not limited by such effects. Description of the Drawings

[0018] Figure 1 A diagram showing a substrate corner processing device according to an embodiment of the present invention.

[0019] Figure 2 A diagram for describing a substrate corner processing method according to an embodiment of the present invention.

[0020] Figure 3 A diagram of a machining path for moving a grinding wheel section used for Figure 2 description.

[0021] Figure 4 A diagram of defects that may occur on a substrate along a machining path of a grinding wheel section used for Figure 3 description.

[0022] Figure 5 A flowchart describing a substrate corner machining method according to an embodiment of the present invention.

[0023] Figure 6 A diagram for describing a process of setting a reference machining path of a substrate corner machining method according to an embodiment of the present invention.

[0024] Figure 7 A diagram for describing a process of setting a new machining path of a substrate corner machining method according to an embodiment of the present invention.

[0025] Figure 8 A diagram for describing a process of setting a new machining path of a substrate corner machining method according to an embodiment of the present invention.

[0026] Figure 9 A diagram for describing a substrate corner machining method according to another embodiment of the present invention.

[0027] Figure 10 A diagram for describing a substrate corner machining method according to still another embodiment of the present invention. Detailed Description of the Invention

[0028] In this embodiment, various transformations can be applied. Specific embodiments will be exemplarily shown in the drawings and described in detail in the text. If reference is made to the content described in detail later together with the appended Figure 1 drawings, the effects, features, and methods for achieving them of this embodiment will become clear. However, this embodiment is not limited to the embodiments disclosed below and can be implemented in various forms.

[0029] To clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and in the entire specification, similar parts are given similar reference numerals.

[0030] In the following embodiments, unless the context clearly indicates otherwise, singular expressions include plural expressions.

[0031] In the following embodiments, terms such as "including" or "having" mean that there are features or structures described in the specification, and do not preclude the possibility of adding one or more other features or structures in advance.

[0032] In the following embodiments, when referring to a part such as a unit, region, or structure being above or on top of another part, it includes not only the case where it is immediately above the other part but also the case where there are other units, regions, structures, etc. in between. The standards of "on" and "under" are described with reference to the drawings.

[0033] In cases where a certain embodiment can be implemented differently, the specific process sequence can also be executed differently from the described sequence. For example, two consecutively described processes can be either substantially executed simultaneously or in the reverse order of the described sequence.

[0034] In the drawings, for convenience of description, the dimensions of structures may be exaggerated or reduced. For example, the dimensions and thicknesses of the structures shown in the figures are arbitrarily shown for convenience of description, and thus the following embodiments are not necessarily limited to what is shown.

[0035] Figure 1 FIG. showing a substrate corner processing apparatus 1 according to an embodiment of the present invention.

[0036] A substrate corner processing apparatus 1 according to an embodiment of the present invention is an apparatus for processing the corners of a substrate P placed on one side. The substrate corner processing apparatus 1 can be applied not only to display screens for mobile products but also to various arbitrary technical fields such as display screens for vehicles and wearable devices, and its application range is not particularly limited.

[0037] In this specification, as an example, the substrate P can be an ultra-thin glass (UTG) substrate. For example, the substrate P is generally formed in a square plate shape and basically has four side wall portions extending in a straight line and corner portions where a pair of side wall portions intersect. However, the present invention is not limited thereto, and the substrate P can be interpreted as various objects that can be processed by the substrate corner processing apparatus 1, and various shapes can be applicable.

[0038] Refer to Figure 1 According to an embodiment of the present invention, the substrate corner processing apparatus 1 may include a photographing unit 10, a processing unit 20, a processing worktable 30, and a control unit 40.

[0039] The photographing unit 10 may be disposed on one side of the substrate corner processing apparatus 1. The photographing unit 10 may photograph one surface of the substrate P placed on the processing worktable 30 to generate image information M1. The photographing unit 10 may include a camera, and the type and number of the cameras are not particularly limited.

[0040] In one embodiment, the photographing unit 10 may photograph the substrate P while moving above the substrate P and generate image information M1. At this time, the generated image information M1 may include an image of a part rather than the whole of the substrate P, but is not limited thereto.

[0041] In one embodiment, a plurality of photographing units 10 may be provided. The plurality of photographing units 10 may photograph different corner portions of each substrate P and generate image information M1.

[0042] The image information M1 generated by the photographing unit 10 may include an identification mark M on the substrate P (refer to Figure 2 ) and the position information of the corner portions of the substrate P. Among them, the identification mark M may be directly marked on the surface of the substrate P facing the photographing unit 10, and the corner portion may be a corner area including the contour line forming the outer periphery of the substrate P.

[0043] The photographing unit 10 may generate the image information M1 whenever the substrate P is replaced with a new substrate P. Specifically, the photographing unit 10 may photograph the substrate P from a preset perspective and generate the image information M1 including the identification mark and the corner portions of each substrate P. At this time, the perspective of the photographing unit 10 may be a perspective set based on the position where the identification mark of the substrate P is fixed on the processing table 30.

[0044] The photographing unit 10 may transmit the generated image information M1 to the control unit 40. The operations of the photographing unit 10, such as the timing, number of times, position, specific photographing part of the photographing unit 10 performing photographing, and the transmission and use of the image information M1 obtained through photographing, etc., may be controlled by the control unit 40.

[0045] The processing unit 20 may be arranged at a position separated from the processing table 30. The processing unit 20 may include a grinding wheel unit 21 that rotates around a rotation axis. The grinding wheel unit 21 may move along the outer periphery of the substrate P in a state of being in contact with the side wall portion of the substrate P to process the corner portions of the substrate P.

[0046] The processing unit 20 may receive the information of the processing path from the control unit 40 and move the grinding wheel unit 21 along the received processing path to process the corner portions of the substrate P. The position, rotation speed, inclination, movement speed, movement direction, movement distance, etc. of the grinding wheel unit 21 may be controlled by the control unit 40.

[0047] The processing table 30 may have a placement surface for placing the substrate P. The processing table 30 may support the substrate P when processing the substrate P. For example, the processing table 30 may include a fixing member to fix the substrate P on the placement surface and prevent the substrate P from shaking during the processing process.

[0048] In one embodiment, the processing table 30 may move in a preset direction in the state where the substrate P is placed. For example, the processing table 30 may move in a direction parallel to or perpendicular to the placement surface for placing the substrate P and can rotate around a rotation axis perpendicular to the placement surface of the processing table 30.

[0049] The operation of the fixing member for fixing the substrate P in the processing table 30, or the moving speed, rotational speed, moving direction, moving distance, etc. of the processing table 30 can be controlled by the control unit 40.

[0050] The control unit 40 can control one or more of the imaging unit 10, the processing unit 20, and the processing table 30. In addition, the control unit 40 can receive the transmitted image information M1 from the imaging unit 10 and set the processing path using the transmitted image information M1. In addition, the control unit 40 can transfer the set processing path to the processing unit 20 or the processing table 30 and control the operation of the processing unit 20 or the processing table 30 along the set processing path. The method for the control unit 40 to set the processing path will be described with reference to Figures 5 to 8 as follows.

[0051] Figure 2 FIG. is a diagram for describing a method for processing a substrate corner according to an embodiment of the present invention. Figure 3 For describing Figure 2 the processing path along which the grinding wheel unit 21 moves. Figure 4 For describing along Figure 3 the processing path of the grinding wheel unit 21, the defects that may occur on the substrate are shown in the figure.

[0052] Hereinafter, for ease of description, an embodiment in which the substrate P has a square flat shape and the substrate corner processing device only processes two corner portions C1 and C2 connected to one side wall portion of the substrate P will be mainly described. However, the present invention is not limited thereto, and the substrate corner processing device can also process all the corner portions formed on the substrate or only a part of the corner portions.

[0053] Referring to Figures 2 to 4 , according to an embodiment of the present invention, in the substrate corner processing method, after positioning the substrate P based on the identification mark M of the substrate P, the processing path GL of the substrate P can be set, and then the grinding wheel unit 21 is moved along the set processing path GL to process the corner portions C1 and C2 of the substrate P.

[0054] The processing path GL can be set as follows: the grinding wheel unit 21 moves along the side wall portion of the substrate P from the first corner portion C1 disposed on one side of the substrate P to the second corner portion C2 disposed on the other side of the substrate P.

[0055] At this time, the grinding wheel unit 21 can move along the preset processing path GL and contact the substrate P at the first location CP1, and the first location CP1 can be the processing start location. The path for the grinding wheel unit 21 to move from the outside of the substrate P to the direction of the first location CP1 can be a curved path with a predetermined curvature. Thus, unnecessary wear of the substrate P due to the contact pressure between the grinding wheel unit 21 and the substrate P can be prevented at the first location CP1.

[0056] In addition, after machining the first corner C1, the grinding wheel part 21 can move along the side wall part to the second corner C2 and machine the second corner C2. The grinding wheel part 21 that has finished machining the first corner C1 and the second corner C2 can be separated from the substrate P at a second location CP2 that is adjacently disposed to the second corner C2. The second location CP2 can become the machining end location. The path along which the grinding wheel part 21 moves in such a way as to be separated from the substrate P at the second location CP2 can have a predetermined curvature.

[0057] On the other hand, the substrate P cut by the cutting process has a tolerance, so there will be a slight difference in area. For example, when the substrate cut as shown in Figure 3 has a positive tolerance d1, a first substrate Pa with an area larger than the reference substrate Pr is formed, and when it has a negative tolerance d2, a second substrate Pb with an area smaller than the reference substrate Pr is formed.

[0058] The machining path GL set for the reference substrate Pr can be set such that, as shown in (a) of Figure 4 , the machined part and the non-machined part of the reference substrate Pr are smoothly connected. Therefore, when machining the first substrate Pa along the machining path GL set for the reference substrate Pr, the grinding wheel part 21 contacts the first substrate Pa before reaching the first location CP1, and as shown in (b) of Figure 4 , a tangential breaking phenomenon in which a depression is formed above the first location CP1 occurs.

[0059] The tangential breaking phenomenon occurring in the first substrate Pa results in an uneven circular shape of the machined first corner C1, causing a machining defect where the machining shape of the first corner C1 exceeds the preset curvature, and ultimately leading to a defective product.

[0060] On the other hand, when machining the second substrate Pb along the machining path GL set for the reference substrate Pr, after the grinding wheel part 21 passes through the first location CP1, it contacts the second substrate Pb inside the first location CP1, and as shown in (c) of Figure 4 , a tangential breaking phenomenon with a convex bending shape occurs below the first location CP1 and below the second location CP2. In addition, since the first corner C1 is not sufficiently machined, a machining defect occurs in the second substrate Pb where the chamfer of the first corner C1 is formed to be small, resulting in a defective product.

[0061] Hereinafter, with reference to Figures 5 to 8 and Figure 1 , a substrate corner machining method according to an embodiment of the present invention for solving the above problems will be described.

[0062] Figure 5 is a flowchart for describing a substrate corner machining method according to an embodiment of the present invention.Figure 6 This is a diagram for the process of setting a reference machining path for a substrate corner machining method according to an embodiment of the present invention. Figure 7 This is a diagram for the process of setting a new machining path for a substrate corner machining method according to an embodiment of the present invention. Figure 8 This is a diagram for the process of setting a new machining path for a substrate corner machining method according to an embodiment of the present invention.

[0063] Referring to Figures 5 to 8 , a substrate corner machining method according to an embodiment of the present invention may include: a step S100 of confirming a first distance from an identification mark M of a reference substrate Pr to an adjacent edge in a first direction; a step S200 of setting a reference machining path of a machining unit 20; a step S300 of confirming a second distance from an identification mark M of a target substrate Pt to an adjacent edge in the first direction based on image information M1 obtained by an imaging unit 10; and a step S400 of setting a new machining path by using the first distance and the second distance.

[0064] First, after a substrate corner machining apparatus transfers the reference substrate Pr to a machining table 30, it is positioned with the identification mark M as a reference and placed on the placement surface of the machining table 30. Herein, the reference substrate Pr, as a substrate serving as a reference for the target substrate Pt, may be a substrate having an area that is the intermediate value within the area tolerance range of the target substrate Pt, but is not limited thereto. The reference substrate Pr may also be determined according to the user's selection.

[0065] Then, the imaging unit 10 images the reference substrate Pr and generates image information M1 of the reference substrate Pr. For example, the image information M1 of the reference substrate Pr may include position information of corner portions C1, C2 and / or position information of the identification mark M marked on the reference substrate Pr.

[0066] Specifically, the imaging unit 10 may image the first corner portion C1 and the adjacent identification mark M together to obtain a first image V1, and may image the second corner portion C2 and the adjacent identification mark M together to obtain a second image V2. However, the present invention is not limited thereto, and the imaging unit 10 may also image the corner portions C1, C2 from a perspective that does not include the identification mark M to obtain the first image V1 and the second image V2.

[0067] The first image V1 and the second image V2 may constitute the image information M1 of the reference substrate Pr. The imaging unit 10 may transmit the generated image information M1 of the reference substrate Pr to the control unit 40.

[0068] Then, the control unit 40 calculates the first distance S100 by using the obtained image information M1 of the reference substrate Pr.

[0069] The first distance may be the distance from a preset reference point to an adjacent edge in the first direction in the reference substrate Pr. Herein, the first direction may be the direction (e.g., the y-axis direction) separating the first side portion E1 and the second side portion E2 that are connected to the processed corner portions C1, C2 and face each other in the reference substrate Pr.

[0070] In one embodiment, the reference point may be the identification mark M, but is not limited thereto. For the sake of convenience of description hereinafter, the case where the identification mark M is set as the reference point will be mainly described.

[0071] The first distance may be calculated corresponding to the corner portions C1, C2 processed by the substrate corner processing device respectively. Specifically, the control unit 40 may use the first image V1 to obtain the position information of the identification mark M adjacent to the first corner portion C1 and the position information of the first side portion E1 adjacent in the first direction (y-axis direction), and calculate the 1-1 distance A0 between the identification mark M and the first side portion E1.

[0072] In addition, the control unit 40 may use the second image V2 to obtain the position information of the identification mark M adjacent to the second corner portion C2 and the position information of the second side portion E2 adjacent in the first direction (y-axis direction), and calculate the 1-2 distance B0 between the identification mark M and the second side portion E2.

[0073] Then, the control unit 40 sets the reference processing path GL of the reference substrate Pr.

[0074] The reference processing path GL set by the control unit 40 may include a first location CP1 and a second location CP2. Herein, the first location CP1 and the second location CP2 may be the location where the grinding wheel starts to process or the location where the processing ends in the reference substrate Pr. At this time, the moving direction of the grinding wheel is not limited to Figure 2 the shown content, and it may also move in the opposite direction of the shown direction.

[0075] In one embodiment, the first location CP1 may be set to be adjacent to the first corner portion C1 on the first side portion E1, and the second location CP2 may be set to be adjacent to the second corner portion C2 on the second side portion E2. However, the present invention is not limited thereto, and the processing start point and the processing end point may be changed as needed. For the sake of convenience of description hereinafter, the technical concept of the present invention will be mainly described with the embodiment where the first location CP1 is set as the processing start point on the first side portion E1 and the second location CP2 is set as the processing end point on the second side portion E2. The processing path deformation examples corresponding to the change of the processing start point and the processing end point will be referred to Figure 9 and Figure 10 hereinafter for description.

[0076] The reference machining path GL may further include a curved path along which the grinding wheel moves before and after the first location CP1 and the second location CP2. Additionally, the reference machining path GL may further include a straight path along the side wall portion connecting the first corner C1 and the second corner C2.

[0077] Specifically, the reference machining path GL may further include a first curved path for gently bringing the grinding wheel into contact with the reference substrate Pr. The first curved path may connect from the first location CP1 to the outside of the reference substrate Pr. Additionally, the reference machining path GL may include a second curved path that is connected to the first curved path and is configured to machine the circular shape of the first corner C1. At this time, the first curved path and the second curved path can be bent in opposite directions with respect to the first location CP1.

[0078] In one embodiment, the reference machining path GL may be set to machine all of the first corner C1, the second corner C2, and the side wall portion connecting the first corner C1 and the second corner C2 in the reference substrate Pr. As another embodiment, the reference machining path GL may be set to machine the first corner C1 and the second corner C2 in the reference substrate Pr, but not machine the side wall portion connecting the first corner C1 and the second corner C2.

[0079] Then, the substrate corner machining device may remove the reference substrate Pr from the machining table 30, transfer the target substrate Pt onto the machining table 30, and then perform positioning based on the identification mark M to place it on the placement surface of the machining table 30. Here, the target substrate Pt refers to the substrate on which actual machining is performed using the substrate corner machining device.

[0080] Then, the imaging unit 10 images the target substrate Pt and generates image information M1 of the target substrate Pt. The image information M1 of the target substrate Pt may include the position information of the corners C1 and C2 of the target substrate Pt and / or the position information of the identification mark M marked on the target substrate Pt.

[0081] For example, the imaging unit 10 may image the first corner C1 of the target substrate Pt and the adjacent identification mark M together to obtain a third image V3, and may image the second corner C2 of the target substrate Pt and the adjacent identification mark M together to obtain a fourth image V4. However, the present invention is not limited thereto, and the imaging unit 10 may also image the corners C1 and C2 of the target substrate Pt from a perspective that does not include the identification mark M to obtain the third image V3 and the fourth image V4. The imaging unit 10 may image the corners C1 and C2 from the same perspective as the first image V1 and the second image V2 to obtain the third image V3 and the fourth image V4, but is not limited thereto.

[0082] The third image V3 and the fourth image V4 can form the image information M1 of the target substrate Pt. The photographing unit 10 can transmit the generated image information M1 of the target substrate Pt to the control unit 40.

[0083] Then, the control unit 40 calculates the second distance S300 based on the received image information M1 of the target substrate Pt.

[0084] The second distance can be the distance from a preset reference point to an adjacent edge in the first direction (y-axis direction) in the target substrate Pt. Among them, the preset reference point can be the identification mark M, but it is not limited thereto. The second distance can be calculated corresponding to the corners C1 and C2 processed by the substrate corner processing device respectively.

[0085] Specifically, the control unit 40 can use the third image V3 to obtain the position information of the identification mark M adjacent to the first corner C1 in the target substrate Pt and the position information of the first side E1 adjacent in the first direction (y-axis direction), and calculate the 2-1 distance A1 between the identification mark M and the first side E1.

[0086] In addition, the control unit 40 can use the fourth image V4 to obtain the position information of the identification mark M adjacent to the second corner C2 and the position information of the second side E2 adjacent in the first direction (y-axis direction), and calculate the 2-2 distance B1 between the identification mark M and the second side E2.

[0087] Then, the control unit 40 sets a new processing path GL S400 using the first distance and the second distance.

[0088] Specifically, the control unit 40 can compare the 1-1 distance A0 and the 2-1 distance A1 on the first corner C1 side to calculate the first tolerance a. In addition, the control unit 40 can compare the 1-2 distance B0 and the 2-2 distance B1 on the second corner C2 side to calculate the second tolerance b. The first tolerance a and the second tolerance b calculated by the control unit 40 can be the tolerance values for the target substrate Pt to deviate from the reference substrate Pr to both sides in the first direction (y-axis direction).

[0089] The control unit 40 can set a new processing path GL based on the first tolerance a and the second tolerance b. That is, the control unit 40 can set the first coordinate R1 for starting the processing of the target substrate Pt by moving the first location CP1 in the first direction by the first tolerance a, and set the second coordinate R2 for ending the processing of the target substrate Pt by moving the second location CP2 in the first direction by the second tolerance b.

[0090] At this time, the first coordinate R1 can be set to be adjacent to the first corner C1 on the first side E1 of the target substrate Pt, and the second coordinate R2 can be set to be adjacent to the second corner C2 on the second side E2 of the target substrate Pt.

[0091] The new machining path GL set for the target substrate Pt may include a curved path in which the grinding wheel moves back and forth between the first coordinate R1 and the second coordinate R2. For example, the new machining path GL may include a third curved path for approaching the target substrate Pt side by the grinding wheel, and may include a fourth curved path for machining the first corner C1 of the target substrate Pt.

[0092] The third curved path may have the same curvature as the first curved path of the reference machining path GL. That is, although the target substrate Pt has a different area from the reference substrate Pr, the grinding wheel may move along the third curved path having the same curvature as the first curved path of the reference machining path GL to contact the target substrate Pt.

[0093] In addition, the fourth curved path may have the same curvature as the second curved path of the reference machining path GL. Therefore, the first corner C1 of the target substrate Pt may have the same cross-sectional shape as the first corner C1 of the reference substrate Pr. The substrate processing apparatus according to an embodiment of the present invention may perform processing as follows, that is, the target substrate Pt having various tolerances has the same first corner C1 shape.

[0094] In addition, the curved path formed before and after the end coordinate R2 of the target substrate Pt may also have the same curvature as the curved path formed before and after the second location CP2 of the reference substrate Pr, and the plurality of target substrates Pt may all have the same second corner C2 shape.

[0095] As Figure 7 shown in (a) of, when the target substrate Pt has an area larger than that of the reference substrate Pr (that is, when it has a positive tolerance), the control unit 40 may calculate the values of the first tolerance a and the second tolerance b as positive values. At this time, as Figure 7 shown in (b) of, the first coordinate R1 may move the first tolerance a in the first direction from the first location CP1 to the outside of the target substrate Pt, and the second coordinate R2 may move the second tolerance b in the first direction from the second location CP2 to the outside of the target substrate Pt.

[0096] In addition, as Figure 8 shown in (a) of, when the target substrate Pt has an area smaller than that of the reference substrate Pr (that is, when it has a negative tolerance), the control unit 40 may calculate the values of the first tolerance a and the second tolerance b as negative values. At this time, as Figure 8 shown in (b) of, the first coordinate R1 may move the first tolerance a in the first direction from the first location CP1 to the inside of the target substrate Pt, and the second coordinate R2 may move the second tolerance b in the first direction from the second location CP2 to the inside of the target substrate Pt.

[0097] Therefore, the control unit 40 can set a processing path along which the processing unit moves from when the grinding wheel approaches the target substrate Pt until it separates from the target substrate Pt, and can prevent processing defects such as tangential cracking from occurring around the first coordinate R1 and the second coordinate R2 of the target substrate Pt, that is, around the processing start point and the processing end point.

[0098] On the other hand, the above-described embodiment mainly describes the case where the first coordinate R1 as the processing start point is set on the first side portion E1 and the second coordinate R2 as the processing end point is set on the second side portion E2 to process the first corner portion C1 and the second corner portion C2 of the target substrate Pt. However, it is not limited thereto. When the first coordinate R1 and the second coordinate R2 are adjacently set with a corner portion therebetween, the present invention can of course be applied.

[0099] Figure 9 FIG. is a diagram for describing a substrate corner processing method according to another embodiment of the present invention.

[0100] Compared with Figures 5 to 8 the substrate corner processing method according to the embodiment described in Figure 9 the difference in the substrate corner processing method according to the embodiment shown is that a third location CP3 and a fourth location CP4 are further set on the third side portion E3 of the reference substrate Pr, and a third coordinate R3 and a fourth coordinate R4 are further set on the third side portion E3 of the target substrate Pt. Therefore, the following description will focus on the above differences, and repeated descriptions will be omitted.

[0101] Referring to Figure 9 , according to another embodiment of the present invention, a substrate corner processing method can set a plurality of new processing paths GL1, GL2 for the target substrate Pt. The new processing paths GL1, GL2 can be processing paths for processing the first corner portion C1 and the second corner portion C2 of the target substrate Pt respectively. In addition, the new processing paths GL1, GL2 can be processing paths that start or end processing on the third side portion E3 of the target substrate Pt.

[0102] First, the control unit 40 can obtain the image information of the first corner portion C1 of the reference substrate Pr and set a reference processing path for processing the first corner portion C1. The reference processing path can include a first location CP1 set on the first side portion E1 and a third location CP3 set on the third side portion E3. The first location CP1 and the third location CP3 can be the processing start point or the processing end point for processing the first corner portion C1 in the reference substrate Pr respectively.

[0103] Then, the control unit 40 can obtain the image information of the first corner portion C1 of the target substrate Pt and calculate a first tolerance a. At this time, the first tolerance a can be the distance by which the first side portion E1 of the target substrate Pt is separated from the first side portion E1 of the reference substrate Pr in the first direction (y-axis direction).

[0104] Then, the control unit 40 can set the first coordinate R1 and the third coordinate R3 from the positions of the first location CP1 and the third location CP3 by using the first tolerance a. At this time, the first coordinate R1 can be moved by the first tolerance a in the first direction from the first location CP1 and set on the first side portion E1 of the target substrate Pt, and the third coordinate R3 can be moved by the first tolerance a in the first direction from the third location CP3 and set on the third side portion E3 of the target substrate Pt.

[0105] Then, the control unit 40 can set a first new machining path GL1 passing through the first coordinate R1 and the third coordinate R3. The first new machining path GL1 can include a curved path connecting between the first coordinate R1 and the third coordinate R3, and can also include a curved path connecting from the first coordinate R1 to the outside of the target substrate Pt and a curved path connecting from the third coordinate R3 to the outside of the target substrate Pt.

[0106] At this time, the control unit 40 can set the moving direction of the grinding wheel unit 21 moving along the first new machining path GL1 to set the machining direction of the first corner C1. For example, the control unit 40 can set the machining direction as follows, that is, the grinding wheel unit 21 moves from the first coordinate R1 along the direction toward the third coordinate R3, that is, in the counterclockwise direction, or set the machining direction as follows, that is, the grinding wheel unit 21 moves from the third coordinate R3 along the direction toward the first coordinate R1, that is, in the clockwise direction.

[0107] On the other hand, the control unit 40 can obtain the image information of the second corner C2 of the reference substrate Pr and set a reference machining path for machining the second corner C2. The reference machining path can include a second location CP3 set on the second side portion E2 and a fourth location CP4 set on the third side portion E3.

[0108] Then, the control unit 40 can obtain the image information of the second corner C2 of the target substrate Pt and calculate the second tolerance b. At this time, the second tolerance b can be a tolerance in the direction opposite to the first tolerance a. For example, the second tolerance b can be the distance by which the second side portion E2 of the target substrate Pt is separated from the second side portion E2 of the reference substrate Pr in the first direction (y-axis direction).

[0109] Then, the control unit 40 can set the second coordinate R2 and the fourth coordinate R4 from the positions of the second location CP2 and the fourth location CP4 by using the second tolerance b, and set a second new machining path GL2 passing through the second coordinate R2 and the fourth coordinate R4. The second coordinate R2 can be moved by the second tolerance b in the first direction from the second location CP2 and set on the second side portion E2 of the target substrate Pt, and the fourth coordinate R4 can be moved by the second tolerance b in the first direction from the fourth location CP4 and set on the third side portion E3 of the target substrate Pt.

[0110] The second new machining path GL2 may include a curved path connecting the second coordinate R2 and the fourth coordinate R4, and may further include a curved path connecting from the second coordinate R2 to the outside of the target substrate Pt and a curved path connecting from the fourth coordinate R4 to the outside of the target substrate Pt.

[0111] The control unit 40 may set the moving direction of the grinding wheel unit 21 moving along the second new machining path GL2 to set the machining direction of the second corner C1. For example, the control unit 40 may set the machining direction as follows, that is, the grinding wheel unit 21 moves from the second coordinate R2 along the direction toward the fourth coordinate R4, that is, in the clockwise direction, or may set the machining direction as follows, that is, the grinding wheel unit 21 moves from the fourth coordinate R4 along the direction toward the second coordinate R2, that is, in the counterclockwise direction.

[0112] That is, the control unit 40 may set new machining paths for the plurality of corners C1, C2 included in the target substrate Pt respectively. At this time, the machining directions of the grinding wheel unit 21 for machining each of the corners C1, C2 may be the same as each other or may be different from each other.

[0113] In addition, the control unit 40 may set the machining order of each of the corners C1, C2. For example, the control unit 40 may set the machining order as follows, that is, after machining the first corner C1, the second corner C2 is machined, or may set the machining order as follows, that is, after machining the second corner C2, the first corner C1 is machined.

[0114] Figure 10 It is a diagram for describing a substrate corner machining method according to still another embodiment of the present invention.

[0115] Compared with Figure 9 the substrate corner machining method according to the embodiment described in Figure 10 the difference in the substrate corner machining method according to the embodiment shown is that the target substrate Pt has a third tolerance c in the second direction (x-axis direction) with respect to the reference substrate Pr, and thus each of the coordinates R1, R2, R3, R4 set on the target substrate Pt moves not only in the first direction but also in the second direction from each of the locations CP1, CP2, CP3, CP4. Therefore, the following description will be centered on the above difference, and repeated descriptions will be omitted.

[0116] Referring to Figure 10 according to a substrate corner machining method of still another embodiment of the present invention, the control unit 40 may first obtain a first distance from the reference point to each side to be machined by using the image information of the first corner C1' and the second corner C2' of the reference substrate Pr photographed by the photographing unit 10.

[0117] Among them, the first distance may include a 1-1 distance from the first reference point to the first edge E1', a 1-2 distance from the second reference point to the second edge E2', and a 1-3 distance from the third reference point to the third edge E3'. The first reference point, the second reference point, and the third reference point may be preset reference points, and may be reference points set identically for the reference substrate Pr and the target substrate Pt. Additionally, the 1-1 distance and the 1-2 distance may be distances in the first direction (y-axis direction), and the 1-3 distance may be a distance in a second direction (e.g., x-axis direction) that intersects the first direction.

[0118] Then, the control unit 40 may set a first reference machining path for machining the first corner C1' and a second reference machining path for machining the second corner C2' for the reference substrate Pr. The first reference machining path may include a first location CP1 and a third location CP3 corresponding to the machining start point or the machining end point of the first corner C1', and the second reference machining path may include a second location CP2 and a fourth location CP4 corresponding to the machining start point or the machining end point of the second corner C2'.

[0119] Then, the control unit 40 may obtain the second distance from the reference point to each edge using the image information of the first corner C1 and the second corner C2 of the target substrate Pt captured by the imaging unit 10. For example, the control unit 40 may obtain a 2-1 distance from the first reference point to the first edge E1, a 2-2 distance from the second reference point to the second edge E2, and a 2-3 distance from the third reference point to the third edge E3. Among them, the 2-1 distance and the 2-2 distance may be distances in the first direction (y-axis direction), and the 2-3 distance may be a distance in the second direction (x-axis direction).

[0120] Then, the control unit 40 may compare the first distance with the second distance, and calculate a first tolerance a of the first edge E1, a second tolerance b of the second edge E2, and a third tolerance c of the third edge E3. The first tolerance a, the second tolerance b, and the third tolerance c may each have a positive value or a negative value.

[0121] Then, the control unit 40 may use the first tolerance a and the third tolerance c to set a first new machining path GL1 for the first corner C1. Specifically, the control unit 40 may move the first location CP1 in the first direction by the first tolerance a and in the second direction by the third tolerance c, set a first coordinate R1 on the first edge E1, move the third location CP3 in the first direction by the first tolerance a and in the second direction by the third tolerance c, and set a third coordinate R3 on the third edge E3. The first new machining path GL1 may include a curved path connecting the first coordinate R1 and the third coordinate R3, a curved path connecting from the first coordinate R1 to the outside of the target substrate Pt, and a curved path connecting from the third coordinate R3 to the outside of the target substrate Pt.

[0122] In addition, the control unit 40 can use the second tolerance b and the third tolerance c to set a second new machining path GL2 for the second corner C2. Specifically, the control unit 40 can move the second location CP2 and the fourth location CP4 along the first direction by the second tolerance b and along the second direction by the third tolerance c, set a second coordinate R2 on the second side E2, and set a fourth coordinate R4 on the third side E3. The second new machining path GL2 can include a curved path connecting the second coordinate R2 and the fourth coordinate R4, a curved path connecting from the second coordinate R2 to the outside of the target substrate Pt, and a curved path connecting from the fourth coordinate R4 to the outside of the target substrate Pt.

[0123] As described above, the control unit 40 can calculate the tolerances in the first direction and the second direction that the target substrate Pt has with respect to the reference substrate Pr, and set a new machining path to which each tolerance is applicable.

[0124] As described above, in the embodiment of the present invention, when only a part of the substrate edge needs to be machined, the machining start point and the machining end point with the substrate tolerance value corrected can be quickly set, and a precise and accurate machining path can be set so that no tangential breakage occurs in the substrate.

[0125] Therefore, the embodiment of the present invention can provide a substrate corner machining device and method that can avoid machining defects such as tangential breakage, improve the machining quality, and save machining time and machining costs.

[0126] As described above, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary. Those skilled in the relevant technical field will understand that various deformations and variations of the embodiments can be made therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical concept of the appended claims.

[0127] Reference numerals

[0128] 1: Substrate corner machining device

[0129] 10: Photographing unit

[0130] 20: Machining unit

[0131] 21: Grinding wheel unit

[0132] 30: Machining workbench

[0133] 40: Control unit

[0134] P: Substrate

Claims

1. A substrate corner processing device, comprising: A photographing unit, wherein the photographing unit obtains image information of a reference substrate and a target substrate; a control unit, wherein the control unit sets a reference processing path of the reference substrate and a new processing path of the target substrate based on the image information obtained by the imaging unit; and a processing unit, wherein the processing unit moves along a set new processing path of the target substrate to process a corner of the target substrate; Wherein, the control unit calculates a first distance between an identification mark and an edge of the reference substrate from the image information of the reference substrate, calculates a second distance between an identification mark and an edge of the target substrate from the image information of the target substrate, and uses the first distance and the second distance to set a new processing path for the target substrate.

2. The substrate corner processing device according to claim 1, wherein: The reference processing path includes a first location where processing begins on the reference substrate, The new processing path includes a starting coordinate for starting processing on the target substrate, The starting coordinate is separated from the first location by a predetermined distance along a first direction.

3. A substrate corner processing method, comprising: The step of confirming a first distance from an identification mark of the reference substrate to an edge adjacent to the reference substrate in a first direction by using image information of the reference substrate; The step of setting a reference processing path of the reference substrate; The step of using the image information of the target substrate to confirm a second distance from the identification mark of the target substrate to an edge adjacent to the first direction; and The step of setting a new processing path for the target substrate by using the first distance and the second distance.

4. The substrate corner processing method according to claim 3, wherein: The step of setting the reference processing path comprises: The step of setting a first location on the reference substrate for starting processing; and The step of setting a second location on the reference substrate where processing is to be completed.

5. The substrate corner processing method according to claim 4, wherein: The step of setting a new processing path includes: a step of comparing the first distance and the second distance to calculate a tolerance value; The step of setting a starting coordinate for starting processing on the target substrate based on the tolerance value; and The step of setting end coordinates for ending processing on the target substrate based on the tolerance value.

6. The substrate corner processing method according to claim 5, wherein: The starting coordinates are spaced from the first location along the first direction.

7. The substrate corner processing method according to claim 5, wherein: The end coordinates are spaced from the second location along the first direction.

8. The substrate corner processing method according to claim 3, wherein: The reference processing path includes a first curved path connected from a first location where processing is started on the reference substrate to an outer side of the reference substrate.

9. The substrate corner processing method according to claim 8, wherein: The reference machining path includes a second curved path connected from the first location to the inner side of the reference substrate, The second curved path is curved in a direction opposite to the direction in which the first curved path is curved, with the first location as a reference.

10. The substrate corner processing method according to claim 8, wherein: The new processing path includes a third curved path connected from the starting coordinates for starting processing on the target substrate to the outside of the target substrate, The third curvilinear path has the same curvature as the first curvilinear path.

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