Substrate processing apparatus and method

Abstract

The present invention relates to a substrate processing apparatus and method, and the substrate processing apparatus may comprise: a polishing pad supporting part for supporting a polishing pad on which a polishing film is formed, the polishing film polishing and cleaning foreign matter attached to a probe pin of a probe card; a polishing pad transfer device capable of loading a new polishing pad to the polishing pad support part or unloading an old polishing pad; and a buffer module capable of accommodating the new polishing pad or the old polishing pad.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and method, and more particularly, to a substrate processing apparatus and method capable of automatically replacing a polishing pad. Background Art

[0002] Semiconductor elements such as integrated circuit elements can generally be formed by repeatedly performing a series of processing steps on a substrate such as a silicon wafer.

[0003] For example, by repeatedly performing a deposition process of forming a film on a substrate, an etching process for forming the film into a pattern having electrical characteristics, an ion implantation process or a diffusion process for implanting or diffusing impurities into the pattern, a cleaning and rinsing process for removing impurities from the substrate on which the pattern is formed, etc., the semiconductor element can be formed on the substrate.

[0004] In addition, after forming the semiconductor element as described above, an electrical inspection process for inspecting the electrical characteristics of the semiconductor element can be performed.

[0005] The inspection process can be performed by an inspection device such as a probe test station using a probe card having a plurality of probe pins (probes). Summary of the Invention

[0006] Technical Problem

[0007] In the past, the probe pins formed on the probe card were contaminated by various foreign substances during contact with the pads of the semiconductor elements formed on the substrate.

[0008] In order to remove such foreign substances on the probe pins that hinder electrical contact, in the past, the operator opened the door of the equipment and manually installed one by one the polishing film for cleaning the probe pins or the polishing pad attached with the polishing film inside the equipment, which was cumbersome such as being repeated many times a day.

[0009] However, in the past polishing pad replacement method relying on manual work, the working hours of the replacement operation such as the operator opening the door of the equipment, taking out the old polishing pad, and installing the new polishing pads one by one at a ratio of 1:1 are greatly increased, so that the time and labor consumed by the replacement operation are greatly wasted, and the operation of the equipment needs to be interrupted during the replacement operation, so the wasted time increases and the productivity of the equipment is greatly reduced, and it is difficult to match various specifications of polishing pads for probe pins of different shapes of manufacturing companies, and due to replacing with unmatched polishing pads, errors may occur, component breakage may occur, or cleaning may be insufficient, thus various forms of human errors such as poor contact between the probe pins and the substrate may occur.

[0010] The present invention aims to solve multiple problems including the problems described above, and aims to provide a substrate processing apparatus and method capable of automating the operation of loading and unloading a polishing pad from a buffer module to a polishing pad support portion. However, such technical problems are exemplary cases, and the scope of the present invention is not limited thereto.

[0011] Solution

[0012] The substrate processing apparatus according to the concept of the present invention for solving the above technical problems may include: a polishing pad support portion on which a polishing pad is formed, the polishing pad having a polishing film formed thereon, the polishing film polishing foreign substances attached to probe pins of a probe card for cleaning; a polishing pad transfer device capable of loading a new polishing pad onto the polishing pad support portion or unloading an old polishing pad; and a buffer module capable of accommodating the new polishing pad or the old polishing pad.

[0013] In addition, according to the present invention, the polishing pad may include: a pad body formed in an overall rectangular plate shape, and having the polishing film in contact with the probe pins formed on an upper surface thereof; and a horizontal hole portion formed in the pad body to allow at least a part of a transfer arm of the polishing pad transfer device to be inserted therethrough.

[0014] In addition, according to the present invention, the polishing pad may be a fully penetrating type polishing pad in which the horizontal hole portion is formed from a front surface to a rear surface, so that a front end portion of the transfer arm of the polishing pad transfer device can completely penetrate the pad body and be exposed to the outside.

[0015] In addition, according to the present invention, the polishing pad support portion may include: a support pin formed to support the polishing pad; a lifting table formed to surround the support pin and configured to be able to relatively descend with the support pin as a reference so that the support pin can relatively ascend and be exposed to the outside; and a lifting device for relatively lifting the lifting table.

[0016] In addition, according to the present invention, the lifting device may include: a nut member formed on the lifting table; a screw threadedly connected to the nut member; a conveyor belt wound around a driven roller and a driving roller formed on a rotation shaft of the screw to transmit the rotational force of the driving roller to the driven roller; and a first motor for rotating the driving roller.

[0017] In addition, according to the present invention, the polishing pad transfer device may include: a transfer arm capable of carrying the polishing pad and configured to be able to move forward and backward; a transfer arm forward and backward device for moving the transfer arm forward and backward; a turntable supporting the transfer arm forward and backward device and configured to be able to rotate; a lifting device for lifting the turntable; and a rotation device for rotating the turntable.

[0018] In addition, according to the present invention, a locking table that engages with the rear surface of the polishing pad may be formed at the front end of the transfer arm that completely penetrates the pad body and is exposed to the outside.

[0019] In addition, according to the present invention, the transfer arm forward and backward device may include: a forward and backward track formed on the turntable in the forward and backward direction to be able to guide the movable stage formed on the transfer arm; a conveyor belt, one side of which is fixed to the movable stage and the other side of which is wound around at least one driven roller and a driving roller and rotates along the track; and a second motor that rotates the driving roller.

[0020] In addition, according to the present invention, the polishing pad transfer device may further include: a robotic arm formed below or above the transfer arm and supporting a substrate inspected by a probe pin of a probe card; and a robotic arm forward and backward device that moves the robotic arm forward and backward.

[0021] In addition, according to the present invention, the turntable may be composed of an upper turntable and a lower turntable that can be additionally provided, so that a transfer arm can be additionally provided above an existing robotic arm that transfers the substrate. The transfer arm is formed on the upper turntable, and the robotic arm is formed on the lower turntable.

[0022] In addition, according to the present invention, the buffer module may include: a buffer frame formed with a convex portion to temporarily accommodate a plurality of the polishing pads in a stacked manner with a space therebetween in the vertical direction; an alignment block formed on the convex portion and formed with an alignment guide convex portion to be able to insert into an alignment guide groove portion formed on the lower surface of the polishing pad; and a position adjustment block that adjusts the front, rear, left, and right positions of the alignment block.

[0023] In addition, according to the present invention, the buffer module may form a substrate accommodation portion in the buffer frame to be able to temporarily accommodate at least one substrate together with the polishing pad.

[0024] In addition, according to the present invention, the polishing pad may be a partially penetrating type polishing pad in which the horizontal hole portion is formed from the front surface until before reaching the rear surface, so that the front end portion of the transfer arm of the polishing pad transfer device can partially penetrate the pad body and be located inside.

[0025] In addition, according to the present invention, a coupling protrusion may be formed at the front end portion of the transfer arm, and a coupling groove portion that engages with the coupling protrusion when the transfer arm ascends may be formed on the ceiling surface of the inner surface of the horizontal hole portion of the polishing pad.

[0026] In addition, according to the present invention, the transfer arm may be in a shape bifurcated into two forks.

[0027] Further, according to the present invention, the polishing pad support portion may be an integrated support portion that also supports a substrate together with the polishing pad.

[0028] Further, according to the present invention, the polishing pad transfer device may be an integrated transfer device that also transfers a substrate together with the polishing pad.

[0029] Further, according to the present invention, the polishing pad may form an identification portion at least in part so as to be able to display inherent information on an identification device or transmit the inherent information to the identification device.

[0030] On the other hand, a substrate processing method according to the concept of the present invention for solving the above technical problem may include: (a) a step of rotating a transfer arm of a polishing pad transfer device toward a buffer module; (b) a step of advancing the transfer arm to penetrate a horizontal hole portion of a polishing pad temporarily accommodated in the buffer module; (c) a step of raising the transfer arm so that a locking table formed at a front end portion of the transfer arm can be engaged with the polishing pad; (d) a step of retracting the transfer arm carrying the polishing pad; (e) a step of rotating the transfer arm together with the polishing pad toward a polishing pad support portion; (f) a step of advancing the transfer arm to transfer the polishing pad above the polishing pad support portion; and (g) a step of lowering the transfer arm to load the polishing pad on the polishing pad support portion and then retracting only the transfer arm to return to the polishing pad transfer device.

[0031] On the other hand, a substrate processing apparatus according to the concept of the present invention for solving the above technical problem may include: a polishing pad support portion formed with a polishing pad having a polishing film thereon, the polishing film for polishing foreign matter attached to probe pins of a probe card for cleaning; a polishing pad transfer device capable of loading a new polishing pad onto the polishing pad support portion or unloading an old polishing pad; and a buffer module capable of accommodating the new polishing pad or the old polishing pad. The polishing pad includes: a pad body formed in an overall rectangular plate shape and having the polishing film in contact with the probe pins formed on an upper surface thereof; and a horizontal hole portion formed in the pad body to allow at least a part of a transfer arm of the polishing pad transfer device to be inserted therethrough. The polishing pad is a full-through type polishing pad in which the horizontal hole portion is formed from a front surface to a rear surface so that a front end portion of the transfer arm of the polishing pad transfer device can completely penetrate through the pad body and be exposed to the outside. The polishing pad support portion includes: a support pin formed to support the polishing pad; a lifting table formed to surround the support pin and capable of relatively descending with respect to the support pin so that the support pin can relatively rise and be exposed to the outside; and a lifting device for relatively lifting the lifting table. The polishing pad transfer device includes: a transfer arm capable of carrying the polishing pad and formed to be able to move forward and backward; a transfer arm forward and backward device for moving the transfer arm forward and backward; a turntable supporting the transfer arm forward and backward device and formed to be able to rotate; a lifting device for lifting the turntable; and a rotation device for rotating the turntable. The transfer arm is formed with a locking table at a front end portion that completely penetrates through the pad body and is exposed to the outside for engaging with a rear surface of the polishing pad. The buffer module includes: a buffer frame formed with a protrusion portion for temporarily accommodating a plurality of the polishing pads in a stacked manner in a vertical direction with the plurality of polishing pads spaced apart from each other; an alignment block formed on the protrusion portion and having an alignment guide protrusion portion for being inserted into an alignment guide groove portion formed on a lower surface of the polishing pad; and a position adjustment block for adjusting the front, rear, left, and right positions of the alignment block.

[0032] Advantageous Effects

[0033] According to multiple embodiments of the present invention configured as described above, a transfer arm can be simply added above an existing robot arm for transferring a substrate, thereby automating the operation of loading and unloading a polishing pad from a buffer module to a polishing pad support portion. A fully penetrating polishing pad or a partially penetrating polishing pad can be used to greatly enhance rigidity and durability. Through this, unmanned operation and remote equipment operation can be achieved. The polishing pad can be automatically loaded and unloaded at the polishing pad support portion without interrupting the equipment, thereby greatly saving the time and labor consumed in the replacement operation, reducing the wasted time and greatly improving the productivity of the equipment. The inherent information of the polishing pad can be identified, so that various specifications of polishing pads can be accurately matched to the probe pins with different forms according to different manufacturing companies to replace the polishing pad. The position of the polishing pad can be accurately and precisely aligned to prevent replacement errors. Existing substrate logistics lines such as a polishing pad support portion, a polishing pad transfer device, or a buffer module and the logistics line of the polishing pad can be adopted together, thereby improving space utilization. Various forms of human errors can be prevented, and the reliability and stability of the equipment can be improved. Thus, the contact success rate of the probe pins can be increased. The number of polishing pads that can be stored in the buffer module can be adjusted, thereby having the effect of meeting the various requirements of all customers. Of course, the scope of the present invention is not limited to such effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 FIG. is a side cross-sectional view schematically showing a substrate processing apparatus according to some embodiments of the present invention.

[0035] Figures 2 to 8 step by step shows Figure 1 the operation process of the substrate processing apparatus in a side cross-sectional view.

[0036] Figure 9 FIG. is a side cross-sectional view schematically showing a substrate processing apparatus according to other embodiments of the present invention.

[0037] Figure 10 shows Figure 9 a perspective view of an example of the substrate processing apparatus.

[0038] Figure 11 shows Figure 9 a perspective view of an example of the polishing pad of the substrate processing apparatus.

[0039] Figure 12 shows Figure 11 a top cross-sectional view showing the transfer state of the polishing pad of the substrate processing apparatus.

[0040] Figure 13 shows Figure 12 a top cross-sectional view of another example of the polishing pad of the substrate processing apparatus.

[0041] Figure 14 is a longitudinal sectional view showing the lowered state of the transfer arm of the polishing pad. Figure 13

[0042] Figure 15 is a longitudinal sectional view showing the raised state of the transfer arm of the polishing pad. Figure 13

[0043] Figure 16 is a plan view showing the layout of the substrate processing apparatus according to still other embodiments of the present invention.

[0044] Figure 17 is a flowchart showing a substrate processing method according to some embodiments of the present invention.

[0045] Description of Reference Numerals

[0046] C: probe card

[0047] P: probe pin

[0048] F: polishing film

[0049] 1: polishing pad

[0050] 1a: pad body

[0051] 1b: horizontal hole portion

[0052] 1c: engaging groove portion

[0053] 1d: identification portion

[0054] H: alignment guide groove portion

[0055] 1-1: fully penetrating polishing pad

[0056] 1-2: partially penetrating polishing pad

[0057] 10: polishing pad support portion

[0058] 11: support pin

[0059] 12: lifting table

[0060] 13: lifting device

[0061] 131: nut member

[0062] 132: screw

[0063] 133: conveyor belt

[0064] 134: driven roller

[0065] 135: driving roller

[0066] M1: first motor

[0067] 20: Grinding pad transfer device

[0068] 21: Transfer arm

[0069] 21a: Locking platform

[0070] B: Coupling protrusion

[0071] 21b: Movable platform

[0072] 22: Transfer arm forward and backward device

[0073] 221: Forward and backward track

[0074] 222: Conveyor belt

[0075] 223: Driven roller

[0076] 224: Driving roller

[0077] M2: Second motor

[0078] 23: Turntable

[0079] 231: Upper turntable

[0080] 232: Lower turntable

[0081] 24: Lifting device

[0082] 25: Rotating device

[0083] 26: Robot arm

[0084] 27: Robot arm forward and backward device

[0085] 30: Buffer module

[0086] 31: Buffer frame

[0087] 31a: Protrusion part

[0088] 32: Alignment block

[0089] T: Alignment guide protrusion part

[0090] 33: Position adjustment block

[0091] 34: Substrate accommodating part

[0092] 40: Control unit

[0093] 100, 200, 300: Substrate processing device Detailed implementation manners

[0094] Hereinafter, a plurality of preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0095] Embodiments of the present invention are provided to more fully explain the present invention to those with ordinary knowledge in the technical field. In the following embodiments, it can be deformed in many other ways, and the scope of the present invention is not limited to the following embodiments. Instead, these embodiments are provided to make the present disclosure more fully complete and to fully convey the concept of the present invention to those skilled in the art. In addition, in the drawings, for convenience and clarity of illustration, the thickness or size of each layer is exaggerated.

[0096] The terms used in this specification are used to describe specific embodiments and do not limit the present invention. As used in this specification, unless otherwise specified in the context, the singular form may include the plural form. In addition, when used in this specification, "comprise" and / or "comprising" specify the existence of the mentioned shapes, numbers, steps, operations, components, elements, and / or combinations thereof, and do not exclude the existence or addition of one or more other shapes, numbers, operations, elements, and / or combinations.

[0097] Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the drawings, for example, according to manufacturing techniques and / or tolerances, deformations of the illustrated shapes can be anticipated. Therefore, embodiments of the present invention concept should include, for example, shape changes caused by manufacturing, and should not be construed as limited to the specific shapes of the regions illustrated in this specification.

[0098] Figure 1 is a side cross-sectional view schematically showing a substrate processing apparatus 100 according to some embodiments of the present invention.

[0099] First, as Figure 1 shown, a substrate processing apparatus 100 according to some embodiments of the present invention generally may include a polishing pad support portion 10, a polishing pad transfer device 20, a buffer module 30, and a control unit 40.

[0100] For example, the polishing pad support portion 10 may be a device that supports a polishing pad 1, and a polishing film F is formed on the polishing pad 1. The polishing film F polishes foreign substances on the probe pins P attached to the probe card C for cleaning.

[0101] Here, for example, the probe card C may be a component for inspecting the electrical characteristics of semiconductor elements formed on a substrate S (refer to Figure 9 and Figure 10 ), and the probe pin P may be a kind of probe or needle shape that can contact the semiconductor elements of the substrate S.

[0102] However, such a probe card C or probe pins P are not limited to the drawings and can be manufactured in a very diverse variety and shape according to the specifications of the manufacturing company or the customer company, etc.

[0103] In addition, for example, the substrate S may be a wafer having semiconductor elements formed on its upper surface. However, the substrate S is not necessarily limited to a wafer, and all substrates of very diverse types and forms such as various display substrates or substrates for light-emitting elements such as laser substrates, or printed circuit boards or glass substrates can be applied.

[0104] For example, as Figure 1 shown, the polishing pad 1 may include: a pad body 1a formed in an overall rectangular plate, polygonal plate or disc shape, and having a polishing film F in contact with the probe pins P formed on its upper surface; and a horizontal hole portion 1b formed in the pad body 1a to allow at least a part of the transfer arm 21 of the polishing pad transfer device 20 to be inserted.

[0105] More specifically, for example, as Figure 1 shown, the polishing pad 1 may be a fully-through type polishing pad 1-1 in which the horizontal hole portion 1b is formed from the front surface to the rear surface, so that the front end portion of the transfer arm 21 of the polishing pad transfer device 20 can completely penetrate the pad body 1a and be exposed to the outside.

[0106] Compared with a solid rectangular plate shape of the same size without the horizontal hole portion 1b and being hard, such a hollow type fully-through polishing pad 1-1 has greatly increased strength and durability, so that not only can the sagging phenomenon or deformation phenomenon be prevented, but also the weight equivalent to the area of the horizontal hole portion 1b can be reduced, thereby achieving weight reduction.

[0107] In addition, since the transfer can be performed in a state where the transfer arm 21 completely penetrates the polishing pad 1, the transfer can be performed very stably and firmly without shaking, and the detachment or dropping phenomenon of the polishing pad 1 can be prevented, thereby greatly improving the reliability and stability of the equipment.

[0108] However, such a polishing pad 1 is not limited to the drawings, and all polishing pads of very diverse forms and shapes with a polishing film F attached to their upper surfaces can be used.

[0109] More specifically, for example, as Figure 1 shown, the polishing pad support portion 10 may include: a support pin 11 formed to support the polishing pad 1; a lifting table 12 formed in a shape surrounding the support pin 11 and formed to be able to relatively descend with the support pin 11 as a reference so that the support pin 11 can relatively rise and be exposed to the outside; and a lifting device 13 for relatively lifting the lifting table 12.

[0110] Here, for example, the lifting device 13 may include: a nut member 131 formed on the lifting table 12; a screw 132 threadedly connected to the nut member 131; a conveyor belt 133 wound around a driven roller 134 and a driving roller 135 formed on the rotating shaft of the screw 132 to transmit the rotational force of the driving roller 135 to the driven roller 134; and a first motor M1 that rotates the driving roller 135.

[0111] Therefore, the polishing pad support portion 10 can raise the support pin 11 relative to receive the polishing pad 1 from the transfer arm 21, and if the polishing pad 1 is placed, the lifting table 12 can rise relative to support the polishing pad 1.

[0112] However, such a lifting device 13 is not limited to the drawings, and in addition, various forward and backward devices such as a combination of a wire and a pulley, a combination of a sprocket and a worm wheel, a combination of a screw and a nut member, a gear combination, a linear motor, and a cylinder can be applied.

[0113] For example, the polishing pad transfer device 20 may be a polishing pad replacement device capable of loading a new polishing pad 1 onto the polishing pad support portion 10 or unloading an old polishing pad 1.

[0114] More specifically, for example, the polishing pad transfer device 20 may include: a transfer arm 21 capable of carrying the polishing pad 1 and formed to be able to move forward and backward; a transfer arm forward and backward device 22 capable of moving the transfer arm 21 forward and backward; a turntable 23 that supports the transfer arm forward and backward device 22 and is formed to be able to rotate; a lifting device 24 that raises and lowers the turntable 23; and a rotating device 25 that rotates the turntable 23.

[0115] Therefore, the transfer arm 21 can rotate and move forward and backward in the direction of the polishing pad support portion 10 or the buffer module 30 described later through the transfer arm forward and backward device 22, and can rise to be able to carry the polishing pad 1, and can lower to be able to place the polishing pad 1.

[0116] In addition, the transfer arm 21 may form a locking table 21a that engages with the rear surface of the polishing pad 1 at the front end portion that completely penetrates the pad body 1a and is exposed to the outside.

[0117] Therefore, the transfer arm 21 can pass through the horizontal hole portion 1b of the polishing pad 1 or disengage from the horizontal hole portion 1b in the lowered state, and can be engaged with the polishing pad 1 through the locking table 21a in the raised state to safely transfer the polishing pad 1.

[0118] Such a locking table 21a is not limited to the drawings, and can be formed not only in a straight shape, but also in a very diverse shape such as an inclined shape, an arch shape, or a cross shape, thereby also performing a function of aligning the polishing pad 1.

[0119] For example, the buffer module 30 can be a part that can accommodate a new polishing pad 1 or an old polishing pad 1.

[0120] For example, the buffer module 30 can be applicable to all storage structures in a very diverse form that can accommodate the polishing pad 1.

[0121] That is, the buffer module 30 can be applicable to all containers or racks of very diverse types and shapes such as various cassette shapes, magazine shapes, FOUP (Front Open Unified Pod) shapes, or FOSB (Front Opening Shipping Box) shapes, etc., so as to be able to accommodate a plurality of polishing pads 1.

[0122] For example, the control unit 40 can be various electronic control devices such as a microprocessor, semiconductor chip, integrated circuit, central processing unit, arithmetic device, computer, server computer, smart tablet, smart phone, smart device, electronic device, a program processing device capable of processing a series of programs, or a storage device storing a program, etc., that can apply a control signal to the polishing pad support portion 10 and the polishing pad transfer device 20.

[0123] Figures 2 to 8 It is a side sectional view showing Figure 1 the operation process of the substrate processing apparatus 100 step by step.

[0124] As Figures 2 to 8 shown, if the operation process of the substrate processing apparatus 100 according to some embodiments of the present invention is shown step by step, first, as Figure 2 shown, the transfer arm 21 of the polishing pad transfer device 20 can rotate toward the buffer module 30. At this time, the transfer arm 21 can be in a retracted state in the idle state so as not to interfere with the rotation.

[0125] Next, as Figure 3 shown, the transfer arm 21 can advance and penetrate the horizontal hole portion 1b of the polishing pad 1 temporarily accommodated in the buffer module 30. At this time, the transfer arm 21 can be in a relatively lowered state so as not to collide with the polishing pad 1.

[0126] Next, as Figure 4 shown, the transfer arm 21 can rise so that the locking table 21a formed at the front end of the transfer arm 21 can be engaged with the polishing pad 1. At this time, by the rising transfer arm 21, the polishing pad 1 can be engaged with the transfer arm 21 and be picked up from the buffer module 30 to become free.

[0127] Next, as Figure 5 shown, the transfer arm 21 carrying the polishing pad 1 can retract in a direction away from the buffer module 30.

[0128] Next, as Figure 6 shown, the transfer arm 21 can rotate together with the polishing pad 1 toward the polishing pad support portion 10.

[0129] Next, as Figure 7 shown, the transfer arm 21 can advance to transfer the polishing pad 1 above the polishing pad support portion 10.

[0130] Next, as Figure 8 shown, after the transfer arm 21 descends to load the polishing pad 1 onto the polishing pad support portion 10, only the transfer arm 21 retreats and returns to the polishing pad transfer device 20.

[0131] Therefore, according to the present invention, it is possible to automate the polishing pad replacement operation of loading and unloading the polishing pad 1 from the buffer module 30 to the polishing pad support portion 10, and the all-through type polishing pad 1-1 can be used to greatly enhance the rigidity and durability. Through this, unmanned operation and remote equipment operation can be achieved, and the polishing pad can be automatically loaded and unloaded on the polishing pad support portion 10 without interrupting the equipment, thereby greatly saving the time and labor required for the replacement operation and reducing the wasted time and greatly improving the productivity of the equipment.

[0132] Figure 9 FIG. is a side cross-sectional view schematically showing a substrate processing apparatus 200 according to other embodiments of the present invention.

[0133] As Figure 9 shown, the polishing pad transfer device 20 of the substrate processing apparatus 200 according to other embodiments of the present invention may further include: a robotic arm 26 formed below or above the transfer arm 21 and supporting a substrate S inspected by a probe pin P of a probe card C; and a robotic arm forward and backward device 27 that moves the robotic arm 26 forward and backward.

[0134] Here, the turntable 23 may be composed of an upper turntable 231 and a lower turntable 232 that can be additionally provided, so that the transfer arm 21 can be simply additionally provided above the existing robotic arm 26 for transferring the substrate S. At least one or more transfer arms 21 may be formed on the upper turntable 231, and at least one or more robotic arms 26 may be formed on the lower turntable 232.

[0135] However, in addition to this, the transfer arm 21 and the robotic arm 26 can be arranged in a very diverse form. For example, the transfer arm 21 is formed on the lower turntable 232, or the robotic arm 26 is formed on the upper turntable 231, the transfer arms 21 are formed in multiple layers, the robotic arms 26 are formed in multiple layers, etc.

[0136] Therefore, if a polishing pad transfer device 20 that can transfer not only such a polishing pad 1 but also a substrate S is used, the substrate S can be transferred together with the polishing pad 1.

[0137] Here, the polishing pad support portion 10 can be an integrated support portion that also supports the substrate S together with the polishing pad 1, the polishing pad transfer device 20 can be an integrated transfer device that also transfers the substrate S together with the polishing pad 1, and the buffer module 30 can form a substrate accommodation portion 34 in the buffer frame 31 so as to be able to temporarily accommodate at least one substrate S together with the polishing pad 1.

[0138] Therefore, existing substrate logistics lines and polishing pad logistics lines such as the polishing pad support portion 10, the polishing pad transfer device 20, or the buffer module 30 can be adopted together, thereby greatly improving the space utilization rate of the equipment.

[0139] Figure 10 is a perspective view showing Figure 9 an example of a substrate processing apparatus 200, Figure 11 is a perspective view showing Figure 9 an example of the polishing pad 1 of the substrate processing apparatus 200, Figure 12 is a top cross-sectional view showing Figure 11 the transfer state of the polishing pad 1 of the substrate processing apparatus 200.

[0140] As Figure 10 shown, for example, the transfer arm forward and backward device 22 of the substrate processing apparatus 200 according to some other embodiments of the present invention may include: a forward and backward track 221 formed on the turntable 23 in the forward and backward direction to be able to guide the movable table 21b formed on the transfer arm 21; a conveyor belt 222, one side of which is fixed to the movable table 21b and the other side of which is wound around at least one driven roller 223 and a driving roller 224 and rotates along the track; and a second motor M2 that rotates the driving roller 224.

[0141] Therefore, if the second motor M2 rotates the driving roller 224 forward or backward, one side of the conveyor belt 222 can move forward or backward. When the movable table 21b fixed to one side of the conveyor belt 222 moves forward or backward, the transfer arm 21 can move forward or backward, and the transfer arm 21 can rotate through the turntable 23.

[0142] However, such a transfer arm forward and backward device 22 is not limited to the drawings. In addition, various forward and backward devices such as a combination of a wire and a pulley, a combination of a sprocket and a helical wheel, a combination of a screw and a nut member, a gear combination, a linear motor, and a cylinder can be applied.

[0143] For example, as Figure 10As shown, the buffer module 30 may include: a buffer frame 31 formed with a protrusion 31a to temporarily accommodate a plurality of polishing pads 1 in a stacked manner with a space therebetween in the vertical direction; an alignment block 32 formed on the protrusion 31a and formed with an alignment guide protrusion T to be inserted into an alignment guide groove H formed on the lower surface of the polishing pad 1; and a position adjustment block 33 for adjusting the front, rear, left, and right positions of the alignment block 32.

[0144] Here, for example, as Figure 10 shown, the buffer module 30 may form a substrate accommodation part 34 in the buffer frame 31 to be able to temporarily accommodate at least one substrate S together with the polishing pad 1.

[0145] Therefore, when the polishing pad 1 is placed on the buffer frame 31, it can be naturally aligned by the alignment guide protrusion T of the alignment block 32, and there may be two or more alignment blocks 32 arranged in the diagonal direction.

[0146] Here, for example, as Figure 11 and Figure 12 shown, the polishing pad 1 may be a full-through type polishing pad 1-1 in which a horizontal hole part 1b is formed from the front surface to the rear surface, so that the front end part of the transfer arm 21 of the polishing pad transfer device 20 can completely penetrate the pad body 1a and be exposed to the outside.

[0147] In addition, the transfer arm 21 may form a locking table 21a at the front end part that is completely penetrated through the pad body 1a and exposed to the outside and is engaged with the rear surface of the polishing pad 1.

[0148] Here, for example, as Figure 11 shown, the polishing pad 1 may form an identification part 1d at least in part to be able to display inherent information on an identification device or transmit inherent information to the identification device.

[0149] Therefore, after the locking table 21a at the front end part of the transfer arm 21 completely penetrates the horizontal hole part 1b, if the transfer arm 21 rises, it is engaged with the rear side surface of the polishing pad 1 and stably transferred, and the inherent information such as the usage amount, replacement time, specification, manufacturing company, or matching probe card information of the polishing pad 1 can be confirmed using the identification part 1d and applied to the equipment.

[0150] Figure 13 is a top view cross-sectional view showing another example of the polishing pad 1 of the substrate processing apparatus 200 shown in Figure 12 , and Figure 14 is a longitudinal cross-sectional view showing the lowered state of the transfer arm of the polishing pad 1 shown in Figure 13 , and Figure 15 is a longitudinal cross-sectional view showing the raised state of the transfer arm of the polishing pad 1 shown in Figure 13 .

[0151] As Figures 13 to 15 shown, as another example of the polishing pad 1 of the substrate processing apparatus 200, for example, the polishing pad 1 may be a partially penetrating polishing pad 1-2 in which the horizontal hole portion 1b is formed from the front surface to before reaching the rear surface, so that the front end portion of the transfer arm 21 of the polishing pad transfer device 20 can partially penetrate the pad body 1a and be located inside.

[0152] As such a partially hollow type of partially penetrating polishing pad 1-2 is also much greater in strength and durability compared to a solid rectangular plate shape of the same size without the horizontal hole portion 1b and being solid, so that not only can the sagging phenomenon or deformation phenomenon be prevented, but also the weight corresponding to the area of the horizontal hole portion 1b can be reduced, thereby enabling weight reduction.

[0153] A coupling projection B may be formed at the front end portion of the transfer arm 21, and a coupling groove portion 1c that engages with the coupling projection B when the transfer arm 21 rises may be formed on the ceiling surface of the inner surface of the horizontal hole portion 1b of the polishing pad 1.

[0154] Here, for example, when the transfer arm 21 is formed in a shape bifurcated into two in a two-fork manner, the horizontal hole portion 1b may also be formed in two to correspond to the transfer arm 21.

[0155] Therefore, as Figure 14 shown, after the transfer arm 21 is inserted into the horizontal hole portion 1b, as Figure 15 shown, the transfer arm 21 rises, so that the coupling projection B formed at the front end portion of the transfer arm 21 engages with the coupling groove portion 1c formed inside the polishing pad 1, thereby enabling the polishing pad 1 to be stably transferred.

[0156] Therefore, according to the present invention, by simply adding a transfer arm 21 above the existing robot arm 26 for transferring the substrate S, the operation of loading and unloading the polishing pad 1 from the buffer module 30 to the polishing pad support portion 10 can be automated. By using a fully penetrating polishing pad 1-1 or a partially penetrating polishing pad 1-2, the rigidity and durability can be greatly enhanced. Through this, unmanned operation and remote equipment operation can be achieved. The polishing pad 1 can be automatically loaded and unloaded at the polishing pad support portion 10 without interrupting the equipment, thereby greatly saving the time and labor consumed in the replacement operation, reducing the wasted time and greatly improving the productivity of the equipment. The inherent information of the polishing pad 1 can be identified, so that various specifications of polishing pads can be accurately matched with the probe pins of different manufacturing companies to replace the polishing pad. The position of the polishing pad 1 can be accurately and precisely aligned to prevent replacement errors. The existing substrate logistics line and the polishing pad logistics line such as the polishing pad support portion 10, the polishing pad transfer device 20 or the buffer module 30 can be adopted together, thereby improving the space utilization rate. Various types of human errors can be prevented, and the reliability and stability of the equipment can be improved. Thus, the contact success rate of the probe pin P can be improved. The number of polishing pads that can be stored in the buffer module 30 can be adjusted to meet the various requirements of all customers.

[0157] Figure 16 FIG. 4 is a plan view showing a substrate processing apparatus 300 according to still other embodiments of the present invention.

[0158] As Figure 16 shown, in addition to the above-described polishing pad support portion 10, polishing pad transfer device 20, buffer module 30, and control unit 40, the substrate processing apparatus 300 according to still other embodiments of the present invention may further include a substrate support portion 70, a test head 60, a modulator 50, and a load port module 80 provided on the main body 90.

[0159] For example, the main body 90 may be an inspection chamber in which an accommodation space is formed inside to accommodate the substrate S. The accommodation space is not only formed as a clean environment, but also the air pressure, temperature, humidity, etc. can be controlled during other inspections.

[0160] Here, the substrate S may be a wafer having semiconductor elements formed on its upper surface. However, the substrate S is not limited to a wafer, and all very diverse types and forms of substrates such as light-emitting element substrates for various display substrates or laser substrates, or printed circuit boards or glass substrates can be applied.

[0161] In addition, the main body 90 is not limited to the drawings, and all very diverse types and forms of inspection chambers can be used according to the requirements of the customer company or the installation environment, etc.

[0162] For example, the substrate support portion 70 is a component formed on the main body 90 to support the substrate S. More specifically, for example, the substrate support portion 70 may include: a lift pin 71 formed to support the substrate S when loading the substrate; a substrate chuck 72 formed in a shape surrounding the lift pin 71, and when the lift pin 71 descends relatively, the substrate chuck 72 supports the substrate S; and a lifting device 73 formed on the moving stage 14 and configured to lift and lower the lift pin 71 relatively.

[0163] Therefore, in the substrate support portion 70, when the substrate S is loaded on the lift pin 71 by the transfer module described later, the lift pin 71 descends relatively, so that the substrate chuck 72 vacuum-adsorbs or electrostatically adsorbs the substrate S to firmly fix the substrate S, enabling inspection by the probe card C.

[0164] For example, the test head 60 may be a component that is docked and coupled to the main body 90 through a plurality of spring pins or an interface board or the like to be electrically connected to the probe card C, and can transmit various electrical signals required for inspection to the probe card C and receive the response signals thereto to perform electrical inspection.

[0165] For example, the modulator 50 is a component that rotates the test head 60 around the horizontal rotation axis 51 to dock or undock the main body 90 and the test head 60. In addition to the rotation method, all docking devices of very diverse methods can be applied.

[0166] As described above, the polishing pad support portion 10 may be a device formed on the main body 90 to support the polishing pad 1. The polishing pad 1 is formed with a polishing film F, and the polishing film F polishes the foreign matter attached to the probe pin P for cleaning.

[0167] More specifically, for example, the polishing pad support portion 10 may include: a support pin 11 formed to support the polishing pad 1 when replacing the polishing pad; a lifting table 12 formed in a shape surrounding the support pin 11 and configured to descend relatively with the support pin 11 as a reference to enable the support pin 11 to rise relatively and be exposed to the outside when replacing the polishing pad; a lifting device 13 for lifting and lowering the lifting table 12; and a moving stage 14 for moving the lifting table 12 along the first track R1 from the polishing pad replacement area to the probe card corresponding area.

[0168] Here, the substrate support portion 70 may be arranged side by side with the moving stage 14 so that when the moving stage 14 moves to the probe card corresponding area, the substrate support portion 70 and the moving stage 14 can move from the probe card corresponding area to the waiting area simultaneously.

[0169] Therefore, the substrate support portion 70 can be located in the probe card corresponding area to perform the substrate inspection process of electrically contacting the probe pin P and the substrate S.

[0170] For example, the polishing pad transfer device 20 can be a device capable of loading a new polishing pad 1 onto the polishing pad support portion 10 and unloading the old polishing pad 1.

[0171] For example, the polishing pad transfer device 20 can be formed on the main body 90, and when replacing the polishing pad, unload the old polishing pad 1 from the polishing pad support portion 10 or load the new polishing pad 1 onto the polishing pad support portion 10.

[0172] For example, the polishing pad transfer device 20 can include: a transfer arm 21 formed to be capable of carrying the polishing pad 1 and capable of extending and contracting; a turntable 23 that swings and rotates the transfer arm 21; a lifting device 24 that lifts and lowers the turntable 23; and a rotating device 25 that moves the turntable 23 or the lifting device 24 along the second track R2.

[0173] Here, the transfer arm 21 can be additionally provided above the existing robot arm 26 that transports the substrate S.

[0174] For example, the load port module 80 can be a module formed on the main body 90 and placing a container 2 containing a plurality of polishing pads 1 or a container 2 containing a plurality of substrates S.

[0175] The load port module 80 can be a load port module for polishing pads that can only place a polishing pad container containing the polishing pad 1, or a load port module for substrates that can only place a substrate container containing the substrate S, or an integrated load port module that can place all of them together.

[0176] In addition, the load port module 80 is not limited to the drawings, and all kinds of loaders such as a dual loader that can place two or more containers for processing can be applied.

[0177] For example, the buffer module 30 can be a module formed on the main body 90 and temporarily accommodating the polishing pad 1, and can store a plurality of polishing pads 1 in advance to extend the cycle time of equipment management.

[0178] Therefore, according to the present invention, by simply additionally providing the transfer arm 21 above the existing robot arm 26 that transfers the substrate S, it can be very easily applied to the existing equipment, and thereby the cost of purchasing additional equipment can be greatly saved.

[0179] Figure 17 It is a flowchart showing a substrate processing method according to some embodiments of the present invention.

[0180] As Figures 1 to 17As shown, a substrate processing method according to some embodiments of the present invention may include: (a) a step of rotating a transfer arm 21 of a polishing pad transfer device 20 toward a buffer module 30; (b) a step of advancing the transfer arm 21 to penetrate a horizontal hole portion 1b of a polishing pad 1 temporarily accommodated in the buffer module 30; (c) a step of raising the transfer arm 21 so that a locking table 21a formed at a front end portion of the transfer arm 21 can be engaged with the polishing pad 1; (d) a step of retracting the transfer arm 21 carrying the polishing pad 1; (e) a step of rotating the transfer arm 21 together with the polishing pad 1 toward a polishing pad support portion 10; (f) a step of advancing the transfer arm 21 to transfer the polishing pad 1 above the polishing pad support portion 10; and (g) a step of lowering the transfer arm 21 to load the polishing pad 1 on the polishing pad support portion 10, and then only retracting the transfer arm 21 and returning it to the polishing pad transfer device 20.

[0181] Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, this is merely an exemplary case, and those of ordinary skill in the art will understand that various modifications and equivalent other embodiments can be made therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical concept of the appended claims.

Claims

1. A substrate processing device, comprising: A polishing pad support portion is formed with a polishing pad, and the polishing pad is formed with a polishing film, and the polishing film polishes and cleans foreign matter attached to the probe pins of the probe card; a polishing pad transfer device capable of loading a new polishing pad onto the polishing pad support portion or unloading an old polishing pad; as well as The buffer module can accommodate the new polishing pad or the old polishing pad.

2. The substrate processing apparatus according to claim 1, wherein: The polishing pad comprises: a pad body formed in a rectangular plate shape as a whole and having the polishing film formed on an upper surface thereof to contact the probe pin; and A horizontal hole is formed in the pad body so that at least a portion of a transfer arm of the polishing pad transfer device can be inserted therein.

3. The substrate processing apparatus according to claim 2, wherein: The polishing pad is a fully through-type polishing pad in which the horizontal hole portion is formed from the front surface to the rear surface so that the front end portion of the transfer arm of the polishing pad transfer device can completely pass through the pad body and be exposed to the outside.

4. The substrate processing apparatus according to claim 1, wherein: The polishing pad supporting portion comprises: a support pin formed to support the polishing pad; a lifting platform formed in a shape surrounding the support pin and formed to be able to be relatively lowered with respect to the support pin so as to be able to relatively raise the support pin and expose it to the outside; and The lifting device enables the lifting platform to rise and fall relatively.

5. The substrate processing apparatus according to claim 4, wherein: The lifting device comprises: A nut component formed on the lifting platform; A screw, threadedly connected to the nut component; a conveyor belt wound around a driven roller and a driving roller formed on a rotating shaft of the screw to transmit a rotational force of the driving roller to the driven roller; and The first motor rotates the driving roller.

6. The substrate processing apparatus according to claim 1, wherein: The polishing pad transfer device comprises: A transfer arm capable of carrying the polishing pad and formed to be able to move forward and backward; A transfer arm forward and backward device, which enables the transfer arm to move forward and backward; A turntable, supporting the transfer arm forward and backward movement device, and formed to be rotatable; A lifting device for lifting and lowering the turntable; and The rotating device rotates the turntable.

7. The substrate processing apparatus according to claim 6, wherein: The transfer arm has a locking platform formed at a front end portion that completely passes through the pad body and is exposed to the outside and is engaged with a rear surface of the polishing pad.

8. The substrate processing apparatus according to claim 6, wherein: The transfer arm forward and backward device comprises: A forward and backward track is formed on the turntable in the forward and backward direction so as to guide the movable table formed on the transfer arm; A conveyor belt, one side of which is fixed to the movable table, and the other side of which is wound around at least one driven roller and a driving roller to rotate along the track; and The second motor rotates the driving roller.

9. The substrate processing apparatus according to claim 6, wherein: The polishing pad transfer device also includes: a robot arm formed below or above the transfer arm and supporting a substrate to be inspected using probe pins of a probe card; and The mechanical arm forward and backward device enables the mechanical arm to move forward and backward.

10. The substrate processing apparatus according to claim 9, wherein: The turntable is composed of an upper turntable and a lower turntable that can be additionally installed, so that the transfer arm can be additionally installed above the existing robot arm that transfers the substrate. The transfer arm is formed on the upper turntable, The mechanical arm is formed on the lower turntable.

11. The substrate processing apparatus according to claim 1, wherein: The buffer module comprises: a buffer frame formed with a protrusion to temporarily accommodate the plurality of polishing pads in a stacked manner in an up-and-down direction so that the plurality of polishing pads are spaced apart from each other; an alignment block formed on the protruding portion and having an alignment guide protruding portion so as to be insertable into an alignment guide groove portion formed on a lower surface of the polishing pad; and The position adjustment block is used to adjust the front, back, left and right positions of the alignment block.

12. The substrate processing apparatus according to claim 11, wherein: The buffer module forms a substrate receiving portion on the buffer frame to temporarily receive at least one substrate together with the polishing pad.

13. The substrate processing apparatus according to claim 2, wherein: The polishing pad is a partially through-type polishing pad in which the horizontal hole is formed from the front surface to before reaching the rear surface, so that the front end of the transfer arm of the polishing pad transfer device can partially penetrate the pad body and be located inside.

14. The substrate processing apparatus according to claim 13, wherein: A coupling protrusion is formed at the front end of the transfer arm. A coupling groove portion that couples with the coupling protrusion when the transfer arm is raised is formed on a ceiling surface of the inner surface of the horizontal hole portion of the polishing pad.

15. The substrate processing apparatus according to claim 6, wherein: The transfer arm is a two-fork type formed in a shape that is forked into two.

16. The substrate processing apparatus according to claim 1, wherein: The polishing pad support portion is an integrated support portion that supports a substrate together with the polishing pad.

17. The substrate processing apparatus according to claim 1, wherein: The polishing pad transfer device is an integrated transfer device that transfers the substrate together with the polishing pad.

18. The substrate processing apparatus according to claim 1, wherein: The polishing pad has an identification portion formed on at least a portion thereof so that unique information can be displayed on an identification device or transmitted to the identification device.

19. A substrate processing method, comprising: (a) a step of rotating a transfer arm of a polishing pad transfer device toward a buffer module; (b) the transfer arm moves forward to penetrate the horizontal hole portion of the polishing pad temporarily accommodated in the buffer module; (c) the transfer arm is raised so that a stopper formed at a front end of the transfer arm can engage with the polishing pad; (d) the step of retreating the transfer arm carrying the polishing pad; (e) the step of rotating the transfer arm together with the polishing pad toward the polishing pad support portion; (f) the step of moving the transfer arm forward to transfer the polishing pad to above the polishing pad support portion; as well as (g) After the transfer arm is lowered to place the polishing pad on the polishing pad support portion, only the transfer arm is moved backward to return to the polishing pad transfer device.

20. A substrate processing device, comprising: A polishing pad support portion is formed with a polishing pad, and the polishing pad is formed with a polishing film, and the polishing film polishes and cleans foreign matter attached to the probe pins of the probe card; a polishing pad transfer device capable of loading a new polishing pad onto the polishing pad support portion or unloading an old polishing pad; as well as A buffer module is capable of accommodating the new polishing pad or the old polishing pad, The polishing pad comprises: a pad body formed in a rectangular plate shape as a whole and having the polishing film formed on an upper surface thereof to contact the probe pin; and a horizontal hole portion formed in the pad body so as to allow at least a portion of a transfer arm of the polishing pad transfer device to be inserted therein; The polishing pad is a fully through-type polishing pad in which the horizontal hole portion is formed from the front surface to the rear surface, so that the front end portion of the transfer arm of the polishing pad transfer device can completely pass through the pad body and be exposed to the outside. The polishing pad supporting portion comprises: a support pin formed to support the polishing pad; a lifting platform formed in a shape surrounding the support pin and formed to be able to be relatively lowered with respect to the support pin so as to be able to relatively raise the support pin and expose it to the outside; and A lifting device is used to make the lifting platform rise and fall relatively. The polishing pad transfer device comprises: A transfer arm capable of carrying the polishing pad and formed to be able to move forward and backward; A transfer arm forward and backward device, which enables the transfer arm to move forward and backward; A turntable, supporting the transfer arm forward and backward movement device, and formed to be rotatable; A lifting device for lifting and lowering the turntable; and A rotating device is provided to rotate the turntable. The transfer arm has a stopper formed at the front end portion thereof which completely passes through the pad body and is exposed to the outside and is engaged with the rear surface of the polishing pad. The buffer module comprises: a buffer frame formed with a protrusion to temporarily accommodate the plurality of polishing pads in a stacked manner in an up-and-down direction so that the plurality of polishing pads are spaced apart from each other; an alignment block formed on the protruding portion and having an alignment guide protruding portion so as to be insertable into an alignment guide groove portion formed on a lower surface of the polishing pad; and The position adjustment block is used to adjust the front, back, left and right positions of the alignment block.

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