Air cooling device, air cooling method and semiconductor equipment

Abstract

The invention belongs to the technical field of semiconductor equipment, and discloses an air cooling device, an air cooling method and semiconductor equipment. The air cooling device comprises an upper cover, a partition plate and a base, the partition plate and the upper cover are connected to define an air inlet flow channel and an air outlet flow channel which are isolated from each other, a heat transfer space is defined between the base and the partition plate, the air inlet flow channel and the air outlet flow channel are communicated with the heat transfer space, and cooling gas can flow into the heat transfer space through the air inlet flow channel. And after absorbing heat, the air flows out through the air outlet flow channel. According to the air cooling device, inflow and outflow of cooling gas can be achieved through the air inlet flow channel and the air outlet flow channel respectively, efficient utilization of the cooling gas is achieved, high heat exchange efficiency and a uniform heat dissipation effect are achieved, parts on the cavity cover are prevented from being damaged by high temperature in the reaction process, and the service life of the cavity cover is prolonged. And the failure rate and the maintenance cost of the semiconductor equipment can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to an air-cooling device, an air-cooling method and a semiconductor equipment. Background Art

[0002] In existing semiconductor equipment, various components such as pipes and sensors are often arranged on the cavity cover of the reaction chamber to control the atmosphere and temperature inside the chamber. However, during the reaction process, the high temperature inside the chamber will be transferred to the cavity cover, resulting in a relatively high overall temperature of the cavity cover, which is likely to cause high-temperature damage to various components arranged on the cavity cover, is not conducive to ensuring the normal progress of the reaction, and also increases the failure rate and maintenance cost of the semiconductor equipment.

[0003] Therefore, there is an urgent need for an air-cooling device, an air-cooling method and a semiconductor equipment to solve the above technical problems. Summary of the Invention

[0004] The first object of the present invention is to provide an air-cooling device capable of cooling the cavity cover and avoiding high-temperature damage to the components on the cavity cover.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] The air-cooling device includes:

[0007] An upper cover provided with an air inlet and an air outlet;

[0008] A partition connected to the upper cover to define an isolated air inlet flow channel and an air outlet flow channel. The air inlet is directly communicated with the air inlet flow channel, and the air outlet is directly communicated with the air outlet flow channel;

[0009] A base connected to the side of the partition away from the upper cover. The base can be thermally connected to the cavity cover, and a heat transfer space is defined between the base and the partition. The air inlet flow channel and the air outlet flow channel are respectively communicated with the heat transfer space. The cooling gas can flow from the air inlet through the air inlet flow channel into the heat transfer space and flow out through the air outlet flow channel after absorbing heat.

[0010] Preferably, an installation channel is provided through the air-cooling device, and the installation channel is used to accommodate a gas inlet connected to the cavity cover.

[0011] Preferably, the upper cover is provided with a first through hole, the partition is provided with a second through hole, and the base is provided with a third through hole. The first through hole, the second through hole and the third through hole are communicated to form the installation channel.

[0012] Preferably, the air cooling device has a heat transfer space arranged in an annular shape, the installation channel is arranged in the middle part of the heat transfer space, and the upper cover is provided with at least two air inlets and at least two air outlets, the air inlets are evenly arranged around the axial direction of the heat transfer space, and at least part of the air outlets and at least part of the air inlets are alternately arranged around the axial direction of the heat transfer space.

[0013] Preferably, the air cooling device also includes cooling fins, and a plurality of the cooling fins are thermally connected to the base and arranged in the heat transfer space, and along the radial direction of the heat transfer space, a plurality of the cooling fins are arranged at intervals to form cooling sectors, and around the axial direction of the heat transfer space, a plurality of the cooling sectors are arranged circumferentially.

[0014] Preferably, along the radial direction of the heat transfer space, in each of the heat dissipation sectors, two adjacent heat dissipation fins are spaced 2-4 mm apart; and / or,

[0015] Around the axial direction of the heat transfer space, the interval between two adjacent heat dissipation sectors is 2-4 mm.

[0016] Preferably, the heat dissipation fins have a height of 17-23 mm and a thickness of 2-4 mm.

[0017] Preferably, the partition is provided with a first opening and a second opening, and is protrudingly provided with a first flange, the first flange being used for sealingly connecting the upper cover, the inner side of the first flange, the first opening and the air inlet defining the air inlet flow channel, and the outer side of the first flange, the second opening and the air outlet defining the air outlet flow channel.

[0018] Preferably, along the radial direction of the heat transfer space, the opening size of the second opening is not less than the distance between the two heat dissipation fins that are farthest apart in each of the heat dissipation sectors.

[0019] Preferably, a radial flow channel is spaced apart and formed between two adjacent heat dissipation sectors, the radial flow channel extends along the radial direction of the heat transfer space, and the projections of the radial flow channel and the second opening on the horizontal plane overlap.

[0020] Preferably, the second opening is a fan ring.

[0021] Preferably, the upper cover is provided with a first tubular portion, and one end of the first tubular portion away from the partition is configured as the air inlet, and the cooling gas can enter from the air inlet and flow through the first tubular portion, and along the flow direction of the cooling gas, the inner diameter of the first tubular portion gradually decreases.

[0022] The beneficial effects of the air-cooling device provided by the present invention: Through the above air-cooling device, the inflow and outflow of the cooling gas can be realized through the air inlet channel and the air outlet channel respectively, achieving the efficient utilization of the cooling gas and the uniform heat dissipation effect, reducing the occurrence of cold spots on the cavity cover, being beneficial to the temperature uniformity in the reaction chamber, reducing process errors, while ensuring the heat exchange efficiency, ensuring the cooling effect on the cavity cover, avoiding the high-temperature damage of the components on the cavity cover during the reaction process, and being beneficial to reducing the failure rate and maintenance cost of the semiconductor device.

[0023] The second object of the present invention is to provide an air-cooling method, which can cool the cavity cover and avoid the high-temperature damage of the components on the cavity cover.

[0024] To achieve this purpose, the present invention adopts the following technical solutions:

[0025] An air-cooling method, applied to the above air-cooling device, includes:

[0026] Install the air-cooling device on the cavity cover, the cavity cover has a high-temperature area and a low-temperature area, the air-cooling device has at least two air inlets, and the flow rate in the air inlet closer to the high-temperature area is greater than the flow rate in the air inlet closer to the low-temperature area.

[0027] Preferably, the air-cooling method includes:

[0028] Set at least two sensors in the air-cooling device, the sensors are arranged corresponding to the air inlets, the sensors are used to measure the temperature of the area on the cavity cover opposite to the air inlets, and when the temperature detection result of the sensor is higher than the threshold temperature, according to the difference between the temperature detection result and the threshold temperature, calculate the size of the additional flow rate required in the corresponding air inlet.

[0029] The beneficial effects of the air-cooling method provided by the present invention: By adjusting the air inlet flow rate, the cooling effect on the cavity cover can be achieved with less vibration, ensuring that the normal reaction in the reaction chamber will not be negatively affected during cooling, while also saving energy consumption and ensuring the service life of flow control components such as fans.

[0030] The third object of the present invention is to provide a semiconductor device, whose cavity cover has a lower temperature and has a higher service life and working stability.

[0031] To achieve this purpose, the present invention adopts the following technical solutions:

[0032] A semiconductor device, including a cavity cover and the above air-cooling device, the air-cooling device is attached to the cavity cover and is thermally connected to the cavity cover.

[0033] Advantages of the semiconductor device provided by the present invention: Through the above-mentioned air-cooling device, the inflow and outflow of the cooling gas can be realized through the air inlet flow channel and the air outlet flow channel respectively, achieving efficient utilization of the cooling gas and a uniform heat dissipation effect, reducing the occurrence of cold spots on the cavity cover, facilitating temperature uniformity in the reaction chamber, reducing process errors, ensuring the efficiency of heat exchange at the same time, ensuring the cooling effect on the cavity cover, avoiding high-temperature damage to the components on the cavity cover during the reaction process, and being beneficial to reducing the failure rate and maintenance cost of the semiconductor device. Description of the Drawings

[0034] Figure 1 is a perspective view of the air-cooling device provided by the present invention;

[0035] Figure 2 is an assembled perspective view of the partition plate and the base provided by the present invention;

[0036] Figure 3 is a perspective view of the base provided by the present invention;

[0037] Figure 4 is a top view of the air-cooling device provided by the present invention;

[0038] Figure 5 is along Figure 4 the internal structure diagram of the air-cooling device along A-A in

[0039] Figure 6 is Figure 5 the partial enlarged view at C in

[0040] Figure 7 is along Figure 4 the internal structure diagram of the air-cooling device along B-B in

[0041] In the figure:

[0042] 100, air inlet flow channel; 200, air outlet flow channel;

[0043] 1, upper cover; 11, first tubular part; 111, air inlet; 12, second tubular part; 121, air outlet; 13, first through hole;

[0044] 2, partition plate; 21, first opening; 22, second opening; 23, second through hole; 24, first flange; 25, abutting flange;

[0045] 3, base; 31, third through hole;

[0046] 4, heat dissipation fins;

[0047] 5, fan. Detailed Embodiments

[0048] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the sake of description, only the parts related to the present invention rather than all the structures are shown in the drawings.

[0049] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0051] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", and "left" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0052] The following is based on the attached Figure 1 to the attached Figure 7 This paper introduces the air-cooling device, air-cooling method, and semiconductor device provided by the present invention.

[0053] Refer to Figures 1 to 3 As shown, in this embodiment, the air-cooling device mainly includes an upper cover 1, a partition 2, a base 3, and heat dissipation fins 4 installed in the base 3. Among them, the upper cover 1 is provided with an air inlet 111 and an air outlet 121. The cooling gas can enter the air-cooling device through the air inlet 111 and flow out of the air-cooling device through the air outlet 121 (refer to Figure 1as shown by the black arrow). The partition plate 2 is arranged below the upper cover 1 and is connected to the upper cover 1. An air inlet flow channel 100 and an air outlet flow channel 200 are defined between the upper cover 1 and the partition plate 2, and the two are not directly connected. Moreover, the air inlet flow channel 100 is directly connected to the air inlet 111, and the air outlet flow channel 200 is directly connected to the air outlet 121, thus ensuring that the cooling gas will not be mixed when flowing in and out, and reducing the use efficiency of the cooling gas.

[0054] The base 3 is arranged below the partition plate 2 and is connected to the side of the partition plate 2 away from the upper cover 1. A cavity cover is arranged below the base 3, and the base 3 can be in heat conduction connection with the cavity cover. The base 3 and the partition plate 2 are connected and a heat transfer space is defined therebetween. The above-mentioned air inlet flow channel 100 and air outlet flow channel 200 are respectively connected to the heat transfer space, so that the cooling gas can flow into the heat transfer space through the air inlet flow channel 100 and flow out through the air outlet flow channel 200. Compared with the method of directly connecting the air inlet 111 and the air outlet 121 to the base 3, the partition plate 2 can make the air flow through the air inlet flow channel 100 and the air outlet flow channel 200 more evenly through the heat transfer space, thereby reducing cold spots (i.e., the phenomenon of lower temperature at local positions) and improving the heat dissipation efficiency.

[0055] A plurality of heat dissipation fins 4 are arranged in the heat transfer space, and the heat dissipation fins 4 are in heat conduction connection with the base 3. The heat of the cavity cover can be transferred to the surface of the heat dissipation fins 4 through the base 3. When the cooling gas flows into the heat transfer space, heat exchange can occur between the cooling gas and the heat dissipation fins 4, and then the cooling gas flows out through the air outlet flow channel 200 and the air outlet 121 after absorbing heat, thereby realizing the heat dissipation effect on the cavity cover.

[0056] Through the above-mentioned air cooling device, the inflow and outflow of the cooling gas can be realized through the air inlet flow channel 100 and the air outlet flow channel 200 respectively, realizing the efficient utilization of the cooling gas and the uniform heat dissipation effect, reducing the occurrence of cold spots on the cavity cover, being beneficial to the temperature uniformity in the reaction chamber, and reducing process errors. Arranging the heat dissipation fins 4 in the heat transfer space can significantly increase the heat exchange area between the air cooling device and the cooling gas, thereby ensuring the heat exchange efficiency, ensuring the cooling effect on the cavity cover, avoiding the damage of the components on the cavity cover due to high temperature during the reaction process, and being beneficial to reducing the failure rate and maintenance cost of the semiconductor device. Exemplarily, in this embodiment, the temperature in the reaction chamber is at least 420 degrees, and the air cooling device can limit the temperature of the cavity cover within a range not exceeding 180 degrees and ensure the uniformity of the cavity cover temperature.

[0057] Optionally, in this embodiment, the air-cooling device is provided with an installation channel running through it. The installation channel is isolated from the air inlet channel 100, the air outlet channel 200, and the heat transfer space. The installation channel is used to accommodate a gas inlet connected to the cavity cover. The gas inlet can be connected to a gas supply pipeline, and can pass through the cavity cover and supply working gas to the reaction chamber to achieve specific reaction operations. When the working gas passes through the gas inlet, heat exchange will occur between the working gas and the cavity cover. At this time, if there are cold spots on the cavity cover, it will cause the temperature of the working gas to be uneven, and further cause the temperature of the spray plate and the inside of the reaction chamber to be uneven, affecting the quality of the finished product. And the air-cooling device has the effect of avoiding cold spots, which can make the working gas maintain temperature uniformity, thus facilitating the temperature uniformity in the reaction chamber.

[0058] Specifically, referring to Figures 1 to 3 As shown, in this embodiment, the upper cover 1 is provided with a first through hole 13, the partition 2 is provided with a second through hole 23, and the base 3 is provided with a third through hole 31. The first through hole 13, the second through hole 23, and the third through hole 31 are connected and form the above-mentioned installation channel. Preferably, at least one of the upper cover 1, the partition 2, and the base 3 is provided with a butt flange 25. The butt flange 25 protrudes and can be hermetically butted against at least one of the adjacent upper cover 1, partition 2, and base 3, so as to ensure that the installation channel is isolated from the air inlet channel 100, the air outlet channel 200, and the heat transfer space.

[0059] As Figure 3 、 Figure 4 shown, in this embodiment, the air-cooling device has a heat transfer space arranged in a ring shape, and the installation channel is arranged in the middle of the heat transfer space. The upper cover 1 is provided with at least two air inlets 111 and at least two air outlets 121. The air inlets 111 are evenly arranged around the axis of the heat transfer space, and at least some of the air outlets 121 and at least some of the air inlets 111 are alternately arranged around the axis of the heat transfer space. Such an arrangement can make the air flow more evenly in the heat transfer space, so as to ensure uniform cooling of the cavity cover and avoid the appearance of cold spots. Optionally, in some embodiments, an avoidance area can also be set on the upper cover 1, and no air outlets 121 and air inlets 111 are set in the avoidance area, so as to reserve space for the installation of other necessary structures.

[0060] Moreover, within the heat transfer space, along the radial direction of the heat transfer space, a plurality of heat dissipation fins 4 are arranged at intervals to form heat dissipation sectors, and along the axial direction of the heat transfer space, a plurality of heat dissipation sectors are arranged circumferentially. Such an arrangement of the heat dissipation fins 4 can form a plurality of annular flow channels within the annular heat transfer space, and adjacent two annular flow channels can communicate with each other along the radial direction of the heat transfer space. This can not only fully increase the heat exchange area within the heat transfer space, but also enable the cooling gas to flow regularly within the heat transfer space with less resistance, thereby improving the utilization efficiency of the cooling gas and achieving a better heat dissipation effect.

[0061] Exemplarily, along the radial direction of the heat transfer space, within each heat dissipation sector, the adjacent two heat dissipation fins 4 are arranged with an interval of 2 - 4 mm, and preferably with an interval of 3 mm. Along the axial direction of the heat transfer space, the adjacent two heat dissipation sectors are arranged with an interval of 2 - 4 mm, and preferably with an interval of 3 mm.

[0062] Furthermore, increasing the height of the heat dissipation fins 4 can also increase the heat exchange area. Therefore, the height of the heat dissipation fins 4 is preferably 17 - 23 mm, and the corresponding thickness is preferably 2 - 4 mm to ensure the increase of the heat exchange area and the structural strength of the heat dissipation fins 4. Exemplarily, in this embodiment, the height of the heat dissipation fins 4 is 20 mm and the thickness is 3 mm.

[0063] Referring to Figure 2 、 Figure 5 and Figure 6 As shown, in this embodiment, the partition 2 is provided with a first opening 21 and a second opening 22, and a first flange 24 is protrudingly provided. The first flange 24 is arranged between the first opening 21 and the second opening 22. The first flange 24 can be hermetically abutted against the upper cover 1, thereby defining an inlet air flow channel 100 among the first flange 24, the first opening 21 and the air inlet 111, and defining an outlet air flow channel 200 among the first flange 24, the second opening 22 and the air outlet 121. The first flange 24 can isolate the inlet air flow channel 100 and the outlet air flow channel 200, thereby realizing the separation of the inflow and outflow of the cooling gas, ensuring that there is no mixing phenomenon, and guaranteeing the heat dissipation and cooling effects of the cavity cover components. Optionally, in this embodiment, the first opening 21 is set as a circular opening, and the first flange 24 is set as an annular protrusion, so that the cooling gas can pass through evenly and smoothly. Optionally, as Figure 6 shown, in some embodiments, the first flange 24 and the upper cover 1 can also be integrally connected, which can also form a sealing connection effect and also belongs to the scope of protection of the present invention.

[0064] Preferably, adjacent two heat dissipation sectors are spaced apart to form a radial flow channel. The radial flow channel extends along the radial direction of the heat transfer space, and the projection of the radial flow channel and the second opening 22 on the horizontal plane coincides, so that the gas after absorbing heat can flow out more smoothly through the second opening 22, reducing the resistance of gas flow, and enabling the gas to flow more comprehensively in the heat transfer space, achieving the effect of reducing cold spots.

[0065] Exemplarily, the second opening 22 is arranged as a fan-shaped ring, and along the radius direction of the heat transfer space, the opening size of the second opening 22 is not less than the distance between the two heat dissipation fins 4 that are farthest apart in each heat dissipation sector, so that the resistance of the cooling gas during outflow is small, and it can flow out more smoothly, avoiding the phenomenon that the cooling gas after absorbing heat remains in the heat transfer space and is difficult to discharge. Of course, in some other embodiments, the second opening 22 can also be in other shapes such as square or oval, as long as the opening size setting of the second opening 22 is satisfied.

[0066] Optionally, in some embodiments, a second flange can also be arranged between the second opening 22 and the first opening 21, and the second flange is made to abut against the upper cover 1, so as to further achieve the effect of separating the inlet air flow channel 100 and the outlet air flow channel 200. And in the present invention, the shape of the second flange is not specifically limited, as long as it can achieve the separation effect.

[0067] As Figure 7 shown, in this embodiment, the upper cover 1 is provided with a first tubular portion 11, and the opening at the end of the first tubular portion 11 away from the partition 2 is the above-mentioned air inlet 111. A fan 5 is installed at the air inlet 111, so that the fan 5 is away from the reaction chamber with a higher temperature, which not only protects the normal use of the fan 5, but also reduces the negative impact of the vibration of the fan 5 during operation on the reaction chamber. The fan 5 can drive the cooling gas to enter through the air inlet 111 and flow through the first tubular portion 11. Preferably, along the flow direction of the cooling gas, the inner diameter of the first tubular portion 11 gradually decreases, so as to enhance the flow rate and improve the cooling effect. It can be understood that, in some embodiments, the number of air inlets 111 and the number of corresponding installed fans 5 are relatively large to meet higher heat dissipation requirements. And in some embodiments, when the heat dissipation requirement is low, fewer air inlets 11 and fewer fans 5 can be set to save structural costs.

[0068] Continue to refer to Figure 7 shown, in this embodiment, the upper cover 1 is further provided with a second tubular portion 12, and the opening at the end of the second tubular portion 12 away from the partition 2 is the above-mentioned air outlet 121. Optionally, in this embodiment, the second tubular portion 12 is in a straight tubular shape to facilitate the outflow of the cooling gas.

[0069] Further, in this embodiment, the partition plate 2 and the base 3 are rotatably connected, so that during the cooling process, by changing the relative angle between the partition plate 2 and the base 3, the distance between the first opening 21 and the components to be cooled on the cavity cover can be shortened, thereby improving the cooling rate of the local position on the cavity cover and achieving a better effect of protecting the components to be cooled.

[0070] The present invention also discloses an air-cooling method applied to the above-mentioned air-cooling device, including:

[0071] Install the air-cooling device on the cavity cover. The cavity cover has a high-temperature area and a low-temperature area. The air-cooling device has at least two air inlets 111, and the flow rate in the air inlet 111 close to the high-temperature area is greater than the flow rate in the air inlet 111 close to the low-temperature area.

[0072] Exemplarily, in this embodiment, a high-temperature area and a low-temperature area are formed on the cavity cover, and the temperature of the high-temperature area is higher than that of the low-temperature area. The air-cooling device includes at least two air inlets 111, and each air inlet 111 is provided with a fan 5, and different air inlets 111 have different distances from the high-temperature area and the low-temperature area. By controlling the above-mentioned fan 5, the air inlet flow rate of each air inlet 111 can be adjusted, so that the flow rate in the air inlet 111 close to the high-temperature area is greater than the flow rate in the air inlet 111 close to the low-temperature area, improving the cooling effect on the high-temperature area. Of course, in some other embodiments, the air inlet 111 can also be connected to other flow control components to achieve flow regulation.

[0073] Specifically, in this embodiment, at least two sensors are provided in the air-cooling device. The sensors are correspondingly arranged with the air inlets 111, and the sensors are used to measure the temperature of the area on the cavity cover opposite to the air inlets 111. When the temperature detection result of the sensor is higher than the threshold temperature, according to the difference between the temperature detection result and the threshold temperature, the magnitude of the flow rate that needs to be increased in the corresponding air inlet 111 is calculated. Exemplarily, when the temperature detection result detected by one sensor is higher than the threshold temperature and the temperature detection result detected by another sensor is lower than the threshold temperature, it means that a high-temperature area that needs to be strengthened for heat dissipation appears on the cavity cover, and the flow rate in the corresponding air inlet 111 needs to be increased. Of course, since the temperature of the cavity cover is limited by various factors such as process and structure, and the heat dissipation capacity of the air-cooling device is also limited by various factors such as specific dimensions, the threshold temperature, calculation formula, etc. are not specifically limited in the present invention, as long as the corresponding temperature control effect can be achieved.

[0074] By adjusting the air inlet flow rate, the cooling effect on the cavity cover can be achieved with less vibration, ensuring that the normal reaction in the reaction chamber will not be negatively affected during cooling, while also saving energy consumption and ensuring the service life of components such as the fan 5.

[0075] The present invention also provides a semiconductor device, which includes a cavity cover and the above-mentioned air-cooling device. The cavity cover is disposed on the reaction chamber, and the air-cooling device is adhesively arranged on the cavity cover and is thermally connected to the cavity cover. Through this air-cooling device, the inflow and outflow of the cooling gas can be realized through the air inlet flow channel 100 and the air outlet flow channel 200 respectively, achieving the efficient utilization of the cooling gas. The heat dissipation fins 4 can significantly increase the heat exchange area between the air-cooling device and the cooling gas, thereby ensuring the heat exchange efficiency, ensuring the cooling effect on the cavity cover, avoiding the high-temperature damage of the components on the cavity cover during the reaction process, and being beneficial to reducing the failure rate and maintenance cost of the semiconductor device.

[0076] In the description of this specification, the descriptions referring to the terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0077] Obviously, the above embodiments of the present invention are merely examples given for clearly explaining the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Air cooling device, characterized in that: include: An upper cover (1), wherein the upper cover (1) is provided with an air inlet (111) and an air outlet (121); a partition (2), the partition (2) and the upper cover (1) being connected to define an air inlet flow channel (100) and an air outlet flow channel (200) that are isolated from each other, the air inlet (111) being directly connected to the air inlet flow channel (100), and the air outlet (121) being directly connected to the air outlet flow channel (200); A base (3), wherein the base (3) is connected to the side of the partition (2) away from the upper cover (1), the base (3) can be thermally connected to the cavity cover, and a heat transfer space is defined between the base (3) and the partition (2), the air inlet channel (100) and the air outlet channel (200) are respectively connected to the heat transfer space, and cooling gas can flow from the air inlet (111) through the air inlet channel (100) into the heat transfer space, and flow out through the air outlet channel (200) after absorbing heat.

2. The air cooling device according to claim 1, characterized in that: The air cooling device is provided with an installation channel running through it, and the installation channel is used to accommodate a gas inlet connected to the cavity cover.

3. The air cooling device according to claim 2, characterized in that: The upper cover (1) is provided with a first through hole (13), the partition (2) is provided with a second through hole (23), and the base (3) is provided with a third through hole (31); the first through hole (13), the second through hole (23) and the third through hole (31) are connected to form the installation channel.

4. The air cooling device according to claim 2, characterized in that: The air cooling device has a heat transfer space arranged in an annular shape, the installation channel is arranged in the middle of the heat transfer space, and, The upper cover (1) is provided with at least two air inlets (111) and at least two air outlets (121); the air inlets (111) are evenly arranged around the axial direction of the heat transfer space; at least part of the air outlets (121) and at least part of the air inlets (111) are alternately arranged around the axial direction of the heat transfer space.

5. The air cooling device according to claim 4, characterized in that: The air cooling device further comprises heat dissipation fins (4), a plurality of the heat dissipation fins (4) are heat-conductively connected to the base (3) and are arranged in the heat transfer space, and, Along the radial direction of the heat transfer space, a plurality of heat dissipation fins (4) are arranged at intervals to form heat dissipation sectors, and around the axial direction of the heat transfer space, a plurality of heat dissipation sectors are arranged circumferentially.

6. The air cooling device according to claim 5, characterized in that: Along the radial direction of the heat transfer space, in each of the heat dissipation sectors, two adjacent heat dissipation fins (4) are arranged with a spacing of 2-4 mm; and / or, Around the axial direction of the heat transfer space, two adjacent heat dissipation sectors are spaced 2-4 mm apart.

7. The air cooling device according to claim 6, characterized in that: The heat dissipation fins (4) have a height of 17-23 mm and a thickness of 2-4 mm.

8. The air cooling device according to claim 5, characterized in that: The partition (2) is provided with a first opening (21) and a second opening (22), and is provided with a first flange (24) protrudingly, wherein the first flange (24) is used for sealingly connecting to the upper cover (1), the inner side of the first flange (24), the first opening (21) and the air inlet (111) define the air inlet flow channel (100), and the outer side of the first flange (24), the second opening (22) and the air outlet (121) define the air outlet flow channel (200).

9. The air cooling device according to claim 8, characterized in that: Along the radial direction of the heat transfer space, the opening size of the second opening (22) is not less than the distance between the two heat dissipation fins (4) that are farthest apart in each of the heat dissipation sectors.

10. The air cooling device according to claim 8, characterized in that: A radial flow channel is arranged between two adjacent heat dissipation sectors and extends in a radial direction of the heat transfer space. The radial flow channel and the projection of the second opening (22) on a horizontal plane overlap.

11. The air cooling device according to claim 8, characterized in that: The second opening (22) is a fan ring.

12. The air cooling device according to claim 1, characterized in that: The upper cover (1) is provided with a first tubular portion (11), and one end of the first tubular portion (11) away from the partition (2) is configured as the air inlet (111). The cooling gas can enter from the air inlet (111) and flow through the first tubular portion (11), and the inner diameter of the first tubular portion (11) gradually decreases along the flow direction of the cooling gas.

13. An air cooling method, applied to an air cooling device as claimed in any one of claims 1 to 12, characterized in that: include: The air cooling device is installed on a cavity cover, the cavity cover has a high temperature area and a low temperature area, the air cooling device has at least two air inlets (111), and the flow rate in the air inlet (111) close to the high temperature area is greater than the flow rate in the air inlet (111) close to the low temperature area.

14. The air cooling method according to claim 13, characterized in that: The air cooling method comprises: At least two sensors are arranged on the air cooling device, the sensors being arranged corresponding to the air inlet (111), the sensors being used to measure the temperature of an area on the cavity cover opposite to the air inlet (111), and When the temperature detection result of the sensor is higher than a threshold temperature, the amount of flow that needs to be increased in the corresponding air inlet (111) is calculated based on the difference between the temperature detection result and the threshold temperature.

15. A semiconductor device, characterized in that The invention comprises a cavity cover and an air cooling device as described in any one of claims 1 to 12, wherein the air cooling device is arranged on the cavity cover in a close fit and is thermally connected to the cavity cover.

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