High-precision camera chip distance measurement debugging platform and method

Abstract

The invention discloses a high-precision camera chip distance measurement debugging platform and method.The high-precision camera chip distance measurement debugging platform comprises an optical platform assembly and a product jig assembly, the optical platform assembly comprises a displayer, an optical platform, a button and a lower frame, and the product jig assembly is arranged at the front end of the top of the optical platform assembly; the product jig assembly comprises a product installation buckle, a shell positioning plate, a first reinforcing rib plate, a second reinforcing rib plate, a supporting plate, an installation bottom plate, a detection probe, a probe fixing block, an XY high-precision adjusting table module, an adjusting table module adapter plate and a product. According to the invention, through new process requirements, the relative position of the product is determined through a high-precision detection instrument, and the camera is fixed by a customized high-precision clamping jig, so that the product is repeatedly and accurately positioned, a new assembly process is realized, and high repeated positioning precision and pre-fixation during adjustment of a camera chip can be realized only by using one connecting buckle; the device is economical and practical under the condition of meeting the production requirements of manual lines.

Description

Technical Field

[0001] This application relates to the technical field of cameras, and particularly to a high-precision camera chip ranging debugging platform and method. Background Art

[0002] With the iteration of camera products, the relative distance requirements between the camera sensor and the lens in camera products are getting higher and higher. Ordinary shells produced by molds cannot meet the product assembly accuracy requirements or are expensive, which is not conducive to the interests of the enterprise itself.

[0003] Therefore, there are deficiencies in the prior art and improvements are needed. Summary of the Invention

[0004] This application provides a high-precision camera chip ranging debugging platform and method to solve the problems in the above background art.

[0005] In a first aspect, this application provides a high-precision camera chip ranging debugging platform, including an optical platform component and a product fixture component, characterized in that: the optical platform component includes a display, an optical platform, buttons and a lower frame. A product fixture component is provided at the front end of the top of the optical platform component, and the product fixture component includes a product installation buckle, a housing positioning plate, a first reinforcing rib plate, a second reinforcing rib plate, a support plate, a mounting base plate, a detection probe, a probe fixing block, an XY high-precision adjustment table module, an adjustment table module adapter plate and a product.

[0006] Optionally, a plurality of equally spaced screw holes are provided on the inner surface of the optical platform, through holes are provided on the periphery of the inner surface of the mounting base plate, and the mounting base plate is connected to the optical platform through fastening screws.

[0007] Optionally, a display is connected to the rear end of the top of the optical platform through fastening screws, and a button is connected to the right end of the front surface of the optical platform through fastening screws.

[0008] Optionally, a lower frame is fixedly connected to the bottom of the optical platform, and the lower frame includes various electrical components, a computer mainframe, a detection instrument controller and shock pads.

[0009] Optionally, pads are fixedly connected to the four peripheries of the bottom of the lower frame, and casters are also movably connected to the four peripheries of the bottom of the lower frame.

[0010] Optionally, support plates are fixedly connected to the left and right ends of the top of the mounting base plate, and a housing positioning plate is fixedly connected to the top of the support plates.

[0011] Optionally, a product is connected to the inner surface of the housing positioning plate through a product installation buckle, and an XY high-precision adjustment table module is fixedly connected to the rear end of the top of the mounting base plate.

[0012] Optionally, a transfer board for the adjustment stage module is provided on the top of the XY high-precision adjustment stage module. A probe fixing block is fixedly connected to the top of the transfer board for the adjustment stage module, and a detection probe is provided at the bottom of the probe fixing block.

[0013] Optionally, the right rear end of the bottom of the housing positioning plate is fixedly connected to the upper end of the inner side of the support plate through the first reinforcing rib plate, and the left front end of the bottom of the housing positioning plate is fixedly connected to the upper end of the inner side of the support plate through the second reinforcing rib plate.

[0014] In a second aspect, the present application provides a method for debugging the distance measurement of a high-precision camera chip, which uses the above-mentioned high-precision camera chip distance measurement debugging platform, and includes the following steps:

[0015] A. Manually place the product on the product fixture assembly, and rotate it clockwise by ° as indicated until the camera positioning pin is inserted into the fixture;

[0016] B. Press the start button of the optical platform assembly and wait for the detection probe to read the position information of the chip;

[0017] C. After the reading is completed, the display will show the position information of each position of the chip. Manually adjust the relative position of the chip with a screwdriver according to the information;

[0018] D. Press the start button again until the values displayed on the display are all qualified, and then manual feeding can be performed.

[0019] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art:

[0020] Through the new process requirements, the present application determines the relative position of the product through high-precision detection instruments, and customizes high-precision clamping fixtures to fix the camera to achieve repeated and accurate positioning of the product, thereby realizing a new assembly process. Moreover, only one connection buckle can achieve high repeated positioning accuracy and pre-fixation during the adjustment of the camera chip. It is economical and affordable under the condition of meeting the production requirements of the manual line. Description of the Drawings

[0021] The drawings here are incorporated into the specification and constitute a part of this specification, showing the embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0023] One or more embodiments are illustrated by way of example in the accompanying drawings corresponding thereto. These illustrative descriptions do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated. The drawings in the figures do not constitute a scale limitation.

[0024] Figure 1 This is a schematic three-dimensional structure diagram of the high-precision camera chip ranging and debugging platform of the present invention.

[0025] Figure 2 This is a schematic top view structure diagram of the high-precision camera chip ranging and debugging platform of the present invention.

[0026] Figure 3 This is a schematic structure diagram of the optical platform assembly of the present invention.

[0027] Figure 4 This is a schematic structure diagram of the product fixture assembly of the present invention.

[0028] Description of reference numerals:

[0029] Optical platform assembly 1, display 1-1, optical platform 1-2, button 1-3, lower frame 1-4, product fixture assembly 2, product installation buckle 2-1, housing positioning plate 2-2, first reinforcing rib plate 2-3, second reinforcing rib plate 2-4, support plate 2-5, installation base plate 2-6, detection probe 2-7, probe fixing block 2-8, XY high-precision adjustment table module 2-9, adjustment table module adapter plate 2-10, product 2-11. Detailed implementation manners

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0031] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0032] For ease of description, spatial relative relationship terms may be used in the text to describe the relative position or movement of one element or feature shown in the figure with respect to another element or feature. These relative relationship terms are, for example, "inside", "outside", "inner side", "outer side", "below", "beneath", "above", "over", "front", "rear", etc. Such spatial relative relationship terms are intended to include different orientations of the device during use or operation other than the orientations depicted in the figure. For example, if the device in the figure undergoes a position flip, attitude change, or motion state change, then these directional indications will change accordingly. For example, an element described as "below" or "beneath" other elements or features will then be oriented as "above" or "over" other elements or features. Therefore, the exemplary term "below" can include both the upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used in the text are interpreted accordingly.

[0033] To solve the technical problems in the prior art, the present application provides a high-precision camera chip ranging and debugging platform and method, which can achieve determining the relative position of the product through new process requirements and high-precision detection instruments, fixing the camera with a customized high-precision fixture to achieve repeated and precise positioning of the product, thereby realizing a new assembly process, and achieving high repeated positioning accuracy and pre-fixation during the adjustment of the camera chip with only one connection buckle, which is economical and affordable under the condition of meeting the requirements of manual line production.

[0034] Figures 1-4 A high-precision camera chip ranging and debugging platform provided by an embodiment of the present application includes an optical platform assembly 1 and a product fixture assembly 2. The optical platform assembly 1 includes a display 1-1, an optical platform 1-2, a button 1-3, and a lower frame 1-4. The product fixture assembly 2 is disposed at the front end of the top of the optical platform assembly 1, and the product fixture assembly 2 includes a product mounting buckle 2-1, a housing positioning plate 2-2, a first reinforcing rib plate 2-3, a second reinforcing rib plate 2-4, a support plate 2-5, a mounting base plate 2-6, a detection probe 2-7, a probe fixing block 2-8, an XY high-precision adjustment table module 2-9, an adjustment table module adapter plate 2-10, and a product 2-11. Through new process requirements, determining the relative position of the product through high-precision detection instruments, fixing the camera with a customized high-precision fixture to achieve repeated and precise positioning of the product, thereby realizing a new assembly process, and achieving high repeated positioning accuracy and pre-fixation during the adjustment of the camera chip with only one connection buckle, which is economical and affordable under the condition of meeting the requirements of manual line production.

[0035] In the present invention, a plurality of equally spaced screw holes are provided on the inner surface of the optical platform 1-2. Through holes are provided around the inner surface of the mounting base plate 2-6, and the mounting base plate 2-6 is connected to the optical platform 1-2 by fastening screws, which facilitates the loading and unloading of the mounting base plate 2-6.

[0036] Please continue to refer to Figure 3 , a display 1-1 is connected to the rear end of the top of the optical platform 1-2 by fastening screws, and a button 1-3 is connected to the right end of the front surface of the optical platform 1-2 by fastening screws. A lower frame 1-4 is fixedly connected to the bottom of the optical platform 1-2, and the lower frame 1-4 includes various electrical components, a computer mainframe, a detection instrument controller, and shock pads. Blocks are fixedly connected to the four corners of the bottom of the lower frame 1-4, and casters are also movably connected to the four corners of the bottom of the lower frame 1-4, which facilitates people to move this device.

[0037] Please continue to refer to Figure 4 , support plates 2-5 are fixedly connected to the left and right ends of the top of the mounting base plate 2-6, and a housing positioning plate 2-2 is fixedly connected to the top of the support plate 2-5. A product 2-11 is connected to the inner surface of the housing positioning plate 2-2 by a product mounting buckle 2-1. An XY high-precision adjustment table module 2-9 is fixedly connected to the rear end of the top of the mounting base plate 2-6. The distance of the detection probe 2-7 relative to the surface of the simulated Sensor is calibrated at four points by using a distance calibration jig, and it is ensured that the flatness jump of the four-point monitoring plane is ≤0.005 mm, that is, the parallelism between the surface of the simulated Sensor and the mounting surface of the simulated lens is ≤0.005 mm. A transfer plate 2-10 for the adjustment table module is provided on the top of the XY high-precision adjustment table module 2-9, a probe fixing block 2-8 is fixedly connected to the top of the transfer plate 2-10 for the adjustment table module, and a detection probe 2-7 is provided at the bottom of the probe fixing block 2-8 for positioning the product.

[0038] Specifically, the XY high-precision adjustment table module 2-9 uses a spectral confocal probe to monitor the distance between the surface of the Sensor and the mounting surface of the lens. Manually lock the screws to correct the relative distance value. When the standard distance reaches 19.25±0.005 mm, it is in an OK state. Finally, manually apply glue to fix the screws. The right rear end of the bottom of the housing positioning plate 2-2 is fixedly connected to the upper end of the inner side of the support plate 2-5 through a first reinforcing rib plate 2-3, and the left front end of the bottom of the housing positioning plate 2-2 is fixedly connected to the upper end of the inner side of the support plate 2-5 through a second reinforcing rib plate 2-4.

[0039] The present invention also provides a method for high-precision camera chip ranging and debugging using the above high-precision camera chip ranging and debugging platform, including the following steps:

[0040] A. Manually place the product on the product fixture assembly 2 and rotate it clockwise by 60° according to the indication until the camera positioning pin is inserted into the fixture;

[0041] B. Press the start button of the optical platform assembly 1 and wait for the detection probe 2-7 to read the position information of the chip;

[0042] C. After the reading is completed, the display 1-1 will display the position information of each position of the chip. Manually adjust the relative position of the chip with a screwdriver according to the information;

[0043] D. Press the start button again until the values displayed on the display 1-1 are all qualified, then manual feeding can be carried out.

[0044] In the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0045] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0046] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0047] In the present application, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0048] In this application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is less than that of the second feature.

[0049] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0050] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, provided that these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to include these changes and modifications.

[0051] The above is the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered by the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

1. A high-precision camera chip ranging debugging platform, including an optical platform component and a product fixture component, characterized in that: The optical platform assembly includes a display, an optical platform, a button and a lower frame. A product fixture assembly is arranged at the front end of the top of the optical platform assembly, and the product fixture assembly includes a product mounting buckle, a shell positioning plate, a reinforcing rib plate 1, a reinforcing rib plate 2, a support plate, a mounting base plate, a detection probe, a probe fixing block, an XY high-precision adjustment module, an adjustment module adapter plate and a product.

2. A high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The inner surface of the optical platform is provided with a plurality of screw holes which are distributed at equal distances, and through holes are provided around the inner surface of the mounting base plate, and the mounting base plate is connected to the optical platform by fastening screws.

3. A high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The rear end of the top of the optical platform is connected to a display via a fastening screw, and the right end of the front of the optical platform is connected to a button via a fastening screw.

4. The high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The bottom of the optical platform is fixedly connected with a lower frame, and the lower frame includes various electrical components, a computer host, a detection instrument controller and a shock-absorbing pad.

5. The high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The bottom of the lower frame is fixedly connected with cushion blocks around the periphery, and the bottom of the lower frame is movably connected with walking wheels around the periphery.

6. The high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The left and right ends of the top of the installation base plate are both fixedly connected with support plates, and the top of the support plate is fixedly connected with a housing positioning plate.

7. The high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The inner surface of the housing positioning plate is connected to the product via a product mounting buckle, and the rear end of the top of the mounting base plate is fixedly connected to an XY high-precision adjustment table module.

8. The high-precision camera chip ranging debugging platform according to claim 1, characterized in that: A tuning module adapter plate is arranged on the top of the XY high-precision tuning module, a probe fixing block is fixedly connected to the top of the tuning module adapter plate, and a detection probe is arranged on the bottom of the probe fixing block.

9. The high-precision camera chip ranging debugging platform according to claim 1, characterized in that: The right rear end of the bottom of the shell positioning plate is fixedly connected to the upper end of the inner side of the support plate through a reinforcing rib plate 1, and the left front end of the bottom of the shell positioning plate is fixedly connected to the upper end of the inner side of the support plate through a reinforcing rib plate 2.

10. A method for performing high-precision camera chip ranging debugging using the high-precision camera chip ranging debugging platform according to any one of claims 1 to 9, characterized in that: The following steps are involved: A. Manually place the product on the product fixture assembly and rotate it clockwise as instructed until the camera positioning pin sinks into the fixture; B. Press the start button of the optical platform assembly and wait for the detection probe to read the position information of the chip; C. After reading, the display will show the position information of each position of the chip. According to the information, use a screwdriver to manually adjust the relative position of the chip; D. Press the start button again until the values ​​displayed on the monitor are all qualified, then everyone can start unloading the material.

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