Liquid cooling system

Abstract

A liquid cooling system comprises a plurality of first liquid cooling plates and a plurality of liquid cooling modules. The first liquid cooling plates are used for making thermal contact with the multiple first heating elements, and the first liquid cooling plates are connected in series and communicate with one another. The liquid cooling modules are connected in series and communicate with each other. The liquid cooling module comprises two shunting parts and a plurality of second liquid cooling plates. The shunting part communicates with the first liquid cooling plate. Each shunting part is provided with a plurality of shunting holes. The second liquid cooling plate is used for being in thermal contact with a plurality of second heating elements. The second liquid cooling plates are arranged between the flow dividing parts, and the second liquid cooling plates communicate with the flow dividing parts through the flow dividing holes correspondingly. The first liquid cooling plate and the liquid cooling module are connected in series and communicate with each other.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling systems for memory, and in particular to a liquid cooling system. Background Art

[0002] With the development of technology, the amount of data that needs to be processed by DIMM (Dual In-line Memory Module) specifications has increased significantly, causing the power consumption of the memory to increase accordingly, generating a large amount of waste heat.

[0003] However, in general servers, most still use air cooling systems to provide air flow to the memory to remove waste heat, but such air cooling systems are unable to dissipate heat from high-power memory in real time. Summary of the invention

[0004] The present invention provides a liquid cooling system which can provide a proper cooling mechanism for memory.

[0005] A liquid cooling system provided by one embodiment of the present invention includes a plurality of first liquid cooling plates and a plurality of liquid cooling modules. The plurality of first liquid cooling plates are used to thermally contact with the first heating element respectively, and the plurality of first liquid cooling plates are connected in series and communicated with each other. The plurality of liquid cooling modules are connected in series and communicated with each other. The liquid cooling module includes two diversion parts and a plurality of second liquid cooling plates. The diversion part is communicated with the first liquid cooling plate. The diversion part has a plurality of diversion holes. The second liquid cooling plate is used to thermally contact with the second heating element. The second liquid cooling plate is arranged between the plurality of diversion parts, and the second liquid cooling plate is connected to the diversion part through the diversion hole. The first liquid cooling plate is connected in series with the liquid cooling module and communicated with each other.

[0006] According to the liquid cooling system disclosed in the above embodiment, in addition to using the first liquid cooling plate to absorb the heat generated by the first heating element, the first liquid cooling plate used for the first heating element can also be connected in series to the second liquid cooling plate, and the heat generated by the second heating element during operation is absorbed by the second liquid cooling plate, thereby preventing heat from accumulating around the second heating element and affecting the normal operation of the second heating element.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 FIG. 4 is a perspective schematic diagram of a liquid cooling system according to one embodiment of the present invention.

[0009] Figure 2 for Figure 1 Schematic diagram of some components of the liquid cooling system.

[0010] Figure 3 for Figure 2 Schematic diagram of some components of the liquid cooling system.

[0011] In the figure, 10: liquid cooling system;

[0012] 11: first liquid cooling plate;

[0013] 11a: front first liquid cooling plate;

[0014] 11b: rear first liquid cooling plate;

[0015] 12: Liquid cooling module;

[0016] 12a: first liquid cooling module;

[0017] 12b: second liquid cooling module;

[0018] 12c: third liquid cooling module;

[0019] 12d: fourth liquid cooling module;

[0020] 121: diversion part;

[0021] 1211: diversion hole;

[0022] 122: second liquid cooling plate;

[0023] 1221: Lug portion;

[0024] 1222: avoidance slot;

[0025] 123: flexible thermal pad;

[0026] 13: connecting pipe;

[0027] 20: first heating element;

[0028] 22: The second heating element. DETAILED DESCRIPTION

[0029] Please refer to Figure 1 to Figure 2 ,in Figure 1 is a three-dimensional schematic diagram of a liquid cooling system according to an embodiment of the present invention, and Figure 2 for Figure 1 Schematic diagram of some components of the liquid cooling system.

[0030] The liquid cooling system 10 provided in this embodiment is applied in a chassis of a server, for example. The liquid cooling system 10 includes a plurality of first liquid cooling plates 11 , a plurality of liquid cooling modules 12 and a plurality of connecting pipes 13 .

[0031] The number of the first liquid cooling plates 11 is, for example, two. Specifically, the first liquid cooling plates 11 include a front first liquid cooling plate 11a and a rear first liquid cooling plate 11b. The front first liquid cooling plate 11a and the rear first liquid cooling plate 11b are connected in series and communicate with each other. The front first liquid cooling plate 11a and the rear first liquid cooling plate 11b are used to thermally contact with a plurality of first heating elements 20, respectively, wherein the first heating element 20 is, for example, a central processing unit (CPU).

[0032] The number of the liquid cooling modules 12 is, for example, four. Specifically, the liquid cooling module 12 includes a first liquid cooling module 12a, a second liquid cooling module 12b, a third liquid cooling module 12c, and a fourth liquid cooling module 12d. The first liquid cooling module 12a, the second liquid cooling module 12b, the third liquid cooling module 12c, and the fourth liquid cooling module 12d are connected in series and communicate with each other.

[0033] Please include Figure 1 to Figure 2 Refer to Figure 3 ,in Figure 3 for Figure 2 Schematic diagram of some components of the liquid cooling system.

[0034] Each liquid cooling module 12 includes two flow dividers 121 , a plurality of second liquid cooling plates 122 and a plurality of flexible thermal pads 123 .

[0035] The diverter 121 is made of, for example, copper. The diverter 121 is connected to the first liquid cooling plate 11. Each diverter 121 includes a plurality of diverter holes 1211, and the number of diverter holes 1211 of each diverter 121 is, for example, seven. In the present embodiment, one of the diverters 121 of the second liquid cooling module 12b and one of the diverters 121 of the third liquid cooling module 12c are integrally formed structures, and the other one of the diverters 121 of the second liquid cooling module 12b and the other one of the diverters 121 of the third liquid cooling module 12c are integrally formed structures. However, the present invention is not limited thereto.

[0036] The second liquid cooling plate 122 is, for example, made of SAE 304 stainless steel, which helps to improve durability and heat dissipation. In each liquid cooling module 12, the number of the second liquid cooling plates 122 is, for example, seven, and the second liquid cooling plates 122 are arranged between the two diverter parts 121, and the second liquid cooling plates 122 are connected to the diverter parts 121 through the diverter holes 1211 respectively. Specifically, each second liquid cooling plate 122 is provided with a lug 1221 at opposite ends, and the lugs 1221 of the second liquid cooling plates 122 are respectively inserted into the diverter holes 1211 to stabilize the connection between the second liquid cooling plate 122 and the diverter part 121. Among them, the lug 1221 and the diverter part 121 are connected by welding to strengthen the connection tightness between the second liquid cooling plate 122 and the diverter part 121. However, the present invention is not limited to the welding connection method.

[0037] The second liquid cooling plate 122 has a flow channel inside for cooling liquid (such as water, not shown) to flow through. Figure 3 The second liquid cooling plate 122 is shown by the dotted line inside. The second liquid cooling plate 122 is used to thermally contact a plurality of second heating elements 22, wherein the second heating element 22 is, for example, a memory of DIMM specification. Alternatively, the second liquid cooling plate 122 is used to clamp the second heating element 22. Alternatively, the second heating element 22 is disposed between two second liquid cooling plates 122. Thus, the heat generated by the second heating element 22 during operation can be absorbed by the second liquid cooling plate 122 to prevent the heat from accumulating around the second heating element 22 and affecting the normal operation of the second heating element 22.

[0038] Furthermore, the second liquid cooling plate 122 is provided with an avoidance groove 1222 to avoid interference with the protruding portion (not separately labeled) on the second heating element 22 and facilitate the plugging and unplugging of the second heating element 22. Please note that the avoidance groove 1222 is an optional design. In some embodiments, the second liquid cooling plate 122 may not have the avoidance groove 1222. In addition, when plugging and unplugging the second heating element 22, there is no need to remove the liquid cooling module 12, which can avoid the risk of cooling liquid leakage.

[0039] In each liquid cooling module 12, the number of the flexible thermal pads 123 is, for example, seven. The flexible thermal pads 123 are, for example, made of polyimide (PI) and are flexible. The flexible thermal pads 123 are respectively arranged on the outside of the second liquid cooling plate 122. By the flexible design of the flexible thermal pads 123, the second heating element 22 with an uneven surface can be closely fitted with the flexible thermal pads 123, and the flexible thermal pads 123 and the second liquid cooling plate 122 can achieve a sufficient heat exchange effect, thereby strengthening the heat conduction between the second liquid cooling plate 122 and the second heating element 22.

[0040] The number of the connecting pipes 13 is, for example, two. The connecting pipes 13 are, for example, made of polytetrafluoroethylene (PTFE) and are flexible. The connecting pipes 13 connect the first liquid cooling module 12a with the second liquid cooling module 12b and the third liquid cooling module 12c with the fourth liquid cooling module 12d.

[0041] Please note that the number of the above components is not intended to limit the present invention.

[0042] By the above configuration, the first liquid cooling plate 11 and the liquid cooling module 12 can be connected in series and communicate with each other. Specifically, the front first liquid cooling plate 11a, the rear first liquid cooling plate 11b, the first liquid cooling module 12a, the second liquid cooling module 12b, the third liquid cooling module 12c and the fourth liquid cooling module 12d of the liquid cooling system 10 only form one series connection pipeline.

[0043] Specifically, if Figure 1 As shown by arrow AA, the liquid cooling system 10 is used to allow the coolant to flow into the front first liquid cooling plate 11a. The coolant leaves the front first liquid cooling plate 11a after completing the heat exchange with one of the first heating elements 20. Figure 1 The coolant flows into the rear first liquid cooling plate 11b as shown by the arrow BB. The coolant leaves the rear first liquid cooling plate 11b after completing the heat exchange with another first heating element 20.

[0044] Next, the coolant Figure 1 As shown by the arrow CC, the cooling liquid flows into one of the branching parts 121 of the first liquid cooling module 12a. Figure 1 As shown by the arrow DD, the coolant flows through the second liquid cooling plate 122 of the first liquid cooling module 12a to complete the heat exchange with the second heating element 22, and then flows into another branching portion 121 of the first liquid cooling module 12a. Figure 1 As shown by arrow EE, the liquid flows into one of the branching parts 121 of the second liquid cooling module 12b through one of the connecting pipes 13.

[0045] Next, the coolant Figure 1 As shown by the arrow FF, the coolant flows through the second liquid cooling plate 122 of the second liquid cooling module 12b to complete the heat exchange with the second heating element 22. The coolant then flows into another branching portion 121 of the second liquid cooling module 12b. Figure 1 As shown by the arrow GG, the liquid flows from the other branching part 121 of the second liquid cooling module 12b into one branching part 121 of the third liquid cooling module 12c.

[0046] Next, the coolant Figure 1As shown by the arrow HH, the coolant flows through the second liquid cooling plate 122 of the third liquid cooling module 12c to complete heat exchange with the second heating element 22, and then flows into another branching portion 121 of the third liquid cooling module 12c. Figure 1 As shown by arrow II, the liquid flows into one of the branching parts 121 of the fourth liquid cooling module 12d through another connecting pipe 13.

[0047] Please note that in the second liquid cooling module 12b and the third liquid cooling module 12c, one set of two integrally formed flow dividers 121 are directly connected to each other, and the flow direction indicated by the arrow GG can be achieved. Please note that in the second liquid cooling module 12b and the third liquid cooling module 12c, another set of two integrally formed flow dividers 121 are not directly connected to each other, so the flow direction indicated by the arrow EE cannot be directly connected to the flow direction indicated by the arrow II.

[0048] Next, the coolant Figure 1 As shown by the arrow JJ, the coolant flows through the second liquid cooling plate 122 of the fourth liquid cooling module 12d to complete the heat exchange with the second heating element 22, and then flows into another branching portion 121 of the fourth liquid cooling module 12d. Figure 1 As shown by the arrow KK, it leaves the fourth liquid cooling module 12d.

[0049] According to the liquid cooling system of the above embodiment, in addition to using the first liquid cooling plate 11 to absorb the heat generated by the first heating element 20, the first liquid cooling plate 11 used for the first heating element 20 can also be connected in series to the second liquid cooling plate 122, thereby absorbing the heat generated by the second heating element 22 during operation through the second liquid cooling plate 122, thereby preventing heat from accumulating around the second heating element 22 and affecting the normal operation of the second heating element 22. According to simulation tests, the liquid cooling system 10 of the present invention can maintain the operating temperature of the second heating element 22 below 67.3°C.

[0050] Moreover, the liquid cooling system 10 only forms one serially connected pipeline. In addition, the liquid cooling system 10 with serially connected pipelines can increase the inlet and outlet temperature difference of the cooling liquid to make the heat exchange more sufficient, thereby saving the operating cost of the liquid cooling.

[0051] Furthermore, the avoidance groove 1222 of the second liquid cooling plate 122 can avoid interference with the protruding portion of the second heating element 22 and facilitate the plugging and unplugging of the second heating element 22. In addition, when plugging and unplugging the second heating element 22, there is no need to remove the liquid cooling module 12, which can avoid the risk of cooling liquid leakage.

[0052] Furthermore, due to the flexible design of the flexible thermal pad 123 , the second heating element 22 with an uneven surface can be closely attached to the flexible thermal pad 123 , and sufficient heat exchange can be achieved through the flexible thermal pad 123 and the second liquid cooling plate 122 , thereby enhancing the heat conduction between the second liquid cooling plate 122 and the second heating element 22 .

[0053] Although the present invention is disclosed as above by the aforementioned embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be subject to the scope of the patent application attached to this specification.

Claims

1. A liquid cooling system, characterized in that: include: A plurality of first liquid cooling plates, used for respectively being in thermal contact with a plurality of first heating elements, wherein the plurality of first liquid cooling plates are connected in series and communicate with each other; as well as A plurality of liquid cooling modules are connected in series and communicated with each other, each of the liquid cooling modules comprising: Two flow splitters, connected to the first liquid cooling plates, each of the flow splitters having a plurality of flow splitters; as well as A plurality of second liquid cooling plates, used for thermally contacting with a plurality of second heating elements, the plurality of second liquid cooling plates being arranged between the plurality of the flow diversion parts, and the second liquid cooling plates being connected to the flow diversion parts through the flow diversion holes respectively; The first liquid cooling plate and the liquid cooling module are connected in series and communicate with each other.

2. The liquid cooling system according to claim 1, characterized in that: Each of the second liquid cooling plates has a lug portion at two opposite ends, and the lug portions of the second liquid cooling plates are respectively inserted into the flow diversion holes to stabilize the connection between the second liquid cooling plate and the flow diversion portion.

3. The liquid cooling system according to claim 2, characterized in that: The lug portion and the diverter portion are connected by welding to enhance the connection tightness between the second liquid cooling plate and the diverter portion.

4. The liquid cooling system according to claim 1, characterized in that: The second liquid cooling plate is used to clamp the second heating element, and the second liquid cooling plate includes an avoidance groove to avoid interference with a protruding portion on the second heating element.

5. The liquid cooling system according to claim 1, characterized in that: The liquid cooling module further includes a plurality of flexible thermally conductive pads, which are flexible and are respectively disposed on the outer sides of the second liquid cooling plates to enhance heat conduction between the second liquid cooling plates and the second heating elements.

6. The liquid cooling system according to claim 5, characterized in that: The flexible thermal conductive pad is made of polyimide.

7. The liquid cooling system according to claim 1, characterized in that: The first liquid cooling plate includes a front first liquid cooling plate and a rear first liquid cooling plate, the liquid cooling module includes a first liquid cooling module, a second liquid cooling module, a third liquid cooling module and a fourth liquid cooling module, and the liquid cooling system is used for allowing cooling liquid to flow through the front first liquid cooling plate, the rear first liquid cooling plate, the first liquid cooling module, the second liquid cooling module, the third liquid cooling module and the fourth liquid cooling module in sequence.

8. The liquid cooling system according to claim 7, characterized in that: One of the multiple diversion parts of the second liquid cooling module and one of the multiple diversion parts of the third liquid cooling module are an integrally formed structure, and another one of the multiple diversion parts of the second liquid cooling module and another one of the multiple diversion parts of the third liquid cooling module are an integrally formed structure.

9. The liquid cooling system according to claim 7, characterized in that: It also includes a plurality of connecting pipes, which are made of polytetrafluoroethylene and are flexible, and are respectively connected to the first liquid cooling module and the second liquid cooling module, and the third liquid cooling module and the fourth liquid cooling module.

10. The liquid cooling system according to claim 7, characterized in that: The front first liquid cooling plate, the rear first liquid cooling plate, the first liquid cooling module, the second liquid cooling module, the third liquid cooling module and the fourth liquid cooling module of the liquid cooling system only form one series connecting pipeline.

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