Modelica-based multilayer sleeve temperature measuring instrument simulation model construction method

Abstract

The invention discloses a Modelica-based multi-layer sleeve temperature measuring instrument simulation model construction method, which comprises the following steps of: establishing a basic mathematical model of a temperature measuring instrument according to the structure, the material and the heat transfer principle of a thermometer body of the temperature measuring instrument; the structure of the non-standard temperature measuring instrument is simplified and decomposed, the heat transfer processes of all layers of sleeves are connected in series, and an overall mathematical model of the multi-layer sleeve temperature measuring instrument is established based on a basic mathematical model; modeling a heat transfer condition of a contact air gap between a sleeve of the multi-layer sleeve temperature measuring instrument and a thermometer body, combining the heat transfer condition with an overall mathematical model to establish a high-precision mathematical model, and then developing a simulation program by using a Modelica language and establishing a heat transfer model program of the multi-layer sleeve temperature measuring instrument based on the high-precision mathematical model; and performing simulation test and verification on the heat transfer model program, and then performing packaging to generate a simulation model. And the temperature measurement requirements in various industrial fields can be met.

Description

Technical Field

[0001] This application relates to the field of process instrument modeling and simulation, and particularly to a method for constructing a simulation model of a multi-layer casing temperature measurement instrument based on Modelica. Background Art

[0002] Process instruments play an important role in industrial production processes for detecting, displaying, recording, or controlling process parameters. Digital instruments and control systems connect various systems and devices in the entire industrial process into an information whole through their extended digital networks. The basic performance of detection instruments usually includes accuracy, variation, sensitivity, stability, and reliability, etc. In actual industrial measurements, different application scenarios have different performance requirements for instruments, so it is necessary to select appropriate detection instruments according to specific situations.

[0003] Existing temperature measurement instruments have two temperature measurement methods: contact type and non-contact type. Contact type temperature measurement instruments can be further divided into four categories according to the principle: expansion type, pressure type, thermal resistance, and thermoelectric effect. The temperature measurement instrument measures the temperature of the measured medium, and the process in which its temperature changes with the medium temperature is called the dynamic response of the temperature measurement instrument. The temperature response process can be represented by a differential equation or a transfer function. The main characteristic parameter in the response process is the time constant, and the size of this time constant usually depends on the material structure parameters of the temperature measurement instrument and the inherent properties of the measured medium, such as the specific heat capacity, density, thermal conductivity, measurement end volume, flow rate of the measured medium, etc.

[0004] Common industrial standard temperature measurement instruments include platinum rhodium 10 - platinum thermocouple (type S), nickel chromium - nickel silicon thermocouple (type K), platinum resistance temperature measurement instruments Pt100, Pt1000, Cu100, etc. There are corresponding standard requirements for the dynamic response time of standard temperature measurement instruments in the production process. However, for some high-standard and high-requirement industrial processes, such as temperature measurement in nuclear engineering, it is necessary to design various parameters affecting the response time according to the actual situation to meet the measurement requirements. However, existing non-standard temperature measurement instruments still have relatively large deficiencies in measurement accuracy, resulting in the accuracy of measurement results being affected, and further affecting the stability and safety of the entire industrial process. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a method for constructing a simulation model of a multi-layer casing temperature measurement instrument based on Modelica to solve the technical problem of relatively low measurement accuracy existing in non-standard multi-layer casing temperature measurement instruments.

[0006] According to the first aspect of the embodiments of this application, a method for constructing a simulation model of a multi-layer casing temperature measurement instrument based on Modelica is provided, including:

[0007] Based on the structure, material, and heat transfer principle of the thermometer body of the temperature measuring instrument, establish a basic mathematical model of the temperature measuring instrument;

[0008] Simplify and decompose the structure of the non-standard temperature measuring instrument, connect the heat transfer processes of each layer of the casing in series, and based on the basic mathematical model, establish an overall mathematical model of the multi-layer casing temperature measuring instrument;

[0009] Model the heat transfer situation of the contact air gap between the casing of the multi-layer casing temperature measuring instrument and the thermometer body, and combine it with the overall mathematical model to establish a high-precision mathematical model;

[0010] Based on the high-precision mathematical model, develop a simulation program using Modelica language to establish a heat transfer model program for the multi-layer casing temperature measuring instrument;

[0011] Conduct simulation tests and verification on the heat transfer model program;

[0012] Package the verified heat transfer model program to generate a simulation model of the temperature measuring instrument for practical applications.

[0013] According to the second aspect of the embodiments of the present application, provide a device for constructing a simulation model of a multi-layer casing temperature measuring instrument based on Modelica, including:

[0014] The first model establishment module is used to establish a basic mathematical model of the temperature measuring instrument according to the structure, material, and heat transfer principle of the thermometer body of the temperature measuring instrument;

[0015] The second model establishment module is used to simplify and decompose the structure of the non-standard temperature measuring instrument, connect the heat transfer processes of each layer of the casing in series, and based on the basic mathematical model, establish an overall mathematical model of the multi-layer casing temperature measuring instrument;

[0016] The third model establishment module is used to model the heat transfer situation of the contact air gap between the casing of the multi-layer casing temperature measuring instrument and the thermometer body, and combine it with the overall mathematical model to establish a high-precision mathematical model;

[0017] The simulation program development module is used to develop a simulation program using Modelica language based on the high-precision mathematical model to establish a heat transfer model program for the multi-layer casing temperature measuring instrument;

[0018] The model verification module is used to conduct simulation tests and verification on the heat transfer model program;

[0019] The model encapsulation generation module is used to package the verified heat transfer model program to generate a simulation model of the temperature measuring instrument for practical applications.

[0020] According to a third aspect of the embodiments of the present application, an electronic device is provided, including:

[0021] One or more processors;

[0022] A memory for storing one or more programs;

[0023] When the one or more programs are executed by the one or more processors, the one or more processors implement the method as described in the first aspect.

[0024] According to a fourth aspect of the embodiments of the present application, a computer-readable storage medium is provided, on which computer instructions are stored, and when the instructions are executed by a processor, the steps of the method as described in the first aspect are implemented.

[0025] The technical solutions provided by the embodiments of the present application may include the following beneficial effects:

[0026] As can be seen from the above embodiments, the present application models the contact air gap between the casing of the multi-layer casing temperature measuring instrument and the thermometer body, significantly improving the accuracy of the model; by modeling and simulating the dynamic response characteristics of the multi-layer casing temperature measuring instrument, the accuracy of the instrument design is improved, and pre-performance verification can be carried out before the product is put into actual application; by encapsulating the simulation model into a library, the scalability and portability of the device are improved; at the same time, through a standardized interface, model exchange and co-simulation with multiple software platforms are realized, further improving the modeling efficiency and accuracy, and promoting the optimization of the product development process.

[0027] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0029] Figure 1 is a schematic diagram of the structure of a three-layer casing temperature measuring instrument shown according to an exemplary embodiment.

[0030] Figure 2 is a flowchart of a method for constructing a simulation model of a multi-layer casing temperature measuring instrument based on Modelica shown according to an exemplary embodiment.

[0031] Figure 3 is a diagram showing the fmu interface of a multi-layer casing temperature measuring instrument shown according to an exemplary embodiment.

[0032] Figure 4Schematic diagram of a simulation device for a multi-layer casing temperature measurement instrument shown according to an exemplary embodiment. Detailed implementation mode

[0033] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0034] Figure 1 Schematic diagram of the structure of a three-layer casing temperature measurement instrument shown according to an exemplary embodiment. As Figure 1 shown, the three-layer casing temperature measurement instrument is generally cylindrical and has axial symmetry. The innermost part of the instrument is the temperature sensing element 1 for measuring temperature, and the temperature signal data is transmitted to the outside through the lead wire 2. There is a gas gap 6 between the temperature sensing element 1 and the instrument casing. The three-layer casing is, from the inside to the outside, the insulation layer 3, the protective casing 4, and the outer protective sleeve 5.

[0035] Figure 2 Flowchart of a method for constructing a simulation model of a multi-layer casing temperature measurement instrument based on Modelica shown according to an exemplary embodiment. As Figure 2 shown, it may include the following steps:

[0036] S1: Establish a basic mathematical model of the temperature measurement instrument according to the structure, material, and heat transfer principle of the thermometer body of the temperature measurement instrument; this step may include the following sub-steps:

[0037] S11: For the convective heat transfer coefficient between the sensor and the measured medium, its value is affected by various physical factors, and the mathematical model of the heat transfer coefficient is established as follows:

[0038]

[0039] In formula (1), is the heat transfer coefficient, and the unit is ; is the thermal conductivity of the fluid, and the unit is W / (m·K); is the characteristic dimension of the plate, and the unit is m; is the Grashof number; is the Prandtl number;

[0040] S12: When analyzing the heat transfer characteristics of the temperature measurement instrument, the heat conduction in the object follows Fourier's formula:

[0041]

[0042] In the formula ρ represents the comprehensive density of the sensor, c represents the specific heat capacity of the sensor, T represents the temperature of the sensor; t represents time; represents the heat flux density.

[0043] Following Equation (2) enables the model to accurately describe and calculate the heat conduction in each part of the temperature measuring instrument, providing a theoretical basis for the subsequent establishment of the mathematical model.

[0044] S13: According to the mathematical model of the heat transfer coefficient and the dimensions, structure, material, and boundary conditions of the thermometer body, establish the following basic mathematical model reflecting the response time of the temperature measuring instrument by following Fourier's formula:

[0045]

[0046] In Equation (3), represents the comprehensive density of the sensor, with the unit of ; represents the volume of the sensor, with the unit of ; represents the comprehensive specific heat of the sensor, with the unit of ; respectively represent the temperature of the sensor and the temperature of the measured medium, with the unit of ; represents the surface area of the sensor, with the unit of .

[0047] S2: Simplify and decompose the structure of the non-standard temperature measuring instrument, connect the heat transfer processes of each layer of the casing in series, and establish the overall mathematical model of the multi-layer casing temperature measuring instrument based on the basic mathematical model;

[0048] Specifically, for the non-standard thermal resistance temperature measuring instrument, consider the dimensions and materials of the thermometer body and the outer casing as the influencing factors on its dynamic temperature measurement performance; taking the three-layer casing temperature measuring instrument in Figure 1 as an example, take the dimensional parameters and material parameters of each layer of the three-layer casing temperature measuring instrument as the influencing factors for the subsequent model establishment, so as to flexibly adapt to the instrument casings with various different combinations of dimensions and materials, without having to re-establish complex models for each specific situation, which not only reduces the complexity and workload of modeling, but also improves the generality and practicality of the model.

[0049] Due to the small end area, the end effect can be ignored, and each layer of casing can be simplified to a cylindrical wall structure. A simplified scheme is adopted for the heat transfer process of each layer of casing. The inner layer temperature input value is set as the adjacent outer layer temperature output value, so that the temperature values at the critical points of adjacent layers are the same, and they are connected in series. Combining with the basic mathematical model described above, the overall mathematical model is established as follows:

[0050]

[0051] In Equation (4), represents the comprehensive density of the -th layer of the sensor casing, with the unit of ; represents the outer radius and inner radius of the -th layer of the sensor casing, with the unit of m; represents the comprehensive specific heat of the -th layer of the sensor casing, with the unit of J / (kg·K); represents the outer layer temperature, with the unit of K; represents the temperature of the -th layer of the casing, with the unit of K; represents the convective heat transfer coefficient between the -th layer of the sensor casing and the outer layer, with the unit of .

[0052] In actual situations, this model can also be used for heat transfer simulation of temperature measuring instruments with fewer or more than three layers of casings, and can be applicable to casing structures with different numbers of layers, having high accuracy, generality, and adaptability.

[0053] S3: Model the heat transfer situation of the contact air gap between the casing of the multi-layer casing temperature measuring instrument and the thermometer body, and combine it with the overall mathematical model to establish a high-precision mathematical model; this step may include the following sub-steps:

[0054] S31: Use Ansys to simulate the temperature response of the air gap between each structural layer, and fit the influence parameters of different compositions of the air gap on the temperature response of the multi-layer casing temperature measuring instrument;

[0055] Specifically, in Ansys, there is a plate with a thickness of L, which is divided into multiple layers. The middle layer is the gas gap, the left side of the plate is at a constant temperature TL, and the initial temperature of the plate is , and observe the temperature change on the right side of the plate through Ansys heat transfer.

[0056] When there is no air gap in the middle, based on the basic mathematical model and the mixed density and specific heat of the metal layer, the heat transfer parameters of the metal layer can be fitted to be When the middle is all air layer, the basic mathematical models can be connected in series to fit and obtain the heat transfer parameters of the air layer under normal temperature and pressure conditions as .

[0057] Calculate the mixed heat transfer parameters of two substances :

[0058]

[0059] Among them, are different constant values, is the thickness of the air layer.

[0060] S32: Combine the fitting result with the overall mathematical model of the multi-layer casing temperature measuring instrument to establish a high-precision mathematical model.

[0061] Specifically, substitute the mixed heat transfer parameters calculated in Equation (5) into the overall mathematical model of the insulating layer, and connect it in series with Equation (4), so that the model can reflect the influence of the air gap between the thermometer body and the casing on heat conduction, and more accurately describe the actual heat transfer process, to obtain the high-precision mathematical model of the multi-layer casing temperature measuring instrument:

[0062]

[0063] S4: Based on the high-precision mathematical model, develop a simulation program using Modelica language to establish a heat transfer model program for the multi-layer casing temperature measuring instrument; this step may include the following sub-steps:

[0064] S41: Define the variable types used in the simulation program, assign dimension attributes, and define relevant variables;

[0065] Specifically, set the variable types such as , , etc. that directly affect the thermal response time as parameters, set the temperature of the measured medium as an input variable, and set the temperature of the temperature measuring instrument that changes in real time with time as an output variable, so as to ensure that the system fully models various physical quantities in the heat transfer process.

[0066] S42: Based on the high-precision mathematical model, use Modelica language to implement the dynamic response simulation of the multi-layer casing temperature measuring instrument to obtain a simulation program;

[0067] Specifically, in the simulation program, the geometric structure of the multi-layer casing temperature measuring instrument and the material properties of each layer are defined, and the simulation environment is set. Then, the high-precision mathematical model is simulated and modeled using the Modelica language to accurately simulate the dynamic response process of the multi-layer casing temperature measuring instrument.

[0068] S43: Perform dimensional check before compilation.

[0069] Specifically, the system will perform a dimensional check to ensure the physical correctness of the equations and prevent simulation errors caused by dimensional mismatches. This step can ensure the consistency of the model at the physical and mathematical levels, thereby improving the accuracy and reliability of the simulation results.

[0070] S5: Conduct simulation tests and verification on the heat transfer model program to verify the accuracy and reliability of the model; this step may include the following sub-steps:

[0071] S51: Calculate and check the boundary conditions and internal parameters of the model in the simulation program;

[0072] Specifically, check whether the boundary conditions set in the simulation program meet the requirements of practical applications to ensure their physical rationality; check whether the internal parameters of the model are set correctly to ensure the correct basic settings of the simulation model and provide accurate initial conditions for subsequent calculations.

[0073] S52: Call the internal solver to perform simulation calculations and check the calculation results;

[0074] Specifically, by calling the internal solver to execute the dynamic response simulation of the model, calculate the temperature change process of the multi-layer casing temperature measuring instrument, record the key parameters therein, and check the physical rationality of the results.

[0075] S53: View the list of calculation result parameters and modify them as needed to verify the accuracy and stability of the model.

[0076] Specifically, after the simulation calculation is completed, a list of result parameters containing each key variable will be generated. The input parameters of the simulation program can be modified and recalculated, and the accuracy and stability of the model can be verified through the values in the list of result parameters. To facilitate observing the influence of changes in various parameter variables on the response time of the multi-layer casing temperature measuring instrument, and output interfaces are added. That is, the time required for the output to change to 63.2% of the range change in the first-order step response, which is usually called the time constant. For industrial temperature measurement by temperature measuring instruments, the time required for the output of a common temperature measuring instrument to change to 50% of the range change Indicates the thermal response time. This design enables the model to have good observability, facilitating parameter adjustment and optimization.

[0077] S6: Package the verified heat transfer model program to generate a simulation model of the temperature measuring instrument for practical applications.

[0078] Specifically, package the verified simulation program into a general fmu interface to generate a simulation model of the temperature measuring instrument for practical applications, enabling it to be applicable to co-simulation on multiple platforms including Matlab-Simulink, improving the portability and scalability of the model. Taking Figure 3 the display diagram of the fmu interface of the multi-layer sleeve temperature measuring instrument as an example, where the input variable N_T05 of the fmu interface represents the set current thermal response time of the temperature measuring instrument the input variable N_T0632 represents the set current thermal response time of the instrument the input variable T0 represents the input current temperature of the measured medium, and the input variable mode represents the set simulation mode (using list parameters, using , using three types); the output variable T3 represents the temperature of the temperature measuring instrument, the output variable tau05_3 represents the current simulated thermal response time of the temperature measuring instrument the output variable tau0632_3 represents the thermal response time.

[0079] Corresponding to the foregoing embodiments of the method for constructing a simulation model of a multi-layer sleeve temperature measuring instrument based on Modelica, the present application also provides an embodiment of a device for constructing a simulation model of a multi-layer sleeve temperature measuring instrument based on Modelica.

[0080] Figure 4 is a schematic diagram of a multi-layer sleeve temperature measuring instrument simulation device shown according to an exemplary embodiment. As Figure 4 shown, for this device, it includes:

[0081] The first model establishment module 1 is used to establish a basic mathematical model of the temperature measuring instrument according to the structure, material, and heat transfer principle of the thermometer body of the temperature measuring instrument;

[0082] The second model establishment module 2 is used to simplify and decompose the non-standard temperature measuring instrument structure, connect the heat transfer processes of each layer of the sleeve in series, and establish an overall mathematical model of the multi-layer sleeve temperature measuring instrument based on the basic mathematical model;

[0083] The third model establishment module 3 is configured to model the heat transfer situation of the contact air gap between the casing of the multi-layer casing temperature measuring instrument and the thermometer body, and combine it with the overall mathematical model to establish a high-precision mathematical model;

[0084] The simulation program development module 4 is configured to develop a simulation program using the Modelica language based on the high-precision mathematical model to establish a heat transfer model program for the multi-layer casing temperature measuring instrument;

[0085] The model verification module 5 is configured to perform simulation tests and verification on the heat transfer model program;

[0086] The model encapsulation generation module 6 is configured to encapsulate the verified heat transfer model program to generate a simulation model of the temperature measuring instrument that can be used for actual applications.

[0087] Regarding the device in the above embodiments, the specific manners in which each module performs operations have been described in detail in the embodiments related to the method, and will not be elaborated here.

[0088] For the device embodiments, since they basically correspond to the method embodiments, reference may be made to the partial descriptions of the method embodiments for the relevant parts. The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this application. Those of ordinary skill in the art can understand and implement it without creative efforts.

[0089] After considering the specification and practicing the content disclosed herein, those skilled in the art will readily conceive of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the claims.

[0090] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A method for constructing a simulation model of a multilayer casing temperature measuring instrument based on Modelica, characterized in that: include: According to the structure, material and heat transfer principle of the temperature measuring instrument thermometer body, the basic mathematical model of the temperature measuring instrument is established; The structure of the non-standard temperature measuring instrument is simplified and decomposed, the heat transfer process of each layer of casing is connected in series, and based on the basic mathematical model, the overall mathematical model of the multi-layer casing temperature measuring instrument is established; Modeling the heat transfer of the contact air gap between the multi-layer sleeve temperature measuring instrument sleeve and the thermometer body, and combining it with the overall mathematical model to establish a high-precision mathematical model; Based on the high-precision mathematical model, a simulation program is developed using the Modelica language to establish a heat transfer model program for a multilayer casing temperature measuring instrument; Conducting simulation testing and verification on the heat transfer model program; The verified heat transfer model program is encapsulated to generate a temperature measurement instrument simulation model that can be used in practical applications.

2. The method according to claim 1, characterized in that According to the structure, material and heat transfer principle of the temperature measuring instrument thermometer body, the basic mathematical model of the temperature measuring instrument is established, including: For the convection heat transfer coefficient between the sensor and the measured medium , its value is affected by many physical factors, and the mathematical model of heat transfer coefficient is established as follows: ； In formula (1), is the heat transfer coefficient, in units of ; is the thermal conductivity of the fluid, in W / (m·K); is the characteristic size of the plate, in m; is the number of grit; is the Prandtl number; According to the mathematical model of the heat transfer coefficient and the size, structure, material and boundary conditions of the thermometer body, a basic mathematical model reflecting the response time of the temperature measuring instrument is established as follows: ； In formula (2), Indicates the comprehensive density of the sensor in units of ; Indicates the volume of the sensor in units of ; Indicates the comprehensive specific heat of the sensor, in units of ; Respectively represent the temperature of the sensor and the temperature of the measured medium, the unit is K; Represents the surface area of ​​the sensor in units of .

3. The method according to claim 1, characterized in that The structure of the non-standard temperature measuring instrument is simplified and decomposed, the heat transfer process of each layer of casing is connected in series, and based on the basic mathematical model, the overall mathematical model of the multi-layer casing temperature measuring instrument is established, including: For non-standard temperature measuring instruments, the volume and surface area of ​​the sensor are calculated using the structural parameters of each layer of the non-standard thermal resistance temperature measuring instrument, and the end effect is ignored. The heat transfer process of each layer of the casing is connected in series. Combined with the mathematical model of the temperature measuring instrument, the overall mathematical model is established as follows: ； In formula (3), Indicates the sensor The comprehensive density of the layer casing is ; and Indicates the sensor The outer radius and inner radius of the layer casing, in meters; Indicates the sensor The comprehensive specific heat of the layer casing, unit is ; represents the outer layer temperature in K; Indicates The temperature of the layer casing, in K; Indicates the sensor The convection heat transfer coefficient between the first layer and the outer layer is in .

4. The method according to claim 1, characterized in that: The heat transfer condition of the contact air gap between the multi-layer sleeve temperature measuring instrument sleeve and the thermometer body is modeled, and a high-precision mathematical model is established based on the overall mathematical model, including: Ansys was used to simulate the temperature response of the air gap between each structural layer, and the parameters affecting the temperature response of the multilayer casing temperature measurement instrument with different air gap compositions were fitted. The fitting results are combined with the overall mathematical model of the multilayer casing temperature measuring instrument to establish a high-precision mathematical model.

5. The method according to claim 1, characterized in that Use Modelica language to develop simulation program and establish heat transfer model program of multi-layer casing temperature measuring instrument, including: Define the variable types used in the simulation program, assign dimension attributes, and define related variables; Based on the high-precision mathematical model, the dynamic response simulation of the multilayer casing temperature measuring instrument is realized using the Modelica language to obtain a simulation program; Perform dimension checking before compiling.

6. The method according to claim 1, characterized in that The heat transfer model program is simulated and tested and verified, including: Calculate and check the boundary conditions and internal parameters of the model in the simulation program; Call the internal solver to perform simulation calculations and check the calculation results; Review the list of calculation result parameters and modify them as needed to verify the accuracy and stability of the model.

7. The method according to claim 1, characterized in that The verified heat transfer model program is packaged to generate a temperature measurement instrument simulation model that can be used in practical applications, including: The verified simulation program is encapsulated as a universal FMU interface to generate a temperature measurement instrument simulation model that can be used in practical applications, making it suitable for multi-platform joint simulation.

8. A device for constructing a simulation model of a multilayer casing temperature measuring instrument based on Modelica, characterized in that: include: The first model building module is used to build a basic mathematical model of the temperature measuring instrument according to the structure, material and heat transfer principle of the temperature measuring instrument thermometer body; The second model building module is used to simplify and decompose the structure of the non-standard temperature measuring instrument, connect the heat transfer process of each layer of casing in series, and establish an overall mathematical model of the multi-layer casing temperature measuring instrument based on the basic mathematical model; The third model building module is used to model the heat transfer of the contact air gap between the multi-layer sleeve temperature measuring instrument sleeve and the thermometer body, and combine it with the overall mathematical model to establish a high-precision mathematical model; A simulation program development module, used to develop a simulation program based on the high-precision mathematical model using the Modelica language, and to establish a heat transfer model program for a multi-layer casing temperature measuring instrument; A model verification module, used for performing simulation testing and verification on the heat transfer model program; The model packaging generation module is used to package the verified heat transfer model program and generate a temperature measurement instrument simulation model that can be used in practical applications.

9. An electronic device, characterized in that: include: one or more processors; A memory for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the instruction is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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