Crystal plasticity finite element modeling method and device, medium and electronic equipment

Abstract

The invention relates to the technical field of material analysis, in particular to a crystal plasticity finite element modeling method, a crystal plasticity finite element modeling device, a storage medium and electronic equipment. The crystal plasticity finite element modeling method comprises the following steps: collecting grain information of a given material sample; performing crystal grain division based on the crystal grain information to obtain a crystal grain data file, and determining grid parameters based on a crystal grain with a minimum crystal grain morphology area in the crystal grain information; creating a grain geometric model according to the grain data file, creating a grid model according to the grid parameters, and mapping the grain geometric model to the grid model to obtain a crystal plasticity finite element grid model; and endowing a boundary condition and a constitutive relation to the crystal plasticity finite element mesh model so as to realize crystal plasticity finite element simulation. According to the crystal plasticity finite element modeling method provided by the invention, the modeling calculation efficiency can be improved while the model precision is ensured.

Description

Technical Field

[0001] The present disclosure relates to the technical field of material analysis, and particularly to a crystal plasticity finite element modeling method, a crystal plasticity finite element modeling device, a storage medium, and an electronic device. Background Art

[0002] The research on crystal plasticity has extensive applications in multiple fields. In the aerospace field, it can be used to study the fatigue fracture mechanism of materials and predict the fatigue life. In the field of metal material processing, it helps to understand the deformation behavior of materials during the processing, so as to improve the macroscopic mechanical properties by regulating the microstructure.

[0003] The setting of the true morphology and orientation information of grains is indispensable in the process of crystal plasticity modeling, and is of great significance for improving the accuracy and reliability of the model. In the existing crystal plasticity modeling methods, the process of repeatedly processing and analyzing the metallographic diagram is cumbersome and will also cause image distortion, and there is a lack of effective processing of small grains and grain boundary details, thus having an adverse impact on the model accuracy and calculation efficiency.

[0004] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0005] The purpose of the present disclosure is to provide a crystal plasticity finite element modeling method, a crystal plasticity finite element modeling device, a storage medium, and an electronic device, aiming to solve the problem of low calculation efficiency of crystal plasticity finite element modeling.

[0006] Other characteristics and advantages of the present disclosure will become apparent through the following detailed description, or will be partially learned through the practice of the present disclosure.

[0007] According to one aspect of the present disclosure, a crystal plasticity finite element modeling method is provided, including: collecting grain information of a given material specimen; obtaining a grain data file based on the grain information for grain division, and determining grid parameters based on the grain with the smallest grain morphology area in the grain information; creating a grain geometric model according to the grain data file, creating a grid model according to the grid parameters, and mapping the grain geometric model to the grid model to obtain a crystal plasticity finite element grid model; assigning boundary conditions and constitutive relations to the crystal plasticity finite element grid model to achieve crystal plasticity finite element simulation.

[0008] Optionally, the collecting the grain information of a given material specimen includes: collecting the grain information using EBSD technology; wherein, the grain information includes the position coordinates and Euler angles of the grains.

[0009] Optionally, obtaining the grain data file by partitioning grains based on the grain information includes: reading the grain information using the MTEX toolbox of MATLAB and partitioning the grains to output the grain data file.

[0010] Optionally, determining the mesh parameters based on the grain with the smallest grain morphology area in the grain information includes: drawing a grain morphology map based on the grain information; determining the grain with the smallest area according to the grain morphology map, and determining the size of the mesh unit according to the grain with the smallest area; performing mesh partitioning based on the size of the grain morphology map and the size of the mesh unit to obtain the mesh parameters.

[0011] Optionally, mapping the grain geometric model to the mesh model to obtain the crystal plasticity finite element mesh model includes: assigning grains to corresponding mesh units in ABAQUS according to the grain orientation information in the grain data file to create a correspondence between the mesh units and the grains; when a mesh unit corresponds to multiple grains, determining the grains corresponding to the mesh unit according to the areas of the grains to update the correspondence; creating the crystal plasticity finite element mesh model based on the correspondence.

[0012] Optionally, before obtaining the grain data file by partitioning grains based on the grain information and determining the mesh parameters based on the grain with the smallest grain morphology area in the grain information, the method further includes: removing small-sized grains to update the grain information; and / or smoothing the boundaries of the grains to update the grain information.

[0013] Optionally, before assigning boundary conditions and constitutive relations to the crystal plasticity finite element mesh model, the method further includes: configuring the boundary conditions and the constitutive relations according to the actual stress situation of the given material specimen.

[0014] According to a second aspect of the present disclosure, there is provided a crystal plasticity finite element modeling device, including: a collection module for collecting grain information of a given material specimen; a partitioning module for obtaining a grain data file by partitioning grains based on the grain information and determining mesh parameters based on the grain with the smallest grain morphology area in the grain information; a modeling module for creating a grain geometric model according to the grain data file, creating a mesh model according to the mesh parameters, and mapping the grain geometric model to the mesh model to obtain a crystal plasticity finite element mesh model; a simulation module for assigning boundary conditions and constitutive relations to the crystal plasticity finite element mesh model to implement crystal plasticity finite element simulation.

[0015] According to a third aspect of the present disclosure, there is provided a computer-readable storage medium having stored thereon a computer program, which when executed by a processor, implements the crystal plasticity finite element modeling method in the above embodiments.

[0016] According to a fourth aspect of the embodiments of the present disclosure, there is provided an electronic device, characterized by comprising: one or more processors; a storage device for storing one or more programs, which when executed by the one or more processors, cause the one or more processors to implement the crystal plasticity finite element modeling method in the above embodiments.

[0017] The exemplary embodiments of the present disclosure may have some or all of the following beneficial effects:

[0018] In the technical solutions provided by some embodiments of the present disclosure, when performing crystal plasticity finite element modeling on a given material specimen, the grain geometry model is subjected to mesh mapping, so that the mesh shape of the model is more uniform and regular, the quality of the mesh is improved, and the number of mesh elements is greatly reduced, thereby enabling the computational efficiency of model simulation to be greatly improved; in addition, by determining the mesh parameters based on the grain with the smallest grain morphology area, the detailed features of each grain in the given material specimen can be retained to the greatest extent, and thus, when the mesh mapping operation is performed to improve the computational efficiency, the accuracy of the model is not significantly affected.

[0019] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure and used together with the specification to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts. In the drawings:

[0021] Figure 1 Schematically showing a flowchart of a crystal plasticity finite element modeling method in an exemplary embodiment of the present disclosure;

[0022] Figure 2 Schematically showing a grain morphology diagram in an exemplary embodiment of the present disclosure;

[0023] Figure 3 Schematically showing a grain morphology diagram drawn after processing grain information in an exemplary embodiment of the present disclosure;

[0024] Figure 4Schematically show a comparison diagram of the number of line segment cusps in a grain morphology map in an exemplary embodiment of the present disclosure;

[0025] Figure 5 Schematically show a schematic diagram of a grain geometry model in an exemplary embodiment of the present disclosure;

[0026] Figure 6 Schematically show a schematic diagram of a crystal plasticity finite element mesh model after mesh mapping in an exemplary embodiment of the present disclosure;

[0027] Figure 7 Schematically show a schematic diagram of an original crystal plasticity finite element mesh model;

[0028] Figure 8 Schematically show a strain nephogram of a crystal plasticity finite element mesh model after mesh mapping in an exemplary embodiment of the present disclosure;

[0029] Figure 9 Schematically show a strain nephogram of an original crystal plasticity finite element mesh model;

[0030] Figure 10 Schematically show a comparison diagram of stress-strain curves of a crystal plasticity finite element mesh model in an exemplary embodiment of the present disclosure;

[0031] Figure 11 Schematically show a schematic flow diagram of crystal plasticity finite element modeling and simulation in an exemplary embodiment of the present disclosure;

[0032] Figure 12 Schematically show a schematic diagram of the composition of a crystal plasticity finite element modeling device in an exemplary embodiment of the present disclosure;

[0033] Figure 13 Schematically show a schematic diagram of the structure of a computer system of an electronic device in an exemplary embodiment of the present disclosure. Detailed implementation manners

[0034] Now, the exemplary embodiments will be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0035] In addition, the described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present disclosure. However, those skilled in the art will realize that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be employed. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present disclosure.

[0036] The block diagrams shown in the drawings are only functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor devices and / or microcontroller devices.

[0037] The flowcharts shown in the drawings are only illustrative and do not necessarily include all the contents and operations / steps, nor do they necessarily need to be executed in the described order. For example, some operations / steps can be decomposed, while some operations / steps can be combined or partially combined, so the actual execution order may change according to the actual situation.

[0038] The research on crystal plasticity has extensive applications in multiple fields. In the aerospace field, it can be used to study the fatigue fracture mechanism of materials and predict the fatigue life. In the field of metal material processing, it helps to understand the deformation behavior of materials during the processing, so as to improve the macroscopic mechanical properties by regulating the microstructure.

[0039] In recent years, the research on crystal plasticity has developed to the combination with finite element modeling, which can set the crystal plasticity constitutive relationship and handle the plastic deformation of crystals under complex external boundaries. The setting of the true morphology and orientation information of grains is indispensable in the process of crystal plasticity modeling and is of great significance for improving the accuracy and reliability of the model.

[0040] In the prior art, a finite element model can be established based on the grains in the true metallographic structure. This method collects the metallographic digital images of real materials, obtains the grain gray binary image through preprocessing, performs connectivity recognition on it to obtain the grain boundary position and shape map of the grains, and then imports the grain shape map into the finite element software ABAQUS for modeling. This method can more accurately reflect the actual morphology of the grains, but the process of processing and analyzing the metallographic images multiple times is cumbersome and will also cause image distortion, and the obtained crystal model does not include the grain orientation.

[0041] Another crystal plasticity finite element modeling method is to use the MTEX2Gmesh toolkit in MATLAB software to call the Gmesh software, which realizes the process flow of crystal plasticity finite element modeling and reduces the manual operation process of manually inputting information such as grain orientations. However, this method lacks effective processing of small grains and grain boundary details, thus causing adverse effects on the model accuracy and calculation efficiency.

[0042] Therefore, in view of one or more deficiencies in the prior art, the present disclosure provides a crystal plasticity finite element modeling method that, while realizing crystal plasticity finite element modeling, retains the accuracy of the model and improves the calculation efficiency.

[0043] The implementation details of the technical solutions of the embodiments of the present disclosure are elaborated in detail below.

[0044] Figure 1 Schematically shows a flowchart of a crystal plasticity finite element modeling method in an exemplary embodiment of the present disclosure. As Figure 1 shown, the crystal plasticity finite element modeling method includes steps S101 to S107:

[0045] Step S101, collecting grain information of a given material specimen;

[0046] Step S103, performing grain division based on the grain information to obtain a grain data file, and determining mesh parameters based on the grain with the smallest grain morphology area in the grain information;

[0047] Step S105, creating a grain geometry model according to the grain data file, creating a mesh model according to the mesh parameters, and mapping the grain geometry model to the mesh model to obtain a crystal plasticity finite element mesh model;

[0048] Step S107, assigning boundary conditions and constitutive relations to the crystal plasticity finite element mesh model to implement crystal plasticity finite element simulation.

[0049] In the technical solutions provided by some embodiments of the present disclosure, when performing crystal plasticity finite element modeling for a given material specimen, the grain geometry model is mesh-mapped, making the mesh shape of the model more uniform and regular, improving the quality of the mesh, and greatly reducing the number of mesh elements. Furthermore, the calculation efficiency of model simulation can be greatly improved. Additionally, by determining the mesh parameters based on the grain with the smallest grain morphology area, the detailed features of each grain in the given material specimen can be retained to the greatest extent. Thus, when the mesh mapping operation realizes the improvement of calculation efficiency, the accuracy of the model is not significantly affected.

[0050] Next, each step of the crystal plasticity finite element modeling method in this exemplary embodiment will be described in more detail with reference to the accompanying drawings and embodiments.

[0051] In step S101, the grain information of a given material sample is collected.

[0052] In an embodiment of the present disclosure, the collecting the grain information of a given material sample includes: collecting the grain information using EBSD technology; wherein, the grain information includes the position coordinates and Euler angles of the grains.

[0053] Specifically, EBSD, the full name is Electron Backscattered Diffraction, and the main feature of EBSD is to perform diffraction with a spatial resolution of sub-micron level while retaining the conventional features of a scanning electron microscope, and to give crystallographic data.

[0054] Use EBSD to scan a given material sample to obtain grain information (i.e., EBSD data) including position coordinates and Euler angles and output it.

[0055] In step S103, grain division is performed based on the grain information to obtain a grain data file, and grid parameters are determined based on the grain with the smallest grain morphology area in the grain information.

[0056] On the one hand, grain division is performed based on the grain information to obtain a grain data file.

[0057] In an embodiment of the present disclosure, the performing grain division based on the grain information to obtain a grain data file includes: using the MTEX toolbox of MATLAB to read the grain information and perform grain division to output the grain data file.

[0058] Import the grain information into MATLAB, and call the METX toolbox to generate a grain data file containing model node information and grain orientation data of each grain in ABAQUS according to the position coordinates and Euler angles of each grain.

[0059] On the other hand, grid parameters are determined based on the grain with the smallest grain morphology area in the grain information.

[0060] In an embodiment of the present disclosure, the determining grid parameters based on the grain with the smallest grain morphology area in the grain information includes: drawing a grain morphology map based on the grain information; determining the grain with the smallest area according to the grain morphology map, and determining the size of the grid unit according to the grain with the smallest area; performing grid division based on the size of the grain morphology map and the size of the grid unit to obtain grid parameters.

[0061] Figure 2 Schematically shows a grain morphology map in an exemplary embodiment of the present disclosure. As Figure 2As shown, it is a grain morphology map drawn based on grain information. Refer to Figure 2 As shown, each color patch represents a kind of grain, and the grain with the smallest area can be selected from them.

[0062] When dividing the grid, it is necessary to ensure that the grain with the smallest area covers a preset number of cells, and then determine the size of the grid cell based on this. The preset number can be adjusted as needed. For example, if the grain with the smallest area is at least mapped to 10 grid cells, then the size of the grid cell can be determined according to the area of the grain and the number of grid cells.

[0063] According to the grain morphology map, the length and width of the scanning area of EBSD can be obtained. By dividing the scanning area into grids according to the determined size of the grid cell, the final grid parameters can be obtained, including the number of grid cells corresponding to the grid length, the number of grid cells corresponding to the grid width, and the size of the grid cell.

[0064] It should be noted that in the present disclosure, the order of steps for grain division and determining grid parameters is not limited. It can be one after the other or carried out simultaneously.

[0065] In an embodiment of the present disclosure, before obtaining the grain data file by dividing grains based on the grain information and determining grid parameters based on the grain with the smallest morphology area in the grain information, the method further includes: removing small-sized grains to update the grain information; and / or smoothing the boundaries of the grains to update the grain information.

[0066] Specifically, the grain information can be processed, such as removing small-sized grains and smoothing the serrated grain boundaries (grain boundaries). These two methods can be used alternatively or simultaneously. The above can be used for data processing and optimization through the MTEX toolbox in MATLAB software.

[0067] When removing small-sized grains, a size threshold can be set, and when it is smaller than the set threshold, it will be removed. Or a quantity can be set to remove a preset number of grains with the smallest size. The present disclosure does not make a limitation here.

[0068] When performing boundary smoothing processing, it can be completed by means of boundary value smoothing, such as boundary smoothing according to the mean and standard deviation, or an image processing method for smoothing the boundary, such as an edge smoothing algorithm or a contour approximation algorithm, to reduce boundary noise, etc. Of course, other methods such as model training and adaptive smoothing can also be used, and the present disclosure does not make a limitation here.

[0069] Figure 3 Schematically shows a grain morphology map drawn after processing grain information in an exemplary embodiment of the present disclosure.Figure 3 This is the result after removing and smoothing the grain information, compared with the original unprocessed grain morphology Figure 2 and the processed grain morphology Figure 3 It can be seen that Figure 3 the grain boundaries in [[ ]] have no obvious serrated cusps and are basically smoothed

[0070] Figure 4 Schematically shows a comparison diagram of the number of segment cusps in a grain morphology diagram according to an exemplary embodiment of the present disclosure Figure 4 It shows the comparison of the number of cusps of each segment in the original unprocessed grain morphology and the grain morphology after removal and smoothing processing. It can be seen that the number of cusps on more segments in the processed grain morphology diagram decreases, and overall, the total number of cusps has been greatly reduced

[0071] Based on the above method, the grid complexity can be reduced, thereby reducing the calculation cost, and the problem of non - convergence in finite element analysis can be avoided to a certain extent

[0072] In step S105, a grain geometry model is created according to the grain data file, and a grid model is created according to the grid parameters, and the grain geometry model is mapped to the grid model to obtain a crystal plasticity finite element grid model

[0073] Figure 5 Schematically shows a schematic diagram of a grain geometry model according to an exemplary embodiment of the present disclosure. Specifically, the grain data file includes model node information. The grain data file is imported into ABAQUS for geometric modeling to obtain a grain geometry model as shown in Figure 5 [[ ]]

[0074] At the same time, a grid model is created according to the grid parameters, and then the grain geometry model is mapped into the grid model. In an embodiment of the present disclosure, the mapping of the grain geometry model to the grid model to obtain a crystal plasticity finite element grid model includes: according to the grain orientation information in the grain data file, grains are assigned to corresponding grid cells in ABAQUS to create a correspondence between the grid cells and the grains; when a grid cell corresponds to multiple grains, the grains corresponding to the grid cell are determined according to the areas of the grains to update the correspondence; and a crystal plasticity finite element grid model is created based on the correspondence

[0075] Specifically, the grain data file includes grain orientation information. According to the grain orientation information, a grid mapping operation is performed in ABAQUS to accurately assign the grain orientation to the corresponding grid cells

[0076] During the mapping process, it is possible that multiple grains are mapped into the same grid cell. In this case, the grain with the largest area occupied by the grain at this grid cell can be selected to achieve a one-to-one correspondence between the grain and the grid cell. If there are multiple grains with the largest proportion, one of them can be randomly selected.

[0077] Figure 6 Schematically showing a schematic diagram of a crystal plasticity finite element mesh model mapped by a grid in an exemplary embodiment of the present disclosure, Figure 7 Schematically showing a schematic diagram of an original crystal plasticity finite element mesh model. Comparing Figure 6 and Figure 7 , Figure 6 , the mesh shape of the model is more uniform and regular, and the quality of the mesh is improved. In addition Figure 6 the mesh model after grid mapping contains 10,000 grids, while Figure 7 the mesh model without grid mapping contains 70,163 grids. Figure 6 The number of grids is greatly reduced, so the refinement of the model and the calculation efficiency can be effectively improved.

[0078] In step S107, boundary conditions and constitutive relations are assigned to the crystal plasticity finite element mesh model to implement crystal plasticity finite element simulation.

[0079] In an embodiment of the present disclosure, before assigning boundary conditions and constitutive relations to the crystal plasticity finite element mesh model, the method further includes: configuring the boundary conditions and the constitutive relations according to the actual stress situation of the given material specimen.

[0080] Based on the actual working environment of the given material specimen, the real stress situation is obtained, and periodic boundary conditions are applied to the model in ABAQUS and a separate material model is assigned to each grain, so as to implement crystal plasticity finite element simulation.

[0081] Next, the simulation results of the crystal plasticity finite element mesh model after grid mapping and the original crystal plasticity finite element mesh model without grid mapping will be compared.

[0082] Figure 8 Schematically showing a strain nephogram of a crystal plasticity finite element mesh model after grid mapping in an exemplary embodiment of the present disclosure, Figure 9 Schematically showing a strain nephogram of an original crystal plasticity finite element mesh model. Comparing Figure 8 and Figure 9It can be seen that the overall strain distributions and average strains of the two figures are basically the same. That is to say, the influence of mesh mapping on the strain of the model is small and can be ignored. The crystal plasticity finite element mesh model after mesh mapping can completely replace the original crystal plasticity finite element mesh model without mesh mapping.

[0083] Figure 10 Schematically shows a comparison diagram of stress-strain curves of a crystal plasticity finite element mesh model in an exemplary embodiment of the present disclosure. As Figure 10 shown, it shows the stress-strain curves of the crystal plasticity finite element mesh model after mesh mapping and the crystal plasticity finite element mesh model without mesh mapping. The two curves basically coincide, which also shows that the difference in the stress-strain conditions of the models with and without mesh mapping is small. It can be considered that the mesh mapping operation does not significantly affect the accuracy of the model in the current model analysis and can replace the original model and greatly improve the calculation efficiency.

[0084] Figure 11 Schematically shows a schematic flow chart of a crystal plasticity finite element modeling and simulation in an exemplary embodiment of the present disclosure. Referring to Figure 11 shown, the crystal plasticity finite element modeling and simulation mainly includes the following steps:

[0085] Step S1101, obtain the EBSD data of the additive manufacturing specimen (i.e., the given material specimen) to obtain grain information including position coordinates, Euler angles, etc.;

[0086] Step S1102, perform data processing using the MTEX toolbox of MATLAB, including removing small grains and planar grain boundaries, to obtain model node information and grain orientation information;

[0087] Step S1103, perform geometric modeling using ABAQUS;

[0088] Step S1104, perform mesh mapping in ABAQUS;

[0089] Step S1105, apply periodic boundary conditions and constitutive relations to the model in ABAQUS to achieve crystal plasticity finite element simulation.

[0090] Based on the above method, obtain the grain information of the given material specimen using EBSD; use the MTEX toolbox in MATLAB software to perform processing such as removing small grains and smoothing grain boundaries to obtain optimized grain data; import the output data into ABAQUS for geometric modeling and mesh mapping operations to obtain the corresponding mesh model; set boundary conditions and constitutive relations in ABAQUS to achieve a complete finite element modeling process. The process of crystal plasticity finite element modeling is realized, ensuring the accuracy of the model while improving the calculation efficiency.

[0091] Figure 12 Schematically shows a schematic diagram of the composition of a crystal plasticity finite element modeling device in an exemplary embodiment of the present disclosure. As Figure 12 shown, the crystal plasticity finite element modeling device 1200 may include an acquisition module 1201, a division module 1202, a modeling module 1203, and a simulation module 1204.

[0092] Among them:

[0093] The acquisition module 1201 is used to acquire the grain information of a given material specimen;

[0094] The division module 1202 is used to perform grain division based on the grain information to obtain a grain data file, and determine grid parameters based on the grain with the smallest grain morphology area in the grain information;

[0095] The modeling module 1203 is used to create a grain geometric model according to the grain data file, create a grid model according to the grid parameters, and map the grain geometric model to the grid model to obtain a crystal plasticity finite element grid model;

[0096] The simulation module 1204 is used to assign boundary conditions and constitutive relations to the crystal plasticity finite element grid model to achieve crystal plasticity finite element simulation.

[0097] According to an exemplary embodiment of the present disclosure, the acquisition module 1201 is used to acquire the grain information using EBSD technology; wherein, the grain information includes the position coordinates and Euler angles of the grains.

[0098] According to an exemplary embodiment of the present disclosure, the division module 1202 is used to read the grain information using the MTEX toolbox of MATLAB and perform grain division to output the grain data file.

[0099] According to an exemplary embodiment of the present disclosure, the division module 1202 is further used to draw a grain morphology map based on the grain information; determine the grain with the smallest area according to the grain morphology map, and determine the size of the grid unit according to the grain with the smallest area; perform grid division based on the size of the grain morphology map and the size of the grid unit to obtain grid parameters.

[0100] According to an exemplary embodiment of the present disclosure, the modeling module 1203 is used to assign grains to corresponding grid units in ABAQUS according to the grain orientation information in the grain data file to create a correspondence between the grid units and the grains; when a grid unit corresponds to multiple grains, determine the grain corresponding to the grid unit according to the area of each grain to update the correspondence; create the crystal plasticity finite element grid model based on the correspondence.

[0101] According to an exemplary embodiment of the present disclosure, the acquisition module 1201 is further configured to remove small-sized grains to update the grain information before obtaining the grain data file based on the grain division of the grain information and determining the grid parameters based on the grain with the smallest grain morphology area in the grain information; and / or smooth the boundaries of the grains to update the grain information.

[0102] According to an exemplary embodiment of the present disclosure, the simulation module 1204 is further configured to configure the boundary conditions and the constitutive relationship according to the actual stress condition of the given material specimen.

[0103] The specific details of each module in the above crystal plasticity finite element modeling device 1200 have been described in detail in the corresponding crystal plasticity finite element modeling method, and thus will not be elaborated herein.

[0104] It should be noted that although several modules or units of the device for action execution are mentioned in the above detailed description, such a division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of the two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0105] In an exemplary embodiment of the present disclosure, a storage medium capable of implementing the above method is also provided. It may adopt a portable compact disc read-only memory (CD-ROM) and include program code, and can run on a terminal device, such as a mobile phone. However, the program product of the present disclosure is not limited thereto. In this document, the readable storage medium may be any tangible medium that contains or stores a program, and the program can be used by or in combination with an instruction execution system, device, or device.

[0106] In an exemplary embodiment of the present disclosure, an electronic device capable of implementing the above method is also provided. Figure 13 A schematic structural diagram of a computer system of an electronic device according to an exemplary embodiment of the present disclosure is shown.

[0107] It should be noted that Figure 13 The computer system 1300 of the electronic device shown is only an example, and should not impose any limitation on the functions and usage scope of the embodiments of the present disclosure.

[0108] As Figure 13As shown, computer system 1300 includes a Central Processing Unit (CPU) 1301, which can perform various appropriate actions and processes according to programs stored in a Read-Only Memory (ROM) 1302 or programs loaded from a storage section 1308 into a Random Access Memory (RAM) 1303. In the RAM 1303, various programs and data required for system operations are also stored. The CPU 1301, ROM 1302, and RAM 1303 are connected to each other via a bus 1304. An Input / Output (I / O) interface 1305 is also connected to the bus 1304.

[0109] The following components are connected to the I / O interface 1305: an input section 1306 including a keyboard, a mouse, etc.; an output section 1307 including, for example, a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), etc., and a speaker, etc.; a storage section 1308 including a hard disk, etc.; and a communication section 1309 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 1309 performs communication processing via a network such as the Internet. A drive 1310 is also connected to the I / O interface 1305 as needed. A removable medium 1311, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1310 as needed so that a computer program read from it can be installed into the storage section 1308 as needed.

[0110] In particular, according to an embodiment of the present disclosure, the processes described below with reference to the flowcharts can be implemented as computer software programs. For example, an embodiment of the present disclosure includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes program codes for performing the methods shown in the flowcharts. In such an embodiment, the computer program can be downloaded and installed from a network via the communication section 1309, and / or installed from the removable medium 1311. When the computer program is executed by a Central Processing Unit (CPU) 1301, various functions defined in the system of the present disclosure are executed.

[0111] It should be noted that the computer-readable medium shown in the embodiments of the present disclosure can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of a computer-readable storage medium can include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present disclosure, a computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, apparatus, or device. In the present disclosure, a computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, in which computer-readable program code is carried. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, and this computer-readable medium can send, propagate, or transmit a program for use by or in combination with an instruction execution system, apparatus, or device. The program code contained on a computer-readable medium can be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0112] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram can represent a module, a program segment, or a part of code, and the above module, program segment, or part of code contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks can occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and the combination of blocks in a block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0113] The units involved in the embodiments described in this disclosure can be implemented in software or in hardware, and the described units can also be provided in a processor. Among them, the names of these units do not constitute a limitation to the unit itself in certain cases.

[0114] As another aspect, the present disclosure also provides a computer-readable medium, which may be included in the electronic device described in the above embodiments; or may exist alone without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by an electronic device, the electronic device implements the methods described in the above embodiments.

[0115] It should be noted that although several modules or units of a device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present disclosure, the features and functions of the two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0116] Through the description of the above embodiments, those skilled in the art can easily understand that the example embodiments described herein can be implemented by software or by a combination of software and necessary hardware. Therefore, the technical solutions according to the embodiments of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (such as a personal computer, a server, a touch terminal, or a network device, etc.) to execute the methods according to the embodiments of the present disclosure.

[0117] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include known common general knowledge or conventional technical means in the technical field not disclosed in the present disclosure.

[0118] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A crystal plasticity finite element modeling method, characterized in that: include: Collect grain information of a given material sample; Performing grain division based on the grain information to obtain a grain data file, and determining grid parameters based on the grain with the smallest grain morphology area in the grain information; Creating a grain geometry model according to the grain data file, creating a mesh model according to the mesh parameters, and mapping the grain geometry model to the mesh model to obtain a crystal plasticity finite element mesh model; Boundary conditions and constitutive relations are assigned to the crystal plasticity finite element mesh model to achieve crystal plasticity finite element simulation.

2. The crystal plasticity finite element modeling method according to claim 1, characterized in that: The step of collecting grain information of a given material sample includes: The grain information is collected using EBSD technology; wherein the grain information includes the position coordinates and Euler angles of the grains.

3. The crystal plasticity finite element modeling method according to claim 1, characterized in that: The step of performing grain division based on the grain information to obtain a grain data file includes: The MTEX ​​toolkit of MATLAB is used to read the grain information and perform grain division to output the grain data file.

4. The crystal plasticity finite element modeling method according to claim 1, characterized in that: The step of determining the grid parameters based on the grain with the smallest grain morphology area in the grain information includes: Drawing a grain morphology map based on the grain information; Determine the grain with the smallest area according to the grain morphology map, and determine the size of the grid unit according to the grain with the smallest area; Grid parameters are obtained by grid division based on the size of the grain morphology image and the size of the grid unit.

5. The crystal plasticity finite element modeling method according to claim 1, characterized in that: Mapping the grain geometry model to the mesh model to obtain a crystal plasticity finite element mesh model comprises: According to the grain orientation information in the grain data file, the grains are assigned to corresponding grid cells in ABAQUS to create a corresponding relationship between the grid cells and the grains; When a grid unit corresponds to a plurality of grains, the grain corresponding to the grid unit is determined according to the area of ​​each grain, so as to update the corresponding relationship; The crystal plasticity finite element mesh model is created based on the corresponding relationship.

6. The crystal plasticity finite element modeling method according to claim 1, characterized in that: Before performing grain division based on the grain information to obtain a grain data file and determining grid parameters based on the grain with the smallest grain morphology area in the grain information, the method further includes: Removing small-sized grains to update the grain information; and / or The grain boundaries are smoothed to update the grain information.

7. The crystal plasticity finite element modeling method according to claim 1, characterized in that: Before assigning boundary conditions and constitutive relations to the crystal plasticity finite element mesh model, the method further includes: The boundary conditions and the constitutive relationship are configured according to the actual stress conditions of the given material sample.

8. A crystal plasticity finite element modeling device, characterized in that: include: A collection module, used to collect grain information of a given material sample; A division module, used for performing grain division based on the grain information to obtain a grain data file, and determining grid parameters based on the grain with the smallest grain morphology area in the grain information; A modeling module, used to create a grain geometry model according to the grain data file, and to create a mesh model according to the mesh parameters, and to map the grain geometry model to the mesh model to obtain a crystal plasticity finite element mesh model; The simulation module is used to assign boundary conditions and constitutive relations to the crystal plasticity finite element mesh model to realize crystal plasticity finite element simulation.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the crystal plasticity finite element modeling method according to any one of claims 1 to 7 is implemented.

10. An electronic device, characterized in that: include: one or more processors; A storage device for storing one or more programs, when the one or more computer programs are executed by the one or more processors, enables the one or more processors to implement the crystal plasticity finite element modeling method as described in any one of claims 1 to 7.

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