Magnetic integration device and apparatus
By using magnetic integration devices in inductors or transformers and using common magnetic columns to build two magnetic devices, the loss problem caused by uneven magnetic flux distribution is solved, and power conversion with higher efficiency and smaller volume is achieved.
Patent Information
- Application Number
- CN202510345050.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2025-06-17
AI Technical Summary
Existing inductors or transformers have problems with large size and low efficiency, mainly due to the uneven distribution of magnetic flux, resulting in large losses.
A magnetic integrated device is adopted, which includes a first base plate, a second base plate, a common magnetic column, a side column and a winding column. Two magnetic devices are constructed through the common magnetic column to make the magnetic flux distribution more evenly and have a large offset effect.
Through uniform flux distribution and partial cancellation effects, core loss is reduced, power efficiency is improved, and device volume is reduced.
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Figure CN120164704A_ABST
Abstract
Description
Technical Field
[0001] This application mainly relates to the field of power electronics technology, and particularly to magnetic integration devices and equipment. Background Art
[0002] In modern power electronics and power management systems, inductors and transformers are key electromagnetic components in power converters, mainly used for electromagnetic conversion in circuits to achieve energy transfer, electrical isolation, etc., and are widely used in all power conversion devices such as charging piles, network power supplies, and vehicle-mounted power supplies. However, in existing inductors or transformers, there are still limitations in technical problems such as volume and weight, and efficiency bottlenecks. Summary of the Invention
[0003] The main purpose of this application is to provide magnetic integration devices and equipment to solve the problems of large volume of inductors or transformers and uneven magnetic flux distribution resulting in large losses and low efficiency, so as to reduce the volume of the device and improve the efficiency.
[0004] To solve the above problems, this application provides a magnetic integration device, which includes: a first bottom plate, a second bottom plate, a common magnetic column, a first side column, a second side column, a third side column, a fourth side column, and a plurality of winding columns; the common magnetic column is arranged between the first bottom plate and the second bottom plate; one end of the first side column is connected to the first bottom plate, and the other end is connected to the common magnetic column. One end of the second side column is connected to the first bottom plate, and the other end is connected to the common magnetic column, forming a first ring; one end of the third side column is connected to the second bottom plate, and the other end is connected to the common magnetic column. One end of the fourth side column is connected to the second bottom plate, and the other end is connected to the common magnetic column, forming a second ring; the same number of winding columns are distributed in the first ring and the second ring; within the first ring, one end of each winding column is connected to the first bottom plate, and the other end is connected to the common magnetic column; within the second ring, one end of each winding column is connected to the second bottom plate, and the other end is connected to the common magnetic column; a coil is sleeved on each winding column.
[0005] In one embodiment, the first bottom plate, the second bottom plate, and the common magnetic column are distributed in parallel; the two ends of the first bottom plate, the two ends of the second bottom plate, and the two ends of the common magnetic column are flush.
[0006] In one embodiment, the first side column and the second side column are distributed in parallel; the third side column and the fourth side column are distributed in parallel; the first side column and the third side column are arranged opposite to each other, and the second side column and the fourth side column are arranged opposite to each other.
[0007] In one embodiment, the winding columns in the first ring and the winding columns in the second ring are arranged in one-to-one correspondence along a first direction.
[0008] In one embodiment, three winding posts are respectively arranged inside the first ring and inside the second ring. The three winding posts inside the first ring and the three winding posts inside the second ring are distributed in one-to-one correspondence to form a two-way three-phase structure.
[0009] In one embodiment, the magnetic integration device further includes: a plurality of first magnetic resistances, which are arranged between the first side post and the common magnetic post, between the second side post and the common magnetic post, between the third side post and the common magnetic post, and between the fourth side post and the common magnetic post.
[0010] In one embodiment, the first bottom plate at least includes a first sub-bottom plate, a second sub-bottom plate, and a third sub-bottom plate; a second magnetic resistance is arranged between the first sub-bottom plate and the second sub-bottom plate; a second magnetic resistance is arranged between the second sub-bottom plate and the third sub-bottom plate; the second bottom plate at least includes a fourth sub-bottom plate, a fifth sub-bottom plate, and a sixth sub-bottom plate; a second magnetic resistance is arranged between the fourth sub-bottom plate and the fifth sub-bottom plate; a second magnetic resistance is arranged between the fifth sub-bottom plate and the sixth sub-bottom plate.
[0011] In one embodiment, the first sub-bottom plate and the first side post are of an integral structure, the third sub-bottom plate and the second side post are of an integral structure, the fourth sub-bottom plate and the third side post are of an integral structure, and the sixth sub-bottom plate and the fourth side post are of an integral structure.
[0012] In one embodiment, the number of sub-bottom plates in the first bottom plate is the same as the number of winding posts inside the first ring, the number of sub-bottom plates in the second bottom plate is the same as the number of winding posts inside the second ring, and the winding posts and the sub-bottom plates are in one-to-one correspondence.
[0013] In one embodiment, the common magnetic post at least includes a first common magnetic post, a second common magnetic post, and a third common magnetic post; a third magnetic resistance is arranged between the first common magnetic post and the second common magnetic post; a third magnetic resistance is arranged between the second common magnetic post and the third common magnetic post.
[0014] In one embodiment, a first middle post is arranged between adjacent winding posts inside the first ring; one end of the first middle post is connected to the first bottom plate, and the other end is connected to the common magnetic post; a second middle post is arranged between adjacent winding posts inside the second ring, and one end of the second middle post is connected to the second bottom plate, and the other end is connected to the common magnetic post.
[0015] In one embodiment, a fifth magnetic resistance is arranged between the other end of the first middle post and the common magnetic post; a fifth magnetic resistance is arranged between the other end of the second middle post and the common magnetic post.
[0016] In one embodiment, the number of common magnetic posts is the same as the number of winding posts inside the first ring, and the winding posts and the common magnetic posts are in one-to-one correspondence.
[0017] To solve the above problems, the present application also provides a magnetic integration device, which includes: a magnetic integration device, which is the magnetic integration device described in any one of the above embodiments; a switch module, one end of the switch module is coupled to the magnetic integration device; a power supply, the power supply is coupled to the other end of the switch module and the magnetic integration device to achieve buck-boost control by controlling the on / off of the switch module.
[0018] The present application provides a magnetic integration device and equipment, which construct two magnetic devices through a common magnetic column to make the magnetic flux distribution in the magnetic core more uniform and have a greater cancellation effect, so as to solve the problem that the local magnetic density of the side column and bottom plate of the magnetic core is too large due to the unbalanced magnetic flux distribution in the actual application of magnetic integration, resulting in large losses, so as to improve the power efficiency and reduce the volume. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Among them:
[0020] Figure 1 is a schematic structural diagram of the first embodiment of the magnetic integration device provided by the present application;
[0021] Figure 2 is a schematic structural diagram of the second embodiment of the magnetic integration device provided by the present application;
[0022] Figure 3 is a schematic structural diagram of the third embodiment of the magnetic integration device provided by the present application;
[0023] Figure 4 is a schematic structural diagram of the fourth embodiment of the magnetic integration device provided by the present application;
[0024] Figure 5 is a schematic structural diagram of the fifth embodiment of the magnetic integration device provided by the present application;
[0025] Figure 6 is a schematic structural diagram of the sixth embodiment of the magnetic integration device provided by the present application;
[0026] Figure 7 is a schematic structural diagram of the seventh embodiment of the magnetic integration device provided by the present application;
[0027] Figure 8a is Figure 2 the corresponding simulation effect schematic diagram in the solution;
[0028] Figure 8b is Figure 3Schematic diagram of the corresponding simulation effect in the solution;
[0029] Figure 9 It is a schematic structural diagram of an embodiment of a winding column provided by the present application;
[0030] Figure 10 It is a schematic structural diagram of the eighth embodiment of a magnetic integration device provided by the present application;
[0031] Figure 11 It is a schematic structural diagram of the ninth embodiment of a magnetic integration device provided by the present application;
[0032] Figure 12 It is a schematic structural diagram of the tenth embodiment of a magnetic integration device provided by the present application;
[0033] Figure 13 It is a schematic structural diagram of an embodiment of a magnetic integration device provided by the present application;
[0034] Figure 14 It is a schematic structural diagram of an embodiment of a switch module provided by the present application.
[0035] Reference numerals in the drawings:
[0036] 100, magnetic integration device; 110, first ring; 120, second ring; 10a, sub-bottom plate; 10, first bottom plate; 11, first sub-bottom plate; 12, second sub-bottom plate; 13, third sub-bottom plate; 20, second bottom plate; 21, fourth sub-bottom plate; 22, fifth sub-bottom plate; 23, sixth sub-bottom plate; 30, common magnetic column; 31, first common magnetic column; 32, second common magnetic column; 33, third common magnetic column; 40, first side column; 41, second side column; 42, third side column; 43, fourth side column; 50, winding column; 51, segmented magnetic column; 52, fourth magnetic resistance; 60, first magnetic resistance; 70, second magnetic resistance; 71, first sub-magnetic resistance; 80, third magnetic resistance; 81, second sub-magnetic resistance; 90, first middle column; 91, second middle column; 92, fifth magnetic resistance; 200, magnetic integration device; 210, switch module; 220, power supply. Detailed implementation manners
[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. Additionally, it should be noted that for the sake of description, only parts related to the present application rather than all structures are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.
[0038] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products, or devices.
[0039] Referring to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.
[0040] In traditional inductors or transformers, a discrete structure is usually adopted, such as traditional EE, EQ type cores. However, using the above structure will have problems such as large volume, many assembly processes, requiring more components, large occupied space, and multiple assemblies; relatively large losses, large overall volume of multiple devices and no magnetic flux cancellation effect; poor device consistency, and it is difficult to ensure the consistency of each performance during actual processing. Or for a three-phase integrated transformer, the side columns are fixed by side bonding. Among them, the three-phase (three winding columns) inductor or transformer is integrated on the same magnetic core, and the overall volume is relatively small. However, this solution also has problems such as introducing a large magnetic resistance at the side columns of the magnetic core for glue fixing, affecting the uniformity of the integrated magnetic flux distribution and large losses; the glue layer thickness and operating factors have a great influence on the bonding of the magnetic core, resulting in large fluctuations in losses and being difficult to control; for a solution with four common magnetic columns to be bonded, the middle two magnetic columns occupy the length space, resulting in a low integration degree and a large volume.
[0041] Therefore, this application provides a magnetic integration device and equipment to solve the above problems.
[0042] Referring to Figure 1 as shown Figure 1 is a schematic structural diagram of the first embodiment of the magnetic integration device provided by this application; the magnetic integration device 100 includes: a first bottom plate 10, a second bottom plate 20, a common magnetic column 30, a first side column 40, a second side column 41, a third side column 42, a fourth side column 43, and a plurality of winding columns 50.
[0043] Among them, the common magnetic post 30 is arranged between the first bottom plate 10 and the second bottom plate 20; one end of the first side post 40 is connected to the first bottom plate 10, and the other end is connected to the common magnetic post 30. One end of the second side post 41 is connected to the first bottom plate 10, and the other end is connected to the common magnetic post 30, forming a first ring 110; one end of the third side post 42 is connected to the second bottom plate 20, and the other end is connected to the common magnetic post 30. One end of the fourth side post 43 is connected to the second bottom plate 20, and the other end is connected to the common magnetic post 30, forming a second ring 120; the same number of winding posts 50 are distributed in the first ring 110 and the second ring 120; within the first ring 110, one end of each winding post 50 is connected to the first bottom plate 10, and the other end is connected to the common magnetic post 30; within the second ring 120, one end of each winding post 50 is connected to the second bottom plate 20, and the other end is connected to the common magnetic post 30; a coil is sleeved on each winding post 50.
[0044] The coils therein include but are not limited to windings and PCB windings, and can be other forms that generate the same excitation function. The magnetic flux direction generated by the coils in the magnetic circuit can be adjusted according to actual applications. And for the magnetic core forms mentioned above, including but not limited to the above, the shape and spacing of the magnetic posts can be adjusted under the condition of ensuring the above integration form.
[0045] In an embodiment, the first bottom plate 10, the second bottom plate 20, and the common magnetic post 30 are distributed in parallel; the two ends of the first bottom plate 10, the two ends of the second bottom plate 20, and the two ends of the common magnetic post 30 are flush.
[0046] In an embodiment, the first side post 40 and the second side post 41 are distributed in parallel; the third side post 42 and the fourth side post 43 are distributed in parallel; the first side post 40 and the third side post 42 are oppositely arranged, and the second side post 41 and the fourth side post 43 are oppositely arranged.
[0047] Specifically, as Figure 1 shown, the corresponding first bottom plate 10 and the second bottom plate 20 are arranged in parallel, the first side post 40 and the second side post 41 are arranged in parallel, and the third side post 42 and the fourth side post 43 are arranged in parallel. And, the winding posts 50 within the same ring, for example, the multiple winding posts 50 within the first ring 110 or the second ring 120 are also arranged in parallel. Relatively, the first bottom plate 10, the second bottom plate 20, and the common magnetic post 30 are also arranged in parallel. Further, the two ends of the first bottom plate 10, the two ends of the second bottom plate 20, and the two ends of the common magnetic post 30 are flush.
[0048] In this application, the first bottom plate 10, the second bottom plate 20, and the common magnetic column 30 are arranged in parallel. The vertical distance between the common magnetic column 30 and the first bottom plate 10 and the vertical distance between the common magnetic column 30 and the second bottom plate 20 are the same or different; preferably, the vertical distance between the common magnetic column 30 and the first bottom plate 10 is the same as the vertical distance between the common magnetic column 30 and the second bottom plate 20.
[0049] In this application, the first side column 40 and the second side column 41 are perpendicularly distributed with respect to the first bottom plate 10 and the common magnetic column 30; the third side column 42 and the fourth side column 43 are perpendicularly distributed with respect to the common magnetic column 30 and the second bottom plate 20; the winding columns 50 within the first ring 110 are perpendicular to the first bottom plate 10 and the common magnetic column 30; the winding columns within the second ring 120 are perpendicular to the common magnetic column 30 and the second bottom plate 20.
[0050] In one embodiment, three winding columns 50 are respectively arranged inside the first ring 110 and the second ring 120. The three winding columns 50 within the first ring and the three winding columns 50 within the second ring 120 are distributed in one-to-one correspondence to form a two-way three-phase structure.
[0051] In one embodiment, the winding columns 50 within the first ring 110 and the winding columns 50 within the second ring 120 are arranged in one-to-one correspondence along the first direction. The first direction is as Figure 1 shown. Specifically, the first direction is the direction perpendicular to the common magnetic column 30.
[0052] As Figure 1 shown, in one embodiment, the winding columns 50 are set to 6. Among them, 3 winding columns 50 are arranged in the first ring 110, and 3 winding columns 50 are arranged in the second ring 120. And the three winding columns 50 in the first ring 110 and the three winding columns 50 in the second ring 120 are relatively arranged in one-to-one correspondence along the first direction to form a two-way three-phase structure. Among them, in this magnetic integration device 100, there are a total of 6 exciting magnetic coils, which are respectively sleeved on each winding column 50, and magnetic fluxes with equal amplitudes and the same directions are generated on the 6 winding columns 50 respectively. Among them, the magnetic fluxes of L1_1&L1_2, L2_1&L2_2, and L3_1&L3_2 are the same or have a phase difference, for example, 90°, 180°, etc. The phase differences between L1_1&L2_1&L3_1 and L1_2&L2_2&L3_2 are 120° respectively, and they form a specific function power converter with the corresponding conversion circuit.
[0053] In the above settings, the DC magnetic fluxes of L1_1&L1_2, L2_1&L2_2, and L3_1&L3_2 are almost completely cancelled out in the common columns of their corresponding regions. The AC magnetic fluxes are superimposed or cancelled out. In one embodiment, the overall magnetic flux is decreased through cancellation, and the thickness of the magnetic columns can be reduced to shrink the volume. At the same time, due to the 120° phase difference between L1_1&L2_1&L3_1 and L1_2&L2_2&L3_2, their magnetic fluxes are cancelled out in the bottom magnetic columns and the side columns, and the effective cross-sectional areas of the bottom columns and the side columns can also be reduced to decrease the overall volume of the magnetic core. Or, without reducing the volume, the overall loss of the magnetic core can be significantly reduced.
[0054] Through the above method, by using 3-phase combined with 2-way integration, the magnetic column cross-sectional area has a high utilization rate, the magnetic flux cancellation is sufficient, and the magnetic flux density distribution is uniform. Compared with the traditional integration method, the magnetic core loss is reduced by an average of 30%+, effectively improving the power supply efficiency. At the same time, it can be adjusted to make the magnetic flux distribution of the magnetic core uniform (Φd1 = Φd2), where Φd1 and Φd2 refer to the magnetic fluxes in different regions of the bottom magnetic column. There are no high magnetic flux density points and no local saturation problems. The cross-sectional area in the middle of the magnetic core bottom plate can be reduced by 20%+, and the overall volume of the magnetic core is reduced by 20%+, achieving a higher power density. The inductance tolerance, magnetic flux distribution, and processing consistency of the integrated magnetic components are well improved.
[0055] In one embodiment, as Figure 2 shown, Figure 2 FIG. 10 is a schematic structural diagram of a second embodiment of the magnetic integration device provided by the present application. Among them, the magnetic integration device 100 further includes: a plurality of first magnetic resistances 60, and the plurality of first magnetic resistances 60 are disposed between the first side column 40 and the common magnetic column 30, between the second side column 41 and the common magnetic column 30, between the third side column 42 and the common magnetic column 30, and between the fourth side column 43 and the common magnetic column 30.
[0056] In the magnetic circuit, a plurality of first magnetic resistances 60 are provided, and the implementation methods include but are not limited to bonding air gaps. It can be any material with a μr (relative magnetic permeability) less than that of the main magnetic core for bonding or filling, and can also be in a multi-segment bonding form. Among them, the relative magnetic permeability μr is the ratio of the magnetic permeability of the material to the magnetic permeability of vacuum μ0, and is used to measure the magnetic conductance performance of the material.
[0057] In one embodiment, as Figure 3 shown, Figure 3It is a schematic structural diagram of the third embodiment of the magnetic integration device provided by this application; the first bottom plate 10 at least includes a first sub-bottom plate 11, a second sub-bottom plate 12, and a third sub-bottom plate 13; a second magnetic resistor 70 is arranged between the first sub-bottom plate 11 and the second sub-bottom plate 12; a second magnetic resistor 70 is arranged between the second sub-bottom plate 12 and the third sub-bottom plate 13; the second bottom plate 20 at least includes a fourth sub-bottom plate 21, a fifth sub-bottom plate 22, and a sixth sub-bottom plate 23; a second magnetic resistor 70 is arranged between the fourth sub-bottom plate 21 and the fifth sub-bottom plate 22; a second magnetic resistor 70 is arranged between the fifth sub-bottom plate 22 and the sixth sub-bottom plate 23.
[0058] In another embodiment, the second magnetic resistor 70 is arranged between adjacent winding columns 50, specifically as Figure 3 shown.
[0059] It can be understood that the implementation manner of the second magnetic resistor 70 also includes but is not limited to bonding air gaps, and it can be any material with a μr (relative magnetic permeability) less than that of the main magnetic core for bonding or filling, and it can also be divided into a multi-segment bonding form.
[0060] Among them, for the setting of the first magnetic resistor 60 and the second magnetic resistor 70 in the above embodiments, the first magnetic resistor 60 can be used alone or the first magnetic resistor 60 and the second magnetic resistor 70 can be used in combination. By the coordinated use of the first magnetic resistor 60 and the second magnetic resistor 70, a relatively uniform magnetic flux distribution in the side columns and / or the bottom plate can be obtained, lower magnetic core loss can be achieved, and the parameters are easy to control in production.
[0061] In one embodiment, as Figure 3 shown, the first sub-bottom plate 11 and the first side column 40 are of an integral structure, the third sub-bottom plate 13 and the second side column 41 are of an integral structure, the fourth sub-bottom plate 21 and the third side column 42 are of an integral structure, and the sixth sub-bottom plate 23 and the fourth side column 43 are of an integral structure.
[0062] In one embodiment, as Figure 3 shown, the number of sub-bottom plates in the first bottom plate 10 is the same as the number of winding columns 50 in the first ring 110. The sub-bottom plates in the first bottom plate 10 correspond one-to-one with the winding columns in the first ring 110. There is a second magnetic resistor 70 between two adjacent sub-bottom plates in the first bottom plate 10, and this second magnetic resistor 70 is located between two adjacent winding columns 50 in the adjacent first ring 110; the number of sub-bottom plates in the second bottom plate 20 is the same as the number of winding columns 50 in the second ring 120. There is a second magnetic resistor 70 between two adjacent sub-bottom plates in the second bottom plate 20, and this second magnetic resistor 70 is located between two adjacent winding columns 50 in the second ring 120, and the winding columns 50 in the second ring 120 correspond one-to-one with the sub-bottom plates in the second bottom plate 20.
[0063] As Figure 3As shown, the number of winding posts 50 is taken as six for example, with 3 winding posts 50 arranged within the first ring 110 and 3 winding posts 50 arranged within the second ring 120, corresponding to each other one by one. Therefore, the number of sub-bottom plates in the first bottom plate 10 and the second bottom plate 20 is also set to 3 respectively, and a second magnetic resistance 70 is arranged between adjacent sub-bottom plates. It can be understood that the setting of the second magnetic resistance 70 is also correspondingly arranged, and its set position is between two adjacent winding posts 50. It can be understood that in other embodiments, the number of sub-bottom plates can also correspond to the number of the second magnetic resistances 70 arranged therebetween, and for the number of the second magnetic resistances 70 and their set positions, mutual adjustment can be made between the sub-bottom plates, and the position is not limited to the position shown in the figure and can be arranged to move left and right on the bottom plate.
[0064] Similarly, in this embodiment solution, the method of adopting multiple sub-bottom plates and the second magnetic resistance 70 in the above-mentioned embodiment can also be combined for setting. As Figure 4 shown, Figure 4 is a schematic structural diagram of the fourth embodiment of the magnetic integration device provided by the present application; in this embodiment, the second magnetic resistance 70 is arranged between adjacent winding posts 50. Specifically, the second magnetic resistance 70 includes a plurality of sub-bottom plates 10a, and the plurality of sub-bottom plates 10a are connected to each other to form; further, in another embodiment, on this basis, the second magnetic resistance 70 includes a plurality of sub-bottom plates 10a and a plurality of first sub-magnetic resistances 71, and the first sub-magnetic resistances 71 are arranged between the plurality of sub-bottom plates 10a, and adjacent sub-bottom plates 10a are connected through the first sub-magnetic resistances 71. It can be understood that the number of the sub-bottom plates 10a and the first sub-magnetic resistances 71 is not specifically limited and can be set and adjusted according to actual situations, and the number of the sub-bottom plates 10a and the number of the first sub-magnetic resistances 71 are correspondingly arranged. The first sub-magnetic resistance 71 can also include, but is not limited to, an adhesive air gap, and can be bonded or filled with any material less than the μr (relative magnetic permeability) of the main magnetic core, and can also be in a multi-segment bonding form.
[0065] In one embodiment, as Figure 5 shown, Figure 5 is a schematic structural diagram of the fifth embodiment of the magnetic integration device provided by the present application; the common magnetic post 30 at least includes a first common magnetic post 31, a second common magnetic post 32 and a third common magnetic post 33; a third magnetic resistance 80 is arranged between the first common magnetic post 31 and the second common magnetic post 32; a third magnetic resistance 80 is arranged between the second common magnetic post 32 and the third common magnetic post 33.
[0066] It is understandable that the implementation of the third magnetic resistance 80 also includes, but is not limited to, bonding air gaps, which can be bonded or filled with any material with a μr (relative magnetic permeability) less than that of the main magnetic core, and can also be divided into multiple bonding forms. For example, for the first and second magnetic resistances 70 and the third magnetic resistance 80, bonding methods including but not limited to using glass bead glue to generate air gaps, or composite bonding of cores with lower μr, or magnetic powder glue bonding, or filling with magnetic conductive ink can be adopted.
[0067] In one embodiment, as Figure 5 shown, the number of common magnetic posts 30 is the same as the number of winding posts 50 within the first ring 110, and the winding posts 50 and the common magnetic posts 30 correspond to each other one by one. Specifically, the third magnetic resistance 80 is located between two adjacent winding posts 50 of the same ring.
[0068] Combining the above embodiments, in another embodiment, multiple common magnetic posts 30 can be included in the common magnetic posts 30, and the corresponding number setting can also be correspondingly set with the number of winding posts 50 within the first ring 110 or the second ring 120, or corresponding to the number of the third magnetic resistances 80. The third magnetic resistances 80 are arranged between adjacent common magnetic posts 30, and the number of the third magnetic resistances 80 is multiple. For example, when the number of the third magnetic resistances 80 is 2, the corresponding number of common magnetic posts 30 is 3.
[0069] In another embodiment, specifically referring to Figure 6 shown, Figure 6 is a schematic structural diagram of the sixth embodiment of the magnetic integration device provided by the present application; wherein, in this embodiment, the third magnetic resistance 80 includes multiple common magnetic posts 30, which are connected to each other. In another embodiment, the third magnetic resistance 80 includes multiple common magnetic posts 30 and multiple second sub-magnetic resistances 81, and a second sub-magnetic resistance 81 is arranged between adjacent common magnetic posts 30, and the multiple common magnetic posts 30 are connected through the second sub-magnetic resistances 81; specifically, the specific numbers of the multiple common magnetic posts 30 and the multiple second sub-magnetic resistances 81 are not limited and can be set and adjusted according to actual situations, and the number of common magnetic posts 30 and the number of second sub-magnetic resistances 81 are correspondingly set.
[0070] Combining the above embodiment solutions, as Figure 7 shown, Figure 7 is a schematic structural diagram of the seventh embodiment of the magnetic integration device provided by the present application; it is understandable that Figure 7 is a comprehensive specific solution combining the above embodiments. By setting the second magnetic resistance 70 on the first base plate 10 and the second base plate 20, and setting the third magnetic resistance 80 on the common magnetic posts 30, the entire magnetic integration device 100 is jointly adjusted to meet the requirement of magnetic flux balance, reduce losses, and improve power supply efficiency. Further, for the solution of this embodiment, in other embodiments, reference can be made to Figure 4 and / orFigure 6 For the solution, the setting of the number of the second magnetoresistance 70 and / or the setting of the number of the third magnetoresistance 80 therein are adjusted. It is not limited to the description in the above solution and can be adjusted according to the actual situation.
[0071] For the above embodiment solution, as Figure 8a and Figure 8b shown, Figure 8a is Figure 2 the schematic diagram of the corresponding simulation effect in the solution; Figure 8b is Figure 3 the schematic diagram of the corresponding simulation effect in the solution; It can be understood that after the second magnetoresistance 70 and / or the third magnetoresistance 80 are used for individual or combined adjustment settings, the magnetic density therein is relatively uniform. Further, for Figure 8b the effect in Figure 3 can also be achieved in other solutions using the second magnetoresistance 70 and / or the third magnetoresistance 80, and is not limited to the solution in
[0072] For the winding post 50 therein, as combined with Figure 9 shown, Figure 9 is the structural schematic diagram of an embodiment of the winding post provided by the present application; the winding post 50 includes: a segmented magnetic post 51 and a fourth magnetoresistance 52; wherein, the numbers of the first, second, third, and fourth magnetoresistances usually distributed on the corresponding magnetic posts are equal, and the fourth magnetoresistance 52 of the middle winding post 50 can also be finely adjusted to make the inductance equal to that of the other two winding posts 50. The sizes of other parts can also be adjusted according to the actual magnetic core shape to meet the requirements of magnetic flux balance. When setting the inductor or transformer coil, it is necessary to avoid an area thickness of ≥3 times the first, second, third, and fourth magnetoresistances to reduce the loss caused by magnetic leakage in the low-magnetoresistance part (air gap, low-μr material, etc.).
[0073] In an embodiment, as Figure 10 shown, Figure 10 is the structural schematic diagram of the eighth embodiment of the magnetic integration device provided by the present application; a first middle post 90 is arranged between adjacent winding posts 50 in the first ring 110; one end of the first middle post 90 is connected to the first bottom plate 10, and the other end is connected to the common magnetic post 30; a second middle post 91 is arranged between adjacent winding posts 50 in the second ring 120, and one end of the second middle post 91 is connected to the second bottom plate 20, and the other end is connected to the common magnetic post 30.
[0074] It can be understood that for the setting of the middle post, the solution of any one of the above embodiments can be combined and executed. Among them, for the number of the middle posts in the first ring 110 and the second ring 120, it can also be freely set, and the specific solution can refer to the setting of the second magnetoresistance 70 in the above, that is, perform relevant corresponding settings related to the number of the winding posts 50.
[0075] In one embodiment, as Figure 11 shown, Figure 11 is a schematic structural diagram of the ninth embodiment of the magnetic integration device provided by the present application; a fifth magnetic resistance 92 is provided between the other end of the first middle column 90 and the common magnetic column 30; a fifth magnetic resistance 92 is provided between the other end of the second middle column 91 and the common magnetic column 30.
[0076] Among them, in some embodiments, the first middle column 90 and the second middle column 91 are arranged in parallel; similarly, in other embodiments, the first middle column 90 and the second middle column 91 are also arranged in parallel with the corresponding winding columns 50, and the first side column 40, the second side column 41, the third side column 42 and the fourth side column 43.
[0077] It can be understood that on the basis of this embodiment including the first middle column 90 and the second middle column 91, combined with the above setting scheme of the second magnetic resistance 70 and the third magnetic resistance 80, as Figure 12 shown, Figure 12 is a schematic structural diagram of the tenth embodiment of the magnetic integration device 100 provided by the present application; among them, in other embodiments, the second magnetic resistance 70 and the third magnetic resistance 80 can be set separately, that is, only the second magnetic resistance 70 or the third magnetic resistance 80 is set; or they can be set in a coordinated manner, that is, the second magnetic resistance 70 and the third magnetic resistance 80 are set at the same time. In some embodiments, referring to the schemes of Figure 4 and Figure 6 , the number of the second magnetic resistance 70 and / or the third magnetic resistance 80 can be multiple, and the specific number is not limited and can be set according to the actual scheme. In some embodiments, regarding the positions of the second magnetic resistance 70 and the third magnetic resistance 80, as Figure 12 shown, they are arranged between the winding column 50 and the first middle column 90, and between the winding column 50 and the second middle column 91, and the specific positions can be adjusted left and right according to the actual situation without specific limitation.
[0078] By the above method, by setting the current excitation settings, magnetic integration methods of the above two-way inductors or transformers, and / or combining the adjustment of the second magnetic resistance 70 and the third magnetic resistance 80, the magnetic flux distribution in the magnetic core is more uniform and has a large part of the cancellation effect, which not only solves the problem of excessive local magnetic density in the side columns and bottom plates of the magnetic core caused by the unbalanced magnetic flux distribution in the actual application of traditional three-phase integration, resulting in a large loss problem, but also further reduces the total loss of the two-way magnetic core. Compared with the traditional integration and assembly methods, the magnetic core loss is reduced by 16% - 60%, effectively improving the power supply efficiency. For example, for the above-shaped magnetic core inductor, dimensions: 103mm * 26mm * 36mm; current frequency: 200kHz; magnetic core material: DMR96A; peak magnetic flux density: 0.12T. The comparison of the magnetic flux magnitude & distribution and the magnetic core loss is as follows:
[0079] Adopting the traditional discrete device method requires six sets of devices: the total loss of two-way inductance / transformer power conversion: 2.75W * 6 = 16.5W.
[0080] Adopting the above-mentioned existing three-phase integration method requires two sets of devices: the total loss of two-way inductance / transformer power conversion: 6.5W * 2 = 13W.
[0081] From the above comparison, it can be seen that adopting the embodiment solution of the present application can effectively reduce the conversion loss therein to improve the power efficiency.
[0082] Adopting the above method, the magnetic flux distribution of the bottom column and the side column is uniform, there is no high-density point, the cross-sectional area of the local magnetic core can be reduced by about 20%, effectively reducing the volume of the magnetic core, achieving a higher power density, and in combination with the settings of the second magnetic resistance 70 and the third magnetic resistance 80, reducing the order-of-magnitude gap between the second magnetic resistance 70 and the third magnetic resistance 80 and the first magnetic resistance 60, the inductance tolerance, magnetic flux distribution and processing consistency of the integrated magnetic component are well improved, so that the parameters are easier to control.
[0083] To solve the above problems, the present application also provides a magnetic integration device 200. Refer to Figure 13 as shown, Figure 13 is a schematic structural diagram of an embodiment of the magnetic integration device provided by the present application; wherein, the magnetic integration device 200 includes: a magnetic integration device 100, and the magnetic integration device 100 is the magnetic integration device 100 described in any one of the above embodiments; a switch module 210, one end of the switch module 210 is coupled to the magnetic integration device 100; a power supply 220, and the power supply 220 is coupled to the other end of the switch module 210 and the magnetic integration device 100 to achieve buck-boost control by controlling the on-off of the switch module 210.
[0084] Further, in combination with Figure 14 as shown, Figure 14 is a schematic structural diagram of an embodiment of the switch module provided by the present application; wherein, corresponding to the solution of the above embodiment, it is applied to a PFC circuit with three-phase six switches and two inductors per phase. It can be understood that the above magnetic integration device 200 includes but is not limited to the above three-phase six-switch PFC circuit, and can be circuit topologies such as two-way LLC.
[0085] The magnetic integration device 100 and equipment provided by the present application. The magnetic integration device 100 includes: a first bottom plate 10, a second bottom plate 20, a common magnetic column 30, a first side column 40, a second side column 41, a third side column 42, a fourth side column 43, and a plurality of winding columns 50. Among them, the common magnetic column 30 is arranged between the first bottom plate 10 and the second bottom plate 20; one end of the first side column 40 is connected to the first bottom plate 10, and the other end is connected to the common magnetic column 30. One end of the second side column 41 is connected to the first bottom plate 10, and the other end is connected to the common magnetic column 30, forming a first ring 110; one end of the third side column 42 is connected to the second bottom plate 20, and the other end is connected to the common magnetic column 30. One end of the fourth side column 43 is connected to the second bottom plate 20, and the other end is connected to the common magnetic column 30, forming a second ring 120; the same number of winding columns 50 are distributed in the first ring 110 and the second ring 120; within the first ring 110, one end of each winding column 50 is connected to the first bottom plate 10, and the other end is connected to the common magnetic column 30; within the second ring 120, one end of each winding column 50 is connected to the second bottom plate 20, and the other end is connected to the common magnetic column 30; a coil is sleeved on each winding column 50. In the above manner, two magnetic devices are constructed by using the common magnetic column 30, so that the magnetic flux distribution in the magnetic core is more uniform and has a larger partial cancellation effect, to solve the problem that the local magnetic density of the side columns and bottom plates of the magnetic core is too large due to the unbalanced magnetic flux distribution in the actual application of magnetic integration, resulting in a large loss, so as to improve the efficiency of the power supply 220 and reduce the volume.
[0086] The embodiments of the present application have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.
Claims
1. A magnetic integration device, characterized in that: The magnetic integration device comprises: a first bottom plate, a second bottom plate, a common magnetic column, a first side column, a second side column, a third side column, a fourth side column and a winding column; The common magnetic column is arranged between the first bottom plate and the second bottom plate; One end of the first side column is connected to the first bottom plate, and the other end is connected to the common magnetic column; one end of the second side column is connected to the first bottom plate, and the other end is connected to the common magnetic column, forming a first ring; One end of the third side column is connected to the second bottom plate, and the other end is connected to the common magnetic column; one end of the fourth side column is connected to the second bottom plate, and the other end is connected to the common magnetic column, forming a second ring; The same number of winding posts are distributed in the first ring and the second ring; in the first ring, one end of each winding post is connected to the first bottom plate, and the other end is connected to the common magnetic post; in the second ring, one end of each winding post is connected to the second bottom plate, and the other end is connected to the common magnetic post; A coil is sleeved on each winding pole.
2. The magnetic integration device according to claim 1, characterized in that: The first bottom plate, the second bottom plate and the common magnetic column are arranged parallel to each other; two ends of the first bottom plate, two ends of the second bottom plate and two ends of the common magnetic column are flush.
3. The magnetic integrated device according to claim 2, characterized in that: The first side column and the second side column are distributed in parallel; the third side column and the fourth side column are distributed in parallel; the first side column and the third side column are arranged opposite to each other, and the second side column and the fourth side column are arranged opposite to each other.
4. The magnetic integration device according to claim 2, characterized in that: The winding poles in the first ring shape and the winding poles in the second ring shape are arranged one by one in a first direction.
5. The magnetic integration device according to claim 1, characterized in that: Three winding poles are respectively arranged inside the first ring shape and inside the second ring shape, and the three winding poles in the first ring shape and the three winding poles in the second ring shape are distributed in a one-to-one correspondence to form a two-way three-phase structure.
6. The magnetic integration device according to claim 1, characterized in that: The magnetic integration device also includes: A plurality of first magnetic resistors are arranged between the first side column and the common magnetic column, between the second side column and the common magnetic column, between the third side column and the common magnetic column, and between the fourth side column and the common magnetic column.
7. The magnetic integration device according to claim 1 or 6, characterized in that: The first base plate at least includes a first sub-base plate, a second sub-base plate and a third sub-base plate; a second magnetic resistance is arranged between the first sub-base plate and the second sub-base plate; and the second magnetic resistance is arranged between the second sub-base plate and the third sub-base plate; The second base plate at least includes a fourth sub-base plate, a fifth sub-base plate and a sixth sub-base plate; the second magnetic resistance is arranged between the fourth sub-base plate and the fifth sub-base plate; the second magnetic resistance is arranged between the fifth sub-base plate and the sixth sub-base plate.
8. The magnetic integration device according to claim 7, characterized in that: The first sub-base plate and the first side column are an integral structure, the third sub-base plate and the second side column are an integral structure, the fourth sub-base plate and the third side column are an integral structure, and the sixth sub-base plate and the fourth side column are an integral structure.
9. The magnetic integration device according to claim 7, characterized in that: The number of sub-base plates in the first base plate is the same as the number of winding posts in the first ring, and the winding posts in the first ring correspond to the sub-base plates in the first base plate one by one; the number of sub-base plates in the second base plate is the same as the number of winding posts in the second ring, and the winding posts in the second ring correspond to the sub-base plates in the second base plate one by one; The second magnetic resistance is arranged between two adjacent winding poles in the same ring shape.
10. The magnetic integration device according to claim 2, characterized in that: The common magnetic column at least includes a first common magnetic column, a second common magnetic column and a third common magnetic column; a third magnetic resistance is arranged between the first common magnetic column and the second common magnetic column; the third magnetic resistance is arranged between the second common magnetic column and the third common magnetic column; the third magnetic resistance is located between two adjacent winding columns in the same ring.
11. The magnetic integration device according to claim 1 or 10, characterized in that: A first middle column is arranged between adjacent winding columns in the first ring; one end of the first middle column is connected to the first bottom plate, and the other end is connected to the common magnetic column; A second middle column is arranged between adjacent winding columns in the second ring, one end of the second middle column is connected to the second bottom plate, and the other end is connected to the common magnetic column; The first center column in the first ring shape and the second center column in the second ring shape are relatively distributed in a one-to-one correspondence.
12. The magnetic integration device according to claim 11, characterized in that: A fifth magnetic resistor is arranged between the other end of the first middle column and the common magnetic column; and a fifth magnetic resistor is arranged between the other end of the second middle column and the common magnetic column.
13. The magnetic integration device according to claim 10, characterized in that: The number of the common magnetic columns is the same as the number of the winding columns in the first ring shape, and the winding columns correspond to the common magnetic columns one by one.
14. A magnetic integration device, characterized in that: The magnetic integrated device comprises: A magnetic integrated device, wherein the magnetic integrated device is a magnetic integrated device as claimed in any one of claims 1 to 13; A switch module, one end of which is coupled to the magnetic integration device; A power supply is coupled to the other end of the switch module and the magnetic integration device to achieve step-up and step-down control by controlling the on and off of the switch module.