Substrate processing system

Abstract

A substrate processing system includes a first processing apparatus, a second processing apparatus, and an integrated control apparatus. The first processing apparatus performs a first process on a substrate based on a job. The second processing apparatus performs a second process on the substrate based on the job. The integrated control device generates a first virtual job and a second virtual job on the basis of an integrated job creation command received from an external control device. The first processing apparatus performs at least a portion of the first processing on the substrate based on the first dummy job. The second processing apparatus performs at least a portion of the second processing on the substrate processed by the first processing apparatus based on the second dummy job.

Description

[0001] This application claims the priority of Japanese Patent Application JP2023-212287 filed on December 15, 2023, and Japanese Patent Application JP2024-165396 filed on September 24, 2024, and incorporates all the disclosures of these applications into this application. Technical Field

[0002] The present invention relates to a substrate processing system. Background Art

[0003] A substrate processing apparatus that performs batch processing and single-wafer processing on a substrate using a single apparatus has been proposed (for example, refer to Japanese Unexamined Patent Application Publication No. 2021-64654 (Document 1)). Document 1 discloses a structure in which a loading / unloading unit, a single-wafer processing unit, a batch processing unit, and an interface unit are provided in one apparatus. In the substrate processing apparatus disclosed in Document 1, the loading / unloading unit moves a cassette containing a plurality of substrates into and out of the apparatus. The batch processing unit uniformly processes a batch containing a plurality of substrates. The single-wafer processing unit processes each substrate in the batch one by one. The interface unit transfers substrates between the batch processing unit and the single-wafer processing unit. Specifically, the batch processing unit performs a chemical solution treatment in which a plurality of substrates constituting a batch are collectively processed using chemical solutions such as dilute hydrofluoric acid, phosphoric acid aqueous solution, and SC1 (a mixed solution containing ammonia, hydrogen peroxide water, and water), and a rinsing treatment in which a plurality of substrates constituting a batch are collectively rinsed using a rinsing solution. The single-wafer processing unit supplies a drying liquid (for example, isopropyl alcohol) to each substrate that has been rinsed by the batch processing unit one by one to form a liquid film of the drying liquid on each substrate, and then dries each substrate one by one using a supercritical fluid.

[0004] However, in the substrate processing apparatus disclosed in Document 1, after the single-wafer processing unit forms a liquid film of the drying liquid on the substrate, only the process of drying the substrate using a supercritical fluid (drying process) is performed. Therefore, the single-wafer processing unit cannot perform a process using chemical solutions such as dilute hydrofluoric acid, phosphoric acid aqueous solution, and SC1 (chemical solution treatment).

[0005] In contrast, it is considered to construct a substrate processing system that, in addition to being able to perform a series of substrate processing combining the chemical solution treatment and rinsing treatment performed by the batch processing apparatus and the drying treatment performed by the single-wafer processing apparatus, can also selectively perform a series of substrate processing performed only by the batch processing apparatus and a series of substrate processing performed only by the single-wafer processing apparatus.

[0006] However, in the case of performing a series of substrate processes using multiple processing devices, the host computer needs to command the multiple processing devices to generate jobs (control jobs) respectively, so as to perform a series of substrate processes (for example, a substrate process that continuously performs chemical solution process, rinsing process, and drying process) using the multiple processing devices. Therefore, it is necessary to introduce a new system (software) into the existing host computer, and the burden on the operator who manages the host computer becomes greater. In addition, if multiple processing devices can be controlled by issuing a production command for one job (control job), the burden on the operator who manages the host computer can be reduced, but it does not conform to the SEMI standard to make multiple processing devices perform substrate processes through one job (control job). SUMMARY OF THE INVENTION

[0007] An object of the present invention is to provide a substrate processing system that can suppress an increase in the burden on an operator who manages an external control device.

[0008] According to one aspect of the present invention, a substrate processing system includes a first processing device, a second processing device, and an integrated control device. The first processing device performs a first process on a substrate based on a job. The second processing device performs a second process on the substrate based on a job. The integrated control device controls the first processing device and the second processing device based on a command received from an external control device. The job instructs the following processing: loading a substrate from a substrate storage container into the interior of a processing device, performing a process on the substrate inside the processing device, and then unloading the substrate from the interior of the processing device to the substrate storage container or another substrate storage container different from the substrate storage container. The integrated control device generates a first virtual job and a second virtual job based on a production command of a comprehensive job received from the external control device. The first processing device performs at least a part of the first process on the substrate based on the first virtual job. The second processing device performs at least a part of the second process on the substrate processed by the first processing device based on the second virtual job.

[0009] According to this substrate processing system, an increase in the burden on an operator who manages an external control device can be suppressed.

[0010] In a certain embodiment, the substrate processing system further includes a first connection part. The first connection part connects the first processing device and the second processing device. The first connection part has a substrate transfer mechanism. The substrate transfer mechanism transfers the substrate processed by the first processing device to the second processing device.

[0011] In a certain embodiment, the substrate processing system further includes a substrate standby unit. The substrate after performing at least a part of the first processing stands by in the substrate standby unit. The substrate transfer mechanism transfers the substrate standing by in the substrate standby unit to the second processing device. The integrated control device generates the second virtual job corresponding to the substrate standing by in the substrate standby unit.

[0012] In a certain embodiment, the second processing device has a storage unit. The storage unit stores the identification information of the virtual container placement unit. The integrated control device generates information indicating that a virtual substrate storage container is placed in the virtual container placement unit corresponding to the substrate standing by in the substrate standby unit.

[0013] In a certain embodiment, the first processing device includes a first housing having a first opening. The second processing device includes a second housing having a second opening. The first connection part further has a first connection housing. One end of the first connection housing is connected to the first housing. The other end of the first connection housing is connected to the second housing. The substrate transfer mechanism takes out the substrate processed by the first processing device from the first opening of the first housing, transfers it inside the first connection housing, and transfers it into the second housing from the second opening.

[0014] In a certain embodiment, the substrate processing system further includes a second connection part. The second connection part connects the first processing device and the second processing device. The first processing device has a first housing and a first container placement unit. A substrate storage container is placed in the first container placement unit. The second processing device has a second housing and a second container placement unit. The substrate storage container is placed in the second container placement unit. The first container placement unit is provided outside the first housing. The second container placement unit is provided outside the second housing. The second connection part has a container transfer mechanism. The container transfer mechanism transfers the substrate storage container placed in the first container placement unit to the second container placement unit.

[0015] In a certain embodiment, the second connection part further has a second connection housing. The second connection housing covers the first container placement unit and the second container placement unit. The container transfer mechanism transfers the substrate storage container inside the second connection housing.

[0016] In a certain embodiment, the first processing device has a first storage unit. The first storage unit stores a first process that defines the first processing. The second processing device has a second storage unit. The second storage unit stores a second process that defines the second processing. The integrated control device edits an integrated process formed by integrating the first process and the second process, and stores integrated process information. When receiving a production command for the integrated operation from the external control device, the integrated control device generates the first virtual operation and the second virtual operation with reference to the integrated process information. The first virtual operation includes identification information of the first process integrated into the integrated process. The second virtual operation includes identification information of the second process integrated into the integrated process.

[0017] In a certain embodiment, the first processing device executes a part of the first processing. When editing the integrated process, the integrated control device edits the first process based on an instruction from the external control device so as to execute a part of the first processing.

[0018] In a certain embodiment, the second processing device executes a part of the second processing. When editing the integrated process, the integrated control device edits the second process based on an instruction from the external control device so as to execute a part of the second processing.

[0019] In a certain embodiment, the first storage unit stores a plurality of the first processes that are different from each other. When editing the integrated process, the integrated control device integrates the first processes into the integrated process in units of one substrate. When integrating two or more of the first processes into the integrated process, the integrated control device generates two or more of the first virtual operations.

[0020] In a certain embodiment, the second storage unit stores a plurality of the second processes that are different from each other. When editing the integrated process, the integrated control device integrates the second processes into the integrated process in units of one substrate. When integrating two or more of the second processes into the integrated process, the integrated control device generates two or more of the second virtual operations.

[0021] In a certain embodiment, the first processing device notifies the integrated control device of an event that occurs in the first processing device together with identification information of the first virtual job. The second processing device notifies the integrated control device of an event that occurs in the second processing device together with identification information of the second virtual job. The integrated control device notifies the external control device of an event that occurs in the first processing device together with identification information of the integrated job. The integrated control device notifies the external control device of an event that occurs in the second processing device together with identification information of the integrated job.

[0022] In a certain embodiment, the event that occurs in the first processing device includes a completion event indicating completion of processing based on the first virtual job. When the event notified from the first processing device to the integrated control device is the completion event of the first virtual job, the integrated control device decides not to notify the external control device of the completion event.

[0023] In a certain embodiment, the integrated control device generates the second virtual job multiple times. The event that occurs in the second processing device includes a plurality of completion events indicating completion of processing based on each of the plurality of second virtual jobs. The plurality of completion events include a final completion event which is the completion event finally notified from the second processing device. When the completion event notified from the second processing device to the integrated control device is not the final completion event, the integrated control device decides not to notify the external control device of the completion event. When the completion event notified from the second processing device to the integrated control device is the final completion event, the integrated control device notifies the external control device of the completion event together with identification information of the integrated job.

[0024] In a certain embodiment, the first processing device has a first control device that controls execution of the first processing. The second processing device has a second control device that controls execution of the second processing. One of the first control device and the second control device also serves as the integrated control device.

[0025] In a certain embodiment, the first processing device includes a batch-type substrate processing device capable of processing multiple substrates together. The second processing device includes a single-wafer substrate processing device that processes substrates one by one.

[0026] In an embodiment, the integrated control device generates the first virtual job to control the batch-type substrate processing device. The batch-type substrate processing device performs a part of the first processing on the multiple substrates based on the first virtual job. After the batch-type substrate processing device finishes processing the multiple substrates, the integrated control device generates the second virtual job to control the single-substrate-type substrate processing device. The single-substrate-type substrate processing device performs a part of the second processing on a part of the multiple substrates, one substrate at a time, based on the second virtual job. After the single-substrate-type substrate processing device finishes processing a part of the multiple substrates, the integrated control device generates the second virtual job again to control the single-substrate-type substrate processing device. The single-substrate-type substrate processing device performs a part of the second processing on each of the remaining substrates of the multiple substrates, one substrate at a time, based on the second virtual job.

[0027] According to another aspect of the present invention, a substrate processing system includes a first processing device, a plurality of second processing devices, an integrated control device, and a container transfer mechanism. The first processing device performs a first processing on a substrate based on a job. The plurality of second processing devices perform a second processing on the substrate respectively based on a job. The integrated control device controls the first processing device and the plurality of second processing devices based on a command received from an external control device. The container transfer mechanism can move independently of the first processing device and the plurality of second processing devices. The job instruction is as follows: loading a substrate from a substrate storage container into the interior of a processing device, performing processing on the substrate in the interior of the processing device, and then unloading the substrate from the interior of the processing device into the substrate storage container or another substrate storage container different from the substrate storage container. The integrated control device generates a first virtual job and a second virtual job based on a production command of an integrated job received from the external control device. The first processing device performs at least a part of the first processing on the substrate based on the first virtual job. One of the plurality of second processing devices selected by the integrated control device performs at least a part of the second processing on the substrate processed by the first processing device based on the second virtual job. The first processing device has a first container placement part for placing the substrate storage container. Each of the plurality of second processing devices has a second container placement part for placing the substrate storage container. The container transfer mechanism transfers the substrate storage container containing the substrate processed by the first processing device from the first container placement part to the second container placement part of the one second processing device among the plurality of second processing devices. According to this substrate processing system, an increase in the burden on an operator who manages the external control device can be suppressed.

[0028] In a certain embodiment, the integrated control device stores processing information indicating the number of substrates to be processed in each of the plurality of second processing devices and maintenance information of each of the plurality of second processing devices. The integrated control device selects the one second processing device from the plurality of second processing devices based on the processing information and the maintenance information of each second processing device.

[0029] In a certain embodiment, the plurality of second processing devices include a first type of second processing device group and a second type of second processing device group different from the first type. The second type of second processing device group is arranged in an area separated from the area where the first type of second processing device group is arranged. The integrated control device selects one of the first type of second processing device group and the second type of second processing device group based on the production order of the integrated operation, and selects the one second processing device from the one selected second processing device group.

[0030] In a certain embodiment, the first processing device includes a batch-type substrate processing device capable of processing a plurality of substrates together. Each of the plurality of second processing devices includes a single-piece type substrate processing device that processes substrates one by one.

[0031] Through the following detailed description of the present invention with reference to the drawings, the above object and other objects, features, aspects and advantages become clear. Description of the Drawings

[0032] Figure 1 It is a block diagram showing the structure of the substrate processing system according to Embodiment 1 of the present invention.

[0033] Figure 2 It is a flowchart showing the process executed by the control unit of the integrated control device included in the substrate processing system according to Embodiment 1 of the present invention.

[0034] Figure 3 It is a plan view schematically showing the structure of the substrate processing system according to Embodiment 1 of the present invention.

[0035] Figure 4 It is a side sectional view schematically showing the inside of the single-piece processing unit.

[0036] Figure 5 It is a diagram showing an example of the first process editing screen.

[0037] Figure 6 It is a flowchart showing the process of the integrated process editing process executed by the control unit of the integrated control device included in the substrate processing system according to Embodiment 1 of the present invention.

[0038] Figure 7 This is a flowchart showing the process executed by the control unit of the integrated control device included in the substrate processing system according to Embodiment 1 of the present invention.

[0039] Figure 8 This is a flowchart showing the process executed by the first control unit of the batch processing device included in the substrate processing system according to Embodiment 1 of the present invention.

[0040] Figure 9 This is a flowchart showing the process executed by the first control unit of the batch processing device based on the first virtual job.

[0041] Figure 10 This is a flowchart showing the process executed by the control unit of the integrated control device included in the substrate processing system according to Embodiment 1 of the present invention.

[0042] Figure 11 This is a flowchart showing the process executed by the control unit of the integrated control device included in the substrate processing system according to Embodiment 1 of the present invention.

[0043] Figure 12 This is a flowchart showing the process executed by the second control unit of the single wafer processing device based on the second virtual job.

[0044] Figure 13 This is a flowchart showing the notification process executed by the first control unit of the first processing device when an event occurs in the first processing device operating based on the first virtual job.

[0045] Figure 14 This is a flowchart showing the notification process executed by the control unit of the integrated control device when an event occurs in the first processing device operating based on the first virtual job.

[0046] Figure 15 This is a flowchart showing the notification process executed by the second control unit of the second processing device when a completion event occurs in the second processing device operating based on the second virtual job.

[0047] Figure 16 This is a flowchart showing the notification process executed by the control unit of the integrated control device when a completion event occurs in the second processing device operating based on the second virtual job.

[0048] Figure 17 This is a diagram showing an example of the second process editing screen.

[0049] Figure 18This is a flowchart showing the process executed by the control unit of the integrated control device included in a modified example of the substrate processing system according to Embodiment 1 of the present invention.

[0050] Figure 19 This is a block diagram showing the structure of the substrate processing system according to Embodiment 2 of the present invention.

[0051] Figure 20 This is a block diagram showing the structure of the substrate processing system according to Embodiment 3 of the present invention.

[0052] Figure 21 This is a block diagram showing the structure of the substrate processing system according to Embodiment 4 of the present invention. Detailed Embodiments

[0053] Hereinafter, embodiments of the substrate processing system of the present invention will be described with reference to the accompanying drawings ( Figures 1 - 21 ). However, the present invention is not limited to the following embodiments and can be implemented in various ways without departing from its gist. In addition, for parts with repeated descriptions, the descriptions may be appropriately omitted. Further, in the drawings, the same or corresponding parts are denoted by the same reference numerals and will not be described repeatedly.

[0054] The "substrate" in the embodiments of the present invention can be applied to various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical discs, substrates for magnetic discs, and substrates for magneto-optical discs. Hereinafter, the embodiments of the present invention will be mainly described by taking a substrate processing system for processing disc-shaped semiconductor wafers as an example, but it can also be similarly applied to the processing of various substrates exemplified above. In addition, regarding the shape of the substrate, it can also be applied to various shapes.

[0055] [Embodiment 1]

[0056] Figure 1 This is a block diagram showing the structure of the substrate processing system 1000 according to the present embodiment. The substrate processing system 1000 according to the present embodiment processes a substrate W. Specifically, the substrate processing system 1000 according to the present embodiment performs substrate processing on the substrate W. The substrate processing includes, for example, chemical solution processing, rinsing processing, and drying processing. Through the chemical solution processing, the substrate W is processed with a chemical solution. The chemical solution processing is, for example, etching processing or cleaning processing. The rinsing processing represents the processing of rinsing the chemical solution from the substrate W. The drying processing represents the processing of drying the substrate W.

[0057] As Figure 1As shown, the substrate processing system 1000 of the present embodiment includes an integrated control device 10, a first processing device 20, and a second processing device 50. The substrate processing system 1000 is controlled by a host computer HC. The host computer HC is an example of an "external control device".

[0058] The first processing device 20 performs a first process on the substrate W based on one job. Here, a job represents an instruction for the processing device. Specifically, the job is a control job. That is, the job instructs to perform the following process: carry the substrate W from the substrate storage container CA into the inside of the processing device, perform a process on the substrate W inside the processing device, and then carry the substrate W out of the inside of the processing device into the same or a different substrate storage container CA.

[0059] Specifically, the first processing device 20 is configured to carry the substrate W from the substrate storage container CA into the inside of the first processing device 20 based on one job, perform a process (first process) on the substrate W inside the first processing device 20, and then carry the substrate W out of the inside of the first processing device 20 into the same or a different substrate storage container CA. The first processing device 20 can be an existing processing device, a device modified from an existing processing device, or a new processing device.

[0060] In the present embodiment, the first processing device 20 is a batch processing device. For example, the first processing device 20 can also be a batch-type cleaning device or a batch-type etching device. The cleaning device and the etching device are substrate processing devices. The batch processing device performs a batch process of processing a plurality of substrates W together. Specifically, the batch processing device processes the substrates W constituting a batch together. A batch is composed of one or more substrates W. The number of substrates W constituting a batch is, for example, 1 or more and 25 or less. A batch of substrates W is stored in one substrate storage container CA. The batch processing device is configured to be able to carry out the substrates W constituting a batch from the substrate storage container CA and perform, for example, a chemical solution process, a rinsing process, and a drying process on the substrates W constituting a batch.

[0061] Hereinafter, the first processing device 20 may sometimes be referred to as the "batch processing device 20". In the present embodiment, the batch processing device 20 processes two batches together. Specifically, the batch processing device 20 combines two batches to form one batch. Hereinafter, the one batch formed by combining two batches may sometimes be referred to as a "set of batches".

[0062] In addition, the substrate storage container CA stores a plurality of substrates W in a stacked state. Specifically, the plurality of substrates W are stacked in the substrate storage container CA in a horizontal posture at intervals in the vertical direction. Here, the horizontal posture means a state in which the thickness direction of the substrate W is along the vertical direction. The substrate storage container CA can be, for example, a FOUP (Front Opening Unified Pod), a SMIF (Standard Mechanical Inter Face) box, or an OC (Open Cassette).

[0063] The second processing device 50 performs a second process on the substrate W based on one job. Specifically, the second processing device 50 is configured to carry the substrate W into the interior of the second processing device 50 from the substrate storage container CA based on one job, perform a process (second process) on the substrate W inside the second processing device 50, and then carry the substrate W out of the interior of the second processing device 50 into the same or a different substrate storage container CA. Similar to the first processing device 20, the second processing device 50 can be an existing processing device, a device obtained by modifying an existing processing device, or a new processing device.

[0064] In the present embodiment, the second processing device 50 is a single-wafer processing device. For example, the second processing device 50 can be a single-wafer cleaning device or a single-wafer etching device. The single-wafer processing device performs a single-wafer process of processing the substrates W one by one. Specifically, the single-wafer processing device carries out the substrates W one by one from the substrate storage container CA and processes the substrates W one by one. The single-wafer processing device is configured to be able to perform a chemical solution process, a rinse process, and a drying process on one substrate W, for example. Hereinafter, the second processing device 50 may sometimes be referred to as the "single-wafer processing device 50".

[0065] The integrated control device 10 controls the first processing device 20 and the second processing device 50 based on a command received from the host computer HC. More specifically, the integrated control device 10 generates a first virtual job and a second virtual job based on a production command of an integrated job received from the host computer HC. Then, the integrated control device 10 causes the first processing device 20 to execute the first virtual job and causes the second processing device 50 to execute the second virtual job. The integrated control device 10 can be, for example, a general-purpose computer system or a dedicated computer system. Here, the production command of the integrated job represents a production command for controlling jobs. In addition, the first virtual job is a control job. Similarly, the second virtual job is a control job.

[0066] The first processing apparatus 20 performs at least a part of the first process on the substrate W based on the first virtual job. The second processing apparatus 50 performs at least a part of the second process on the substrate W processed by the first processing apparatus 20 based on the second virtual job.

[0067] In this embodiment, the first virtual job causes the batch processing apparatus 20 to perform a chemical liquid treatment and a rinse treatment. The second virtual job causes the single-wafer processing apparatus 50 to perform a drying treatment. Therefore, the batch processing apparatus 20 performs the chemical liquid treatment and the rinse treatment among the chemical liquid treatment, the rinse treatment, and the drying treatment on a group of batches based on the first virtual job. The single-wafer processing apparatus 50 performs the chemical liquid treatment, the rinse treatment, and the drying treatment among the drying treatment on each substrate W included in a group of batches after batch processing based on the second virtual job.

[0068] As described above, according to Embodiment 1, the host computer HC only needs to instruct the integrated control device 10 to create one job. Therefore, the host computer HC does not need to instruct the first processing device 20 and the second processing device 50 to create jobs separately. Therefore, there is no need to introduce a new system (software) to the existing host computer, so it is possible to suppress the increase in the burden on the operator who manages the host computer HC. In addition, according to Embodiment 1, the integrated control device 10 generates a first virtual job and a second virtual job based on the command from the host computer HC, whereby the first processing device 20 and the second processing device 50 cooperate to perform a series of substrate processing (substrate processing that continuously performs liquid treatment, rinsing treatment, and drying treatment). Therefore, since the first processing device 20 and the second processing device 50 will not perform substrate processing through one job, the SEMI standard is met.

[0069] Next, refer to Figure 1 The substrate processing system 1000 of this embodiment is further described. Figure 1 As shown, the substrate processing system 1000 of the present embodiment further includes a first connection unit 80. The first connection unit 80 connects the first processing apparatus 20 and the second processing apparatus 50 together.

[0070] As reference Figure 3 As described later, the first connection unit 80 includes a substrate transfer mechanism 82 for transferring the substrate W processed by the first processing apparatus 20 to the second processing apparatus 50. In the present embodiment, the substrate transfer mechanism 82 of the first connection unit 80 transfers the substrates W processed by the chemical solution and rinsed in the batch processing apparatus 20 to the single-wafer processing apparatus 50 one by one.

[0071] Next, refer to Figure 1 , describing the structures of the host computer HC, the integrated control device 10, the first processing device 20 and the second processing device 50.

[0072] As Figure 1 shown, the host computer HC commands the control device 10 to create a comprehensive operation. The host computer HC can be, for example, a general computer system or a dedicated computer system. The host computer HC can also be, for example, a MES (Manufacturing Execution System). Specifically, the host computer HC includes an input unit HC1, a display unit HC2, a storage unit HC3, a communication unit HC4, and a control unit HC5.

[0073] The input unit HC1 includes a user interface device operated by an operator. The input unit HC1 inputs a signal corresponding to the operator's operation to the control unit HC5. The input unit HC1 includes, for example, a keyboard and a mouse. The input unit HC1 can also include a touch sensor overlapping the display surface of the display unit HC2. A graphical user interface can also be formed by overlapping a touch sensor on the display surface of the display unit HC2. For example, as will be described later, the operator can operate the input unit HC1 to edit the process. Figure 5 As described later, the operator can operate the input unit HC1 to edit the process.

[0074] The display unit HC2 is controlled by the control unit HC5 to display various screens. For example, the display unit HC2 is controlled by the control unit HC5 to display the first process editing screen G1 described later. The display unit HC2 includes, for example, a display device such as a liquid crystal display device or an organic EL (electroluminescence) display device. Figure 5 As described later, the first process editing screen G1 is displayed. The display unit HC2 includes, for example, a display device such as a liquid crystal display device or an organic EL (electroluminescence) display device.

[0075] The storage unit HC3 has a main storage device. The main storage device includes, for example, a semiconductor memory. The storage unit HC3 can also have an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit HC3 can also include a removable medium. The storage unit HC3 stores various computer programs and various data.

[0076] The communication unit HC4 is connected to a network and performs communication with the integrated control device 10. The network includes, for example, a LAN (Local Area Network) laid in a factory where the first processing device 20 and the second processing device 50 are provided. The communication unit HC4 includes a communication machine. The communication machine is, for example, a network interface controller.

[0077] In addition, when the existing host computer is used as the host computer HC, the communication interface between the host computer HC and the integrated control device 10 can use the existing communication interface.

[0078] The communication unit HC4 is controlled by the control unit HC5 and sends a signal for commanding the production of an integrated operation to the integrated control device 10. In addition, the communication unit HC4 receives a notification indicating that an event has occurred from the integrated control device 10. The notification includes a notification of an event that has occurred in the substrate processing system 1000. For example, when an event occurs in which the substrate storage container CA is docked with the substrate processing system 1000, the communication unit HC4 receives a notification from the integrated control device 10 indicating that the substrate storage container CA has been docked with the substrate processing system 1000.

[0079] The control unit HC5 includes a processor. The control unit HC5 includes, for example, a CPU (Central Processing Unit) as the processor. The control unit HC5 may also include a GPU (Graphics Processing Unit) as the processor. Alternatively, the control unit HC5 may include a general-purpose computing device or a dedicated computing device. For example, the control unit HC5 may include an FPGA (Field-Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit) as the general-purpose computing device or the dedicated computing device.

[0080] The control unit HC5 executes a computer program stored in the storage unit HC3 to control the display unit HC2, the storage unit HC3, and the communication unit HC4. When executing the computer program, the control unit HC5 may refer to the data stored in the storage unit HC3. For example, when the notification received from the integrated control device 10 indicates that an event has occurred in which the substrate storage container CA is docked with the substrate processing system 1000, the control unit HC5 causes the communication unit HC4 to send a production command for the integrated operation.

[0081] Next, the integrated control device 10 will be described. As Figure 1 shown, the integrated control device 10 includes a communication unit 11, a storage unit 12, and a control unit 13.

[0082] The communication unit 11 is connected to a network and performs communication with the communication unit HC4 of the host computer HC. The communication unit 11 includes a communication machine. The communication unit 11 is controlled by the control unit 13 and notifies the host computer HC of the occurrence of an event. In addition, the communication unit 11 receives a production instruction for the integrated operation from the host computer HC.

[0083] The communication unit 11 also performs communication between the first processing device 20 and the second processing device 50. The communication unit 11 is controlled by the control unit 13, and sends the first virtual job to the first processing device 20 and the second virtual job to the second processing device 50. In addition, the communication unit 11 is notified of the events that occur in the first processing device 20 and the events that occur in the second processing device 50.

[0084] For example, when an event occurs in which the substrate storage container CA is docked with the first processing device 20, the first processing device 20 notifies the integrated control device 10 of the occurrence of the event. In addition, when the processing based on the first virtual job is completed, the first processing device 20 notifies the integrated control device 10 of the occurrence of the event. Similarly, when an event occurs in which the substrate storage container CA is docked with the second processing device 50, the second processing device 50 notifies the integrated control device 10 of the occurrence of the event. In addition, when the processing based on the second virtual job is completed, the second processing device 50 notifies the integrated control device 10 of the occurrence of the event.

[0085] The storage unit 12 has a main storage device. The storage unit 12 may also have an auxiliary storage device. The storage unit 12 may also include a removable medium. The storage unit 12 stores various computer programs and various data. For example, the data includes reference Figure 5 and Figure 6 the integrated process information HR described later.

[0086] The control unit 13 includes a processor. The control unit 13 includes, for example, a CPU as the processor. The control unit 13 may also include a GPU as the processor. The control unit 13 may also include a general-purpose computing device or a dedicated computing device. The control unit 13 executes the computer programs stored in the storage unit 12 to control the communication unit 11 and the storage unit 12. When executing the computer programs, the control unit 13 may refer to the data stored in the storage unit 12.

[0087] For example, when the communication unit 11 receives a production command for an integrated job from the host computer HC, the control unit 13 generates the first virtual job and the second virtual job by referring to the integrated process information HR. Then, the control unit 13 controls the communication unit 11 to send the first virtual job from the communication unit 11 to the first processing device 20. Similarly, the control unit 13 controls the communication unit 11 to send the second virtual job from the communication unit 11 to the second processing device 50.

[0088] In addition, when an event occurs in which the substrate storage container CA is docked with the first processing device 20, the control unit 13 notifies the host computer HC from the communication unit 11 that an event has occurred in which the substrate storage container CA is docked with the substrate processing system 1000.

[0089] Next, the first processing device 20 will be described. As Figure 1As shown, the first processing device 20 includes a first control device 21 and a main body 30. The main body 30 performs a first process on the substrate W. In the present embodiment, the first processing device 20 is a batch processing device, and the main body 30 performs batch processing on the substrate W. The first control device 21 controls the main body 30. Specifically, the first control device 21 includes a first communication unit 22, a first storage unit 23, and a first control unit 24.

[0090] The first communication unit 22 is connected to the network and performs communication with the communication unit 11 of the integrated control device 10. The first communication unit 22 includes a communicator. The first communication unit 22 is controlled by the first control unit 24 and notifies the integrated control device 10 of the occurrence of an event. In addition, the first communication unit 22 receives a first virtual job from the integrated control device 10.

[0091] The first storage unit 23 has a main storage device. The first storage unit 23 may also have an auxiliary storage device. The first storage unit 23 may also include a removable medium. The first storage unit 23 stores various computer programs and various data. For example, the data includes a first process RP1. The first process RP1 defines the first process performed by the main body 30 of the first processing device 20 on the substrate W. Specifically, the first process RP1 defines the order of substrate processing (process sequence) and the set values of various parameters (process parameters).

[0092] The first control unit 24 includes a processor. The first control unit 24 includes, for example, a CPU as the processor. The first control unit 24 may also include an MCU (Micro Controller Unit), an MPU (Micro Processing Unit), or a GPU as the processor. The first control unit 24 may also include a general-purpose computing device or a dedicated computing device. The first control unit 24 executes the computer programs stored in the first storage unit 23 to control the first communication unit 22, the first storage unit 23, and the main body 30. When executing the computer programs, the first control unit 24 may refer to the data stored in the first storage unit 23.

[0093] Specifically, whenever an event occurs in the first processing device 20, the first control unit 24 notifies the integrated control device 10 of the occurrence of the event from the first communication unit 22. For example, whenever the state of the main body 30 changes, the first control unit 24 notifies the integrated control device 10 of the occurrence of the event from the first communication unit 22.

[0094] In addition, when the first control unit 24 receives a first virtual job from the integrated control device 10, it controls the main body 30 based on the first process RP1 to cause the main body 30 to process the substrate W. Specifically, at least one first process RP1 is stored in the first storage unit 23. The first virtual job includes information for determining (specifying)

[0095] Information of one first process RP1 in the first process RP1 stored in the first storage unit 23. The first control unit 24 controls the main body unit 30 with reference to the first process RP1 determined (designated) by the first virtual job.

[0096] In the present embodiment, the main body unit 30 performs a chemical liquid treatment and a rinsing treatment on the substrate W based on the first virtual job. The first process RP1 determined (designated) by the first virtual job stipulates the order of the chemical liquid treatment, the order of the rinsing treatment, and the set values of various parameters.

[0097] Next, the second processing device 50 will be described. As Figure 1 shown, the second processing device 50 includes a second control device 51 and a main body unit 60. The main body unit 60 performs a second process on the substrate W. In the present embodiment, the second processing device 50 is a single wafer processing device, and the main body unit 60 performs a single wafer process on the substrate W. The second control device 51 controls the main body unit 60. Specifically, the second control device 51 includes a second communication unit 52, a second storage unit 53, and a second control unit 54.

[0098] The second communication unit 52 is connected to the network and performs communication with the communication unit 11 of the integrated control device 10. The second communication unit 52 includes a communication machine. The second communication unit 52 is controlled by the second control unit 54 and notifies the integrated control device 10 of the occurrence of an event. In addition, the second communication unit 52 receives a second virtual job from the integrated control device 10.

[0099] The second storage unit 53 has a main storage device. The second storage unit 53 may also have an auxiliary storage device. The second storage unit 53 may also include a removable medium. The second storage unit 53 stores various computer programs and various data. For example, the data includes a second process RP2. The second process RP2 stipulates the second process performed by the main body unit 60 of the second processing device 50 on the substrate W. Specifically, the second process RP2 stipulates the order (process sequence) of the substrate process and the set values of various parameters (process parameters).

[0100] The second control unit 54 includes a processor. The second control unit 54 includes, for example, a CPU as the processor. The second control unit 54 may also include an MCU, an MPU, or a GPU as the processor. The second control unit 54 may also include a general-purpose computing device or a dedicated computing device. The second control unit 54 executes the computer programs stored in the second storage unit 53 to control the second communication unit 52, the second storage unit 53, and the main body unit 60. When executing the computer programs, the second control unit 54 may refer to the data stored in the second storage unit 53.

[0101] Specifically, whenever an event occurs in the second processing device 50, the second control unit 54 notifies the integrated control device 10 of the occurrence of the event from the second communication unit 52. For example, whenever the state of the main body unit 60 changes, the second control unit 54 notifies the integrated control device 10 of the occurrence of the event from the second communication unit 52.

[0102] In addition, when the second control unit 54 receives the second virtual job from the integrated control device 10, it controls the main body unit 60 based on the second process RP2 to cause the main body unit 60 to process the substrate W. Specifically, the second storage unit 53 stores at least one second process RP2. The second virtual job includes information for determining (designating) one second process RP2 among the second processes RP2 stored in the second storage unit 53. The second control unit 54 controls the main body unit 60 with reference to the second process RP2 determined (designated) by the second virtual job.

[0103] In the present embodiment, the main body unit 60 performs a drying process on the substrate W based on the second virtual job. The second process RP2 determined (designated) by the second virtual job specifies the order of the drying process and the set values of various parameters.

[0104] Next, with reference to Figure 1 and Figure 2 , the process executed by the control unit 13 of the integrated control device 10 will be described. Figure 2 is a flowchart showing the process flow of the process executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. The process shown in Figure 2 starts when the integrated control device 10 receives a production command for an integrated job from the host computer HC.

[0105] As shown in Figure 2 , the integrated control device 10 generates a first virtual job and a second virtual job based on the production command for the integrated job received from the host computer HC. Specifically, when the integrated control device 10 receives the production command for the integrated job from the host computer HC, it generates a first virtual job and a second virtual job with reference to the integrated process information HR.

[0106] Specifically, when the control unit 13 (integrated control device 10) starts the process shown in Figure 2 , it generates a first virtual job with reference to the integrated process information HR and sends the first virtual job from the communication unit 11 to the first control device 21 of the first processing device 20 (step S1). As a result, the first processing device 20 processes the substrate W based on the first virtual job. In the present embodiment, the first processing device 20 is a batch processing device that performs a chemical solution process and a rinsing process on a group of batches at once.

[0107] After the liquid medicine treatment and the rinsing treatment for a set of batches are completed, the control unit 13 (integrated control device 10) generates a second virtual operation with reference to the integrated process information HR, and sends the second virtual operation from the communication unit 11 to the second control device 51 of the second processing device 50 (process S2). As a result, the second processing device 50 performs processing on the substrate W based on the second virtual operation. In the present embodiment, the second processing device 50 is a single-piece processing device, and processes the substrates W one by one. Specifically, the second processing device 50 performs a drying process.

[0108] The second virtual operation instructs to perform processing on the substrates W constituting one batch. Therefore, after the drying process for one batch in a set of batches (two batches) is completed, the control unit 13 (integrated control device 10) generates a second virtual operation again with reference to the integrated process information HR, and sends the second virtual operation from the communication unit 11 to the second control device 51 of the second processing device 50 again (process S3). As a result, Figure 2 the processing shown ends. In addition, the second processing device 50 performs a drying process on the other batch in a set of batches (two batches) based on the second second virtual operation.

[0109] Next, refer to Figure 3 The substrate processing system 1000 of the present embodiment will be described. Figure 3 is a plan view schematically showing the structure of the substrate processing system 1000 of the present embodiment. Specifically, Figure 3 shows the structures of the main body 30 of the batch processing device 20, the main body 60 of the single-piece processing device 50, the first connection part 80, and the second connection part 90.

[0110] In addition, in the following description, for easy understanding, the X direction, the Y direction, and the Z direction are sometimes defined for the description. The X direction and the Y direction are directions parallel to the horizontal plane, and the Z direction is a direction parallel to the vertical plane. The X direction and the Y direction are orthogonal to each other. In the present embodiment, the side where the plurality of first container placement parts CP1 are located in the batch processing device 20 is the +X side, and the opposite side is the -X side. Similarly, in the single-piece processing device 50, the side where the plurality of second container placement parts CP2 are located is the +X side, and the opposite side is the -X side. In addition, with respect to the batch processing device 20, the side where the single-piece processing device 50 is located is the -Y side, and with respect to the single-piece processing device 50, the side where the batch processing device 20 is located is the +Y side. Therefore, the batch processing device 20 and the single-piece processing device 50 face each other in the Y direction.

[0111] As Figure 3As shown, the main body 30 of the batch processing apparatus 20 includes a first housing 31, a plurality of first container placement units CP1, a container storage unit ACB, a first batch transfer mechanism HTR, a first posture conversion mechanism CTC, a second batch transfer mechanism WTR, and a first batch processing unit BPU1 to a seventh batch processing unit BPU7.

[0112] The plurality of first container placement units CP1 are provided outside the first housing 31. Substrate storage containers CA are respectively placed on the plurality of first container placement units CP1. In the present embodiment, the batch processing apparatus 20 includes two first container placement units CP1. The two first container placement units CP1 are arranged along the Y direction. The two first container placement units CP1 are located on the +X side with respect to the container storage unit ACB.

[0113] The first container placement unit CP1 is, for example, a load port. Hereinafter, one of the two first container placement units CP1 may be referred to as "first load port LP1", and the other may be referred to as "second load port LP2". The second load port LP2 is located on the -Y side with respect to the first load port LP1. The first load port LP1 is located on the +Y side with respect to the second load port LP2.

[0114] The container storage unit ACB is provided inside the first housing 31. The container storage unit ACB stores the substrate storage containers CA. Specifically, the container storage unit ACB includes a first container transfer mechanism 32, a first container rack 33a, and a plurality of second container racks 33b.

[0115] The first container transfer mechanism 32 is configured to be able to transfer the substrate storage container CA between the second load port LP2, the first container rack 33a, and the plurality of second container racks 33b. The operation of the first container transfer mechanism 32 is controlled by the first control device 21.

[0116] Specifically, the first container transfer mechanism 32 can transfer the substrate storage container CA placed on the second load port LP2 to the first container rack 33a to place the substrate storage container CA on the first container rack 33a. In addition, the first container transfer mechanism 32 can transfer the substrate storage container CA from the first container rack 33a to one of the plurality of second container racks 33b to place the substrate storage container CA on the second container rack 33b. In addition, the first container transfer mechanism 32 can transfer the substrate storage container CA from the second container rack 33b to the second load port LP2 to place the substrate storage container CA on the second load port LP2. In addition, the first container transfer mechanism 32 can transfer the substrate storage container CA from the second container rack 33b to the first container rack 33a to place the substrate storage container CA on the first container rack 33a. Further, the first container transfer mechanism 32 can transfer the substrate storage container CA from the first container rack 33a to the second load port LP2 to place the substrate storage container CA on the second load port LP2.

[0117] The first lot transfer mechanism HTR and the first posture transformation mechanism CTC are provided in the first housing 31. The first lot transfer mechanism HTR is configured to access the substrate storage container CA placed on the first container rack 33a, take out the substrates W constituting one lot together from the substrate storage container CA, and transfer the substrates W constituting one lot to the first posture transformation mechanism CTC. In addition, the first lot transfer mechanism HTR and the first posture transformation mechanism CTC are configured to be able to transfer one lot of substrates W between the first lot transfer mechanism HTR and the first posture transformation mechanism CTC. The operation of the first lot transfer mechanism HTR is controlled by the first control device 21.

[0118] The first posture transformation mechanism CTC is configured to combine two lots of substrates W to form a set of lots. In addition, the first posture transformation mechanism CTC is configured to transform the posture of a set of lots and transform the postures of the respective substrates W constituting a set of lots between a horizontal posture and a vertical posture. That is, the first posture transformation mechanism CTC is configured to transform the posture of a set of lots between a horizontal posture and a vertical posture. The operation of the first posture transformation mechanism CTC is controlled by the first control device 21.

[0119] Specifically, according to the first container transfer mechanism 32 transferring the first substrate storage container CA1 from the second load port LP2 to the first container rack 33a, the first lot transfer mechanism HTR transfers the first lot of substrates W stored in the first substrate storage container CA1 to the first posture transformation mechanism CTC together.

[0120] After the first container transfer mechanism 32 transfers the emptied first substrate storage container CA1 from the first container rack 33a to one of the plurality of second container racks 33b, it transfers the second substrate storage container CA2 newly placed on the second load port LP2 to the first container rack 33a. Then, the first batch transfer mechanism HTR transfers the substrates W of the second batch stored in the second substrate storage container CA2 placed on the first container rack 33a to the first posture conversion mechanism CTC all at once. The first posture conversion mechanism CTC combines two batches sequentially transferred by the first batch transfer mechanism HTR to form a set of batches.

[0121] The second batch transfer mechanism WTR and the first to seventh batch processing units BPU1 to BPU7 are provided in the first housing 31. The first to seventh batch processing units BPU1 to BPU7 are arranged in the X direction. In the present embodiment, the seventh batch processing unit BPU7 among the first to seventh batch processing units BPU1 to BPU7 is located at the position closest to the +X side.

[0122] The second batch transfer mechanism WTR and the first posture conversion mechanism CTC are configured to be able to transfer a set of batches between the second batch transfer mechanism WTR and the first posture conversion mechanism CTC. In addition, the second batch transfer mechanism WTR is configured to be able to transfer a set of batches between the first to seventh batch processing units BPU1 to BPU7. Moreover, the second batch transfer mechanism WTR is configured to be able to transfer a set of batches between the substrate standby unit 40 described later. Specifically, the second batch transfer mechanism WTR has a pair of chucks 34, and the pair of chucks 34 are configured to be able to grip the substrates W in the vertical posture that constitute a set of batches. The operation of the second batch transfer mechanism WTR is controlled by the first control device 21.

[0123] The first to fourth batch processing units BPU1 to BPU4 are each configured to be able to perform chemical liquid treatment (batch chemical liquid treatment) on the substrates W in the vertical posture that constitute a set of batches all at once. Therefore, the batch processing device 20 can perform chemical liquid treatment on up to four sets of batches (eight batches) in parallel. After the second batch transfer mechanism WTR grips a set of batches supported by the first posture conversion mechanism CTC using the pair of chucks 34, it transfers them to one of the first to fourth batch processing units BPU1 to BPU4.

[0124] Specifically, the first to fourth batch processing units BPU1 to BPU4 each have a first chemical liquid tank CHB1 to a fourth chemical liquid tank CHB4 and a first lifter LF1 to a fourth lifter LF4.

[0125] A liquid medicine is stored in the first liquid medicine tank CHB1. The liquid medicine is, for example, an etching liquid. The etching liquid can be an acidic liquid medicine such as an aqueous phosphoric acid solution. The first lifter LF1 is configured to be able to move up and down between an upper position and a lower position. The upper position is a position above the liquid level of the liquid medicine stored in the first liquid medicine tank CHB1, and the lower position is a position below the liquid level of the liquid medicine stored in the first liquid medicine tank CHB1. The operation of the first lifter LF1 is controlled by the first control device 21.

[0126] When the first lifter LF1 is in the upper position, a set of batches is transferred between the first lifter LF1 and the second batch transfer mechanism WTR. Specifically, the first lifter LF1 has a support member 35. The support member 35 supports each substrate W in a vertical posture. When the first lifter LF1 is in the upper position, the second batch transfer mechanism WTR places a set of batches on the support member 35 of the first lifter LF1. In addition, when the first lifter LF1 is in the upper position, the second batch transfer mechanism WTR uses a pair of chucks 34 to grip each substrate W in a vertical posture supported by the support member 35 of the first lifter LF1.

[0127] In a state where each substrate W in a vertical posture is supported by the support member 35, the first lifter LF1 moves from the upper position to the lower position, whereby each substrate W in a vertical posture is immersed in the liquid medicine stored in the first liquid medicine tank CHB1. Each substrate W is held in the liquid medicine, whereby each substrate W is subjected to liquid medicine treatment. After the liquid medicine treatment is completed, the first lifter LF1 moves from the lower position to the upper position.

[0128] The structures of the second batch processing unit BPU2 to the fourth batch processing unit BPU4 are the same as the structure of the first batch processing unit BPU1, so their descriptions are omitted.

[0129] The fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 are each configured to be able to perform a rinsing process (batch rinsing process) on each substrate W in a vertical posture constituting a set of batches. Therefore, the batch processing device 20 can perform the rinsing process on at most two sets of batches (four batches) in parallel. The second batch transfer mechanism WTR transfers a set of batches after the liquid medicine treatment to one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6.

[0130] Specifically, the fifth batch processing unit BPU5 has a first rinsing tank ONB1 and a fifth lifter LF5. The sixth batch processing unit BPU6 has a second rinsing tank ONB2 and a sixth lifter LF6.

[0131] The rinsing liquid is stored in the first rinsing tank ONB1 and the second rinsing tank ONB2, respectively. The rinsing liquid can be deionized water (DIW). By immersing a set of batches after chemical liquid treatment in the rinsing liquid, the chemical liquid attached to each substrate W in a vertical posture constituting a set of batches is rinsed. The structures of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 are substantially the same as those of the first batch processing unit BPU1 to the fourth batch processing unit BPU4, so their detailed descriptions are omitted.

[0132] The seventh batch processing unit BPU7 performs a batch drying process for drying each substrate W in a vertical posture constituting a set of batches together. The seventh batch processing unit BPU7 is used when performing chemical liquid treatment, rinsing treatment, and drying treatment in the batch processing apparatus 20. The operation of the seventh batch processing unit BPU7 is controlled by the first control device 21.

[0133] Specifically, the seventh batch processing unit BPU7 includes a drying chamber LPD, an inert gas supply nozzle, and an organic solvent supply nozzle. The second batch transfer mechanism WTR stores a set of batches after rinsing treatment in the drying chamber LPD. The inert gas supply nozzle supplies an inert gas into the drying chamber LPD. The organic solvent supply nozzle supplies vapor of an organic solvent into the drying chamber LPD. In addition, the inert gas is, for example, nitrogen. The organic solvent is, for example, IPA (isopropyl alcohol).

[0134] After the seventh batch processing unit BPU7 stores a set of batches in the drying chamber LPD, first, an inert gas is supplied into the drying chamber LPD to replace the atmosphere in the drying chamber LPD with the inert gas. After that, the seventh batch processing unit BPU7 decompresses the drying chamber LPD. Then, in a state where the drying chamber LPD is decompressed, the seventh batch processing unit BPU7 supplies vapor of an organic solvent into the drying chamber LPD. The organic solvent and the moisture attached to the substrate W are discharged out of the drying chamber LPD. As a result, each substrate W stored in the drying chamber LPD is dried.

[0135] In addition, the first batch and the second batch constituting a set of batches can be returned to the first substrate storage container CA1 and the second substrate storage container CA2, respectively, after the drying process is performed.

[0136] Specifically, the second batch transfer mechanism WTR transports a set of batches after the drying process to the first posture conversion mechanism CTC. The first posture conversion mechanism CTC converts the posture of each substrate W from a vertical posture to a horizontal posture. On the other hand, the first container transfer mechanism 32 moves the empty first substrate storage container CA1 from the second container rack 33b to the first container rack 33a.

[0137] The first batch transfer mechanism HTR transfers one of the two batches (the first batch) constituting a set of batches from the first posture transformation mechanism CTC to the empty first substrate storage container CA1 placed on the first container rack 33a, thereby loading it into the first substrate storage container CA1. As a result, the first batch is stored in the first substrate storage container CA1. After the first container transfer mechanism 32 transfers the first substrate storage container CA1 containing the first batch after the drying process to the second loading port LP2, it moves the empty second substrate storage container CA2 from the second container rack 33b to the first container rack 33a. The first substrate storage container CA1 placed on the second loading port LP2 is transferred from the second loading port LP2 to the first loading port LP1 by the second container transfer mechanism 92 described later.

[0138] The second batch after the drying process is similarly loaded into the empty second substrate storage container CA2 as the first batch. Then, the second substrate storage container CA2 containing the second batch after the drying process is transferred to the second loading port LP2 by the first container transfer mechanism 32 in the same manner as the first substrate storage container CA1.

[0139] On the other hand, when the batch drying process is not performed in the batch processing device 20, the second batch transfer mechanism WTR transfers the batch after the rinsing process to the first connection portion 80. Specifically, the second batch transfer mechanism WTR transfers the batch after the rinsing process to the substrate standby portion 40 described later. The batch after the rinsing process stands by in the substrate standby portion 40. In addition, the batch after the rinsing process is an example of "a substrate that has undergone at least a part of the first process".

[0140] Next, the first connection portion 80 will be described. As Figure 3 shown, the first connection portion 80 has a substrate standby portion 40. The substrate standby portion 40 is provided in the first housing 31 of the batch processing device 20. In the present embodiment, the substrate standby portion 40 is provided on the +X side of the seventh batch processing unit BPU7.

[0141] When performing substrate processing by the batch processing device 20 and the single-chip processing device 50, the substrate standby portion 40 makes the batch after the rinsing process stand by. Specifically, the substrate standby portion 40 includes a seventh elevator LF7, a standby tank 42, a chuck mechanism TFC, and a posture transformation portion 43.

[0142] For example, deionized water is stored in the standby tank 42. The seventh elevator LF7 is configured to be able to move up and down between an upper position and a lower position in the same manner as the first elevator LF1. The operation of the seventh elevator LF7 is controlled by the control unit 13 of the integrated control device 10 (refer to Figure 1) Control. In addition, the integrated control device 10 can be arranged, for example, below a plurality of second container placement parts CP2 described later.

[0143] Specifically, when the second batch transfer mechanism WTR places a set of batches on the support member 35 of the seventh lifter LF7 located at the upper position, the first control device 21 (first control unit 24) notifies the integrated control device 10 of the completion event of the first virtual operation. The completion event indicates that the processing based on the operation has been completed. The control unit 13 of the integrated control device 10 starts the control of the first connection part 80 in response to the occurrence of the completion event of the first virtual operation.

[0144] Specifically, when the completion event of the first virtual operation occurs, the seventh lifter LF7 moves from the upper position to the lower position. As a result, a set of batches (each substrate W in the vertical posture) is immersed in the deionized water stored in the standby tank 42. Since the structure of the seventh lifter LF7 is the same as that of the first lifter LF1, its detailed description is omitted.

[0145] The chuck mechanism TFC is configured to transfer one batch between the seventh lifter LF7 and the posture changing unit 43. Specifically, the chuck mechanism TFC has a pair of chucks 41, and the pair of chucks 41 are configured to be able to grip one of the two batches that make up a set of batches. The operation of the chuck mechanism TFC is controlled by the control unit 13 of the integrated control device 10.

[0146] When a set of batches is immersed in the liquid in the standby tank 42, the chuck mechanism TFC grips one of the two batches that make up the set of batches supported by the seventh lifter LF7 and transfers it to the posture changing unit 43. Specifically, the chuck mechanism TFC grips one of the two batches with the pair of chucks 41, moves the one batch above the liquid level of the standby tank 42, and then transfers it to the posture changing unit 43. After the chuck mechanism TFC transfers each substrate W that makes up one batch from the posture changing unit 43 to the single-chip processing device 50 using the substrate transfer mechanism 82 described later, it grips the other batch immersed in the liquid in the standby tank 42 and transfers it to the posture changing unit 43.

[0147] The posture changing unit 43 has a second posture changing mechanism and an immersion tank. The second posture changing mechanism is configured to be able to perform the handover of each substrate W in the vertical posture that makes up one batch with the chuck mechanism TFC. In addition, the second posture changing mechanism is configured to change the posture of each substrate W that makes up one batch from the vertical posture to the horizontal posture. The operation of the second posture changing mechanism is controlled by the control unit 13 of the integrated control device 10.

[0148] Deionized water is stored, for example, in the dipping tank. The second posture changing mechanism is configured to be movable in the vertical direction. By moving downward the second posture changing mechanism, a batch of substrates W are dipped in the deionized water in the dipping tank. Further, the second posture changing mechanism adjusts the vertical position of each substrate W after the posture change so that the uppermost substrate W in the batch of substrates W is positioned above the liquid level of the dipping tank. In addition, the second posture changing mechanism can change the posture of a batch either in the liquid in the dipping tank or above the liquid level of the dipping tank.

[0149] Next, the single wafer processing apparatus 50 will be described. As Figure 3 shown, the main body 60 of the single wafer processing apparatus 50 includes a second housing 61, a plurality of second container mounting portions CP2, a transfer robot IR, a central robot CR, and a plurality of towers TW. Further, the first connection portion 80 has a transfer portion 62.

[0150] The plurality of second container mounting portions CP2 are provided outside the second housing 61. Specifically, the plurality of second container mounting portions CP2 are located on the +X side of the second housing 61. Substrate storage containers CA are respectively mounted on the plurality of second container mounting portions CP2. The plurality of second container mounting portions CP2 are arranged in the Y direction.

[0151] In the present embodiment, the single wafer processing apparatus 50 includes four second container mounting portions CP2. The second container mounting portion CP2 is, for example, a load port. Hereinafter, the second container mounting portion CP2 may be referred to as "third load port LP3".

[0152] The transfer robot IR, the central robot CR, and the plurality of towers TW are located inside the second housing 61. The transfer robot IR transfers the substrate W between the third load port LP3 and the central robot CR. Further, a mounting table (path) for temporarily mounting the substrate W may be provided between the transfer robot IR and the central robot CR, and the substrate W may be indirectly transferred between the transfer robot IR and the central robot CR via the mounting table. The operation of the transfer robot IR is controlled by the second control device 51.

[0153] The plurality of towers TW are arranged so as to surround the central robot CR in a plan view. In the present embodiment, the single wafer processing apparatus 50 includes four towers TW (first tower TW1 to fourth tower TW4).

[0154] Each tower TW includes a plurality of single wafer processing units 63 stacked one above the other. In the present embodiment, the first tower TW1, the second tower TW2, and the fourth tower TW4 include three single wafer processing units 63. The third tower TW3 includes two single wafer processing units 63 and one chamber 63a. Specifically, single wafer processing units 63 are provided on the uppermost layer and the lowermost layer of the third tower TW3. The chamber 63a is provided in the middle layer of the third tower TW3.Figure 3 Shows the structure of the middle layer of each tower TW.

[0155] The central robot CR transports the substrate W between the transfer robot IR and the single-chip processing unit 63. In addition, the central robot CR transports the substrate W between the chamber 63a and the single-chip processing unit 63. The operation of the central robot CR is controlled by the second control device 51.

[0156] The single-chip processing unit 63 is configured to be able to perform chemical liquid treatment, rinsing treatment, and drying treatment on one substrate W respectively. The transfer portion 62 of the first connection portion 80 is provided in the chamber 63a. Specifically, the chamber 63a has a substantially box shape and houses the transfer portion 62.

[0157] The transfer portion 62 is configured to hold the substrate W piece by piece. For example, the transfer portion 62 can be a clamping chuck or a vacuum chuck. The operation of the transfer portion 62 is controlled by the control portion 13 of the integrated control device 10 (refer to Figure 1 ).

[0158] Next, refer to Figure 3 for further description of the batch processing device 20, the single-chip processing device 50, and the first connection portion 80. As Figure 3 shown, the first housing 31 of the batch processing device 20 has a first opening 31a. The second housing 61 of the single-chip processing device 50 has a second opening 61a. The first connection portion 80 further includes a first connection housing 81 and a substrate transfer mechanism 82.

[0159] The first connection housing 81 is cylindrical. The first connection housing 81 extends in the Y direction. One end of the first connection housing 81 is connected to the first housing 31. The other end of the first connection housing 81 is connected to the second housing 61. One end and the other end of the first connection housing 81 are open, and the inner space of the first connection housing 81 communicates with the first opening 31a of the first housing 31 and the second opening 61a of the second housing 61.

[0160] Specifically, the first opening 31a of the first housing 31 is provided at a position where the inner space of the substrate standby portion 40 communicates with the inner space of the first connection housing 81. The second opening 61a of the second housing 61 is provided at a position where the inner space of the chamber 63a communicates with the inner space of the first connection housing 81.

[0161] The substrate transfer mechanism 82 transfers the substrate W processed by the batch processing apparatus 20 to the single wafer processing apparatus 50 one by one. Specifically, the substrate transfer mechanism 82 accesses the substrate standby section 40 through the first opening 31a of the first housing 31, and transfers the substrate W waiting in the substrate standby section 40 to the single wafer processing apparatus 50 one by one. The substrate transfer mechanism 82 is, for example, a transfer robot. The operation of the substrate transfer mechanism 82 is controlled by the control section 13 of the integrated control apparatus 10.

[0162] Specifically, the substrate transfer mechanism 82 transfers the substrate W located above the liquid surface of the dipping tank provided in the posture changing section 43 to the single wafer processing apparatus 50. Therefore, the substrate transfer mechanism 82 transfers the wet substrate W. Therefore, during the transfer of the substrate W by the substrate transfer mechanism 82, it is difficult for the substrate W to dry. As a result, for example, even when a fine pattern is formed on the substrate W, the pattern is unlikely to collapse during the transfer of the substrate W by the substrate transfer mechanism 82.

[0163] The second posture changing mechanism corresponds to the case where the topmost substrate W has been transferred by the substrate transfer mechanism 82, and adjusts the vertical position of each substrate W after posture change held by the second posture changing mechanism so that the next topmost substrate W is located above the liquid surface of the dipping tank.

[0164] The substrate transfer mechanism 82 takes out the substrate W processed by the batch processing apparatus 20 from the first opening 31a of the first housing 31, transfers it inside the first connection housing 81, and takes it into the second housing 61 from the second opening 61a of the second housing 61. Specifically, the substrate transfer mechanism 82 takes the substrate W into the chamber 63a through the second opening 61a. Then, the substrate transfer mechanism 82 hands over the substrate W to the transfer section 62. The transfer section 62 holds the substrate W handed over from the substrate transfer mechanism 82.

[0165] When the control section 13 of the integrated control apparatus 10 causes the transfer section 62 to hold the substrate W, it notifies the single wafer processing apparatus 50 that the transfer section 62 has held the substrate W. When the single wafer processing apparatus 50 receives this notification, the central robot CR accesses the chamber 63a, takes out the substrate W from the chamber 63a, and takes it into one of the single wafer processing units 63.

[0166] As described above, according to the first embodiment, the first connection section 80 is provided in the substrate processing system 1000. As a result, a dedicated transfer path for transferring the substrate W is formed between the first processing apparatus 20 and the second processing apparatus 50. Therefore, for example, it is not necessary to perform the following processes: returning the wet substrate W to the substrate storage container CA, and transferring the substrate storage container CA containing the wet substrate W from the first container mounting section CP1 of the first processing apparatus 20 to the second container mounting section CP2 of the second processing apparatus 50.

[0167] Next, with reference to Figure 3 the substrate processing system 1000 of the present embodiment will be further described. As Figure 3 shown, the substrate processing system 1000 further includes a second connection part 90. The second connection part 90 connects the batch processing device 20 and the single wafer processing device 50. The second connection part 90 has a second connection housing 91 and a second container transfer mechanism 92.

[0168] The second connection housing 91 is cylindrical. The second connection housing 91 extends in the Y direction. The second connection housing 91 covers the first container placement part CP1 of the first processing device 20 and the second container placement part CP2 of the second processing device 50. The second container transfer mechanism 92 is configured to transfer the substrate storage container CA. For example, the second container transfer mechanism 92 transfers the substrate storage container CA placed on the first container placement part CP1 of the first processing device 20 to the second container placement part CP2 of the second processing device 50. Specifically, the second container transfer mechanism 92 transfers the substrate storage container CA inside the second connection housing 91. The operation of the second container transfer mechanism 92 is controlled by the control part 13 of the integrated control device 10 (refer to Figure 1 ).

[0169] In the present embodiment, the second connection housing 91 covers the second load port LP2 of the first processing device 20 and the plurality of third load ports LP3 of the second processing device 50. Therefore, the second load port LP2 and the plurality of third load ports LP3 are located inside the second connection housing 91, and the first load port LP1 of the first processing device 20 is located outside the second connection housing 91. The substrate storage container CA is placed on the first load port LP1 by an OHT (Overhead Hoist Transport). A factory internal transfer system such as an OHT transfers the substrate storage container CA in the clean room where the first processing device 20 and the second processing device 50 are provided.

[0170] The end on the +Y side (the first load port LP1 side) of the second connection housing 91 is located between the first load port LP1 and the second load port LP2. The end on the +Y side of the second connection housing 91 is open. Hereinafter, the end on the +Y side of the second connection housing 91 may be referred to as "one end of the second connection housing 91". In addition, the end on the opposite side (-Y side) of one end of the second connection housing 91 may be referred to as "the other end of the second connection housing 91".

[0171] The second container transport mechanism 92 transports the substrate storage container CA placed on the first load port LP1 from the outside to the inside of the second connection housing 91 via one end (the end on the +Y side) of the second connection housing 91, and places the substrate storage container CA on the second load port LP2. In addition, the second container transport mechanism 92 transports the empty substrate storage container CA placed on the second load port LP2 by the first container transport mechanism 32 to any one of the four third load ports LP3, and places the substrate storage container CA on the third load port LP3.

[0172] The top wall of the second connection case 91 has an opening (not shown). For example, the opening formed in the top wall of the second connection case 91 may be located near the other end (the end on the -Y side) of the second connection case 91. In addition, the other end (the end on the -Y side) of the second connection case 91 is located closer to the -Y side than the third load port LP3 located closest to the -Y side among the four third load ports LP3.

[0173] The second container transport mechanism 92 is configured to be movable upward and downward. The second container transport mechanism 92 moves the substrate storage container CA storing the substrates W dried by the single-wafer processing apparatus 50 upward toward the opening formed in the ceiling wall of the second connection housing 91 .

[0174] The opening formed in the top wall of the second connection housing 91 may be formed so as to be accessible to the OHT, for example. In this case, the OHT receives the substrate storage container CA from the second container conveying mechanism 92 through the opening formed in the top wall of the second connection housing 91, and conveys the substrate storage container CA to the outside of the second connection housing 91. Alternatively, the second container conveying mechanism 92 may also raise the substrate storage container CA to the top of the top wall of the second connection housing 91 through the opening formed in the top wall of the second connection housing 91.

[0175] As described above, according to Embodiment 1, the second connection portion 90 is provided in the substrate processing system 1000. As a result, a dedicated transport path for transporting the substrate storage container CA is formed between the first processing apparatus 20 and the second processing apparatus 50. Therefore, it is not necessary to transport the substrate storage container CA between the first processing apparatus 20 and the second processing apparatus 50 using an in-factory transport system such as OHT.

[0176] Next, refer to Figure 4 The one-chip processing unit 63 is described. Figure 4 2 is a side cross-sectional view schematically showing the interior of the single-chip processing unit 63. Figure 4 As shown, the wafer processing unit 63 includes a chamber 63b, a spin chuck 64, a nozzle 65, a nozzle moving unit 66, and a cup 67. In addition, the wafer processing device 50 further includes a liquid supply pipe 71 and an opening and closing valve 72.

[0177] The substrate W is carried into the chamber 63b, and processing is performed within the chamber 63b. The chamber 63b has a substantially box shape. The chamber 63b houses the rotary chuck 64, the nozzle 65, the nozzle moving unit 66, the cup 67, and a part of the liquid supply pipe 71.

[0178] The rotary chuck 64 holds the substrate W horizontally. The rotary chuck 64 rotates the substrate W about a first rotation axis AX1 extending in the vertical direction. Specifically, the rotary chuck 64 includes a rotary base 641, a plurality of chuck members 642, a motor body 643, and a shaft 644.

[0179] The rotary base 641 is disk-shaped and supports the plurality of chuck members 642 in a horizontal posture. The plurality of chuck members 642 are arranged at the peripheral portion of the rotary base 641. The plurality of chuck members 642 grip the peripheral portion of the substrate W. The substrate W is held in a horizontal posture by the plurality of chuck members 642. The operation of the plurality of chuck members 642 is controlled by the second control device 51. The plurality of chuck members 642 are arranged such that the center of the substrate W is opposed to the center of the rotary base 641.

[0180] The shaft 644 is coupled to the center of the rotary base 641. The shaft 644 extends vertically downward from the center of the rotary base 641 along the first rotation axis AX1. The motor body 643 rotates the shaft 644 about the first rotation axis AX1. As a result, the rotary base 641 rotates, and the substrate W held by the plurality of chuck members 642 rotates about the first rotation axis AX1. The operation of the motor body 643 is controlled by the second control device 51. The motor body 643 is, for example, an electric motor.

[0181] The nozzle moving unit 66 moves the nozzle 65 in the vertical direction and the horizontal direction. Specifically, the nozzle moving unit 66 includes an arm 661, a base 662, and a nozzle moving mechanism 663.

[0182] The base 662 extends in the vertical direction. The arm 661 is coupled to the base 662. The arm 661 extends horizontally from the base 662. The arm 661 supports the nozzle 65. For example, the nozzle 65 is fixed to the front end portion of the arm 661.

[0183] The nozzle moving mechanism 663 moves the arm 661 in the vertical direction and the horizontal direction. As a result, the nozzle 65 moves in the vertical direction and the horizontal direction. The nozzle moving mechanism 663 is controlled by the second control device 51.

[0184] Specifically, the nozzle moving mechanism 663 has a rotating mechanism and a lifting mechanism. The rotating mechanism rotates the base 662 in both forward and reverse directions about a second rotation axis AX2 extending in the vertical direction. As a result, the nozzle 65 moves along a horizontal plane. The lifting mechanism raises and lowers the base 662 in the vertical direction. As a result, the nozzle 65 moves in the vertical direction. The actuator of the rotating mechanism may have, for example, a servo motor such as a stepping motor and a speed reducer. The actuator of the lifting mechanism may also have, for example, a ball screw and an electric motor capable of rotating in both forward and reverse directions.

[0185] The nozzle moving unit 66 moves the nozzle 65 between a processing position and a retracted position. The processing position is a position opposed to the center of the substrate W. The retracted position is a position outside the cup 67 in a top view.

[0186] The nozzle 65 ejects a processing liquid onto the upper surface of the substrate W held by the rotary chuck 64 from the processing position. More specifically, the nozzle 65 ejects the processing liquid toward the center of the rotating substrate W. As a result, a liquid film of the processing liquid is formed on the upper surface of the substrate W. In the present embodiment, the nozzle 65 ejects IPA. IPA is an example of an organic solvent.

[0187] Here, the drying process performed by the single wafer processing unit 63 will be described. As described with reference to Figure 3 After the substrate W has been subjected to a chemical liquid treatment and a rinsing treatment by the batch processing apparatus 20, it is sometimes transferred to the single wafer processing apparatus 50. In this case, the central robot CR transfers the substrate W from the transfer section 62 to one of the plurality of single wafer processing units 63. The rotary chuck 64 holds the substrate W carried into the chamber 63b and rotates it. Then, IPA is supplied from the nozzle 65 to the rotating substrate W. As a result, the rinsing liquid attached to the substrate W is rinsed off, and a liquid film of IPA is formed on the upper surface of the substrate W. When a predetermined time has elapsed since the start of the ejection of IPA, the rotary chuck 64 increases the rotation speed of the substrate W. As a result, IPA scatters from the upper surface of the substrate W, and the substrate W is dried.

[0188] Next, the liquid supply pipe 71, the on-off valve 72, and the cup 67 will be described. The liquid supply pipe 71 supplies the processing liquid to the nozzle 65. The liquid supply pipe 71 is a tubular member through which the processing liquid flows. By supplying the processing liquid to the nozzle 65 via the liquid supply pipe 71, the processing liquid is ejected from the nozzle 65. In the present embodiment, the liquid supply pipe 71 supplies IPA to the nozzle 65.

[0189] The on-off valve 72 is provided in the liquid supply pipe 71. The on-off valve 72 can be switched between an open state and a closed state. The second control device 51 controls the opening and closing operation of the on-off valve 72. Specifically, when supplying the processing liquid (IPA) from the nozzle 65 to the substrate W, the second control device 51 makes the on-off valve 72 in the open state. As a result, the processing liquid (IPA) flows in the liquid supply pipe 71 toward the nozzle 65 and is ejected from the nozzle 65 to the substrate W. When the second control device 51 stops the nozzle 65 from ejecting the processing liquid (IPA), the second control device 51 makes the on-off valve 72 in the closed state. As a result, the flow of the processing liquid (IPA) through the liquid supply pipe 71 stops, and the nozzle 65 stops ejecting the processing liquid (IPA).

[0190] The cup 67 is disposed outside the rotary chuck 64. The cup 67 has a substantially cylindrical shape. In other words, the cup 67 surrounds the rotary chuck 64. The cup 67 catches the processing liquid discharged from the substrate W and prevents the processing liquid from scattering inside the chamber 63b.

[0191] In addition, the single wafer processing unit 63 may have at least one nozzle in addition to the nozzle 65. For example, the single wafer processing unit 63 may further have a chemical liquid nozzle and a rinse liquid nozzle in addition to the nozzle 65. The chemical liquid nozzle ejects a chemical liquid onto the upper surface of the substrate W when performing a chemical liquid process in the single wafer processing unit 63. The rinse liquid nozzle ejects a rinse liquid onto the upper surface of the substrate W when performing a rinse process in the single wafer processing unit 63.

[0192] Next, with reference to Figure 1 and Figure 5 the first process editing screen G1 will be described. Figure 5 FIG. is an example showing the first process editing screen G1. The first process editing screen G1 is a screen for editing (producing) an integrated process. The integrated process represents a process obtained by integrating the first process RP1 and the second process RP2. Before using the substrate processing system 1000 to process the substrate W, the user of the substrate processing system 1000 edits (produces) the integrated process via the first process editing screen G1.

[0193] The integrated control device 10 causes the display unit HC2 of the host computer HC to display the first process editing screen G1. As Figure 5 shown, the first process editing screen G1 displays a process name column 101, a first process list column 102, and a second process list column 103.

[0194] The process name column 101 is an input column for setting the name of the integrated process. The operator of the host computer HC can operate the input unit HC1 to input any characters, symbols, or numbers in the process name column 101 to set the name of the integrated process.

[0195] The first process list column 102 displays a list of the names of the first processes RP1 stored in the first storage unit 23 of the first processing device 20. For example, when multiple first processes RP1 are stored in the first storage unit 23, the first process list column 102 displays the names of the multiple first processes RP1 in a list form. An operator of the host computer HC can operate the input unit HC1 to specify (select) from the first processes RP1 displayed in the first process list column 102 the first process RP1 to be integrated into the integrated process.

[0196] In addition, when an operator of the host computer HC operates the input unit HC1 to specify (select) one of the names of the first processes RP1 displayed in the first process list column 102, a first single process editing screen (not shown) is displayed on the display unit HC2.

[0197] The first single process editing screen is a screen for editing the first process RP1 specified (selected) by the operator. In the case where the batch processing device 20 is an existing device, the existing first process RP1 stored in the first storage unit 23 specifies the order of the chemical liquid treatment, the rinsing treatment, and the drying treatment, as well as the set values of various parameters related to these treatments. For example, when an operator creates an integrated process, the operator edits the first process RP1 via the first single process editing screen so that the chemical liquid treatment and the rinsing treatment among the chemical liquid treatment, the rinsing treatment, and the drying treatment are performed by the batch processing device 20.

[0198] The second process list column 103 similarly displays a list of the names of the second processes RP2 stored in the second storage unit 53 of the second processing device 50. An operator of the host computer HC can operate the input unit HC1 to specify (select) from the second processes RP2 displayed in the second process list column 103 the second process RP2 to be integrated into the integrated process.

[0199] In addition, when an operator of the host computer HC operates the input unit HC1 to specify (select) one of the names of the second processes RP2 displayed in the second process list column 103, similarly to the case where the first process RP1 is specified (selected), a second single process editing screen (not shown) is displayed on the display unit HC2.

[0200] The second single process editing screen, similarly to the first single process editing screen, is a screen for editing the second process RP2 specified (selected) by the operator. For example, when an operator creates an integrated process, the operator edits the second process RP2 via the second single process editing screen so that only the drying treatment among the chemical liquid treatment, the rinsing treatment, and the drying treatment is performed by the single wafer processing device 50.

[0201] Next, refer to Figure 1 、 Figure 5and Figure 6 to illustrate the comprehensive process editing process executed by the control unit 13 of the comprehensive control device 10. Figure 6 It is a flowchart showing the process of the comprehensive process editing process executed by the control unit 13 of the comprehensive control device 10 included in the substrate processing system 1000 of the present embodiment. As Figure 6 shown, the comprehensive process editing process includes steps S11 to S19. For example, corresponding to the operator operating the input unit HC1 of the host computer HC to instruct the editing of the comprehensive process, the comprehensive process editing process is started.

[0202] When the comprehensive process editing process is started, the control unit 13 acquires the first process RP1 (step S11) from the first processing device 20 via the communication unit 11. Specifically, the control unit 13 commands the first control unit 24 of the first processing device 20 to send the first process RP1. The first control unit 24 reads the first process RP1 (process file) from the first storage unit 23 according to the command from the comprehensive control device 10. The first control unit 24 sends the first process RP1 (process file) read from the first storage unit 23 to the comprehensive control device 10 via the first communication unit 22. As a result, the communication unit 11 of the comprehensive control device 10 receives the first process RP1 (process file) from the first processing device 20, and the control unit 13 acquires the first process RP1 (process file) via the communication unit 11. The control unit 13 causes the storage unit 12 to store the first process RP1 (process file) sent from the first processing device 20.

[0203] When the control unit 13 acquires the first process RP1, it generates (creates) a list of the first process RP1 and causes the storage unit 12 to store the list data of the first process RP1 (step S12).

[0204] Similarly to step S11, the control unit 13 acquires the second process RP2 (step S13) from the second processing device 50 via the communication unit 11. The control unit 13 causes the storage unit 12 to store the second process RP2 sent from the second processing device 50.

[0205] When the control unit 13 acquires the second process RP2, it generates (creates) a list of the second process RP2 and causes the storage unit 12 to store the list data of the second process RP2 (step S14).

[0206] When the control unit 13 generates (creates) the list of the first process RP1 and the list of the second process RP2, it causes the first process editing screen G1 (refer to Figure 5)It is displayed on the display unit HC2 of the host computer HC (process S15). When the control unit 13 displays the first process editing screen G1, it refers to the list data of the first process RP1 and displays an overview of the first process RP1 in the first process list column 102. Similarly, the control unit 13 refers to the list data of the second process RP2 and displays an overview of the second process RP2 in the second process list column 103.

[0207] After the control unit 13 displays the first process editing screen G1, as described with reference to Figure 5 as described above, it accepts the editing operation of the integrated process performed by the operator via the first process editing screen G1 (process S16). As a result, the control unit 13 edits the integrated process obtained by integrating the first process RP1 and the second process RP2 specified (selected) by the operator and causes the storage unit 12 to store the integrated process information HR (refer to Figure 1 )(process S17).

[0208] Specifically, as described with reference to Figure 5 as described above, when causing the first processing device 20 to execute a part of the first process, when editing the integrated process, the control unit 13 edits the first process RP1 based on an instruction from the host computer HC so as to execute a part of the first process. Therefore, the edited first process RP1 is integrated into the integrated process. In the present embodiment, the first process performed by the first processing device 20 includes a chemical solution process, a rinsing process, and a drying process. When editing the integrated process, the control unit 13 edits the first process RP1 according to the operation of the operator on the input unit HC1 so as to execute the chemical solution process and the rinsing process among the chemical solution process, the rinsing process, and the drying process.

[0209] Similarly, when causing the second processing device 50 to execute a part of the second process, when editing the integrated process, the control unit 13 edits the second process RP2 based on an instruction from the host computer HC so as to execute a part of the second process. Therefore, the edited second process RP2 is integrated into the integrated process. In the present embodiment, the second process performed by the second processing device 50 includes a chemical solution process, a rinsing process, and a drying process. When editing the integrated process, the control unit 13 edits the second process RP2 according to the operation of the operator on the input unit HC1 so as to execute only the drying process among the chemical solution process, the rinsing process, and the drying process.

[0210] The integrated process information HR includes identification information of the integrated process and identification information of the first process RP1 and the second process RP2 integrated into the integrated process. For example, the integrated process information HR includes information indicating the name set for the integrated process and information indicating the names set for the first process RP1 and the second process RP2 integrated into the integrated process, respectively.

[0211] When the integrated process information HR is stored in the storage unit 12, the control unit 13 sends the first process RP1 that is integrated into the integrated process to the first processing device 20 (step S18). When the first communication unit 22 receives the first process RP1 from the integrated control device 10, the first control unit 24 of the first processing device 20 changes (overwrites) the first process RP1 stored in the first storage unit 23 to the first process RP1 sent from the integrated control device 10. Therefore, the first process RP1 stored in the first storage unit 23 is changed to the edited first process RP1.

[0212] Similarly, the control unit 13 sends the second process RP2 that is integrated into the integrated process to the second processing device 50 (step S19). As a result, the second process RP2 stored in the second storage unit 53 of the second processing device 50 is changed (overwritten) to the second process RP2 sent from the integrated control device 10.

[0213] After sending the first process RP1 and the second process RP2, the control unit 13 ends Figure 6 the integrated process editing process shown.

[0214] Next, with reference to Figure 1 、 Figure 3 、 Figure 7 and Figure 8 the processing executed when the control unit 13 of the integrated control device 10 controls the second container transfer mechanism 92 and the processing executed when the first control unit 24 of the batch processing device 20 controls the first container transfer mechanism 32 will be described.

[0215] Figure 7 is a flowchart showing the flow of the processing executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. For example, corresponding to the integrated control device 10 (communication unit 11) receiving a production command for an integrated job from the host computer HC, the Figure 7 processing shown starts. Figure 8 is a flowchart showing the flow of the processing executed by the first control unit 24 of the batch processing device 20 included in the substrate processing system 1000 of the present embodiment. Corresponding to the batch processing device 20 receiving a first virtual job, the Figure 8 processing shown starts.

[0216] As Figure 7As shown, when the control unit 13 of the integrated control device 10 receives a production command for an integrated operation via the communication unit 11 from the host computer HC, it controls the second container transfer mechanism 92 to transfer the first substrate storage container CA1 placed on the first loading port LP1 to the second loading port LP2, so that the first substrate storage container CA1 is placed on the second loading port LP2 (process S21). In addition, the first substrate storage container CA1 is placed on the first loading port LP1 by the OHT. Further, when the first substrate storage container CA1 is transferred from the first loading port LP1 to the second loading port LP2, the second substrate storage container CA2 is placed on the first loading port LP1 by the OHT.

[0217] When the control unit 13 receives a production command for an integrated operation via the communication unit 11 from the host computer HC, it generates a first virtual operation with reference to the integrated process information HR (process S22). Then, the control unit 13 sends the first virtual operation to the batch processing device 20. The first virtual operation includes the identification information of the first process RP1 that is integrated into the integrated process. The first control unit 24 of the batch processing device 20 controls the operations of the respective parts of the batch processing device 20 with reference to the first process RP1 specified by the first virtual operation.

[0218] Specifically, the production command for the integrated operation includes the identification information of the integrated process. The identification information of the integrated process represents, for example, the name set for the integrated process. The control unit 13 generates a first virtual operation with reference to the identification information of the integrated process included in the integrated process information HR and the identification information of the first process RP1. The identification information of the first process RP1 represents, for example, the name set for the first process RP1.

[0219] As Figure 8 shown, when the first control unit 24 of the batch processing device 20 receives the first virtual operation via the first communication unit 22, it controls the first container transfer mechanism 32 to transfer the first substrate storage container CA1 placed on the second loading port LP2 to the first container rack 33a, so that the first container rack 33a is loaded with the first substrate storage container CA1 (process S31). Then, the first control unit 24 controls the first batch transfer mechanism HTR to transfer the first batch stored in the first substrate storage container CA1 placed on the first container rack 33a to the first posture transformation mechanism CTC.

[0220] When the first batch is taken out from the first substrate storage container CA1, the first control unit 24 controls the first container transfer mechanism 32 to transfer the empty first substrate storage container CA1 placed on the first container rack 33a to one of the plurality of second container racks 33b, so that the empty first substrate storage container CA1 is placed on one of the second container racks 33b (process S32).

[0221] AsFigure 7 As shown, when the control unit 13 of the integrated control device 10 transports the first substrate storage container CA1 from the second loading port LP2 to the first container rack 33a, it controls the second container transport mechanism 92 to transport the second substrate storage container CA2 placed on the first loading port LP1 to the second loading port LP2, so that the second substrate storage container CA2 is placed on the second loading port LP2 (process S23).

[0222] As Figure 8 shown, when the second substrate storage container CA2 is placed on the second loading port LP2, the first control unit 24 of the batch processing device 20 controls the first container transport mechanism 32 to transport the second substrate storage container CA2 placed on the second loading port LP2 to the first container rack 33a, so that the second substrate storage container CA2 is placed on the first container rack 33a (process S33). Then, the first control unit 24 controls the first batch transport mechanism HTR to transport the second batch stored in the second substrate storage container CA2 placed on the first container rack 33a to the first posture conversion mechanism CTC.

[0223] When the second batch is removed from the second substrate storage container CA2, the first control unit 24 controls the first container transport mechanism 32 to transport the empty second substrate storage container CA2 placed on the first container rack 33a to another one of the plurality of second container racks 33b, so that the empty second substrate storage container CA2 is placed on another one of the second container racks 33b (process S34).

[0224] After the first control unit 24 places the empty second substrate storage container CA2 on another one of the second container racks 33b, it controls the first container transport mechanism 32 to transport the empty first substrate storage container CA1 from the second container rack 33b to the second loading port LP2, so that the empty first substrate storage container CA1 is placed on the second loading port LP2 (process S35).

[0225] As Figure 7 shown, when the control unit 13 of the integrated control device 10 places the empty first substrate storage container CA1 on the second loading port LP2, it controls the second container transport mechanism 92 to transport the empty first substrate storage container CA1 from the second loading port LP2 to one of the plurality of third loading ports LP3, so that the empty first substrate storage container CA1 is placed on one of the third loading ports LP3 (process S24).

[0226] As Figure 8As shown, when transporting the empty first substrate storage container CA1 from the second loading port LP2, the first control unit 24 of the batch processing apparatus 20 controls the first container transport mechanism 32 to transport the empty second substrate storage container CA2 from the second container rack 33b to the second loading port LP2, and places the empty second substrate storage container CA2 on the second loading port LP2 (step S36). As a result, Figure 8 The processing shown ends.

[0227] As Figure 7 shown, when placing the empty second substrate storage container CA2 on the second loading port LP2, the control unit 13 of the integrated control apparatus 10 controls the second container transport mechanism 92 to transport the empty second substrate storage container CA2 from the second loading port LP2 to another third loading port LP3 among the plurality of third loading ports LP3, and places the empty second substrate storage container CA2 on another one of the third loading ports LP3 (step S25).

[0228] Return the first batch after the drying process performed by the second processing apparatus 50 to the first substrate storage container CA1 placed on the third loading port LP3. As Figure 7 shown, when the first batch is returned to the first substrate storage container CA1 placed on the third loading port LP3, the control unit 13 of the integrated control apparatus 10 controls the second container transport mechanism 92 to transport the first substrate storage container CA1 to the transfer position where the substrate storage container CA is transferred between the second container transport mechanism 92 and the OHT. As a result, the first substrate storage container CA1 is transferred from the second container transport mechanism 92 to the OHT (step S26).

[0229] Similarly, return the second batch after the drying process performed by the second processing apparatus 50 to the second substrate storage container CA2 placed on the third loading port LP3. When the second batch is returned to the second substrate storage container CA2 placed on the third loading port LP3, the control unit 13 controls the second container transport mechanism 92 to transport the second substrate storage container CA2 to the transfer position where the substrate storage container CA is transferred between the second container transport mechanism 92 and the OHT. As a result, the second substrate storage container CA2 is transferred from the second container transport mechanism 92 to the OHT (step S27). By transferring the second substrate storage container CA2 from the second container transport mechanism 92 to the OHT, Figure 7 The processing shown ends.

[0230] In addition, Figure 7 the steps S24 and S25 shown and Figure 8Each of the processes of process S35 and process S36 shown above only needs to be executed before the transfer robot IR of the single-chip processing device 50 transfers the substrate W into the substrate storage container CA. For example, the first substrate storage container CA1 can be transferred to the third load port LP3 in synchronization with the timing of transferring the first substrate W in the first batch from the batch processing device 20 to the single-chip processing device 50. Similarly, the second substrate storage container CA2 can be transferred to the third load port LP3 in synchronization with the timing of transferring the first substrate W in the second batch from the batch processing device 20 to the single-chip processing device 50.

[0231] Next, with reference to Figure 1 , Figure 3 and Figure 9 , the processing performed by the first control unit 24 of the batch processing device 20 based on the first virtual job will be described. Figure 9 is a flowchart showing the process flow of the processing performed by the first control unit 24 of the batch processing device 20 based on the first virtual job. Specifically, Figure 9 shows the process flow of the first control unit 24 of the batch processing device 20 controlling the first batch transfer mechanism HTR, the first posture transformation mechanism CTC, the second batch transfer mechanism WTR, and the first batch processing units BPU1 to the sixth batch processing units BPU6 based on the first virtual job. Corresponding to the first container transfer mechanism 32 placing the first substrate storage container CA1 on the first container rack 33a, the process shown in Figure 9 starts.

[0232] As Figure 9 shown, when the first substrate storage container CA1 is placed on the first container rack 33a ( Figure 8 process S31), the first control unit 24 controls the first batch transfer mechanism HTR to transfer the first batch stored in the first substrate storage container CA1 placed on the first container rack 33a to the first posture transformation mechanism CTC (process S41).

[0233] After the first control unit 24 transfers the first batch to the first posture transformation mechanism CTC, when the second substrate storage container CA2 is placed on the first container rack 33a ( Figure 8 process S33), it controls the first batch transfer mechanism HTR to transfer the second batch stored in the second substrate storage container CA2 placed on the first container rack 33a to the first posture transformation mechanism CTC (process S42).

[0234] The first control unit 24 controls the first posture transformation mechanism CTC to produce a set of batches (process S43).

[0235] When a set of batches is produced, the first control unit 24 controls the first posture transformation mechanism CTC to transform the posture of each substrate W constituting a set of batches from a horizontal posture to a vertical posture (process S44). As a result, the posture of a set of batches is transformed from a horizontal posture to a vertical posture.

[0236] After transforming the posture of a set of batches, the first control unit 24 controls the second batch transfer mechanism WTR to transfer a set of batches to one of the first batch processing unit BPU1 to the fourth batch processing unit BPU4. As a result, a set of batches is subjected to a chemical solution treatment in one of the first batch processing unit BPU1 to the fourth batch processing unit BPU4 (process S45).

[0237] Specifically, the first control unit 24 controls the second batch transfer mechanism WTR to place a set of batches on the support member 35 of one of the first elevator LF1 to the fourth elevator LF4. Then, it controls the elevator supporting a set of batches to lower from the upper position to the lower position. As a result, a set of batches is immersed in the chemical solution in the corresponding chemical solution tank, and a set of batches is subjected to a chemical solution treatment.

[0238] When a predetermined time has elapsed since the start of the chemical solution treatment, the first control unit 24 controls the second batch transfer mechanism WTR to transfer a set of batches from one of the first batch processing unit BPU1 to the fourth batch processing unit BPU4 to one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6. As a result, a set of batches is subjected to a rinsing treatment in one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 (process S46).

[0239] Specifically, when a predetermined time has elapsed since the start of the chemical solution treatment, the first control unit 24 controls the elevator supporting a set of batches to rise from the lower position to the upper position. Then, it controls the second batch transfer mechanism WTR to grasp a set of batches supported by the elevator.

[0240] After the second batch transfer mechanism WTR grasps a set of batches, the first control unit 24 controls the second batch transfer mechanism WTR to transfer a set of batches. Then, the first control unit 24 controls the second batch transfer mechanism WTR to place a set of batches on the support member 35 of one of the fifth elevator LF5 and the sixth elevator LF6. Then, it controls the elevator supporting a set of batches to lower from the upper position to the lower position. As a result, a set of batches is immersed in the rinsing liquid in the corresponding rinsing tank, and a set of batches is subjected to a rinsing treatment.

[0241] When a predetermined time has elapsed since the start of the rinsing process, the first control unit 24 controls the second batch transfer mechanism WTR to transfer a set of batches from one of the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 to the substrate standby unit 40 (step S47). As a result, Figure 9 the processing shown ends.

[0242] Specifically, when a predetermined time has elapsed since the start of the rinsing process, the first control unit 24 controls the elevator that supports a set of batches to rise from the lower position to the upper position. Then, it controls the second batch transfer mechanism WTR to grasp the set of batches supported by the elevator.

[0243] After the first control unit 24 causes the second batch transfer mechanism WTR to grasp a set of batches, it controls the second batch transfer mechanism WTR to transfer the set of batches. Then, the first control unit 24 controls the second batch transfer mechanism WTR to place the set of batches on the support member 35 of the seventh elevator LF7.

[0244] When a set of batches is supported by the seventh elevator LF7, as described with reference to Figure 3 the first control unit 24 notifies the integrated control device 10 via the first communication unit 22 of the completion event of the first virtual operation.

[0245] Next, with reference to Figure 1 , Figure 3 , Figure 10 and Figure 11 , the processing executed by the control unit 13 of the integrated control device 10 is described. Figure 10 and Figure 11 are flowcharts showing the flow of the processing executed by the control unit 13 of the integrated control device 10 included in the substrate processing system 1000 of the present embodiment. Specifically, Figure 10 and Figure 11 show the flow of the processing in which the control unit 13 of the integrated control device 10 controls the chuck mechanism TFC and the posture changing unit 43. It starts in response to the integrated control device 10 being notified of the completion event of the first virtual operation from the batch processing device 20 Figure 10 and Figure 11 shown. That is, it starts in response to a set of batches being supported by the seventh elevator LF7 Figure 10 and Figure 11 shown.

[0246] When the processing of Figure 10 and Figure 11When performing the processing shown, the control unit 13 controls the chuck mechanism TFC to convey the first lot in a set of lots to the posture conversion unit 43 (step S51). Specifically, the control unit 13 first controls the seventh lifter LF7 to descend from the upper position to the lower position. As a result, a set of lots is immersed in the liquid in the standby tank 42. After that, the control unit 13 controls the chuck mechanism TFC to cause the pair of chucks 41 to grip the first lot. Then, the first control unit 24 controls the chuck mechanism TFC to move the first lot above the liquid level of the standby tank 42 and then convey it to the posture conversion unit 43.

[0247] When the control unit 13 conveys the first lot to the posture conversion unit 43, it controls the second posture conversion mechanism of the posture conversion unit 43 to change the posture of each substrate W constituting the first lot from the vertical posture to the horizontal posture (step S52). That is, the control unit 13 controls the second posture conversion mechanism to change the posture of the first lot from the vertical posture to the horizontal posture.

[0248] Furthermore, after the control unit 13 changes the posture of the first lot from the vertical posture to the horizontal posture, it controls the second posture conversion mechanism to adjust the vertical position of each substrate W of the first lot so that the uppermost substrate W in the substrates W of the first lot is located above the liquid level of the immersion tank. As a result, the first lot is in a standby state in the substrate standby unit 40. The control unit 13 of the integrated control device 10 generates a second virtual job corresponding to the situation where the first lot is on standby in the substrate standby unit 40. Thus, according to Embodiment 1, when generating the second virtual job (control job), each substrate W of the first lot is in a standby state in the substrate standby unit 40. Thereby, the single wafer processing device 50 can execute the second virtual job (control job) to process each substrate W of the first lot one by one.

[0249] Specifically, the control unit 13 generates information indicating that a virtual substrate storage container is placed on the virtual load port corresponding to the situation where the first lot is on standby in the substrate standby unit 40 (step S53). Hereinafter, the information indicating that a virtual substrate storage container is placed on the virtual load port may sometimes be referred to as "virtual placement information". After the control unit 13 generates the virtual placement information, it sends the virtual placement information and the identification information of the virtual load port to the single wafer processing device 50 via the communication unit 11. The virtual load port is an example of a "virtual container placement unit".

[0250] When the virtual placement information is sent to the second processing device 50, the control unit 13 generates a second virtual operation (process S54) with reference to the integrated process information HR. Then, the control unit 13 sends the second virtual operation to the single-chip processing device 50. The second virtual operation includes the identification information of the second process RP2 integrated into the integrated process. Specifically, the control unit 13 generates the second virtual operation with reference to the identification information of the second process RP2 included in the integrated process information HR. The identification information of the second process RP2 represents, for example, the name set for the second process RP2.

[0251] The second control unit 54 of the single-chip processing device 50 controls the operations of the respective parts of the single-chip processing device 50 with reference to the second process RP2 specified by the second virtual operation. Specifically, the second storage unit 53 of the single-chip processing device 50 stores the identification information of the virtual loading port together with the identification information of the third loading port LP3. When the second control unit 54 receives the virtual placement information and the identification information of the virtual loading port sent from the integrated control device 10 via the second communication unit 52, it becomes a state capable of executing the second virtual operation in the same manner as when a substrate storage container CA is placed on one of the third loading ports LP3. Therefore, even if the substrate W is directly transferred from the batch processing device 20 to the single-chip processing device 50, the single-chip processing device 50 can process the substrate W transferred from the batch processing device 20 based on the second process RP2.

[0252] When the second virtual operation is sent to the single-chip processing device 50, the control unit 13 controls the substrate transfer mechanism 82 to transfer the substrates W of the first batch one by one from the substrate standby unit 40 to the transfer unit 62 (process S55). Specifically, the substrate transfer mechanism 82 grips the uppermost substrate W of the first batch located above the liquid level of the dipping tank and transfers it to the transfer unit 62. When the substrate W is transferred to the transfer unit 62 by the substrate transfer mechanism 82, the control unit 13 controls the transfer unit 62 to hold the substrate W. Whenever the substrate transfer mechanism 82 transfers the substrate W, the control unit 13 controls the second posture conversion mechanism to adjust the vertical position of each substrate W in the first batch so that the uppermost substrate W in the first batch of substrates W is located above the liquid level of the dipping tank.

[0253] Whenever the substrate transfer mechanism 82 transfers the substrate W, the control unit 13 determines whether the transfer of the substrates W of the first batch is completed (process S56). The control unit 13 causes the substrate transfer mechanism 82 to transfer the substrate W until the transfer of the substrates W of the first batch is completed (the "No" in process S56).

[0254] When the control unit 13 determines that the transfer of the substrates W of the first batch is completed (the "Yes" in process S56), as Figure 11As shown, the control chuck mechanism TFC conveys the second lot in a group of lots to the posture changing unit 43 (process S57). The processes of processes S57 to S62 are substantially the same as the processes of processes S51 to S56, and thus their descriptions are omitted. Figure 10 and Figure 11 The process shown ends when the control unit 13 determines that the conveyance of the substrate W of the second lot is completed (Yes in process S62).

[0255] Next, with reference to Figure 1 、 Figure 3 、 Figure 4 and Figure 12 ,the processing performed by the second control unit 54 of the single wafer processing apparatus 50 based on the second virtual operation will be described. Figure 12 is a flowchart showing the flow of the processing performed by the second control unit 54 of the single wafer processing apparatus 50 based on the second virtual operation. Specifically, Figure 12 shows the processing flow when the single wafer processing apparatus 50 performs a drying process on one substrate W included in the first lot.

[0256] Corresponds to the start of the process shown when the transfer unit 62 holds the substrate W. Specifically, when the control unit 13 of the integrated control apparatus 10 corresponds to the case where the transfer unit 62 holds the substrate W, it notifies the single wafer processing apparatus 50 that the processing in the chamber 63a has been completed. When the second control unit 54 of the single wafer processing apparatus 50 receives a notification indicating that the processing in the chamber 63a has been completed via the second communication unit 52, it starts Figure 12 the process shown. Figure 12

[0257] When the process shown starts, the second control unit 54 controls the central robot CR to convey the substrate W (the substrate W after the rinse process) from the transfer unit 62 to one of the plurality of single wafer processing units 63 (process S71). Then, the second control unit 54 causes the single wafer processing unit 63 to perform a drying process (process S72). Figure 12 Specifically, the second control unit 54 controls the rotary chuck 64 to hold the substrate W carried into the chamber 63b by the central robot CR. Then, the second control unit 54 controls the rotary chuck 64 to rotate the substrate W. When the rotation speed of the substrate W reaches a predetermined rotation speed, the second control unit 54 opens the on-off valve 72. As a result, IPA is ejected from the nozzle 65 onto the rotating substrate W, and a liquid film of IPA is formed on the upper surface of the substrate W.

[0258]

[0259] ​​When a predetermined time has elapsed since the start of IPA ejection, the second control unit 54 closes the on-off valve 72. As a result, the nozzle 65 stops ejecting IPA. When the ejection of IPA stops, the second control unit 54 controls the rotary chuck 64 to increase the rotation speed of the substrate W. As a result, IPA scatters from the substrate W and the substrate W dries. The second control unit 54 controls the rotary chuck 64 to stop the rotation of the substrate W when a predetermined time has elapsed after increasing the rotation speed of the substrate W. As a result, the drying process ends.

[0260] When the drying process ends, the second control unit 54 controls the central robot CR and the transfer robot IR to transfer the substrate W from the single wafer processing unit 63 to the transfer robot IR (process S73).

[0261] When the substrate W is transferred from the central robot CR to the transfer robot IR, the second control unit 54 controls the transfer robot IR to transfer the substrate W into the first substrate storage container CA1 placed in one of the plurality of third load ports LP3 (process S74). As a result, the dried substrate W is stored in the first substrate storage container CA1. Figure 12 The processing shown ends.

[0262] Next, with reference to Figure 1 、 Figure 13 and Figure 14 , the process of notifying the occurrence of an event will be described. Figure 13 is a flowchart showing the process of notification executed by the first control unit 24 of the first processing device 20 when an event occurs in the first processing device 20 operating based on the first virtual job. Figure 14 is a flowchart showing the process of notification executed by the control unit 13 of the integrated control device 10 when an event occurs in the first processing device 20 operating based on the first virtual job.

[0263] As Figure 13 shown, when an event occurs while controlling each part of the first processing device 20 based on the first virtual job, the first control unit 24 of the first processing device 20 notifies the integrated control device 10 of the event that has occurred in the first processing device 20 together with the identification information of the first virtual job via the first communication unit 22 (process S81). As a result, Figure 13 The processing shown ends.

[0264] As Figure 14 shown, when the control unit 13 of the integrated control device 10 is notified of the occurrence of an event, it determines whether to notify the host computer HC of the event that has occurred in the first processing device 20 (process S91).

[0265] When the control unit 13 decides not to notify the host computer HC of the occurrence of an event (No in step S91), Figure 14 The processing shown ends. For example, the event that occurs in the first processing device 20 includes a completion event indicating the completion of processing based on the first virtual job. When the event notified from the first processing device 20 is the completion event of the first virtual job, the control unit 13 decides not to notify the host computer HC of the completion event.

[0266] On the other hand, when the control unit 13 decides to notify the host computer HC of the occurrence of an event (Yes in step S91), it converts the identification information of the first virtual job into the identification information of the integrated job (step S92), and notifies the host computer HC of the event that occurred in the first processing device 20 together with the identification information of the integrated job (step S93). As a result, Figure 14 The processing shown ends.

[0267] In addition, regarding the notification processing executed when an event occurs in the second processing device 50 that operates based on the second virtual job, except for the processing of notifying the completion event, it is substantially the same as the processing described with reference to Figure 13 and Figure 14 Therefore, their descriptions are omitted.

[0268] Next, with reference to Figure 1 、 Figure 15 and Figure 16 The processing of notifying the host computer HC of the occurrence of the completion event will be described. Figure 15 is a flowchart showing the process of notification processing executed by the second control unit 54 of the second processing device 50 when a completion event occurs in the second processing device 50 that operates based on the second virtual job. Figure 16 is a flowchart showing the process of notification processing executed by the control unit 13 of the integrated control device 10 when a completion event occurs in the second processing device 50 that operates based on the second virtual job.

[0269] As Figure 15 shown, when a completion event occurs while controlling each part of the second processing device 50 based on the second virtual job, the second control unit 54 of the second processing device 50 notifies the integrated control device 10 of the completion event that occurred in the second processing device 50 together with the identification information of the second virtual job via the second communication unit 52 (step S81a). As a result, Figure 15 The processing shown ends.

[0270] Specifically, as referred to Figure 2As described above, the integrated control device 10 generates the second virtual job multiple times. Therefore, the events that occur in the second processing device 50 include multiple completion events indicating the completion of processing based on each of the multiple second virtual jobs. Moreover, among the multiple completion events, there is a completion event finally notified from the second processing device 50, that is, the final completion event. In the present embodiment, the integrated control device 10 generates the second virtual job twice. Therefore, the completion event notified to the integrated control device 10 for the second time from the second processing device 50 corresponds to the final completion event.

[0271] As Figure 16 shown, when the control unit 13 of the integrated control device 10 is notified of the occurrence of a completion event from the second processing device 50, it determines whether the completion event is the final completion event (step S91a).

[0272] When the control unit 13 determines that the completion event notified from the second processing device 50 is not the final completion event (\"No\" in step S91a), it decides not to notify the main computer HC of the completion event (step S94a), and ends Figure 16 the processing shown.

[0273] On the other hand, when the control unit 13 determines that the completion event notified from the second processing device 50 is the final completion event (\"Yes\" in step S91a), it converts the identification information of the second virtual job into the identification information of the integrated job (step S92a), and notifies the main computer HC of the completion event together with the identification information of the integrated job (step S93a). As a result, Figure 16 the processing shown ends.

[0274] As described above, as described with reference to Figures 1 - 16 above, according to Embodiment 1, the main computer HC only needs to command the integrated control device 10 to create one job. Therefore, the main computer HC does not need to command the first processing device 20 and the second processing device 50 to create jobs separately. Therefore, there is no need to introduce a new system (software) into the existing main computer, and thus an increase in the burden on the operator managing the main computer HC can be suppressed. In addition, the integrated control device 10 generates the first virtual job and the second virtual job based on a command from the main computer HC, whereby the first processing device 20 and the second processing device 50 cooperatively execute a series of substrate processes. Therefore, since the first processing device 20 and the second processing device 50 do not perform substrate processing through one job, it complies with the SEMI standard.

[0275] Moreover, according to Embodiment 1, the batch processing device 20 can perform chemical liquid treatment and rinsing treatment on multiple substrates W at once. Therefore, the productivity can be improved. In addition, the consumption of chemical liquid can be reduced.

[0276] In addition, according to Embodiment 1, the substrate W can be dried by the drying process of the single wafer processing apparatus 50. Compared with the drying process of the batch processing apparatus 20, the pattern is less likely to collapse during the drying process of the single wafer processing apparatus 50. Therefore, compared with the case of using the drying process of the batch processing apparatus 20, the pattern is less likely to collapse during the drying process.

[0277] In addition, according to Embodiment 1, existing process files can be edited and used. Therefore, the burden on the operator can be reduced compared with the case of newly creating process files.

[0278] Next, with reference to Figure 1 、 Figure 3 、 Figure 17 and Figure 18 , a modification example of the substrate processing system 1000 of the present embodiment will be described. Figure 17 is a diagram showing an example of the second process editing screen G2. In addition, in the example shown in Figure 17 , for ease of understanding, the first process list column 102 shown in Figure 5 is omitted.

[0279] As shown in Figure 17 , in the second process editing screen G2, two process setting columns 104 and 105 are displayed instead of the second process list column 103 shown in Figure 5 . The process setting column 104 is an input column for setting a process (second process RP2) for each substrate W constituting the first batch. The process setting column 105 is an input column for setting a process (second process RP2) for each substrate W constituting the second batch. The operator can operate the input unit HC1 in the display of the second process editing screen G2 to set different second processes RP2 for each substrate W. When editing the comprehensive process, the control unit 13 of the integrated control device 10 integrates the second process RP2 into the comprehensive process on a per-substrate basis corresponding to the case where the operator has set the second process RP2 for each substrate W via the second process editing screen G2.

[0280] In the example shown in Figure 17 , process A is set for the first substrate W (slot number 1) of the first batch, process D is set for the second to twenty-fourth substrates W (slot numbers 2 to 24) of the first batch, and process B is set for the twenty-fifth substrate W (slot number 25) of the first batch. In addition, in the example shown in Figure 17 , process D is set for the first to ninth substrates W (slot numbers 1 to 9) of the second batch, process C is set for the tenth substrate W (slot number 10) of the second batch, and process D is set for the eleventh to twenty-fifth substrates W (slot numbers 11 to 25) of the second batch.

[0281] In addition, Process A to Process D represent different second processes RP2. Process A to Process D may be existing process files stored in the second storage unit 53 of the single wafer processing apparatus 50, or may be process files newly created by an operator.

[0282] The newly created process file is stored in the second storage unit 53 of the single wafer processing apparatus 50 when editing the integrated process. In the case of using an existing process file, as described with reference to Figure 5 as described, the operator edits the existing Processes A to D via the second single process editing screen. As described with reference to Figure 6 as described, the existing Processes A to D stored in the second storage unit 53 are changed to Processes A to D edited via the second single process editing screen.

[0283] Next, with reference to Figure 1 、 Figure 17 and Figure 18 , the processing executed by the control unit 13 of the integrated control device 10 will be described. Figure 18 is a flowchart showing the flow of the processing executed by the control unit 13 of the integrated control device 10 included in a modification of the substrate processing system 1000 of the present embodiment. The processing shown in Figure 18 starts when the integrated control device 10 receives a production command for an integrated job from the host computer HC.

[0284] When the processing starts in Figure 18 , similar to the process S1 shown in Figure 2 , the control unit 13 refers to the integrated process information HR to generate a first virtual job, and sends the first virtual job from the communication unit 11 to the first processing device 20 (process S101). As a result, the first processing device 20 executes the chemical solution treatment and the rinsing treatment on a set of batches all at once.

[0285] After the chemical solution treatment and the rinsing treatment on a set of batches are completed, the control unit 13 refers to the integrated process information HR to generate a second virtual job, and sends the second virtual job from the communication unit 11 to the second processing device 50 (processes S102 to S107). Specifically, when integrating two or more second processes RP2 into an integrated process, the control unit 13 generates two or more second virtual jobs.

[0286] For example, in the case where the second process RP2 is set as shown in Figure 17 , when the substrate transfer mechanism 82 transfers the first substrate W of the first batch, the control unit 13 generates a second virtual job representing the identification information of Process A, and sends it to the second processing device 50 (process S102).

[0287] When the control unit 13 conveys the second substrate W of the first lot by the substrate conveyance mechanism 82, it generates a second virtual job representing the identification information of the process D and sends it to the second processing device 50 (step S103).

[0288] When the control unit 13 conveys the twenty-fifth substrate W of the first lot by the substrate conveyance mechanism 82, it generates a second virtual job representing the identification information of the process B and sends it to the second processing device 50 (step S104).

[0289] In addition, the control unit 13 may send a second virtual job representing the identification information of the process D to the second processing device 50 each time the second to twenty-fourth substrates W of the first lot are conveyed by the substrate conveyance mechanism 82.

[0290] When the control unit 13 conveys the first substrate W of the second lot by the substrate conveyance mechanism 82, it generates a second virtual job representing the identification information of the process D and sends it to the second processing device 50 (step S105). In addition, as described with reference to Figure 2 As described above, the control unit 13 sends a second virtual job at the time of lot switching. Therefore, when the process set for the twenty-fifth substrate W of the first lot is the same as the process set for the first substrate W of the second lot, the control unit 13 also sends a second virtual job when conveying the first substrate W of the second lot by the substrate conveyance mechanism 82.

[0291] When the control unit 13 conveys the tenth substrate W of the second lot by the substrate conveyance mechanism 82, it generates a second virtual job representing the identification information of the process C and sends it to the second processing device 50 (step S106).

[0292] In addition, the control unit 13 may send a second virtual job representing the identification information of the process D to the second processing device 50 each time the first to ninth substrates W of the second lot are conveyed by the substrate conveyance mechanism 82.

[0293] When the control unit 13 conveys the eleventh substrate W of the second lot by the substrate conveyance mechanism 82, it generates a second virtual job representing the identification information of the process D and sends it to the second processing device 50 (step S107). As a result, Figure 18 The processing shown ends.

[0294] In addition, the control unit 13 may send a second virtual job representing the identification information of the process D to the second processing device 50 every time the eleventh to twenty-fifth substrates W of the second lot are conveyed by the substrate conveyance mechanism 82.

[0295] As described above, as described with reference to Figure 1 、 Figure 3 、 Figure 17and Figure 18 As described, according to Embodiment 1, the process can be changed on a substrate-by-substrate basis. Therefore, the processes executed in the single wafer processing apparatus 50 can be changed for each substrate W. Further, in reference to Figure 1 , Figure 3 , Figure 17 and Figure 18 In the described example, the process of the second processing apparatus 50 is set for each substrate W. However, when the first processing apparatus 20 is a single wafer processing apparatus, the process of the first processing apparatus 20 may also be set for each substrate W.

[0296] [Embodiment 2]

[0297] Next, Embodiment 2 of the present invention will be described with reference to Figure 19 . However, matters different from Embodiment 1 will be described, and the description of matters the same as those in Embodiment 1 will be omitted. Embodiment 2 is different from Embodiment 1 in that the first control device 21 of the first processing device 20 also serves as the integrated control device 10 described with reference to Figures 1 - 18 .

[0298] Figure 19 is a block diagram showing the configuration of the substrate processing system 1000 of the present embodiment. As Figure 19 shown, the substrate processing system 1000 of the present embodiment includes a first processing device 20 and a second processing device 50.

[0299] The first processing device 20 performs the first processing on the substrate W based on one job in the same manner as in Embodiment 1. The second processing device 50 performs the second processing on the substrate W based on one job in the same manner as in Embodiment 1.

[0300] In the present embodiment, the first communication unit 22 of the first processing device 20 communicates between the communication unit HC4 of the host computer HC and the second communication unit 52 of the second processing device 50. As already described, in the present embodiment, the first control device 21 of the first processing device 20 also serves as the integrated control device 10. Therefore, the first control unit 24 of the first control device 21 generates a first virtual job and a second virtual job based on the production command of the integrated job received from the host computer HC. The first control unit 24 executes the first virtual job. In addition, the first control unit 24 sends the second virtual job to the second processing device 50 via the first communication unit 22 to cause the second processing device 50 to execute the second virtual job.

[0301] Above, with reference to Figure 19Embodiment 2 of the present invention is described. According to Embodiment 2, similarly to Embodiment 1, the host computer HC commands the integrated control device 10 to create one job. Therefore, similarly to Embodiment 1, an increase in the burden on the operator who manages the host computer HC can be suppressed.

[0302] In addition, in Embodiment 2, the first control device 21 of the first processing device 20 also serves as the integrated control device 10, but the second control device 51 of the second processing device 50 may also serve as the integrated control device 10.

[0303] [Embodiment 3]

[0304] Figure 20 is a block diagram showing the structure of the substrate processing system 1000a according to Embodiment 3. As Figure 20 shown, in the substrate processing system 1000a, from Figure 1 and Figure 3 the substrate processing system 1000 shown omits the first connection portion 80 and the second connection portion 90, and the substrate standby portion 40 is omitted from the first processing device 20. In addition to the respective structures of the substrate processing system 1000, the substrate processing system 1000a further includes another second processing device 50 and a local transfer mechanism 93. The other structures of the substrate processing system 1000a are substantially the same as those of the substrate processing system 1000 shown in Figure 1 and Figure 3 shown.

[0305] In the substrate processing system 1000a, another second processing device 50 is disposed adjacent to the (-Y) side of the second processing device 50. These two second processing devices 50 are the same type of processing devices having substantially the same structure, and are each configured to be able to perform a second process on the substrate W based on one job. In the present embodiment, the two second processing devices 50 are single-wafer processing devices, and the first processing device 20 is a batch processing device as described above. In addition, in the substrate processing system 1000a, three or more second processing devices 50 may be provided. That is, the substrate processing system 1000a includes a plurality of second processing devices 50.

[0306] The local transfer mechanism 93 is a mechanism for transferring the substrate storage container CA between the first processing device 20 and the plurality of second processing devices 50. The local transfer mechanism 93 is a transfer mechanism different from the above-described in-factory transfer system TS existing in the clean room where the first processing device 20 and the plurality of second processing devices 50 are provided. The local transfer mechanism 93 is an OHT or an AGV (Automated Guided Vehicle) that operates independently of the in-factory transfer system TS. The AGV is a transfer mechanism that travels on the floor of the clean room.

[0307] The local transfer mechanism 93 is configured to be able to transfer the substrate storage container CA to and from the above-described in-factory transfer system TS. The local transfer mechanism 93 only transfers the substrate storage container CA between the first processing device 20 and the plurality of second processing devices 50, and does not transfer the substrate storage container CA between the substrate processing devices other than the substrate processing system 1000a in the clean room, the container storage warehouse (i.e., the carrier buffer box for temporarily storing the substrate storage container CA), and the substrate processing system 1000a.

[0308] In the present embodiment, the local transfer mechanism 93 is an OHT. The local transfer mechanism 93 is disposed, for example, near the (+X)-side portion of the first processing device 20 and the plurality of second processing devices 50. The local transfer mechanism 93 is disposed above (i.e., on the (+Z)-side) the first container placement portion CP1 of the first processing device 20 and the second container placement portion CP2 of each second processing device 50. The local transfer mechanism 93 includes a movable portion 931 that holds and transfers the substrate storage container CA. The movable portion 931 can move independently of the first processing device 20 and the second processing device 50.

[0309] In the substrate processing system 1000a, the integrated control device 10 controls the first processing device 20 and the plurality of second processing devices 50 based on commands received from the host computer HC. Specifically, the integrated control device 10 generates a first virtual job and a second virtual job based on the production command of the integrated job received from the host computer HC.

[0310] The integrated control device 10 sends the first virtual job from the communication unit 11 to the first processing device 20, and causes the first processing device 20 to execute the first virtual job. In the present embodiment, the first virtual job causes the first processing device 20 (i.e., the batch processing device 20) to execute the chemical liquid treatment and the rinsing treatment. During the chemical liquid treatment and the rinsing treatment of the substrate W in the first processing device 20, two empty substrate storage containers CA containing the substrate W are placed on the first container rack 33a and / or the second container rack 33b.

[0311] A plurality of substrates W (i.e., the above-described first batch and second batch) that have completed the processing in the first processing device 20 are stored in two substrate storage containers CA on the first container rack 33a and / or the second container rack 33b, and are placed on the first container placement portion CP1. The substrate storage container CA for storing the substrate W that has completed the processing in the first processing device 20 may be the substrate storage container CA that stored the substrate W before the processing in the first processing device 20, or may be another substrate storage container CA different from the substrate storage container CA. When the substrate storage container CA containing the substrate W is placed on the first container placement portion CP1, the integrated control device 10 selects one of the plurality of second processing devices 50.

[0312] The selection of the second processing device 50 is performed as follows, for example. First, the integrated control device 10 sends a request to each of the plurality of second processing devices 50 to send information to be processed, and each second processing device 50 sends the information to be processed to the integrated control device 10. The information to be processed is information indicating the number of substrates W (i.e., substrates W waiting for processing) waiting for processing in the second processing device 50. The substrate W waiting for processing refers to the substrate W that has been carried into the second processing device 50 and has not yet been processed by the second processing device 50. The information to be processed of each second processing device 50 sent from each second processing device 50 is stored in the storage unit 12 of the integrated control device 10.

[0313] Next, the integrated control device 10 compares the information to be processed of the plurality of second processing devices 50, and based on the comparison result, determines a second processing device 50 into which the substrate storage container CA carried out from the first processing device 20 by the local transfer mechanism 93 is to be carried in as scheduled. Specifically, for example, the integrated control device 10 selects a second processing device 50 with the smallest number of substrates W waiting for processing among the plurality of second processing devices 50.

[0314] Then, the local transfer mechanism 93 is controlled by the control unit 13 of the integrated control device 10. The local transfer mechanism 93 holds the substrate storage container CA placed on the first container placement unit CP1 and transfers it to the second container placement unit CP2 of the selected second processing device 50 and places it on the second container placement unit CP2. Thereby, the substrate W processed by the first processing device 20 is carried into the second processing device 50. The local transfer mechanism 93 directly carries the substrate storage container CA carried out from the first processing device 20 into the second processing device 50 without passing through the container storage warehouse or the like.

[0315] When the substrate storage container CA is placed on the second container placement unit CP2 of the second processing device 50, the integrated control device 10 sends a second virtual job from the communication unit 11 to the second processing device 50, and causes the second processing device 50 to execute the second virtual job. In the present embodiment, the second virtual job causes the second processing device 50 (i.e., the single-chip processing device 50) to execute a drying process.

[0316] Thus, in the substrate processing system 1000a, the substrate storage container CA can be easily transported by the local transfer mechanism 93 to one of the plurality of second processing devices 50 appropriately selected. In addition, when transporting the substrate storage container CA from the first processing device 20 to the one second processing device 50, since it does not pass through a container storage warehouse or the like, the time required for transporting from the container storage warehouse to the one second processing device 50 will not increase due to delays caused by the transportation of other substrate storage containers CA or the like. Therefore, the time from the end of the processing of the substrate W by the first processing device 20 to the start of the processing of the substrate W by the one second processing device 50 can be shortened.

[0317] In the substrate processing system 1000a, the above method for selecting one of the second processing devices 50 is not necessarily limited to the above example. For example, the integrated control device 10 sends requests for sending maintenance information and the above-mentioned information to be processed to each of the plurality of second processing devices 50, and each second processing device 50 sends maintenance information and information to be processed to the integrated control device 10. The maintenance information is information indicating the scheduled start time and end time of a predetermined maintenance to be performed next in the second processing device 50 (i.e., the predetermined maintenance to be performed in the nearest future). The maintenance information and information to be processed of each second processing device 50 sent from each second processing device 50 are stored in the storage unit 12 of the integrated control device 10.

[0318] Then, through the integrated control device 10, the information to be processed and the maintenance information of the plurality of second processing devices 50 are compared, and based on the comparison result, one of the second processing devices 50 into which the substrate storage container CA to be transported out from the first processing device 20 by the local transfer mechanism 93 is scheduled to be transported is determined. Specifically, for example, among the plurality of second processing devices 50, considering the number of substrates W to be processed and the maintenance schedule, one of the second processing devices 50 that can process the substrates W in the substrate storage container CA to be transported in earliest is selected.

[0319] For example, even if it is the second processing device 50 with the smallest number of substrates W to be processed among the plurality of second processing devices 50, if maintenance is scheduled to be performed before the start of the processing of the substrates W in the substrate storage container CA to be transported in, the second processing device 50 whose processing of the substrates W in the substrate storage container CA will be slowed down when considering the maintenance is not selected as the above one second processing device 50. Then, the second processing device 50 with the smallest number of substrates W to be processed among the second processing devices 50 with the maintenance schedule temporarily advanced is selected as the above one second processing device 50.

[0320] As described above, the substrate processing system 1000a includes a first processing device 20, a plurality of second processing devices 50, an integrated control device 10, and a local transfer mechanism 93. The first processing device 20 performs a first process on the substrate W based on a job. The plurality of second processing devices 50 perform second processes on the substrate W respectively based on a job. The integrated control device 10 controls the first processing device 20 and the plurality of second processing devices 50 based on commands received from an external control device (i.e., a host computer HC). The local transfer mechanism 93 can move independently of the first processing device 20 and the plurality of second processing devices 50.

[0321] The processing from when a job instruction loads the substrate W into the interior of the processing device from the substrate storage container CA, performs a process on the substrate W inside the processing device, and then unloads the substrate W from the interior of the processing device to the substrate storage container CA or another substrate storage container CA different from the substrate storage container CA. The integrated control device 10 generates a first virtual job and a second virtual job based on a production command for an integrated job received from the host computer HC. The first processing device 20 performs at least a part of the first process (in the above example, a chemical solution process and a rinsing process) on the substrate W based on the first virtual job. One of the plurality of second processing devices 50 selected by the integrated control device 10 performs at least a part of the second process (in the above example, a drying process) on the substrate W processed by the first processing device 20 based on the second virtual job.

[0322] The first processing device 20 has a first container placement unit CP1 for placing the substrate storage container CA. Each of the plurality of second processing devices 50 has a second container placement unit CP2 for placing the substrate storage container CA. The local transfer mechanism 93 transfers the substrate storage container CA containing the substrate W processed by the first processing device 20 from the first container placement unit CP1 to the second container placement unit CP2 of the above one of the plurality of second processing devices 50.

[0323] Thus, as described above, it is possible to easily transfer the substrate storage container CA to one of the plurality of second processing devices 50 appropriately selected. In addition, as described above, it is possible to shorten the time from when the processing of the substrate W by the first processing device 20 ends to when the processing of the substrate W by the above one second processing device 50 starts.

[0324] As described above, preferably, the first processing device 20 includes a batch-type substrate processing device capable of processing a plurality of substrates W together, and the plurality of second processing devices 50 include single-sheet-type substrate processing devices for processing substrates one by one. Thus, it is possible to appropriately perform a hybrid process in which batch processing of each substrate W is followed by single-sheet processing.

[0325] In the above example, the integrated control device 10 stores the processing information indicating the number of substrates W to be processed in each of the plurality of second processing devices 50 and the maintenance information of each of the plurality of second processing devices 50. Preferably, the integrated control device 10 selects one second processing device 50 from the plurality of second processing devices 50 based on the processing information and the maintenance information of each second processing device 50. Thus, the one second processing device 50 can be selected in consideration of the maintenance period of each second processing device 50. As a result, the one second processing device 50 that can process the substrates W in the substrate storage container CA scheduled to be carried in the earliest can be selected.

[0326] [Implementation Method 4]

[0327] Figure 21 is a block diagram showing the structure of a substrate processing system 1000b according to Embodiment 4. Figure 21 As shown, in the substrate processing system 1000b, in addition to Figure 20 In addition to the structures of the substrate processing system 1000a shown in FIG. 1 , a plurality of second processing devices 50b are further provided. Figure 20 The illustrated substrate processing system 1000a is substantially the same.

[0328] The plurality of second processing apparatuses 50b are respectively single-wafer processing apparatuses of a different type from the second processing apparatus 50 described above. The second processing apparatuses 50b and the second processing apparatus 50 differ in, for example, apparatus structures, types of processing liquids used, types of processing that can be performed, and the like. For example, in the second processing apparatus 50b, the substrate W is dried using a drying method of a different type from that of the second processing apparatus 50. In the following description, the plurality of second processing apparatuses 50 are also referred to as "a first type of second processing apparatus group 500", and the plurality of second processing apparatuses 50b are also referred to as "a second type of second processing apparatus group 500b". In addition, the second processing apparatus 50 and the second processing apparatus 50b are also collectively referred to as "a second processing apparatus".

[0329] The plurality of second processing devices 50b included in the second type of second processing device group 500b are processing devices of the same type having substantially the same structure, and are each configured to be capable of performing a second process on the substrate W based on one operation. In the present embodiment, the second type of second processing device group 500b includes two second processing devices 50b. The number of second processing devices 50b included in the second type of second processing device group 500b may also be three or more.

[0330] The second type of second processing device group 500b is arranged in an area separated from the area where the first type of second processing device group 500 is arranged. Figure 21In the example shown, with respect to the direction of the conveyance path for conveying the substrate storage container CA along the local conveyance mechanism 93, the second processing device group 500b of the second type is located on the side opposite to the second processing device group 500 of the first type with the first processing device 20 interposed therebetween. The local conveyance mechanism 93 can also convey the substrate storage container CA between the first processing device 20 and the plurality of second processing device groups 500b. The local conveyance mechanism 93 is also disposed above (i.e., on the (+Z) side) the second container placement unit CP2 of each second processing device 50b. The movable part 931 of the local conveyance mechanism 93 can also move independently of the second processing device 50b.

[0331] In the substrate processing system 1000b, the integrated control device 10 controls the first processing device 20, the plurality of second processing devices 50, and the plurality of second processing device groups 500b based on commands received from the host computer HC. Specifically, the integrated control device 10 generates a first virtual job and a second virtual job based on a production command for an integrated operation received from the host computer HC.

[0332] The integrated control device 10 sends the first virtual job from the communication unit 11 to the first processing device 20, causing the first processing device 20 to execute the first virtual job. In the present embodiment, the first virtual job causes the first processing device 20 (i.e., the batch processing device 20) to perform a chemical solution treatment and a rinsing treatment. During the chemical solution treatment and rinsing treatment of the substrate W in the first processing device 20, two empty substrate storage containers CA containing the substrate W are placed on the first container rack 33a and / or the second container rack 33b.

[0333] The plurality of substrates W (i.e., the above-mentioned first batch and second batch) that have completed the processing in the first processing device 20 are stored in two substrate storage containers CA on the first container rack 33a and / or the second container rack 33b, and are placed on the first container placement unit CP1. The substrate storage container CA that stores the substrate W after the processing in the first processing device 20 can be the substrate storage container CA that stored the substrate W before the processing in the first processing device 20, or can be another substrate storage container CA different from this substrate storage container CA.

[0334] When the substrate storage container CA containing the substrate W is placed on the first container placement unit CP1, the integrated control device 10 selects one of the second processing device groups of the first type 500 and the second processing device group of the second type 500b. The selection of this one second processing device group is performed, for example, based on the content of the drying treatment indicated by the second virtual job, the size of the pattern on the substrate W pre-stored in the storage unit 12, and the like.

[0335] When the selection of the second processing device group of the above-mentioned one party (the second processing device group 500 of the first type or the second processing device group 500b of the second type in this embodiment) is completed, the local transfer mechanism 93 is controlled by the control unit 13 of the integrated control device 10. The movable part 931 of the local transfer mechanism 93 holds the substrate storage container CA placed on the first container placement part CP1 and starts to move toward the area where the selected second processing device group of the above-mentioned one party is arranged.

[0336] In the integrated control device 10, in parallel with the above-mentioned movement of the movable part 931, one second processing device (that is, the second processing device 50 or the second processing device 50b) is selected from among the plurality of second processing devices included in the selected second processing device group of the above-mentioned one party. The selection of this one second processing device is performed in substantially the same manner as the selection of the above-mentioned one second processing device 50 in the substrate processing system 1000a. Then, the substrate storage container CA is transferred to the second container placement part CP2 of the selected one second processing device by the local transfer mechanism 93 and placed on the second container placement part CP2. Thus, the substrate W processed by the first processing device 20 is transferred to this one second processing device. The local transfer mechanism 93 directly transfers the substrate storage container CA carried out from the first processing device 20 into the above-mentioned one second processing device (that is, the second processing device 50 or the second processing device 50b) without passing through the above-mentioned container storage warehouse or the like.

[0337] When the substrate storage container CA is placed on the second container placement part CP2 of the above-mentioned one second processing device, the integrated control device 10 sends a second virtual job from the communication unit 11 to this one second processing device, causing this one second processing device to execute the second virtual job. In this embodiment, the second virtual job causes this one second processing device (that is, the single-chip processing device) to perform a drying process.

[0338] As described above, the substrate processing system 1000b includes a first processing device 20, a plurality of second processing devices (that is, the second processing device 50 and the second processing device 50b), an integrated control device 10, and a local transfer mechanism 93. The first processing device 20 performs a first process on the substrate W based on a job. The plurality of second processing devices perform second processes on the substrate W respectively based on a job. The plurality of second processing devices include a second processing device group 500 of the first type and a second processing device group 500b of a second type different from the first type. The second processing device group 500b of the second type is arranged in an area separated from the area where the second processing device group 500 of the first type is arranged. The integrated control device 10 controls the first processing device 20 and the plurality of second processing devices based on commands received from an external control device (that is, the host computer HC). The local transfer mechanism 93 can move independently of the first processing device 20 and the plurality of second processing devices.

[0339] The operation instruction transfers the substrate W into the interior of the processing apparatus from the substrate storage container CA, and after performing processing on the substrate W inside the processing apparatus, the substrate W is transferred out of the interior of the processing apparatus to the above substrate storage container CA or another substrate storage container CA different from the above substrate storage container CA until the processing is completed. The integrated control device 10 generates a first virtual job and a second virtual job based on the production command of the integrated job received from the host computer HC. The first processing device 20 performs at least a part of the first processing (in the above example, the chemical liquid processing and the rinsing processing) on the substrate W based on the first virtual job.

[0340] The integrated control device 10 selects one of the second processing device groups of the first type 500 and the second processing device group of the second type 500b based on the production command of the integrated job, and selects one second processing device (i.e., the second processing device 50 or the second processing device 50b) from the one second processing device group. One second processing device selected by the integrated control device 10 among the plurality of second processing devices performs at least a part of the second processing (in the above example, the drying processing) on the substrate W processed by the first processing device 20 based on the second virtual job.

[0341] The first processing device 20 has a first container placement portion CP1 for placing the substrate storage container CA. Each of the plurality of second processing devices has a second container placement portion CP2 for placing the substrate storage container CA. The local transfer mechanism 93 transfers the substrate storage container CA containing the substrate W processed by the first processing device 20 from the first container placement portion CP1 to the second container placement portion CP2 of the above one second processing device (i.e., the second processing device 50 or the second processing device 50b) among the plurality of second processing devices.

[0342] Thereby, it is possible to easily transfer the substrate storage container CA to one second processing device appropriately selected from the plurality of second processing devices (i.e., the second processing device group of the first type 500 and the second processing device group of the second type 500b). In addition, similar to the substrate processing system 1000a, it is possible to shorten the time from the end of the processing of the substrate W by the first processing device 20 to the start of the processing of the substrate W by the one second processing device.

[0343] As described above, in the substrate processing system 1000b, the substrate storage container CA storing the substrate W processed by the first processing device 20 is transported from the first processing device 20 to one of the second processing device groups selected by the integrated control device 10 (i.e., the first type of second processing device group 500 or the second type of second processing device group 500b). And preferably, in parallel with this transportation, the integrated control device 10 selects one second processing device (i.e., the second processing device 50 or the second processing device 50b) in this one second processing device group as the second processing device that performs the second virtual operation. Thereby, the time from the end of the processing of the substrate W by the first processing device 20 to the start of the processing of the substrate W by this one second processing device can be further shortened.

[0344] As described above, preferably, the first processing device 20 includes a batch-type substrate processing device capable of processing a plurality of substrates W at once, and each of the plurality of second processing devices includes a single-wafer-type substrate processing device that processes substrates one by one. Thereby, a hybrid process of performing single-wafer processing after batch processing of each substrate W can be appropriately implemented.

[0345] The embodiments of the present invention have been described above with reference to the drawings ( Figures 1 - 21 ). However, the present invention is not limited to the above-described embodiments and can be implemented in various ways without departing from its gist. In addition, the multiple constituent elements disclosed in the above-described embodiments can be appropriately changed. For example, a certain constituent element among all the constituent elements shown in a certain embodiment can be added to the constituent elements of other embodiments, or several constituent elements among all the constituent elements shown in a certain embodiment can be deleted from the embodiment.

[0346] In the drawings, for the sake of easy understanding of the invention, each constituent element is schematically shown as the main body, and the thickness, length, number, interval, etc. of each constituent element shown in the drawings may sometimes be different from the actual ones for the convenience of making the drawings. In addition, the structure of each constituent element shown in the above-described embodiments is an example and is not particularly limited. Of course, various changes can be made without substantially departing from the effects of the present invention.

[0347] For example, in the embodiment described with reference to Figures 1 - 21 , a structure in which the substrate W is processed using the first processing device 20 and the second processing devices 50, 50b is described, but the integrated control device 10 may also cause only the first processing device 20 to process the substrate W, or may also cause only the second processing device 50 or the second processing device 50b to process the substrate W. In this case, one of the first process RP1 and the second process RP2 is integrated in the integrated operation.

[0348] In addition, in the reference to Figures 1 - 21In the described embodiments, it is a combination of a batch-type cleaning or etching apparatus and a single-wafer cleaning or etching apparatus, but the combination of the first processing apparatus 20 and the second processing apparatuses 50, 50b is not limited thereto. For example, the combination of the first processing apparatus 20 and the second processing apparatuses 50, 50b can be a combination of a scrub cleaning apparatus and a batch cleaning apparatus, a combination of a film thickness inspection apparatus and a cleaning apparatus, a combination of a warpage measurement apparatus and a lamp annealing apparatus, or a combination of a cleaning apparatus and a particle counting apparatus.

[0349] In addition, in the Figures 1 - 21 described embodiments, a part of the first processing that can be performed by the first processing apparatus 20 is used, but all of the processing that can be performed by the first processing apparatus 20 can also be used. The same applies to the second processing apparatuses 50, 50b. For example, when the first processing apparatus 20 is a film thickness inspection apparatus, all of the processing that can be performed by the first processing apparatus 20 is used.

[0350] In addition, in the Figures 1 - 21 described embodiments, it is a combination of a batch-type processing apparatus and a single-wafer processing apparatus, but it can also be a combination of batch-type processing apparatuses or a combination of single-wafer processing apparatuses.

[0351] In addition, in the Figures 1 - 21 described embodiments, batch processing and single-wafer processing are combined, but it can also be a combination of batch processing and batch processing or a combination of single-wafer processing and single-wafer processing. For example, multiple processing apparatuses that can perform the same processing can be combined.

[0352] In addition, in the Figures 1 - 19 described embodiments, the substrate processing system 1000 includes a first connection portion 80 and a second connection portion 90, but the substrate processing system 1000 can also include only one of the first connection portion 80 and the second connection portion 90.

[0353] In addition, in the Figures 1 - 19 described embodiments, it is a combination of two processing apparatuses, but it can also be a combination of three or more processing apparatuses as in the Figure 20 and Figure 21 described embodiments.

[0354] In addition, in the Figures 1 - 19In the described embodiment, after the second posture changing mechanism changes the posture of one batch from the vertical posture to the horizontal posture, virtual placement information (information indicating that a virtual substrate storage container is placed on the virtual loading port) is generated corresponding to the case where the vertical position of one batch is adjusted such that the uppermost substrate W of one batch is located above the liquid level of the immersion tank. However, the virtual placement information may also be generated corresponding to the case where the second posture changing mechanism changes the posture of one batch from the vertical posture to the horizontal posture.

[0355] In addition, in the embodiment described with reference to Figures 1 - 19 the first connecting portion 80 has the substrate standby portion 40, but the first processing device 20 may also have the substrate standby portion 40.

[0356] In addition, in the embodiment described with reference to Figure 21 two second processing device groups are provided, but three or more second processing device groups may also be provided.

[0357] Although the invention has been depicted and described in detail, the foregoing description is illustrative and not restrictive. Therefore, various modifications or modes can be adopted as long as they do not depart from the scope of the present invention.

[0358] The present invention is useful for a device, a system, and a method for processing substrates.

[0359] Description of Reference Numerals

[0360] 10: Integrated control device

[0361] 20: First processing device, batch processing device

[0362] 21: First control device

[0363] 23: First storage unit

[0364] 31: First housing

[0365] 31a: First opening

[0366] 40: Substrate standby portion

[0367] 50, 50b: Second processing device, single-piece processing device

[0368] 51: Second control device

[0369] 53: Second storage unit

[0370] 61: Second housing

[0371] 61a: Second opening

[0372] 80: First connecting portion

[0373] 81: First connection housing

[0374] 82: Substrate transfer mechanism

[0375] 90: Second connection part

[0376] 91: Second connection housing

[0377] 92: Second container transfer mechanism

[0378] 93: Local transfer mechanism

[0379] 1000, 1000a, 1000b: Substrate processing system

[0380] A - D: Processes

[0381] CA: Substrate storage container

[0382] CA1: First substrate storage container

[0383] CA2: Second substrate storage container

[0384] CP1: First container placement part

[0385] CP2: Second container placement part

[0386] G1: First process editing screen

[0387] G2: Second process editing screen

[0388] HC: Main computer

[0389] HR: Comprehensive process information

[0390] LP1: First loading port

[0391] LP2: Second loading port

[0392] LP3: Third loading port

[0393] RP1: First process

[0394] RP2: Second process

[0395] W: Substrate.

Claims

1. A substrate processing system (1000), characterized in that: have: A first processing device (20) that performs a first process on a substrate (W) based on a job; a second processing device (50) for performing a second processing on the substrate (W) based on the job; as well as An integrated control device (10) controls the first processing device (20) and the second processing device (50) based on a command received from an external control device, The operation instruction is a process of loading a substrate (W) from a substrate storage container (CA) into a processing device, performing a process on the substrate (W) in the processing device, and then unloading the substrate (W) from the processing device into the substrate storage container (CA) or another substrate storage container (CA) different from the substrate storage container (CA). The integrated control device (10) generates a first virtual job and a second virtual job based on a production command of an integrated job received from the external control device, The first processing device (20) performs at least a part of the first processing on the substrate (W) based on the first virtual job, The second processing device (50) performs at least a part of the second processing on the substrate (W) processed by the first processing device (20) based on the second virtual job.

2. The substrate processing system (1000) according to claim 1, characterized in that: The substrate processing system (1000) further comprises a first connecting portion (80) for connecting the first processing device (20) and the second processing device (50). The first connecting portion (80) has a substrate transport mechanism (82) for transporting the substrate (W) processed by the first processing device (20) to the second processing device (50).

3. The substrate processing system (1000) according to claim 2, characterized in that: The substrate processing system (1000) further comprises a substrate standby unit (40) for allowing the substrate (W) to standby after performing at least a part of the first processing. The substrate transport mechanism (82) transports the substrate (W) waiting in the substrate standby section (40) to the second processing device (50). The integrated control device (10) generates the second virtual job in response to a situation in which the substrate (W) is on standby in the substrate standby section (40).

4. The substrate processing system (1000) according to claim 3, characterized in that: The second processing device (50) includes a storage unit for storing identification information of a virtual container loading unit. The integrated control device (10) generates information indicating that a virtual substrate storage container is placed on the virtual container placement section in response to the substrate (W) being placed on standby in the substrate standby section (40).

5. The substrate processing system (1000) according to any one of claims 2 to 4, characterized in that: The first processing device (20) includes a first housing (31) having a first opening (31a). The second processing device (50) includes a second housing (61) having a second opening (61a). The first connecting portion (80) further comprises a first connecting housing (81). One end of the first connecting shell (81) is connected to the first shell (31). The other end of the first connecting shell (81) is connected to the second shell (61). The substrate conveying mechanism (82) conveys the substrate (W) processed by the first processing device (20) out of the first opening (31a) of the first shell (31), conveys it inside the first connecting shell (81), and conveys it into the second shell (61) from the second opening (61a).

6. The substrate processing system (1000) according to any one of claims 1 to 4, characterized in that: The substrate processing system (1000) further comprises a second connecting portion (90) for connecting the first processing device (20) and the second processing device (50). The first processing device (20) comprises a first housing (31) and a first container mounting portion (CP1) for mounting a substrate storage container (CA). The second processing device (50) comprises a second housing (61) and a second container mounting portion (CP2) for mounting the substrate storage container (CA). The first container placement portion (CP1) is disposed outside the first housing (31). The second container placement portion (CP2) is disposed outside the second shell (61). The second connecting portion (90) includes a container transport mechanism for transporting the substrate storage container (CA) mounted on the first container mounting portion (CP1) to the second container mounting portion (CP2).

7. The substrate processing system (1000) according to claim 6, characterized in that: The second connecting portion (90) further includes a second connecting housing (91) covering the first container mounting portion (CP1) and the second container mounting portion (CP2). The container transport mechanism transports the substrate storage container (CA) inside the second connecting case (91).

8. The substrate processing system (1000) according to any one of claims 1 to 4, characterized in that: The first processing device (20) has a first storage unit (23) storing a first recipe (RP1) for defining the first processing. The second processing device (50) includes a second storage unit (53) for storing a second recipe (RP2) for defining the second processing. The integrated control device (10) edits the integrated process formed by integrating the first process (RP1) and the second process (RP2), and stores the integrated process information (HR). When receiving a production command for the integrated operation from the external control device, the integrated control device (10) generates the first virtual operation and the second virtual operation by referring to the integrated process information (HR). The first virtual operation includes identification information of the first process (RP1) integrated into the integrated process, The second virtual process includes identification information of the second process (RP2) integrated into the integrated process.

9. The substrate processing system (1000) according to claim 8, characterized in that: The first processing device (20) performs a part of the first processing, When editing the integrated recipe, the integrated control device (10) edits the first recipe (RP1) based on an instruction from the external control device so as to execute a part of the first process.

10. The substrate processing system (1000) according to claim 8, characterized in that: The second processing device (50) performs a part of the second processing. When editing the integrated recipe, the integrated control device (10) edits the second recipe (RP2) based on instructions from the external control device so as to execute a part of the second process.

11. The substrate processing system (1000) according to claim 8, characterized in that: The first storage unit (23) stores a plurality of first processes (RP1) that are different from each other. When editing the integrated process, the integrated control device (10) integrates the first process (RP1) into the integrated process on a substrate (W) basis. When the integrated control device (10) integrates two or more of the first processes (RP1) into the integrated process, it generates two or more of the first virtual operations.

12. The substrate processing system (1000) according to claim 8, characterized in that: The second storage unit (53) stores a plurality of second processes (RP2) that are different from each other. When editing the integrated process, the integrated control device (10) integrates the second process (RP2) into the integrated process on a substrate (W) basis. When the integrated control device (10) integrates two or more of the second recipes (RP2) into the integrated recipe, it generates two or more of the second virtual jobs.

13. The substrate processing system (1000) according to any one of claims 1 to 4, characterized in that: The first processing device (20) notifies the integrated control device (10) of an event occurring in the first processing device (20) together with identification information of the first virtual job, The second processing device (50) notifies the integrated control device (10) of an event occurring in the second processing device (50) together with identification information of the second virtual job, The integrated control device (10) notifies the external control device of events occurring in the first processing device (20) together with identification information of the integrated operation, and notifies the external control device of events occurring in the second processing device (50) together with identification information of the integrated operation.

14. The substrate processing system (1000) according to claim 13, characterized in that: The event occurring in the first processing device (20) includes a completion event indicating completion of processing based on the first virtual job, The integrated control device (10) determines not to notify the external control device of the completion event when the event notified from the first processing device (20) is a completion event of the first virtual job.

15. The substrate processing system (1000) according to claim 13, characterized in that: The integrated control device (10) generates the second virtual operation multiple times. The events generated in the second processing device (50) include a plurality of completion events indicating completion of processing based on each of the plurality of second virtual jobs. The plurality of completion events include a final completion event which is the last completion event notified from the second processing device (50), The integrated control device (10) decides not to notify the external control device of the completion event when the completion event notified from the second processing device (50) is not the final completion event, and notifies the external control device of the completion event together with the identification information of the integrated job when the completion event notified from the second processing device (50) is the final completion event.

16. The substrate processing system (1000) according to any one of claims 1 to 4, characterized in that: The first processing device (20) has a first control device (21) for controlling the execution of the first processing. The second processing device (50) has a second control device (51) for controlling the execution of the second processing. One of the first control device (21) and the second control device (51) also serves as the integrated control device (10).

17. The substrate processing system (1000) according to any one of claims 1 to 4, characterized in that: The first processing device (20) comprises a batch type substrate processing device capable of processing a plurality of substrates (W) at a time. The second processing device (50) includes a single-sheet substrate processing device that processes substrates (W) one by one.

18. The substrate processing system (1000) according to claim 17, characterized in that: The integrated control device (10) generates the first virtual job to control the batch substrate processing device. The batch type substrate processing device performs a part of the first processing on the plurality of substrates (W) based on the first virtual job, The integrated control device (10) generates the second virtual job to control the single substrate processing device after the batch substrate processing device completes processing of the plurality of substrates (W). The single-sheet substrate processing device performs a part of the second processing on a part of the substrates (W) among the plurality of substrates (W) in units of one substrate (W) based on the second virtual job, The integrated control device (10) generates the second virtual job again to control the single-sheet substrate processing device after the single-sheet substrate processing device completes processing of a portion of the plurality of substrates (W). The single-sheet substrate processing apparatus performs a part of the second process on each of the remaining substrates (W) among the plurality of substrates (W) in units of one substrate (W) based on the second virtual job.

19. A substrate processing system (1000a, 1000b), characterized in that: have: A first processing device (20) that performs a first process on a substrate (W) based on a job; A plurality of second processing devices (50) for performing second processing on the substrate (W) respectively based on the operation; an integrated control device (10) for controlling the first processing device (20) and the plurality of second processing devices (50) based on a command received from an external control device; as well as a local transport mechanism (93) capable of moving independently of the first processing device (20) and the plurality of second processing devices (50); The operation instruction is a process of carrying a substrate (W) from a substrate storage container (CA) into a processing device, performing a process on the substrate (W) in the processing device, and then carrying the substrate (W) out of the processing device into the substrate storage container (CA) or another substrate storage container (CA) different from the substrate storage container (CA), The integrated control device (10) generates a first virtual job and a second virtual job based on a production command of an integrated job received from the external control device, The first processing device (20) performs at least a part of the first processing on the substrate (W) based on the first virtual operation. A second processing device (50) selected by the integrated control device (10) from among the plurality of second processing devices (50) performs at least a portion of the second processing on the substrate (W) processed by the first processing device (20) based on the second virtual job, The first processing device (20) includes a first container mounting portion (CP1) for mounting a substrate storage container (CA). The plurality of second processing devices (50) each have a second container mounting portion (CP2) for mounting the substrate storage container (CA). The local transport mechanism (93) transports the substrate storage container (CA) containing the substrate (W) processed by the first processing device (20) from the first container loading section (CP1) to the second container loading section (CP2) of one of the second processing devices (50) among the multiple second processing devices (50).

20. The substrate processing system (1000a, 1000b) according to claim 19, characterized in that: The integrated control device (10) stores processing information indicating the number of substrates (W) to be processed of each of the plurality of second processing devices (50) and maintenance information of each of the plurality of second processing devices (50), and selects one of the plurality of second processing devices (50) based on the processing information and maintenance information of each second processing device (50).

21. The substrate processing system (1000b) according to claim 19, characterized in that: The plurality of second processing devices (50, 50b) include a first type of second processing device group (500) and a second type of second processing device group (500b) different from the first type, The second type of second processing device group (500b) is arranged in an area separated from an area where the first type of second processing device group (500) is arranged, The integrated control device (10) selects a second processing device group from one of the first type of second processing device group (500) and the second type of second processing device group (500b) based on the production command of the integrated operation, and selects a second processing device (50, 50b) from the second processing device group on the one side.

22. The substrate processing system (1000a, 1000b) according to any one of claims 19 to 21, characterized in that: The first processing device (20) comprises a batch type substrate processing device capable of processing a plurality of substrates (W) at a time. The plurality of second processing devices (50) each include a single-sheet substrate processing device that processes substrates (W) one by one.

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