A crystal bonding device and method

Abstract

The present invention relates to the field of semiconductor technology, and specifically to a crystal bonding device and method. The crystal bonding device includes a carrier platform and a loading device, a unloading device, a mounting device, a dipping device, a turntable device and a crystal supply device installed inside the carrier platform; the loading device and the unloading device are arranged parallel to each other at opposite ends of the carrier platform, the mounting device is arranged between the discharge end of the loading device and the feed end of the unloading device, the dipping device is located on one side of the loading device, and the dipping device and the turntable device are respectively arranged on both sides of the mounting device, and the crystal supply device is located on the side of the turntable device away from the mounting device; a movable main binding head assembly, a first binding head assembly and a second binding head assembly are provided inside the carrier platform, the main binding head assembly is arranged on one side of the unloading device, the first binding head assembly is arranged on one side of the loading device, and the second binding head assembly is arranged on one side of the crystal supply device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a crystal bonding device and method. Background Art

[0002] A die bonder, also known as a chip mounter, is an essential piece of equipment in the integrated circuit packaging process. Its job is to remove the chip from the blue film, transfer it to a pre-applied adhesive carrier, and bond the chip to the substrate. The die bonder can place components with high speed and precision, completing a series of critical steps such as positioning, alignment, and placement. With the rapid development of the semiconductor industry, the chip packaging process is increasingly demanding higher efficiency for die bonders.

[0003] However, existing die-bonding equipment has certain drawbacks when in use: on the one hand, the layout of the various modules in the die-bonding equipment is relatively scattered and the continuity is low, which in turn affects the efficiency of die-bonding; on the other hand, the die-bonding equipment can usually only perform a single welding or bonding operation, and manual adjustment is required when changing products, which is not only time-consuming and labor-intensive but also prone to introducing errors, thus affecting the efficiency of die-bonding. Summary of the Invention

[0004] In order to solve the technical problems of existing die bonding equipment being bulky and having low die bonding efficiency, the present invention provides a die bonding equipment and method.

[0005] The technical solution to the technical problem solved by the present invention is to provide a crystal bonding device, which includes a supporting platform and a loading device, a unloading device, a mounting device, a dipping device, a turntable device and a crystal supply device installed inside the supporting platform; the loading device and the unloading device are arranged parallel to each other at the opposite ends of the supporting platform, the mounting device is arranged between the discharge end of the loading device and the feed end of the unloading device, the dipping device is located on one side of the loading device, and the dipping device and the turntable device are respectively arranged on both sides of the mounting device, and the crystal supply device is located on the side of the turntable device away from the mounting device; a movable main binding head assembly, a first binding head assembly and a second binding head assembly are provided inside the supporting platform, the main binding head assembly is arranged on one side of the unloading device, the first binding head assembly is arranged on one side of the loading device for dispensing glue on the substrate, and the second binding head assembly is arranged on the side of the crystal supply device One side is used for taking and placing chips, and the working areas between the main head assembly, the first head assembly and the second head assembly do not overlap; the mounting device includes a workbench assembly and a first linear module, and the turntable device includes a turntable body and a second linear module, and the second linear module is arranged parallel to the first linear module; the workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device; the turntable body can slide in the length direction of the second linear module, so that the turntable body can slide into the working area of ​​the second head assembly or the working area of ​​the main head assembly; when the workbench assembly transports the substrate after glue dispensing to the mounting area and the turntable body slides into the working area of ​​the main head assembly, the main head assembly picks up the chip of the turntable body and bonds it to the substrate.

[0006] Preferably, the crystal bonding equipment also includes an upward-looking positioning device installed inside the carrier platform, and the upward-looking positioning device includes a first upward-looking detector and a second upward-looking detector for identifying the bottom of the chip; the first upward-looking detector cooperates with the second binding head assembly, and the first upward-looking detector is arranged at one end of the second linear module close to the crystal supply device; the second upward-looking detector cooperates with the main binding head assembly, and the second upward-looking detector is arranged at the other end of the second linear module; when the second binding head assembly takes out the chip from the crystal supply device, the first upward-looking detector performs a first correction on the chip, and when the chip moves to the mounting area through the transfer table device and the main binding head assembly picks up the chip on the transfer table device, the second upward-looking detector performs a second correction on the chip.

[0007] Preferably, a first opening and a second opening are provided on the supporting platform; the feed end of the loading device extends through the first opening to be exposed to the outside of the supporting platform, and the discharge end of the unloading device extends through the second opening to be exposed to the outside of the supporting platform, and the feed end of the loading device and the discharge end of the unloading device are distributed at both ends of the supporting platform.

[0008] Preferably, the loading device includes a carrying component, a lifting component and a cylinder blocking component; the carrying component is passed through the first opening, the lifting component is arranged on a side of the carrying component close to the mounting device, and the cylinder blocking component is arranged at the bottom of the lifting component.

[0009] Preferably, the first head binding assembly includes a first robotic arm cooperating with the glue dipping device and a first downward-looking detector for identifying the glue dispensing position of the substrate, the first robotic arm and the first downward-looking detector are connected or relatively stationary, and the second head binding assembly includes a second robotic arm cooperating with the crystal supply device and a second downward-looking detector for identifying the chip adsorption position, the second robotic arm and the second downward-looking detector are connected or relatively stationary; the first robotic arm dips glue from the glue dipping device and dispenses glue to the substrate through the first downward-looking detector, the second robotic arm takes the chip from the crystal supply device through the second downward-looking detector and places it on the transfer table device, and the detection accuracy of the first downward-looking detector is lower than the detection accuracy of the second downward-looking detector.

[0010] Preferably, the crystal bonding equipment further comprises a material table device installed inside the supporting platform; the material table device is located between the transfer table device and the unloading device, and the material table cooperates with the main binding head assembly.

[0011] Preferably, the crystal bonding equipment also includes a suction nozzle rack device installed inside the supporting platform; the suction nozzle rack device is located between the material table device and the unloading device, the material table device is arranged on the side close to the transfer table device, and the suction nozzle rack device is arranged on the side close to the feed end of the unloading device.

[0012] Another technical solution of the present invention to solve the above-mentioned technical problems is to provide a crystal bonding method, which is applied to the above-mentioned crystal bonding equipment, and the crystal bonding method includes: providing a substrate, the loading device moves the substrate into the working area of ​​the first binding head assembly, and the first binding head assembly cooperates with the dipping device to perform glue treatment on the substrate; the crystal supply device provides a chip, and the second binding head assembly transports the chip to the transfer table device; the loading device moves the substrate to the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chip to the working area of ​​the main binding head assembly; the main binding head assembly mounts the chip on the transfer table device to the substrate; the unloading device receives the substrate after mounting from the mounting device.

[0013] Compared with the prior art, the die bonding device and method provided by the present invention have the following advantages:

[0014] 1. In the die bonding equipment provided by the embodiment of the present invention, the movable main head assembly, the first head assembly and the second head assembly are independently arranged to ensure that the main head assembly can achieve high-speed chip mounting, and avoid the gluing and chip removal processes of the other head assemblies affecting the chip mounting effect of the main head assembly; the first head assembly glues the substrate located on the loading device through the glue dipping device, and the second head assembly picks up the chip through the crystal supply device and transports the chip to the transfer table device. The gluing and chip removal processes are processed in parallel, which improves the overall efficiency of the die bonding; and the first head assembly is used to glue the substrate, and the second head assembly is used to pick up and place the chip. The main head assembly has relatively high precision requirements due to the need to mount the chip. The working areas of the first head assembly, the second head assembly and the main head assembly are separated, and the precision requirements for the first head assembly and the second head assembly are relatively low, which saves costs.

[0015] It can be understood that the internal layout of the carrier is compact. When the substrate after glue dispensing is transported to the mounting area for mounting, the loading device can receive a new substrate to be processed for glue dispensing again, and wait for the previous substrate after glue dispensing to complete mounting; the transfer table device transports the chip to the mounting area, and the main binding head assembly takes away the chip, and then the new chip can be received from the crystal supply device again; the processes of glue dispensing and chip removal in the embodiment of the present invention do not affect each other, and the overall efficiency of the crystal bonding equipment is further improved through the parallel design of the assembly line.

[0016] 2. In the die bonding equipment provided in an embodiment of the present invention, the workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device. Through this layout, unnecessary time occupied by the substrate during transportation can be saved, further improving the efficiency of chip mounting to the substrate.

[0017] 3. In the die bonding equipment provided by the embodiment of the present invention, the transfer table device can quickly and stably transfer chips, reduce the waiting time for placement, and improve production efficiency.

[0018] It can be understood that when the turntable body slides into the working area of ​​the second head binding assembly, the second head binding assembly picks up the chip on the crystal supply device and places it on the turntable body; when the turntable body slides into the working area of ​​the main head binding assembly, the main head binding assembly picks up the chip on the turntable body and mounts it on the substrate; wherein, the second linear module is arranged in parallel with the first linear module, which can realize parallel operation while reducing the overall volume of the crystal bonding equipment.

[0019] 4. In the die bonding equipment provided by the embodiment of the present invention, when the second binding head assembly takes out the chip from the die supply device, the first upward-looking detector performs the first correction on the chip. When the chip is moved to the mounting area through the turntable device and the main binding head assembly takes up the chip on the turntable device, the second upward-looking detector performs the second correction on the chip. The first upward-looking detector and the second upward-looking detector can identify the bottom of the chip. The two corrections can greatly improve the accuracy of chip mounting, ensuring that the main binding head assembly can achieve high-precision mounting of the chip. Multiple corrections can avoid the use of a higher-precision upward-looking detector, thereby reducing the cost of the die bonding equipment.

[0020] 5. In the die bonding equipment provided in the embodiment of the present invention, a first opening and a second opening are provided at opposite ends of the carrier platform, and the feed end of the loading device and the discharge end of the unloading device extend through the first opening and the second opening to be exposed to the outside of the carrier platform respectively. Through this design, a device for transmitting the substrate to be processed and taking away the finished substrate after the mounting is completed can be connected to each end; by incorporating the die bonding equipment into the corresponding production line, it is beneficial to the assembly of the production line and the dynamic adjustment of the production line.

[0021] 6. In the die bonding equipment provided by the embodiment of the present invention, the carrying assembly allows the substrate to be processed to move through, the lifting assembly can lift the substrate and move the substrate to the mounting device, and the lifting action of the lifting assembly can be controlled by the cylinder blocking assembly.

[0022] 7. In the crystal bonding equipment provided by the embodiment of the present invention, the first robot arm takes glue from the dipping device and then performs glue dispensing operation on the substrate through the first downward-looking detector, and the second robot arm takes the chip from the crystal supply device through the second downward-looking detector and places it on the transfer table device; by setting two downward-looking detectors to realize the separate operations of dipping glue and dispensing glue by the first binding head assembly and taking and placing chips by the second binding head assembly, the corresponding downward-looking detectors can be adaptively configured according to the detection accuracy required in the actual operation of different processes, which can reduce costs and improve detection efficiency.

[0023] 8. In the die bonding equipment provided in the embodiment of the present invention, different types of chips transported by the transfer table device can be placed on the material table device to realize multi-chip mounting; when the second binding head assembly takes the chip from the crystal supply device and places it on the transfer table device, the main binding head assembly can absorb the chip on the material table device for mounting to improve the mounting efficiency.

[0024] 9. In the die bonding equipment provided in the embodiment of the present invention, a nozzle holder device is provided to enable replacement of various types of nozzles.

[0025] 10. An embodiment of the present invention also provides a die bonding method, which is applied to the above-mentioned die bonding equipment. The die bonding method includes: providing a substrate, a loading device moves the substrate into the working area of ​​a first binding head assembly, and the first binding head assembly cooperates with a glue dipping device to perform glue dispensing on the substrate; a crystal supply device provides a chip, and a second binding head assembly transports the chip to a turntable device; a loading device moves the substrate to a mounting device, and the mounting device and the turntable device respectively move the substrate and the chip to the working area of ​​a main binding head assembly; the main binding head assembly mounts the chip on the turntable device to the substrate; and a unloading device receives the substrate after mounting from the mounting device.

[0026] It should be noted that this die bonding method has the same beneficial effects as the above-mentioned die bonding equipment, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 This is a schematic diagram of the overall framework of the die bonding equipment according to an embodiment of the present invention. Figure 1 .

[0029] Figure 2 This is a schematic diagram of the overall framework of the die bonding equipment according to an embodiment of the present invention. Figure 2 .

[0030] Figure 3 It is a structural schematic diagram of a mounting device of a die bonding device according to an embodiment of the present invention.

[0031] Figure 4 It is a structural schematic diagram of the turntable device of the crystal bonding equipment according to an embodiment of the present invention.

[0032] Figure 5 This is a schematic diagram of the overall framework of the die bonding equipment according to an embodiment of the present invention. Figure 3 .

[0033] Figure 6 It is a schematic diagram of the framework of the top-view positioning device of the die-bonding equipment according to an embodiment of the present invention.

[0034] Figure 7 It is a structural schematic diagram of a loading device of a crystal bonding device according to an embodiment of the present invention.

[0035] Figure 8 It is a schematic diagram of the framework of the first head binding assembly in the die bonding equipment according to an embodiment of the present invention.

[0036] Figure 9 It is a schematic diagram of the framework of the second head binding assembly in the die bonding equipment according to an embodiment of the present invention.

[0037] Figure 10 It is a structural schematic diagram of the material table device of the crystal bonding equipment according to an embodiment of the present invention.

[0038] Figure 11 It is a structural schematic diagram of a nozzle holder device of a die bonding device according to an embodiment of the present invention.

[0039] Figure 12 It is a schematic flow chart of a die bonding method according to an embodiment of the present invention.

[0040] Description of the accompanying drawings:

[0041] 100. Die bonding equipment;

[0042] 1. Carrying platform; 11. Main head-binding assembly; 12. First head-binding assembly; 121. First robotic arm; 122. First downward-looking detector; 13. Second head-binding assembly; 131. Second robotic arm; 132. Second downward-looking detector; 14. First opening; 15. Second opening;

[0043] 2. Loading device; 21. Carrying assembly; 22. Lifting assembly; 23. Cylinder blocking assembly; 3. Unloading device; 4. Mounting device; 41. Workbench assembly; 42. First linear module; 43. First drag chain; 5. Gluing device; 6. Turntable assembly; 61. Turntable body; 62. Second linear module; 63. Second drag chain;

[0044] 7. Crystal supply device; 8. Upward positioning device; 81. First upward detector; 82. Second upward detector; 9. Material table device; 91. Material table body; 92. First pillar; 93. First base; 10. Nozzle holder device; 101. Nozzle holder body; 1010. Accommodating slot; 102. Second pillar; 103. Second base. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0047] It should be noted that the terms "first" and "second" in the description and claims of the present invention are used to distinguish different objects rather than to describe a specific order.

[0048] In the present invention, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the present invention and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0049] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0050] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0051] See also Figure 1, an embodiment of the present invention provides a crystal bonding device 100, which includes a carrier platform 1 and a loading device 2, a unloading device 3, a mounting device 4, a dipping device 5, a turntable device 6 and a crystal supply device 7 installed inside the carrier platform 1; the loading device 2 and the unloading device 3 are arranged parallel to each other at opposite ends of the carrier platform 1, the mounting device 4 is arranged between the discharge end of the loading device 2 and the feed end of the unloading device 3, the dipping device 5 is located on one side of the loading device 2, and the dipping device 5 and the turntable device 6 are respectively arranged on both sides of the mounting device 4, and the crystal supply device 7 is located on the side of the turntable device 6 away from the mounting device 4; a movable main binding head assembly 11, a first binding head assembly 12 and a second binding head assembly 13 are provided inside the carrier platform 1, the main binding head assembly 11 is arranged on one side of the unloading device 3, the first binding head assembly 12 is arranged on one side of the loading device 2, and the second binding head assembly 13 is arranged on one side of the crystal supply device 7.

[0052] The die bonding device 100 provided in the embodiment of the present invention can be used in the semiconductor industry to bond chips to substrates after glue dispensing, thereby realizing glue process application; the die bonding device 100 can place components at high speed to complete a series of key steps such as positioning, alignment and mounting. It is an indispensable device in the integrated circuit packaging process and is also the most important link in semiconductor packaging.

[0053] It should be noted that the movable main binding head assembly 11, the first binding head assembly 12 and the second binding head assembly 13 are independently arranged, which can ensure that the main binding head assembly 11 can achieve high-speed chip mounting and avoid the glue dipping and chip removal processes of the other binding heads affecting the chip mounting effect of the main binding head assembly 11.

[0054] Furthermore, the first head binding component 12 dispenses glue on the substrate located on the loading device 2 through the glue dipping device 5, and the second head binding component 13 picks up the chip through the crystal supply device 7 and transports the chip to the transfer table device 6. The processes of glue dipping and chip removal are processed in parallel, thereby improving the overall efficiency of crystal bonding.

[0055] The crystal bonding equipment 100 of an embodiment of the present invention separates the first head binding assembly 12, the second head binding assembly 13 and the main head binding assembly 11, and arranges them in different areas. The working areas of the main head binding assembly 11, the first head binding assembly 12 and the second head binding assembly 13 do not overlap. Through this design, on the one hand, it can avoid the mutual influence between the head binding assemblies during work, thereby improving the overall efficiency of crystal bonding.

[0056] On the other hand, the first head assembly 12 is used for dispensing glue on the substrate, and the second head assembly 13 is used for taking and placing chips. The main head assembly has relatively high requirements for precision due to the need to mount chips. Therefore, the first head assembly 12 and the second head assembly 13 are separated from the working area of ​​the main head assembly 11. The precision requirements for the first head assembly 12 and the second head assembly 13 are relatively low, which also saves costs while ensuring the precision of the main head assembly 11.

[0057] It can be understood that the internal layout of the supporting platform 1 is compact, and the supporting platform 1 is used to install and fix the loading device 2, the unloading device 3, the mounting device 4, the glue dipping device 5, the turntable device 6, the crystal supply device 7 and the movable main head assembly 11, the first head assembly 12 and the second head assembly 13, wherein the mounting device 4 of this embodiment is arranged parallel to the turntable device 6.

[0058] Specifically, Figure 2 The figure shows the motion range of the first head assembly 12, the second head assembly 13 and the main head assembly 11; the first head assembly 12 is arranged on a side close to the loading device 2 and the glue dipping device 5. When the substrate is located at the loading device 2, the first head assembly 12 dips glue in the glue dipping device 5 and applies it on the substrate; the second head assembly 13 is arranged on a side close to the crystal supply device 7 and the turntable device 6. When the chip is located at the crystal supply device 7, the second head assembly 13 picks up the chip and places it on the turntable device 6, and the turntable device 6 transports the chip to the mounting area; the main head assembly 11 is arranged on a side close to the mounting device 4 and the unloading device 3. After the glue is dispensed, the substrate moves to the mounting device 4 through the discharge end of the loading device 2. The mounting device 4 also transports the substrate to the mounting area. The main head assembly 11 picks up the chip on the turntable device 6 and bonds it to the substrate to complete the mounting step.

[0059] It should be further explained that inside the carrier 1, when the substrate after glue application is transported to the mounting area for mounting, the loading device 2 can receive a new substrate to be processed for glue application again, and wait for the previous substrate after glue application to complete mounting; the transfer table device 6 transports the chip to the mounting area, and after the main binding head assembly 11 takes away the chip, it can receive a new chip from the crystal supply device 7 again.

[0060] The processes of dipping and dispensing glue and removing chips in the embodiment of the present invention do not affect each other. Through the parallel design of the assembly line, the overall efficiency of the die bonding equipment 100 is further improved to solve the technical problems of the existing die bonding equipment being bulky and having low die bonding efficiency.

[0061] See also Figure 1 and Figure 3The placement device 4 includes a workbench assembly 41, a first linear module 42 and a first drag chain 43; the workbench assembly 41 can slide in the length direction of the first linear module 42, so that the workbench assembly 41 can slide to correspond to the discharge end of the loading device 2 or the feed end of the unloading device 3, and the first drag chain 43 is arranged on the side of the first linear module 42.

[0062] Specifically, when the workbench assembly 41 slides to correspond to the discharge end of the loading device 2, the workbench assembly 41 can receive the substrate after the dispensing process is completed from the loading device 2; when the first linear module 42 is running, it can drive the workbench assembly 41 to slide to correspond to the feed end of the unloading device 3. When the main binding head assembly 11 completes the mounting operation, the unloading device 3 receives the chip after the mounting process.

[0063] It can be understood that the workbench assembly 41 can slide relative to the first linear module 42. The first linear module 42 serves as the hub, and its two ends correspond to the discharge end of the loading device 2 and the feed end of the unloading device 3 respectively. Through this layout, unnecessary time occupied by the substrate during transportation can be saved, further improving the efficiency of chip mounting to the substrate.

[0064] During operation, the first linear module 42 needs to be connected with cables and pipelines to transmit power and data. In the embodiment of the present invention, the cables and pipelines of the first linear module 42 are fixed in the first drag chain 43. It can be understood that the drag chain can wrap these cables and pipelines in an orderly manner to play a protective role and prevent the cables and pipelines from being pulled, damaged or exposed to the external environment during the movement of the first linear module 42, causing safety hazards.

[0065] It should be noted that the use of a drag chain can significantly improve the operating stability of the first linear module 42. By fixing the cables and pipelines in the first drag chain 43, the interference and resistance that may be generated during their movement can also be reduced, thereby making the movement of the first linear module 42 more stable and reliable.

[0066] The first linear module 42 of the embodiment of the present invention is a key component of the automation equipment, and its performance will directly affect the operating efficiency and stability of the entire crystal bonding equipment 100; by combining the first linear module 42 with the first drag chain 43, it can not only protect cables and pipelines, but also prevent foreign objects from entering, thereby improving the safety of the crystal bonding equipment 100 and extending the service life of the first linear module 42. In addition, it can also reduce energy loss and improve the overall performance of the crystal bonding equipment 100.

[0067] See also Figure 2 、 Figure 3 and Figure 4The turntable device 6 includes a turntable body 61, a second linear module 62 and a second drag chain 63; the turntable body 61 can slide in the length direction of the second linear module 62, so that the turntable body 61 can slide into the working area of ​​the second binding head assembly 13 or the working area of ​​the main binding head assembly 11; the second linear module 62 is arranged parallel to the first linear module 42, and the second drag chain 63 is arranged on the side of the second linear module 62.

[0068] It should be noted that in the turntable device 6 of the embodiment of the present invention, a vacuum adsorption hole is provided on the turntable body 61, which is used to fix the chip when the second binding head assembly 13 takes the chip and places it on the turntable body 61. The crystal bonding equipment 100 can quickly and stably transfer the chip by using the turntable device 6, reduce the waiting time for mounting, and improve production efficiency.

[0069] Specifically, when the turntable body 61 slides into the working area of ​​the second head binding assembly 13, the turntable body 61 can receive the chip from the crystal supply device 7; when the second linear module 62 is running, it can drive the turntable body 61 to slide into the working area of ​​the main head binding assembly 11, and the main head binding assembly 11 will take the chip on the turntable body 61 for mounting.

[0070] It can be understood that when the turntable body 61 slides into the working area of ​​the second head binding assembly 13, the second head binding assembly 13 picks up the chip on the crystal supply device 7 and places it on the turntable body 61. When the turntable body 61 slides into the working area of ​​the main head binding assembly 11, the main head binding assembly 11 picks up the chip on the turntable body 61 and mounts it on the substrate; the second linear module 62 is arranged in parallel with the first linear module 42, which can reduce the overall volume of the crystal bonding equipment 100 while realizing parallel work to improve the overall work efficiency.

[0071] Similar to the first linear module 42, the second linear module 62 also needs cables and pipelines to be connected to transmit power and data during operation. In the embodiment of the present invention, the cables and pipelines of the second linear module 62 are also fixed in the second drag chain 63. By setting the second drag chain 63, the cables and pipelines of the second linear module 62 can be protected, which significantly improves the operating stability of the second linear module 62 and extends the service life of the second linear module 62. The beneficial effects are the same as those achieved by the cooperation of the first linear module 42 and the first drag chain 43, and will not be repeated here.

[0072] Drag chains are widely used and play an indispensable role in various automation equipment, such as industrial robots, CNC equipment, and automated production lines. They not only protect the safe operation of lines but also improve the reliability and service life of automation equipment. By properly selecting drag chain materials and installation methods, they can meet the needs of different automation equipment and improve the efficiency and safety of the entire mechanical system.

[0073] See also Figure 4 、 Figure 5 and Figure 6 The die-bonding device 100 further includes an upward-looking positioning device 8 installed inside the carrier 1 . The upward-looking positioning device 8 includes a first upward-looking detector 81 and a second upward-looking detector 82 .

[0074] Among them, the first upward viewing detector 81 cooperates with the second binding head assembly 13, and the first upward viewing detector 81 is arranged at one end of the second linear module 62 close to the crystal supply device 7; the second upward viewing detector 82 cooperates with the main binding head assembly 11, and the second upward viewing detector 82 is arranged at the other end of the second linear module 62.

[0075] It can be understood that when the second head binding assembly 13 takes out the chip from the crystal supply device 7, the first upward-looking detector 81 performs the first correction on the chip; when the chip moves to the mounting area through the transfer table device 6 and the main head binding assembly 11 picks up the chip from the transfer table device 6, the second upward-looking detector 82 performs the second correction on the chip.

[0076] It should be noted that the first upward-looking detector 81 and the second upward-looking detector 82 can identify the bottom of the chip. Through two corrections, the accuracy of chip mounting can be greatly improved, ensuring that the main binding head assembly 11 can achieve high-precision mounting of the chip. Moreover, through multiple corrections, the use of a higher-precision upward-looking detector can be avoided, thereby reducing the cost of the die bonding equipment 100.

[0077] In some embodiments, the upward-looking detector is an upward-looking CCD (Charge Coupled Device). CCD is a semiconductor device that can convert optical images into digital signals to achieve operations such as image acquisition, storage, and transmission processing.

[0078] See also Figure 5 A first opening 14 and a second opening 15 are provided on the supporting platform 1; the feeding end of the loading device 2 extends through the first opening 14 to be exposed to the outside of the supporting platform 1, and the discharging end of the unloading device 3 extends through the second opening 15 to be exposed to the outside of the supporting platform 1, and the feeding end of the loading device 2 and the discharging end of the unloading device 3 are distributed at both ends of the supporting platform 1.

[0079] It can be understood that a first opening 14 and a second opening 15 are provided at opposite ends of the carrier platform 1, and the feed end of the loading device 2 and the discharge end of the unloading device 3 extend through the first opening 14 and the second opening 15 to be exposed to the outside of the carrier platform 1 respectively. Through this design, a device for transmitting the substrate to be processed and taking away the finished substrate after the mounting is completed can be connected to each end.

[0080] It should be noted that, by incorporating the die-bonding device 100 into a corresponding production line, it is beneficial to both the assembly of the production line and the dynamic adjustment of the production line.

[0081] In an embodiment of the present invention, the first opening 14 and the second opening 15 are respectively located at opposite ends of the supporting platform 1, and the first opening 14 and the second opening 15 are staggered to stagger the loading device 2 and the unloading device 3, which is adapted to the independent layout between the main head binding assembly 11, the first head binding assembly 12 and the second head binding assembly 13, so that the layout inside the supporting platform 1 is more compact and has higher continuity, further improving the efficiency of the crystal bonding process.

[0082] See also Figure 5 and Figure 7 The loading device 2 includes a carrying component 21, a lifting component 22 and a cylinder blocking component 23; it can be understood that the carrying component 21 is used to place the substrate, the first binding head component 12 dips glue in the glue dipping device 5 and applies the glue to the substrate on the carrying component 21, and the carrying component 21 can also be used for the substrate to move through after the glue is dispensed. The lifting component 22 can lift the substrate and move the substrate to the mounting device 4, and the lifting action of the lifting component 22 can be controlled by the cylinder blocking component 23.

[0083] Furthermore, the carrying component 21 is passed through the first opening 14 , the lifting component 22 is arranged on a side of the carrying component 21 close to the mounting device 4 , and the cylinder blocking component 23 is arranged at the bottom of the lifting component 22 .

[0084] It should be noted that the two ends of the supporting component 21 are respectively the feed end and the discharge end of the loading device 2, wherein the discharge end of the loading device 2 corresponds to the side of the supporting component 21 close to the mounting device 4. When there is a substrate on the feed end of the loading device 2, the supporting component 21 can transport the substrate, and during the transportation process, it moves through the first opening 14 to the inside of the supporting platform 1.

[0085] In some embodiments, the cylinder blocking assembly 23 is arranged at the bottom of the lifting assembly 22, and cooperates with the lifting assembly 22 to lift the substrate and move it to the mounting device 4; the cylinder blocking assembly 23 can be driven by air pressure to control or prevent the movement of the object. Its main function in the embodiment of the present invention is to ensure that the substrate can stay accurately at the predetermined position to prevent it from continuing to move and affecting the steps of the mounting process.

[0086] It can be understood that the cylinder blocking assembly 23 is a device widely used in automated production lines and mechanical equipment. Its working principle is: when compressed air flows into the upper part of the cylinder through the control valve, it will push the piston to move downward, thereby causing the gear lever to drop, thereby releasing the previously blocked tooling plate (that is, the substrate in the embodiment of the present invention); conversely, when the control valve releases the gas, the piston will return to its original position under the action of the spring force, and prepare to block the next tooling plate (that is, after moving the previous substrate to the mounting device 4, prepare to block the new substrate), so as to ensure that the substrates placed on the loading device 2 of this embodiment can be controlled in sequence and accurately.

[0087] See also Figure 5 、 Figure 8 and Figure 9 The first head binding assembly 12 includes a first robotic arm 121 and a first downward-looking detector 122 that cooperate with the dipping device 5 , and the second head binding assembly 13 includes a second robotic arm 131 and a second downward-looking detector 132 that cooperate with the crystal supply device 7 .

[0088] It can be understood that the first robot arm 121 takes glue from the dipping device 5 and performs glue dispensing operation on the substrate through the first downward-looking detector 122, and the second robot arm 131 takes the chip from the crystal supply device 7 through the second downward-looking detector 132 and places it on the transfer table device 6.

[0089] In some embodiments, the first downward-looking detector 122 is connected to the first robotic arm 121, or the first downward-looking detector 122 and the first robotic arm 121 are relatively stationary, that is, the first downward-looking detector 122 also moves during the movement of the first robotic arm 121; the first robotic arm 121 moves to the top of the substrate after the glue dipping device 5 is dipped in glue, and the glue dispensing position on the substrate is identified by the first downward-looking detector 122. After adjusting to the glue dispensing position, the first robotic arm 121 performs glue dispensing operations on the substrate.

[0090] In some embodiments, the second downward-looking detector 132 is connected to the second robotic arm 131, or the second downward-looking detector 132 and the second robotic arm 131 are relatively stationary; when the second robotic arm 131 is ready to take the chip from the crystal supply device 7, the second downward-looking detector 132 identifies the adsorption position of the second robotic arm 131 on the crystal supply device 7 where the second robotic arm 131 picks up the chip. After adjusting to the adsorption position, the second robotic arm 131 picks up the chip and places it on the transfer table device 6.

[0091] It should be noted that the first binding head assembly 12 and the second binding head assembly 13 of the embodiment of the present invention are independent of each other, and the separate operations of dipping glue and taking and placing chips are achieved by respectively providing a first downward-looking detector 122 and a second downward-looking detector 132 .

[0092] In this embodiment, the detection accuracy of the first downward-looking detector 122 is lower than the detection accuracy of the second downward-looking detector 132; it can be understood that the downward-looking detector can be adaptively configured according to the detection accuracy required in the actual operation of different processes, avoiding the use of high-precision downward-looking detectors to identify processes with lower precision requirements such as dipping and dispensing glue, and picking and placing chips, thereby improving detection efficiency while reducing costs.

[0093] See also Figure 5 、 Figure 10 and Figure 11 As an optional embodiment, the crystal bonding equipment 100 also includes a material table device 9 installed inside the supporting platform 1; the material table device 9 is located between the transfer table device 6 and the unloading device 3, and the material table cooperates with the main binding head assembly 11.

[0094] In some embodiments, the material table device 9 includes a material table body 91, a first support 92, and a first base 93. The first base 93 is mounted and fixed to the carrier 1, and the first support 92 supports the material table body 91. It can be understood that different types of chips transported by the transfer table device 6 can be placed on the material table body 91 of the material table device 9 to achieve multi-chip placement.

[0095] It should be noted that when the second head assembly 13 takes the chip from the crystal supply device 7 and places it on the transfer table device 6, the main head assembly 11 can mount the chip by sucking it from the material table device 9 to improve the efficiency of mounting the chip to the substrate.

[0096] As another optional embodiment, the crystal bonding equipment 100 also includes a suction nozzle rack device 10 installed inside the supporting platform 1; the suction nozzle rack device 10 is located between the material table device 9 and the unloading device 3, the material table device 9 is arranged on the side close to the transfer table device 6, and the suction nozzle rack device 10 is arranged on the side close to the feed end of the unloading device 3.

[0097] In some embodiments, the nozzle holder device 10 includes a nozzle holder body 101, a second pillar 102 and a second base 103. The second base 103 is mounted and fixed on the supporting platform 1, and the second pillar 102 supports the nozzle holder body 101. The nozzle holder body 101 is provided with a receiving groove 1010 for accommodating vacuum nozzles of different sizes. It can be understood that the nozzle holder device 10 is a device for replacing vacuum nozzles. The working end of the main head binding assembly 11 can be detachably connected to nozzles of different sizes, and the main head binding assembly 11 can replace the vacuum nozzle through the nozzle holder device 10. The method can be automatically replaced or manually replaced. The specific method can be set according to actual conditions. The embodiment of the present invention can meet the compatibility of replacing vacuum nozzles of different sizes by providing the nozzle holder device 10.

[0098] See also Figure 12 The embodiment of the present invention further provides a die bonding method, which is applied to the above-mentioned die bonding device. The die bonding method includes:

[0099] S1: Provide a substrate, and the loading device moves the substrate to the working area of ​​the first binding head assembly. The first binding head assembly cooperates with the glue dipping device to perform glue dispensing on the substrate;

[0100] S2: The wafer supply device provides chips, and the second binding head assembly transports the chips to the transfer table device;

[0101] S3: The loading device moves the substrate to the placement device, and the placement device and the transfer table device respectively move the substrate and chip to the working area of ​​the main binding head assembly;

[0102] S4: The main head assembly mounts the chip on the transfer table device to the substrate;

[0103] S5: The unloading device receives the substrate after placement from the placement device.

[0104] It can be understood that the die bonding equipment provided in the embodiment of the present invention integrates the processes of dipping glue, dispensing glue, and mounting required for chip mounting, realizing a streamlined mounting process from loading, dipping glue, dispensing glue, taking chips, mounting, and unloading, thereby improving the efficiency of mounting.

[0105] In this embodiment, the main binding head assembly, the first binding head assembly and the second binding head assembly are independently arranged to split the processes required for chip mounting, so that the die bonding equipment can execute parallel processing processes in different areas, greatly improving work efficiency.

[0106] Specifically, in step S1, the first head binding assembly is arranged on a side close to the loading device and the glue dipping device. When the substrate is located at the loading device, the loading device moves the substrate into the working area of ​​the first head binding assembly, and the first head binding assembly dips glue in the glue dipping device and applies it on the substrate.

[0107] Furthermore, in step S2, the second head binding assembly is arranged on a side close to the crystal supply device and the turntable device. When the chip is located at the crystal supply device, the second head binding assembly picks up the chip and places it on the turntable device.

[0108] In steps S3 and S4, the main binding head assembly is arranged on a side close to the mounting device and the unloading device. The substrate after the dispensing process is moved to the mounting device through the discharge end of the loading device. The mounting device also transports the substrate to the mounting area. The mounting area in the embodiment of the present invention is also the working area of ​​the main binding head assembly. The main binding head assembly picks up the chip on the transfer table device and bonds it to the substrate to complete the mounting step.

[0109] It should be noted that the die bonding method provided by the embodiment of the present invention has the same beneficial effects as the above-mentioned die bonding equipment. When the substrate after glue application is transported to the working area of ​​the main head assembly for mounting, the loading device can receive a new substrate to be processed for glue application again, and wait for the previous substrate after glue application to be completed. The transfer table device can receive a new chip from the die feeding device after the main head assembly removes the chip after transporting the chip to the mounting area. The glue application and chip removal processes of the embodiment of the present invention do not affect each other, and the overall efficiency is further improved through the parallel design of the assembly line.

[0110] Among them, in the mounting process of step S4, the main head assembly picks up the chip on the transfer table device in its working area and mounts the chip to the substrate. By setting three independently movable head assemblies, the main head assembly is ensured to achieve high-speed mounting of the chip.

[0111] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A die bonding device, characterized in that: The die bonding equipment includes a carrier platform and a loading device, an unloading device, a mounting device, a glue dipping device, a transfer table device and a die feeding device installed inside the carrier platform; The loading device and the unloading device are arranged parallel to each other at opposite ends of the supporting platform, the placement device is arranged between the discharge end of the loading device and the feed end of the unloading device, the glue dipping device is located on one side of the loading device, and the glue dipping device and the transfer table device are respectively arranged on both sides of the placement device, and the crystal feeding device is located on the side of the transfer table device away from the placement device; The interior of the carrier is provided with a movable main binding head assembly, a first binding head assembly and a second binding head assembly, the main binding head assembly is arranged on one side of the unloading device, the first binding head assembly is arranged on one side of the loading device for dispensing glue on the substrate, and the second binding head assembly is arranged on one side of the wafer feeding device for taking and placing chips, and the working areas of the main binding head assembly, the first binding head assembly and the second binding head assembly do not overlap; The placement device includes a workbench assembly and a first linear module, and the transfer table device includes a transfer table body and a second linear module, wherein the second linear module is arranged parallel to the first linear module; The workbench assembly can slide in the length direction of the first linear module, so that the workbench assembly can slide to correspond to the discharge end of the loading device or the feed end of the unloading device; the turntable body can slide in the length direction of the second linear module, so that the turntable body can slide into the working area of ​​the second binding head assembly or the working area of ​​the main binding head assembly; When the workbench assembly transports the glued substrate to the mounting area and the transfer table body slides into the working area of ​​the main binding head assembly, the main binding head assembly picks up the chip of the transfer table body and bonds it to the substrate.

2. The die bonding device according to claim 1, wherein: The die bonding device further includes an upward-looking positioning device installed inside the carrier, the upward-looking positioning device including a first upward-looking detector and a second upward-looking detector for identifying the bottom of the chip; The first upward-viewing detector cooperates with the second binding head assembly, and the first upward-viewing detector is arranged at one end of the second linear module close to the crystal feeding device; The second upward-looking detector cooperates with the main binding head assembly, and the second upward-looking detector is arranged at the other end of the second linear module; When the second binding head assembly takes out the chip from the crystal supply device, the first upward-looking detector performs a first correction on the chip. When the chip moves to the mounting area through the transfer table device and the main binding head assembly picks up the chip on the transfer table device, the second upward-looking detector performs a second correction on the chip.

3. The die bonding device according to claim 1, wherein: The supporting platform is provided with a first opening and a second opening; The feed end of the loading device extends through the first opening to be exposed to the outside of the supporting platform, and the discharge end of the unloading device extends through the second opening to be exposed to the outside of the supporting platform, and the feed end of the loading device and the discharge end of the unloading device are distributed at both ends of the supporting platform.

4. The die bonding device according to claim 3, wherein: The feeding device includes a bearing assembly, a lifting assembly and a cylinder blocking assembly; The bearing assembly is passed through the first opening, the lifting assembly is arranged on a side of the bearing assembly close to the mounting device, and the cylinder blocking assembly is arranged at the bottom of the lifting assembly.

5. The die bonding device according to claim 1, wherein: The first binding head assembly includes a first robotic arm cooperating with the glue dipping device and a first downward-looking detector for identifying a glue dispensing position on a substrate, the first robotic arm and the first downward-looking detector being connected or relatively stationary, and the second binding head assembly includes a second robotic arm cooperating with the wafer feeding device and a second downward-looking detector for identifying a chip adsorption position, the second robotic arm and the second downward-looking detector being connected or relatively stationary; The first robot arm takes glue from the dipping device and dispenses glue to the substrate through the first downward-looking detector. The second robot arm takes the chip from the crystal supply device and places it on the transfer table device through the second downward-looking detector. The detection accuracy of the first downward-looking detector is lower than that of the second downward-looking detector.

6. The die bonding device according to claim 1, wherein: The die bonding equipment further includes a material table device installed inside the carrying platform; The material table device is located between the transfer table device and the unloading device, and the material table cooperates with the main binding head assembly.

7. The die bonding device according to claim 6, wherein: The die bonding equipment further comprises a nozzle holder device installed inside the carrier platform; The suction nozzle holder device is located between the material table device and the unloading device. The material table device is arranged on a side close to the transfer table device, and the suction nozzle holder device is arranged on a side close to the feeding end of the unloading device.

8. A die bonding method, applied to the die bonding device according to any one of claims 1 to 7, characterized in that: The die bonding method comprises: Providing a substrate, the loading device moves the substrate into the working area of ​​the first binding head assembly, and the first binding head assembly cooperates with the glue dipping device to perform glue dispensing on the substrate; The wafer supply device provides chips, and the second binding head assembly transports the chips to the transfer table device; The loading device moves the substrate to the mounting device, and the mounting device and the transfer table device respectively move the substrate and the chip to the working area of ​​the main binding head assembly; The main binding head assembly mounts the chip on the transfer table device to the substrate; The unloading device receives the substrate after the mounting is completed from the mounting device.

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