Packaging structure and communication equipment

Abstract

The invention provides a packaging structure and communication equipment. The packaging structure comprises a substrate, a chip, a fixing piece, a first radiation structure and a first dielectric waveguide. For example, the chip can be a radio frequency chip, and the first radiation structure can be an antenna or other element with a signal emission function. The chip is fixed on the surface of the substrate, and the fixing piece is fixed on the surface of one side, deviating from the chip, of the substrate. A first cavity is formed in the fixing piece and penetrates through the fixing piece in the direction perpendicular to the surface of the substrate. The first radiation structure is located on the surface of the side, away from the chip, of the substrate, and at least part of the first radiation structure is located in the first cavity. And the end part of the first dielectric waveguide is inserted into the first cavity. The fixing piece can play a role in fixing the first dielectric waveguide and coupling high-frequency and high-speed signals, and the fixing piece is fixed on the surface of the substrate without occupying the space of a circuit board, so that the integration level of the packaging structure is relatively high, and high-density transmission of the high-frequency and high-speed signals can be conveniently realized.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a packaging structure and communication equipment. Background Art

[0002] With the rapid development of communication technology, communication equipment has an increasing demand for the transmission of high-frequency and high-speed transmission signals. For the transmission of high-frequency and high-speed signals, factors such as loss, group delay, and reliability need to be considered. High-frequency and high-speed signals are mainly transmitted between communication devices through dielectric waveguides. During the operation of the communication equipment, the radiating structure can couple the high-frequency and high-speed signals into the dielectric waveguide through the coupling structure. However, in the communication equipment of the related technology, the coupling structure needs to be fixed on the circuit board, which requires the installation structure and space to be reserved on the circuit board, which will take up a lot of board-level space, resulting in a low degree of integration of the communication equipment and difficulty in achieving high-density transmission of high-frequency and high-speed signals. Summary of the invention

[0003] The embodiments of the present application provide a packaging structure and a communication device to improve the integration of the communication device and achieve high-density transmission of high-frequency and high-speed signals.

[0004] In the first aspect, an embodiment of the present application provides a packaging structure, and the packaging structure in the embodiment of the present application may include: a substrate, a chip, a fixing member, a first radiation structure and a first dielectric waveguide. Exemplarily, the chip may be a radio frequency chip, and the first radiation structure may be an antenna or other element with a signal transmission function. The chip is fixed to the surface of the substrate, and the fixing member is fixed to the surface of the substrate on the side away from the chip. A first cavity is provided in the fixing member, and the first cavity passes through the fixing member in a direction perpendicular to the surface of the substrate. The first radiation structure is located on the surface of the substrate on the side away from the chip, and at least part of the first radiation structure is located in the first cavity. The end of the first dielectric waveguide is inserted into the first cavity.

[0005] In the packaging structure provided in the embodiment of the present application, a fixing member is arranged on the surface of the substrate, and a first cavity is arranged in the fixing member, and the end of the first dielectric waveguide is inserted into the first cavity. At least part of the first radiation structure is arranged in the first cavity, and the high-frequency and high-speed signal emitted by the first radiation structure can be radiated into the first cavity, and the high-frequency and high-speed signal is coupled to the first dielectric waveguide through the first cavity. In the embodiment of the present application, the fixing member can play the role of fixing the first dielectric waveguide and coupling the high-frequency and high-speed signal, and the fixing member is fixed to the surface of the substrate without occupying the space of the circuit board, so that the integration of the packaging structure is relatively high, which is convenient for realizing high-density transmission of high-frequency and high-speed signals.

[0006] Furthermore, a plurality of cavities may be provided in the fixture, so that more dielectric waveguides may be inserted into the fixture, further improving the transmission density of high-frequency and high-speed signals. Specifically, a second cavity may also be provided in the fixture, and the second cavity penetrates the fixture in a direction perpendicular to the surface of the substrate, and the packaging structure may also include: a second radiation structure and a second dielectric waveguide; the second radiation structure is located on the surface of the substrate away from the chip, and at least part of the second radiation structure is located in the second cavity; the end of the second dielectric waveguide is inserted into the second cavity. Similarly, a third cavity and a fourth cavity may also be provided in the fixture, and the packaging structure may also include: a third radiation structure, a fourth radiation structure, a third dielectric waveguide and a fourth dielectric waveguide. The specific implementation of each cavity may refer to the specific setting of the first cavity, the specific implementation of each radiation structure may refer to the specific setting of the first radiation structure, and the specific implementation of each dielectric waveguide may refer to the specific setting of the first dielectric waveguide, and the repetitions will not be repeated. In the specific implementation, the number of cavities, radiation structures, and dielectric waveguides may be set according to actual needs.

[0007] In an embodiment of the present application, the fixing member may include: a packaging cover plate and a dielectric waveguide base. The packaging cover plate is located between the substrate and the dielectric waveguide base, the packaging cover plate is fixed to the surface of the substrate, and the packaging cover plate is detachably connected to the dielectric waveguide base. During the installation process, the end of each dielectric waveguide can be first inserted into the corresponding cavity in the dielectric waveguide base, and then the dielectric waveguide base is connected to the packaging cover plate. In a specific implementation, one end of the dielectric waveguide can be inserted into one dielectric waveguide base, and the other end can be inserted into another dielectric waveguide base, so that the packaging structure is connected to other communication devices through the dielectric waveguide. Since the packaging cover plate is detachably connected to the dielectric waveguide base, it is convenient to replace the dielectric waveguide or the dielectric waveguide base during subsequent use, and the installation and maintenance costs are low.

[0008] In a possible implementation, the package cover plate and the dielectric waveguide base are snap-fitted and connected at the edge. In a specific implementation, a snap core and a snap cap that cooperate with each other can be provided at the edge of the package cover plate and the dielectric waveguide base, so that the dielectric waveguide base can be easily installed on the package cover plate, and the dielectric waveguide base can also be easily removed. Of course, in some cases, other methods can also be used to achieve a detachable connection between the package cover plate and the dielectric waveguide base.

[0009] In some embodiments of the present application, the surface of the encapsulation cover plate facing the dielectric waveguide base is provided with a first groove, and the surface of the dielectric waveguide base facing the encapsulation cover plate is provided with a first protrusion. The first groove and the first protrusion are located at the position between the first cavity and the second cavity. The encapsulation cover plate and the dielectric waveguide base are matched and installed through the first groove and the first protrusion. When the encapsulation cover plate and the dielectric waveguide base are connected to each other, the first protrusion is embedded into the first groove to strengthen the firmness between the encapsulation cover plate and the dielectric waveguide base. When the dielectric waveguide base is removed from the encapsulation cover plate, the first protrusion can be pulled out from the first groove. Thus, it is convenient to realize the detachable connection between the encapsulation cover plate and the dielectric waveguide base.

[0010] Of course, the positions of the first groove and the first protrusion can also be interchanged, that is, the surface of the encapsulation cover plate facing the dielectric waveguide base can be provided with a first protrusion, and the surface of the dielectric waveguide base facing the encapsulation cover plate is provided with a first groove. The first groove and the first protrusion are located at the position between the first cavity and the second cavity. The encapsulation cover plate and the dielectric waveguide base are matched and installed through the first groove and the first protrusion.

[0011] Similarly, at the position between other two adjacent cavities, matching protrusions and grooves can also be provided, which can be set with reference to the first protrusion and the first groove, and the repeated parts will not be elaborated here.

[0012] In a possible implementation manner, the encapsulation structure in the embodiments of the present application may further include: a sealant. The encapsulation cover plate is fixed to the surface of the substrate through the sealant. The sealant is located above the substrate and at the edge of the encapsulation cover plate. Exemplarily, the sealant can be a conductive adhesive. By using the sealant to fix the encapsulation cover plate on the surface of the substrate, the encapsulation cover plate can be directly fixed on the surface of the substrate without occupying additional space on the circuit board, which can save the space of the circuit board and improve the integration degree of the encapsulation structure. Of course, in some cases, other methods (such as welding) can also be used to fix the encapsulation cover plate on the surface of the substrate.

[0013] In a possible implementation manner, the encapsulation cover plate can be made of a metal material; or, the encapsulation cover plate can include: an organic material and a metallized treatment layer wrapping the organic material. That is to say, the surface of the encapsulation cover plate is made of a metal material. In this way, the shielding efficiency of the encapsulation cover plate is relatively high. When the high-frequency and high-speed signal emitted by the first radiation structure radiates into the first cavity, the encapsulation cover plate can play a good coupling role and can realize signal conversion with an ultra-wideband (>40%).

[0014] In a possible implementation manner, the dielectric waveguide base can include: a metal material or an organic material. Optionally, the surface of the dielectric waveguide base can be metallized, or the surface of the dielectric waveguide base can also not be metallized, as long as it can realize the function of fixing the dielectric waveguide.

[0015] In the embodiment of the present application, the first dielectric waveguide may include: a first cladding and a first core. The first cladding wraps the first core. The end of the first cladding is snap-fitted and fixed in the first cavity, and the end of the first core located in the first cavity protrudes from the end of the first cladding. That is to say, the end of the first core is not wrapped by the first cladding. Such a setting can expose the end of the first core in the first cavity, making it easier for high-frequency and high-speed signals to be coupled into the first core and improving the signal coupling effect.

[0016] Specifically, the end of the first core in the first cavity is located on the side of the encapsulation cover plate away from the substrate. That is to say, the end of the first core is at the position of the dielectric waveguide base. In this way, when the dielectric waveguide base is not connected to the encapsulation cover plate, the end of the first core does not protrude beyond the surface of the dielectric waveguide base, that is, the end of the first core is not exposed outside, thereby playing a role in protecting the first core and avoiding damage to the first core by external objects.

[0017] In a second aspect, the embodiment of the present application further provides a communication device. The communication device provided by the embodiment of the present application may include: an encapsulation structure and a circuit board, and the encapsulation structure is fixed on the surface of the circuit board. When specifically setting, one or more encapsulation structures may be provided on the surface of the circuit board according to actual needs. The communication device may further include: a control chip, a dielectric waveguide, a connector, and a plastic encapsulation layer. The encapsulation structure may be connected to the connector through the dielectric waveguide, and the plastic encapsulation layer wraps the encapsulation structure, the control chip, the dielectric waveguide, and the connector. During the operation of the communication device, the control chip may transmit high-frequency and high-speed signals to the encapsulation structure. After the encapsulation structure modulates and processes the high-frequency and high-speed signals, the high-frequency and high-speed signals are transmitted to other communication devices through the dielectric waveguide and the connector. Since the integration degree of the above-mentioned encapsulation structure in the embodiment of the present application is relatively high, the communication device including the above-mentioned encapsulation structure can achieve high-density transmission of high-frequency and high-speed signals. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of the communication device provided by the embodiment of the present application;

[0019] Figure 2 It is another schematic structural diagram of the communication device provided by the embodiment of the present application;

[0020] Figure 3 It is a schematic diagram of the connection relationship between the fixing member and the dielectric waveguide in the embodiment of the present application;

[0021] Figure 4 It is a partially enlarged schematic diagram of the encapsulation structure in the embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of the coupling effect of the encapsulation cover plate in the embodiment of the present application;

[0023] Figure 6 This is a simulation schematic diagram of dielectric waveguide coupling in the embodiments of the present application.

[0024] Reference numerals:

[0025] 100 - Communication device; 101 - Package structure; 102 - Circuit board; 103 - Control chip; 104 - Dielectric waveguide; 105 - Connector; 106 - Plastic encapsulation layer; 21 - Substrate; 22 - Chip; 23 - Fixing member; 231 - Package cover plate; 232 - Dielectric waveguide base; 241 - First radiation structure; 242 - Second radiation structure; 243 - Third radiation structure; 244 - Fourth radiation structure; 251 - First dielectric waveguide; 251a - First cladding; 251b - First core; 252 - Second dielectric waveguide; 253 - Third dielectric waveguide; 254 - Fourth dielectric waveguide; 26 - Sealant; 27 - Thermal interface material; U1 - First cavity; U2 - Second cavity; U3 - Third cavity; U4 - Fourth cavity; H - Heat dissipation via hole. Detailed implementation manners

[0026] In order to achieve high - density transmission of high - frequency and high - speed signals, the embodiments of the present application provide a package structure and a communication device. The package structure provided by the embodiments of the present application can be an antenna in package (AIP). The package structure in the embodiments of the present application can be applied to various communication devices such as terminal devices and network devices. Among them, the terminal device can be a mobile phone, a tablet computer (Pad), a computer with wireless transceiver function, a virtual reality (VR) terminal, an augmented reality (AR) terminal, etc. The network device can be a baseband unit (BBU), a radio network controller (RNC), a base station controller (BSC), a base transceiver station (BTS), etc.

[0027] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0028] It should be noted that the same reference numerals in the accompanying drawings of the present application denote the same or similar structures, and thus repeated descriptions thereof will be omitted. The words expressing positions and directions described in the present application are illustrative with reference to the accompanying drawings, but can be changed according to needs, and all changes made are included in the protection scope of the present application. The accompanying drawings of the present application are only used to illustrate the relative positional relationship and do not represent the actual ratio.

[0029] Figure 1 The following is a schematic structural diagram of the communication device provided by the embodiment of the present application. As Figure 1 shown, the communication device 100 provided by the embodiment of the present application may include: a package structure 101 and a circuit board 102, and the package structure 101 is fixed on the surface of the circuit board 102. When specifically setting, one or more package structures 101 may be provided on the surface of the circuit board 102 according to actual needs. The communication device 100 may further include: a control chip 103, a dielectric waveguide 104, a connector 105, and a plastic package layer 106. The package structure 101 may be connected to the connector 105 through the dielectric waveguide 104, and the plastic package layer 106 wraps the package structure 101, the control chip 103, the dielectric waveguide 104, and the connector 105. During the operation of the communication device 100, the control chip 103 may transmit high-frequency and high-speed signals to the package structure 101. After the package structure 101 modulates and processes the high-frequency and high-speed signals, the high-frequency and high-speed signals are transmitted to other communication devices 100 through the dielectric waveguide 104 and the connector 105.

[0030] Figure 2 The following is another schematic structural diagram of the communication device provided by the embodiment of the present application. As Figure 2 shown, the package structure 101 in the embodiment of the present application may include: a substrate 21, a chip 22, a fixing member 23, a first radiation structure 241, and a first dielectric waveguide 251. Exemplarily, the chip 22 may be a radio frequency chip, and the first radiation structure 241 may be an antenna or other elements having a signal transmitting function. The chip 22 is fixed on the surface of the substrate 21, and the fixing member 23 is fixed on the surface of the substrate 21 on the side facing away from the chip 22. A first cavity U1 is provided in the fixing member 23, and the first cavity U1 penetrates through the fixing member 23 in a direction perpendicular to the surface of the substrate 21. The first radiation structure 241 is located on the surface of the substrate 21 on the side facing away from the chip 22, and at least a part of the first radiation structure 241 is located in the first cavity U1. The end of the first dielectric waveguide 251 is inserted into the first cavity U1.

[0031] In the package structure 101 provided in the embodiment of the present application, a fixing member 23 is provided on the surface of the substrate 21, and a first cavity U1 is provided in the fixing member 23, and the end of the first dielectric waveguide 251 is inserted into the first cavity U1. At least a portion of the first radiation structure 241 is provided in the first cavity U1, and the high-frequency and high-speed signal emitted by the first radiation structure 241 can be radiated into the first cavity U1, and the high-frequency and high-speed signal is coupled to the first dielectric waveguide 251 through the first cavity U1. In the embodiment of the present application, the fixing member 23 can play the role of fixing the first dielectric waveguide 251 and coupling the high-frequency and high-speed signal, and the fixing member 23 is fixed to the surface of the substrate 21, without occupying the space of the circuit board 102, so that the integration of the package structure 101 is relatively high, and it is convenient to realize the high-density transmission of high-frequency and high-speed signals.

[0032] Further, continue to refer to Figure 2 , multiple cavities can be set in the fixing member 23, so that more dielectric waveguides can be inserted into the fixing member 23, further improving the transmission density of high-frequency and high-speed signals. Specifically, a second cavity U2 can also be set in the fixing member 23, and the second cavity U2 penetrates the fixing member 23 in a direction perpendicular to the surface of the substrate 21. The packaging structure 101 can also include: a second radiation structure 242 and a second dielectric waveguide 252; the second radiation structure 242 is located on the surface of the substrate 21 away from the chip 22, and at least part of the second radiation structure 242 is located in the second cavity U2; the end of the second dielectric waveguide 252 is inserted into the second cavity U2. Similarly, the fixing member 23 may further include a third cavity U3 and a fourth cavity U4, and the packaging structure 101 may further include: a third radiation structure 243, a fourth radiation structure 244, a third dielectric waveguide 253, and a fourth dielectric waveguide 254. The specific implementation of each cavity may refer to the specific setting of the first cavity U1, the specific implementation of each radiation structure may refer to the specific setting of the first radiation structure 241, and the specific implementation of each dielectric waveguide may refer to the specific setting of the first dielectric waveguide 251. The repeated parts will not be repeated. In the specific implementation, the number of cavities, radiation structures, and dielectric waveguides may be set according to actual needs.

[0033] Figure 3 Schematic diagram of the connection relationship between the fixing member and the dielectric waveguide in the embodiment of the present application, combined with Figure 2 and Figure 3, the fixing member 23 may include: a packaging cover plate 231 and a dielectric waveguide base 232. The packaging cover plate 231 is located between the substrate 21 and the dielectric waveguide base 232. The packaging cover plate 231 is fixed to the surface of the substrate 21, and the packaging cover plate 231 is detachably connected to the dielectric waveguide base 232. During the installation process, the ends of the dielectric waveguides can be inserted into the corresponding cavities in the dielectric waveguide base 232 first, and then the dielectric waveguide base 232 is connected to the packaging cover plate 231. In a specific implementation, one end of the dielectric waveguide can be inserted into one dielectric waveguide base 232, and the other end can be inserted into another dielectric waveguide base 232, so that the packaging structure 101 is connected to other communication devices through the dielectric waveguide. Since the packaging cover plate 231 is detachably connected to the dielectric waveguide base 232, it is convenient to replace the dielectric waveguide or the dielectric waveguide base 232 during subsequent use, and the installation and maintenance costs are relatively low.

[0034] In a possible implementation manner, as Figure 2 shown, the packaging cover plate 231 and the dielectric waveguide base 232 are snap-connected at the edges. For example, Figure 2 in, the packaging cover plate 231 and the dielectric waveguide base 232 can be snap-connected at the dashed box W. In a specific implementation, a snap core and a snap cap that cooperate with each other can be provided at the edges of the packaging cover plate 231 and the dielectric waveguide base 232. In this way, it is relatively easy to install the dielectric waveguide base 232 on the packaging cover plate 231, and it is also relatively easy to disassemble the dielectric waveguide base 232. Of course, in some cases, other methods can also be used to achieve the detachable connection between the packaging cover plate 231 and the dielectric waveguide base 232.

[0035] In some embodiments of the present application, a first groove P1 is provided on the surface of the packaging cover plate 231 facing the dielectric waveguide base 232, and a first protrusion Q1 is provided on the surface of the dielectric waveguide base 232 facing the packaging cover plate 231. The first groove P1 and the first protrusion Q1 are located at the position between the first cavity U1 and the second cavity U2. The packaging cover plate 231 and the dielectric waveguide base 232 are matched and installed through the first groove P1 and the first protrusion Q1. When the packaging cover plate 231 and the dielectric waveguide base 232 are connected to each other, the first protrusion Q1 is embedded into the first groove P1 to strengthen the firmness between the packaging cover plate 231 and the dielectric waveguide base 232. When the dielectric waveguide base 232 is removed from the packaging cover plate 231, the first protrusion Q1 can be pulled out from the first groove P1. Thus, it is convenient to achieve the detachable connection between the packaging cover plate 231 and the dielectric waveguide base 232.

[0036] Of course, the first groove P1 and the first protrusion Q1 can also be interchanged. That is, the surface of the encapsulation cover plate 231 facing the dielectric waveguide base 232 can be provided with the first protrusion Q1, and the surface of the dielectric waveguide base 232 facing the encapsulation cover plate 231 is provided with the first groove P1. The first groove P1 and the first protrusion Q1 are located at the position between the first cavity U1 and the second cavity U2, and the encapsulation cover plate 231 and the dielectric waveguide base 232 are matched and installed through the first groove P1 and the first protrusion Q1.

[0037] Similarly, at the position between other two adjacent cavities, a matching protrusion and groove can also be provided, which can be set with reference to the first protrusion Q1 and the first groove P1, and the repeated parts will not be elaborated.

[0038] In a possible implementation manner, the encapsulation structure in the embodiment of the present application may further include: a sealant 26. The encapsulation cover plate 231 is fixed to the surface of the substrate 21 through the sealant 26. The sealant 26 is located above the substrate 21 and at the edge of the encapsulation cover plate 231. Exemplarily, the sealant 26 can be a conductive adhesive. By using the sealant 26 to fix the encapsulation cover plate 231 on the surface of the substrate 21, the encapsulation cover plate 231 can be directly fixed on the surface of the substrate 21, without occupying the space of the circuit board 102 additionally, which can save the space of the circuit board 102 and improve the integration degree of the encapsulation structure 101. Of course, in some cases, other methods (such as welding) can also be used to fix the encapsulation cover plate 231 on the surface of the substrate 21.

[0039] Figure 4 It is a partial enlarged schematic diagram of the encapsulation structure in the embodiment of the present application. As Figure 4 shown, the encapsulation cover plate 231 can be made of a metal material; or, the encapsulation cover plate 231 can include: an organic material and a metallized treatment layer wrapping the organic material. That is, the surface of the encapsulation cover plate 231 is made of a metal material. In this way, the shielding efficiency of the encapsulation cover plate 231 is relatively high. The high-frequency and high-speed signal emitted by the first radiation structure 241 radiates into the first cavity U1, and the encapsulation cover plate 231 can play a better coupling role and can realize signal conversion with an ultra-wideband (>40%).

[0040] In a possible implementation manner, the dielectric waveguide base 232 can include: a metal material or an organic material. Optionally, the surface of the dielectric waveguide base 232 can be metallized, or the surface of the dielectric waveguide base 232 can also not be metallized, as long as it can realize the function of fixing the dielectric waveguide.

[0041] In the embodiment of the present application, as Figure 2As shown, the first dielectric waveguide 251 may include: a first cladding 251a and a first core 251b. The first cladding 251a wraps the first core 251b. The end of the first cladding 251a is snap-fitted and fixed within the first cavity U1, and the end of the first core 251b located within the first cavity U1 protrudes beyond the end of the first cladding 251a. That is to say, the end of the first core 251b is not wrapped by the first cladding 251a. Such a setting enables the end of the first core 251b to be exposed within the first cavity U1, making it easier for high-frequency and high-speed signals to be coupled into the first core 251b and achieving a better signal coupling effect.

[0042] Specifically, the end of the first core 251b within the first cavity U1 is located on the side of the encapsulation cover plate 231 away from the substrate 21. That is to say, the end of the first core 251b is at the position of the dielectric waveguide base 232. In this way, when the dielectric waveguide base 232 is not connected to the encapsulation cover plate 231, the end of the first core 251b does not extend beyond the surface of the dielectric waveguide base 232, that is, the end of the first core 251b is not exposed to the outside. Thus, it can play a role in protecting the first core 251b and preventing the first core 251b from being damaged by external objects.

[0043] In a possible implementation, as Figure 2 shown, a thermal interface material 27 may be filled between the chip 22 and the circuit board 102. Heat dissipation vias H may be provided in the circuit board 102, and the chip 22 may dissipate heat through the thermal interface material 27 and the heat dissipation vias H.

[0044] In the embodiments of the present application, referring to Figure 2 , the encapsulation cover plate 231 is fixed to the surface of the substrate 21 using a sealant 26, and the encapsulation cover plate 231 and the dielectric waveguide base 232 are connected using a cooperating protrusion and groove, and a cooperating snap core and snap cap, which can achieve precise connection between the substrate 21, the encapsulation cover plate 231, and the dielectric waveguide base 232, making the encapsulation structure simple in structure, small in size, and having a high degree of integration. Moreover, the processing cost of the encapsulation structure is relatively low, and the installation and maintenance costs are also relatively low, having manufacturability and mass producibility. During the working process, high-frequency and high-speed signals can be radiated into the cavity through the radiation structure on the substrate 21, and the high-frequency and high-speed signals can be coupled into the dielectric waveguide through the cavity, enabling high-density transmission of high-frequency and high-speed signals. In addition, due to the advantages of the dielectric waveguide such as being bendable and having low loss, the performance of the entire transmission link can be improved.

[0045] Figure 5 For the coupling effect schematic diagram of the encapsulation cover plate in the embodiments of the present application, as Figure 5As shown, the curve S1 in the figure represents the insertion loss of the high-frequency and high-speed signal. The closer the insertion loss is to zero, the smaller the loss during the transmission of the high-frequency and high-speed signal. Therefore, it can be seen from the curve S1 that the loss of the high-frequency and high-speed signal transmitted using the packaging structure in the embodiment of the present application is small. The curves S2 and S3 respectively represent the return loss at both ends of the dielectric waveguide. The smaller the return loss, the lower the reflection of the high-frequency and high-speed signal. It can be seen from the curves S2 and S3 that the reflection of the high-frequency and high-speed signal transmitted using the packaging structure in the embodiment of the present application is low, and the loss at the port is small. Therefore, the packaging cover plate in the embodiment of the present application can achieve a good coupling effect, has a good return loss for the high-frequency and high-speed signal, small loss, and high channel isolation efficiency.

[0046] Figure 6 This is a simulation schematic diagram of the dielectric waveguide coupling in the embodiment of the present application. As Figure 6 shown, the curve S4 in the figure represents the insertion loss of the high-frequency and high-speed signal. It can be seen from the curve S4 that the loss of the high-frequency and high-speed signal transmitted using the packaging structure in the embodiment of the present application is small. The curve S5 is the return loss of the high-frequency and high-speed signal. It can be seen from the curve S5 that the reflection of the high-frequency and high-speed signal transmitted using the packaging structure in the embodiment of the present application is low. The curve S6 represents the isolation degree between different dielectric waveguides. It can be seen from the curve S6 that the isolation degree between different dielectric waveguides is small, indicating that the mutual coupling between different dielectric waveguides is small, and the high-frequency and high-speed signal transmitted in the dielectric waveguide is less interfered, which is conducive to realizing the high-density transmission of the high-frequency and high-speed signal. Therefore, the packaging cover plate in the embodiment of the present application has a good coupling effect on the high-frequency and high-speed signal, small mutual coupling between different dielectric waveguides, good return loss for the high-frequency and high-speed signal, small loss, and high channel isolation efficiency.

[0047] Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present application.

[0048] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. An encapsulation structure, characterized in that, include: substrate; A chip is fixed on the surface of the substrate; A fixing member, fixed to a surface of the substrate facing away from the chip; A first cavity is provided in the fixing member, and the first cavity penetrates the fixing member in a direction perpendicular to the surface of the substrate; A first radiation structure is located on a surface of the substrate facing away from the chip, and at least a portion of the first radiation structure is located in the first cavity; A first dielectric waveguide, an end of which is inserted into the first cavity.

2. The encapsulation structure according to claim 1, characterized in that, The fixing member is further provided with a second cavity, and the second cavity penetrates the fixing member in a direction perpendicular to the surface of the substrate; The packaging structure also includes: a second radiation structure and a second dielectric waveguide; the second radiation structure is located on a surface of the substrate facing away from the chip, and at least a portion of the second radiation structure is located in the second cavity; an end of the second dielectric waveguide is inserted into the second cavity.

3. The encapsulation structure according to claim 1 or 2, characterized in that, The fixing member comprises: a packaging cover plate and a dielectric waveguide base; The packaging cover is located between the substrate and the dielectric waveguide base; The packaging cover plate is fixed to the surface of the substrate, and the packaging cover plate is detachably connected to the dielectric waveguide base.

4. The encapsulation structure according to claim 3, characterized in that, The packaging cover plate is snap-connected with the dielectric waveguide base at the edge.

5. The encapsulation structure according to claim 3, characterized in that, A first groove is provided on the surface of the packaging cover plate facing the dielectric waveguide base, and a first protrusion is provided on the surface of the dielectric waveguide base facing the packaging cover plate, the first groove and the first protrusion are located between the first cavity and the second cavity, and the packaging cover plate and the dielectric waveguide base are matched and installed through the first groove and the first protrusion; or A first protrusion is provided on the surface of the packaging cover plate facing the dielectric waveguide base, and a first groove is provided on the surface of the dielectric waveguide base facing the packaging cover plate. The first groove and the first protrusion are located between the first cavity and the second cavity, and the packaging cover plate and the dielectric waveguide base are matched and installed through the first groove and the first protrusion.

6. The encapsulation structure according to any one of claims 3 to 5, characterized in that, Also includes: Sealant; The packaging cover plate is fixed to the surface of the substrate by means of a sealant, and the sealant is located on the substrate and at the edge of the packaging cover plate.

7. The encapsulation structure according to any one of claims 3 to 6, characterized in that, The package cover plate is made of metal material; or, the package cover plate includes: an organic material, and a metallization treatment layer wrapping the organic material.

8. The encapsulation structure according to claim 3, characterized in that, The dielectric waveguide base comprises: a metal material or an organic material.

9. The encapsulation structure according to claim 1, characterized in that, The first dielectric waveguide comprises: a first cladding and a first core; The first cladding wraps the first fiber core, an end of the first cladding is clamped and fixed in the first cavity, and an end of the first fiber core located in the first cavity protrudes from an end of the first cladding.

10. The encapsulation structure according to claim 9, characterized in that, The fixing member comprises: a packaging cover plate and a dielectric waveguide base; The packaging cover is located between the substrate and the dielectric waveguide base; An end of the first fiber core in the first cavity is located on a side of the packaging cover plate facing away from the substrate.

11. A communication device, characterized in that, include: The packaging structure and circuit board according to any one of claims 1 to 10, wherein the packaging structure is fixed to a surface of the circuit board.

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