Chip heat dissipation packaging structure

Abstract

This invention relates to the field of chip packaging technology, specifically to a chip heat dissipation packaging structure, including a circuit board, a chip body, a heat-conducting component, a cold head, a water inlet connector, a water return connector, a water inlet pipe, a water return pipe, a radiator, a cooling fan, a controller, power wiring, a transmission box, a pump body, a circulation mechanism, a spraying mechanism, and a packaging mechanism. This invention achieves coolant circulation through the circulation mechanism, allowing some devices to recycle the coolant and effectively preventing coolant evaporation and water vapor corrosion of electrical components. The spraying mechanism achieves uniform coolant spraying, allowing some devices to evenly spray low-temperature coolant onto the surface of the heat-conducting component, facilitating stable heat absorption from various areas of the component. The packaging mechanism encapsulates the chip body, allowing some devices to elastically encapsulate the chip, effectively preventing damage to some electronic components due to excessive force, and improving the efficiency, stability, and protection of the device.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a chip heat dissipation packaging structure. Background Technology

[0002] With the continuous development of semiconductor technology, chip integration is becoming increasingly higher, meaning that more transistors and other electronic components can be integrated onto a chip of the same size. This increased integration leads to a significant improvement in chip performance, but also a sharp increase in power consumption. High-performance chips generate a large amount of heat during operation. If this heat cannot be dissipated in time, the chip temperature will rise rapidly. Increased chip temperature exacerbates electron migration, affecting the speed and path of electrons within the semiconductor material. This can cause instability in the chip's operating frequency, resulting in performance degradation, stuttering, or even system crashes. Furthermore, prolonged operation at high temperatures accelerates the aging and damage of internal chip materials, shortening the chip's lifespan.

[0003] Existing devices primarily isolate and dissipate heat from the chip using a heat-conducting component and coolant. Many existing technologies resemble a chip heat dissipation packaging structure. The structure in publication number CN113690205B includes a circuit board, a chip, and a mounting component, with the chip mounted on the surface of the circuit board. This chip heat dissipation packaging structure also includes: a fixing component mounted on the mounting component to stably position the mounting component on the circuit board; and a heat-conducting component to absorb heat from the chip. This invention, by setting up a heat dissipation structure, can evenly spray coolant onto the surface of the heat-conducting component during the movement of the telescopic component, and can also create airflow blowing onto the surface of the heat-conducting component to accelerate the evaporation of coolant on the component and accelerate heat dissipation, thereby improving the heat dissipation efficiency of the packaging structure. However, this device still has areas for optimization.

[0004] Existing devices primarily absorb heat generated by the chip through coolant evaporation. This makes it difficult for some devices to recycle the coolant, leading to water vapor evaporation that corrodes electrical components. Secondly, some devices use fixed spray racks to spray coolant onto the heat-conducting components, making it difficult to evenly spray the low-temperature coolant onto the surface of the components. This hinders the stable absorption of heat from different areas of the components. Finally, some devices use bolts to encapsulate the heat dissipation components onto the chip, making it difficult to provide flexible, stress-resistant encapsulation. This results in excessive stress on some electronic components, causing damage and reducing the device's efficiency and usability. Therefore, to address these issues, a chip heat dissipation encapsulation structure is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a chip heat dissipation packaging structure to solve the problems mentioned in the background art. Existing devices mainly absorb heat generated by the chip through coolant evaporation, making it difficult for some devices to recycle the coolant. This leads to some coolant evaporation producing water vapor that corrodes electrical components. Secondly, some devices mainly use fixed spray racks to spray coolant onto the heat-conducting components, making it difficult to evenly spray low-temperature coolant onto the surface of the heat-conducting components, thus hindering the stable absorption of heat from different areas of the heat-conducting components. Finally, some devices mainly use bolts to encapsulate the heat dissipation components onto the chip, making it difficult to elastically encapsulate the chip, resulting in excessive stress and damage to some electronic components.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a chip heat dissipation packaging structure, including a circuit board, a chip body disposed on the top of the circuit board, a heat-conducting component attached to the top of the chip body, a cold head fixedly connected to the outer wall of the heat-conducting component, a water inlet connector fixedly connected to the top center of the cold head, a water return connector fixedly connected to the top left side of the cold head, a water inlet pipe fixedly connected to the top of the water inlet connector, a water return pipe fixedly connected to the top of the water return connector, a radiator fixedly connected to the top of the water inlet pipe and the water return pipe, a cooling fan fixedly connected to the top of the radiator, a controller fixedly mounted on the top right side of the cold head, a power supply wire fixedly connected to the top right side of the controller, a transmission box fixedly connected to the top of the inner wall of the cold head, and a pump body fixedly connected to the front left side of the transmission box;

[0007] The transmission box is equipped with a circulation mechanism, which includes a drive motor. The front side of the drive motor is fixedly connected to the middle of the rear side of the transmission box. The lower part of the cold head is equipped with a spray mechanism, which includes a spray frame. The top of the spray frame is sleeved on the lower part of the outer wall of the water inlet connector. The outer wall of the cold head is equipped with a sealing mechanism, which includes a fixing ring plate. The inner wall of the fixing ring plate is fixedly connected to the lower part of the outer wall of the cold head.

[0008] Preferably, a drive shaft is fixedly connected to the front middle of the drive motor, the front end of the drive shaft passes through the rear side wall of the transmission box and is fixedly connected to a first bevel gear, a second bevel gear is meshed with the front of the first bevel gear, a transmission worm is fixedly connected to the inner wall of the second bevel gear, and the two ends of the transmission worm are movably connected to both sides of the inner wall of the transmission box.

[0009] Preferably, a transmission worm gear is meshed with the left side of the outer wall of the transmission worm, a transmission shaft is fixedly connected to the inner wall of the transmission worm gear, the rear end of the transmission shaft is movably connected to the rear side of the inner wall of the transmission box, and the front end of the transmission shaft passes through the front side wall of the transmission box and the rear side wall of the pump body and is movably connected to the front side of the inner wall of the pump body.

[0010] Preferably, the outer wall of the drive shaft is fixedly connected to the inside of the pump body with threaded blades, the water inlet of the pump body is located inside the upper part of the cold head, and the water outlet of the pump body is fixedly connected to the bottom of the return water connector.

[0011] Preferably, a linkage worm gear is meshed with the right side of the outer wall of the transmission worm, a rotating shaft is fixedly connected to the inner wall of the linkage worm gear, the top end of the rotating shaft is movably connected to the top of the inner wall of the cold head, and the bottom end of the rotating shaft passes through the transmission box and is fixedly connected to the main gear.

[0012] Preferably, the outer wall of the main gear is meshed with an internal gear, the bottom of the internal gear is fixedly connected to the top outer ring of the spray frame, the outer wall of the spray frame is fixedly connected with a ball bearing, and the outer wall of the ball bearing is fixedly connected to the lower inner wall of the cold head.

[0013] Preferably, the spray frame consists of a movable joint, a spray rod, and an outer ring frame. A pair of movable sealing rings are fixedly connected to the lower outer wall of the water inlet joint, and the outer wall of the movable sealing ring is slidably connected to the inner wall of the movable joint of the spray frame.

[0014] Preferably, a sealing pressure ring is fixedly connected to the bottom inner ring of the fixing ring plate, the bottom of the sealing pressure ring is attached to the top of the circuit board, and limit sockets are fixedly connected to the four corners of the outer wall of the fixing ring plate.

[0015] Preferably, a telescopic sleeve is fitted on the upper part of the outer wall of the limiting socket, a buffer spring is fixedly connected to the top of the outer wall of the telescopic sleeve, and the bottom of the buffer spring is fixedly connected to the lower part of the outer wall of the limiting socket.

[0016] Preferably, a fastening bolt is inserted into the upper part of the inner wall of the telescopic sleeve, the bottom end of the fastening bolt passes through the telescopic sleeve and the limiting socket and is threaded with a threaded connector, and the bottom of the threaded connector is fixedly connected to the top of the circuit board.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. This invention utilizes a circulating mechanism comprising a drive motor, drive shaft, first bevel gear, second bevel gear, transmission worm, transmission worm wheel, transmission shaft, and threaded blades. A controller activates the drive motor, causing the drive shaft and first bevel gear to rotate in a limited position. The first bevel gear meshes, driving the second bevel gear and transmission worm to rotate in a limited position. The transmission worm meshes, driving the transmission worm wheel, transmission shaft, and threaded blades to rotate in a limited position. This allows the threaded blades, in conjunction with the pump body, to circulate the coolant between the cold head and the radiator, achieving coolant circulation. This enables some parts of the device to recycle the coolant, effectively preventing coolant evaporation and water vapor corrosion of electrical components, thus improving the device's efficiency and practicality.

[0019] 2. This invention utilizes a spray mechanism comprising a linkage worm gear, a rotating shaft, a main gear, an internal gear, a spray frame, ball bearings, and a movable sealing ring. Through the meshing of the transmission worm, the linkage worm gear, rotating shaft, and main gear are driven to rotate in a limited position. The main gear, in turn, drives the inner walls of the internal gear, spray frame, and ball bearings to rotate in a limited position. This allows the spray frame to uniformly spray coolant onto the heat-conducting components, achieving uniform coolant spraying. This enables some parts of the device to uniformly spray low-temperature coolant onto the surface of the heat-conducting components, facilitating stable absorption of heat from various areas of the components by the coolant, thus improving the stability and practicality of the device.

[0020] 3. This invention utilizes a packaging mechanism comprising a fixed ring plate, a sealing pressure ring, a limiting socket, a telescopic sleeve, a buffer spring, a fastening bolt, and a threaded joint. The limiting socket is aligned with the threaded joint, and then a flathead screwdriver is used to rotate the fastening bolt clockwise, causing the bolt threads to insert into the threaded joint. The fastening bolt drives the telescopic sleeve to slide downwards on the outer wall of the limiting socket. The telescopic sleeve compresses the buffer spring, which in turn applies elastic pressure to the limiting socket and the fixed ring plate. This causes the fixed ring plate to press the sealing pressure ring onto the circuit board, achieving chip encapsulation. This allows some devices to elastically encapsulate chips, effectively preventing damage to some electronic components due to excessive force, and improving the device's protection and practicality. Attached Figure Description

[0021] Figure 1 This is a first front cross-sectional perspective view of a partial structure of the cold head and circuit board of the present invention;

[0022] Figure 2 This is a front side perspective view of the structure of the present invention;

[0023] Figure 3 This is a second front cross-sectional perspective view of a partial structure of the cold head and circuit board of the present invention;

[0024] Figure 4 This is a top sectional perspective view of a partial structure of the transmission box and circulation mechanism of the present invention;

[0025] Figure 5 This is a partial side cross-sectional perspective view of the pump body and circulation mechanism of the present invention;

[0026] Figure 6 This is a partial side cross-sectional perspective view of the cold head and spray mechanism of the present invention;

[0027] Figure 7 This is a top sectional perspective view of a partial structure of the cold head and spray mechanism of the present invention;

[0028] Figure 8 This is a frontal cross-sectional perspective view of a portion of the circuit board and packaging mechanism of the present invention.

[0029] In the diagram: 101. Circuit board; 102. Chip body; 103. Heat-conducting component; 104. Cold block; 105. Water inlet connector; 106. Water return connector; 107. Water inlet pipe; 108. Water return pipe; 109. Radiator; 110. Cooling fan; 111. Controller; 112. Power supply wiring; 113. Transmission box; 114. Pump body; 2. Circulation mechanism; 201. Drive motor; 202. Drive shaft; 203. First bevel gear; 204. Second bevel gear; 205. 206. Transmission worm gear; 207. Transmission worm wheel; 208. Transmission shaft; 209. Threaded blade; 3. Spraying mechanism; 301. Linkage worm wheel; 302. Rotating shaft; 303. Main gear; 304. Internal gear; 305. Spray frame; 306. Ball bearing; 307. Movable sealing ring; 4. Sealing mechanism; 401. Fixed ring plate; 402. Sealing pressure ring; 403. Limit socket; 404. Telescopic sleeve; 405. Buffer spring; 406. Fastening bolt; 407. Threaded joint. Detailed Implementation

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] Please see Figures 1-8 One embodiment provided by the present invention:

[0032] A chip heat dissipation packaging structure includes a circuit board 101, a chip body 102 disposed on the top of the circuit board 101, a heat-conducting component 103 attached to the top of the chip body 102, a cold head 104 fixedly connected to the outer wall of the heat-conducting component 103, a water inlet connector 105 fixedly connected to the top center of the cold head 104, a water return connector 106 fixedly connected to the top left side of the cold head 104, a water inlet pipe 107 fixedly connected to the top of the water inlet connector 105, a water return pipe 108 fixedly connected to the top of the water return connector 106, a radiator 109 fixedly connected to the top of the water inlet pipe 107 and the water return pipe 108, a cooling fan 110 fixedly connected to the top of the radiator 109, a controller 111 fixedly disposed on the top right side of the cold head 104, a power supply wire 112 fixedly connected to the top right side of the controller 111, a transmission box 113 fixedly connected to the top of the inner wall of the cold head 104, and a pump body 114 fixedly connected to the front left side of the transmission box 113.

[0033] The transmission box 113 is equipped with a circulation mechanism 2, which includes a drive motor 201. The front side of the drive motor 201 is fixedly connected to the middle of the rear side of the transmission box 113. A drive shaft 202 is fixedly connected to the middle of the front side of the drive motor 201. The front end of the drive shaft 202 passes through the rear wall of the transmission box 113 and is fixedly connected to a first bevel gear 203. A second bevel gear 204 is meshed with the front of the first bevel gear 203. A transmission worm gear 205 is fixedly connected to the inner wall of the second bevel gear 204. The two ends of the transmission worm gear 205 are movably connected to the two sides of the inner wall of the transmission box 113. Through this design, the drive motor 201 drives the drive shaft 202 and the first bevel gear 203 to rotate in a limited position, so that the first bevel gear 203 meshes and drives the second bevel gear 204 to drive the transmission worm gear 205 to rotate in a limited position. A transmission worm wheel 206 is meshed with the left side of the outer wall of the transmission worm gear 205. A drive shaft 207 is fixedly connected to the inner wall of the drive worm gear 206. The rear end of the drive shaft 207 is movably connected to the rear side of the inner wall of the drive box 113. The front end of the drive shaft 207 passes through the front side wall of the drive box 113 and the rear side wall of the pump body 114 and is movably connected to the front side of the inner wall of the pump body 114. Through this design, the drive worm 205 meshes and drives the drive worm gear 206 and the drive shaft 207 to rotate in a limited position. The outer wall of the drive shaft 207 is fixedly connected to the threaded blade 208 inside the pump body 114. The water inlet of the pump body 114 is located inside and above the cold head 104. The drain outlet of the pump body 114 is fixedly connected to the bottom of the return water connector 106. Through this design, the drive shaft 207 drives the threaded blade 208 to rotate synchronously, so that the threaded blade 208 cooperates with the pump body 114 to drive the coolant to circulate between the cold head 104 and the radiator 109, which facilitates the cooling of the chip body 102 by the coolant.

[0034] A spray mechanism 3 is located at the lower interior of the cold head 104. The spray mechanism 3 includes a spray frame 305, the top of which is fitted onto the lower outer wall of the water inlet connector 105. A linkage worm gear 301 is meshed with the right side of the outer wall of the transmission worm 205. A rotating shaft 302 is fixedly connected to the inner wall of the linkage worm gear 301. The top end of the rotating shaft 302 is movably connected to the top of the inner wall of the cold head 104. The bottom end of the rotating shaft 302 passes through the transmission box 113 and is fixedly connected to the main gear 303. Through this design, the transmission worm 205 meshes with and drives the linkage worm gear 301 and the rotating shaft 302 to rotate in a limited position, so that the rotating shaft 302 drives the main gear 303 to rotate synchronously. An internal gear 304 is meshed with the outer wall of the main gear 303. The bottom of the internal gear 304 is fixedly connected to... A ball bearing 306 is fixedly connected to the outer ring of the top of the spray frame 305. The outer wall of the spray frame 305 is fixedly connected to the lower inner wall of the cold head 104. Through this design, the main gear 303 meshes and drives the inner gear 304, the spray frame 305 and the inner wall of the ball bearing 306 to rotate in a limited position. The spray frame 305 consists of a movable joint, a spray rod and an outer ring frame. A pair of movable sealing rings 307 are fixedly connected to the lower outer wall of the water inlet joint 105. The outer wall of the movable sealing rings 307 is slidably connected to the inner wall of the movable joint of the spray frame 305. Through this design, the movable sealing rings 307 can be used to seal the water inlet joint 105 and the spray frame 305, which facilitates the spray frame 305 to spray coolant evenly onto the heat-conducting component 103.

[0035] The outer wall of the cold head 104 is provided with a packaging mechanism 4, which includes a fixing ring plate 401. The inner wall of the fixing ring plate 401 is fixedly connected to the lower part of the outer wall of the cold head 104. A sealing pressure ring 402 is fixedly connected to the bottom inner ring of the fixing ring plate 401. The bottom of the sealing pressure ring 402 is attached to the top of the circuit board 101. Limit sockets 403 are fixedly connected to the four corners of the outer wall of the fixing ring plate 401. Through this design, the fixing ring plate 401 can cooperate with the sealing pressure ring 402 to package the chip body 102. A telescopic sleeve 404 is sleeved on the upper part of the outer wall of the limit socket 403. A buffer spring 405 is fixedly connected to the top of the outer wall of the telescopic sleeve 404. The bottom of the buffer spring 405 is fixedly connected to the limit socket 403. Below the outer wall of the socket 403, this design allows the telescopic sleeve 404 to slide within the outer wall of the socket 403, and applies elastic pressure to the socket 403 via a buffer spring 405. A fastening bolt 406 is inserted into the upper inner wall of the telescopic sleeve 404. The bottom end of the fastening bolt 406 passes through the telescopic sleeve 404 and the socket 403 and is threaded with a threaded connector 407. The bottom of the threaded connector 407 is fixedly connected to the top of the circuit board 101. This design allows the fastening bolt 406 to work with the threaded connector 407 to fix the fixing ring plate 401 and the cold head 104 above the circuit board 101, facilitating the heat dissipation and encapsulation of the chip body 102 by the cold head 104.

[0036] Working principle: When coolant needs to be circulated, the controller 111 first starts the drive motor 201. The drive motor 201 drives the drive shaft 202 to rotate in a limited position. The drive shaft 202 drives the first bevel gear 203 to rotate synchronously. The first bevel gear 203 meshes and drives the second bevel gear 204 to rotate. The second bevel gear 204 drives the transmission worm gear 205 to rotate in a limited position. The transmission worm gear 205 meshes and drives the transmission worm wheel 206 to rotate synchronously. The transmission worm wheel 206 drives the transmission shaft 207 to rotate in a limited position. The transmission shaft 207 drives the threaded blades 208 to rotate synchronously. This allows the threaded blades 208 to work with the pump body 114 to circulate the coolant between the cold head 104 and the radiator 109, thus realizing the coolant circulation operation.

[0037] When it is necessary to spray the coolant evenly, the transmission worm gear 205 first engages to drive the linkage worm wheel 301 to rotate. The linkage worm wheel 301 drives the rotating shaft 302 to rotate in a limited position. The rotating shaft 302 drives the main gear 303 to rotate synchronously. The main gear 303 engages to drive the internal gear 304 to rotate. The internal gear 304 drives the inner wall of the spray frame 305 and the ball bearing 306 to rotate in a limited position, so that the spray frame 305 sprays the coolant evenly onto the heat-conducting component 103, thus realizing the uniform spraying operation of the coolant.

[0038] When it is necessary to encapsulate the chip body 102, first align the limiting socket 403 with the threaded connector 407, and then use a flathead screwdriver to rotate the fastening bolt 406 clockwise so that the fastening bolt 406 is threaded into the inside of the threaded connector 407. The fastening bolt 406 drives the telescopic sleeve 404 to slide downward on the outer wall of the limiting socket 403. The telescopic sleeve 404 compresses the buffer spring 405, so that the buffer spring 405 applies elastic pressure to the limiting socket 403 and the fixing ring plate 401, so that the fixing ring plate 401 drives the sealing ring 402 to press and seal on the circuit board 101, thus realizing the encapsulation operation of the chip body 102. The operation ends here.

[0039] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Those skilled in the art can readily implement the present invention based on the accompanying drawings and the above description. However, any modifications, alterations, or variations made by those skilled in the art without departing from the scope of the present invention, utilizing the disclosed technical content, are equivalent embodiments of the present invention. Furthermore, any modifications, alterations, or variations made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the present invention.

Claims

1. A chip heat dissipation packaging structure, comprising a circuit board (101), characterized in that: A chip body (102) is mounted on top of the circuit board (101). A heat-conducting component (103) is attached to the top of the chip body (102). A cold head (104) is fixedly connected to the outer wall of the heat-conducting component (103). A water inlet connector (105) is fixedly connected to the middle of the top of the cold head (104). A water return connector (106) is fixedly connected to the left side of the top of the cold head (104). A water inlet pipe (107) is fixedly connected to the top of the water inlet connector (105). A water return pipe (106) is fixedly connected to the top of the water return connector (106). A water pipe (108) is fixedly connected to the top of the inlet pipe (107) and the return pipe (108) with a radiator (109). A cooling fan (110) is fixedly connected to the top of the radiator (109). A controller (111) is fixedly attached to the top right side of the cold head (104). A power supply wire (112) is fixedly connected to the top right side of the controller (111). A transmission box (113) is fixedly connected to the top of the inner wall of the cold head (104). A pump body (114) is fixedly connected to the front left side of the transmission box (113). The transmission box (113) is equipped with a circulation mechanism (2) inside. The circulation mechanism (2) includes a drive motor (201). The front side of the drive motor (201) is fixedly connected to the middle of the rear side of the transmission box (113). A drive shaft (202) is fixedly connected to the middle of the front side of the drive motor (201). The front end of the drive shaft (202) passes through the rear side wall of the transmission box (113) and is fixedly connected to a first bevel gear (203). A second bevel gear (204) is meshed with the front of the first bevel gear (203). A transmission worm (205) is fixedly connected to the inner wall of the second bevel gear (204). The two ends of the transmission worm (205) are movably connected to both sides of the inner wall of the transmission box (113). The outer wall of the transmission worm (205) is meshed with a transmission worm wheel (206) on the left side. The inner wall of the transmission worm wheel (206) is fixedly connected to a transmission shaft (207). The rear end of the transmission shaft (207) is movably connected to the rear side of the inner wall of the transmission box (113). The front end of the transmission shaft (207) passes through the front side wall of the transmission box (113) and the rear side wall of the pump body (114) and is movably connected to the front side of the inner wall of the pump body (114). The outer wall of the transmission shaft (207) is fixedly connected to a threaded blade (208) inside the pump body (114). The water inlet of the pump body (114) is located inside and above the cold head (104). The drain outlet of the pump body (114) is fixedly connected to the bottom of the return water connector (106). The cold head (104) is provided with a spray mechanism (3) at the bottom inside. The spray mechanism (3) includes a spray frame (305). The top of the spray frame (305) is sleeved on the bottom of the outer wall of the water inlet connector (105). The outer wall of the cold head (104) is provided with a sealing mechanism (4). The sealing mechanism (4) includes a fixing ring plate (401). The inner wall of the fixing ring plate (401) is fixedly connected to the bottom of the outer wall of the cold head (104).

2. The chip heat dissipation packaging structure according to claim 1, characterized in that: The outer wall of the transmission worm (205) is meshed with a linkage worm wheel (301), and the inner wall of the linkage worm wheel (301) is fixedly connected with a rotating shaft (302). The top end of the rotating shaft (302) is movably connected to the top of the inner wall of the cold head (104), and the bottom end of the rotating shaft (302) passes through the transmission box (113) and is fixedly connected with a main gear (303).

3. The chip heat dissipation packaging structure according to claim 2, characterized in that: The outer wall of the main gear (303) is meshed with an internal gear (304), the bottom of the internal gear (304) is fixedly connected to the top outer ring of the spray frame (305), the outer wall of the spray frame (305) is fixedly connected with a ball bearing (306), and the outer wall of the ball bearing (306) is fixedly connected to the lower inner wall of the cold head (104).

4. The chip heat dissipation packaging structure according to claim 3, characterized in that: The spray frame (305) consists of a movable joint, a spray rod and an outer ring frame. A pair of movable sealing rings (307) are fixedly connected to the lower outer wall of the water inlet joint (105). The outer wall of the movable sealing ring (307) is slidably connected to the inner wall of the movable joint of the spray frame (305).

5. The chip heat dissipation packaging structure according to claim 1, characterized in that: The bottom inner ring of the fixed ring plate (401) is fixedly connected to a sealing pressure ring (402), the bottom of the sealing pressure ring (402) is attached to the top of the circuit board (101), and the four corners of the outer wall of the fixed ring plate (401) are fixedly connected to limit sockets (403).

6. The chip heat dissipation packaging structure according to claim 5, characterized in that: A telescopic sleeve (404) is fitted on the upper part of the outer wall of the limiting socket (403). A buffer spring (405) is fixedly connected to the top of the outer wall of the telescopic sleeve (404), and the bottom of the buffer spring (405) is fixedly connected to the lower part of the outer wall of the limiting socket (403).

7. A chip heat dissipation packaging structure according to claim 6, characterized in that: A fastening bolt (406) is inserted into the upper part of the inner wall of the telescopic sleeve (404). The bottom end of the fastening bolt (406) passes through the telescopic sleeve (404) and the limiting socket (403) and is threaded with a threaded connector (407). The bottom of the threaded connector (407) is fixedly connected to the top of the circuit board (101).

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