Rigid-flex circuit board and electronic equipment

Abstract

The invention discloses a rigid-flexible circuit board and electronic equipment, and the circuit board comprises a plurality of rigid boards which are arranged at intervals, and each rigid board is composed of a plurality of layer boards; the two flexible boards are arranged on the two sides of the rigid boards, and the rigid boards are arranged at the non-edge positions of the flexible boards, so that the thickness of the edge position of the rigid-flexible circuit board is smaller than the thickness of the rigid board position of the rigid-flexible circuit board. Through the mutual pressing between the two flexible boards and the rigid board, the use of a reinforcing sheet can be avoided, and the flexible board formed at the non-rigid board area of the rigid-flexible circuit board can meet the bending requirement and the space compression requirement. Namely, the rigid-flexible circuit board has the characteristics of compact structure, small occupied space, bending function and high reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of rigid-flex printed circuit boards, and in particular, to a rigid-flex printed circuit board and an electronic device. Background Art

[0002] A flexible printed circuit board, also known as a "flexible board", is a printed circuit made of a flexible insulating substrate. The flexible circuit provides excellent electrical performance, can be freely bent, wound, and folded, can withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to the requirements of the spatial layout, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection.

[0003] In the prior art, the flexible printed circuit board has good flexibility and can be bent to a certain extent. However, its hardness is relatively low. For some circuit boards that need to ensure flexibility to have the ability to bend, while also ensuring that the circuit board has sufficient hardness and a relatively thin thickness, the processing is generally more complex and will occupy a large space. In addition, the existing PCB lamination processing technology cannot meet the requirements of increasingly dense wiring and reduced space usage for products. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a rigid-flex printed circuit board. By mutually laminating two flexible boards and a rigid board, the use of reinforcing sheets can be avoided, and the flexible board formed in the non-rigid board area of the rigid-flex printed circuit board can meet the bending requirements and the space compression requirements.

[0005] The present invention also provides an electronic device.

[0006] The rigid-flex printed circuit board according to the first aspect embodiment of the present invention includes: a plurality of rigid boards, which are arranged at intervals from each other, and the rigid boards are composed of a plurality of laminates; two flexible boards, which are arranged on both sides of the plurality of rigid boards and the rigid boards are arranged at non-edge positions of the flexible boards, so that the thickness of the edge of the rigid-flex printed circuit board is less than the thickness of the rigid-flex printed circuit board at the rigid board.

[0007] According to the embodiment of the present invention, by mutually laminating two flexible boards and a rigid board, the use of reinforcing sheets can be avoided, and the flexible board formed in the non-rigid board area of the rigid-flex printed circuit board can meet the bending requirements and the space compression requirements. That is, the rigid-flex printed circuit board has the characteristics of a compact structure, small occupied space, bending function, and high reliability.

[0008] According to some embodiments of the present invention, a plug-in portion is provided at the edge of the flexible board.

[0009] According to some embodiments of the present invention, through holes are provided at the edges of the flexible board.

[0010] According to some embodiments of the present invention, in the first direction, adjacent two rigid boards are spaced apart, so that the thickness of the region between the adjacent two rigid boards is less than the thickness of the rigid-flex circuit board at the rigid board.

[0011] According to some embodiments of the present invention, the thickness of the rigid board is h1, and h1 satisfies the relational expression: 0.15 mm ≤ h1 ≤ 0.2 mm.

[0012] According to some embodiments of the present invention, the thickness of the flexible board is h2, and h2 satisfies the relational expression: 0.03 mm ≤ h2 ≤ 0.04 mm.

[0013] According to some embodiments of the present invention, the rigid board includes: two first conductive layers, a first insulating layer, and two second insulating layers. The two first conductive layers are disposed on both sides of the first insulating layer, and the two second insulating layers are respectively disposed on one side of the two first conductive layers facing away from the first insulating layer.

[0014] According to some embodiments of the present invention, the flexible layer includes: a second conductive layer and a third insulating layer. The third insulating layer is in contact with the rigid layer, and the second conductive layer is disposed on one side of the third insulating layer facing away from the rigid layer.

[0015] According to some embodiments of the present invention, the first insulating layer and the second insulating layer are respectively an epoxy resin layer and a glass cloth layer; and / or, the third insulating layer is a polyimide layer.

[0016] An electronic device according to an embodiment of the second aspect of the present invention includes: the rigid-flex circuit board.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a schematic structural diagram of the superposition of the flexible board and the rigid board according to the present invention;

[0020] Figure 2 is a schematic structural diagram of the rigid-flex circuit board according to the present invention.

[0021] Reference numerals:

[0022] 100, Rigid-flex PCB;

[0023] 10, Flexible board; 11, Second conductive layer; 12, Third insulating layer;

[0024] 20, Rigid board; 21, First insulating layer; 22, First conductive layer; 23, Second insulating layer. Detailed implementation manners

[0025] The embodiments of the present invention will be described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention will be described in detail below.

[0026] Below, with reference to Figure 1 - Figure 2 describe the rigid-flex PCB 100 according to the embodiments of the present invention. The present invention also proposes an electronic device having the above-mentioned rigid-flex PCB 100.

[0027] Referring to Figure 1 and Figure 2 As shown, the rigid-flex PCB 100 according to the embodiments of the present invention includes: a plurality of rigid boards 20 and two flexible boards 10. The plurality of rigid boards 20 are arranged at intervals. The rigid board 20 is composed of a plurality of laminates. The two flexible boards 10 are arranged on both sides of the plurality of rigid boards 20. Among them, the rigid board 20 can be an FR4 core board, and the flexible board 10 can be an FRCC.

[0028] The rigid board 20 is disposed at a non-edge position of the flexible board 10, so that the thickness of the edge of the rigid-flex PCB 100 is less than the thickness of the rigid-flex PCB 100 at the rigid board 20. By laminating and pressing the two flexible boards 10 and the plurality of rigid boards 20, the area of the rigid-flex PCB 100 where there is no rigid board 20 becomes a flexible board, reducing the number of layers, thereby forming a bendable part on the rigid-flex PCB 100. That is, the rigid-flex PCB 100 can be bent through the flexible board; the hard board part, that is, at the rigid board 20, can ensure the required hardness of the rigid-flex PCB 100, and there is no need to design a reinforcing sheet, meeting the customer's requirement of being thin and hard at this place.

[0029] Thus, by mutually pressing the two flexible boards 10 and the rigid board 20, it is possible to avoid using a reinforcing sheet, and the flexible board formed at the area of the rigid-flex PCB 100 where there is no rigid board 20 can meet the bending requirements and the space compression requirements. That is, the rigid-flex PCB 100 has the characteristics of a compact structure, small occupied space, bendable function, and high reliability.

[0030] The edge of the flexible board 10 is provided with a plug-in part. Among them, the plug-in part can be a gold finger. That is, the gold finger can be plugged and electrically connected with other circuit boards, which can expand the application scenarios of the rigid-flex PCB 100.

[0031] Through holes are provided at the edges of the flexible board 10. That is, pads are provided at the edges of the flexible board 10. Components are fixed on the pads by soldering through the through holes on the rigid-flexible circuit board 100, and printed conductors connect the components to achieve the electrical connection of the components in the circuit. Specifically, the form of the pads is not limited to one of square pads, circular pads, island pads, and oval pads.

[0032] In the first direction, adjacent rigid boards 20 are spaced apart from each other so that the thickness of the region between two adjacent rigid boards 20 is less than the thickness of the rigid-flexible circuit board 100 at the rigid board 20. That is to say, by separating two adjacent rigid boards 20 from each other, a thinning region can be formed between the two adjacent rigid boards 20 while the two adjacent rigid boards 20 are separated from each other. That is, the thickness of the region between two adjacent rigid boards 20 is less than the thickness at the rigid board 20, which is beneficial to making the thickness of the rigid-flexible circuit board 100 thinner.

[0033] Refer to Figure 1 As shown, the thickness of the rigid board 20 is h1, and h1 satisfies the relationship: 0.15 mm ≤ h1 ≤ 0.2 mm. In this way, the thickness of the rigid board 20 is set between 0.15 mm and 0.2 mm, which can avoid the problem that the rigid board 20 is too thick resulting in too large a thickness of the rigid-flexible circuit board 100, and avoid the rigid board 20 being too thin, so as not to affect subsequent drilling and use. Specifically, if the thickness of the rigid board 20 is greater than 0.2 mm, it will cause the rigid board 20 to be too thick, and then cause the thickness of the rigid-flexible circuit board 100 to be too large. And if the thickness of the rigid board 20 is less than 0.15 mm, it will break or break through during card hole or use.

[0034] Refer to Figure 1 As shown, the thickness of the flexible board 10 is h2, and h2 satisfies the relationship: 0.03 mm ≤ h2 ≤ 0.04 mm. In this way, when the thickness of the flexible board 10 is set between 0.03 mm and 0.04 mm, on the one hand, it can avoid the problem that the flexible board 10 breaks during lamination due to being too thin, and on the other hand, it can avoid the problem that the rigid board 20 is too thick resulting in too large a thickness of the rigid-flexible circuit board 100.

[0035] Refer to Figure 1 and Figure 2As shown, the rigid board 20 includes: two first conductive layers 22, a first insulating layer 21, and two second insulating layers 23. The two first conductive layers 22 are disposed on both sides of the first insulating layer 21, and the two second insulating layers 23 are respectively disposed on the side of the two first conductive layers 22 away from the first insulating layer 21. That is, the first insulating layer 21 is sandwiched between the two first conductive layers 22. The first insulating layer 21 can separate the two first conductive layers 22 and achieve insulation between the two first conductive layers 22. In addition, conduction between the two first conductive layers 22 can also be achieved through vias. Further, a second insulating layer 23 is also disposed between the first conductive layer 22 and the flexible board 10. Through the second insulating layer 23, the first conductive layer 22 and the flexible layer can be separated, and in addition, the insulation strength between the first conductive layer 22 and the flexible layer can be improved, thereby avoiding conduction between the first conductive layer 22 and the flexible layer.

[0036] Referring to Figure 1 and Figure 2 As shown, the flexible layer includes: a second conductive layer 11 and a third insulating layer 12. The third insulating layer 12 is in contact with the rigid layer, and the second conductive layer 11 is disposed on the side of the third insulating layer 12 away from the rigid layer. Among them, the third insulating layer 12 is an electrical insulating layer, and its function is to isolate current leakage between the circuits in the rigid-flex circuit board 100 and the external circuits. And, the second conductive layer 11 is a copper layer, that is, copper layers are provided on both sides of the circuit board, so that electrical conduction can be achieved through both sides of the circuit board.

[0037] The first insulating layer 21 and the second insulating layer 23 can be an epoxy resin layer and a glass cloth layer respectively. Among them, epoxy resin has good electrical insulation, moisture resistance, heat shock resistance, heat resistance, low corrosiveness and other properties. Therefore, epoxy resin can be used as the first insulating layer 21 or the second insulating layer 23. Among them, glass cloth (glass-fibre fabric) is a fabric woven from glass fibers, which has properties such as insulation, heat insulation, corrosion resistance, non-combustibility, high temperature resistance, and high strength. Therefore, glass cloth can be used as the first insulating layer 21 or the second insulating layer 23.

[0038] The third insulating layer 12 can be a polyimide layer. Among them, the polyimide layer has high insulation performance, so the polyimide layer can effectively isolate current leakage between the circuits in the rigid-flex circuit board 100 and the external circuits.

[0039] An electronic device according to an embodiment of the second aspect of the present invention includes: a rigid-flex circuit board 100. Thus, the rigid-flex circuit board 100 on the electronic device has application scenarios with the characteristics of a compact structure, small occupied space, having a bending function, and high reliability.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0041] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0042] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A rigid-flex circuit board (100), characterized in that: include: A plurality of rigid plates (20), wherein the plurality of rigid plates (20) are arranged at intervals from each other, and the rigid plates (20) are composed of a plurality of layer plates; Two flexible boards (10), wherein the two flexible boards (10) are arranged on both sides of the plurality of rigid boards (20) and the rigid boards (20) are arranged at non-edges of the flexible boards (10), so that the thickness at the edge of the rigid-flexible circuit board (100) is less than the thickness of the rigid-flexible circuit board (100) at the rigid board (20).

2. The rigid-flex circuit board (100) according to claim 1, characterized in that: An inserting portion is provided at the edge of the flexible board (10).

3. The rigid-flex circuit board (100) according to claim 2, characterized in that: Through holes are provided at the edge of the flexible board (10).

4. The rigid-flex circuit board (100) according to claim 2, characterized in that: In the first direction, two adjacent rigid boards (20) are spaced apart so that the thickness of the area between the two adjacent rigid boards (20) is smaller than the thickness of the rigid-flex circuit board (100) at the rigid boards (20).

5. The rigid-flex circuit board (100) according to claim 4, characterized in that: The thickness of the rigid plate (20) is h1, and h1 satisfies the relationship: 0.15 mm ≤ h1 ≤ 0.2 mm.

6. The rigid-flex circuit board (100) according to claim 5, characterized in that: The thickness of the flexible board (10) is h2, and h2 satisfies the relationship: 0.03 mm ≤ h2 ≤ 0.04 mm.

7. The rigid-flex circuit board (100) according to claim 4, characterized in that: The rigid board (20) comprises: two first conductive layers (22), a first insulating layer (21) and two second insulating layers (23), wherein the two first conductive layers (22) are arranged on both sides of the first insulating layer (21), and the two second insulating layers (23) are respectively arranged on one side of the two first conductive layers (22) away from the first insulating layer (21).

8. The rigid-flex circuit board (100) according to claim 1, characterized in that: The flexible layer comprises: a second conductive layer (11) and a third insulating layer (12), the third insulating layer (12) being in contact with the rigid layer, and the second conductive layer (11) being arranged on a side of the third insulating layer (12) away from the rigid layer.

9. The rigid-flex circuit board (100) according to claim 1, characterized in that: The first insulating layer (21) and the second insulating layer (23) are respectively an epoxy resin layer and a glass cloth layer; and / or, The third insulating layer (12) is a polyimide layer.

10. An electronic device, characterized in that: include: The rigid-flex circuit board (100) according to any one of claims 1 to 9.

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