Automatic packaging device for circuit board

Abstract

The invention relates to the technical field of circuit board packaging devices, in particular to an automatic circuit board packaging device which comprises a cleaning assembly used for cleaning dust on the surface of a circuit board, the cleaning assembly comprises two sets of guide wheels arranged in a base, and flexible toothed belts are attached to the surfaces of the two sets of guide wheels. The device comprises a flexible toothed belt, moving blocks are fixedly connected to the two ends of the flexible toothed belt, a connecting rope is fixedly connected between the two moving blocks, a gear is connected to the outer surface of the flexible toothed belt in a meshed mode, a driving motor is fixedly connected to the lower end of the gear, hollow pipes are fixedly installed at the upper ends of the two moving blocks, and the upper ends of the hollow pipes communicate with nozzles. Through cooperative use of all parts, dust on the surface of the circuit board can be cleaned when the circuit board is packaged, the circuit board can be kept in a fixed state, and the packaging precision and the packaging quality of the circuit board are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board packaging devices, and specifically to an automatic circuit board packaging device. Background Art

[0002] An automatic circuit board packaging device is a device integrating various automatic technologies, used for packaging circuit boards and electronic components thereon to protect the circuit from external environmental interference and ensure the stability and reliability of the circuit.

[0003] However, during the packaging process of the circuit board, it will be affected by dust in the air. During the packaging process of the circuit board, dust will enter the gaps inside the circuit board and will be embedded on or inside the surface of the circuit board as the packaging material is applied, resulting in defects such as uneven thickness, bubbles, and cracks in the packaging material, thereby reducing the protection effect of the packaging layer. Summary of the Invention

[0004] The purpose of the present invention is to provide an automatic circuit board packaging device to solve the problem in the above-mentioned background art that in the prior art, dust enters the gaps inside the circuit board, resulting in defects such as uneven thickness, bubbles, and cracks in the packaging material, thereby reducing the protection effect of the packaging layer.

[0005] To achieve the above purpose, the present invention provides the following technical solution: an automatic circuit board packaging device, including a base, and further including: two sets of guide grooves symmetrically and quickly penetrated at the surface corners of the base, a baffle fixed on the surface of the base and having an L-shaped structure, a plurality of suction holes are equidistantly opened on one side of the baffle facing the middle position of the base, and the suction holes are communicated with a negative pressure module;

[0006] It further includes a cleaning component for cleaning the surface of the circuit board. The cleaning component includes two guide wheels arranged inside the base. A flexible toothed belt is attached to the surfaces of the two guide wheels. Both ends of the flexible toothed belt are fixedly connected with moving blocks. A connecting rope is fixedly connected between the two moving blocks. The outer surface of the flexible toothed belt is meshed with a gear. The lower end of the gear is fixedly connected with a driving motor. Hollow tubes are fixedly installed at the upper ends of the two moving blocks, and the upper ends of the hollow tubes are communicated with nozzles.

[0007] Further, a groove is opened on the surface of the base, and a plurality of adsorption holes are equidistantly opened on the bottom surface of the groove.

[0008] Further, the two guide wheels are symmetrically distributed at an angle, and the two guide wheels are rotatably connected to the inner wall of the base.

[0009] Further, a limiting wheel is attached to the surface of the connecting rope. The limiting wheel is arranged at a corner inside the base, and the connecting rope is rotatably connected to the inner wall of the base.

[0010] Further, the upper end of the hollow tube penetrates through the inside of the guide groove and slides inside the guide groove, and the lower end of the hollow tube is communicated with the output end of the negative pressure module.

[0011] Further, it further includes two sets of symmetrically arranged limiting components for limiting the circuit board. The limiting component includes a guide rod fixedly installed on one side of the moving block. A round rod is provided on one side of the guide rod, and one end of the round rod is rotatably connected to the inner wall of the base. A driving groove is formed on the surface of the guide rod. A pulley group is sleeved on the surface of the round rod. The other end of the pulley group is fixedly connected with a synchronous rod. First telescopic rods are fixedly installed on the surfaces of the round rod and the synchronous rod. The upper end of the first telescopic rod is movably connected with a second telescopic rod, and a push plate is fixedly installed at the end of the second telescopic rod.

[0012] Further, the driving groove is composed of a set of semi-helical grooves and a set of straight grooves smoothly connected, and the driving groove is slidably matched with the guide rod.

[0013] Further, the plane structure of the transmission belt on the surface of the pulley group is in an ∞ shape, which is used to drive the round rod and the synchronous rod to rotate synchronously and in opposite directions. The synchronous rod is rotatably connected to the inner wall of the base.

[0014] Further, the second telescopic rod is arranged inside a guide groove formed inside the base, and the second telescopic rod is slidably matched with the guide groove. A buffer pad is attached to the side of the push plate close to the circuit board.

[0015] The technical solution provided by the present invention has the following beneficial effects compared with the known prior art:

[0016] First, through the mutually cooperating components such as the guide wheels, connecting ropes, and hollow tubes provided in the present invention, when encapsulating the circuit board, the circuit board is placed inside the groove, and then the negative pressure module and the driving motor are started. The operating driving motor drives the gear to rotate synchronously and drives the flexible toothed belt to start rotating around the guide wheel, so that the flexible toothed belt drives the two moving blocks to move synchronously. At the same time, in cooperation with the started negative pressure module, the gas discharged by the negative pressure module enters the inside of the hollow tube and is discharged through the nozzle and acts on the surface of the circuit board, so that the dust on the surface of the circuit board is blown and sucked by the suction holes, achieving the purpose of cleaning the dust and ensuring the quality of circuit board encapsulation.

[0017] Second, through the cooperation of components such as the guide rod, pulley group, and push plate set in the present invention, when cleaning the surface of the circuit board, the moving block will drive the guide rod to slide inside the driving groove opened on the surface of the round rod, thereby starting to drive the round rod to rotate. At the same time, the pulley group is used to drive the synchronous rod to rotate in the opposite direction synchronously, so that the first telescopic rods installed on the surfaces of the round rod and the synchronous rod start to rotate synchronously, and drive the second telescopic rods to extend from the inside of the base, and drive the buffer pads installed on one side of the push plate to start contacting the circuit board, realizing the correction of the circuit board. Then, the circuit board is adsorbed through the adsorption holes, so that the circuit board is in a fixed state, which is convenient for encapsulation and ensures the accuracy of encapsulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 Schematic diagram of the overall structure of the present invention;

[0020] Figure 2 Schematic diagram of the internal structure of the base of the present invention;

[0021] Figure 3 For Figure 2 Schematic diagram of the enlarged structure at A in

[0022] Figure 4 Schematic diagram of the overall structure of the cleaning component of the present invention;

[0023] Figure 5 For Figure 4 Schematic diagram of the enlarged structure at B in

[0024] Figure 6 Schematic diagram of the overall structure of the limiting component of the present invention.

[0025] In the figure: 1. Base; 101. Guide groove; 102. Groove; 103. Adsorption hole; 2. Baffle; 201. Dust suction hole; 3. Cleaning component; 301. Guide wheel; 302. Flexible toothed belt; 303. Moving block; 304. Connecting rope; 3041. Limiting wheel; 305. Gear; 306. Driving motor; 307. Hollow tube; 4. Limiting component; 401. Guide rod; 402. Round rod; 403. Driving groove; 404. Pulley group; 405. Synchronous rod; 406. First telescopic rod; 407. Second telescopic rod; 408. Push plate. DETAILED DESCRIPTION OF THE INVENTION

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] The following further describes the present invention with reference to embodiments.

[0028] Embodiment: An automatic encapsulation device for a circuit board, as Figures 1 - 6 shown, includes a base 1 for carrying the circuit board to be encapsulated. It should be noted that a feeding module and an encapsulation module are provided above the base 1 for conveying the circuit board and encapsulating the circuit board, and both the feeding module and the encapsulation module are prior arts and are not shown in the figure. Two groups of guide grooves 101 are symmetrically and quickly opened on the surface corners of the base 1, which can play a role in guiding and limiting. A groove 102 is opened on the surface of the base 1. By opening the groove 102, it is convenient for the circuit board to be placed inside it for encapsulation.

[0029] Among them, a plurality of groups of adsorption holes 103 are equidistantly opened on the bottom surface of the groove 102. The guide wheel 301 is communicated with an adsorption module for adsorbing and fixing the circuit board. And a baffle 2 fixedly installed on the surface of the base 1 in an L-shaped structure can form a blocking effect by setting the baffle 2. A plurality of groups of dust suction holes 201 are equidistantly opened on one side of the baffle 2 facing the middle position of the base 1, and the dust suction holes 201 are communicated with a negative pressure module. By setting the dust suction holes 201, it can cooperate with the negative pressure module to generate suction to suck up the blown dust and prevent the dust from spreading everywhere and affecting the encapsulation of the circuit board.

[0030] Combined with the attached Figure 1 -attached Figure 6 , it further includes a cleaning component 3 for cleaning the surface of the circuit board, so that the dust on the surface of the circuit board can be cleaned before encapsulation, reducing the influence of dust on the encapsulation of the circuit board. The cleaning component 3 includes two groups of guide wheels 301 provided inside the base 1. The two groups of guide wheels 301 are symmetrically distributed at an angle, and the two groups of guide wheels 301 are rotatably connected to the inner wall of the base 1. By setting the guide wheels 301, it can play a role in guiding and limiting.

[0031] Among them, the surfaces of two groups of guide wheels 301 are attached with a flexible toothed belt 302. By setting the flexible toothed belt 302, it can cooperate with other components to achieve movement. It should be noted that the flexible toothed belt 302 is sleeved on the surface of the guide wheel 301 and has an L-shaped structure. Both ends of the flexible toothed belt 302 are fixedly connected with moving blocks 303. By setting the moving blocks 303, when the flexible toothed belt 302 moves, the moving blocks 303 can be driven to move synchronously. It should be noted that when the two groups of moving blocks 303 move, their moving directions are different. Combined with the attached Figure 1 , one group of moving blocks 303 moves up and down, and the other group of moving blocks 303 moves left and right.

[0032] Among them, a connecting rope 304 is fixedly connected between the two groups of moving blocks 303. By setting the connecting rope 304, it can play a connecting role, so that the two groups of moving blocks 303 can move simultaneously. The surface of the connecting rope 304 is attached with a limiting wheel 3041. The limiting wheel 3041 is arranged at a corner inside the base 1, and the connecting rope 304 is rotatably connected to the inner wall of the base 1. By setting the limiting wheel 3041, the connecting rope 304 can be limited, so that the connecting rope 304 will not deviate, ensuring that the two groups of moving blocks 303 can move normally. The outer surface of the flexible toothed belt 302 is meshed with a gear 305. By setting the gear 305, it can cooperate with the flexible toothed belt 302 to drive the flexible toothed belt 302 to move, achieving the purpose of driving the moving blocks 303 to move.

[0033] Among them, a driving motor 306 is fixedly connected to the lower end of the gear 305. The driving motor 306 is a servo motor and can rotate forward and backward to control the rotation and reset of the flexible toothed belt 302. Hollow tubes 307 are fixedly installed at the upper ends of the two groups of moving blocks 303, and nozzles are communicated with the upper ends of the hollow tubes 307. The lower ends of the hollow tubes 307 are communicated with the output end of the negative pressure module. By setting the hollow tubes 307 and the nozzles, gas can be ejected to act on the surface of the circuit board to achieve the purpose of dust cleaning. It should be noted that the negative pressure module includes a filter, and the output end of the filter is communicated with the hollow tube 307, so that the air sucked by the negative pressure module is discharged after dust removal and then acts on the surface of the circuit board to ensure the cleanliness of the surface of the circuit board. The upper end of the hollow tube 307 penetrates through the inside of the guide groove 101 and slides inside the guide groove 101.

[0034] Combined with the attached Figure 1 - attached Figure 6, further comprising two sets of symmetrically arranged limiting components 4 for limiting the circuit board, so that during the process of cleaning the dust on the surface of the circuit board, position correction can be performed, and adsorption and fixation are carried out in cooperation with the adsorption holes 103 to ensure the stability and packaging accuracy of the circuit board during the packaging process; the limiting component 4 includes a guide rod 401 fixedly installed on one side of the moving block 303, and the guide rod 401 can move synchronously with the moving block 303, so as to drive other components to move; a round rod 402 is arranged on one side of the guide rod 401, and one end of the round rod 402 is rotatably connected to the inner wall of the base 1. By setting the round rod 402, power can be provided for the subsequent fixation of the circuit board through its rotation;

[0035] Wherein, a driving groove 403 is formed on the surface of the guide rod 401. The driving groove 403 is composed of a set of semi-spiral grooves and a set of straight grooves smoothly connected. The driving groove 403 is slidably matched with the guide rod 401. By setting the driving groove 403, it can cooperate with the guide rod 401. When the guide rod 401 follows the moving block 303 to move, it can slide inside the driving groove 403 to achieve the purpose of driving the round rod 402 to rotate; it is worth noting that the semi-spiral groove is first slidably matched with the guide rod 401, and the straight groove is formed through the surface of the round rod 402. When the guide rod 401 follows the moving block 303 to move synchronously, it will move from the semi-spiral groove to the straight groove; a pulley group 404 is sleeved on the surface of the round rod 402, and the plane structure of the transmission belt on the surface of the pulley group 404 is in the shape of ∞. By setting the pulley group 404, it can drive its rotation when the round rod 402 rotates, and synchronously drive the components fixedly connected to the other end of the pulley group 404 to rotate, and the rotation direction is opposite to that of the round rod 402;

[0036] Wherein, the other end of the pulley group 404 is fixedly connected with a synchronous rod 405, and the synchronous rod 405 is rotatably connected to the inner wall of the base 1. By setting the synchronous rod 405, it can rotate under the action of the pulley group 404, and the rotation direction is opposite to that of the round rod 402; first telescopic rods 406 are fixedly installed on the surfaces of the round rod 402 and the synchronous rod 405. By setting the first telescopic rods 406, they can rotate synchronously with the round rod 402 and the synchronous rod 405; it is worth noting that in combination with the attached Figure 6, in the initial state, the first telescopic rod 406 is in a contracted state; the upper end of the first telescopic rod 406 is movably connected to a second telescopic rod 407. The second telescopic rod 407 is arranged inside a guiding groove formed inside the base 1, and the second telescopic rod 407 is in sliding fit with the guiding groove. By providing the second telescopic rod 407, when the first telescopic rod 406 rotates following the round rod 402 and the synchronous rod 405, it can synchronously push the second telescopic rod 407 to extend from inside the guiding groove; it should be noted that by making the second telescopic rod 407 telescopic, it can thus adapt to circuit boards of different specifications, increasing the practicality of the device; a push plate 408 is fixedly installed at the end of the second telescopic rod 407. By providing the push plate 408, it can thus move synchronously with the second telescopic rod 407 and come into contact with the circuit board; a buffer pad is attached to the side of the push plate 408 close to the circuit board. By providing the buffer pad, it can play a buffering role and avoid damaging the circuit board.

[0037] Specifically, when encapsulating the circuit board, first place the circuit board into the inside of the groove 102, and then start the negative pressure module and the drive motor 306. The operating drive motor 306 will drive the gear 305 to rotate synchronously, and drive the flexible toothed belt 302 to start rotating around the guide pulley 301. The rotating flexible toothed belt 302 will drive two groups of moving blocks 303 to move synchronously, and at the same time drive the hollow tube 307 to move inside the guide groove 101; and in cooperation with the started negative pressure module, the gas discharged by the negative pressure module will enter the inside of the hollow tube 307 after being filtered and be discharged through the nozzle, so that the discharged gas uniformly acts on the surface of the circuit board following the movement of the moving block 303, and the dust on the surface of the circuit board is blown and sucked by the suction holes 201, achieving the purpose of cleaning the dust and ensuring the quality of circuit board encapsulation;

[0038] When cleaning the dust on the surface of the circuit board, the moving moving block 303 will drive the guide rod 401 to slide inside the driving groove 403 formed on the surface of the round rod 402, starting to drive the round rod 402 to rotate. The rotating round rod 402, in cooperation with the pulley set 404 sleeved on its surface, will drive the synchronous rod 405 to rotate synchronously and in the opposite direction, causing the first telescopic rods 406 installed on the surfaces of the round rod 402 and the synchronous rod 405 to start rotating synchronously and in the opposite direction. The rotating first telescopic rods 406 will drive the second telescopic rods 407 to start extending from inside the guiding groove, and drive the push plate 408 to extend and come into contact with the surface of the circuit board, causing the buffer pad installed on one side of the push plate 408 to start coming into contact with the circuit board, realizing the correction of the circuit board. Then, through the cooperation of the adsorption module and the adsorption holes 103, start to adsorb and fix the circuit board, so that the circuit board is in a fixed state during the encapsulation process, facilitating encapsulation and ensuring the accuracy of encapsulation.

[0039] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board automatic packaging device, comprising a base (1), characterized in that: Also includes: The surface of the base (1) is symmetrically provided with two groups of guide grooves (101), and a baffle (2) in an L-shaped structure is fixedly mounted on the surface of the base (1); a plurality of groups of dust suction holes (201) are equidistantly provided on one side of the baffle (2) facing the middle of the base (1), and the dust suction holes (201) are connected to a negative pressure module; It also includes a cleaning component (3) for cleaning the surface of the circuit board, the cleaning component (3) including two groups of guide wheels (301) arranged inside the base (1), the surfaces of the two groups of guide wheels (301) are bonded with flexible toothed belts (302), both ends of the flexible toothed belts (302) are fixedly connected with moving blocks (303), a connecting rope (304) is fixedly connected between the two groups of moving blocks (303), the outer surface of the flexible toothed belt (302) is meshingly connected with a gear (305), the lower end of the gear (305) is fixedly connected with a driving motor (306), the upper ends of the two groups of moving blocks (303) are fixedly installed with hollow tubes (307), and the upper ends of the hollow tubes (307) are connected with nozzles.

2. The circuit board automatic packaging device according to claim 1, characterized in that: A groove (102) is provided on the surface of the base (1), and a plurality of groups of adsorption holes (103) are provided at equal intervals on the bottom surface of the groove (102).

3. The circuit board automatic packaging device according to claim 2, characterized in that: The two groups of guide wheels (301) are angularly symmetrically distributed, and the two groups of guide wheels (301) are rotatably connected to the inner wall of the base (1).

4. The circuit board automatic packaging device according to claim 3, characterized in that: The surface of the connecting rope (304) is fitted with a limiting wheel (3041), the limiting wheel (3041) is arranged at a corner inside the base (1), and the connecting rope (304) is rotatably connected to the inner wall of the base (1).

5. The circuit board automatic packaging device according to claim 1, characterized in that: The upper end of the hollow tube (307) penetrates through the interior of the guide groove (101) and slides inside the guide groove (101), and the lower end of the hollow tube (307) is connected to the output end of the negative pressure module.

6. The circuit board automatic packaging device according to claim 1, characterized in that: The invention also comprises two groups of symmetrically arranged limiting assemblies (4) for limiting the position of the circuit board, wherein the limiting assembly (4) comprises a guide rod (401) fixedly mounted on one side of the moving block (303), a round rod (402) being provided on one side of the guide rod (401), and one end of the round rod (402) being rotatably connected to the inner wall of the base (1), a driving groove (403) being provided on the surface of the guide rod (401), a belt pulley group (404) being sleeved on the surface of the round rod (402), and a synchronous rod (405) being fixedly connected to the other end of the belt pulley group (404), a first telescopic rod (406) being fixedly mounted on the surface of both the round rod (402) and the synchronous rod (405), the upper end of the first telescopic rod (406) being movably connected to the second telescopic rod (407), and a push plate (408) being fixedly mounted on the end of the second telescopic rod (407).

7. The circuit board automatic packaging device according to claim 6, characterized in that: The driving groove (403) is composed of a group of semi-spiral grooves and a group of straight grooves connected smoothly, and the driving groove (403) is slidably matched with the guide rod (401).

8. The circuit board automatic packaging device according to claim 6, characterized in that: The transmission belt plane structure on the surface of the pulley group (404) is in an ∞ shape, which is used to drive the round rod (402) and the synchronous rod (405) to rotate synchronously, and the rotation directions are opposite. The synchronous rod (405) is rotatably connected to the inner wall of the base (1).

9. The circuit board automatic packaging device according to claim 6, characterized in that: The second telescopic rod (407) is arranged inside a guide groove opened inside the base (1), and the second telescopic rod (407) is slidably matched with the guide groove, and a buffer pad is attached to a side of the push plate (408) close to the circuit board.

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