Multilayer sandwich type ultrathin and superhard abrasive dicing blade and preparation method thereof

Abstract

The invention discloses a multilayer sandwich type ultrathin superhard abrasive dicing blade and a preparation method thereof.The multilayer sandwich type ultrathin superhard abrasive dicing blade is composed of a center layer, N composite layers A and N composite layers B, the N composite layers A and the N composite layers B are axially and symmetrically arranged on the two sides of the center layer, the composite layers A, the composite layers B and the center layer are all composed of matrix phases and superhard abrasives, the volume fractions of the superhard abrasives in the surface layer of the composite layer A and the surface layer of the composite layer B are sequentially reduced or increased from the center layer to the surface layer of the composite layer A, and / or the particle sizes of the superhard abrasives in the surface layer of the composite layer B are reduced or increased from the center layer to the surface layer of the composite layer A and the surface layer of the composite layer B. By designing a symmetrical multilayer structure, the composition dissimilation and synergy preparation process in the ultrathin and superhard abrasive dicing blade is realized, the uniformity and the flatness of the dicing blade are effectively guaranteed, the stability and the durability of the morphology of a blade edge in the use process are optimized, and the service life of the dicing blade is prolonged. The service life of the ultrathin and superhard abrasive dicing blade is greatly prolonged, and the dicing quality of the ultrathin and superhard abrasive dicing blade is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of superhard material preparation, and particularly relates to a multi-layer sandwich type ultra-thin superhard abrasive dicing blade and a preparation method thereof. Background Art

[0002] An ultra-thin superhard abrasive (superhard abrasive) dicing blade is a high-precision tool with diamond or cubic boron nitride as the main abrasive cutting material. It not only has extremely high hardness and wear resistance, and is specially used for cutting high-precision and high-hardness materials, especially suitable for scenarios with extremely strict requirements for material damage and cutting width. Due to its excellent performance, the superhard abrasive dicing blade is widely used in high-tech fields such as precision machining, electronics and microelectronics manufacturing, and optical components. Currently, there are mainly three preparation methods for industrialized ultra-thin superhard abrasive dicing blades: hot pressing sintering method, electroplating method, and cured resin method. Although there are already mature production processes, the ultra-thin superhard abrasive dicing blades on the market are basically single-component and single-structure single-layer dicing blades. During actual use, common problems such as blade edge deformation (V-shaped, ∩-shaped, cracks, etc.), superhard abrasive shedding, and matrix fatigue will occur in the dicing blade. It is difficult for the blade edge to remain sharp and flat for a long time, reducing the cutting accuracy and stability. Compared with a single structure, a multi-layer structure ultra-thin superhard abrasive dicing blade can disperse and relieve the stress during the cutting process, and can more effectively disperse the heat during the cutting process, reducing thermal damage or thermal deformation, thereby providing higher strength, toughness, extending the service life, and improving the dicing effect.

[0003] The hot pressing sintering method is one of the key technologies for preparing ultra-thin superhard abrasive dicing blades. Combining high temperature and high pressure conditions, the superhard abrasive particles are evenly distributed in the binder, and a dense and high-hardness superhard abrasive composite material is formed through heating and pressing. Although the hot pressing sintering method can be mass-produced at present, the subsequent thinning is difficult and the manufacturing cost is high. At the same time, due to the homogenization treatment such as ball milling in this method, it is easy to cause uneven distribution of superhard abrasive grains, with high process control requirements, and it is difficult to obtain a multi-layer structure ultra-thin superhard abrasive dicing blade through multiple powder spreading and pressing.

[0004] The electroplating method for preparing ultra-thin superhard abrasive dicing blades is to electro-deposit a binder on the surface of a metal matrix, embed superhard abrasive particles, and form a dense metal layer through continuous electroplating to fix the superhard abrasive particles and ensure the tight combination of the matrix and the superhard abrasive. The advantage of the electroplating method for preparing ultra-thin superhard abrasive dicing blades is that it can be precisely controlled by electrochemical means, with high process flexibility, high exposure rate of superhard abrasives, and low cost; however, compared with the hot pressing sintering method, the binding force between the electroplated superhard abrasives and the matrix is insufficient, the superhard abrasives are easy to fall off, the service life of the dicing blade is short, and the pollution problems such as wastewater and heavy metals in the electroplating industry are serious, with certain limitations in industrial production.

[0005] At present, the cured resin method has also been developed into a common preparation technology for superhard abrasive tools. By dispersing superhard abrasive particles in a resin matrix and using thermal curing or light curing to form a dense superhard abrasive composite material. The superhard abrasive dicing blades prepared by this method have a large process adjustment range and good shock absorption performance, and are widely used in the precision machining field of hard and brittle materials. However, the strength of the resin matrix is limited, its performance deteriorates in a high-temperature environment, the high-temperature resistance and durability of the dicing blade are poor, and the shrinkage and stress during the curing process make it difficult to control the thickness and uniformity of the dicing blade. Summary of the Invention

[0006] To overcome the deficiencies of the prior art, the first object of the present invention is to provide a multi-layer sandwich-type ultra-thin superhard abrasive dicing blade. By setting structural layers with different formulas and stacking them in a sandwich structure, a multi-layer strength structure is realized to solve the common deformation problem of the cutting edge of the ultra-thin superhard abrasive dicing blade during use. Maintaining the cutting edge morphology of the dicing blade can effectively improve the service life of the dicing blade and improve the dicing effect.

[0007] The second object of the present invention is to provide a preparation method for a multi-layer sandwich-type ultra-thin superhard abrasive dicing blade. The present invention uses a 3D printing method of fused deposition modeling (FDM) to prepare a multi-layer sandwich-type ultra-thin superhard abrasive dicing blade. Using this method, there is no need to use a specific substrate, which greatly improves the uniformity and flatness of the dicing blade, and effectively improves problems such as uneven distribution of superhard abrasive grains and inhomogeneous substrate.

[0008] To achieve the above object, the present invention adopts the following technical solutions:

[0009] The present invention provides a multi-layer sandwich-type ultra-thin superhard abrasive dicing blade, which is composed of a central layer and N composite layers A and N composite layers B symmetrically arranged on both sides of the central layer in the axial direction. The composite layer A, the composite layer B, and the central layer are all composed of a matrix phase and superhard abrasives. Among them, the volume fraction of superhard abrasives in the surface layer of the composite layer A and the surface layer of the composite layer B decreases or increases in turn from the central layer, and / or the particle size of the superhard abrasives in the surface layer of the composite layer A and the surface layer of the composite layer B becomes finer or coarser from the central layer.

[0010] The present invention provides a multi-layer sandwich-type ultra-thin superhard abrasive dicing blade. Based on the central layer and the symmetrically arranged composite layers, a multi-layer strength structure is realized to solve the common deformation problem of the cutting edge of the ultra-thin superhard abrasive dicing blade during use. Maintaining the cutting edge morphology of the dicing blade can effectively improve the service life of the dicing blade and improve the dicing quality effect.

[0011] Among them, when the volume fraction of superabrasives in the surface layer of composite layer A and the surface layer of composite layer B decreases successively from the central layer, it is suitable for preparing a superabrasive scribing tool with a cross-sectional profile of bevel chamfer (common degrees are 15° - 60°). By controlling the superabrasive concentration, the central layer has greater strength and better wear resistance, which can slow down the change of the cross-sectional angle, effectively optimize the problem that the scribing tool is ground flat or a V-shaped wear appears at the cutting edge during actual use, and improve the service life of the scribing tool.

[0012] When the volume fraction of superabrasives in the surface layer of composite layer A and the surface layer of composite layer B increases successively from the central layer, it is suitable for preparing a superabrasive scribing tool with a cross-sectional profile of rectangle or arrow shape. By controlling the superabrasive concentration, the composite layer has greater strength and better wear resistance, which helps to slow down the wear rate of the contact layer of the scribing tool, effectively optimize the problem of excessive wear on the outer side and ∩-shaped deformation at the cutting edge, and improve the service life of the scribing tool.

[0013] In a preferred solution, when the volume fraction of superabrasives in the surface layer of composite layer A and the surface layer of composite layer B decreases successively from the central layer in the multi-layer sandwich-type ultra-thin superabrasive scribing tool, in the central layer, the volume fraction of superabrasives is 20% - 70%; the volume fraction of the matrix phase is 30 - 80%; and from the central layer to the surface layer of composite layer A and the surface layer of composite layer B, the volume fraction of superabrasives decreases by 2 - 20% layer by layer;

[0014] When the volume fraction of superabrasives in the surface layer of composite layer A and the surface layer of composite layer B increases successively from the central layer in the multi-layer sandwich-type ultra-thin superabrasive scribing tool, in the central layer, the volume fraction of superabrasives is 2% - 60%; the volume fraction of the matrix phase is 40 - 98%; and from the central layer to the surface layer of composite layer A and the surface layer of composite layer B, the volume fraction of superabrasives increases by 2 - 20% layer by layer.

[0015] In the present invention, any composite layer or central layer is regarded as a structural layer, and the multi-layer sandwich-type ultra-thin superabrasive scribing tool provided by the present invention has a total of 2N + 1 structural layers.

[0016] In a preferred solution, when the particle size of superabrasives in the multi-layer sandwich-type ultra-thin superabrasive scribing tool decreases successively from the central layer to the surface layer of composite layer A and the surface layer of composite layer B, in each structural layer, the particle size of superabrasives is 1μm - 450μm, preferably 10 - 200μm, and from the central layer to the surface layer of composite layer A and the surface layer of composite layer B, the particle size of superabrasives decreases by at least one particle size layer by layer, preferably by 0.5 - 20μm.

[0017] In a preferred embodiment, for the multi-layer sandwich type ultra-thin super-abrasive scribing blade, when the particle size of the super-abrasives gradually increases from the central layer to the surface layer of composite layer A and the surface layer of composite layer B, in each structural layer, the particle size of the super-abrasives is 1 - 450 μm, preferably 10 - 200 μm, and from the central layer to the surface layer of composite layer A and the surface layer of composite layer B, the particle size of the super-abrasives increases by at least one grit size layer by layer, preferably by 0.5 - 20 μm.

[0018] Since the particle size setting of the super-abrasives in the ultra-thin scribing blade is mainly affected by requirements such as the cutting object, cutting accuracy, and cutting speed, generally, super-abrasives with a particle size finer than 20 μm are suitable for high-precision machining, and higher surface quality and finer cutting can be obtained. Larger particle size super-abrasives have higher cutting efficiency and rougher surfaces, and are suitable for mass cutting of ceramics, stones, etc. Therefore, if the particle size change in each structural layer of the multi-layer sandwich type ultra-thin super-abrasive scribing blade is too small, the optimization effect of the sandwich structure is not obvious; if the particle size change is too large, the cutting accuracy does not meet the standard and the cutting scenario is not applicable.

[0019] In a preferred embodiment, the matrix phases of composite layer A, composite layer B, and the central layer, by mass fraction, are all composed as follows: 40% - 80% copper-tin alloy, 5% - 20% tungsten carbide, 0% - 10% of M, and M is selected from at least one of cobalt, iron, titanium, and zinc.

[0020] In a preferred embodiment, the super-abrasive is diamond and / or cubic boron nitride.

[0021] In the present invention, the matrix phase compositions of each structural layer of the multi-layer sandwich type ultra-thin super-abrasive scribing blade are the same, and the matrix phase volume fraction changes correspondingly with the volume fraction of the super-abrasives. Among them, since tungsten carbide has high hardness and thermal conductivity, and its thermal expansion coefficient is similar to that of the super-abrasives, tungsten carbide is used as the skeleton component of the matrix phase to provide limit and support for the super-abrasives; copper-tin alloy, iron, cobalt, etc. are used as metal binders to uniformly disperse the super-abrasives and firmly bond the matrix phase and the super-abrasives. Using the above matrix phase components can, firstly, avoid the difference in thermal expansion coefficients between different materials, reduce interface stress and defects; secondly, maintain the consistency of the super-abrasive growth process and contribute to improving crystal quality; at the same time, using the same matrix phase composition in each structural layer is beneficial to maintaining the consistency of heat conduction, improving the quality and performance of the scribing blade.

[0022] In a preferred embodiment, N is 1 - 7, preferably 1 - 3. The inventor found that controlling the number of layers of the composite layer within the above range is optimal. If the number of layers is too many, the stress at the interface of the scribing blade increases, reducing the performance of the scribing blade, and too many superimposed layers are likely to exceed the thickness limit of the ultra-thin scribing blade.

[0023] Preferably, the total thickness of the dicing blade is ≤ 1 mm, and the thickness of any structural layer is 0.01 - 0.45 mm, preferably 0.1 - 0.4 mm. Controlling the thickness of each structural layer within the above range provides the optimal performance. If the structural layer is too thin, it requires high requirements for 3D printing equipment, has fast wear, and a short service life. If the structural layer is too thick, the total thickness exceeds the thickness limit of the ultra-thin dicing blade, which does not meet the requirements of the dicing blade.

[0024] The present invention also provides a method for preparing a multi-layer sandwich ultra-thin and ultra-hard abrasive dicing blade. Ultra-hard abrasive micropowder, matrix phase powder, and binder are respectively proportioned according to the designed components and designed particle sizes of each structural layer. After mixing, N + 1 groups of mixed materials are obtained. The N + 1 groups of mixed materials are respectively subjected to internal mixing, granulation, and wire making to obtain N + 1 groups of structural layer filaments. Then, the N + 1 groups of structural layer filaments are successively placed into the feeding port of a 3D printer for 3D printing to obtain a green body, and the green body is degreased and sintered to obtain a multi-layer sandwich ultra-thin and ultra-hard abrasive dicing blade.

[0025] Preferably, the particle size of the matrix phase powder is ≤ 450 μm, preferably 20 - 100 μm.

[0026] During the actual operation process, the ultra-hard abrasive micropowder is proportioned according to the particle size of the ultra-hard abrasive of each layer of the multi-layer sandwich ultra-thin and ultra-hard abrasive dicing blade. Using the ultra-hard abrasive micropowder and matrix phase powder within the particle size range of the present invention can ensure both material uniformity and printing accuracy. If the particle size of the raw material is too small, agglomeration will occur, affecting the uniformity of the dicing blade. If it is too large, the printing accuracy will be reduced, affecting the denseness of the dicing blade.

[0027] Preferably, the binder in the N + 1 groups of mixed materials, by mass percentage, comprises the following components: styrene-butadiene block copolymer 30 - 75%, polyurethane 5 - 35%, polyvinyl butyral 5 - 10%, acrylonitrile-butadiene-styrene copolymer 3 - 6%, trimellitate 3 - 6%.

[0028] Further preferably, the binder in the N + 1 groups of mixed materials, by mass percentage, comprises the following components: styrene-butadiene block copolymer 50 - 60%, polyurethane 20 - 35%, polyvinyl butyral 5 - 10%, acrylonitrile-butadiene-styrene copolymer 3 - 6%, trimellitate 3 - 6%.

[0029] Preferably, the temperature of the internal mixing, granulation, and wire drawing is 100 - 300 °, and the rotation speed of the wire drawing is 10 - 200 rpm.

[0030] Preferably, the diameters of the N + 1 groups of structural layer filaments are all 1.65 to 1.85 mm. During the actual operation, the N + 1 groups of mixtures are respectively put into a mixer for mixing to obtain the feed materials for each structural layer. The feed materials are put into a granulator in batches for granulation, and then the batches of granular materials are put into a wire drawing machine to respectively obtain N + 1 groups of structural layer filaments with diameters all being 1.75 mm ± 0.10 mm.

[0031] Preferably, the preparation method of the multi-layer sandwich type ultra-thin and ultra-hard abrasive dicing blade uses a fused deposition modeling 3D printer. During the actual use process, the model of the overall structure of the ultra-thin and ultra-hard abrasive dicing blade is pre-drawn in a computer, the model is imported into the printer slicing software to set the printing parameters, and then it is imported into the 3D printer; the filamentous materials are put into the printer according to the structural layer settings for printing. When the printing of the bottom structural layer is completed, the printer program is paused, the filament for the next structural layer is replaced and the printing of this structural layer is completed. The filaments are replaced in sequence according to the settings for printing to obtain the green body of the multi-layer sandwich type ultra-thin and ultra-hard abrasive dicing blade.

[0032] Preferably, the process parameters of the 3D printing are: printing speed 10 to 300 mm / s, printing layer thickness 0.01 mm to 2 mm, and printing temperature 100 to 350 °C.

[0033] Preferably, the debinding is carried out in a hydrogen atmosphere. The debinding process is as follows: from room temperature, the temperature is raised at a rate of 5 to 10 °C / min to 80 to 120 °C and held for 0.5 to 1 h; then the temperature is raised at a rate of 3 to 10 °C / min to 180 to 230 °C and held for 1 to 2.5 h; then the temperature is raised at a rate of 1 to 5 °C / min to 300 to 330 °C and held for 0.5 to 1.5 h; then the temperature is raised at a rate of 1 to 5 °C / min to 400 to 430 °C and held for 0.5 to 1.5 h; finally, the temperature is raised at a rate of 2 to 6 °C / min to 500 to 620 °C and held for 0.5 to 2 h. After the thermal debinding program is completed, it is cooled with the furnace to obtain the debound blank of the ultra-thin and ultra-hard abrasive dicing blade. Subsequently, the debound blank is sintered to obtain the multi-layer sandwich type ultra-thin and ultra-hard abrasive dicing blade.

[0034] Preferably, the sintering is hot press sintering. The temperature of the hot press sintering is 700 to 1000 °C, and the sintering pressure is 50 to 200 kg / cm 2 , and the holding time under pressure is 120 s to 600 s. After the holding under pressure is completed, the pressure is slowly released and the temperature is lowered to obtain the multi-layer sandwich type ultra-thin and ultra-hard abrasive dicing blade. In the present invention, due to the composition of the matrix phase and the ultra-thinness of the dicing blade, sintering and forming can be achieved at a relatively low temperature.

[0035] Beneficial effects:

[0036] The present invention provides a multi-layer sandwich-type ultra-thin and ultra-hard abrasive dicing blade. Composite layers are stacked from the central layer to both sides. By setting different compositions for each structural layer, unique physical properties are provided for the dicing blade, improving the bending resistance and structural stability of the dicing blade, reducing the deformation of the cutting edge morphology, and effectively increasing the service life of the dicing blade.

[0037] The present invention adopts the fused deposition modeling 3D printing process. This process can not only improve the uniformity of each structural layer, but also does not require the use of a specific substrate, and stably improves the flatness of the dicing blade. At the same time, this 3D printing preparation method can adjust the number of structural layers and the formula according to actual needs to achieve personalized configuration for specific scenarios or performances. Characteristics such as strength, thermal conductivity, electrical conductivity, and optical properties can all be expanded by using this method. Brief Description of the Drawings

[0038] Figure 1 It is a schematic diagram of a multi-layer sandwich-type ultra-thin and ultra-hard abrasive dicing blade. Detailed Embodiments

[0039] In order to make the content of the present invention easier to be clearly understood, the following further detailed description is made on the present invention according to specific embodiments.

[0040] Example 1

[0041] Design a three-layer sandwich-type ultra-thin diamond dicing blade with a diameter × height dimension of 50 mm × 0.6 mm, and the height of each structural layer is 0.2 mm. The diamond concentration of the central layer is 30%, and the diamond concentrations of composite layers A1 and B1 are 20%; the matrix phase composition of each structural layer is 70% volume fraction of CuSn 10 , 20% volume fraction of Co, and 10% volume fraction of WC; the mass ratio of the matrix phase powder to the binder in each structural layer is 10:1, and the binder components are all: 55% styrene-butadiene block copolymer, 30% polyurethane, 5% polyvinyl butyral, 5% acrylonitrile-butadiene-styrene copolymer, 5% trimellitate. The particle size of the diamond powder is 100 - 120 μm, and the particle size of the binder powder is 100 - 120 μm.

[0042] This example provides a 3D printing manufacturing process for a multi-layer sandwich-type ultra-thin diamond dicing blade, including the following steps:

[0043] 1) Preparation of printing filaments: Weigh appropriate amounts of diamond powder, metal powder, and binder respectively, mix them evenly, and then put them into a kneader for sufficient kneading. The obtained central layer feedstock and composite layer feedstock are put into a granulator in batches for granulation, and then the two kinds of granular materials are put into a wire drawing machine to extrude the central layer filament and composite layer filament with a diameter of 1.75 mm ± 0.10 mm respectively;

[0044] 2) Printing model and parameter design: Draw the model of the three-layer sandwich-type ultra-thin diamond scribing tool in a computer, import the model into slicing software to set printing parameters, and then export the printing file; the printing parameters are a nozzle diameter of 1 mm, a layer height of 0.5 mm, an extrusion rate of 50 mm / s, and a flow rate of 100%;

[0045] 3) Green body printing: Import the printing file into a dual-nozzle 3D printer, put the two filaments into the two feeding ports of the dual-nozzle printer respectively, start the printer, and the printer prints by exchanging nozzles layer by layer according to the program settings to obtain the green body of the three-layer sandwich-type ultra-thin diamond scribing tool;

[0046] 4) Green body debinding: Load the obtained green body into a graphite mold, put it into a vacuum debinding furnace for thermal debinding to remove the binder completely, and the vacuum degree is 3.0×10 -3 Pa; Debinding heating program: First, raise the temperature from room temperature to 100 °C at a rate of 10 °C / min and hold for 0.5 h at 100 °C; then raise the temperature from 100 °C to 220 °C at a rate of 5 °C / min and hold for 1 h at 220 °C; then raise the temperature from 220 °C to 300 °C at a rate of 3 °C / min and hold for 1 h at 300 °C; then raise the temperature from 300 °C to 400 °C at a rate of 3 °C / min and hold for 1 h at 400 °C; finally, raise the temperature from 400 °C to 550 °C at a rate of 3 °C / min and hold for 1 h at 550 °C, and finally cool with the furnace and take out the sample;

[0047] 5) Hot pressing sintering synthesis: Load the debound blank into a graphite mold, put it into an intermediate frequency sintering furnace for hot pressing sintering, the sintering temperature is 750 °C, the sintering pressure is 5 MPa, and the sintering time is 150 s. After completion, take it out of the mold to obtain the three-layer sandwich-type ultra-thin diamond scribing tool.

[0048] Example 2

[0049] Design a five-layer sandwich-type ultra-thin cubic boron nitride scribing tool with a diameter × height dimension of 60 mm × 0.9 mm, a center layer height of 0.1 mm, and four composite layer heights of 0.2 mm each. The cubic boron nitride concentration in the center layer is 10%, the cubic boron nitride concentration in the A1 layer and the B1 composite layer is 20%, and the cubic boron nitride concentration in the A2 and B2 composite layers is 30%; the matrix phase composition of each structural layer is 70% volume fraction of CuSn 12 、20% volume fraction of WC, 5% volume fraction of Fe, 5% volume fraction of Ti; the mass ratio of the binder powder to the binder in each structural layer is 10:1, and the binder components are: 55% styrene-butadiene block copolymer, 30% polyurethane, 5% polyvinyl butyral, 5% acrylonitrile-butadiene-styrene copolymer, 5% trimellitate. The particle size of the cubic boron nitride powder is 100 - 120 μm, and the particle size of the binder powder is 100 - 200 μm.

[0050] This example provides a 3D printing manufacturing process for a multi-layer sandwich-type ultra-thin cubic boron nitride scribing tool, including the following steps:

[0051] 1) Preparation of printing filaments: Weigh appropriate amounts of cubic boron nitride powder, binder powder, and adhesive respectively, mix them evenly, and then put them into a kneader for sufficient kneading. The obtained central layer feedstock and two composite layer feedstocks are granulated in batches in a granulator, and then the three kinds of granular materials are extruded in a wire drawing machine respectively to obtain a central layer filament and a composite layer filament with a diameter of 1.75 mm ± 0.10 mm;

[0052] 2) Printing model and parameter design: Draw the model of the five-layer sandwich-type ultra-thin cubic boron nitride scribing tool in a computer, import the model into slicing software to set printing parameters, and then export the printing file; the printing parameters are a nozzle diameter of 1 mm, a layer height of 0.2 - 0.4 mm, an extrusion rate of 30 mm / s, and a flow rate of 100%;

[0053] 3) Green body printing: Import the printing file into a 3D printer, put the filaments of the A2 and B2 layer composite layers into the feeding port of the printer. When the printing of the B2 layer composite layer is completed, pause the printer program, replace the filaments with the filaments of the A1 and B1 layer composite layers and continue printing. When the printing of the B1 layer composite layer is completed, pause the printer program, replace the filaments with the filaments of the central layer and continue printing. When the printing of the central layer is completed, pause the printer program, replace the filaments with the filaments of the A1 and B1 layer composite layers and continue printing. When the printing of the A1 layer composite layer is completed, pause the printer program, replace the filaments with the filaments of the A2 and B2 layer composite layers to complete all printing programs. After printing, a green body of the five-layer sandwich-type ultra-thin cubic boron nitride scribing tool is obtained;

[0054] 4) Debinding of the green body: Put the obtained green body into a graphite mold and place it in a vacuum debinding furnace for thermal debinding to remove the adhesive completely. The vacuum degree is 3.0×10 -3 Pa; Debinding heating program: First, raise the temperature from room temperature to 120 °C at a rate of 10 °C / min and hold for 1 h at 120 °C; then raise the temperature from 120 °C to 200 °C at a rate of 6 °C / min and hold for 1 h at 200 °C; then raise the temperature from 200 °C to 300 °C at a rate of 3 °C / min and hold for 1.5 h at 300 °C; then raise the temperature from 300 °C to 400 °C at a rate of 3 °C / min and hold for 1.5 h at 400 °C; finally, raise the temperature from 400 °C to 520 °C at a rate of 3 °C / min and hold for 1.5 h at 520 °C, and finally cool with the furnace and take out the specimen;

[0055] 5) Hot press sintering synthesis: The degreased green body is loaded into a graphite mold and placed in an intermediate frequency sintering furnace for hot press sintering. The sintering temperature is 850 °C, the sintering pressure is 10 MPa, and the sintering time is 150 s. After completion, it is taken out of the mold to obtain a five-layer sandwich-type ultra-thin cubic boron nitride scribing tool.

[0056] Example 3

[0057] Design a three-layer sandwich-type ultra-thin diamond scribing tool with a diameter × height dimension of 50 mm × 0.6 mm, and the layer height of each structural layer is 0.2 mm. The diamond particle size of the central layer is 100 / 120 (particle size 125 - 150 μm), and the diamond particle sizes of the composite layers A1 and B1 are 120 / 140 (particle size 106 - 125 μm); the matrix phase composition of each structural layer is 70% volume fraction of CuSn 10 , 20% volume fraction of Co, and 10% volume fraction of WC; the mass ratio of the binder powder to the binder in each structural layer is 10:1, and the binder components are: 55% styrene-butadiene block copolymer, 30% polyurethane, 5% polyvinyl butyral, 5% acrylonitrile-butadiene-styrene copolymer, 5% trimellitate. The particle size of the binder powder is 100 - 120 μm.

[0058] This example provides a 3D printing manufacturing process for a multi-layer sandwich-type ultra-thin diamond scribing tool, including the following steps:

[0059] 1) Preparation of printing filaments: Weigh appropriate amounts of diamond powder, metal powder, and binder respectively, mix them evenly, and then put them into a mixer for sufficient mixing. The obtained central layer feedstock and composite layer feedstock are granulated in a granulator in batches, and then the two kinds of granular materials are extruded in a wire drawing machine to obtain a central layer filament and a composite layer filament with a diameter of 1.75 mm ± 0.10 mm;

[0060] 2) Printing model and parameter design: Draw the model of the three-layer sandwich-type ultra-thin diamond scribing tool in a computer, import the model into slicing software to set printing parameters, and then export the printing file; the printing parameters are nozzle diameter 1 mm, layer height 0.5 mm, extrusion rate 50 mm / s, and flow rate 100%;

[0061] 3) Green body printing: Import the printing file into a dual-nozzle 3D printer, put the two kinds of filaments into the two feed ports of the dual-nozzle printer respectively, start the printer, and the printer prints by exchanging nozzles layer by layer according to the program settings to obtain a green body of the three-layer sandwich-type ultra-thin diamond scribing tool;

[0062] 4) Green body degreasing: Load the obtained green body into a graphite mold and place it in a vacuum degreasing furnace for thermal degreasing to remove the binder completely. The vacuum degree is 3.0×10 -3Pa; Degreasing and heating-up process: First, heat from room temperature to 100 °C at a rate of 10 °C / min and hold at 100 °C for 0.5 h; then heat from 100 °C to 220 °C at a rate of 5 °C / min and hold at 220 °C for 1 h; next, heat from 220 °C to 300 °C at a rate of 3 °C / min and hold at 300 °C for 1 h; then heat from 300 °C to 400 °C at a rate of 3 °C / min and hold at 400 °C for 1 h; finally, heat from 400 °C to 550 °C at a rate of 3 °C / min and hold at 550 °C for 1 h, and then cool in the furnace and take out the specimen;

[0063] 5) Hot pressing and sintering synthesis: Put the degreased green body into a graphite mold and place it in an intermediate frequency sintering furnace for hot pressing sintering. The sintering temperature is 750 °C, the sintering pressure is 5 MPa, and the sintering time is 150 s. After completion, take it out from the mold to obtain a three-layer sandwich-type ultra-thin diamond scribing tool.

[0064] Comparative Example 1

[0065] Design a single-layer sandwich-type ultra-thin diamond scribing tool with a diameter × height dimension of 50 mm × 0.6 mm, a diamond concentration of 30%, and a binder composition of 70% volume fraction of CuSn 10 、20% volume fraction of Co and 10% volume fraction of WC; the mass ratio of the binder powder to the binder is 10:1, and the binder components are: 55% styrene-butadiene block copolymer, 30% polyurethane, 5% polyvinyl butyral, 5% acrylonitrile-butadiene-styrene copolymer, 5% trimellitate. The particle size of the diamond powder is 100 - 120 μm, and the particle size of the binder powder is 100 - 120 μm.

[0066] This comparative example conducts a 3D printing manufacturing process for a single-layer ultra-thin diamond scribing tool, including the following steps:

[0067] 1) Preparation of printing filaments: Weigh an appropriate amount of diamond powder, metal powder, and binder, mix them evenly, and then put them into a mixer for sufficient mixing. Put the obtained feedstock into a granulator for granulation, and then put the granular material into a wire drawing machine to extrude filaments with a diameter of 1.75 mm ± 0.10 mm;

[0068] 2) Printing model and parameter design: Draw the model of the single-layer ultra-thin diamond scribing tool in a computer, import the model into slicing software to set printing parameters, and then export the printing file; the printing parameters are a nozzle diameter of 1 mm, a layer height of 0.5 mm, an extrusion rate of 50 mm / s, and a flow rate of 100%;

[0069] 3) Green body printing: Import the printing file into a 3D printer, put the filaments into the printer feed inlet, and start the printer to print the green body of the single-layer ultra-thin diamond scribing tool;

[0070] 4) Degreasing of green body: The green body is placed into a graphite mold and placed in a vacuum degreasing furnace for thermal degreasing to remove the binder. The vacuum degree is 3.0×10 -3 Pa; Degreasing heating program: first, increase the temperature from room temperature to 100℃ at 10℃ / min, and keep it at 100℃ for 0.5h; then increase the temperature from 100℃ to 220℃ at 5℃ / min, and keep it at 220℃ for 1h; then increase the temperature from 220℃ to 300℃ at 3℃ / min, and keep it at 300℃ for 1h; then increase the temperature from 300℃ to 400℃ at 3℃ / min, and keep it at 400℃ for 1h; finally, increase the temperature from 400℃ to 550℃ at 3℃ / min, and keep it at 550℃ for 1h, finally cool it with the furnace and take out the sample;

[0071] 5) Hot pressing and sintering synthesis: The degreased green body is loaded into a graphite mold and placed in a medium frequency sintering furnace for hot pressing sintering. The sintering temperature is 750°C, the sintering pressure is 5 MPa, and the sintering time is 150 s. After the sintering, a single-layer ultra-thin diamond dicing blade is obtained by taking it out from the mold.

[0072] The ultra-thin and ultra-hard abrasive dicing knives of the same thickness as those obtained in the above-mentioned Examples 1, 3 and Comparative Example 1 were used to perform a dicing experiment on silicon wafer materials on a precision dicing machine. When Example 1 cut 6210 meters, the wear amount was 0.7mm and there was no obvious deformation; when Comparative Example 1 cut 3490 meters, the wear amount was 0.75mm and blade deformation was visible. When Example 3 cut 2500 meters, there was no obvious edge collapse or cracking of the wafer material; when Comparative Example 1 cut 2500 meters, edge collapse and microcracks were visible on the wafer material. The ultra-thin cubic boron nitride dicing knife of the above-mentioned Example 2 was used to perform a dicing experiment on silicon wafers with the same parameters on a precision dicing machine. When Example 2 cut 13450 meters, the wear amount was 0.62mm and there was no obvious deformation.

Claims

1. A multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife, characterized in that: The multi-layer sandwich type ultra-thin super-hard abrasive slicing knife consists of a central layer and N layers of composite layers A and N layers of composite layers B axially symmetrically arranged on both sides of the central layer, wherein the composite layer A, the composite layer B and the central layer are all composed of a matrix phase and super-hard abrasives, wherein the volume fraction of the super-hard abrasives in the surface layer of the composite layer A and the surface layer of the composite layer B decreases or increases successively from the central layer to the surface layer of the composite layer A and the surface layer of the composite layer B, and / or the particle size of the super-hard abrasives in the surface layer of the composite layer A and the surface layer of the composite layer B decreases or increases from the central layer.

2. A multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 1, characterized in that: When the volume fraction of the superhard abrasive in the multi-layer sandwich-type ultra-thin superhard abrasive dicing knife decreases from the center layer to the surface layer of the composite layer A and the surface layer of the composite layer B, the volume fraction of the superhard abrasive in the center layer is 20% to 70%; the volume fraction of the matrix phase is 30% to 80%; and the volume fraction of the superhard abrasive decreases by 2% to 20% from the center layer to the surface layer of the composite layer A and the surface layer of the composite layer B. When the volume fraction of superhard abrasive in the multi-layer sandwich type ultra-thin superhard abrasive slicing knife increases successively from the center layer to the surface layer of composite layer A and the surface layer of composite layer B, the volume fraction of superhard abrasive in the center layer is 2%~60%; the volume fraction of the matrix phase is 40~98%; and from the center layer to the surface layer of composite layer A and the surface layer of composite layer B, the volume fraction of superhard abrasive increases by 2~20% layer by layer.

3. The multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 1, characterized in that: The multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife, when the particle size of the ultra-hard abrasive in the surface layer of the composite layer A and the surface layer of the composite layer B is successively reduced, the particle size of the ultra-hard abrasive in each structural layer is 1 μm to 450 μm, and the particle size of the ultra-hard abrasive decreases by at least one particle size layer by layer from the center layer to the surface layer of the composite layer A and the surface layer of the composite layer B; In the multi-layer sandwich type ultra-thin ultra-hard abrasive slicing knife, when the particle size of the ultra-hard abrasive increases successively from the center layer to the surface layer of composite layer A and the surface layer of composite layer B, in each structural layer, the particle size of the ultra-hard abrasive is 1~450μm, and from the center layer to the surface layer of composite layer A and the surface layer of composite layer B, the particle size of the ultra-hard abrasive increases by at least one particle size layer by layer.

4. The multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 1, characterized in that: The matrix phases of the composite layer A, the composite layer B, and the central layer are all composed by mass fraction as follows: 40% to 80% copper-tin alloy, 5% to 20% tungsten carbide, and 0% to 10% M, wherein M is selected from at least one of cobalt, iron, titanium, and zinc; The superhard abrasive is diamond and / or cubic boron nitride.

5. The multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 1, characterized in that: The N is 1 to 7; The total thickness of the dicing knife is ≤1 mm, and the thickness of any structural layer is 0.01-0.45 mm.

6. A method for preparing a multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to any one of claims 1 to 5, characterized in that: According to the designed components and designed particle size of each structural layer, super-hard abrasive powder, matrix phase powder and binder are respectively prepared, and N+1 groups of mixed materials are obtained after mixing. The N+1 groups of mixed materials are respectively subjected to banburying, granulation and wire-making to obtain N+1 groups of structural layer wires, and then the N+1 groups of structural layer wires are sequentially placed in the feed port of a 3D printer for 3D printing to obtain a green body, and the green body is degreased and sintered to obtain a multi-layer sandwich type ultra-thin super-hard abrasive dicing knife.

7. The method for preparing a multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 6, characterized in that: The particle size of the matrix phase powder is ≤450 μm. The binder in the N+1 group of mixed materials comprises the following components by mass percentage: 30-75% styrene-butadiene block copolymer, 5-35% polyurethane, 5-10% polyvinyl butyral, 3-6% acrylonitrile-butadiene-styrene copolymer, and 3-6% trimellitate; The temperatures of the mixing, granulation and wire drawing are all 100-300°, and the speed of wire drawing is 10-200 rpm; The diameters of the N+1 group of structural layer wires are all 1.65-1.85 mm.

8. The method for preparing a multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 6, characterized in that: The process parameters of the 3D printing are: printing speed 10~300mm / s, printing layer thickness 0.01mm~2mm, and printing temperature 100~350℃.

9. The method for preparing a multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 6, characterized in that: The degreasing is carried out under a hydrogen atmosphere, and the degreasing process is as follows: the temperature is increased from room temperature to 80-120°C at a heating rate of 5-10°C / min, and kept warm for 0.5-1h; then the temperature is increased to 180-230°C at a heating rate of 3-10°C / min, and kept warm for 1-2.5h; then the temperature is increased to 300-330°C at a heating rate of 1-5°C / min, and kept warm for 0.5-1.5h; then the temperature is increased to 400-430°C at a heating rate of 1-5°C / min, and kept warm for 0.5-1.5h; finally the temperature is increased to 500-620°C at a heating rate of 2-6°C / min, and kept warm for 0.5-2h.

10. The method for preparing a multi-layer sandwich type ultra-thin ultra-hard abrasive dicing knife according to claim 6, characterized in that: The sintering is hot pressing sintering, the temperature of the hot pressing sintering is 700-1000°C, and the sintering pressure is 50-200kg / cm 2 The heat preservation and pressure holding time is 120s~600s.

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