Full-automatic thermal evaporation coating equipment

Abstract

The invention belongs to the technical field of evaporation equipment, and particularly relates to full-automatic thermal evaporation coating equipment which comprises a full-automatic loading chamber, a multi-piece sample introduction chamber, a conveying chamber and an evaporation coating chamber which are sequentially arranged, a high-vacuum isolating valve is arranged between the conveying chamber and the evaporation coating chamber to achieve isolation or communication, and except the loading chamber, other chambers are provided with independent vacuum systems. According to the device, the existing industrial technology is combined, a chip loader or a robot at the front end of the device is matched, a full-automatic loading cavity replacing manual loading and unloading of workpieces is designed and added, the full-automatic thermal evaporation coating process is achieved, under the same vacuum condition, resistance evaporation and electron beam evaporation can be achieved respectively, and mass efficient production can be achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of the preparation of thermal evaporation coating equipment. Specifically, it relates to a fully automatic thermal evaporation coating equipment. Background Art

[0002] Thermal evaporation is a type of physical vapor deposition and can be used to prepare various materials such as metals, semiconductors, and insulators. The preparation techniques can be divided into electron beam evaporation preparation techniques and resistance evaporation preparation techniques.

[0003] Currently, there are also various technologies for the equipment of electron beam evaporation and resistance evaporation on the market, and the advantages and disadvantages of batch-type equipment are uneven. For example, when loading and unloading workpieces, each time the workpiece is replaced, the process chamber needs to be changed from process vacuum to atmosphere (venting), and from atmosphere to process vacuum (pumping). Repeatedly changing the process chamber between atmosphere and process vacuum states wastes relatively more process time. The commonly used vacuum configuration uses a cryopump. Due to the good stability and relatively high pumping speed of the cryopump, for some special processes with residual process particles, the maintenance of the cryopump will be increased frequently, resulting in a loss of efficiency. The more workpieces are coated by batch production electron beam evaporation or resistance evaporation equipment, the larger the designed chamber will be. The single-door method will increase the difficulty of equipment maintenance during the process. Traditionally, the loading of electron beam evaporation and resistance evaporation equipment is manual loading, and then the automatic coating process of the equipment is realized. In terms of industrial production, there is still waste of actions, and there is still room for improvement in efficiency. At the same time, when electron beam evaporation process and resistance evaporation process are required, they need to be purchased separately. The floor area is relatively large, the cost is relatively high, and the coating quality of using resistance and electron beam methods under different vacuums is relatively poor. Summary of the Invention

[0004] Aiming at the problems existing in the current prior art, the present invention provides a fully automatic thermal evaporation coating equipment. Cooperating with the loader or robot at the front end of the equipment, a fully automatic loading chamber for replacing human loading and unloading of workpieces is designed to realize a fully automatic thermal evaporation coating equipment.

[0005] The complete technical solution of the present invention includes:

[0006] A fully automatic thermal evaporation coating equipment, comprising a fully automatic loading chamber, a multi-sample loading chamber, a transfer chamber, and an evaporation coating chamber arranged in sequence. High-vacuum isolation valves are respectively provided between the automatic loading chamber and the multi-sample loading chamber, the multi-sample loading chamber and the transfer chamber, and the transfer chamber and the evaporation coating chamber to achieve isolation or connection. Except for the loading chamber, other chambers are provided with independent vacuum systems. An electron beam evaporation system and a resistance evaporation system are simultaneously loaded in the evaporation coating chamber, and can realize the switching use or simultaneous use of the two evaporation processes.

[0007] Further, one or more electron beam evaporation systems may be provided, and one or more resistance evaporation systems may be provided.

[0008] Further, the loading chamber includes a loading chamber door, a first manipulator, a workpiece position calibrator, and an ion generator. The workpiece cassette is hermetically sealed and can load workpieces of different sizes. The number of workpieces loaded at one time is greater than 20. The loading chamber door is provided with a position latch for positioning the workpiece cassette and a key for opening the workpiece cassette. The first manipulator has a 180° wafer flipping function and a 0-360° turning function, and is telescopic, capable of rising, descending, and rotating, and is responsible for loading and unloading workpieces between the loading chamber and the multi-wafer sample introduction chamber.

[0009] Further, the workpiece position calibrator includes a workpiece position calibrator, a workpiece position stage, and a workpiece calibration sensor, which are used to calibrate the workpiece position to ensure that the manipulator accurately transfers the workpiece to the multi-wafer device in the multi-wafer sample introduction chamber.

[0010] Further, the ion generator is composed of a high-voltage power supply, an ion generator body, and an electrode, and is used to eliminate the static electricity on the workpiece surface.

[0011] Further, the multi-wafer sample introduction chamber includes a multi-wafer workpiece device, which can place multiple workpieces; it has the functions of rising and descending. It is equipped with a low-vacuum pumping system. Multiple (quantity ≥ 1) multi-wafer sample introduction chambers can be provided.

[0012] Further, the transfer chamber includes a second manipulator, which is responsible for transferring the loading and unloading of workpieces between the multi-wafer sample introduction chamber and the evaporation coating chamber.

[0013] Further, a high-vacuum pumping system, an electron beam evaporation system, a resistance evaporation system, an ion source system, a coating monitoring system, a heating system, and a workpiece plate system are provided in the evaporation coating chamber.

[0014] Further, the heating system is used to heat and bake the chamber and the workpiece to remove the moisture on the chamber and the workpiece surface. At the same time, the vacuum system is turned on to pump away the evaporated moisture until the moisture content in the chamber drops below the preset value. The heating system is controlled by a control system.

[0015] Further, when the heating system is heating, the humidity in the chamber first increases, then remains stable, and then decreases. The following control method is adopted during actual heating:

[0016]

[0017] t is the continuous heating time of the heating system after the humidity value starts to decrease, RH is the humidity value when the humidity reaches equilibrium, RH0 is the reference humidity value, t0 is the reference duration, and k is a coefficient, which is a fixed value for the same type of equipment and is determined through on-site tests.

[0018] Further, a method for fully automatic evaporation coating using the said equipment.

[0019] The advantages of the present invention over the prior art are as follows:

[0020] 1. The present invention provides a technical solution for a fully automatic thermal evaporation coating equipment. An automatic sample loading system is configured on a traditional process chamber, and in cooperation with a film loader or a robot at the front end of the equipment, an automatic loading chamber for replacing manual loading and unloading of workpieces is designed and added, realizing the full-automatic operation of the entire process of thermal evaporation coating, improving production efficiency, reducing artificial or environmental pollution factors in the process, ensuring the process environment of the coated products, and improving the quality of the coated products.

[0021] 2. The process chamber is designed to improve the preparation technology. Under the same vacuum condition, resistance evaporation and electron beam evaporation can be respectively realized, and batch high-efficiency production can be achieved.

[0022] 3. Except for replacing evaporation materials and maintaining the main process chamber, the process chamber maintains the process vacuum continuously during the coating process without repeated vacuum pumping, saving time and improving production efficiency.

[0023] 3. Reconfigure the vacuum system. The high-vacuum pump group is a combination of a molecular pump and a cryopump, which can maintain a stable process vacuum, is more suitable for special processes with residual particles, reduces the maintenance of the cryopump during the process, has a wider process application range, and improves production efficiency.

[0024] 4. The main process chamber is designed with front and rear opening doors, providing a more convenient maintenance mode, improving maintenance efficiency, and reducing maintenance difficulty.

[0025] 5. Combining with existing industrial technologies, a technical solution for a fully automatic thermal evaporation equipment is designed. Realize full-automatic operation throughout the process, improve production efficiency, reduce artificial or environmental pollution factors in the process, ensure the process environment of the coated products, and improve the quality of the coated products. Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of the fully automatic thermal evaporation coating equipment of the present invention.

[0027] Figure 2 It is a schematic diagram of a workpiece box.

[0028] Figure 3 It is a schematic diagram of a first manipulator.

[0029] Figure 4 It is a schematic diagram of an ion generator.

[0030] Figure 5 It is a schematic diagram of a workpiece position calibration device.

[0031] In the figure: 1 - Equipment operation platform, 2 - Control system, 3 - Workpiece box platform, 4 - Full-automatic workpiece loading chamber, 5 - Workpiece transfer chamber, 6 - Transfer chamber, 7 - Molecular pump system, 8 - Evaporation coating chamber, 9 - Workpiece tray system, 10 - Cold pump system, 11 - Ion source, 12 - Electron beam system, 13 - Resistance system, 14 - Second manipulator, 15 - Multi-piece workpiece device, 16 - High-vacuum isolation valve, 17 - Rotary lifting device, 18 - First robotic arm, 19 - Rotation, 20 - Second robotic arm 21 - Manipulator steering box, 22 - First manipulator, 23 - Ion generator main body, 24 - Air outlet, 25 - Workpiece position table, 26 - Workpiece calibration sensor, 27 - Workpiece position calibrator. Detailed implementation mode

[0032] The present invention will be described in detail below in conjunction with the embodiments and the drawings. However, it should be understood that the embodiments and the drawings are only used for an exemplary description of the present invention and cannot constitute any limitation to the protection scope of the present invention. All reasonable transformations and combinations within the scope of the inventive concept of the present invention fall within the protection scope of the present invention.

[0033] As Figure 1 shown, a full-automatic thermal evaporation coating equipment includes an equipment operation platform 1, a full-automatic wafer transfer system, and a coating process chamber. The equipment operation platform provides an operation space for the operation of the equipment, and a control system 2 is provided in front of the equipment operation platform. The full-automatic wafer transfer system includes a full-automatic workpiece loading chamber 4, a workpiece transfer chamber 5, and a transfer chamber 6. The workpiece loading chamber is a non-vacuum chamber, the workpiece transfer chamber is a high-vacuum chamber, and the transfer chamber is also a high-vacuum chamber. The workpiece loading chamber and the workpiece transfer chamber, and the workpiece transfer chamber and the transfer chamber are isolated by high-vacuum isolation valves 16, and the workpiece transfer chamber and the transfer chamber are each provided with an independent vacuum system.

[0034] The workpiece loading chamber 4 is a sealed chamber, including a workpiece box, an automatic loading fixture door, a first manipulator, a workpiece calibrator, and an ion generator.

[0035] The workpiece box is sealed and can load workpieces of different sizes. The number of workpieces loaded at one time is greater than 20, and there is a fixed locking buckle on the workpiece sealed box.

[0036] The structure of the workpiece box includes a loading groove for wafers and a cover for sealing. The loading groove can load wafers (loading N wafers, N > 1), and the cover is designed with a lock hole. The position of the lock hole corresponds to the lock buckle on the workpiece loading chamber. When in use, through system operation, the lock buckle on the workpiece loading chamber can open or seal the cover for sealing.

[0037] As Figure 2As shown, there are positions I and III on the workpiece box, which are the positions of the locking holes on the sealing buckle of the workpiece box. The corresponding positions on the workpiece loading chamber are the position locking buckles. Positions II and IV are the lock holes for opening the workpiece box, and there are corresponding lock buckles at the corresponding positions on the workpiece loading chamber.

[0038] During use, first, after the positions I and III on the workpiece loading chamber are locked corresponding to positions I and III on the workpiece box, then the lock buckles at positions II and IV on the workpiece loading chamber extend into positions II and IV of the workpiece box. The lock buckle of the workpiece box can be rotated to open the workpiece box. Or to close the workpiece box, after the positions I and III on the workpiece loading chamber are loosened corresponding to positions I and III on the workpiece box, the workpiece box can be taken away by the robot at the front section or replaced with a new workpiece box to be plated.

[0039] There are position lock buckles for positioning the workpiece box and keys for opening the workpiece box on the automatic loading fixture door.

[0040] As Figure 3 As shown, the first manipulator has a 180° wafer flipping vacuum adsorption function and a 0 - 360° steering function, can be telescopic, can move up and down, and can rotate, and is responsible for loading and unloading workpieces between the workpiece loading chamber and the workpiece transfer chamber.

[0041] The specific structure is as follows: The first manipulator has 3 degrees of freedom, namely linear motion, rotational motion, and lifting motion. Below it includes a rotary lifting device 17, above which a first robotic arm 18 is installed. Above the first robotic arm, there is a rotary shaft 19 and a second robotic arm 20. Above the second robotic arm, there is a manipulator steering box 21, and a first manipulator 22 is installed on the steering box.

[0042] The rotary lifting device 17 is responsible for the overall rotation and lifting of the manipulator. The first robotic arm and the second robotic arm are connected by a rotary shaft to realize the selection of the rotation direction of the first manipulator. The manipulator steering box can rotate and realizes the connection between the manipulator and the robotic arm, and is responsible for the 180° rotation of the robotic arm.

[0043] The first manipulator can perform linear telescopic motion and realize the overall rotation in the circumferential direction to align with the position of picking and placing the wafer. The up and down motion of the robotic arm is used for the handover action of picking and placing the wafer. Thus, the process of taking the wafer from the workpiece box, calibrating it by the workpiece calibrator, transporting it to the workpiece transfer chamber, and then taking the wafer from the workpiece transfer chamber and putting it back into the workpiece box is realized. The mechanical box connecting the manipulator can realize the same rotation as other robotic arms, and also controls the 180° rotation of the manipulator to realize the wafer flipping function. The first manipulator adsorbs the wafer through the action of vacuum negative pressure.

[0044] The ion generator is used to eliminate the static electricity on the surface of the workpiece. As Figure 4As shown, it consists of a high-voltage power supply, an ion generator body 23 and an electrode, and an air outlet 24 is designed on the electrode.

[0045] The high-voltage power supply generates a high voltage through a high-voltage generator, and makes the electrode generate corona discharge to ionize the molecules in the air to form negative ions. These ions interact with the charges on the object surface to neutralize the charges on the object surface, thereby eliminating static electricity. When the object surface has a negative charge, it will attract the positive charges in the radiation area of the ion rod; conversely, when the object surface has a positive charge, it will attract the negative charges in the radiation area. In this way, through the ion radiation area of the ion rod, the static electricity on the object surface is neutralized, achieving the purpose of neutralizing the static electricity on the wafer surface by ions during the process of the manipulator transporting the wafer because static electricity will be generated due to collisions and other reasons.

[0046] The workpiece position calibration device is used to calibrate the workpiece position to ensure the accurate position of the first manipulator transporting the workpiece to the workpiece transfer chamber.

[0047] As Figure 5 shown, it includes a workpiece position calibrator 27, a workpiece position table 25 and a workpiece calibration sensor 26.

[0048] The workpiece position calibrator 27 can realize the rotation of the workpiece position table. The workpiece position table 25 and the workpiece calibration sensor 26 are used in combination. During the semiconductor wafer processing, on silicon ingots of 200 mm (including) or more, a circular small opening, namely Notch (V-groove), is cut. The V-groove plays a positioning role in the processes such as IC manufacturing and processing. The workpiece position calibrator 27 pre-locates the center and V-groove of the wafer through the sensing results of the calibration sensor, so as to accurately place it on the wafer loading device in the workpiece loading chamber or in the workpiece cassette.

[0049] The workpiece transfer chamber 5 includes a multi-wafer device 15, and the multi-wafer device can place multiple workpieces. The multi-wafer device is equipped with a low-vacuum pumping system and has the functions of rising and falling. And multiple (quantity ≥ 1) workpiece transfer chambers can be set.

[0050] The transfer chamber 6 is provided with a second manipulator 14, which is responsible for the transfer of loading and unloading of workpieces between the workpiece transfer chamber and the evaporation coating chamber. The transfer chamber is equipped with a high-vacuum pumping system.

[0051] The evaporation coating chamber 8 is a process chamber for realizing coating, and is provided with a high-vacuum pumping system, an electron beam evaporation system 12, a resistance evaporation system 13, an ion source 11, an evaporation monitoring system, a heating system, a workpiece disk system 9, etc., and can realize electron beam evaporation process or resistance evaporation process, or a thermal evaporation process with both processes running in parallel. To achieve mass production of products, the workpiece disk system configured in the evaporation coating chamber 8 adopts a design mode of a main shaft plus planetary shafts (multiple) rotating. The main shaft drives the planetary shafts to rotate, and the planetary shafts drive the rotation of their respective workpiece tables.

[0052] Among them, the electron beam evaporation system can be n sets (n>1), which is a system for realizing electron beam evaporation coating. The resistance evaporation system can be m sets (m>1), which is a system for realizing resistance evaporation coating. The ion source system is a system for realizing the surface cleaning or etching process of the workpiece. The evaporation coating monitoring system monitors the resistance evaporation or electron beam evaporation, evaporation rate and coating thickness.

[0053] The heating system is used to heat and bake the chamber to ensure the relative humidity of the chamber, so that the chamber is easy to evacuate, and the workpiece can be baked to remove the moisture on the surface of the workpiece to better ensure the coating quality of the workpiece. The heating system uses a heater for heating and an armored thermocouple for temperature detection. The heater and the armored thermocouple are controlled by a control system integrated in the computer.

[0054] The heating system in the present invention is intelligently controlled through the control system. Since in actual production, the climatic conditions vary from place to place, and for different batches of products, there will be more or less moisture attached to the components in the vacuum coating equipment chamber and the surface of the workpiece. Before actual coating, the moisture content on the surface is unknown. At this time, it is necessary to turn on the heating system to heat and evaporate the moisture, and turn on the vacuum system to evacuate the evaporated moisture until the moisture content in the chamber drops below the preset value. During this process, it is necessary to control and adjust the heating power and heating time of the heating system to achieve the best heating and drying effect. Based on this, the present invention adopts the following method to realize the control of this process.

[0055] First, analyze the moisture change during the heating process under certain conditions, and find that the general law of this process is: First, after the heating system is turned on, there is a heat conduction stage in the chamber. This process requires a certain amount of time for the temperature in the chamber to rise and gradually reach stability. Subsequently, the water on the chamber and the workpiece surface gradually evaporates, causing the humidity in the chamber to rise. Then, with the extraction of the chamber by the vacuum system, the humidity gradually reaches an equilibrium state. As the heating continues, the water on the chamber and the workpiece surface evaporates completely, and the humidity in the chamber gradually decreases until it is lower than the preset value.

[0056] Since the water content of the chamber and the workpiece surface varies under different conditions and is difficult to measure in advance, through this analysis, the inventors found that the water content can be characterized by the humidity value at the equilibrium state to control the heating power and time. Specifically: First, measurements are taken under a certain fixed water content condition, with both the heating power and the vacuum pump power fixed. The humidity value RH0 at equilibrium after heating is used as the reference humidity value. When the humidity value starts to decline, different continuous heating times are used, and the relationship between the humidity decline (whether it can drop below the preset value) and the continuous heating time is observed, so as to finally obtain the shortest continuous heating time t0 that exactly makes the final humidity reach the preset value. And the following control method is adopted in actual production:

[0057]

[0058] t is the continuous heating time of the heating system after the humidity value starts to decline during this baking, RH is the humidity value at equilibrium during this baking, k is a coefficient related to the temperature T in the chamber and the saturated vapor pressure E at this temperature. Since for the same type of equipment, the chamber volume and the heating power used are basically constant, the temperature fluctuation during the baking process is not large. Therefore, in the present invention, it is taken as a fixed value. For equipment of the same type, a reasonable k value can be determined through on-site tests. Through the above method, this equipment ensures that the waste heat in the final heating stage can be fully utilized to evaporate water without overheating, reducing energy consumption.

[0059] The workpiece disk system adopts a design mode of spindle plus planetary axis (multiple) rotation. The spindle drives the planetary axis to rotate, and the planetary axis drives the rotation of their respective workpiece tables. The evaporation coating chamber adopts a front and rear door opening method, which is convenient for the maintenance of the chamber or the chamber corresponding system.

[0060] The high vacuum pump of the high vacuum pumping system of the present invention is a combination of a cryopump system 10 and a turbomolecular pump system 7, which is convenient for the process, maintains the stability of the process vacuum, and can ensure the normal operation of special processes with residual particles, reducing the maintenance frequency of the cryopump.

[0061] The usage method of this evaporation system equipment is as follows:

[0062] In the front section, install the workpiece equipment or robot. After the loaded workpiece box is sealed, it is transported to the workpiece box platform 3 in the automatic loading chamber. The workpiece box platform moves forward, fixes the workpiece box on the panel that opens the workpiece box, and two latches on the workpiece box panel automatically open and translate the panel of the workpiece box to remove it, and then move down to a program setting position lower than the workpiece box platform and not affecting the operation of the first manipulator.

[0063] The film transfer starts. The first manipulator in the automatic loading chamber extends to the specified workpiece position in the workpiece cassette to pick up the workpiece, then retracts to the automatic loading chamber, and then rotates 90°. The first manipulator rises and extends, places the workpiece on the workpiece position calibrator, and the first manipulator retracts. After the workpiece position is calibrated, the first manipulator extends to pick up the workpiece, retracts to the automatic loading chamber, then flips the workpiece downward by 180°, rotates and rises in the direction of the workpiece transfer chamber, opens the high-vacuum isolation valve between the automatic loading chamber and the workpiece transfer chamber, and the manipulator transfers the workpiece to the specified position in the workpiece transfer chamber.

[0064] The multi-piece workpiece device in the workpiece transfer chamber moves up and down to the corresponding position according to the position specified by the program, facilitating the transfer of the workpiece by the first manipulator. According to the above film transfer process, after the first manipulator places the workpieces one by one from the workpiece cassette onto the multi-piece workpiece device in the workpiece transfer chamber, the first manipulator returns to its initial position in the automatic loading chamber, and the isolation valve between the automatic loading chamber and the workpiece transfer chamber is closed.

[0065] The workpiece transfer chamber is evacuated. When the corresponding switching pressure is pumped down to the process vacuum (at this time, it is default that the transfer chamber and the coating process chamber are both under the process vacuum), open the two high-vacuum valves between the workpiece transfer chamber and the transfer chamber, and between the transfer chamber and the evaporation coating chamber. The spindle of the workpiece disk in the evaporation coating chamber rotates to the corresponding planetary axis workpiece table position, and the corresponding planetary axis workpiece table rotates to the position for loading the workpiece. The second manipulator sequentially picks up the workpieces from the multi-piece workpiece device, rises to the loading high position, transfers the workpiece above the planetary axis workpiece table position, the second manipulator descends, and places the workpiece on the workpiece table on the planetary axis. Using this operation procedure, all the workpieces in the workpiece transfer chamber are loaded onto the workpiece tables on the planetary axis in sequence. After the transfer is completed, the second manipulator retracts to the initial position in the transfer chamber, and the high-vacuum isolation valves between the workpiece transfer chamber and the transfer chamber, and between the transfer chamber and the evaporation coating chamber are closed. The evaporation coating chamber can start the coating process. The configuration of the process chamber can achieve the resistance evaporation process or the electron beam evaporation process, or a process combining the two.

[0066] Among them, for the process with residual particles, when sputtering coating, the cold pump is turned off and the molecular pump is used. The residual particles of the special process are pumped away by the mechanical pump in front of the molecular pump to the recovery device.

[0067] After the coating process is completed, rotate the spindle of the workpiece disk to the position of the planetary workpiece disk to be sampled, rotate the planetary axis to the position where sampling is possible, open the high-vacuum isolation valves between the workpiece transfer chamber and the transfer chamber, and between the transfer chamber and the evaporation coating chamber. The second manipulator descends to the sampling low position and extends under the workpiece, rises to the high position to lift the workpiece back to the position of the second manipulator in the transfer chamber, and then the second manipulator places the workpiece on the position specified by the program on the multi-piece workpiece device table. Perform the above operations in sequence until all the workpieces are taken out and placed on the multi-piece workpiece device table.

[0068] After the extraction is completed, close the high-vacuum isolation valves between the evaporation coating chamber and the transfer chamber, and between the transfer chamber and the workpiece loading chamber. Open the high-vacuum isolation valve between the workpiece transfer chamber and the full-automatic workpiece loading chamber. The first manipulator sequentially extracts workpieces from the multi-piece workpiece device in the workpiece transfer chamber according to the program settings. The manipulator flips the workpiece 180°, then places it on the workpiece calibrator to calibrate the position, and then removes the workpiece and places it back at the designated position in the workpiece box. When all the workpieces are completed and placed back in the workpiece box, the panel of the workpiece box closes and locks the workpiece box with the lid. The workpiece box moves backward, and the equipment at the front end of the device can take away the workpiece box that has completed the coating process. Then place a new workpiece box to be coated and prepare for the coating process of the next batch of workpieces.

[0069] One or more workpiece box platforms for loading workpiece boxes can be set, and one or more workpiece transfer chambers are correspondingly configured, which can achieve fully automatic and efficient production. It can realize resistance and electron beam coating processes under the same vacuum, or separate coating processes. The coating process is monitored by a coating monitor for quality control. The process can be reasonably configured, is convenient to use and operate, can be continuously produced, has high production efficiency and high coating quality.

[0070] For example, for two workpiece boxes and two workpiece loading chambers, since there are high-vacuum isolation valves between the corresponding chambers, the workpiece transfer chamber, the transfer chamber and the coating chamber are all independently evacuated. When the workpieces in the first workpiece box are transferred to the process chamber for processing, the workpieces in the second workpiece box can be transferred to the second workpiece loading chamber for the coating process. After the workpieces in the first workpiece box are completed with the coating process and transferred to the first workpiece transfer chamber, while the first manipulator can take samples to the first workpiece box, the second manipulator can simultaneously take the workpieces in the second workpiece loading chamber into the process chamber for coating. And so on, the production efficiency is significantly improved, and the pollution factors of the process caused by humans or the environment can be reduced, ensuring the process environment of the coated products and providing the quality of the coated products.

[0071] During equipment maintenance and repair, for the evaporation coating chamber, the front and rear chamber doors of the chamber can be opened separately to disassemble, assemble and maintain the chamber and its components.

[0072] The above applications are only some embodiments of this application. For those of ordinary skill in the art, without departing from the inventive concept of this application, several variations and improvements can still be made, and these all belong to the protection scope of this application.

Claims

1. A fully automatic thermal evaporation coating equipment, characterized in that: It comprises a fully automatic loading chamber, a multi-wafer sampling chamber, a transfer chamber and an evaporation coating chamber which are arranged in sequence, wherein the automatic loading chamber and the multi-wafer sampling chamber, the multi-wafer sampling chamber and the transfer chamber, the transfer chamber and the evaporation coating chamber are respectively provided with high vacuum isolation valves to achieve isolation or connection; except for the loading chamber, other chambers are provided with independent vacuum systems; an electron beam evaporation system and a resistance evaporation system are simultaneously loaded in the evaporation coating chamber, so that the two evaporation processes can be switched or used simultaneously.

2. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The electron beam evaporation system may be one or more sets, and the resistance evaporation system may be one or more sets.

3. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The loading chamber includes a loading chamber door, a first manipulator, a workpiece position calibrator and an ion generator. The loading chamber door is provided with a position lock for locating the workpiece box and a key for opening the workpiece box. The first manipulator has a 180° flipping function and a 0-360° turning function, can be retracted, raised, lowered and rotated, and is responsible for loading and unloading workpieces between the loading chamber and the multi-piece injection chamber.

4. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The workpiece position calibrator comprises a workpiece position calibrator, a workpiece position platform and a workpiece calibration sensor, which are used to calibrate the workpiece position to ensure that the robot hand transfers the workpiece to the multi-chip device in the multi-chip feeding chamber with accurate position.

5. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The ion generator consists of a high-voltage power supply, an ion generator body and electrodes, and is used to eliminate static electricity on the surface of the workpiece.

6. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The multi-piece loading chamber includes a multi-piece workpiece device, which can hold multiple workpieces and has the function of rising and falling. It is equipped with a low vacuum exhaust system. Multiple multi-piece loading chambers can be set (quantity ≥ 1).

7. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The transfer chamber includes a second manipulator, which is responsible for the loading and unloading transfer of workpieces between the multi-piece sampling chamber and the evaporation coating chamber.

8. The fully automatic thermal evaporation coating equipment according to claim 1, characterized in that: The evaporation coating chamber is equipped with a high vacuum pumping system, electron beam evaporation system, resistance evaporation system, ion source system, evaporation monitoring system, heating system, and workpiece tray system.

9. The fully automatic thermal evaporation coating equipment according to claim 8, characterized in that: The heating system is used to heat the baking chamber and the workpiece to remove moisture from the chamber and the workpiece surface, and the heating system control system is controlled.

10. A method for fully automatic evaporation coating using the equipment according to any one of claims 1 to 9.

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