Chemical vapor deposition apparatus with direct bonding of lift pin and direct bonding method of lift pin using the same

Abstract

The present invention relates to a lift pin direct bonding chemical vapor deposition apparatus and a lift pin direct bonding method using the same, comprising: a heater on which a wafer is placed; a lift pin provided to the heater; and a weight block which is provided on the lower side of the heater and through which the lifting pin passes, the weight block comprising: a cylinder-shaped weight block body; a through hole which is formed in the weight block body in the height direction and through which the lifting pin passes; and an open slot which is formed on one side of the weight block body in the radial direction, and after the lifting pin is inserted into the through hole through the open slot, a part of the lifting pin is locked on the bottom surface of the weight block body. According to the invention, the lifting pin and the weight block are directly combined, a heater assembly and disassembly process is not needed, the falling phenomenon of the fixing pin can be prevented, the working efficiency can be improved, the structure of the fixing pin can be omitted, and the manufacturing cost can be reduced.

Description

Technical Field

[0001] The present invention relates to a chemical vapor deposition apparatus with a direct coupling method of a lift pin and a lift pin direct coupling method using the same, and more particularly, to a chemical vapor deposition apparatus with a lift pin direct coupling method that directly couples a lift pin to a weight block, eliminates the heater disassembly and assembly process, prevents the fixing pin from falling off, improves work efficiency, omits the structure of the fixing pin, and reduces manufacturing costs, and a lift pin direct coupling method using the same. Background Art

[0002] Generally, in the process of manufacturing semiconductor devices, wafers undergo a specified deposition process, and this deposition process is performed using a chemical vapor deposition apparatus. Referring to Figure 1 , a chemical vapor deposition apparatus according to the prior art has a heater H for placing a wafer W and adjusting the temperature of the wafer W.

[0003] The heater H has a lift pin 2. The lift pin 2 penetrates the heater H and moves up and down with the heater H, and is located on the upper surface of the heater H or protrudes upward from the upper surface of the heater H to support the wafer W.

[0004] The lift pin H is balanced by a weight block 3. As shown in the figure, the weight block 3 is disposed below the heater H, and the lift pin 2 is inserted into the weight block 3 and coupled thereto.

[0005] After inserting the lift pin 2 into the weight block 3, a fixing pin 5 is inserted below the lift pin 2 to fix the lift pin 2 to the weight block 3.

[0006] However, the prior art has the following problems.

[0007] First, in the prior art, when fixing the lift pin 2 to the weight block 3 using the fixing pin 5, the operator reaches in through the side handle of the chamber to perform the work. At this time, it is necessary to disassemble the heater H and then insert the fixing pin 5, and then reassemble the heater H, resulting in a cumbersome assembly process and low work efficiency.

[0008] Second, in the prior art, fixing the lift pin 2 using the fixing pin 5 causes a fixing pin dropping phenomenon where the fixing pin 5 is lost or the fixing pin 5 falls inside the chamber, and it is necessary to find the fixing pin 5 and draw it out, resulting in a further decrease in work efficiency.

[0009] Third, in the prior art, an additional fixing pin 5 is required, resulting in an increase in the number of required components and an increase in manufacturing costs.

[0010] The prior art is technical information that the inventor has for the purpose of deriving the present invention or has obtained during the process of deriving the present invention, and it is not necessarily prior art publicly available to the general public before the application of the present invention.

[0011] Prior art documents

[0012] Patent documents

[0013] (Patent Document 1) Korean Patent Publication No. 10-2005-0112731 (published on December 1, 2005)

[0014] (Patent Document 2) Korean Patent No. 10-0526923 (authorized on November 1, 2005)

[0015] (Patent Document 3) Korean Patent No. 10-1488518 (authorized on January 26, 2015) Summary of the invention

[0016] Technical problem

[0017] In the process of solving the above problems, the object of the present invention is to provide a chemical vapor deposition apparatus with a direct coupling method of a lifting pin and a method for directly coupling a lifting pin using the same, which directly combines the lifting pin with a weight block, can omit the assembly process of a fixing pin, and thus does not require the process of installing and removing a heater, thereby improving work efficiency.

[0018] Furthermore, the present invention provides a chemical vapor deposition apparatus with a direct coupling method of a lifting pin and a method for directly coupling a lifting pin using the same, which can omit the process related to the fixing pin, can prevent the fixing pin from falling off inside the chamber, and thus can further improve work efficiency.

[0019] Furthermore, the present invention provides a chemical vapor deposition apparatus with a direct coupling method of a lifting pin and a method for directly coupling a lifting pin using the same, which does not require an additional fixing pin, can reduce the number of components, and thus can reduce the manufacturing cost.

[0020] The problems to be solved by the present invention are not limited to the above-mentioned problems, and those skilled in the art to which the present invention pertains can clearly understand other problems to be solved that are not mentioned from the following description.

[0021] Solution to the problem

[0022] A chemical vapor deposition apparatus according to an embodiment of the present invention includes: a heater for placing a wafer; lifting pins provided on the heater; and a weight provided on the lower side of the heater through which the lifting pins pass. The weight includes: a weight body in the shape of a cylinder; a through hole formed in the weight body in the height direction through which the lifting pins pass; and an open slot formed in one side of the weight body in the radial direction. After the lifting pins are inserted into the through hole through the open slot, a part of the lifting pins is fixed to the bottom surface of the weight body.

[0023] At this time, the open slot is formed at a specific gap distance, and the gap distance is smaller than the diameter of the through hole. The lifting pins include a first pin body, a second pin body, and a third pin body having different diameters and arranged in the height direction. The first pin body has a specific diameter. The second pin body is arranged below the first pin body, and the diameter of the second pin body is larger than the diameter of the first pin body. The third pin body is arranged below the second pin body, and the diameter of the third pin body is larger than the diameter of the second pin body. The diameter of the first pin body is smaller than the diameter of the through hole, and the first pin body can move up and down inside the through hole. The diameter of the second pin body is larger than the gap distance of the open slot and smaller than the diameter of the through hole, and it can move up and down inside the through hole and be fixed to the open slot. The diameter of the third pin body is larger than the diameter of the through hole and can be fixed to the bottom surface of the through hole.

[0024] Moreover, the diameter of the through hole can be 1.3 to 1.5 times the diameter of the first pin body, the diameter of the through hole can be 1.1 to 1.2 times the diameter of the second pin body, and the diameter of the through hole can be 0.8 to 0.9 times the diameter of the third pin body.

[0025] A method for directly coupling the lifting pins of a chemical vapor deposition apparatus according to an embodiment of the present invention is the method for coupling the lifting pins of the chemical vapor deposition apparatus described in the above embodiment. After the lifting pins are inserted into the through hole through the open slot of the weight, a part of the lifting pins is fixed to the bottom surface of the weight body.

[0026] Moreover, the first pin body of the lifting pins can be inserted into the open slot and then installed in the through hole, and then the lifting pins are lifted, and the third pin body of the lifting pins is fixed to the bottom surface of the through hole.

[0027] Moreover, after inserting the first pin body of the above lifting pin into the above open slot and installing it in the above through hole, the above lifting pin can be raised so that the second pin body is located in the above open slot, and it can be confirmed whether the second pin body is fixed in the above open slot to determine whether the dimensions of the above lifting pin and the above weight block are accurate.

[0028] Moreover, when the third pin body of the above lifting pin is fixed to the bottom surface of the above through hole, it can be confirmed whether the weight block body deviates from the center of the above lifting pin by a specific distance to determine whether the dimensions of the above lifting pin and the above weight block are accurate.

[0029] Effects of the Invention

[0030] As described above, according to the present invention, the assembly process of the fixing pin can be omitted, so there is no need for the heater installation and removal process, and the working efficiency can be improved.

[0031] Moreover, the present invention can omit the process related to the fixing pin, and can prevent the fixing pin from falling off inside the chamber, so the working efficiency can be further improved.

[0032] Moreover, the present invention does not require an additional fixing pin, and the number of components can be reduced, thus having the effect of reducing the manufacturing cost.

[0033] The effects of the present invention are not limited to the above-mentioned effects, and those of ordinary skill in the technical field to which the present invention pertains can clearly understand other effects not mentioned from the following description. Brief Description of the Drawings

[0034] Figure 1 Schematic diagram and enlarged view showing the structure related to the heater and the lifting pin of a chemical vapor deposition apparatus according to the prior art.

[0035] Figure 2 Schematic diagram of a lifting pin according to an embodiment of the present invention.

[0036] Figure 3 Schematic diagrams successively showing the combination of a lifting pin and a weight block according to an embodiment of the present invention.

[0037] Figure 4 Schematic diagram showing that the lifting pin and the weight block do not separate after being combined according to an embodiment of the present invention.

[0038] Figure 5 Schematic diagram showing that after the lifting pin and the weight block are combined according to an embodiment of the present invention, it is confirmed whether the dimensions of the lifting pin and the weight block are accurate.

[0039] (Description of Reference Numerals)

[0040] 20: Lifting pin

[0041] 30: Weight block Detailed implementation manner

[0042] In the present invention, the accompanying drawings may be represented in an exaggerated manner for the purpose of differentiating from the prior art, clarity, and technical understanding. Also, the following terms are defined in consideration of the functions in the present invention and may vary according to the intentions or conventions of users and operators. Therefore, these terms should be defined based on the technical content throughout this specification. On the other hand, the embodiments only belong to the exemplary matters of the structural elements proposed within the scope of the rights of the present invention and do not limit the scope of the rights of the present invention. The scope of rights should be interpreted based on the technical idea throughout the specification of the present invention.

[0043] Throughout the specification, when a structure "includes" another structure, unless there is a particularly contrary description, it means that other structures may also be included without excluding the remaining other structures.

[0044] Also, when a structure is "connected to", "linked to", or "combined with" another structure, this means that there are cases of "directly connected to", "directly linked to", or "directly combined with", and there may also be cases of "connected in a state where other structures are interposed therebetween", "linked in a state where other structures are interposed therebetween", or "combined in a state where other structures are interposed therebetween". On the contrary, when a structure is "directly connected to", "directly linked to", or "directly combined with" another structure, it should be understood that there are no other structures in between.

[0045] Also, when directional terms such as "front", "rear", "upper", "lower", "left", "right", "one end", "the other end", "both ends", etc. are used, they are used exemplarily in relation to the directions of the disclosed drawings and thus cannot be restrictively interpreted. When terms such as "first", "second", etc. are used, they are terms for differentiating each structure and cannot be restrictively interpreted.

[0046] To more clearly illustrate the features of the embodiments of the present invention, the detailed descriptions of matters well-known to those of ordinary skill in the technical field to which the following embodiments belong are omitted. Also, the detailed descriptions of the parts in the drawings that are not related to the description of the embodiments are omitted.

[0047] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0048] Accompanying Figure 2 It is a simplified diagram of a lifting pin according to an embodiment of the present invention. Figure 3 It is a simplified diagram showing the combination of a lifting pin according to an embodiment of the present invention with a weight block in sequence. Figure 4 It is a simplified diagram showing that after combining a lifting pin according to an embodiment of the present invention with a weight block, it does not come off. Figure 5A schematic diagram showing the verification of the accurate dimensions of the lifting pin and the weight block after combining the lifting pin and the weight block according to an embodiment of the present invention.

[0049] Referring to Figures 2 to 5 , a chemical vapor deposition apparatus according to an embodiment of the present invention includes: a heater H for placing a wafer W; a lifting pin 20 provided on the heater H; and a weight block 30 provided on the lower side of the heater H, and the lifting pin 20 penetrates therethrough.

[0050] At this time, the weight block 30 of the present invention may include: a weight block body 31 in the shape of a cylinder; a through hole 32 formed in the weight block body 31 in the height direction (the vertical direction in the figure), and the lifting pin 20 penetrates therethrough; and an open slot 33 formed in one side of the weight block body 31 in the radial direction. That is, the open slot 33 is formed in the weight block body 31 in the horizontal direction in the figure (referring to Figure 3 ). At this time, the open slot 33 is separated by a specific gap S, which will be described separately. At this time, after the lifting pin 20 is inserted into the through hole 32 through the open slot 33, a part of the lifting pin 20 can be fixed to the bottom surface of the weight block body 31.

[0051] That is, according to the present invention, the lifting pin 20 has a structure directly combined with the weight block 30, so there is no need for a structure of a fixing pin.

[0052] The prior art requires the above-mentioned fixing pin. Therefore, when setting the lifting pin, the disassembly and assembly process of the heater is required, and finally there is a problem of low work efficiency.

[0053] The present invention solves this problem. The lifting pin 20 is directly combined with the weight block 30, so there is no need for a fixing pin. Therefore, the disassembly and assembly process of the heater H is not required, and the work efficiency can be improved.

[0054] Moreover, in the prior art, there is a phenomenon that the fixing pin falls off inside the chamber and needs to be removed. Due to this phenomenon of fixing pin falling off, the process of removing the fixing pin is also required, so there is a problem of low work efficiency.

[0055] The present invention solves this problem. As described above, there is no need for the above-mentioned fixing pin, so the phenomenon of fixing pin falling off can be prevented, and thus the work efficiency can be further improved.

[0056] Moreover, in the prior art, an additional above-mentioned fixing pin is required to fix the lifting pin, resulting in an increase in the number of components, and thus there is a problem of increased manufacturing cost.

[0057] The present invention solves this problem and can fix the lifting pin 20 to the weight block 30 without the additional fixing pin, thereby reducing the number of components and thus reducing the manufacturing cost.

[0058] On the other hand, the open slot 33 of the weight block 30 is formed with the specific gap distance S. At this time, the gap distance S is smaller than the diameter D32 of the through hole 32. Thus, the lift pin 20 inserted into the through hole 32 can be prevented from being disengaged.

[0059] The lift pin 20 of the present invention may include a first pin body 21 , a second pin body 22 , and a third pin body 23 having different diameters and arranged in a height direction.

[0060] The above-mentioned first pin body 21 is bar-shaped and may have a specific diameter D21. The above-mentioned second pin body 22 may be configured at the lower side of the above-mentioned first pin body 21, and the diameter D22 of the above-mentioned second pin body 22 is larger than the diameter D21 of the above-mentioned first pin body 21. The above-mentioned third pin body 23 may be configured at the lower side of the above-mentioned second pin body D22, and the diameter of the above-mentioned third pin body 23 is larger than the diameter D22 of the above-mentioned second pin body 22.

[0061] That is, in the height direction, the first pin body 21 may be arranged at the upper side, and the second pin body 22 and the third pin body 23 may be arranged in sequence at the lower side. At this time, the diameter increases from the first pin body 21 to the third pin body 23.

[0062] At this time, the diameter D21 of the first pin body 21 is smaller than the diameter D32 of the through hole 32 , and the first pin body 21 can move in the vertical direction in the through hole 32 .

[0063] Furthermore, the diameter D22 of the second pin body 22 is larger than the gap distance S of the open slot 33 and smaller than the diameter D32 of the through hole 32. According to this structure, the second pin body 22 can move in the vertical direction in the through hole 32, but is locked in the open slot 33. According to the present invention, the lift pin 20 can be prevented from being separated from the weight block 30.

[0064] On the other hand, the diameter D23 of the third pin body 23 is greater than the diameter D32 of the through hole 32 , and the lifting pin 20 can be combined with the weight block 30 by being locked on the bottom surface of the through hole 32 .

[0065] That is, when the lifting pin 20 rises, the third pin body 23 is locked to the bottom surface of the weight block 30, so that the weight block 30 can rise in conjunction. That is, according to the present invention, the lifting pin 20 can also be combined with the weight block 30 without an additional fixing pin structure.

[0066] As described above, the first pin body 21 can be inserted into the through hole 32 of the weight block 30. For this purpose, the diameter D32 of the through hole 32 is preferably 1.3 to 1.5 times the diameter D21 of the first pin body 21. This is because when the diameter D32 of the through hole 32 is 1.3 times smaller than the diameter D21 of the first pin body 21, the lifting pin 20 contacts inside the through hole 32 more frequently, and there is a concern that the lifting pin 20 may be damaged. Also, when the diameter D32 of the through hole 32 is more than 1.5 times the diameter D21 of the first pin body 21, the lifting pin 20 shakes horizontally inside the through hole 32, and it is difficult to stably support the wafer W.

[0067] On the other hand, the diameter D32 of the through hole 32 is preferably 1.1 to 1.2 times the diameter D22 of the second pin body 22. As described above, the diameter D22 of the second pin body 22 is larger than the diameter D21 of the first pin body 21. This is to prevent the lifting pin 20 from detaching from the weight block 30 due to the second pin body 22, which will be described separately. However, when the diameter D32 of the through hole 32 is less than 1.1 times the diameter D22 of the second pin body 22, there is a problem that the contact of the second pin body 22 of the lifting pin 20 inside the through hole 32 increases. When the diameter D32 of the through hole 32 is more than 1.2 times the diameter D22 of the second pin body 22, a shaking phenomenon of the lifting pin 20 may occur.

[0068] Also, the diameter D32 of the through hole 32 is preferably 0.8 to 0.9 times the diameter D23 of the third pin body 23. As described above, the third pin body 23 is fixed to the bottom surface of the through hole 32, so the diameter D23 of the third pin body 23 is larger than the diameter D32 of the through hole 32. At this time, when the diameter D32 of the through hole 32 is less than 0.8 times the diameter D23 of the third pin body 23, the diameter of the through hole 32 is too small, and as described above, there is a problem that the contact between the lifting pin 20 and the inner side surface of the through hole 32 increases. When the diameter D32 of the through hole 32 is more than 0.9 times the diameter D23 of the third pin body 23, the diameter of the through hole 32 is too large, and when the third pin body 23 is inserted into the through hole 32, the lifting pin 20 may detach.

[0069] On the other hand, on the first pin body 21 of the lifting pin 20, as Figure 2As shown, a diameter-expanded portion 24 with an increasing width upward and a fourth pin body 25 disposed on the diameter-expanded portion 24 can be formed. At this time, when the lifting pin 20 descends, the diameter-expanded portion 24 is stuck on the through hole 32 of the weight block 30. Therefore, the upper-end width of the diameter-expanded portion 24 and the diameter of the fourth pin body 25 should be greater than the through hole 32.

[0070] Hereinafter, with reference to Figures 2 to 5 , the coupling method of the lifting pin will be described.

[0071] In the present invention, after the lifting pin 20 is inserted into the through hole 32 through the open slot 33 of the weight block 30, a part of the lifting pin 20 is stuck on the bottom surface of the weight block body 31. That is, as described above, the lifting pin 20 is directly coupled to the weight block 30, so that no additional fixing pin is required. Through this present invention, the working efficiency can be improved and the manufacturing cost can be reduced at the same time.

[0072] For this purpose, first, after inserting the first pin body 21 of the lifting pin 20 into the open slot 33, it is installed in the through hole 32 (refer to Figure 3 (a) part).

[0073] After that, when the lifting pin 20 is raised, the third pin body 23 of the lifting pin 20 is stuck on the bottom surface of the through hole 32 (refer to Figure 3 (b) part). Through this present invention, without an additional fixing pin, the lifting pin 20 is coupled to the weight block 30.

[0074] On the other hand, according to the present invention, it can be confirmed whether the lifting pin 20 or the weight block 30 is accurately manufactured. That is, as Figure 4 (a) part shows, after inserting the first pin body 21 of the lifting pin 20 into the open slot 33, it is installed in the through hole 32. After that, as Figure 4 (b) part shows, the lifting pin 20 is raised so that the second pin body 22 is located in the open slot 33. At this time, it is confirmed whether the second pin body 22 is stuck in the open slot 33, and it is judged whether the dimensions of the lifting pin 20 and the weight block 30 are accurate.

[0075] That is, the diameter D22 of the second pin body 22 is smaller than the diameter D32 of the through hole 32, but larger than the gap S of the open slot 33. Therefore, the second pin body 22 can be lifted and lowered in the through hole 32, but is stuck in the open slot 33. Through this present invention, it can be confirmed whether the dimensions of the lifting pin 20 or the weight block 30 are accurately manufactured.

[0076] And, as Figure 5As shown, when the third pin body 23 of the lifting pin 20 is fixed to the bottom surface of the through hole 32, it is possible to confirm whether the weight block body 31 deviates from the center of the lifting pin 20 by a specific distance, and to determine whether the dimensions of the lifting pin 20 and the weight block 30 are accurate. That is, as Figure 5 shown on the left side of the middle figure, when the third pin body 23 is disposed at the center of the open slot 33 of the weight block 30, it can be determined that the lifting pin 20 and the weight block 30 are accurately manufactured. As Figure 5 shown on the right side of the middle figure, when the third pin body 23 deviates in a specified direction within the open slot 33, it can be determined that there is an error in the manufacture of the lifting pin 20 and the weight block 30.

[0077] As described above, according to the present invention, the assembly process of the fixing pin can be omitted, so there is no need for the heater installation and removal process, providing the possibility of improving work efficiency.

[0078] Moreover, in the present invention, the process related to the fixing pin can be omitted, and the phenomenon of the fixing pin falling off inside the chamber can be prevented, thus providing the possibility of further improving work efficiency.

[0079] Furthermore, in the present invention, no additional fixing pin is required, and the number of components can be reduced, thereby providing the possibility of reducing the manufacturing cost.

[0080] As described above, the present invention is described with reference to the embodiments shown in the figures. However, it should be understood that this is only exemplary, and various modifications and equivalent other embodiments can be made based on the common knowledge in the technical field. Therefore, the true technical protection scope of the present invention is based on the appended claims and should be determined based on the specific content of the above invention.

[0081] Industrial Applicability

[0082] The present invention relates to a manufacturing method and can be applied to the semiconductor-related industrial field.

Claims

1. A chemical vapor deposition device with a lift pin direct combination method, characterized in that: include: Heater, where the wafer is placed; A lifting pin is arranged on the heater; as well as A weight block is disposed on the lower side of the heater, and the lifting pin passes through the weight block. The above-mentioned weight blocks include: A cylinder-shaped weight body; a through hole formed in the height direction of the weight block body, through which the lifting pin passes; and An open slot is formed radially on one side of the weight block body. After the lifting pin is inserted into the through hole through the open slot, a portion of the lifting pin is locked on the bottom surface of the weight block body.

2. The chemical vapor deposition device with lift pin direct combination method according to claim 1, characterized in that: The open slot is formed with a specific gap distance, and the gap distance is smaller than the diameter of the through hole. The lifting pin includes a first pin body, a second pin body and a third pin body having different diameters and arranged in a height direction. The first pin body has a specific diameter, the second pin body is arranged at the lower side of the first pin body, the diameter of the second pin body is larger than the diameter of the first pin body, the third pin body is arranged at the lower side of the second pin body, the diameter of the third pin body is larger than the diameter of the second pin body, The diameter of the first pin body is smaller than the diameter of the through hole, and the first pin body can move in the vertical direction inside the through hole. The diameter of the second pin body is larger than the gap distance of the open slot and smaller than the diameter of the through hole, and can move in the vertical direction inside the through hole and be locked in the open slot. The third pin body has a diameter greater than that of the through hole and is locked on the bottom surface of the through hole.

3. The chemical vapor deposition device with lift pin direct combination method according to claim 2, characterized in that: The diameter of the through hole is 1.3 to 1.5 times the diameter of the first pin body. The diameter of the through hole is 1.1 to 1.2 times the diameter of the second pin body. The diameter of the through hole is 0.8 to 0.9 times the diameter of the third pin body.

4. A method for directly connecting a lifting pin of a chemical vapor deposition device, wherein the chemical vapor deposition device is the chemical vapor deposition device described in any one of claims 1 to 3, and the method for directly connecting the lifting pin is characterized in that after the lifting pin is inserted into the through hole through the open slot of the weight block, a portion of the lifting pin is locked on the bottom surface of the weight block body.

5. The lift pin direct coupling method according to claim 4, characterized in that: After the first pin body of the lifting pin is inserted into the open slot, it is installed in the through hole. The lift pin is raised, and the third pin body of the lift pin is locked to the bottom surface of the through hole.

6. The lift pin direct connection method according to claim 4, characterized in that: After the first pin body of the lifting pin is inserted into the open slot, it is installed in the through hole. The lifting pin is raised so that the second pin body is located in the open slot. Confirm whether the second pin body is locked in the open slot, and determine whether the dimensions of the lifting pin and the weight block are accurate.

7. The lift pin direct coupling method according to claim 5, characterized in that: When the third pin body of the lift pin is locked on the bottom surface of the through hole, it is confirmed whether the weight block body deviates from the center of the lift pin by a specific distance, and whether the dimensions of the lift pin and the weight block are accurate.

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