Electroplating liquid spraying device

By guiding the jet gas in the electroplating solution jetting device to prevent the plating solution from adhesion, and equipped with a cleaning machine to clean the surface of the workpiece, the problem of adhesion of the probe head and the problem of difficult removal of the electroplating solution is solved, and the processing quality is improved.

CN120174438AInactive Publication Date: 2025-06-20SUZHOU XINJIYOU MASCH EQUIP CO LTD
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Patent Information

Application Number
CN202311755511.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-12-20
Publication Date
2025-06-20
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

In the existing electroplating solution spraying process, the probe head is prone to adhere to the electroplating solution, which affects the gloss monitoring accuracy, and it is difficult to remove the adherent electroplating solution on the surface of the workpiece.

Method used

An electroplating solution injection device is designed to guide part of the gas in the jet pipe to jet the probe head through the air guide chamber to prevent the electroplating solution from adhering to it; at the same time, the device is equipped with a cleaning machine to achieve timely cleaning of the surface of the workpiece by passing through the water tank and the water guide sheet.

Benefits of technology

The accuracy of the probe head is improved, the problem of difficult removal of electroplating solution on the surface of the workpiece is avoided, and the processing quality of the workpiece is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an electroplate liquid spraying device which is characterized in that a waste collecting tank is arranged at the top of a base, an electroplate liquid sprayer with a nozzle is mounted at the top of a bracket, and a glossiness monitor with a detection head is arranged between the electroplate liquid sprayer and a liquid storage tank; the upper side and the lower side of the detection head are each provided with an air guide bin parallel to the nozzle, the side, opposite to the glossiness monitor, of each air guide bin is provided with an air outlet, the two air guide bins are jointly connected with a three-way air pipe, and the three-way air pipe is communicated with the air injection pipeline through a ventilation pipe. A supporting frame is arranged on the other side of the waste collecting groove, and a cleaning machine is installed on the top face of the upper end of the supporting frame. According to the electroplating liquid spraying device, the detection head can be purged, the situation that part of electroplating liquid adheres to the detection head after being reflected in the spraying process is avoided, the workpiece can be cleaned in time, the situation that redundant electroplating liquid adheres to the workpiece is avoided, and the machining quality of the workpiece is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of spraying and plating processing, and particularly relates to an electroplating solution spraying device. Background Art

[0002] Electroplating is a process of plating a thin layer of other metals or alloys on the surface of certain metals by using the electrolysis principle. It is a process of making the surface of metal or other material parts adhere to a metal film by using electrolysis, so as to prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhance beauty. In the current electroplating process, flexible circuit boards usually need to be sent into the electroplating bath for electroplating through a conveyor belt.

[0003] After retrieval, a patent with the patent publication number CN110791786B discloses an "electroplating solution spraying device for PCB circuit board electroplating", which includes an electroplating device, a cleaning device, a draining track, a solid material device, a grinding device, and a feeding conveyor belt. A material transfer device is fixedly arranged on the grinding device, and the material transfer device is arranged above the solid material device and the draining track. The cleaning device is used to clean the substrate after electroplating. The material transfer device transfers the drained material to the solid material device, and the solid material device is used to fix the substrate and transfer the fixed substrate to the lower part of the grinding device. The grinding device is used to grind the substrate. This device improves production efficiency, avoids the appearance of large-span transfer devices, reduces the number of transfer devices used in the process, and reduces the complexity of the production line.

[0004] In the prior art, when spraying electroplating solution on the surface of a workpiece, in order to avoid too thick or too thin spraying on the surface of the workpiece, it is necessary to observe the gloss of the electroplating solution spraying surface in real time. The traditional method is to spray the surface of the workpiece with a spraying gun held by a person. With the development of science and technology, the gloss of the spraying surface can be monitored by a gloss monitor. However, during the use of the gloss monitor, the probe of the monitor is prone to adhere to the electroplating solution, affecting the detection accuracy. Moreover, during the spraying process, other areas of the workpiece are also prone to adhere to the electroplating solution. If it is not cleaned in time, the electroplating solution adhered to the surface of the workpiece is difficult to remove. Summary of the Invention

[0005] The purpose of the present invention is to provide an electroplating solution spraying device, which can both blow the detection head to avoid the situation that part of the electroplating solution adheres to the detection head after reflection during the spraying process, improve the detection accuracy, and can also clean the workpiece in time to avoid the situation that the electroplating solution adhered to the surface of the workpiece by the gas is difficult to remove, and improve the processing quality of the workpiece.

[0006] To achieve the above object, the technical solution adopted by the present invention is: an electroplating solution spraying device, comprising: a base, a waste collecting tank is provided at the top of the base, and a position adjusting mechanism is provided on one side of the waste collecting tank, and a bracket is fixedly installed at the movable end of the position adjusting mechanism; A plating solution sprayer with a nozzle is installed at the top of the bracket. A liquid storage tank and a high-pressure gas tank are installed on one side of the plating solution sprayer. The liquid storage tank, the high-pressure gas tank and the plating solution sprayer are respectively connected by a liquid adding pipeline and a jet pipeline. A gloss monitor with a detection head is provided between the plating solution sprayer and the liquid storage tank. A gas guiding chamber is installed on the upper and lower sides of the detection head and parallel to the nozzle, and an air outlet is provided on the side of the gas guiding chamber opposite to the gloss monitor. The two gas guiding chambers are jointly connected to a three-way gas pipe, and the three-way gas pipe is connected to the jet pipeline through a connecting gas pipe; A support frame is provided on the other side of the waste collecting tank, and a cleaning machine is installed on the upper end surface of the support frame.

[0007] The further improved solutions in the above technical solutions are as follows: 1. In the above solution, a slide rail with a slider slidingly connected is installed on the side wall of the upper end of the support frame. The slider is fixedly connected to a second support plate with a communication hole. A water through groove communicating with the communication hole is installed on the upper surface of the second support plate. A communication hose is provided between the water through groove and the water outlet end of the cleaning machine.

[0008] 2. In the above solution, a chute is opened inside the second support plate, and a plug plate with a second communication hole in the middle is slidably connected inside the chute. A guide plate is provided on the lower surface of the second support plate and on one side of the communication hole. A plurality of water guide sheets are spaced inside the communication hole below the plug plate. A first water passing hole is formed between one side of the water guide sheet and the inner wall of the communication hole, and a second water passing hole is formed between the other side and the guide plate.

[0009] 3. In the above solution, an elastic member is provided between the plug plate and the inner wall of the chute. When the elastic member is in a natural state, the plug plate closes the second water passing hole and makes the second communication hole penetrate the first water passing hole and the water through groove.

[0010] 4. In the above solution, when the elastic member is in a compressed state, the second communication hole penetrates the second water passing hole and the water through groove.

[0011] 5. In the above solution, a first support plate is installed at the end of the slide rail far from the support frame.

[0012] 6. In the above solution, the elastic member is located at one end of the chute away from the first support plate.

[0013] 7. In the above solution, a flow divider is provided between the vent pipe and the jet pipe.

[0014] 8. In the above solution, the water guide plates are arranged at equal intervals.

[0015] 9. In the above solution, above the waste collection tank and at the bottom of the upper end of the support frame, a hanging rack for hanging the workpiece is provided.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. For the electroplating solution spraying device of the present invention, its liquid storage tank is connected to the electroplating solution sprayer through a liquid adding pipe, and the high-pressure gas tank is connected to the electroplating solution sprayer through a jet pipe. Part of the gas in the jet pipe is guided by the air guide chamber to jet in front of the detection end of the detection head, avoiding the situation that after the electroplating solution powder sprayed by the electroplating solution sprayer adheres to the surface of the workpiece, part of the electroplating solution powder adheres to the detection head under the drive of the reflected gas, thereby improving the detection accuracy. After the spraying is completed, the cleaning machine is controlled to start discharging water to clean the workpiece in time, avoiding the workpiece from adhering to excess electroplating solution and improving the processing quality of the workpiece; further, the cleaning liquid in the cleaning machine is transmitted to the water trough through a connecting hose, and the cleaning liquid in the water trough flows out from the connecting hole and flushes the surface of the workpiece under the guidance of the water guide plates. Moreover, the movement of the slider on the slide rail can drive the second support plate to move, thereby driving the water trough to move, realizing the cleaning of different positions of the workpiece, expanding the flushing area, avoiding the situation that the gas blown out by the air guide chamber carries electroplating solution and diffuses and adheres to the surface of the workpiece, ensuring the flushing effect on the workpiece, and further improving the processing quality.

[0017] 2. For the electroplating solution spraying device of the present invention, the plug plate with a second communication hole in the middle is slidably connected inside the chute. A guide plate is provided on the lower surface of the second support plate. Inside the communication hole and below the plug plate, a number of water guide plates are arranged at intervals. A first water passing hole is formed between one side of the water guide plate and the inner wall of the communication hole, and a second water passing hole is formed between the other side and the guide plate. The flushing liquid is guided to the workpiece through the front surface of the guide plate to clean the workpiece. The movement of the slider can also drive the second support plate to move, causing the plug plate to move in the chute and squeeze the elastic member, changing the position of the second communication hole so that the second communication hole connects the second water passing hole with the water trough, and the flushing liquid passes through between the back surface of the guide plate and the guide plate, realizing the cleaning of the guide plate itself, improving the cleanliness of the guide plate during long-term use, and thus enhancing the overall cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Att Figure 1 is a schematic structural diagram of the electroplating solution spraying device of the present invention; Att Figure 2Schematic diagram of the partial structure of the electroplating solution spraying device of the present invention Figure 1 ; Appendix Figure 3 It is an exploded view of the partial structure of the electroplating solution spraying device of the present invention; Appendix Figure 4 It is a schematic cross-sectional structure diagram of the water passing tank in the present invention; Appendix Figure 5 Schematic diagram of the partial structure of the electroplating solution spraying device of the present invention Figure 2 ; Appendix Figure 6 Appendix of the present invention Figure 5 Enlarged view of part A.

[0019] In the above drawings: 101, cleaning machine; 102, connecting hose; 103, elastic member; 104, connecting hole; 105, plug board; 106, slider; 107, slide rail; 108, first support plate; 109, second support plate; 110, water passing tank; 111, chute; 112, guide plate; 113, water guide piece; 2, waste collecting tank; 3, base; 4, Z-axis adjusting mechanism; 401, Z-axis slide rail; 402, second slider; 5, Y-axis adjusting mechanism; 501, Y-axis slide rail; 502, first slider; 601, support; 602, electroplating solution injector; 603, air jet pipe; 604, liquid adding pipe; 605, diverter; 606, ventilation pipe; 607, three-way air pipe; 608, air guide chamber; 609, detection head; 610, filter screen; 611, gloss monitor; 7, support frame; 8, hanging rack; 9, liquid storage tank; 10, high-pressure gas tank; 11, support plate; 12, air outlet; 13, nozzle; 14, second connecting hole; 15, first water passing hole; 16, second water passing hole. Embodiment

[0020] The present patent can be further clearly understood through the following specific embodiments, but they do not limit the present patent.

[0021] Embodiment 1: An electroplating solution spraying device, comprising: a base 3, a waste collecting tank 2 is arranged at the top of the base 3, and a position adjusting mechanism is arranged on one side of the waste collecting tank 2, and a support 601 is fixedly installed at the movable end of the position adjusting mechanism; An electroplating solution injector 602 with a nozzle 13 is installed at the top of the support 601, a liquid storage tank 9 and a high-pressure gas tank 10 are installed on one side of the electroplating solution injector 602, and the liquid storage tank 9 and the high-pressure gas tank 10 are respectively connected in communication with the electroplating solution injector 602 through a liquid adding pipe 604 and an air jet pipe 603, and a gloss monitor 611 with a detection head 609 is arranged between the electroplating solution injector 602 and the liquid storage tank 9; Start the high-pressure gas tank and the liquid storage tank, and introduce the electroplating solution and high-pressure gas into the electroplating solution injector through the liquid addition pipeline and the jet pipeline, so as to spray the electroplating solution on the surface of the workpiece through the electroplating solution injector. A gloss monitor is arranged on one side of the electroplating solution injector to monitor the gloss of the real-time spraying surface through the gloss monitor; On the upper and lower sides of the detection head 609 and parallel to the nozzle 13, a gas guide chamber 608 is installed, and an air outlet 12 is opened on the side of the gas guide chamber 608 opposite to the gloss monitor 611. The two gas guide chambers 608 are jointly connected with a three-way gas pipe 607, and this three-way gas pipe 607 is connected with the jet pipeline 603 through a gas pipe 606; On the other side of the waste collection tank 2, a support frame 7 is arranged, and a cleaning machine 101 is installed on the upper top surface of the support frame 7; When a certain value is reached, stop the spraying of the electroplating solution, so as to realize the precise monitoring of the electroplating solution spraying process. At the same time, through the setting of the gas guide chamber, the gas pipe and the three-way gas pipe guide part of the gas in the jet pipeline to jet in front of the detection end of the detection head, which can effectively prevent the electroplating solution powder from adhering to the detection head, thus ensuring the detection accuracy.

[0022] On the upper side wall of the support frame 7, a slide rail 107 with a slidably connected slider 106 is installed. The slider 106 is fixedly connected with a second support plate 109 having a communication hole 104. A water trough 110 communicated with the communication hole 104 is installed on the upper surface of the second support plate 109. A communication hose 102 is arranged between the water trough 110 and the water outlet end of the cleaning machine 101; The cleaning machine introduces the cleaning liquid into the water trough through the communication hose. The water trough moves on the slide rail through the slider, so that a plurality of water guide plates are attached to the outer wall of the workpiece receiving electroplating solution spraying with different specifications. Thus, when the workpiece is cleaned after the spraying is completed, the cleaning liquid can flow out from the first water passing hole formed by the second communication hole and the communication hole under the guidance of the water guide plate, and the cleaning liquid slowly flows along the surface of the workpiece, so as to ensure that the surface of the electroplating solution is not affected by scouring during the flushing process.

[0023] A chute 111 is opened inside the second support plate 109. An insertion plate 105 with a second communication hole 14 in the middle is slidably connected inside the chute 111. On the lower surface of the second support plate 109 and on one side of the communication hole 104, a guide plate 112 is arranged. A plurality of water guide plates 113 are spaced inside the communication hole 104 below the insertion plate 105. A first water passing hole 15 is formed between one side of the water guide plate 113 and the inner wall of the communication hole 104, and a second water passing hole 16 is formed between the other side and the guide plate 112; An elastic member 103 is disposed between the above-mentioned insertion plate 105 and the inner wall of the sliding groove 111. When the elastic member 103 is in its natural state, the insertion plate 105 closes the second water passing hole 16 and enables the second communication hole 14 to penetrate through the first water passing hole 15 and the water passing groove 110; when the elastic member 103 is in a compressed state, the second communication hole 14 penetrates through the second water passing hole 16 and the water passing groove 110.

[0024] The rinsing liquid is guided to the workpiece through the front surface of the water guide plate to clean the workpiece. The slider can also be moved to drive the second support plate to move, so that the insertion plate moves in the sliding groove to squeeze the elastic member, changing the position of the second communication hole, enabling the second communication hole to communicate the second water passing hole with the water passing groove, and the rinsing liquid passes through between the back surface of the water guide plate and the guide plate, thereby realizing the self-cleaning of the water guide plate, improving the cleanliness of the water guide plate during long-term use, and thus enhancing the overall cleaning effect.

[0025] A first support plate 108 is installed at one end of the above-mentioned slide rail 107 away from the support frame 7; the elastic member 103 is located at one end of the sliding groove 111 away from the first support plate 108.

[0026] A flow divider 605 is disposed between the above-mentioned ventilation pipe 606 and the air jet pipe 603.

[0027] The above-mentioned water guide pieces 113 are arranged at equal intervals.

[0028] Above the above-mentioned waste collecting tank 2 and at the bottom of the upper end of the support frame 7, a hanging rack 8 for hanging the workpiece is provided. Hanging the workpiece on the hanging rack facilitates spraying and also facilitates rinsing it.

[0029] A plurality of support plates 11 are disposed between the above-mentioned air guide chamber 608 and the gloss monitor 611.

[0030] A filter screen 610 is installed on the inner wall of the above-mentioned air outlet 12, which can filter the blown-out gas and avoid the situation that the blown-out gas contains dust and causes pollution to the spraying area.

[0031] Embodiment 2: An electroplating solution spraying device, comprising: a base 3, a waste collecting tank 2 is disposed on the top of the base 3, and a position adjusting mechanism is disposed on one side of the waste collecting tank 2, and a support 601 is fixedly installed at the movable end of the position adjusting mechanism; At the top of the bracket 601, an electroplating solution injector 602 with a nozzle 13 is installed. On one side of the electroplating solution injector 602, a liquid storage tank 9 and a high-pressure gas tank 10 are installed. The liquid storage tank 9, the high-pressure gas tank 10 and the electroplating solution injector 602 are respectively connected through a liquid adding pipeline 604 and a gas jetting pipeline 603. A glossiness monitor 611 with a detection head 609 is arranged between the electroplating solution injector 602 and the liquid storage tank 9. On the upper and lower sides of the detection head 609 and parallel to the nozzle 13, a gas guide chamber 608 is installed. An air outlet 12 is arranged on the side of the gas guide chamber 608 opposite to the glossiness monitor 611. The two gas guide chambers 608 are jointly connected with a tee-shaped gas pipe 607, and the tee-shaped gas pipe 607 and the gas jetting pipeline 603 are connected through a gas pipe 606. On the other side of the waste collecting tank 2, a support frame 7 is arranged. At the upper end top surface of the support frame 7, a cleaning machine 101 is installed. Part of the gas in the gas jetting pipeline is guided by the gas guide chamber to jet air in front of the detection end of the detection head, avoiding the situation that after the electroplating solution powder ejected by the electroplating solution injector is sprayed on the surface of the workpiece, part of the electroplating solution powder adheres to the detection head driven by the reflected gas, thereby improving the detection accuracy. After the spraying is completed, the cleaning machine is controlled to start discharging water to clean the workpiece in time, avoiding the situation that the adhered electroplating solution is difficult to remove subsequently.

[0032] On the upper side wall of the upper end of the support frame 7, a slide rail 107 with a slidably connected slider 106 is installed. The slider 106 is fixedly connected with a second support plate 109 with a communication hole 104. On the upper surface of the second support plate 109, a water through-flow tank 110 communicated with the communication hole 104 is installed. A communication hose 102 is arranged between the water through-flow tank 110 and the water outlet end of the cleaning machine 101. The cleaning liquid in the cleaning machine is transmitted to the water through-flow tank through the communication hose. The cleaning liquid in the water through-flow tank flows out from the communication hole and flushes the surface of the workpiece under the guidance of the water guide piece. And the movement of the slider on the slide rail can drive the second support plate to move, thereby driving the water through-flow tank to move, realizing the cleaning of different positions of the workpiece, expanding the flushing area, avoiding the situation that the gas blown out by the gas guide chamber carries electroplating solution and diffuses and adheres to the surface of the workpiece, ensuring the flushing effect on the workpiece, and further improving the processing quality.

[0033] A chute 111 is formed inside the second support plate 109. An insertion plate 105 with a second communication hole 14 in the middle is slidably connected to the inside of the chute 111. A guide plate 112 is provided on the lower surface of the second support plate 109 and on one side of the communication hole 104. A plurality of water guide plates 113 are spaced apart inside the communication hole 104 and below the insertion plate 105. A first water passage hole 15 is formed between one side of the water guide plate 113 and the inner wall of the communication hole 104, and a second water passage hole 16 is formed between the other side and the guide plate 112. After the flushing is completed, the water trough moves to one end of the slide rail, so that the first support plate squeezes the insertion plate, compresses the elastic member and changes the position of the second communication hole, making it move between the guide plate and the water guide plate, so that the cleaning liquid flows out from the second water passage hole formed by the second communication hole and the communication hole. Thus, under the blocking action of the guide plate, the cleaning liquid can clean the side of the water guide plate in contact with the workpiece surface, ensuring the cleanliness of the surface of the flexible water guide plate.

[0034] An elastic member 103 is provided between the inner wall of the insertion plate 105 and the chute 111. When the elastic member 103 is in its natural state, the insertion plate 105 closes the second water passage hole 16 and makes the second communication hole 14 penetrate the first water passage hole 15 and the water trough 110.

[0035] When the elastic member 103 is in a compressed state, the second communication hole 14 penetrates the second water passage hole 16 and the water trough 110.

[0036] A first support plate 108 is installed at one end of the slide rail 107 away from the support frame 7.

[0037] The elastic member 103 is located at one end of the chute 111 away from the first support plate 108.

[0038] A flow divider 605 is provided between the ventilation pipe 606 and the jet pipe 603.

[0039] The water guide plates 113 are equidistantly spaced apart.

[0040] A hanging rack 8 for hanging the workpiece is provided above the waste collecting tank 2 and at the bottom of the upper end of the support frame 7.

[0041] The position adjustment mechanism includes: a Y-axis adjustment mechanism 5 and a Z-axis adjustment mechanism 4.

[0042] The Y-axis adjustment mechanism 5 includes: a Y-axis slide rail 501 and a first slider 502 slidably mounted on the Y-axis slide rail 501. The first slider 502 is connected to the Z-axis adjustment mechanism 4.

[0043] The above Z-axis adjustment mechanism 4 includes: a Z-axis slide rail 401 and a second slider 502 slidably mounted on the Z-axis slide rail 401. The second slider 402 is fixedly connected to the bracket 601.

[0044] By installing the electroplating solution injector on the bracket, and connecting the bracket to the movable end of the Z-axis adjustment mechanism, and connecting the movable end of the Y-axis adjustment mechanism to the Z-axis adjustment mechanism, the position adjustment of the electroplating solution injector can be realized, and the automatic spraying of the workpiece can be achieved, greatly reducing the labor intensity of the personnel.

[0045] The working principle of the present invention is as follows: During use, the workpiece to be electroplated is placed on the hanging rack. The position of the electroplating solution injector is adjusted through the Z-axis adjustment mechanism and the Y-axis adjustment mechanism. The high-pressure gas tank and the liquid storage tank are started, and the electroplating solution and the high-pressure gas are introduced into the electroplating solution injector through the liquid adding pipeline and the air jet pipeline. Thus, the electroplating solution is sprayed on the surface of the workpiece through the electroplating solution injector. A gloss monitor is arranged on one side of the electroplating solution injector to monitor the gloss of the real-time spraying surface. When a certain value is reached, the spraying of the electroplating solution is stopped, so as to realize the precise monitoring of the electroplating solution spraying process. At the same time, through the setting of the air guide chamber, the air pipe and the three-way air pipe guide part of the gas in the air jet pipeline to jet in front of the detection end of the detection head, which can effectively prevent the electroplating solution powder from adhering to the detection head, thus ensuring the detection accuracy; The cleaning machine introduces the cleaning liquid into the water through-flow tank through the connecting hose. The water through-flow tank moves on the slide rail through the slider, so that a plurality of water guide plates are attached to the outer wall of different specifications of the workpiece affected by the electroplating solution spraying. Thus, when the workpiece is cleaned after the spraying is finished, the cleaning liquid can flow out from the first water through-hole formed by the second communication hole and the communication hole under the guidance of the water guide plate. The cleaning liquid adheres to the surface of the workpiece and flows slowly, so as to ensure that the surface of the electroplating solution is not affected by the scouring during the flushing process. After the scouring is finished, the water through-flow tank moves to one end of the slide rail, so that the first support plate squeezes the plug plate, compresses the elastic part and changes the position of the second communication hole, making it move between the guide plate and the water guide plate, so that the cleaning liquid flows out from the second water through-hole formed by the second communication hole and the communication hole. Thus, the cleaning liquid can, under the blocking action of the guide plate, clean the surface of the water guide plate in contact with the workpiece surface, ensuring the cleanliness of the surface of the soft water guide plate. During the cleaning process, the used cleaning liquid will fall into the waste collection tank.

[0046] When the above electroplating solution spraying device is adopted, it guides part of the gas in the air jet pipeline through the air guide chamber to jet in front of the detection end of the detection head, avoiding the situation that part of the electroplating solution powder adheres to the detection head under the drive of the reflected gas after the electroplating solution powder sprayed by the electroplating solution injector is sprayed on the surface of the workpiece, thus improving the detection accuracy. After the spraying is finished, the cleaning machine is controlled to start discharging water to clean the workpiece in time, avoiding the situation that the adhered electroplating solution is difficult to remove subsequently; Furthermore, the cleaning liquid in the cleaning machine is transmitted to the water trough through a connecting hose. The cleaning liquid in the water trough flows out from the connecting holes and flushes the surface of the workpiece under the guidance of the water guiding pieces. Moreover, by moving the slider on the slide rail, the second support plate can be driven to move, thereby driving the water trough to move, realizing the cleaning of different positions of the workpiece, expanding the flushing area, avoiding the situation that the gas blown out from the air guide chamber carries the electroplating solution and diffuses and adheres to the surface of the workpiece, and improving the flushing effect on the workpiece. Furthermore, its flushing liquid is guided to the workpiece through the front surface of the water guiding plate to realize the cleaning of the workpiece. Also, by moving the slider, the second support plate can be driven to move, so that the plug plate moves in the chute and squeezes the elastic member, changing the position of the second communication hole, making the second communication hole connect the second water passing hole with the water trough. The flushing liquid passes through between the back surface of the water guiding plate and the guide plate, thereby realizing the cleaning of the water guiding plate itself, improving the cleanliness of the water guiding plate during long-term use, and thus enhancing the overall cleaning effect.

[0047] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly. It should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. An electroplating solution spraying device, comprising: Base (3), characterized in that: a waste collecting groove (2) is provided at the top of the base (3), and a position adjusting mechanism is provided on one side of the waste collecting groove (2), and a bracket (601) is fixedly installed at the movable end of the position adjusting mechanism; At the top of the bracket (601), a plating solution injector (602) with a nozzle (13) is installed. On one side of the plating solution injector (602), a liquid storage tank (9) and a high-pressure gas tank (10) are installed. The liquid storage tank (9), the high-pressure gas tank (10) and the plating solution injector (602) are respectively connected by a liquid adding pipeline (604) and a gas jetting pipeline (603). A glossiness monitor (611) with a detection head (609) is provided between the plating solution injector (602) and the liquid storage tank (9). On the upper and lower sides of the detection head (609) and parallel to the nozzle (13), a gas guiding chamber (608) is installed. An air outlet (12) is provided on the side of the gas guiding chamber (608) opposite to the glossiness monitor (611). The two gas guiding chambers (608) are jointly connected to a three-way gas pipe (607), and the three-way gas pipe (607) is connected to the gas jetting pipeline (603) through a gas pipe (606). On the other side of the waste collecting groove (2), a support frame (7) is provided, and a cleaning machine (101) is installed on the upper end surface of the support frame (7).

2. The electroplating solution spraying device according to claim 1, wherein: On the upper end side wall of the support frame (7), a slide rail (107) with a slidably connected slider (106) is installed. The slider (106) is fixedly connected to a second support plate (109) with a communication hole (104). A water through groove (110) communicating with the communication hole (104) is installed on the upper surface of the second support plate (109). A communication hose (102) is provided between the water through groove (110) and the water outlet end of the cleaning machine (101).

3. The electroplating solution spraying device according to claim 2, wherein: A chute (111) is provided inside the second support plate (109). A plug board (105) with a second communication hole (14) in the middle is slidably connected inside the chute (111). On the lower surface of the second support plate (109) and on one side of the communication hole (104), a guide plate (112) is provided. Below the plug board (105) and inside the communication hole (104), a number of water guiding sheets (113) are spaced apart. A first water passing hole (15) is formed between one side of the water guiding sheet (113) and the inner wall of the communication hole (104), and a second water passing hole (16) is formed between the other side and the guide plate (112).

4. The electroplating solution spraying device according to claim 3, wherein: An elastic member (103) is provided between the plug board (105) and the inner wall of the chute (111). When the elastic member (103) is in a natural state, the plug board (105) closes the second water passing hole (16) and enables the second communication hole (14) to penetrate the first water passing hole (15) and the water through groove (110).

5. The electroplating solution spraying device according to claim 4, wherein: When the elastic member (103) is in a compressed state, the second communication hole (14) penetrates the second water passing hole (16) and the water through groove (110).

6. The electroplating solution spraying device according to claim 4, wherein: A first support plate (108) is installed at one end of the sliding rail (107) away from the support frame (7).

7. The electroplating solution spraying device according to claim 6, wherein: The elastic member (103) is located at one end inside the chute (111) away from the first support plate (108).

8. The electroplating solution spraying device according to claim 1, wherein: A flow divider (605) is provided between the ventilation pipe (606) and the jet pipe (603).

9. The electroplating solution spraying device according to claim 1, wherein: The water guide sheets (113) are arranged at equal intervals.

10. The electroplating solution spraying device according to claim 1, wherein: Above the waste collection tank (2) and at the bottom of the upper end of the support frame (7), a hanging rack (8) for hanging workpieces is provided.

Citation Information

Patent Citations

  • A PCB circuit board electroplating solution adding spray device

    CN110791786B